JP2009004584A5 - - Google Patents
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- Publication number
- JP2009004584A5 JP2009004584A5 JP2007164440A JP2007164440A JP2009004584A5 JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5 JP 2007164440 A JP2007164440 A JP 2007164440A JP 2007164440 A JP2007164440 A JP 2007164440A JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating layer
- inner via
- electrical insulating
- component built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010292 electrical insulation Methods 0.000 claims 6
- 230000002093 peripheral Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 238000005755 formation reaction Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164440A JP5127315B2 (ja) | 2007-06-22 | 2007-06-22 | 部品内蔵モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164440A JP5127315B2 (ja) | 2007-06-22 | 2007-06-22 | 部品内蔵モジュール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009004584A JP2009004584A (ja) | 2009-01-08 |
JP2009004584A5 true JP2009004584A5 (hu) | 2010-05-13 |
JP5127315B2 JP5127315B2 (ja) | 2013-01-23 |
Family
ID=40320642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007164440A Expired - Fee Related JP5127315B2 (ja) | 2007-06-22 | 2007-06-22 | 部品内蔵モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5127315B2 (hu) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130050967A1 (en) * | 2010-03-16 | 2013-02-28 | Nec Corporation | Functional device-embedded substrate |
JP5360425B2 (ja) * | 2010-04-08 | 2013-12-04 | 株式会社村田製作所 | 回路モジュール、および回路モジュールの製造方法 |
JP2012049260A (ja) * | 2010-08-25 | 2012-03-08 | Ricoh Microelectronics Co Ltd | 切断方法及び切断装置 |
JP5285819B1 (ja) * | 2012-11-07 | 2013-09-11 | 太陽誘電株式会社 | 電子回路モジュール |
KR102166048B1 (ko) * | 2014-03-20 | 2020-10-15 | 엘지디스플레이 주식회사 | 다층회로기판 |
CN104270885A (zh) * | 2014-05-05 | 2015-01-07 | 珠海越亚封装基板技术股份有限公司 | 具有聚合物基质的插件框架及其制造方法 |
WO2016121491A1 (ja) | 2015-01-30 | 2016-08-04 | 株式会社村田製作所 | 電子回路モジュール |
WO2016181706A1 (ja) | 2015-05-14 | 2016-11-17 | 株式会社村田製作所 | 電子回路モジュール |
KR101828317B1 (ko) | 2017-07-20 | 2018-02-12 | 최현길 | 크기가 상이한 인쇄회로기판을 고정부재를 이용하여 고정하고 인쇄회로기판의 조립 공정을 실시간으로 모니터링하는 방법 및 장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2976049B2 (ja) * | 1992-07-27 | 1999-11-10 | 株式会社村田製作所 | 積層電子部品 |
JP2006210870A (ja) * | 2004-12-28 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 部品内蔵モジュール及びその製造方法 |
WO2007060784A1 (ja) * | 2005-11-28 | 2007-05-31 | Murata Manufacturing Co., Ltd. | 回路モジュールの製造方法および回路モジュール |
-
2007
- 2007-06-22 JP JP2007164440A patent/JP5127315B2/ja not_active Expired - Fee Related
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