JP2009003096A - Optical waveguide module and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To develop a technique for simply materializing mounting of an optical device on a substrate having an optical waveguide. <P>SOLUTION: In an optical waveguide module, a recess 3 for positioning an optical device 4 is formed on a substrate 2 having an optical waveguide 5. The optical device 4 incorporated in the recess 3 is positioned by the inner face of the recess 3 in a manner that the light receiving/emitting part 41 of the optical device 4 is arranged oppositely to the core 51 of the optical waveguide 5, with the optical device 4 optically coupled with the optical waveguide 5. A manufacturing method of the optical waveguide module is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical waveguide module in which an optical element that is a light receiving element or a light emitting element is mounted on a substrate having an optical waveguide, and a manufacturing method thereof.

In recent years, for example, in view of the demand for high-speed signal transmission in electronic devices and an increase in transmission amount, optical communication technology using a substrate provided with an optical waveguide (hereinafter also referred to as an optical waveguide substrate) Application to transmission is becoming widespread (for example, Patent Documents 1 and 2).
An optical waveguide substrate having a composite structure having an electronic circuit (conductor circuit) and an optical waveguide is often used, and a light receiving element and a light emitting element mounted on the optical waveguide substrate are optically connected via the optical waveguide. Thus, a module that can perform signal transmission between the light receiving element side and the light emitting element side (hereinafter also referred to as an optical waveguide module) is widely used.

The conventional optical waveguide module is provided with a mirror that bends the optical path of the optical waveguide at a right angle, as shown in FIG. 1 of Patent Document 1, FIG. 2D of Patent Document 2, and the like. A configuration in which optical coupling between an optical element (light receiving element or light emitting element) mounted above and an optical waveguide is realized is common.
JP 2000-199827 A JP 2002-182049 A

However, the conventional optical waveguide module has a problem that it takes time to align the optical element on the optical waveguide substrate and the mirror. In addition, in the work of electrically connecting the optical element to the conductor circuit on the optical waveguide substrate, it is necessary to maintain the positioning accuracy of the optical element with respect to the mirror, which increases the labor for mounting the optical element. It was also.
In the first place, there is a problem that it takes time and cost to form a mirror.

  In view of the above problems, an object of the present invention is to provide an optical waveguide module and a method for manufacturing the optical waveguide module, which can easily realize positioning and mounting of an optical element with respect to an optical waveguide at low cost.

In order to solve the above problems, the present invention provides the following configuration.
According to a first aspect of the present invention, an optical element that is a light receiving element or a light emitting element is accommodated in a recess formed in a substrate having an optical waveguide, and the optical element is a positioning contact formed on an inner surface of the recess of the substrate. An optical waveguide module is provided, wherein the optical waveguide module is positioned so that the light receiving / emitting portion faces an end surface exposed to the recess of the core portion of the optical waveguide in contact with the contact portion.
According to a second aspect of the present invention, the positioning contact portion of the recess of the substrate forms a pair facing each other in the recess, and the other surface from the opening of the recess that opens on one surface of the substrate. And the recesses are formed so that the extension of the optical axis of the optical waveguide is positioned between a pair of positioning contact portions. An optical waveguide module according to a first aspect of the present invention is provided.
According to a third aspect of the present invention, the optical element is plate-shaped, and includes a light receiving / light emitting portion installation region in which the light receiving / light emitting portion is provided on one of the front and back surfaces. And a contact surface that is brought into contact with a pair of positioning contact portions of the recess by being inserted into the recess from the opening. An optical waveguide module of the invention is provided.
According to a fourth aspect of the present invention, the optical element is brought into contact with the recess so that the optical element receives the light receiving / emitting optical axis of the recess of the optical waveguide. 2nd or 3rd invention characterized in that an inclined support contact portion is provided for supporting in an inclined direction with respect to a virtual vertical plane perpendicular to the optical axis at the end surface of the core portion exposed to An optical waveguide module is provided.
According to a fifth aspect of the invention, the inclined support contact portion is exposed to the recess as it goes from the one surface side of the substrate where the opening of the recess opens to the other surface side. An optical waveguide module according to a fourth aspect of the present invention is an inclined surface in which the distance from the end surface of the core portion of the optical waveguide gradually increases.
According to a sixth aspect of the present invention, an end surface of the core portion of the optical waveguide exposed in the recess is inclined with respect to a virtual vertical plane perpendicular to the optical axis at the end surface, or perpendicular to the optical axis at the end surface. An optical waveguide module according to any one of the first to fifth aspects, wherein the optical waveguide module is a curved surface that bulges on a virtual inclined surface inclined with respect to the virtual vertical surface.
According to a seventh aspect of the present invention, the electrodes provided on both surfaces of the optical element can be electrically connected to an electric circuit provided on the surface of the substrate on the side where the opening of the recess is opened. Provided is an optical waveguide module according to any one of the first to sixth aspects, wherein the optical waveguide module is connected.
An eighth invention provides an optical waveguide module according to the seventh invention, characterized in that the electrode of the optical element and the electric circuit of the substrate are bonded by a solder paste.
According to a ninth aspect of the present invention, an optical element that is a light receiving element or a light emitting element is housed in a recess formed in a substrate having an optical waveguide, and is brought into contact with a positioning contact portion formed on the inner surface of the recess. Thus, a method of manufacturing an optical waveguide module is provided, wherein the optical waveguide module is positioned and mounted so that the light receiving / emitting portion faces the end surface exposed in the recess of the core portion of the optical waveguide.
According to a tenth aspect of the present invention, the positioning contact portion of the recess of the substrate forms a pair facing each other in the recess, and the other surface from the opening of the recess that opens on one surface of the substrate. And the recesses are formed so that the extension of the optical axis of the optical waveguide is positioned between a pair of positioning contact portions. The optical element is inserted between a pair of positioning contact portions and brought into contact with the pair of positioning contact portions, so that the light receiving / emitting portion is brought into contact with the optical axis of the optical waveguide. A method for manufacturing an optical waveguide module according to a ninth aspect of the invention is characterized by positioning.
In an eleventh aspect of the invention, the optical element is plate-shaped, and includes a light receiving / light emitting portion installation area in which the light receiving / light emitting portion is provided on one of the front and back surfaces, and the recess is provided with the opening. Inserting between a pair of positioning contact portions formed at positions facing each other of the recess, contact surfaces formed on both side surfaces of the optical element via the light receiving / light emitting portion installation region A method of manufacturing an optical waveguide module according to a tenth aspect of the invention is characterized in that the receiving / emitting portion is positioned with respect to the optical axis of the optical waveguide by abutting against the pair of positioning abutting portions. provide.
According to a twelfth aspect of the present invention, the optical element is in contact with the optical element so that the optical axis of the light receiving / emitting part is in the concave part of the optical waveguide. An inclined support abutting portion is provided for supporting in an inclined direction with respect to an inclined surface inclined with respect to a virtual vertical plane perpendicular to the optical axis in the end surface of the core portion exposed to the optical axis. A method for manufacturing an optical waveguide module according to the tenth or eleventh invention is provided.
In a thirteenth aspect of the invention, the inclined support contact portion is exposed to the recess as it goes from the one surface side of the substrate where the opening of the recess opens to the other surface side. A manufacturing method of an optical waveguide module according to a twelfth aspect of the invention is provided, wherein the optical waveguide module is an inclined surface in which the distance from the end surface of the core portion of the optical waveguide gradually increases.
In a fourteenth aspect of the present invention, the end surface of the core portion of the optical waveguide exposed in the recess is inclined with respect to a virtual vertical plane perpendicular to the optical axis at the end surface, or perpendicular to the optical axis at the end surface. A method of manufacturing an optical waveguide module according to any one of the ninth to thirteenth inventions, wherein the curved surface bulges on a virtual inclined surface inclined with respect to the virtual vertical surface.
In a fifteenth aspect of the present invention, after the optical element is inserted into the recess of the substrate and positioned, the electrodes provided on both surfaces of the optical element are opened in the recesses of the substrate, respectively. A method of manufacturing an optical waveguide module according to any one of the ninth to fourteenth aspects is provided, wherein the optical circuit module is connected to an electric circuit provided on a surface of the optical waveguide so as to be electrically conductive.
According to a sixteenth aspect of the invention, there is provided the method for manufacturing an optical waveguide module according to the fifteenth aspect, wherein the connection between the electrode of the optical element and the electric circuit of the substrate is performed by bonding using a solder paste. To do.

According to the present invention, it is very easy to position the optical element so that the optical element can be optically coupled to the optical waveguide only by bringing the optical element inserted into the recess into contact with the positioning contact portion in the recess. Yes. For this reason, the manufacturing of the optical waveguide module can be greatly saved.
Compared to a configuration in which the optical coupling between the optical waveguide and the optical element is realized via a mirror as in the prior art, it is possible to reduce the time and cost of forming the mirror.

Hereinafter, an optical waveguide module embodying the present invention and a method for manufacturing the optical waveguide module will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing the structure of the optical waveguide module 1, and FIG. 2 is a diagram showing the relationship between the recess 3 (receptor structure portion) formed in the substrate 2 of the optical waveguide module 1 and the optical element 4. (A) is the figure which separated and showed the board | substrate 2 and the optical element 4, (b) is the figure which shows the state which fixed the optical element 4 to the recess 3, FIG. 3 (a), (b) is a recess. FIG. 4 is an exploded perspective view showing the substrate 2 of the optical waveguide module and the optical element 4 separated from each other.

As shown in FIGS. 1, 2 (a) and 2 (b), the optical waveguide module 1 is housed in a substrate 2 having an optical waveguide and a recess 3 formed in the substrate 2 and mounted on the substrate 2. The optical device 4 has a schematic structure.
The optical element 4 is, for example, a light emitting element such as an LD (semiconductor laser) or an LED, or a light receiving element such as a PD (photodiode). As the light emitting element, a VCSEL (surface emitting semiconductor laser) is suitable.
The optical element 4 is plate-shaped, and one of the front and back surfaces is a light receiving / light emitting portion installation surface 42 (light receiving / light emitting portion installation region) on which the light receiving / light emitting portion 41 is provided. The optical element 4 is optically coupled to the optical waveguide 5 by being inserted into the recess 3 of the substrate 2 and brought into contact with a positioning contact portion 31 (described later) formed on the inner surface of the recess 3. Positioned as possible. That is, the optical element 4 is positioned so that the light receiving / emitting portion 41 faces the end face 51 a exposed in the recess 3 of the core portion 51 (described later) of the optical waveguide 5, Photocoupled.

(Substrate, optical waveguide)
The substrate 2 of the optical waveguide module 1 illustrated in FIG. 1 and the like is provided with a conductor circuit 21 formed of a conductive metal such as copper or copper alloy on one or both surfaces (both surfaces in FIG. 1) of the plate-shaped optical waveguide 5. It has been configured.
The optical waveguide 5 has a configuration in which the periphery of a linear core portion 51 is covered with a clad portion 52.
The substrate 2 may have a configuration in which a conductor circuit 21 is provided on one surface of the optical waveguide 5 and a sheet-like or plate-like base material is provided on the other surface. The base material may be, for example, a base material used when sequentially forming by applying a varnish containing a resin material for forming individual layers of an optical waveguide forming body having a three-layer structure described later.

As a manufacturing method of the optical waveguide 5, for example, the following (a) and (b) can be adopted.
(A) An optical waveguide forming body having a three-layer structure in which a clad layer (a resin layer for forming a part of the clad portion 52) is provided on both surfaces of the core layer, which is a resin layer for forming the core portion, is prepared. The core portion 51 is formed by irradiating the optical waveguide forming body with active energy rays. 1A and 1B, the core layer is denoted by reference numeral 5a, the cladding layer is denoted by reference numeral 5b, and the optical waveguide forming body is denoted by reference numeral 5c.
By irradiation with the active energy ray, a part of the core layer becomes the core part 51, and the part other than the core part 51 of the core layer and the clad layers on both sides of the core layer constitute the clad part 52.
Examples of the material for forming the core layer include resin materials such as cyclic olefin resins such as acrylic resins, epoxy resins, polyimide resins, benzocyclobutene resins, and norbornene resins. A resin composition mainly containing a cyclic olefin resin such as a benzocyclobutene resin or a norbornene resin is preferred, and a resin composition mainly containing an addition polymer of a norbornene resin is particularly preferred.
Examples of active energy rays for forming the core 51 include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, and X-rays. An electron beam can be irradiated with an irradiation dose of, for example, about 50 to 200 KGy.
The material constituting the cladding layer is not particularly limited as long as the refractive index is lower than that of the material constituting the core layer. Specific examples include resin materials such as acrylic resins, epoxy resins, polyimide resins, benzocyclobutene resins, and cyclic olefin resins such as norbornene resins. Among these, a resin composition mainly comprising an addition polymer of norbornene resin is particularly preferable.
When a resin composition mainly composed of an addition polymer of norbornene-based resin is adopted as a material for forming the core layer and the clad layer, transparency, insulation, flexibility and heat resistance can be sufficiently obtained. In addition, the hygroscopicity can be reduced as compared with the case where other resins are used. In the case of a resin composition mainly composed of an addition polymer of norbornene resin, there is an advantage that the refractive index can be adjusted depending on the type of side chain of the addition polymer of norbornene resin.
In the case of this manufacturing method, a core part 51 having a quadrangular cross section (rectangular, but including a square) is obtained.
(B) The periphery of the core part formed in advance is covered with a clad material (clad part).
In the case of this manufacturing method, the cross-sectional shape of the core part 51 becomes free.

(Recess (receptor structure))
The recess 3 provided in the substrate 2 accommodates the optical element 4, so that the optical element 4 is received by the light receiving / emitting part 41 of the core part 51 of the optical waveguide 5 by the inner surface structure of the recess 3. It functions as a receptor structure portion for mounting an optical element, which is positioned so as to face the end surface 51a exposed in the recess 3.
In FIG. 1, FIG. 2 (a), (b), the said recess 3 opens only to one side (main surface 2a) of both surfaces (main surface 2a, 2b of the both sides of thickness) of the board | substrate 2, and the other side It is a non-through hole that is not open on the surface. However, the recess 3 is not limited to a non-through hole. For example, as shown in FIGS. 3A and 3B, a through hole that penetrates the substrate 2 in the thickness direction and opens to both main surfaces 2a and 2b. It may be.
In addition, FIG. 4, FIG. 5 (a), (b) has illustrated the case where the recess 3 is a through-hole.

As shown in FIGS. 1A and 1B to 4, the end surface 51 a of the core portion 51 of the optical waveguide 5 is exposed in the recess 3. The end surface 51a of the core part 51 is located in the vicinity of the inner surface of the recess 3 (position flush with the inner surface or slightly shifted from the inner surface).
In the recess 3, an imaginary straight line H (hereinafter sometimes referred to as an optical axis H) that coincides with the optical axis of the optical waveguide 5 in the end surface 51 a of the core portion 51 passes through the recess 3. Is formed.
Reference sign S1 is a virtual reference plane (hereinafter referred to as a virtual reference plane) that is perpendicular to the substrate 2 (specifically, both main surfaces 2a and 2b) and overlaps the virtual straight line H.
The recess 3 includes end surfaces 36a and 36b (inner wall surfaces; hereinafter referred to as end surfaces in the optical axis direction) at both ends in the direction along the imaginary straight line H, and inner surfaces (inner wall surfaces on both sides) through the virtual reference plane S1. ) And a pair of positioning contact portions 31 (positioning contact surfaces), and is formed in a hole shape (through hole or non-through hole) recessed from the first main surface 2a. The end surface 51a of the core portion 51 is exposed to at least one of the pair of optical axis direction end surfaces 36a and 36b (here, the end surface in the optical axis direction indicated by reference numeral 36a).

As shown in FIG. 4, the recess 3 in the illustrated example has a rectangular shape (square shape) in a plan view shape (a shape viewed from the first main surface 2 a side).
A pair of optical axis direction end faces 36a and 36b of the recess 3 illustrated in FIGS. 1A, 1B, and 4 are formed perpendicular to the virtual straight line H.

As shown in FIGS. 2 (a), 2 (b), 3 (a), 3 (b), etc., the pair of positioning contact portions 31 (positioning contact surfaces) is a virtual reference plane as described above. It is a concave inner surface (inner wall surface) located on both sides via S1.
The pair of positioning contact portions 31 (positioning contact surfaces) is from one main surface (first main surface 2a described later) side to the other main surface (second main surface 2b described later) side. The separation distance is gradually narrowed as the distance goes to.

2 (a), 2 (b), 3 (a), 3 (b), etc., the positioning contact portions 31 (a pair of inner surfaces) on both sides are respectively connected to one side of the substrate 2 via the virtual reference plane S1. An example of a configuration that is formed so as to approach the virtual reference plane S1 from the main surface (first main surface 2a described later) side to the other main surface (second main surface 2b described later) side is illustrated. ing.
However, the shape of the pair of positioning contact portions 31 (positioning contact surfaces) can be changed as appropriate in order to enable positioning of the optical element 4 in accordance with the shape of the optical element 4. For example, one of the positioning contact portions 31 on both sides via the virtual reference plane S1 is changed from one main surface (first main surface 2a described later) side to the other main surface (second main surface described later). 2b) A structure that is formed so as to approach the virtual reference surface S1 as it goes to the side (inclined surface), and the other positioning contact portion 31 is a flat surface that extends parallel to the virtual reference surface S1. It may be.

As described above, the recess 3 has a pair of positioning contact portions 31 (a pair of inner surfaces) from the one main surface (first main surface 2a described later) side to the other main surface, respectively. The recess 3 is opened to one surface (main surface 2a) of the substrate 2 by being formed so as to approach the virtual reference surface S1 as it goes to the (second main surface 2b described later) side. It is formed in a tapered hole shape in which the cross-sectional area gradually decreases (becomes narrower) from the opening 32a side to the other surface (main surface 2b) side.
In the present specification and drawings, the opening portion denoted by reference numeral 32a is the opening portion at the end portion on the side having the larger cross-sectional area among the axial ends of the tapered hole-like recess 3.
Of the two surfaces (main surfaces 2a, 2b) of the substrate 2, the surface where the opening 32a is opened (here, the main surface denoted by reference numeral 2a) is hereinafter referred to as the first main surface and the opposite surface (here). In the following description, the main surface 2b is sometimes referred to as a second main surface.
In the case of a non-through hole, the tapered hole-shaped recess 3 is axial (the vertical direction in FIGS. 2A, 2B, 3A, 3B. In other words, the depth direction. (It coincides with the thickness direction of the substrate 2) Of the both ends, only the side having the larger cross-sectional area (the first main surface 2a side) is opened.

The recess 3 is formed so as to reach the clad portion 52 located on the second main surface 2b side opposite to the first main surface 2a side via the core portion 51.
In addition, the recess 3 in the illustrated example is formed with a depth (a depth from the first main surface 2a) in which a part of the optical element 4 is accommodated, but a depth that allows the entire optical element 4 to be accommodated. May be formed.

The recess 3 (receptor structure) is configured such that the optical element 4 accommodated in the recess 3 contacts the positioning contact portions 31 on both sides of the virtual reference plane S1, so that the light receiving / emitting portion 41 is recessed. The optical waveguide faces the end surface 51a of the core portion 51 exposed at one of the optical axis direction end surfaces 36a and 36b at both ends in the direction along the optical axis of the third optical waveguide 5 (here, the end surface in the optical axis direction of reference numeral 36a). The optical element 4 is positioned so that it can be optically coupled to the optical element 5.
The optical element 4 is brought into contact with the positioning contact portions 31 on both sides of the virtual reference plane S1 when the optical element 4 is housed in the recess 3 on both sides via the light receiving / emitting portion installation surface 42. A contact surface 43 (side surface) is provided. The optical element 4 housed in the recess 3 is a position where optical contact with the optical waveguide 4 is possible by bringing the contact surfaces 43 on both sides into contact with the positioning contact portions 31 on both sides of the virtual reference surface S1. Is positioned.

Specifically, the recess 3 (receptor structure portion) illustrated in FIGS. 2A, 2B, 3A, and 3B is formed in a V-groove shape. A pair of inner surfaces (positioning contact portions 31) located on both sides of the recess 3 via the virtual reference plane S1 go from the first main surface 2a side to the second main surface 2b side of the substrate 2, respectively. Accordingly, the flat surface (an inclined surface inclined with respect to the virtual reference surface S1) that approaches the virtual reference surface S1 and gradually becomes separated from each other is formed. Further, each positioning contact portion 31 (positioning contact surface, inclined surface) is a virtual vertical surface (for example, as shown in FIG. 6A) perpendicular to the end surface 51a of the core portion 51 exposed at the optical axis direction end surface 36a. Perpendicular to the virtual vertical plane S2). The optical element 4 is brought into contact with the optical waveguide 5 by bringing the pair of contact surfaces 43 into contact with the pair of positioning contact portions 31 (positioning contact surfaces, inclined surfaces) of the recess 3. It is positioned so that optical coupling is possible.
The recess 3 (receptor structure) according to the present invention is not limited to this, and various configurations such as the configuration illustrated in FIGS. 5A and 5B can be employed.
As the structure of the recess 3 (receptor structure portion) (the shape of the inner surface of the recess on both sides of the virtual reference plane S1), the optical element 4 is arranged according to the shape of the optical element 4 that is housed and positioned in the recess 3. In order to be able to be positioned, from one main surface (first main surface 2a described later) side of the substrate 2 to the other main surface (second main surface 2b described later) side, the virtual reference surface S1 is interposed. One or both of the inner surfaces (positioning contact portions 31) on both sides may approach the virtual reference plane S1, and the distance between the inner surfaces gradually decreases. The design can be changed as appropriate. It is.

The recess 3 illustrated in FIGS. 5A and 5B also has a positioning contact portion 31 on the inner surfaces that are located on both sides of the recess 3 and face each other via the virtual reference plane S1. 1. Common to the recess 3 in FIGS. 2 (a) and 2 (b).
The recesses 3 in FIG. 5A are virtual as the pair of inner surfaces located on both sides via the virtual reference plane S1 goes from the first main surface 2a side to the second main surface 2b side of the substrate 2, respectively. It is a curved surface 33 that approaches the reference surface S <b> 1 and whose separation distance gradually decreases. Each of the pair of curved surfaces 33 functions as the positioning contact portion 31.
The recess 3 in FIG. 5B is virtual as one of the pair of inner surfaces located on both sides via the virtual reference plane S1 goes from the first main surface 2a side of the substrate 2 to the second main surface 2b side. The curved surface 34 that is close to the reference surface S1 is formed, but the other of the paired inner surfaces becomes the virtual reference surface S1 as it goes from the first main surface 2a side to the second main surface 2b side of the substrate 2. It is an approaching flat surface (inclined surface). The curved surface 34 and the flat surface 35 function as the positioning contact portion 31.
The positioning contact portion 31 for the recess is not limited to the above-described FIGS. 5A and 5B. For example, one of the pair of inner surfaces located on both sides via the virtual reference surface S1 is used as the virtual reference surface. A configuration in which the surface is parallel to the surface S1 (a surface perpendicular to the substrate 2) can also be employed.

The optical element 4 is mounted on the substrate 2 by being inserted into the recess 3 from the first main surface 2a side.
The optical element 4 has an insertion positioning portion 46 having a tapered shape (wedge shape), and is inserted into the recess 3 from the distal end (insertion distal end portion 44) side of the insertion positioning portion 46 and incorporated.
The contact surfaces 43 located on both sides of the optical element 4 via the light receiving / emitting part installation surface 42 are side surfaces on both sides of the insertion positioning part 46, and in the optical element 4, the insertion tip part 44 extends from the insertion tip part 44. The separation distance is gradually increased toward the rear end 45 (the rear end of the optical element 4) on the side opposite to 44. The pair of contact surfaces 43 are formed perpendicular to the light receiving / light emitting unit installation surface 41.
The optical element 4 inserts the insertion positioning portion 46 into the recess 3 from the insertion distal end portion 44 (inserted from the opening 32a on the first main surface 2a side of the recess 3). The contact surface 43 is positioned so as to be optically coupled to the optical waveguide 5 by contacting the contact surfaces 43 with the positioning contact portions 31 on both sides via the virtual reference surface S <b> 1 of the recess 3.

  The optical element 4 illustrated in FIGS. 2 (a), 2 (b) to 5 (a), (b) is specifically formed in a square plate shape, and is one of the four vertices of the square. One functions as the insertion tip 44. In addition, a pair of side surfaces (end surfaces perpendicular to the light receiving / light emitting unit installation surface 41) extending from the insertion distal end portion 44 serve as contact surfaces 43.

In this embodiment, as the optical element 4, the light receiving / emitting optical axis of the light receiving / emitting unit 41 (see, for example, the optical axis H <b> 1 in FIG. 11B) with respect to the light receiving / emitting unit installation surface 42. Use a vertical one.
In the case where the optical element 4 is a light emitting element, one that emits light having an optical axis perpendicular to the light receiving / emitting unit installation surface 42 is employed. In the case of the optical element 4 having a light emitting surface (light emitting portion) such as a VICSEL, one that emits output light in a direction perpendicular to the light emitting surface from the light emitting surface oriented parallel to the light receiving / light emitting portion installation surface 42 is adopted. To do. In the case of a light receiving element, one having a light receiving surface (light receiving portion) oriented in parallel to the light receiving / light emitting portion installation surface 42 is adopted, and this is used with respect to the light receiving / light emitting portion installation surface 42. It is assumed that it is treated as a vertical optical element (light receiving element).
In other words, the optical element 4 in which the receiving / emitting optical axis H1 of the receiving / emitting unit 41 is perpendicular to the receiving / emitting unit installation surface 42 is oriented in a direction parallel to the receiving / emitting unit installation surface 42. An optical element having a light receiving / emitting surface.

As shown in FIGS. 2A, 2B, 3A, and 3B, the positioning of the optical element 4 in the recess 3 is performed on the contact surfaces 43 on both sides of the insertion positioning portion 46 of the optical element 4. However, as shown in FIG. 5A, in addition to the surface contact with the positioning contact portions 31 which are the inner surfaces on both sides via the virtual reference plane S1 of the recess 3, A mode of positioning by local contact with the contact portion 31 (curved surface 33), as shown in FIG. 5B, one side (curved surface) of the positioning contact portions 31 on both sides via the virtual reference surface S1. It is also possible to adopt a mode of positioning by local contact with respect to 34) and surface contact with the other positioning contact portion 31 (flat surface 35).
5 (a) and 5 (b), on both sides, contact surfaces 43 formed in a shape capable of surface contact with the positioning contact portions 31 on both sides via the virtual reference surface S1 are provided on both sides. It is possible to employ the optical element 4 having the same.

In the recess 3, light is applied to one of the optical axis direction end faces 36 a and 36 b at both ends in the direction along the optical axis H (virtual straight line) of the optical waveguide 5 (here, the end face in the optical axis direction indicated by reference numeral 36 b). The optical element 4 can be positioned in the optical axis direction by bringing the back surface 48 of the element 4 opposite to the light receiving / emitting part installation surface 42 into contact. Thereby, the positioning of the light receiving / emitting part 41 in the optical axis direction with respect to the end surface 51a of the core part 51 of the optical waveguide 5 is realized.
The optical element 4 includes an optical axis end face 36a (hereinafter also referred to as a core side end face) opposite to the optical axis end face 36b in which the light receiving / emitting section 41 contacts the back face 48 of the optical element 4 in the recess 3. Or the light receiving / emitting portion 41 is in contact with the end surface 51a of the core portion 51 (however, pressure contact) Position it so that it makes contact with light force. The optical axis direction end face 36 b functions as a positioning part (optical axis direction positioning part) for positioning the optical element 4 in the optical axis direction of the optical waveguide 5.
The positioning of the optical element 4 in the optical axis direction of the optical waveguide 5 can be performed, for example, by inserting a spacer between the optical axis direction end face 36 b and the optical element 4.

The end surface 51a of the core portion 51 of the optical waveguide 5 (hereinafter sometimes abbreviated as “core portion end surface 51a”) is flush with the core-side inner wall surface 36a of the recess 3, and also the core of the recess 3 It may be slightly displaced from the inner wall surface 36a.
The core portion 51 may slightly protrude from the core portion side inner wall surface 36a (see FIGS. 6A, 6B, and 6C), and the tip position is slightly from the core portion side inner wall surface 36a. It may be in a position that is depressed.

(Shape of core end face)
The shape of the core portion end surface 51 a may be a flat surface perpendicular to the optical axis H of the optical waveguide 5 in the core portion end surface 51 a, but between the light receiving / emitting portion 41 of the optical element 4 and the optical waveguide 5. It is more preferable to adopt the shapes illustrated in FIGS. 6A to 6D in that the generated scattered light is prevented from entering the optical waveguide 5.

FIGS. 6A, 6 </ b> B, and 6 </ b> C show examples of the end face 51 a at the tip of the core 51 that slightly protrudes from the core-side inner wall surface 36 a of the recess 3.
FIG. 6A shows a core portion end surface 51a that is a virtual vertical surface S2 perpendicular to the optical axis H of the optical waveguide 5 at the tip of the core portion 51 (in FIG. 6A, the core portion side inner wall surface 36a of the recess 3). Illustrates a configuration in which the inclined surface 51a1 (core portion end surface) is inclined with respect to the virtual vertical surface S2.
The inclination angle θ1 of the inclined surface 51a1 with respect to the virtual vertical plane S2 is preferably about 8 degrees (7-9 degrees).

6 (b) and 6 (c) show the core part end face 51a as a virtual vertical plane S2 perpendicular to the optical axis H of the optical waveguide 5 at the tip of the core part 51 (in FIG. 6 (b) and FIG. 3 is a curved surface having a shape that bulges on a virtual inclined surface S3 that is inclined with respect to the virtual vertical surface S2.
The inclination angle θ2 of the virtual inclined surface S3 with respect to the virtual vertical surface S2 is set to 5 to 11 degrees, more preferably about 8 degrees (7-9 degrees).
The core part end surface 51a (curved surface 51a2) in FIG. 6B is a pair of parallel sides of the core part 51 having a quadrangular cross section (a rectangle including a square) (provided that 4 of the cross section of the core part 51 in the virtual inclined surface S3) A curved surface having a constant width that bulges on the virtual inclined surface S3 and extends in an arc shape so as to connect a pair of sides parallel to the virtual vertical surface S2. Of the four side surfaces of the core portion 51 having a quadrangular cross section, two side surfaces on which a pair of sides inclined with respect to the virtual vertical surface S2 among the four sides of the cross section of the core portion 51 in the virtual inclined surface S3 are located on the curved surface 51a2. It is perpendicular to it. In FIG.6 (b), the part located on virtual inclined surface S3 of the core part 51 front-end | tip has the external appearance close to what is called a saddle shape.
In FIG.6 (c), the front-end | tip of the core part 51 is formed in the external appearance dome shape which swells on virtual inclined surface S3. The core part end surface 51a (curved surface 51a3) is a virtual inclination of the core part 51 having a quadrangular cross section (a rectangle including a square) of the optical waveguide 5 from the vertex 51b at which the tip of the core part 51 protrudes on the virtual inclined surface S3. It is a curved surface connecting the four sides of the cross section of the surface S3.
The core end surface 51a3 has the same appearance as so-called APC (Angled Physical Contact) polishing.

FIGS. 7A and 7B show a flat surface (hereinafter referred to as “virtual vertical surface”) in which the core portion end surface 51a is inclined with respect to a virtual surface (virtual vertical surface) perpendicular to the optical axis H of the optical waveguide 5 in the core portion end surface 51a. This is also an example of an inclined surface 51a1.
However, in FIGS. 7A and 7B, the direction of the optical axis H extends from the first main surface 2 a side of the substrate 2 toward the second main surface 2 b side of the core portion side inner wall surface 36 a of the recess 3. In the optical axis direction end surface 36b opposite to the core portion side inner wall surface 36a (in other words, the end on the first main surface 2a side of the core portion side inner wall surface 36a and perpendicular to the optical axis H). A flat surface (inclined surface 36a1) formed so as to increase from the virtual vertical surface S4 passing through the portion to the optical axis direction end surface 36b side, and the inclined surface 51a1 that is the core end surface 51a is recessed. 3 is formed flush with the core-part-side inner wall surface 36a. The inclined surface 51a1 is inclined with respect to the virtual vertical surface S4. With this configuration, for example, when the recess 3 is formed by laser processing, machining, or the like of the optical waveguide 5, the core portion end surface 51a is processed simultaneously with the formation of the core portion side inner wall surface 36a of the recess 3 ( Since the formation of the inclined surface 51a1 is also completed, there is an advantage that the end surface 51a need not be processed separately.
Also in this case, the inclination angle θ3 of the inclined surface 36a1 with respect to the virtual vertical plane S4 is set to suppress the incidence of scattered light generated between the light receiving / emitting section 41 of the optical element 4 and the optical waveguide 5 to the optical waveguide 5. It is preferably around 8 degrees (7 to 9 degrees).

(Electrode of optical element)
2 (a), 2 (b), 3 (a), and 3 (b), the optical element 4 is placed on the substrate 2 as shown in FIG. Electrodes 47a and 47b are provided for connection with the provided conductor circuit 21 (electric circuit) so as to be electrically conductive. Of the electrodes 47a and 47b on both sides of the optical element 4, one is a cathode and the other is an anode.
One electrode 47 a is provided on the receiving / light emitting unit installation surface 42 on the rear end 45 side of the receiving / emitting unit 41. The other electrode 47 b is provided on the back surface 48 side of the optical element 4 opposite to the light receiving / emitting portion installation surface 42.
The electrodes 47 a and 47 b are formed so as to extend along the light receiving / emitting part installation surface 42 or the back surface 48 of the optical element 4. When the optical element 4 is inserted and positioned in the recess 3, the electrodes 47a and 47b intersect with the extension of the first main surface 2a of the substrate 2 (only a part of the electrodes 47a and 47b is exposed on the substrate 2). Alternatively, the entirety is not stored in the recess 3 of the optical element 4 but is exposed in a portion protruding on the substrate 2.
The optical waveguide module 1 is assembled by inserting the optical element 4 into the recess 3 and then electrically connecting the electrodes 47 a and 47 b to the conductor circuit 21 provided on the first main surface 2 a side of the substrate 2. .

For example, the electrical connection between the electrodes 47a and 47b of the optical element 4 inserted into the recess 3 and the conductor circuit 21 of the substrate 2 is connected to the conductor circuit 21 near the recess 3 as illustrated in FIG. Bonding is performed directly using the solder paste 6 between the formed electrode 21a (land portion) and the electrodes 47a and 47b of the optical element 4. In this case, the solder paste 6 itself can function as a fixing portion for fixing the optical element 4 to the substrate 2.
In addition to directly bonding between the electrode 21a of the conductor circuit 21 and the electrodes 47a and 47b of the optical element 4 by using the solder paste 6, for example, wire bonding using an extra fine wire can be employed.

  The electrical connection between the electrodes 47a and 47b of the optical element 4 and the conductor circuit 21 is performed by, for example, forming the electrode of the conductor circuit 21 in the recess 3 in advance and inserting the electrode into the recess 3. The electrodes 47 a and 47 b of the optical element 4 may be realized in contact with the electrodes of the conductor circuit 21. In this case, for example, when the positions of the electrodes 47 a and 47 b of the optical element 4 are changed to the contact surface 43 and the optical element 4 is inserted into the recess 3, the electrodes 47 a and 47 b are in the recess 3. It is possible to employ a configuration in which electrical connection is realized by contacting the electrode of the conductor circuit 21 formed in advance on the positioning contact portion 31.

(Method for manufacturing optical waveguide module)
Next, an example of an assembly method of the optical waveguide module 1 described above (an optical waveguide module manufacturing method) will be described with reference to FIGS.
First, the substrate 2 is prepared (see FIG. 9A), and the adhesive 7 is applied to the inner surface of the recess 3 of the substrate 2 (FIG. 9B). Next, as shown in FIG. 9C, the optical element 4 is inserted into the recess 3, and the contact surfaces 43 on both sides of the optical element 4 are brought into contact with the positioning contact portions 31 in the recess 3. Thus, the optical element 4 is positioned. Next, the electrodes 47a and 47b of the optical element 4 are connected to the conductor circuit 21 of the substrate 2 so as to be electrically conductive (FIG. 9D).

For the substrate 2, for example, by preparing a plate-shaped optical waveguide 5 and taking into account the electrical connection with the circuit in the electronic device on which the optical waveguide module 1 is mounted, the position of the conductor circuit 21 of the substrate 2, etc. The recess 3 is processed and formed at an appropriate position of the optical waveguide 5.
The optical waveguide 5 used here may have a conductor circuit 21 on one side.
The formation of the recess 3 can be performed by, for example, laser processing, machining using a small tool, or the like.
In the case of laser processing, for example, as shown in FIG. 10, a laser beam 82 is irradiated to the recess 3 formation position while moving a mask 81 disposed between the laser irradiation device 8 and the optical waveguide 5. By controlling the laser irradiation time with respect to the optical waveguide 5 according to the moving speed of the mask 81, the recess 3 having the pair of positioning contact portions 31 can be formed. Optical axis direction end faces 36a and 36b are also formed.
Examples of the laser include a carbon dioxide laser, an excimer laser, and an ultraviolet laser.
The conductor circuit 21 may be formed by bonding a metal plate such as copper or copper alloy to the optical waveguide 5 in which the formation of the recess 3 is completed and etching the metal plate. It is also possible to form the conductor circuit 21 by etching the metal plate after forming the recess 3 in the optical waveguide 5 to which the metal plate for forming the conductor circuit (for example, copper or copper alloy) has been bonded. is there.

  Further, in the optical waveguide manufacturing method described above, a clad layer (resin layer for forming a part of the clad portion 52) is provided on both surfaces of the core layer, which is a resin layer for forming the core portion. In the case of obtaining an optical waveguide 5 by creating a layered optical waveguide forming body and irradiating the optical waveguide forming body with active energy rays to form the core portion 51, for example, forming an optical waveguide having a three-layer structure In order to secure the recess 3 when each layer constituting the body is sequentially formed by applying a varnish containing a resin material forming the individual layers (the first layer to be formed uses a substrate for application). It is also possible to obtain an optical waveguide forming body in which the recesses 3 are formed using the spacer.

(Another aspect 1)
11A and 11B show the optical element 4 in the recess 3, and the optical axis H1 of the light receiving / emitting part 41 of the light receiving / emitting part 41 is the optical axis H of the core end face 51a of the optical waveguide 5. FIG. The example which provided the contact part 37 for inclination support for supporting in the direction inclined with respect to the perpendicular | vertical virtual vertical surface S4 is shown.
For the sake of distinction, the recess 3 having the inclined support contact portion 37 may be described below with reference numeral 3A for convenience of explanation.

11A and 11B, the inclined surface 36a1 (core portion side inner wall surface 36a) itself having the configuration illustrated in FIGS. 7A and 7B is used as the inclined support contact portion 37. FIG. An example used is shown.
The inclined support contact portion 37 (inclined support contact surface) of the recess 3 </ b> A is inclined with respect to a virtual vertical plane S <b> 4 perpendicular to the optical axis H of the optical waveguide 5. The inclined support contact portion 37 (inclined support contact surface) is also a part of the inner surface of the recess 3A. The inclined surface 51a1 which is the core portion end surface 51a is formed flush with the core portion side inner wall surface 36a of the recess 3.
The optical element 4 is inserted into the recess 3A, and the receiving / light emitting portion installation surface 42 is brought into contact (surface contact) with the inclined support contact portion 37 (core side inner wall surface 36a). The light emitting portion installation surface 42 is oriented along the inclined support contact portion 37.
In this recess 3A, the optical element 4 is connected to the positioning contact portions 31 and the tilt support contact portions 37 (tilt support contact surfaces) on both sides via the virtual reference plane S1 in the recess 3A. It can comprise so that it can position by contact | abutting. For this reason, the optical axis direction end surface 36b facing the core portion side inner wall surface 36a in the recess 3A is not necessarily formed so as to function as an optical axis direction positioning portion.

From the above, when the optical element 4 is positioned by bringing the light receiving / light emitting part installation surface 42 of the optical element 4 inserted into the recess 3A into contact with the inclined support contact part 37, the light receiving / light emitting part installation surface 42 is obtained. The optical axis H1 of light reception / light emission of the light reception / light emission unit 41 perpendicular to the virtual vertical surface S4 perpendicular to the optical axis H in the core end surface 51a exposed in the recess 3 of the optical waveguide 5 is Inclined direction.
The tilt angle θ4 of the light receiving / emitting optical axis H1 of the light receiving / emitting section 41 with respect to the virtual vertical plane S4 (in other words, the tilt angle of the virtual tilted surface S3 with respect to the virtual vertical plane S4) is the light receiving / emitting light of the optical element 4. From the viewpoint of preventing the scattered light generated between the portion 41 and the optical waveguide 5 from entering the optical waveguide 5, it is appropriate to set the angle to 5 to 11 degrees, more preferably about 8 degrees (7 to 9 degrees). However, the present invention is not limited to this. For example, when the tilt angle θ4 is about 10 to 60 degrees, the projecting dimension from the substrate 2 at the rear end 45 side portion that is not accommodated in the recess 3A of the optical element 4 and is projected from the substrate 2 Contributes effectively to reduction.

Also in the optical waveguide module 1 having the recess 3A in which the inclined support contact portion 37 (inclined support contact surface) is formed, as illustrated in FIGS. It is possible to adopt a configuration in which is slightly protruded from the core portion side inner wall surface 36a. In the case of the recess 3A, the tip of the core portion 51 is configured to protrude from the inclined support contact portion 37 (inclined surface 36a1, core side inner wall surface 36a).
12 (a), 12 (b) to 14 (a), 14 (b) show the receiving of the optical element 4 in contact with the inclined support contact portion 37 (inclined support contact surface) of the recess 3A. / A configuration for appropriately setting the distance of the optical element 4 with respect to the tip of the core 51 in order to avoid the light emitting portion 41 being pressed against the tip of the core 51 protruding from the core-side inner wall surface 36a. Illustrate.

  12 (a), 12 (b), 13 (a), and 13 (b) show a concave groove 37a that extends along the virtual reference plane S1 in the inclined support contact portion 37 (inclined support contact surface). A configuration in which the tip of the core portion 51 protrudes into the concave groove 37a is illustrated. The tip of the core 51 protrudes from the bottom surface 37b of the concave groove 37a (a part of the inner wall surface 36a on the core part side) into the concave groove 37a. It does not protrude toward the end surface 36b in the optical axis direction facing the inner wall surface 36a. As a result, the light receiving / light emitting portion 41 of the optical element 4 mounted on the substrate 2 by being brought into contact with the inclined support contact portion 37 (inclined support contact surface) and positioned in the recess 3A is mounted on the core. It is possible to arrange it so as to face the tip (end surface 51a) of the portion 51 through a minute gap or to contact it with a light force so that it does not press against the core end surface 51a with a strong force. Can be arranged.

14A and 14B show the contact between the tip of the core 51 protruding to the center of the inclined support contact portion 37 (inclined support contact surface) and the light receiving / emitting portion 41 of the optical element 4. A plate-like spacer 38 having a notch 38a for avoidance is inserted between the optical element 4 and the inclined support contact portion 37, and the light with respect to the tip of the core portion 51 depends on the thickness of the plate-like spacer 38. A configuration in which the distance of the element 4 can be set is illustrated.
The specific shape of the plate-like spacer 38 may be any shape as long as it can avoid contact with the tip of the core portion 51 protruding at the center of the inclined support contact portion 37 and the light receiving / emitting portion 41 of the optical element 4. It is not limited to what was illustrated to 14 (a) and (b). In addition, a configuration in which two plate-like spacers are disposed opposite to each other via the tip of the core portion 51 can be employed.
In addition, the plate-like spacer is fixed to the inclined support contact portion 37 or the light receiving / light emitting portion installation surface 42 of the optical element 4 in advance with an adhesive or the like before the optical element 4 is incorporated into the recess 3A. May be.
Furthermore, a plurality of plate-like spacers may be used in an overlapping manner.

(Another aspect 2)
FIGS. 15A and 15B show an optical waveguide module 1 (hereinafter referred to as the optical waveguide module 1) using an optical element 4 having a plurality of light receiving / emitting portions 41 (hereinafter, this optical element is denoted by reference numeral 4A). A configuration of 1A) is exemplified.
The optical element 4A shown in FIGS. 15 (a) and 15 (b) has a plurality of light receiving / emitting portions 41 arranged in a line between the contact surfaces 43 on both sides of the light receiving / light emitting portion setting surface 42. is there.
The optical element 4A in the illustrated example as a whole functions as the insertion positioning portion 46. As the optical element 4A moves from the insertion tip portion 44 toward the rear end portion 45 on the side opposite to the insertion tip portion 44, the optical element 4A The separation distance between the contact surfaces 43 on both sides is gradually increased via the light receiving / emitting portion installation surface 42 of the element 4. In addition, the rear end portion 45 is located on the side opposite to the insertion tip portion 44 via an array virtual line L in which a plurality of light receiving / emitting portions 41 are arranged in the optical element 4.
In addition, a plurality of electrodes 47a and 47b corresponding to the individual light receiving / light emitting portions 41 are installed at positions shifted from the light receiving / light emitting portions 41 toward the rear end 45 in the optical element 4A.

The concave portion 3 of the substrate 2 on which the optical element 4A is mounted (for the sake of distinction, for convenience of explanation, the following description may be given with reference numeral 3B) is provided on the core-side inner wall surface 36a with the optical waveguide 5 The tips of the plurality of core portions 51 are exposed side by side. The tips of the plurality of core portions 51 exposed at the core portion side inner wall surface 36a are arranged on an imaginary straight line along the surface direction of the substrate 2 between the pair of positioning contact portions 31 in the recess 3. Has been.
The optical element 4A is incorporated in the recess 3B, and the contact surfaces 43 on both sides of the optical element 4A are brought into contact with a pair of positioning contact portions 31 in the recess 3 of the substrate 2, so that the recess 3B A plurality of light receiving / emitting portions 41 of the optical element 4A are arranged facing each other and optically coupled to a plurality of core portions 51 (specifically, tips of the core portions 51) exposed side by side on the inner wall surface 36a on the core portion side. Positioned as possible.
This optical waveguide module 1A can also be assembled in the same procedure as the above-described optical waveguide module manufacturing method (assembly method).

As described above, according to the present invention, the optical element 4 inserted into the recess 3 can be used as the positioning contact portion 31 in the recess 3 and the optical axis direction end face 36b (or the optical axis direction positioning surface). The optical element 4 can be positioned with respect to the optical waveguide 5 so as to be optically coupled to the optical waveguide 5 by simply contacting the spacer between the optical axis direction end face 36b and the optical element 4). . Compared to a configuration in which the optical coupling between the optical waveguide and the optical element is realized via a mirror as in the prior art, it is possible to reduce the labor for forming the mirror and reduce the cost. As a result, significant labor savings and cost reduction in the production of the optical waveguide module can be realized.
In addition, since the optical element is directly optically coupled to the optical waveguide, the optical signal can be transmitted with low loss compared to a configuration in which optical coupling between the optical waveguide and the optical element is realized via a mirror. Transmission is possible. For this reason, it is advantageous for high-speed, large-volume signal transmission.

Needless to say, the present invention is not limited to the above-described embodiment, and the design can be changed as appropriate.
For example, the specific shape or the like of the optical element is not limited to the above-described embodiment, and can be changed as appropriate.
Further, in the above-described embodiment, the configuration in which the rear end 45 side of the optical element 4 incorporated in the recess 3 and mounted on the substrate 2 is illustrated as protruding on the substrate 2, but the entire optical element is accommodated in the recess. In addition, a configuration in which there is no portion protruding from the substrate can be employed.
The optical waveguide module according to the present invention has a configuration in which the optical element 4 incorporated so as to be fitted in the recess formed in the substrate is positioned so as to be optically coupled to the optical waveguide 5 by the inner shape of the recess. There is no particular limitation on the specific shape of the recess.

It is sectional drawing which shows an example of the structure of the optical waveguide module which concerns on this invention. It is a figure which shows the relationship between the recess (receptor structure part) formed in the board | substrate of the optical waveguide module of FIG. 1, and an optical element, Comprising: (a) is the figure which isolate | separated and showed the board | substrate and the optical element, b) shows a state in which the optical element is fixed in the recess. (A), (b) is a figure which shows the structure of the optical waveguide module which used the recessed part as the through-hole. It is the disassembled perspective view which isolate | separated and showed the board | substrate and optical element of the optical waveguide module of FIG. (A), (b) is a figure which shows the modification of the contact part for positioning of a recess. (A)-(c) is a figure which shows the example of the end surface shape of the front-end | tip protruded from the core part side inner wall surface of the recess of the core part of an optical waveguide. (A), (b) is a figure which shows the structure which formed the core part end surface flush with the core part side inner wall surface made into the inclined surface. It is a top view which shows the state which connected the electrode of the optical element inserted in the recess of the board | substrate, and the conductor circuit of the board | substrate with the solder paste. (A)-(d) is a figure explaining the manufacturing method of the optical waveguide module concerning this invention in order. It is a figure explaining an example of the method for forming a recess in an optical waveguide, Comprising: It is a figure explaining the method of forming a recess by laser irradiation, moving a mask. (A), (b) is a figure which shows the structure of the optical waveguide module of the structure which formed the recess with the inclination support contact part (inclination support contact surface) for the inclination support of an optical element in the board | substrate. is there. FIG. 12 is a perspective view showing an example in which a recess / groove is formed in the recess of FIG. 11 to prevent the light receiving / emitting part of the optical element from being pressed against the tip of the core part protruding from the inner wall surface on the core part side. . (A), (b) is sectional drawing which shows the relationship between the board | substrate with a recess provided with the ditch | groove of FIG. 12, and an optical element. (A) shows that when the optical element housed in the recess of FIG. 11 is brought into contact with the inclined support contact portion (inclined support contact surface), the light receiving / emitting portion is protruded from the inner wall surface on the core side. The perspective view which shows the plate-shaped spacer used in order to avoid being pressed on the front-end | tip of another core part, (b) is the plate-shaped spacer of FIG. It is a figure which shows the state inserted in between. (A), (b) is a figure which shows the aspect which enabled it to position collectively the optical element which has two or more light receiving / light-emitting parts corresponding to the several core part of a board | substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 1A ... Optical waveguide module, 2 ... Board | substrate, 2a ... Main surface (1st main surface), 2b ... Main surface (2nd main surface), 21 ... Conductor circuit, 21a ... Electrode 3, 3A, 3B ... Concave (Receptor structure part), 31 ... positioning contact part, 32a, 32b ... opening, 33, 34 ... curved surface (positioning contact part), 35 ... flat surface (positioning contact part), 36a ... Optical axis direction end face (core part side inner wall surface), 36a1 ... inclined face (optical axis direction end face, core part side inner wall face), 36b ... optical axis direction end face, 37 ... inclined support contact part (inclined support contact part) Surface), 37a ... concave groove, 38 ... plate spacer, 38a ... notch part, 4, 4A ... optical element, 41 ... light receiving / light emitting part, 42 ... light receiving / light emitting part installation area (light receiving / light emitting part installation surface) , 43 ... Abutting surface, 44 ... Insertion tip, 45 ... Rear end, 46 ... Insertion positioning part, 47a, 47b ... Electrode, 48 Back surface, 5 ... Optical waveguide, 51 ... Core part, 51a ... End face, 51a1 ... Inclined surface (core part end face), 51a2 ... Curved face (core part end face), 51a3 ... Curved face (core part end face), 51b ... Top part ( Apex), 52 ... cladding part, 6 ... solder paste, 7 ... adhesive, H ... virtual straight line coincident with optical axis, optical axis, H1 ... optical axis of light receiving / emitting part, 8 ... laser irradiation device, 81 ... mask , 82 ... laser light, S1 ... virtual reference plane, S2 ... virtual vertical plane, S3 ... virtual inclined plane, S4 ... virtual vertical plane.

Claims (16)

An optical element that is a light receiving element or a light emitting element is housed in a recess formed in a substrate having an optical waveguide,
The optical element contacts a positioning contact portion formed on the inner surface of the recess of the substrate, and is positioned so that the light receiving / emitting portion faces the end surface exposed to the recess of the core portion of the optical waveguide. An optical waveguide module characterized by being made. The positioning contact portions of the recesses of the substrate form a pair facing each other in the recesses, and are spaced apart from each other toward the other surface from the opening portion of the recess opening in one surface of the substrate. It is an inner surface formed so that the distance is gradually narrowed,
2. The optical waveguide module according to claim 1, wherein the recess is formed such that an extension of the optical axis of the optical waveguide is positioned between a pair of positioning contact portions.   The optical element is plate-shaped, and has a light receiving / light emitting portion installation area in which the light receiving / light emitting section is provided on one of the front and back surfaces, and on both sides through the light receiving / light emitting section installation area, The optical waveguide module according to claim 2, further comprising a contact surface that comes into contact with a pair of positioning contact portions of the recess by being inserted into the recess from the opening.   Further, the optical element is brought into contact with the recess, so that the optical element is exposed to an end surface of the core portion where the receiving / emitting optical axis of the receiving / emitting portion is exposed to the recess of the optical waveguide. 4. The optical waveguide module according to claim 2, further comprising an inclined support contact portion for supporting in an inclined direction with respect to a virtual vertical plane perpendicular to the optical axis.   The core portion of the optical waveguide that is exposed to the recess as the inclined support contact portion goes from the one surface side of the substrate where the opening of the recess opens to the other surface side. The optical waveguide module according to claim 4, wherein the optical waveguide module is an inclined surface with a gradually increasing distance from the end face.   The end surface of the core portion of the optical waveguide exposed in the recess is inclined with respect to a virtual vertical surface perpendicular to the optical axis at the end surface, or to a virtual vertical surface perpendicular to the optical axis at the end surface. The optical waveguide module according to claim 1, wherein the optical waveguide module is a curved surface that bulges on a virtual inclined surface that is inclined.   The electrodes provided on both surfaces of the optical element are respectively connected to an electric circuit provided on the surface of the substrate on the side where the opening of the recess is opened so as to be electrically conductive. The optical waveguide module according to claim 1, wherein the optical waveguide module is characterized in that:   8. The optical waveguide module according to claim 7, wherein the electrode of the optical element and the electric circuit of the substrate are bonded with a solder paste.   An optical element, which is a light receiving element or a light emitting element, is housed in a recess formed in a substrate having an optical waveguide, and is brought into contact with a positioning contact portion formed on the inner surface of the recess. A method of manufacturing an optical waveguide module, comprising: positioning and mounting an end face exposed in the recess of the core portion of the core portion so that the light receiving / emitting portion faces each other. The positioning contact portions of the recesses of the substrate form a pair facing each other in the recesses, and are spaced apart from each other toward the other surface from the opening portion of the recess opening in one surface of the substrate. It is an inner surface formed so that the distance is gradually narrowed,
The recess is formed such that the extension of the optical axis of the optical waveguide is positioned between a pair of positioning contact portions,
The optical element is inserted between a pair of positioning contact portions and brought into contact with the pair of positioning contact portions, thereby positioning the light receiving / emitting portion with respect to the optical axis of the optical waveguide. The method of manufacturing an optical waveguide module according to claim 9.   The optical element is plate-shaped, and includes a light receiving / light emitting portion installation region in which the light receiving / light emitting portion is provided on one of the front and back surfaces, and the recess is opposed to each other from the opening. The contact surfaces formed on the side surfaces on both sides of the optical element via the light receiving / emitting portion installation region are inserted between the pair of positioning contact portions formed at the positions where the pair of positioning contacts are formed. 11. The method of manufacturing an optical waveguide module according to claim 10, wherein the receiving / emitting portion is positioned with respect to the optical axis of the optical waveguide by being brought into contact with the contact portion.   Further, the optical element is brought into contact with the recess, so that the optical element is exposed to an end surface of the core portion where the receiving / emitting optical axis of the receiving / emitting portion is exposed to the recess of the optical waveguide. 12. An inclined support contact portion is provided for supporting in an inclined direction with respect to an inclined surface that is inclined with respect to a virtual vertical plane perpendicular to the optical axis. Manufacturing method of the optical waveguide module.   The core portion of the optical waveguide that is exposed to the recess as the inclined support contact portion goes from the one surface side of the substrate where the opening of the recess opens to the other surface side. 13. The method of manufacturing an optical waveguide module according to claim 12, wherein the distance from the end surface of the optical waveguide is an inclined surface that gradually increases.   The end surface of the core portion of the optical waveguide exposed in the recess is inclined with respect to a virtual vertical surface perpendicular to the optical axis at the end surface, or to a virtual vertical surface perpendicular to the optical axis at the end surface. The method for manufacturing an optical waveguide module according to claim 9, wherein the optical waveguide module is a curved surface that bulges on a virtual inclined surface that is inclined.   After the optical element is inserted and positioned in the recess of the substrate, the electrodes provided on both surfaces of the optical element are respectively surfaces on the side where the opening of the recess of the substrate is opened. The method for manufacturing an optical waveguide module according to claim 9, wherein the optical waveguide module is connected to an electrical circuit provided in the circuit so as to be electrically conductive.   16. The method of manufacturing an optical waveguide module according to claim 15, wherein the connection between the electrode of the optical element and the electric circuit of the substrate is performed by bonding using a solder paste.

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