JP2000098156A - Optical waveguide element, end face structure for optical fiber array, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical waveguide element, an end face structure for optical fiber array and the manufacturing method capable of drastically reducing manufacturing hours and manufacturing the element at low cost. SOLUTION: In this optical waveguide element 100 in which an optical waveguide layer 104 composed of a core layer 106 and upper and lower clad layers 108a, 208b is formed on a substrate 102, an end face 110 including an incident and emitting end of an optical waveguide pattern in an optical waveguide layer 104, namely, only an end face 110 on the side of the optical waveguide layer 104 including at least the end face of the core layer 106 has an angle of 8 deg. with a plane vertical to the optical axis of the optical waveguide pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical waveguide device, an end face structure of an optical fiber array, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
For example, the document title: “Quartz-based waveguide optical coupler technology, NT
TR & D, Vol. 43, no. 11, 1994, p
p. 109-116 ". FIG.
FIG. 1 is a diagram showing an end face structure of such a conventional optical waveguide element, and here shows a state in which the optical waveguide element is connected to an optical fiber.

[0003] As shown in FIG.
Numeral 0 is configured so that the input end face and the output end face of the optical waveguide are inclined at 8 ° with respect to a plane perpendicular to the optical axis direction. Such a configuration is such that when the optical fiber 200 is connected to the optical waveguide element 300, the incident light from the optical fiber 200 to the optical waveguide element 300 or the optical fiber
This is to sufficiently obtain the attenuation (hereinafter, referred to as return loss) of the reflection component (hereinafter, referred to as reflected return light) of the light emitted to zero.

[0004] The reflected return light is generated due to a refractive index mismatch at a connection portion between the optical waveguide element 300 and the optical fiber 200. When the reflected light returns to a semiconductor laser diode (hereinafter referred to as an LD) as a light source, the operation of the LD is performed. It is known to have significant adverse effects on properties. In addition, it may cause noise due to repeated reflection in the optical waveguide. 9, 102 is a substrate, 104 is an optical waveguide layer, 106 is a core layer, 108a and 108b are upper and lower cladding layers, 112, 204, and 314 are end faces, 202 is an optical fiber array, 206 is a UV adhesive, 310 Is Lido.

[0005] For example, in order to obtain a return loss of 40 (dB) or more, a single mode optical fiber requires an end face angle of 4 ° or more in theory, and 8 ° is adopted as a general specification. Often.

[0006]

However, the optical waveguide device having the above-described conventional configuration has the following problems. 8 ° end face angle of optical waveguide element 300
In order to achieve this, the optical waveguide element 300 cut off from the wafer by means such as dicing is attached to a dedicated jig so that the end face angle is 8 ° with respect to the surface plate for polishing, and is polished. . At this time, polishing is usually performed in at least two stages. That is, polishing for setting the end face angle to 8 ° (hereinafter, referred to as primary polishing) and polishing for obtaining desired surface roughness (hereinafter, referred to as secondary polishing).

In the former primary polishing, for example, in order to make the entire end face of the optical waveguide element having a thickness of about 1 mm 8 °, it is necessary to grind about 0.14 mm at the portion to be cut most. Although it depends on the polishing conditions, it is generally necessary to perform low-pressure polishing in order not to damage the optical waveguide element. Therefore, the time required for the primary polishing is long, and the time required for manufacturing the optical waveguide element at low cost is high. Was hindered.

The present invention provides an optical waveguide device, an end face structure of an optical fiber array, and a method of manufacturing the same, which can eliminate the above-mentioned problems, greatly reduce the manufacturing time, and can manufacture the optical waveguide device at low cost. The purpose is to do.

[0009]

According to the present invention, there is provided an optical waveguide device having an optical waveguide layer comprising a core layer and a cladding layer formed on a substrate. The end face including the input / output end of the optical waveguide pattern in the above, so that only the end face on the optical waveguide layer side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern. It was made.

[2] In an optical waveguide device in which an optical waveguide layer comprising a core layer and a cladding layer and a lid are formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is at least as described above. Only the end face on the optical waveguide layer side or the substrate side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern.

[3] In an optical fiber array in which an optical fiber is sandwiched and fixed between at least two substrates, an end surface including an input / output end of the optical fiber is any one of the substrates including an end surface of the optical fiber. Only one of the end faces has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber. [4] In the optical waveguide device according to the above [1], after forming the end face at the specific angle, a lid having the same angle as the specific angle is mounted on the optical waveguide device.

[5] In the optical waveguide device according to the above [1] or [2], after forming the end face at the specific angle,
A block having the same angle as the specific angle is attached to a surface perpendicular to the optical axis of the optical waveguide element. [6] In the optical fiber array according to the above [3], after forming the end face at the specific angle, a block having the same angle as the specific angle is placed on a surface perpendicular to the optical axis of the optical fiber. It is designed to be attached.

[7] In the method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, at least an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer has at least one end face. Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is formed by polishing. It is.

[8] In the method for manufacturing an optical waveguide element in which an optical waveguide layer comprising a core layer and a clad layer and a lid are formed on a substrate, an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is polished. It is to be formed.

[0015]

[9] In the method for manufacturing an optical fiber array in which the optical fiber is sandwiched and fixed between at least two substrates, the end face including the input / output end of the optical fiber is any one of the substrates including the end face of the optical fiber. Only one of the end faces has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber, and the end face having this specific angle is formed by polishing.

[10] In the method for manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a cladding layer is formed on a substrate, at least an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is provided. Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is formed by cutting. It is.

[11] In a method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is Only the end face of the optical waveguide layer including the end face of the core layer or the end face on the substrate side has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face having the specific angle is cut by cutting. It is to be formed.

[12] In the method for manufacturing an optical fiber array in which an optical fiber is sandwiched and fixed between at least two substrates, an end face including an input / output end of the optical fiber includes at least an end face of the optical fiber. Only one end face of the substrate has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber, and the end face having this specific angle is formed by cutting.

[13] In the method for manufacturing an optical waveguide element in which an optical waveguide layer including a core layer and a cladding layer is formed on a substrate, at least an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is in a wafer state before cutting, A groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern up to a depth at which the end face of the core layer is exposed, and at least to a depth at which the substrate is not separated, is formed on the surface of the optical waveguide element at the cut-out portion. It is formed by forming and then cutting the substrate including the substrate at a position where at least the end face of the core layer is not cut.

[14] In a method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a cladding layer and a lid are formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face having this specific angle is cut out. In the previous wafer state, on the surface of the optical waveguide element at
A groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern is formed at least to a depth at which the end face of the core layer is exposed, and to a depth at which the substrate is not separated. It is formed by cutting including the substrate at a position where the end face is not cut.

[15] In the method for manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, at least an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has at least Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is in a wafer state before cutting, A groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern up to a depth at which the end face of the core layer is exposed, and at least to a depth at which the substrate is not separated, is formed on the surface of the optical waveguide element at the cut-out portion. Formed, and then the remaining portion is broken.

[16] In the method for manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a cladding layer and a lid are formed on a substrate, an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face having this specific angle is cut out. In the previous wafer state, on the surface of the optical waveguide element at
Form a groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern to at least a depth at which the end face of the core layer is exposed, and to a depth at which the substrate is not separated, and then break the remaining portion It is formed by performing.

[17] In the method for manufacturing an optical waveguide element in which an optical waveguide layer including a core layer and a cladding layer is formed on a substrate, at least an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer has at least one end face. Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at this specific angle is in a wafer state before cutting, The groove formed on the surface of the optical waveguide element at the cut-out portion is formed by dicing using a V-shaped blade having a tip angle twice as large as the specific angle.

[18] In the method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face having this specific angle is cut out. In the previous wafer state, the groove formed on the surface of the optical waveguide element at the cut-out portion is formed by dicing using a V-shaped blade having a tip angle twice the specific angle. .

[0025]

Embodiments of the present invention will be described below in detail. FIG. 1 is a sectional view showing an end face structure of an optical waveguide device according to a first embodiment of the present invention. As shown in this figure, an optical waveguide element 100 is formed by a flame deposition method (FH) on a substrate 102 made of silicon or quartz glass.
D) and the like, an optical waveguide layer 104 made of a quartz glass thin film is formed. The optical waveguide layer 104 includes a core layer 106 having different refractive indices and upper and lower cladding layers 108a and 108b, and an end face 110 of the optical waveguide layer 104 is aligned with an optical axis of an optical waveguide pattern (not shown) provided in the optical waveguide layer 104. On the other hand, it forms an angle of 8 ° with the end surface 112 of the substrate 102 formed vertically.

The end face 110 is attached to a dedicated jig such that the optical waveguide element 100 cut off from the wafer by means such as dicing or the like is set at an end face angle of 8 ° with respect to a surface plate for polishing. It is formed by polishing at least until the end face angle of the core layer 106 becomes 8 °. FIG. 2 is a sectional view showing a configuration in which the optical waveguide device according to the first embodiment of the present invention is connected to an optical fiber. The same parts as those in the apparatus of FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in FIG.
Is housed in a component (hereinafter, referred to as an optical fiber array 202) for fixing the optical fiber 200 in order to adhere to the optical waveguide element 100, and the angle of the end face 204 is 8 ° similarly to the optical waveguide element 100. Is formed. The optical waveguide element 100 and the optical fiber array 202
UV adhesive 20 with each optical axis aligned
6 is fixed by bonding.

As described above, according to the first embodiment, the end surface of the optical waveguide layer 104 including at least the core layer 106 can be formed without polishing so that the end surface angle becomes 8 ° over the entire end surface of the optical waveguide device 100. By polishing until the angle becomes 8 ° and setting the end face angle to 8 °, a sufficient return loss can be obtained. In the case where the thickness of the optical waveguide element 100 is 1.0 mm and the thickness of the optical waveguide layer 104 is 50 μm, since the end face of the optical waveguide element 100 is shaved in the conventional method, the portion to be shaved most is about 0.14 mm. According to the embodiment of the present invention, the end face of the optical waveguide layer 104 including at least the core layer 106 is reduced by 7 μm.
The purpose can be achieved by cutting by about m.

As a result, the manufacturing time can be greatly reduced,
An optical waveguide element can be manufactured at low cost. Next, a second embodiment of the present invention will be described. FIG. 3 is a sectional view showing an end face structure of an optical waveguide device according to a second embodiment of the present invention. FIG. 3A is a sectional view (part 1) showing an end face structure of the optical waveguide element, and FIG. FIG. 2B is a sectional view (part 2) showing an end face structure of the optical waveguide element. The same parts as those of the above-described device are denoted by the same reference numerals, and description thereof will be omitted.

First, as shown in FIG. 3A, an optical waveguide device 300 according to the second embodiment has a lid made of quartz glass, Pyrex glass, or the like provided on the optical waveguide device 100 shown in the first embodiment. 310 (also referred to as a glass block) is bonded and fixed with an adhesive (not shown). The lid 310 is attached mainly to increase the bonding area when the optical waveguide element 300 and the optical fiber array are bonded and fixed, and to reduce the thickness of the bonding layer to obtain a sufficient bonding strength. Optical waveguide layer 104 and lid 3
The end face 312 of 10 makes an angle of 8 ° with the end face 112 of the substrate 102 formed perpendicular to the optical axis of an optical waveguide pattern (not shown) provided in the optical waveguide layer 104.

The end face 312 is attached to a dedicated jig such that the optical waveguide element 300 cut off from the wafer by means such as dicing or the like is set at an end face angle of 8 ° with respect to a surface plate for polishing. The optical waveguide layer 312 including at least the core layer 106 is polished until the end face angle becomes 8 °. FIG. 3B shows that the end surface 314 of the optical waveguide layer 104 and the substrate 102 is opposite to the end surface 316 of the lid 310 by 8 °.
At an angle.

FIG. 4 is a sectional view showing a structure in which an optical waveguide device according to a second embodiment of the present invention is connected to an optical fiber.
4A is a cross-sectional view showing a configuration in which the optical waveguide device according to FIG. 3A is connected to an optical fiber, and FIG.
It is sectional drawing which shows the structure which connected the optical waveguide element by (b) with the optical fiber. First, as shown in FIG.
The optical fiber 200 is bonded to the optical waveguide device 100 and the lid 310 shown in FIG.
00 is fixed in an optical fiber array 202 for fixing the optical waveguide element 300, and the angle of the end face 204 of the optical fiber array 202 is 8 ° like the angle of the end face 312 of the optical waveguide element 300.
Is formed. The optical waveguide element 300 and the optical fiber array 202 are bonded and fixed with a UV adhesive 206 with their optical axes aligned.

Next, as shown in FIG. 4B, the optical fiber 200 is used for fixing the fiber 200 in order to bond the optical waveguide element 100 and the lid 310 shown in FIG. 3B. It is contained in the optical fiber array 202, and the angle of the end face 204 of the optical fiber array 202 is formed at 8 ° like the angle of the end face 314 of the optical waveguide element 300. Optical waveguide device 300 and optical fiber array 2
Numerals 02 are bonded and fixed with a UV adhesive 206 with their optical axes aligned.

As described above, according to the second embodiment, the lid 3
Also, in the optical waveguide element 300 to which the optical waveguide element 10 is attached, the end face angle is 8 over the entire end face of the optical waveguide element 300.
° without polishing at least the core layer 10.
By polishing until the end face angle of the optical waveguide layer 104 including 6 becomes 8 ° and setting the end face angle to 8 °, a sufficient return loss can be obtained.

In particular, the optical waveguide device 300 to which the lid 310 is attached has the same thickness as the optical waveguide device.
In the case where is attached, the plate thickness becomes as thick as about 2.0 mm. However, according to this embodiment, the depth of the portion to be cut most can be reduced by almost half compared with the conventional one, so that it is necessary for polishing. Time can also be halved compared to conventional methods.

As a result, the manufacturing time can be greatly reduced,
An optical waveguide element can be manufactured at low cost. Next, a third embodiment of the present invention will be described. FIG. 5 is a sectional view of an end face structure of an optical fiber array according to a third embodiment of the present invention. The same parts as those of the apparatus described above are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG.
In reference numeral 02, an optical fiber 200 is arranged in a V-shaped groove (not shown, generally called a V-groove) provided on the surface of a substrate 500a made of quartz glass, sandwiched between substrates 500b, and fixed by bonding. The end surface 204 of the optical fiber 200 and the substrate 500b forms an angle of 8 ° with the end surface 502 of the substrate 500a formed perpendicular to the optical axis of the optical fiber 200.

The end face 204 is formed by attaching and polishing the assembled optical fiber array 202 to a dedicated jig so that the end face angle with respect to the surface plate for polishing is 8 °. Conversely, the end surface of the optical fiber 200 and the end surface of the substrate 500a may be at an angle of 8 ° with the end surface of the substrate 500b (not shown).

With a configuration similar to that described in the first and second embodiments, the optical fiber array of the third embodiment is used to connect to an optical waveguide element (not shown). With such a configuration, in the first and second embodiments, the example in which the present invention is applied to the optical waveguide element has been described. However, the application to the optical fiber array as shown in the third embodiment is described. It is valid.

From this, in the use of connecting the optical waveguide element to the optical fiber array, the manufacturing time of each component can be shortened, so that it can be manufactured at low cost when viewed as a module in which components are combined. next,
A fourth embodiment of the present invention will be described. FIG. 6 is a sectional view of an end face structure of an optical waveguide device according to a fourth embodiment of the present invention. The same parts as those of the device described above are denoted by the same reference numerals, and their description is omitted.

As shown in this figure, an end face 112 of the substrate 102 formed perpendicular to the optical axis of an optical waveguide pattern (not shown) provided in the optical waveguide layer 104 and at least a core layer 106 are included. A lid 602 having an end surface formed at 8 ° in advance is bonded and fixed to an upper portion of the optical waveguide device 100 in which the optical waveguide layer 104 forms an angle of 8 ° by an adhesive (not shown). A lid-like block 604 having an end face 608 formed at an angle of 8 ° is fixed to the end face 112 of the substrate 102 in advance by an adhesive (not shown).

The lid 602 and the block 604 are:
After the optical waveguide element 100 is formed with its 8 ° end face, the respective end faces 606 and 608 are arranged so as to be substantially flush with the end face 110 of the optical waveguide element 100. With such a configuration, the optical waveguide device of the fourth embodiment is used by being connected to an optical fiber array (not shown) with the same configuration as that described in the first and second embodiments.

According to this embodiment, the objective of the optical waveguide device 100 of the first embodiment can be achieved by an extremely small amount of polishing, but is connected to an optical fiber array having an end face of 8 °. In this case, there is a considerable portion where the thickness of the adhesive layer is large, and there is a concern that the adhesive strength is reduced in this portion. On the other hand, the optical waveguide device of the second embodiment has a disadvantage in that the polishing time is longer than that of the optical waveguide device of the first embodiment.

The optical waveguide device according to the fourth embodiment includes an optical waveguide layer 10 including at least the core 106 of the optical waveguide device 100.
Since the lid 602 and the block 604 are attached after the end face 110 of 4 is formed so as to have an angle of 8 °, both the short polishing time and sufficient adhesive strength can be satisfied. Next, a fifth embodiment of the present invention will be described.

FIG. 7 is an explanatory view of a method of manufacturing an end face structure of an optical waveguide device according to a fifth embodiment of the present invention. Hereinafter, description will be made in the order of steps. (1) First, as shown in FIG. 7A, at least a depth at which an end face of the core layer 106 is exposed at a position to be a cut position with respect to the optical waveguide element 100 before being cut and separated from the wafer. And a V-shaped blade 70 having a tip angle of 16 ° to a depth at which the substrate 102 is not separated.
The groove 700 is formed by dicing using No. 1.

(2) Subsequently, the grooves 700 are formed by dicing using an ordinary flat disk-shaped blade (not shown).
As shown in FIG. 7B, the same portion as the portion where is formed is cut including the substrate 102 at least so as not to cut the core layer 106 further. In the first to fourth embodiments, the case where the entire 8 ° end face is formed by polishing has been described. However, according to the fifth embodiment, the 8 ° end face may already be obtained in the step of cutting out the optical waveguide element from the wafer. Therefore, the manufacturing time can be further reduced.

Next, a sixth embodiment of the present invention will be described. FIG. 8 is an explanatory view of a method of manufacturing an end face structure of an optical waveguide device according to a sixth embodiment of the present invention. Hereinafter, description will be made in the order of steps. (1) First, as shown in FIG. 8A, the optical waveguide element 100 before being cut and separated from the wafer is at least at a depth where the end face of the core layer 106 is exposed at a position to be cut. And a V-shaped blade 80 having a tip angle of 16 ° to a depth at which the substrate 102 is not separated.
By dicing using No. 1, a V-shaped groove 800 is formed.

(2) Subsequently, as shown in FIG.
Each of the optical waveguide elements surrounded by the V-shaped groove 800 is bent by a machine or manually, and a stress is applied to break the substrate 102 under the V-shaped groove 800. The grooves formed by dicing are formed on the optical waveguide element or the wheel on which the blades are mounted by using a normal blade having a rectangular tip (not shown) instead of using a V-shaped blade having a tip having an angle of 16 °. An 8 ° groove may be formed in the optical waveguide element by tilting the axis with respect to a plane perpendicular to the substrate surface.

According to the sixth embodiment, according to the sixth embodiment, in addition to the effects described in the fifth embodiment, the manufacturing time can be further reduced in the step of cutting the optical waveguide element from the wafer. it can. Further, the present invention has the following utilization modes. (1) In the first to sixth embodiments of the present invention described above, the case where the end facet angle of the optical waveguide element or the optical fiber array for obtaining sufficient return loss is 8 ° is described.
The application range of the present invention is not limited to this. That is, in a broad sense, the present invention is effective even when the end face angle is all angles of 0 ° or more.

(2) In the first to sixth embodiments, the case has been described in which only the end face of either the upper surface or the lower surface including the end surface of the core layer is 8 °. Of the members on the upper surface side or the lower surface side, at least one end face is all 8 °, and the end faces of the core layer are all 8 °, and the end face of the other member that is in contact with the core layer is the end face. Some may be 8 °.

(3) In the first to fourth embodiments, the method of forming the end face at an angle of 8 ° by polishing has been described. However, the end face may be formed by cutting. (4) In the first to sixth embodiments, the case of the silica-based optical waveguide device has been described. However, the application range of the present invention is not limited to this. It is also effective for an optical waveguide device made of another material. Specifically, there are an organic optical waveguide device using an organic material, a semiconductor optical waveguide device using a semiconductor, and the like.

(5) In the fifth and sixth embodiments, the case where the groove on the surface of the optical waveguide element is formed by dicing has been described. However, the applicable range of the present invention is not limited to this, that is, in a broad sense. Is effective for any means of forming such grooves. Specifically, a broadly-defined mechanical cutting method, a dry etching method using plasma,
Sand blast method using powder and the like.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0054]

As described above, according to the present invention, the following effects can be obtained. (A) Even if the end face angle of the optical waveguide layer including at least the core layer is polished until the end face angle becomes the specific angle, the end face angle is specified without polishing the end face angle over the entire end face of the light intensity waveguide element. By setting the angle, a sufficient return loss can be obtained.

As a result, the manufacturing time can be greatly reduced,
An optical waveguide element can be manufactured at low cost. (B) Even in the optical waveguide device with the lid attached, polishing is performed until the end surface angle of at least the optical waveguide layer including the core layer reaches the specific angle without polishing the entire end surface so that the end surface angle becomes the specific angle. However, by setting the end face angle to a specific angle, a sufficient return loss can be obtained.

(C) In the use of connecting an optical waveguide element to an optical fiber array, the manufacturing time of each component can be shortened. Therefore, when viewed as a module combining components, it can be manufactured at low cost. (D) Since the lid and the block are attached after the end face of the optical waveguide layer including at least the core layer of the optical waveguide element is formed to have a specific angle, both the short polishing time and the sufficient adhesive strength are satisfied. Can be.

(E) In the step of cutting the optical waveguide element from the wafer, an end face having a specific angle can be already obtained, so that the manufacturing time can be further reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an end face structure of an optical waveguide device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a configuration in which the optical waveguide device according to the first embodiment of the present invention is connected to an optical fiber.

FIG. 3 is a sectional view showing an end face structure of an optical waveguide device according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration in which an optical waveguide device according to a second embodiment of the present invention is connected to an optical fiber.

FIG. 5 is a sectional view of an end face structure of an optical fiber array according to a third embodiment of the present invention.

FIG. 6 is a sectional view of an end face structure of an optical waveguide device according to a fourth embodiment of the present invention.

FIG. 7 is an illustration of a method of manufacturing an end face structure of an optical waveguide device according to a fifth embodiment of the present invention.

FIG. 8 is an illustration of a method of manufacturing an end face structure of an optical waveguide device according to a sixth embodiment of the present invention.

FIG. 9 is a diagram showing an end face structure of a conventional optical waveguide element.

[Explanation of symbols]

100, 300 Optical waveguide element 102, 500a, 500b Substrate 104 Optical waveguide layer 106 Core layer 108a, 108b Upper and lower cladding layers 110, 112, 204, 312, 314, 316, 5
02,606,608 end face 200 optical fiber 202 optical fiber array 206 UV adhesive 310,602 lid (glass block) 604 lid-like block 700 groove 701,801 V-shaped blade 800 V-shaped groove

Claims (18)

[Claims] In an optical waveguide device having an optical waveguide layer comprising a core layer and a cladding layer formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is:
An end face structure of an optical waveguide element, wherein at least only an end face on the optical waveguide layer side including an end face of the core layer has a specific angle with respect to a plane perpendicular to an optical axis of the optical waveguide pattern. 2. An optical waveguide device in which an optical waveguide layer comprising a core layer and a clad layer and a lid are formed on a substrate, an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer has at least the core surface. An end face structure of an optical waveguide element, wherein only an end face on the optical waveguide layer side or the substrate side including an end face of a layer has a specific angle with respect to a plane perpendicular to an optical axis of the optical waveguide pattern. 3. An optical fiber array in which an optical fiber is sandwiched and fixed between at least two substrates, wherein an end surface including an input / output end of the optical fiber is any one of the substrates including an end surface of the optical fiber. An end face structure of an optical fiber array, wherein only one end face has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber. 4. The optical waveguide device according to claim 1, wherein
An end face structure for an optical waveguide element, wherein a lid having the same angle as the specific angle is mounted on the optical waveguide element after forming the end face at the specific angle. 5. The optical waveguide device according to claim 1, wherein after forming the end face having the specific angle, a block having the same angle as the specific angle is perpendicular to an optical axis of the optical waveguide device. An end surface structure of the optical waveguide element, wherein the end surface structure is attached to a side surface. 6. The optical fiber array according to claim 3, wherein after forming the end face having the specific angle, a block having the same angle as the specific angle is perpendicular to the optical axis of the optical fiber. An end face structure of an optical fiber array, wherein the end face structure is attached to the optical fiber array. 7. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, wherein an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has at least Only the end surface on the optical waveguide layer side including the end surface of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end surface at the specific angle is formed by polishing. A method for manufacturing an end face structure of an optical waveguide device. 8. In a method for manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is formed by polishing. A method of manufacturing an end face structure of an optical waveguide device, comprising: 9. A method for manufacturing an optical fiber array in which an optical fiber is sandwiched and fixed between at least two substrates, wherein the end face including the input / output end of the optical fiber is at least the substrate including the end face of the optical fiber. Characterized in that only one of the end faces has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber, and the end face at the specific angle is formed by polishing. Method. 10. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, wherein an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has at least Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is formed by cutting. A method for manufacturing an end face structure of an optical waveguide device. 11. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, wherein an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is formed by cutting. A method of manufacturing an end face structure of an optical waveguide device, comprising: 12. A method for manufacturing an optical fiber array in which an optical fiber is sandwiched and fixed between at least two substrates, wherein the end face including the input / output end of the optical fiber is at least the substrate including the end face of the optical fiber. Characterized in that only one of the end faces has a specific angle with respect to a plane perpendicular to the optical axis of the optical fiber, and the end face at the specific angle is formed by cutting. Method. 13. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, wherein an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer has at least Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is cut out in a wafer state before cutting. A groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern is formed on the surface of the optical waveguide element at a predetermined position, at least to a depth at which the end face of the core layer is exposed, and to a depth at which the substrate is not separated. Then, at least a position where the end surface of the core layer is not cut is cut by including the substrate as well, thereby forming an end surface structure of the optical waveguide element. 14. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, wherein an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is not cut out. In the wafer state, on the surface of the optical waveguide element at the cut-out scheduled portion, at least the depth at which the end face of the core layer is exposed, and the plane perpendicular to the optical axis of the optical waveguide pattern until the substrate is separated. Forming a groove having an angle, and then cutting the groove including the substrate at a position where at least the end face of the core layer is not cut, to manufacture the optical waveguide element. Method. 15. A method for manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer is formed on a substrate, wherein an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has at least Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is cut out in a wafer state before cutting. A groove having a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern is formed on the surface of the optical waveguide element at a predetermined position, at least to a depth at which the end face of the core layer is exposed, and to a depth at which the substrate is not separated. And forming the end face structure of the optical waveguide element by breaking the remaining portion. 16. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, wherein an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is not cut out. In the wafer state, on the surface of the optical waveguide element at the cut-out scheduled portion, at least the depth at which the end face of the core layer is exposed, and the plane perpendicular to the optical axis of the optical waveguide pattern until the substrate is separated. A method of manufacturing an end face structure of an optical waveguide element, comprising forming a groove having an angle, and subsequently forming a groove having an angle. 17. A method for manufacturing an optical waveguide device having an optical waveguide layer comprising a core layer and a cladding layer formed on a substrate, wherein an end face including an input / output end of an optical waveguide pattern in the optical waveguide layer has at least Only the end face on the optical waveguide layer side including the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is cut out in a wafer state before cutting. Manufacturing an end face structure of the optical waveguide element, wherein a groove formed on a surface of the optical waveguide element at a predetermined location is formed by dicing using a V-shaped blade having a tip angle twice as large as the specific angle. Method. 18. A method of manufacturing an optical waveguide device in which an optical waveguide layer including a core layer and a clad layer and a lid are formed on a substrate, wherein an end face including an input / output end of the optical waveguide pattern in the optical waveguide layer is Only the end face on the optical waveguide layer side or the substrate side including at least the end face of the core layer has a specific angle with respect to a plane perpendicular to the optical axis of the optical waveguide pattern, and the end face at the specific angle is not cut out. In the state of the wafer, a groove formed on the surface of the optical waveguide element at the cut-out portion is formed with a V having an angle at the tip of which is twice the specific angle.
A method for manufacturing an end face structure of an optical waveguide element, wherein the method is formed by dicing using a letter-shaped blade.