JP2008521216A5 - - Google Patents

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Publication number
JP2008521216A5
JP2008521216A5 JP2007541397A JP2007541397A JP2008521216A5 JP 2008521216 A5 JP2008521216 A5 JP 2008521216A5 JP 2007541397 A JP2007541397 A JP 2007541397A JP 2007541397 A JP2007541397 A JP 2007541397A JP 2008521216 A5 JP2008521216 A5 JP 2008521216A5
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JP
Japan
Prior art keywords
semiconductor layer
semiconductor substrate
region
electronic device
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007541397A
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English (en)
Japanese (ja)
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JP5107049B2 (ja
JP2008521216A (ja
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Publication date
Priority claimed from US10/989,940 external-priority patent/US7109051B2/en
Application filed filed Critical
Publication of JP2008521216A publication Critical patent/JP2008521216A/ja
Publication of JP2008521216A5 publication Critical patent/JP2008521216A5/ja
Application granted granted Critical
Publication of JP5107049B2 publication Critical patent/JP5107049B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007541397A 2004-11-15 2005-11-14 光デバイスと電子デバイスとを集積回路に集積する方法 Expired - Fee Related JP5107049B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/989,940 2004-11-15
US10/989,940 US7109051B2 (en) 2004-11-15 2004-11-15 Method of integrating optical devices and electronic devices on an integrated circuit
PCT/US2005/041155 WO2006055476A2 (en) 2004-11-15 2005-11-14 Method of integrating optical devices and electronic devices on an integrated circuit

Publications (3)

Publication Number Publication Date
JP2008521216A JP2008521216A (ja) 2008-06-19
JP2008521216A5 true JP2008521216A5 (https=) 2008-11-27
JP5107049B2 JP5107049B2 (ja) 2012-12-26

Family

ID=36386883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007541397A Expired - Fee Related JP5107049B2 (ja) 2004-11-15 2005-11-14 光デバイスと電子デバイスとを集積回路に集積する方法

Country Status (4)

Country Link
US (1) US7109051B2 (https=)
EP (1) EP1854128A4 (https=)
JP (1) JP5107049B2 (https=)
WO (1) WO2006055476A2 (https=)

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US8139130B2 (en) 2005-07-28 2012-03-20 Omnivision Technologies, Inc. Image sensor with improved light sensitivity
US8274715B2 (en) 2005-07-28 2012-09-25 Omnivision Technologies, Inc. Processing color and panchromatic pixels
US7574090B2 (en) * 2006-05-12 2009-08-11 Toshiba America Electronic Components, Inc. Semiconductor device using buried oxide layer as optical wave guides
US7916362B2 (en) 2006-05-22 2011-03-29 Eastman Kodak Company Image sensor with improved light sensitivity
US8031258B2 (en) 2006-10-04 2011-10-04 Omnivision Technologies, Inc. Providing multiple video signals from single sensor
US7785983B2 (en) 2007-03-07 2010-08-31 Freescale Semiconductor, Inc. Semiconductor device having tiles for dual-trench integration and method therefor
US8211732B2 (en) 2008-09-11 2012-07-03 Omnivision Technologies, Inc. Image sensor with raised photosensitive elements
US8513037B2 (en) * 2010-12-03 2013-08-20 Bae Systems Information And Electronic Systems Integration Inc. Method of integrating slotted waveguide into CMOS process
US9529996B2 (en) 2011-10-11 2016-12-27 Citrix Systems, Inc. Controlling mobile device access to enterprise resources
US9280377B2 (en) 2013-03-29 2016-03-08 Citrix Systems, Inc. Application with multiple operation modes
US9599561B2 (en) 2011-10-13 2017-03-21 Affymetrix, Inc. Methods, systems and apparatuses for testing and calibrating fluorescent scanners
US8910239B2 (en) 2012-10-15 2014-12-09 Citrix Systems, Inc. Providing virtualized private network tunnels
CN104854561B (zh) 2012-10-16 2018-05-11 思杰系统有限公司 用于应用程序管理框架的应用程序封装
US9971585B2 (en) 2012-10-16 2018-05-15 Citrix Systems, Inc. Wrapping unmanaged applications on a mobile device
US9595629B2 (en) * 2012-10-22 2017-03-14 Mellanox Technologies Silicon Photonics Inc. Enhancing planarization uniformity in optical devices
KR102007258B1 (ko) * 2012-11-21 2019-08-05 삼성전자주식회사 광전 집적회로 기판의 제조방법
US9989703B2 (en) * 2012-11-30 2018-06-05 International Business Machines Corporation Semiconductor structure and method for manufacturing a semiconductor structure
US9018108B2 (en) 2013-01-25 2015-04-28 Applied Materials, Inc. Low shrinkage dielectric films
KR20140095678A (ko) * 2013-01-25 2014-08-04 삼성전자주식회사 광소자 및 전자소자를 포함하는 반도체 장치 및 그 제조 방법
US9387815B2 (en) 2013-02-28 2016-07-12 Kevin Goldstein Apparatus for collection of debris escaping around a vehicle tailgate
US9413736B2 (en) 2013-03-29 2016-08-09 Citrix Systems, Inc. Providing an enterprise application store
US10284627B2 (en) 2013-03-29 2019-05-07 Citrix Systems, Inc. Data management for an application with multiple operation modes
US9985850B2 (en) 2013-03-29 2018-05-29 Citrix Systems, Inc. Providing mobile device management functionalities
US9355223B2 (en) 2013-03-29 2016-05-31 Citrix Systems, Inc. Providing a managed browser
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KR102590996B1 (ko) * 2018-10-17 2023-10-17 삼성전자주식회사 반도체 장치
US10884192B1 (en) * 2019-12-16 2021-01-05 Hewlett Packard Enterprise Development Lp Single-etch wide-bandwidth grating couplers with individually-tuned grating sections

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