JP2008520082A - 表面上にパターン化層を有する物品 - Google Patents

表面上にパターン化層を有する物品 Download PDF

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Publication number
JP2008520082A
JP2008520082A JP2007541264A JP2007541264A JP2008520082A JP 2008520082 A JP2008520082 A JP 2008520082A JP 2007541264 A JP2007541264 A JP 2007541264A JP 2007541264 A JP2007541264 A JP 2007541264A JP 2008520082 A JP2008520082 A JP 2008520082A
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JP
Japan
Prior art keywords
substrate
region
article
microstructured surface
relatively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007541264A
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English (en)
Japanese (ja)
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JP2008520082A5 (enExample
Inventor
スティーブン コック，ロナルド
マジュムダール，ディベイシス
クリフォード，ジュニア アービン，グレン
Original Assignee
イーストマン コダック カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イーストマン コダック カンパニー filed Critical イーストマン コダック カンパニー
Publication of JP2008520082A publication Critical patent/JP2008520082A/ja
Publication of JP2008520082A5 publication Critical patent/JP2008520082A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2007541264A 2004-11-12 2005-11-07 表面上にパターン化層を有する物品 Pending JP2008520082A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/987,992 US20060105148A1 (en) 2004-11-12 2004-11-12 Article with patterned layer on surface
PCT/US2005/040275 WO2006055310A2 (en) 2004-11-12 2005-11-07 Article with patterned layer on surface

Publications (2)

Publication Number Publication Date
JP2008520082A true JP2008520082A (ja) 2008-06-12
JP2008520082A5 JP2008520082A5 (enExample) 2008-11-27

Family

ID=35892430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007541264A Pending JP2008520082A (ja) 2004-11-12 2005-11-07 表面上にパターン化層を有する物品

Country Status (4)

Country Link
US (1) US20060105148A1 (enExample)
EP (1) EP1810080A2 (enExample)
JP (1) JP2008520082A (enExample)
WO (1) WO2006055310A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219006A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd Ｅｌ素子、バックライト装置、照明装置、電子看板装置並びにディスプレイ装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060105152A1 (en) * 2004-11-12 2006-05-18 Eastman Kodak Company Flexible sheet for resistive touch screen
US7199322B2 (en) * 2004-11-12 2007-04-03 Eastman Kodak Company Variable spacer dots for touch screen
US7397466B2 (en) * 2004-11-12 2008-07-08 Eastman Kodak Company Integral spacer dots for touch screen
US7208691B2 (en) * 2004-11-12 2007-04-24 Eastman Kodak Company Touch screen having undercut spacer dots
US7230198B2 (en) * 2004-11-12 2007-06-12 Eastman Kodak Company Flexible sheet for resistive touch screen
US7163733B2 (en) * 2004-11-12 2007-01-16 Eastman Kodak Company Touch screen having spacer dots with channels
US7196281B2 (en) * 2004-11-12 2007-03-27 Eastman Kodak Company Resistive touch screen having conductive mesh
JP4380713B2 (ja) * 2007-03-01 2009-12-09 セイコーエプソン株式会社 液体噴射ヘッドユニットの製造方法
KR101927848B1 (ko) * 2012-09-17 2018-12-12 삼성디스플레이 주식회사 유기전계발광 표시장치 및 이의 제조 방법
KR20150022560A (ko) * 2013-08-23 2015-03-04 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조 방법
CN120456795B (zh) * 2025-07-11 2025-10-24 昆山协鑫光电材料有限公司 一种图案化钙钛矿电池组件及其制备方法与装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294878A (ja) * 2003-03-27 2004-10-21 Seiko Epson Corp 微細構造物の製造方法、デバイス、光学素子、集積回路及び電子機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
WO1997007429A1 (en) * 1995-08-18 1997-02-27 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US6413587B1 (en) * 1999-03-02 2002-07-02 International Business Machines Corporation Method for forming polymer brush pattern on a substrate surface
DE10001135A1 (de) * 2000-01-13 2001-07-19 Inst Neue Mat Gemein Gmbh Verfahren zur Herstellung eines mikrostrukturierten Oberflächenreliefs durch Prägen thixotroper Schichten
US6641767B2 (en) * 2000-03-10 2003-11-04 3M Innovative Properties Company Methods for replication, replicated articles, and replication tools
US20020084290A1 (en) * 2000-11-10 2002-07-04 Therics, Inc. Method and apparatus for dispensing small volume of liquid, such as with a weting-resistant nozzle
DE10229118A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Verfahren zur kostengünstigen Strukturierung von leitfähigen Polymeren mittels Definition von hydrophilen und hydrophoben Bereichen
US20040156988A1 (en) * 2002-08-26 2004-08-12 Mehenti Neville Z. Selective and alignment-free molecular patterning of surfaces
US20060105152A1 (en) * 2004-11-12 2006-05-18 Eastman Kodak Company Flexible sheet for resistive touch screen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004294878A (ja) * 2003-03-27 2004-10-21 Seiko Epson Corp 微細構造物の製造方法、デバイス、光学素子、集積回路及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219006A (ja) * 2009-03-19 2010-09-30 Toppan Printing Co Ltd Ｅｌ素子、バックライト装置、照明装置、電子看板装置並びにディスプレイ装置

Also Published As

Publication number Publication date
EP1810080A2 (en) 2007-07-25
US20060105148A1 (en) 2006-05-18
WO2006055310A2 (en) 2006-05-26
WO2006055310A3 (en) 2006-08-10

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