JP2008516447A - 利用可能なメトロロジーキャパシティに基づいてメトロロジーサンプリングを動的に調整する方法およびシステム - Google Patents

利用可能なメトロロジーキャパシティに基づいてメトロロジーサンプリングを動的に調整する方法およびシステム Download PDF

Info

Publication number
JP2008516447A
JP2008516447A JP2007535669A JP2007535669A JP2008516447A JP 2008516447 A JP2008516447 A JP 2008516447A JP 2007535669 A JP2007535669 A JP 2007535669A JP 2007535669 A JP2007535669 A JP 2007535669A JP 2008516447 A JP2008516447 A JP 2008516447A
Authority
JP
Japan
Prior art keywords
metrology
available
sampling rate
tools
capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007535669A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008516447A5 (enExample
Inventor
エイ． パーディ マシュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2008516447A publication Critical patent/JP2008516447A/ja
Publication of JP2008516447A5 publication Critical patent/JP2008516447A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2007535669A 2004-10-05 2005-06-23 利用可能なメトロロジーキャパシティに基づいてメトロロジーサンプリングを動的に調整する方法およびシステム Pending JP2008516447A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/958,891 US7076321B2 (en) 2004-10-05 2004-10-05 Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
PCT/US2005/022424 WO2006041543A1 (en) 2004-10-05 2005-06-23 Method and system for dynamically adjusting metrology sampling based upon available metrology capacity

Publications (2)

Publication Number Publication Date
JP2008516447A true JP2008516447A (ja) 2008-05-15
JP2008516447A5 JP2008516447A5 (enExample) 2008-08-14

Family

ID=34979412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007535669A Pending JP2008516447A (ja) 2004-10-05 2005-06-23 利用可能なメトロロジーキャパシティに基づいてメトロロジーサンプリングを動的に調整する方法およびシステム

Country Status (8)

Country Link
US (1) US7076321B2 (enExample)
JP (1) JP2008516447A (enExample)
KR (1) KR20070061868A (enExample)
CN (1) CN101032013B (enExample)
DE (1) DE112005002474B4 (enExample)
GB (1) GB2434882B (enExample)
TW (1) TWI369749B (enExample)
WO (1) WO2006041543A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017053150A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Method and system for process control with flexible sampling
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US7305320B2 (en) * 2006-02-15 2007-12-04 International Business Machines Corporation Metrology tool recipe validator using best known methods
US7257502B1 (en) * 2006-02-28 2007-08-14 Advanced Micro Devices, Inc. Determining metrology sampling decisions based on fabrication simulation
DE102008023906B4 (de) 2008-03-31 2021-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. Verfahren und System zum automatischen Erzeugen von Durchsatzmodellen für Halbleiteranlagen
US8170704B2 (en) 2008-03-31 2012-05-01 Globalfoundries Inc. Method and system for automatic generation of throughput models for semiconductor tools
US8559001B2 (en) * 2010-01-11 2013-10-15 Kla-Tencor Corporation Inspection guided overlay metrology
US9228943B2 (en) 2011-10-27 2016-01-05 Kla-Tencor Corporation Dynamically adjustable semiconductor metrology system
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
DE102012200066B4 (de) * 2012-01-03 2020-09-03 Endress + Hauser Process Solutions Ag Verfahren und Einrichtung zur Visualisierung von Informationen in einer Prozessanlage
US9816370B2 (en) * 2012-09-19 2017-11-14 Honeywell International Inc. System and method for optimizing an operation of a sensor used with wellbore equipment
CN102945030B (zh) * 2012-11-02 2015-04-01 上海华力微电子有限公司 一种有效控制晶圆生产过程中生产周期失控的方法
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
TWI539298B (zh) * 2015-05-27 2016-06-21 國立成功大學 具取樣率決定機制的量測抽樣方法 與其電腦程式產品
US10884342B2 (en) 2015-11-11 2021-01-05 Asml Netherlands B.V. Method and apparatus for predicting performance of a metrology system
CN108931336A (zh) * 2017-05-23 2018-12-04 北京航天计量测试技术研究所 一种高稳定性压力控制算法
KR101995112B1 (ko) * 2017-06-14 2019-09-30 에스케이 주식회사 장비신뢰지수에 기초한 Lot 리스크 스코어 기반의 동적 Lot 계측 제어방법 및 시스템
CN115083936B (zh) * 2021-03-10 2025-01-10 长鑫存储技术有限公司 采样量测方法、系统、计算机设备及存储介质
US12000882B2 (en) 2021-03-10 2024-06-04 Changxin Memory Technologies, Inc. Sampling measurement method, system, computer device and storage medium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004535666A (ja) * 2001-04-26 2004-11-25 サーマ‐ウェイブ・インク 計測システムクラスター

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5425839A (en) * 1992-05-14 1995-06-20 Texas Instruments Incorporated Method for rapidly etching material on a semiconductor device
US5770098A (en) * 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
US5586039A (en) * 1993-03-29 1996-12-17 Texas Instruments Incorporated Computer-aided manufacturing support method and system for specifying relationships and dependencies between process type components
US5402367A (en) * 1993-07-19 1995-03-28 Texas Instruments, Incorporated Apparatus and method for model based process control
US5526293A (en) * 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5657252A (en) * 1995-09-29 1997-08-12 Motorola, Inc. Dynamically configurable equipment integration architecture
JP3699776B2 (ja) * 1996-04-02 2005-09-28 株式会社日立製作所 電子部品の製造方法
US5822218A (en) * 1996-08-27 1998-10-13 Clemson University Systems, methods and computer program products for prediction of defect-related failures in integrated circuits
US5982920A (en) * 1997-01-08 1999-11-09 Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory Automated defect spatial signature analysis for semiconductor manufacturing process
US5896294A (en) * 1997-03-11 1999-04-20 Advanced Micro Devices, Inc. Method and apparatus for inspecting manufactured products for defects in response to in-situ monitoring
US5999003A (en) * 1997-12-12 1999-12-07 Advanced Micro Devices, Inc. Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
JP3055516B2 (ja) * 1997-12-25 2000-06-26 日本電気株式会社 半導体集積回路の検査解析装置及びその方法並びにその制御プログラムを記録した記録媒体
US6403385B1 (en) * 1998-01-27 2002-06-11 Advanced Micro Devices, Inc. Method of inspecting a semiconductor wafer for defects
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
IL125337A0 (en) * 1998-07-14 1999-03-12 Nova Measuring Instr Ltd Method and apparatus for lithography monitoring and process control
US6136712A (en) * 1998-09-30 2000-10-24 Lam Research Corporation Method and apparatus for improving accuracy of plasma etching process
US6281962B1 (en) * 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof
US6298470B1 (en) * 1999-04-15 2001-10-02 Micron Technology, Inc. Method for efficient manufacturing of integrated circuits
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US6421574B1 (en) * 1999-09-23 2002-07-16 Advanced Micro Devices, Inc. Automatic defect classification system based variable sampling plan
US6248602B1 (en) * 1999-11-01 2001-06-19 Amd, Inc. Method and apparatus for automated rework within run-to-run control semiconductor manufacturing
US6469518B1 (en) * 2000-01-07 2002-10-22 Advanced Micro Devices, Inc. Method and apparatus for determining measurement frequency based on hardware age and usage
US6477432B1 (en) * 2000-01-11 2002-11-05 Taiwan Semiconductor Manufacturing Company Statistical in-process quality control sampling based on product stability through a systematic operation system and method
US6337217B1 (en) * 2000-02-14 2002-01-08 Advanced Micro Devices, Inc. Method and apparatus for improved focus in optical processing
US6245581B1 (en) * 2000-04-19 2001-06-12 Advanced Micro Devices, Inc. Method and apparatus for control of critical dimension using feedback etch control
US6461878B1 (en) * 2000-07-12 2002-10-08 Advanced Micro Devices, Inc. Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
US6442496B1 (en) * 2000-08-08 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for dynamic sampling of a production line
JP2002076087A (ja) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp 抜き取り検査管理システム
CN1186700C (zh) * 2000-09-15 2005-01-26 先进微装置公司 半导体制造中用来改进控制的自调适取样方法
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6650955B1 (en) * 2001-12-18 2003-11-18 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on process and equipment fingerprinting
US6821792B1 (en) * 2001-12-18 2004-11-23 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on process and equipment state information
US6831555B1 (en) * 2002-03-05 2004-12-14 Advanced Micro Devices, Inc. Method and apparatus for dynamically monitoring system components in an advanced process control (APC) framework
US6687561B1 (en) * 2002-04-03 2004-02-03 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on defectivity
US7069104B2 (en) 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
US8017411B2 (en) * 2002-12-18 2011-09-13 GlobalFoundries, Inc. Dynamic adaptive sampling rate for model prediction
US6766214B1 (en) * 2003-04-03 2004-07-20 Advanced Micro Devices, Inc. Adjusting a sampling rate based on state estimation results
US6868299B2 (en) * 2003-04-15 2005-03-15 I2 Technologies Us, Inc. Generating a sampling plan for testing generated content
US6859746B1 (en) * 2003-05-01 2005-02-22 Advanced Micro Devices, Inc. Methods of using adaptive sampling techniques based upon categorization of process variations, and system for performing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004535666A (ja) * 2001-04-26 2004-11-25 サーマ‐ウェイブ・インク 計測システムクラスター

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
WO2017053150A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Method and system for process control with flexible sampling
KR20180045033A (ko) * 2015-09-21 2018-05-03 케이엘에이-텐코 코포레이션 유연적 샘플링을 이용한 공정 제어 방법 및 시스템
KR102351636B1 (ko) 2015-09-21 2022-01-13 케이엘에이 코포레이션 유연적 샘플링을 이용한 공정 제어 방법 및 시스템

Also Published As

Publication number Publication date
DE112005002474T5 (de) 2007-09-06
DE112005002474B4 (de) 2017-02-09
GB2434882A (en) 2007-08-08
CN101032013B (zh) 2011-07-06
TW200623300A (en) 2006-07-01
GB2434882B (en) 2009-01-21
KR20070061868A (ko) 2007-06-14
US20060074503A1 (en) 2006-04-06
GB0705693D0 (en) 2007-05-02
TWI369749B (en) 2012-08-01
US7076321B2 (en) 2006-07-11
WO2006041543A1 (en) 2006-04-20
CN101032013A (zh) 2007-09-05

Similar Documents

Publication Publication Date Title
JP2008516447A (ja) 利用可能なメトロロジーキャパシティに基づいてメトロロジーサンプリングを動的に調整する方法およびシステム
US6678570B1 (en) Method and apparatus for determining output characteristics using tool state data
CN100378941C (zh) 在制造过程中预测装置的电气参数的方法及系统
US7067333B1 (en) Method and apparatus for implementing competing control models
CN1643452B (zh) 用于控制光刻工艺的方法及装置
KR101165791B1 (ko) 측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치
US6687561B1 (en) Method and apparatus for determining a sampling plan based on defectivity
US6563300B1 (en) Method and apparatus for fault detection using multiple tool error signals
US7296103B1 (en) Method and system for dynamically selecting wafer lots for metrology processing
US6785586B1 (en) Method and apparatus for adaptively scheduling tool maintenance
US6732007B1 (en) Method and apparatus for implementing dynamic qualification recipes
US6937914B1 (en) Method and apparatus for controlling process target values based on manufacturing metrics
US20060058979A1 (en) Method and system for calibrating integrated metrology systems and stand-alone metrology systems that acquire wafer state data
US7321993B1 (en) Method and apparatus for fault detection classification of multiple tools based upon external data
US7020535B1 (en) Method and apparatus for providing excitation for a process controller
TWI400740B (zh) 有關未被抽樣的工件之資料表示
KR20050065663A (ko) 첫 번째-원칙 피드-포워드 제조 제어를 제공하기 위한 방법및 장치
US7069098B2 (en) Method and system for prioritizing material to clear exception conditions
US7533313B1 (en) Method and apparatus for identifying outlier data
US7783455B1 (en) Methods and systems for analyzing process equipment processing variations using sensor data
US7340318B1 (en) Method and apparatus for assessing controller performance
KR101169038B1 (ko) 예외 상황들을 해소하기 위해 재료에 우선순위를 정하기위한 방법 및 시스템

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080623

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080623

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20100421

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20100902

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120326

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120404

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121003