JP2008513978A - プラズマ強化型cvd装置及び方法 - Google Patents

プラズマ強化型cvd装置及び方法 Download PDF

Info

Publication number
JP2008513978A
JP2008513978A JP2007531149A JP2007531149A JP2008513978A JP 2008513978 A JP2008513978 A JP 2008513978A JP 2007531149 A JP2007531149 A JP 2007531149A JP 2007531149 A JP2007531149 A JP 2007531149A JP 2008513978 A JP2008513978 A JP 2008513978A
Authority
JP
Japan
Prior art keywords
substrate
processing system
substrate processing
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007531149A
Other languages
English (en)
Japanese (ja)
Inventor
エス. ケシュナー,マービン
エイチ. マックルランド,ポール
Original Assignee
オプティソーラー インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オプティソーラー インコーポレイテッド filed Critical オプティソーラー インコーポレイテッド
Publication of JP2008513978A publication Critical patent/JP2008513978A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24Deposition of silicon only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45578Elongated nozzles, tubes with holes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32541Shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
JP2007531149A 2004-09-14 2004-09-14 プラズマ強化型cvd装置及び方法 Pending JP2008513978A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2004/030275 WO2006031234A1 (en) 2004-09-14 2004-09-14 Plasma enhanced chemical vapor deposition apparatus and method

Publications (1)

Publication Number Publication Date
JP2008513978A true JP2008513978A (ja) 2008-05-01

Family

ID=34958815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007531149A Pending JP2008513978A (ja) 2004-09-14 2004-09-14 プラズマ強化型cvd装置及び方法

Country Status (6)

Country Link
EP (1) EP1799879A1 (zh)
JP (1) JP2008513978A (zh)
CN (1) CN101018887A (zh)
AU (1) AU2004323359A1 (zh)
CA (1) CA2553122A1 (zh)
WO (1) WO2006031234A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019120557A (ja) * 2017-12-28 2019-07-22 国立研究開発法人産業技術総合研究所 アッセイ装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6407694B2 (ja) * 2014-12-16 2018-10-17 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR101931692B1 (ko) * 2017-10-11 2018-12-21 주식회사 유진테크 배치식 플라즈마 기판처리장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012471A (ja) * 1998-06-25 2000-01-14 Agency Of Ind Science & Technol プラズマcvd装置並びに太陽電池およびこれを作製するプラズマcvd方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4462333A (en) * 1982-10-27 1984-07-31 Energy Conversion Devices, Inc. Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus
US4520757A (en) * 1982-10-27 1985-06-04 Energy Conversion Devices, Inc. Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus
CA2060917A1 (en) * 1991-03-12 1992-09-13 Milam Pender Plasma enhanced chemical vapor deposition device
DE4421103A1 (de) * 1994-06-16 1995-12-21 Siemens Solar Gmbh Verfahren und Vorrichtung zur plasmagestützten Abscheidung dünner Schichten
US6135053A (en) * 1997-07-16 2000-10-24 Canon Kabushiki Kaisha Apparatus for forming a deposited film by plasma chemical vapor deposition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012471A (ja) * 1998-06-25 2000-01-14 Agency Of Ind Science & Technol プラズマcvd装置並びに太陽電池およびこれを作製するプラズマcvd方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019120557A (ja) * 2017-12-28 2019-07-22 国立研究開発法人産業技術総合研究所 アッセイ装置

Also Published As

Publication number Publication date
AU2004323359A1 (en) 2006-03-23
CA2553122A1 (en) 2006-03-23
WO2006031234A1 (en) 2006-03-23
CN101018887A (zh) 2007-08-15
EP1799879A1 (en) 2007-06-27

Similar Documents

Publication Publication Date Title
US20090004363A1 (en) Plasma enhanced chemichal vapor deposition apparatus and method
US20080139003A1 (en) Barrier coating deposition for thin film devices using plasma enhanced chemical vapor deposition process
JP3991315B2 (ja) 薄膜形成装置及び方法
US20090023274A1 (en) Hybrid Chemical Vapor Deposition Process Combining Hot-Wire CVD and Plasma-Enhanced CVD
US20100024729A1 (en) Methods and apparatuses for uniform plasma generation and uniform thin film deposition
KR101523893B1 (ko) 플라스마 처리장치
US20110008550A1 (en) Atomic layer growing apparatus and thin film forming method
JP2007262541A (ja) 微結晶シリコン膜形成方法及び太陽電池
JP4625397B2 (ja) 放電電極、薄膜製造装置及び太陽電池の製造方法
JP5659225B2 (ja) プラズマ堆積ソースおよび薄膜を堆積させるための方法
US11610764B2 (en) Plasma source and method of operating the same
TW201312631A (zh) 用於線性沉積腔室中之氣體分佈與電漿應用的方法與設備
JP4273382B2 (ja) プラズマ処理装置と薄膜形成方法
JP2008513978A (ja) プラズマ強化型cvd装置及び方法
KR20070053317A (ko) 플라즈마 강화 화학 기상 성장 장치 및 방법
JP2018121082A (ja) 触媒cvd装置及び触媒cvd法
TWI585232B (zh) 線性電漿輔助化學氣相沈積設備
Gu et al. Low-temperature fabrication of silicon films by large-area microwave plasma enhanced chemical vapor deposition
CN113078081B (zh) 一种炉管机台
JP3805279B2 (ja) Cat−PECVD装置およびそれを備えた膜処理システム
JP3759075B2 (ja) Cat−PECVD法、それを用いて形成した膜、その膜を備えた薄膜デバイス、および膜処理システム
JPH0633245A (ja) Cvd装置
KR100657354B1 (ko) 상압에서 탄소나노튜브 형성 장치 및 방법
JP3986483B2 (ja) プラズマcvd装置用電極及びプラズマcvd装置
JPS58167766A (ja) 化学蒸着装置

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101028

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101109

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110405