JP2008512230A5 - - Google Patents

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Publication number
JP2008512230A5
JP2008512230A5 JP2007530452A JP2007530452A JP2008512230A5 JP 2008512230 A5 JP2008512230 A5 JP 2008512230A5 JP 2007530452 A JP2007530452 A JP 2007530452A JP 2007530452 A JP2007530452 A JP 2007530452A JP 2008512230 A5 JP2008512230 A5 JP 2008512230A5
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JP
Japan
Prior art keywords
energy
absorbing heat
energy absorbing
heat generating
generating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007530452A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008512230A (ja
Filing date
Publication date
Priority claimed from US10/849,302 external-priority patent/US20060051517A1/en
Application filed filed Critical
Publication of JP2008512230A publication Critical patent/JP2008512230A/ja
Publication of JP2008512230A5 publication Critical patent/JP2008512230A5/ja
Pending legal-status Critical Current

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JP2007530452A 2004-09-03 2005-09-01 熱的に制御される流体セルフアセンブリ法及び支持体 Pending JP2008512230A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/849,302 US20060051517A1 (en) 2004-09-03 2004-09-03 Thermally controlled fluidic self-assembly method and support
PCT/US2005/031561 WO2006029091A2 (en) 2004-09-03 2005-09-01 Thermally controlled fluidic self-assembly method and support

Publications (2)

Publication Number Publication Date
JP2008512230A JP2008512230A (ja) 2008-04-24
JP2008512230A5 true JP2008512230A5 (enExample) 2008-09-11

Family

ID=35759225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530452A Pending JP2008512230A (ja) 2004-09-03 2005-09-01 熱的に制御される流体セルフアセンブリ法及び支持体

Country Status (5)

Country Link
US (1) US20060051517A1 (enExample)
EP (1) EP1784862A2 (enExample)
JP (1) JP2008512230A (enExample)
TW (1) TW200614394A (enExample)
WO (1) WO2006029091A2 (enExample)

Families Citing this family (22)

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US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US20060202944A1 (en) 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US8711063B2 (en) * 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
CN102473598A (zh) * 2010-03-19 2012-05-23 松下电器产业株式会社 用于布置微结构的方法
CN102971873B (zh) * 2010-07-14 2016-10-26 夏普株式会社 微小物体的配置方法、排列装置、照明装置以及显示装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
TWI434895B (zh) 2012-03-28 2014-04-21 Ind Tech Res Inst 染料與光電轉換裝置
EP2839522A4 (en) * 2012-04-20 2015-12-09 Rensselaer Polytech Inst LIGHT-EMITTING DIODES AND METHOD OF PACKAGING THEREOF
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers
TWI664711B (zh) * 2016-09-15 2019-07-01 美商伊樂視有限公司 具有表面貼裝發光元件的顯示器
WO2019203404A1 (ko) * 2018-04-19 2019-10-24 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
CN111129245B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 一种led芯片、显示面板及显示面板的组装设备
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
KR102260638B1 (ko) * 2019-09-26 2021-06-04 엘지전자 주식회사 반도체 발광소자의 자가조립 장치
WO2021054550A1 (en) 2019-09-19 2021-03-25 Lg Electronics Inc. Device for self-assembling semiconductor light-emitting diodes
DE112021006224T5 (de) * 2021-01-08 2023-10-05 Lg Electronics Inc. Selbstanbringungsvorrichtung und selbstanbringungsverfahren

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US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
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US20020149107A1 (en) * 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
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US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US6460966B1 (en) * 2001-08-23 2002-10-08 Hewlett-Packard Company Thin film microheaters for assembly of inkjet printhead assemblies
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US6888178B2 (en) * 2002-01-24 2005-05-03 Massachusetts Institute Of Technology Method and system for magnetically assisted statistical assembly of wafers

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