JP2008309601A - Apparatus and method for inspecting printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting a printed board that are capable of easily and inexpensively performing electrical testing of a printed board the position of which should be determined in such a state that a plurality of inspection probes are made close to each other. <P>SOLUTION: An inspection apparatus 10 for performing electrical testing of a printed board 11 comprises: a holding device 18 for holding the printed board 11; moving devices 13, 14, 15 and 16 for moving inspection probes 21a, 21b, 21c, and 21d respectively; and a CCD camera 22 for taking images of tip parts of the inspection probes 21a etc. in such a state that the tip parts of the inspecting probes 21a etc. are positioned within an imaging-enabled area A. Then, position errors between predetermined positions a-d in the imaging-enabled area and the tip parts of the inspection probes 21a etc. are detected from the images taken by the CCD camera, and position correction values of the inspection probes 21a etc. are calculated based on the position errors. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a printed circuit board inspection apparatus and inspection method for performing electrical inspection of a printed circuit board by individually moving a plurality of inspection probes to contact a pattern on the printed circuit board.

2. Description of the Related Art Conventionally, a printed circuit board inspection apparatus that performs electrical inspection of a printed circuit board by bringing a tip of an inspection probe into contact with the printed circuit board pattern has been used. Then, in such a printed circuit board inspection apparatus, a position error of the inspection probe (an error caused by a displacement of the attachment position when the inspection probe is attached to the moving device) is obtained, and the position error is corrected. There is an inspection apparatus that positions an inspection probe (see, for example, Patent Document 1). The inspection apparatus includes a first imaging device that detects the position of the substrate pattern and a second imaging device that detects the position of the probe, and detects the position of the substrate pattern and the position of the probe individually. It is configured to determine the position of the probe.
Japanese Patent No. 3065612

  However, in the conventional printed circuit board inspection apparatus described above, it is necessary to accurately measure the absolute positions of the first imaging device that detects the position of the substrate pattern and the second imaging device that detects the position of the probe. Therefore, the operation is troublesome and the processing becomes complicated. In addition, the cost increases because two imaging devices are used.

  The present invention has been made to address the above-described problems, and its purpose is to easily and inexpensively perform electrical inspection of a printed circuit board that requires positioning a plurality of inspection probes in close proximity. It is an object of the present invention to provide a printed circuit board inspection apparatus and inspection method that can be performed.

  In order to achieve the above-described object, the configuration feature of the printed circuit board inspection apparatus according to the present invention is that the printed circuit board gripping apparatus that grips the printed circuit board and the one surface of the printed circuit board that is gripped by the printed circuit board gripping apparatus. A printed circuit board inspection device that performs electrical inspection of a printed circuit board by contacting the plurality of inspection probes with a pattern on the printed circuit board. An imaging device having an imaging field capable of imaging the tip portions of the plurality of inspection probes in a state where the plurality of inspection probes are brought close to each other and the tip portions of the plurality of inspection probes are respectively positioned within a predetermined range; A plurality of predetermined positions set in advance in the imaging field so as to respectively correspond to the tip portions of the plurality of inspection probes. Error detection for detecting position errors between a plurality of specified positions and a plurality of inspection probe tips from an image captured by the imaging device with the tip of the inspection probe positioned correspondingly. And a correction value calculation means for calculating the position correction values of the plurality of inspection probes based on the position error detected by the error detection means, and the plurality of inspection probes are brought into contact with the pattern of the printed circuit board for electrical inspection. This is because the plurality of inspection probes are moved in consideration of the position correction value calculated by the correction value calculation means.

  According to the printed circuit board inspection apparatus of the present invention, a plurality of inspection probes are provided in a state in which the distal end portions of the plurality of inspection probes are positioned at respective predetermined positions set in advance in the imaging field of view of the imaging apparatus. The tip of the probe can be imaged with one imaging device. For this reason, the position error between the tip of each inspection probe and the specified position corresponding thereto can be obtained by a simple operation. And the relative positional relationship between each front-end | tip part of a some test | inspection probe can also be correctly known from the positional relationship between the front-end | tip part of each test | inspection probe and the regulation position corresponding to it. As a result, when performing electrical inspection by bringing a plurality of inspection probes into contact with the pattern on the printed circuit board, each tip of the plurality of inspection probes does not collide with the pattern on the fine printed circuit board, It becomes possible to perform electrical inspection by accurately moving the inspection probe. Further, according to the present invention, the cost can be reduced because only one imaging device is required.

  In addition, other structural features of the printed circuit board inspection apparatus according to the present invention include a printed circuit board gripping apparatus that grips the printed circuit board and a plurality of printed circuit board gripping apparatuses that are opposed to one surface of the printed circuit board. A printed circuit board inspection apparatus for performing an electrical inspection of a printed circuit board by bringing a plurality of inspection probes into contact with the pattern of the printed circuit board. With the tips of one or more inspection probes of the test probes positioned within a predetermined range on the pattern of the printed circuit board, the patterns on the printed circuit board and the tips of the one or more inspection probes are respectively An imaging device having an imaging field that can be imaged and a pattern on a printed circuit board so as to correspond to the tip of one or more inspection probes One or more specified positions and one or more specified positions in a state in which the tip portions of one or more inspection probes are positioned so as to correspond to one or more specified positions set in advance within a predetermined range. An error detection unit that detects a position error between the tip of the inspection probe from the image captured by the imaging device, and a plurality of predetermined positions on the printed circuit board pattern based on the position error detected by the error detection unit Correction value calculation means for calculating the position correction value of each of the inspection probes, and the position calculated by the correction value calculation means when performing electrical inspection by bringing a plurality of inspection probes into contact with the pattern of the printed circuit board This is because a plurality of inspection probes are moved in consideration of correction values.

  According to the printed circuit board inspection apparatus according to the present invention described above, the tip of one or more inspection probes among the plurality of inspection probes is placed on the pattern of the printed circuit board so as to be within the imaging field of view of the imaging apparatus. The tip portions of one or more inspection probes can be imaged by an imaging device in a state where the imaging probe is positioned at each predetermined position set in advance. For this reason, the position error between the tip part of one or more inspection probes and the specified position corresponding thereto can be obtained by a simple operation.

  In this case, since the positional relationship between the tip of the inspection probe and the specified position of the printed circuit board corresponding thereto can be accurately detected, the positional relationship between the tip of the inspection probe and the printed circuit board, The tip of the inspection probe can be accurately positioned on the printed circuit board pattern. Further, according to the present invention, since the positional relationship between the tip portion of the inspection probe and the specified position of the printed circuit board is directly obtained, the number of tip portions of the inspection probe to be imaged at one time may be one or all May be the number. And the relative positional relationship between each front-end | tip part of a several test | inspection probe can also be correctly known from the positional relationship between the front-end | tip part of each test | inspection probe imaged and the specified position of a printed circuit board.

  Further, another structural feature of the printed circuit board inspection apparatus according to the present invention is that the positions of the tip portions of the plurality of inspection probes can be changed, and the plurality of inspection probes are respectively attached to the corresponding probe moving apparatuses. Thus, the tip portions of a plurality of inspection probes can be positioned within a predetermined range. In this case, the position of the tip of the inspection probe may be changed by changing the position in the vertical direction, changing the position in the horizontal direction, or changing both positions. According to this, by simply changing the positions of the inspection probes attached to the probe moving device so that the respective distal end portions are gathered toward one place, the distal end portions of the plurality of inspection probes are positioned within a predetermined range. Can be made.

  Further, another structural feature of the printed circuit board inspection apparatus according to the present invention is that each probe moving apparatus for moving a plurality of inspection probes is provided with a rail part having a different height, and the rail part has By attaching the support members that support the inspection probes so that they can be overlapped with each other at least partially, the tip portions of the plurality of inspection probes can be positioned within a predetermined range. There is. According to this, it is possible to prevent the probe moving devices and the inspection probes from colliding with each other or interfering with each other even if the plurality of inspection probes are positioned in a close state.

  Still another structural feature of the printed circuit board inspection apparatus according to the present invention is that the imaging apparatus can be moved by the imaging apparatus moving apparatus. According to this, it becomes possible to move the imaging device to an arbitrary place and image the tip of the inspection probe. In addition, since the imaging device is for imaging the tip portions of the plurality of inspection probes, the imaging device is disposed at the center of the plurality of inspection probes and above the tip portions of the plurality of inspection probes.

  Further, the structural feature of the printed circuit board inspection method according to the present invention is that a plurality of inspection probes are individually moved so as to face one surface of the printed circuit board, and the plurality of inspection probes are formed into a pattern on the printed circuit board. A printed circuit board inspection method for performing electrical inspection of a printed circuit board by bringing the tips into contact with each other, wherein a plurality of inspection probe tips are positioned at respective predetermined positions set in advance within a predetermined imaging field of view. A probe moving step for moving the inspection probe, an imaging step for imaging the tip portions of the plurality of inspection probes at positions where the plurality of inspection probes have moved in the probe moving step, and a plurality of inspections from the images captured in the imaging step An error detection process for detecting a position error between the tip of the probe and each specified position corresponding thereto, and the position error detected in the error detection process. A correction value calculating step for calculating position correction values of a plurality of inspection probes, and a plurality of inspection probes are moved in consideration of the position correction values calculated in the correction value calculation step so that the inspection probes are placed on the printed circuit board. And an inspection process for performing an electrical inspection in contact with the pattern.

  In the printed circuit board inspection method according to the present invention described above, the plurality of inspection probes are moved so that the distal end portions of the plurality of inspection probes are positioned at predetermined positions set in advance within a predetermined imaging field of view. An imaging step of imaging the tip portions of a plurality of inspection probes is provided. For this reason, the position error between the tip of each inspection probe and the specified position corresponding thereto can be accurately obtained by a simple operation.

  Another structural feature of the printed circuit board inspection method according to the present invention is that a plurality of inspection probes are individually moved so as to face one surface of the printed circuit board, and the plurality of inspection probes are formed into a pattern on the printed circuit board. A printed circuit board inspection method for performing an electrical inspection of a printed circuit board by bringing the printed circuit board into contact, wherein a tip of one or more inspection probes among a plurality of inspection probes is set in advance on a pattern of the printed circuit board A probe moving step of moving each of the one or more inspection probes so as to be positioned at the respective predetermined positions of the one or more predetermined positions in the imaging field of view, and at least one inspection probe in the probe moving step An imaging process for imaging the pattern on the printed circuit board and the tip of one or more inspection probes at the moved position, and an image captured in the imaging process An error detecting step for detecting a position error between one or more specified positions and the tip of one or more inspection probes corresponding thereto, and a printed circuit board based on the position error detected in the error detecting step. A correction value calculation step for calculating the position correction value of one or more inspection probes for the upper pattern, and a plurality of inspection probes are moved in consideration of the position correction value calculated in the correction value calculation step. And an inspection step of performing electrical inspection by bringing the pattern into contact with the pattern on the printed circuit board.

  According to the printed circuit board inspection method according to the present invention described above, the tip of one or more inspection probes of the plurality of inspection probes is set in advance on the printed circuit board pattern so as to be within the imaging field of view. An imaging step is provided in which each of the plurality of inspection probes is imaged by moving one or more inspection probes so as to be positioned at the respective specified positions. For this reason, the position error between the tip of one or more inspection probes and the specified position of the printed circuit board corresponding thereto can be obtained by a simple operation. In this case, not only the correction position of the tip of each inspection probe with respect to the specified position of the printed circuit board but also the positions of the tips of the plurality of inspection probes based on the positional relationship between the tip of each inspection probe and the specified position of the printed circuit board The relative positional relationship between the parts can also be accurately known.

(First embodiment)
Hereinafter, a printed circuit board inspection apparatus and inspection method according to a first embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a state in which the inspection apparatus 10 according to the embodiment is viewed from above, and FIG. 3 shows an outline thereof. This inspection apparatus 10 is an apparatus for inspecting whether or not an electrode pattern (not shown) provided on the printed circuit board 11 is properly conducted, and a base 12 and a book supported by the base 12 Four moving devices 13 to 16 as probe moving devices of the invention, a moving device 17 as an imaging device moving device of the present invention supported by a base 12, and a grip installed below the moving devices 13 to 17 The apparatus 18 (refer FIG. 4) is provided.

  The moving device 13 is provided with an inspection probe 21a, the moving device 14 is provided with an inspection probe 21b, the moving device 15 is provided with an inspection probe 21c, and the moving device 16 is provided with an inspection probe 21d. A CCD camera 22 as an apparatus is provided. The base 12 is composed of a frame-shaped base, and rail-like front X-axis guides 23 are provided on the front end edge side portion on the upper surface on the left and right sides along the front end edge, and the rear end edge side portion is provided on the edge portion. Rail-shaped rear X-axis guides 24a, 24b, and 24c extending in the left-right direction are provided in parallel in the front-rear direction.

  The rear X-axis guides 24a, 24b, and 24c form rail portions having different heights according to the present invention. The moving devices 13 and 14 follow the front X-axis guide 23 and the rear X-axis guide 24a in a state where the front end is supported by the front X-axis guide 23 and the rear end is supported by the rear X-axis guide 24a. The moving devices 15 and 16 can move to the left and right, and the front X-axis guide 23 has the front end supported by the front X-axis guide 23 and the rear end supported by the rear X-axis guide 24b. And can be moved left and right along the rear X-axis guide 24b. The moving device 17 follows the front X-axis guide 23 and the rear X-axis guide 24c in a state where the front end is supported by the front X-axis guide 23 and the rear end is supported by the rear X-axis guide 24c. Can be moved left and right.

  Further, as shown in FIG. 5, the rear X-axis guides 24a, 24b, and 24c are separated from the rear X-axis guide 24a so that the position of the rear X-axis guide 24a is low and the position of the rear X-axis guide 24c is high. It becomes higher in order toward the rear X-axis guide 24c. The front end portions of the moving devices 15 and 16 are higher than the front end portions of the moving devices 13 and 14, and the front end portion of the moving device 17 is higher than the front end portions of the moving devices 13 and 14. For this reason, the positions of the moving devices 15 and 16 are higher than the positions of the moving devices 13 and 14, and the position of the moving device 17 is further higher than the moving devices 15 and 16.

  Further, since the rear end portions of the moving devices 13 and 14 are moved along the rear X-axis guide 24a, they cannot overlap each other, and the rear end portions of the moving devices 15 and 16 are respectively set along the rear X-axis guide 24b. Since they move, they cannot overlap each other, but a part of each of the rear side portions of the moving device 13 and the moving device 15, the moving device 14 and the moving device 16, and the moving devices 15, 16 and the moving device 17 can overlap. . Accordingly, the moving devices 13 to 17 can be dispersed to the left and right as shown in FIG. 1 or approached around the moving device 17 as shown in FIG. 2 without changing the order of the left and right directions. .

  The movement of the moving devices 13 to 17 in this case is performed by the operation of the driving devices 25 to 29 connected to the respective moving devices 13 to 17. The driving devices 25 to 29 rotate on the front side of the rear X-axis guide 24a and the like, and rotate the rotation driving shafts 25a to 29a extending in parallel to the rear X-axis guide 24a and the left and right, respectively, and the rotation driving shafts 25a to 29a. The motors 25b to 29b are driven. That is, the drive devices 25 and 27 extend from the left end portion of the base 12 toward the right side, and rotate the rotation drive shafts 25a and 27a in the direction around the axis by the rotation of the motors 25b and 27b. Moreover, the moving devices 13 and 15 are screwed to the corresponding rotation drive shafts 25a and 27a, respectively. For this reason, the moving devices 13 and 15 move to the left and right between the left end side portion of the base 12 and the central portion by the rotation of the rotation drive shafts 25a and 27a.

  The driving devices 26, 28, and 29 extend from the right end of the base 12 toward the left side, and rotate the rotation driving shafts 26a, 28a, and 29a in the direction around the axis by the rotation of the motors 26b, 28b, and 29b. The moving devices 14, 16, and 17 are screwed into the corresponding rotational drive shafts 26 a, 28 a, and 29 a, and the moving devices 14, 16 are moved to the right end of the base 12 by the rotation of the rotational drive shafts 26 a, 28 a. Move side to side from side to center. Further, the moving device 17 moves left and right between the central portions of the base 12 by the rotation of the rotation drive shaft 29a.

  The moving devices 13 and 14 are formed symmetrically, and are supported by the rear X-axis guide 24a and supported by the driving devices 25 and 26, respectively, and forward from each of the supporting tables 13a and 14a. The front end portion includes rail portions 13 b and 14 b supported by the front X-axis guide 23. The inspection probe 21a is attached to the rail portion 13b so as to be movable in the front-rear direction via the moving member 13c, and the inspection probe 21b is attached to the rail in a state movable in the front-rear direction via the moving member 14c. It is attached to the part 14b.

  The rail parts 13b and 14b are provided with Y-axis guides (not shown) each consisting of a rotary shaft part, and motors 13d and 14d for rotating and driving both Y-axis guides, respectively. The probe 21a moves in the front-rear direction along the rail portion 13b together with the moving member 13c, and the inspection probe 21b moves in the front-rear direction along the rail portion 14b together with the moving member 14c by the operation of the motor 14d. Similarly, the moving devices 15 and 16 are formed symmetrically, and are supported by the rear X-axis guide 24b and are connected to the driving devices 27 and 28, respectively, and the supporting tables 15a and 16a. The front end portion extends forward from 16 a and has rail portions 15 b and 16 b supported by the front X-axis guide 23.

  The inspection probe 21c is attached to the rail portion 15b so as to be movable in the front-rear direction via the moving member 15c, and the inspection probe 21d is attached to the rail in a state movable in the front-rear direction via the moving member 16c. It is attached to the part 16b. The rail portions 15b and 16b are provided with Y-axis guides (not shown) each composed of a rotating shaft portion, and motors 15d and 16d for rotating and driving both Y-axis guides, respectively. The inspection probe 21c moves in the front-rear direction along the rail portion 15b together with the moving member 15c, and the inspection probe 21d moves in the front-rear direction along the rail portion 16b together with the moving member 16c by the operation of the motor 16d. In addition, the support member of this invention is comprised by each combination of each support stand 13a, 14a, 15a, 16a and each rail part 13b, 14b, 15b, 16b.

  In addition, the moving device 17 is supported by the rear X-axis guide 24c and connected to the driving device 29. The moving device 17 extends forward from the support table 17a and has a front end supported by the front X-axis guide 23. Rail portion 17b. The CCD camera 22 is attached to the rail portion 17b so as to be movable in the front-rear direction via the moving member 17c. A rail 17b is provided with a Y-axis guide (not shown) formed of a rotating shaft and a motor 17d for rotating the Y-axis guide. The CCD camera 22 is moved together with the moving member 17c by the operation of the motor 17d. It moves in the front-rear direction along the portion 17b.

  As shown in FIGS. 6 and 7, the inspection probe 21 a (, 21 b, 21 c, 21 d) is configured by attaching a needle-like contact 32 to the tip of a rod-like support portion 31. Then, as shown in FIG. 3, each of the inspection probes 21a, 21b, 21c, and 21d is moved through the probe driving portions 33a, 33b, 33c, and 33d that are rotatable about the axis. 14c, 15c, 16c. Further, as shown in FIGS. 8 and 9, the probe drive unit 33a (, 33b, 33c, 33d) is formed in a substantially L-shaped bar shape in plan view, and the moving member 13c (, 14c, 15c, 16c), and a support part for supporting the inspection probe 21a (, 21b, 21c, 21d) provided at the tip of the connection part 34 so as to be substantially orthogonal to the connection part 34. 35.

  An inclined surface that is inclined toward the connecting portion 34 is formed at a tip portion of the support portion 35 that extends in a direction substantially orthogonal to the connecting portion 34, and a cylindrical attachment having a short axial length is formed on the inclined surface. A portion 36 is provided. Each of the inspection probes 21a, 21b, 21c, and 21d is attached to a corresponding attachment portion 36 such as a probe driving portion 33a so as to be rotatable in the direction around the axis of the attachment portion 36. The attachment portion 36 is rotated by the operation of a driving device (not shown). By this rotation, the contact 32 of the inspection probes 21a, 21b, 21c, 21d is perpendicular to the X axis and the Y axis. Can be moved in the direction of the Z-axis.

  Further, bendable wiring cases 37a, 37b, 37c, 37d, and 37e are spanned between the front side end portions of the support bases 13a to 17a and the corresponding moving members 13c to 17c in the moving devices 13 to 17, respectively. Has been. Each of the wiring cases 37a and the like is configured by connecting a rectangular frame in a tubular shape, and various types for connecting each inspection probe 21a and the CCD camera 22 to a control device (not shown). The wiring is accommodated. As a result, when the inspection probes 21a and the CCD cameras 22 move along the rails 13b and the like, the wiring is prevented from being twisted, and the inspection probes 21a and the CCD cameras 22 move smoothly. it can.

  The gripping device 18 is disposed on the upper surface of the base 12 and, as shown in FIG. 4, a pair of fixed rail portions 41 a and 41 b extending in the left-right direction and spaced in the front-rear direction, and the front-rear direction And a pair of moving rail portions 42a, 42b that extend over the fixed rail portions 41a, 41b and are movable in the left-right direction along the fixed rail portions 41a, 41b. A fixed grip portion 43 is provided at the center of the fixed rail portion 41a so as to protrude toward the fixed rail portion 41b. A movable grip portion 44 is provided at the center of the fixed rail portion 41b. It protrudes toward

  Further, a fixed grip 45 is provided on the side of the moving rail portion 42b side of the front end side (fixed rail portion 41a side) of the moving rail portion 42a so as to protrude toward the fixed rail portion 41b. On the side of the moving rail portion 42b side in the rear end side (fixed rail portion 41b side) portion of the moving rail portion 42a, a moving grip portion 46 is provided so as to protrude toward the fixed rail portion 41a. Furthermore, a fixed grip portion 47 is provided on the side of the front end side portion of the moving rail portion 42b on the side of the moving rail portion 42a so as to protrude toward the fixed rail portion 41b, and the rear end of the moving rail portion 42b. On the side portion of the side portion on the side of the moving rail portion 42a, a moving grip portion 48 is provided so as to protrude toward the fixed rail portion 41a.

  The fixed gripping portions 43, 45, 47 and the distal ends of the movable gripping portions 44, 46, 48 are each a gripping portion formed of a pair of upper and lower claw portions formed so as to be able to grip and fix the edge of the printed circuit board 11 43a, 45a, 47a and gripping portions 44a, 46a, 48a. Actuators 43b, 45b, 47b and actuators 44b, 46b, 48b for separating and bringing the pair of claws apart from the proximal end sides of the gripping portions 43a, 45a, 47a and the gripping portions 44a, 46a, 48a are provided. It has been. Further, the moving rail portions 42a and 42b are moved by hand or operated by a driving device (not shown) so as to widen or narrow each other along the fixed rail portions 41a and 41b. The distance can be adjusted according to the length of the printed board 11 in the left-right direction.

  The movable gripping portion 44 can be moved in the front-rear direction by moving it by hand or operating a driving device provided with the drive shaft 44c, and can widen or narrow the interval with the fixed gripping portion 43. Further, the movable gripping portions 46 and 48 are moved in the front-rear direction along the moving rail portions 42a and 42b by moving the gripping portions 46 and 48 by hand or operating a driving device provided with the driving shafts 46c and 48c, respectively. The space | interval with the fixed holding | grip parts 45 and 47 can be expanded or narrowed. The movable grips 44, 46, and 48 are moved according to the length of the printed board 11 in the front-rear direction to adjust the distance from the fixed grips 43, 45, and 47.

  As described above, the printed circuit board 11 is supported in a tensioned state by adjusting the distance between the moving rail portions 42a and 42b and the distance between the movable gripping portions 44, 46, and 48 and the fixed gripping portions 43, 45, and 47. can do. Although not shown, the inspection device 10 controls the operation of each device provided in the inspection device 10 based on a storage device that stores programs and data to be described later, and programs and data stored in the storage device. And a control device for performing the arithmetic processing and an operation panel for operating each device.

  In this configuration, when an electrical inspection of the printed circuit board 11 is performed using the inspection device 10, the printed circuit board 11 is first installed on the gripping device 18 and the inspection probes 21a, 21b, 21c, and 21d are attached. A process of correcting the attachment position by obtaining a position error between the position and a specified position as a reference of the attachment position is performed. When installing the printed circuit board 11, the printed circuit board 11 is fixed in a stretched state by sandwiching the four corners of the printed circuit board 11 between the fixed gripping units 45 and 47 and the movable gripping units 46 and 48. By sandwiching the center part of the front and rear edges of the printed circuit board 11 with the movable gripping part 44, the central part of the printed circuit board 11 is prevented from being bent.

  Then, a positioning process for correcting the position error of the contact 32 of each of the inspection probes 21a, 21b, 21c, and 21d to an appropriate position is performed according to the program of the flowchart shown in FIGS. . This program starts at step 100, and at step 102, moves the CCD camera 22 to move the center O (see FIG. 13) of the imageable area A of the CCD camera 22 to a predetermined position. Next, in step 104, the tip of the contact 32 of each inspection probe 21a, 21b, 21c, 21d when the coordinate of the center O of the imageable area A is (0, 0) is moved to a logical position. Perform the process.

  The logical positions in this case are set in advance, and are four points of prescribed positions a to d located around the center O of the imageable area A as shown in FIG. The predetermined positions a to d are set so that the contacts 32 of the inspection probes 21a, 21b, 21c, and 21d are as center O as possible as long as the inspection probes 21a, 21b, 21c, and 21d do not interfere with each other. It is set as a position that can be approached. For this reason, by the process of step 104, the moving devices 13-16 move to the vicinity of the moving device 17, and a part of the rear side portion of the moving devices 13-17 overlaps in a plan view.

  In addition, the inspection probes 21a, 21b, 21c, and 21d move to the vicinity of the CCD camera 22 to bring the respective contacts 32 closer to the predetermined positions a to d near the center O. In this case, the predetermined coordinates a to d are set such that the specified position a is (Xr1, Yr1), the specified position b is (Xr2, Yr2), the specified position c is (Xr3, Yr3), and the specified position d is (Xr4, Yr4). For convenience of explanation, in FIGS. 10 to 13, the contact 32 of the inspection probe 21d is the probe 1, the contact 32 of the inspection probe 21c is the probe 2, and the contact 32 of the inspection probe 21a is the probe 3. The contact 4 of the inspection probe 21b was used as the probe 4.

  Next, the program proceeds to step 106, where the probe 1 is imaged by the CCD camera 22, and the actual position (Xa1, Ya1) of the tip of the probe 1 is calculated. In step 108, the probe 2 is imaged by the CCD camera 22, and the actual position (Xa2, Ya2) of the tip of the probe 2 is calculated. In step 110, the probe 3 is imaged by the CCD camera 22, Processing for calculating the actual position (Xa3, Ya3) of the tip of the probe 3 is performed. Further, in step 112, the probe 4 is imaged by the CCD camera 22, and the actual position (Xa4, Ya4) of the tip of the probe 4 is calculated.

  In this way, when all the coordinate values of the actual positions of the tips of the probes 1 to 4 are obtained, the program proceeds to step 114 where the positioning error of the probe 1 (from the specified position a and the position of the tip of the probe 1) Processing for obtaining Xd1, Yd1) is performed. In this case, Xd1 is obtained from the difference between the X coordinate value Xa1 of the probe 1 and the X coordinate value Xr1 of the specified position a, and Yd1 is the difference between the Y coordinate value Ya1 of the probe 1 and the Y coordinate value Yr1 of the specified position a. It is obtained from the difference. Next, in step 116, processing for obtaining the positioning error (Xd2, Yd2) of the probe 2 from the specified position b and the tip position of the probe 2 is performed. In step 118, the specified position c and the tip position of the probe 3 are determined. From this, the processing for obtaining the positioning error (Xd3, Yd3) of the probe 3 is performed.

  Xd2 is the difference between the X coordinate value Xa2 of the probe 2 and the X coordinate value Xr2 of the specified position b, and Yd2 is the difference between the Y coordinate value Ya2 of the probe 2 and the Y coordinate value Yr2 of the specified position b. Xd3 is the difference between the X coordinate value Xa3 of the probe 3 and the X coordinate value Xr3 of the specified position c, and Yd3 is the difference between the Y coordinate value Ya3 of the probe 3 and the Y coordinate value Yr3 of the specified position c. . Next, in step 120, processing for obtaining a positioning error (Xd4, Yd4) of the probe 4 from the specified position d and the position of the tip of the probe 4 is performed. In this case, Xd4 is the difference between the X coordinate value Xa4 of the probe 4 and the X coordinate value Xr4 of the specified position d, and Yd4 is the difference between the Y coordinate value Ya4 of the probe 4 and the Y coordinate value Yr4 of the specified position d. Become.

  When all the positioning errors of the probes 1 to 4 are obtained in this way, the program proceeds to step 122 and a new position correction value of the probe 1 is calculated from the positioning error (Xd1, Yd1) of the probe 1 calculated in step 114. A process of calculating (Xc1, Yc1) is performed. In this case, the new Xc1 is obtained from the difference between the X coordinate value Xc1 of the current position correction value of the probe 1 and the X coordinate value Xd1 of the positioning error calculated in step 114, and the new Yc1 is obtained from the current probe 1. Is obtained from the difference between the Y coordinate value Yc1 of the position correction value and the Y coordinate value Yd1 of the positioning error calculated in step 114. Then, the calculated position correction value (Xc1, Yc1) of the new probe 1 is updated as the current position correction value of the probe 1.

  Next, in step 124, a process of calculating a new position correction value (Xc2, Yc2) of the probe 2 from the positioning error (Xd2, Yd2) of the probe 2 calculated in step 116 is performed. A process of calculating a new position correction value (Xc3, Yc3) of the probe 3 from the calculated positioning error (Xd3, Yd3) of the probe 3 is performed. The new Xc2 in step 124 is the difference between the X coordinate value Xc2 of the current position correction value of the probe 2 and the X coordinate value Xd2 of the positioning error calculated in step 116, and the new Yc2 is the current position of the probe 2. This is the difference between the Y coordinate value Yc2 of the correction value and the Y coordinate value Yd2 of the positioning error calculated in step 116.

  The new Xc3 in step 126 is the difference between the X coordinate value Xc3 of the current position correction value of the probe 3 and the X coordinate value Xd3 of the positioning error calculated in step 118, and the new Yc3 is the current probe 3 This is the difference between the Y coordinate value Yc3 of the position correction value and the Y coordinate value Yd3 of the positioning error calculated in step 118. Then, the calculated position correction value (Xc2, Yc2) of the probe 2 is updated as the current position correction value of the probe 2, and the calculated position correction value (Xc3, Yc3) of the probe 3 is updated. Update as position correction value.

  Next, in step 128, processing for calculating a new position correction value (Xc4, Yc4) of the probe 4 from the positioning error (Xd4, Yd4) of the probe 4 calculated in step 120 is performed. In this case, the new Xc4 is obtained from the difference between the X-coordinate value Xc4 of the current position correction value of the probe 4 and the X-coordinate value Xd4 of the positioning error calculated in step 120, and the new Yc4 is obtained. Is obtained from the difference between the Y coordinate value Yc4 of the position correction value and the Y coordinate value Yd4 of the positioning error calculated in step 120. Then, the calculated position correction value (Xc4, Yc4) of the new probe 4 is updated as the current position correction value of the probe 4.

  Then, the program proceeds to step 130, and each of the position correction values (Xc1, Yc1), (Xc2, Yc2), (Xc3, Yc3), (Xc4, Yc4) obtained in steps 122 to 128 is used to probe 1. 4 positioning processing is performed. As a result, the calculated positions where the actual positions of the probes 1 to 4 are corrected coincide with the specified positions a to d in the imageable area A of the CCD camera 22 corresponding thereto. The program then proceeds to step 132 and ends.

  When the inspection apparatus 10 is operated according to a program for actually performing an electrical inspection of the printed circuit board 11, each of the inspection probes 21a, 21b, 21c, and 21d has a position correction value obtained by the above-described processing. Therefore, the inspection probes 21 a, 21 b, 21 c and 21 d do not collide with each other, and the inspection probes 21 a, 21 b, 21 c are applied to the fine pattern on the printed circuit board 11 without colliding with each other. , 21d can be accurately moved for electrical inspection. In this case, the electrical probes are brought into contact with the pattern of the printed circuit board 11 while the inspection probes 21a, 21b, 21c, and 21d are moved on the printed circuit board 11 by driving the devices included in the inspection apparatus 10. .

  As described above, according to the inspection apparatus 10 and the inspection method using the inspection apparatus 10 according to the present embodiment, the tip positions of the inspection probe 21a and the like are respectively set in the imageable area A of the CCD camera 22. The tip portion of the inspection probe 21a and the like can be imaged by the CCD camera 22 in a state where it is positioned at a to d. For this reason, the position error between the tip portions of the inspection probes 21a and the like and the corresponding specified positions a to d can be obtained by simple processing.

  In addition, since the tip of each inspection probe 21a and the like is imaged with the CCD camera 22 positioned at the same position, the relative position between each inspection probe 21a and the like can be accurately detected. As a result, when the electrical inspection is performed by bringing the inspection probe 21a or the like into contact with the pattern of the printed circuit board 11, the distal ends of the inspection probes 21a, 21b, 21c, and 21d do not collide with each other on the printed circuit board 11. The electrical inspection can be performed on the fine pattern by accurately moving the inspection probes 21a, 21b, 21c, and 21d. Further, according to the present embodiment, since only one CCD camera 22 is required, the cost can be reduced.

  In the inspection apparatus 10 according to the present embodiment, the rear end portions of the moving devices 13 and 14 are supported by the lower X-axis guide 24a at a low position, and the wide rear end portions of the moving devices 15 and 16 are the rear portion X. The rear X-axis guide 24b, which is higher than the shaft guide 24a, is supported by the rear X-axis guide 24b, and the wide rear end of the moving device 17 is supported by the rear X-axis guide 24c, which is higher than the rear X-axis guide 24b. Yes. A part of each of the rear side portions of the moving device 13 and the moving device 15, the moving device 14 and the moving device 16, and the moving devices 15, 16 and the moving device 17 can be moved so as to overlap each other.

  In addition, each inspection probe 21a and the like is attached to an attachment portion 36 such as a corresponding probe drive portion 33a so as to be rotatable in the direction around the axis of the attachment portion 36, and is rotated by the operation of the drive device. The contact 32 such as the inspection probe 21a can be moved in the vertical direction. Therefore, even if the vertical positions of the moving devices 13 and the like that support the inspection probes 21a and the like are different, the vertical positions of the tips of the inspection probes 21a and the like can be aligned.

Furthermore, in the inspection apparatus 10 according to the present embodiment, not only the inspection probe 21a and the like can be moved, but also the CCD camera 22 can be moved by the moving device 17 disposed in the center of the moving devices 13-16. . Further, the moving device 17 is disposed at a position higher than the moving devices 13 to 16. Therefore, the CCD camera 22 can be moved to an arbitrary place where the contact 32 such as the inspection probe 21a can be easily imaged. Further, since the CCD camera 22 images the contact 32 such as the inspection probe 21a from above, it is easy to image.
(Second Embodiment)

  FIGS. 14 to 16 show a program for executing the inspection method according to the second embodiment of the present invention. This inspection method is performed using the inspection apparatus 10 described above. When performing an electrical inspection of the printed circuit board 11 according to the second embodiment of the present invention using the inspection apparatus 10, first, the printed circuit board 11 is installed in the gripping device 18 as in the first embodiment described above. At the same time, processing for obtaining the position error between the mounting positions of the inspection probes 21a, 21b, 21c, and 21d and the specified positions set on the printed circuit board 11 and correcting the mounting positions is performed.

  Then, the positioning process for correcting the position error of the contact 32 of each inspection probe 21a, 21b, 21c, 21d is performed according to the program of the flowchart shown in FIGS. This program is started in step 200, and in step 202, the CCD camera 22 is moved and the center O (see FIG. 17) of the imageable area A of the CCD camera 22 is set on the printed circuit board 11 in terms of logic. The process of moving to the position is performed. Next, in step 204, the tip of the contact 32 of each inspection probe 21a, 21b, 21c, 21d when the coordinate of the center 11o of the substrate pattern 11a is (0, 0) is moved to a logical position. Process.

  The logical positions are also four points of defined positions a to d set in the same manner as in the first embodiment, and the coordinates of the defined positions a to d are the coordinates of the center 11o of the substrate pattern 11a. As (0, 0), the specified position a is (Xr1, Yr1), the specified position b is (Xr2, Yr2), the specified position c is (Xr3, Yr3), and the specified position d is (Xr4, Yr4). Also in this case, the contact 32 of the inspection probe 21d is the probe 1, the contact 32 of the inspection probe 21c is the probe 2, the contact 32 of the inspection probe 21a is the probe 3, and the contact 32 of the inspection probe 21b. Was designated as probe 4.

  Next, the program sequentially proceeds to steps 206 to 212, and by executing the same processing as steps 106 to 112 in FIG. 10, the actual position (Xa1, Ya1) of the tip of the probe 1 and the actual position of the tip of the probe 2 are determined. Processing for calculating the position (Xa2, Ya2), the actual position (Xa3, Ya3) of the tip of the probe 3, and the actual position (Xa4, Ya4) of the tip of the probe 4 is performed. When the coordinate values of all the actual positions of the tips of the probes 1 to 4 are obtained in this way, the program proceeds to step 214, and the coordinates of the center O of the imageable area A of the CCD camera 22 are set to (0, 0). ) To calculate the actual position (Xp, Yp) of the center 11o of the substrate pattern 11a.

  This process is performed by imaging the substrate pattern 11a with the CCD camera 22, whereby the position error of the center 11o of the substrate pattern 11a with respect to the center O of the imageable area A is obtained. When the actual position of the tips of the probes 1 to 4 and the actual position of the center 11o of the substrate pattern 11a when the coordinates of the center O of the imageable area A are (0, 0) are obtained, the program performs a step. Proceeding to 216, a process for obtaining the positioning error (Xd1, Yd1) of the probe 1 from the specified position a, the position of the tip of the probe 1 and the position of the center 11o of the substrate pattern 11a is performed.

  In this case, Xd1 is obtained as a value obtained by subtracting the sum of the X coordinate value Xp of the substrate pattern 11a and the X coordinate value Xr1 of the specified position a from the X coordinate value Xa1 of the probe 1, and Yd1 is the Y coordinate of the probe 1. It is obtained as a value obtained by subtracting the sum of the Y coordinate value Yp of the substrate pattern 11a and the Y coordinate value Yr1 of the specified position a from the value Ya1. Similarly, in step 218, a process for obtaining the positioning error (Xd2, Yd2) of the probe 2 from the specified position b, the position of the tip of the probe 2, and the position of the substrate pattern 11a is performed. In step 220, the specified position c Then, a process for obtaining the positioning error (Xd3, Yd3) of the probe 3 from the position of the tip of the probe 3 and the position of the substrate pattern 11a is performed. Further, in step 222, a process for obtaining a positioning error (Xd4, Yd4) of the probe 4 from the specified position d, the position of the tip of the probe 4 and the position of the substrate pattern 11a is performed.

  When all the positioning errors of the probes 1 to 4 are obtained in this manner, in the following steps 224 to 232, new positioning errors (Xd1, Yd1) of the probes 1 to 4 calculated in steps 216 to 222 are calculated. A process of calculating the position correction values (Xc1, Yc1) of the probe 1 and the like and positioning the probes 1 to 4 at the corrected positions is performed. Since the processing in this case is the same as the processing in steps 122 to 130 described above, description thereof is omitted. The program then proceeds to step 234 and ends.

  When the inspection apparatus 10 is operated according to a program for actually performing an electrical inspection of the printed circuit board 11, each of the inspection probes 21a, 21b, 21c, and 21d has a position correction value obtained by the above-described processing. Therefore, the electrical inspection can be performed by accurately positioning the tip of each of the inspection probes 21a, 21b, 21c, and 21d with respect to the substrate pattern 11a of the printed circuit board 11. Also in this case, by driving each device included in the inspection apparatus 10, the inspection probes 21 a, 21 b, 21 c, and 21 d are moved on the printed circuit board 11 to bring the contact 32 into contact with the substrate pattern 11 a of the printed circuit board 11. Perform an inspection.

  As described above, according to the second embodiment of the present invention, from the positional relationship between the tip portion of the inspection probe 21a and the like and the corresponding substrate pattern 11a, the tip portion of the inspection probe 21a and the printed circuit board 11 are used. It is possible to accurately detect the positional relationship between and. And the relative positional relationship between each front-end | tip part, such as inspection probe 21a, can also be known correctly from the positional relationship between the board | substrate pattern 11a and the front-end | tip parts of each inspection probe 21a etc. which were each imaged. For this reason, the electrical inspection can be performed by accurately positioning the tip portions of the inspection probes 21a, 21b, 21c, and 21d with respect to the substrate pattern 11a of the printed circuit board 11. The other effects of the second embodiment are the same as those of the first embodiment described above.

  Further, the printed circuit board inspection apparatus and inspection method according to the present invention are not limited to the above-described embodiments, and can be implemented with appropriate modifications. For example, in the embodiment described above, the CCD camera 22 is provided in the moving device 17, but the CCD camera 22 may be provided in any of the moving devices 13 to 16 and the moving device 17 may be omitted. In each of the above-described embodiments, the inspection probes 21a, 21b, 21c, and 21d are simultaneously moved in steps 104 and 204. However, these may be moved one by one.

  Further, in each of the above-described embodiments, each inspection probe 21a attached to the attachment portion 36 such as the probe drive portion 33a is rotated in the direction around the axis by the operation of the drive device so as to move in the vertical direction. However, instead of this, it is also possible to change the position in the horizontal direction by moving the tip of each inspection probe 21a or the like by the operation of the driving device. In this case, the lengths of the inspection probes 21a and the like are set to different lengths so that the vertical positions of the tips are the same. Also, there may be provided two drive devices, a drive device for moving the probe drive unit 33a and the like in the vertical direction and a drive device for changing the position of the tip portion of the probe drive unit 33a and the like in the horizontal direction. it can.

It is the top view showing the inspection device concerning a 1st embodiment of the present invention. It is the top view which showed the state which has located each test | inspection probe of the test | inspection apparatus of FIG. 1 in the center side. It is the schematic which showed the plane of the inspection apparatus. It is the top view which showed the holding | grip apparatus. It is the side view which showed the inspection apparatus. It is the top view which showed the probe for a test | inspection. It is the side view which showed the probe for a test | inspection. It is the top view which showed the probe drive part. It is the front view which showed the probe drive part. It is the flowchart which showed steps 100-112 of the inspection method which concerns on 1st Embodiment of this invention. It is the flowchart which showed steps 114-120 of the inspection method which concerns on 1st Embodiment of this invention. It is the flowchart which showed steps 122-132 of the inspection method which concerns on 1st Embodiment of this invention. It is explanatory drawing which showed the relationship between the prescription | regulation position set to the imaging possible area | region and the position of a probe. It is the flowchart which showed steps 200-214 of the inspection method which concerns on 2nd Embodiment of this invention. It is the flowchart which showed steps 216-222 of the inspection method which concerns on 2nd Embodiment of this invention. It is the flowchart which showed steps 224-234 of the inspection method which concerns on 2nd Embodiment of this invention. It is explanatory drawing which showed the relationship between the prescription | regulation position set to the board | substrate pattern of a printed circuit board, and the position of a probe.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Inspection apparatus, 11 ... Printed circuit board, 11a ... Board pattern, 13, 14, 15, 16, 17 ... Moving device, 18 ... Grasping device, 21a, 21b, 21c, 21d ... Probe for inspection, 22 ... Camera, 23 ... Front X-axis guide, 24a, 24b, 24c ... Rear X-axis guide, 25, 26, 27, 28, 29 ... Drive device, 32 ... Contact, 33a, 33b, 33c, 33d ... Probe drive, A ... Image-capturing area, a, b, c, d ... prescribed positions.

Claims (7)

A printed circuit board gripping device that grips the printed circuit board; and a probe moving device that individually moves a plurality of inspection probes so as to oppose one surface of the printed circuit board gripped by the printed circuit board gripping device. A printed circuit board inspection apparatus that performs an electrical inspection of the printed circuit board by bringing an inspection probe into contact with the pattern of the printed circuit board,
Imaging with an imaging field of view capable of imaging the tip portions of the plurality of inspection probes in a state where the plurality of inspection probes are brought close to each other and the tip portions of the plurality of inspection probes are respectively positioned within a predetermined range. Equipment,
The tip portions of the plurality of inspection probes are positioned so as to correspond to the plurality of predetermined positions set in advance in the imaging field so as to correspond to the tip portions of the plurality of inspection probes, respectively. An error detecting means for detecting a position error between the plurality of specified positions and the tip portions of the plurality of inspection probes from an image captured by the imaging device in a state;
Correction value calculation means for calculating position correction values of the plurality of inspection probes based on the position error detected by the error detection means,
When performing the electrical inspection by bringing the plurality of inspection probes into contact with the pattern of the printed circuit board, the plurality of inspection probes are moved in consideration of the position correction value calculated by the correction value calculation means. A printed circuit board inspection apparatus. A printed circuit board gripping device that grips the printed circuit board; and a probe moving device that individually moves a plurality of inspection probes so as to oppose one surface of the printed circuit board gripped by the printed circuit board gripping device. A printed circuit board inspection apparatus that performs an electrical inspection of the printed circuit board by bringing an inspection probe into contact with the pattern of the printed circuit board,
The pattern on the printed circuit board and the one or more inspections in a state where the tip of one or more inspection probes of the plurality of inspection probes is positioned within a predetermined range on the pattern on the printed circuit board An imaging device having an imaging field of view capable of imaging the tip of each probe,
The one or more inspection points with respect to the one or more specified positions preset within a predetermined range on the pattern of the printed circuit board so as to correspond to the tip portions of the one or more inspection probes. An image in which the imaging device images a position error between the one or more defined positions and the tip of the one or more inspection probes in a state where the tip ends of the probes are positioned to correspond to each other. Error detection means for detecting from,
Correction value calculation means for calculating position correction values of the plurality of inspection probes with respect to a specified position on the pattern of the printed circuit board based on the position error detected by the error detection means;
When performing the electrical inspection by bringing the plurality of inspection probes into contact with the pattern of the printed circuit board, the plurality of inspection probes are moved in consideration of the position correction value calculated by the correction value calculation means. A printed circuit board inspection apparatus.   The positions of the tip portions of the plurality of inspection probes can be changed and the tip portions of the plurality of inspection probes are positioned within a predetermined range by attaching the plurality of inspection probes to the corresponding probe moving devices. The printed circuit board inspection apparatus according to claim 1, wherein the printed circuit board inspection apparatus can be made to operate.   Each of the probe moving devices for moving the plurality of inspection probes may be provided with a rail portion having a different height, and at least a part of the support member for supporting the inspection probe may overlap the rail portion. The printed circuit board according to any one of claims 1 to 3, wherein tip portions of the plurality of inspection probes can be positioned within a predetermined range by being movably attached in a ready state. Inspection equipment.   The printed circuit board inspection apparatus according to claim 1, wherein the imaging apparatus is movable by an imaging apparatus moving apparatus. Inspection of a printed circuit board for electrical inspection of the printed circuit board by moving a plurality of inspection probes individually against one surface of the printed circuit board and bringing the plurality of inspection probes into contact with the pattern of the printed circuit board A method,
A probe moving step of moving the plurality of inspection probes so that the tip portions of the plurality of inspection probes are positioned at respective predetermined positions set in advance within a predetermined imaging field;
An imaging step of imaging the tip portions of the plurality of inspection probes at a position where the plurality of inspection probes have moved in the probe moving step;
An error detection step of detecting a position error between the tip portions of the plurality of inspection probes and the corresponding specified positions from the images captured in the imaging step;
A correction value calculation step of calculating position correction values of the plurality of inspection probes based on the position error detected in the error detection step;
An inspection step of performing electrical inspection by moving the plurality of inspection probes in consideration of the position correction value calculated in the correction value calculation step and bringing the inspection probes into contact with the pattern on the printed circuit board. A printed circuit board inspection method. Inspection of a printed circuit board for electrical inspection of the printed circuit board by moving a plurality of inspection probes individually against one surface of the printed circuit board and bringing the plurality of inspection probes into contact with the pattern of the printed circuit board A method,
The tip of one or more inspection probes of the plurality of inspection probes is positioned at a predetermined position of one or more predetermined positions within a predetermined imaging field set in advance on the pattern of the printed circuit board. A probe moving step of moving each of the one or more inspection probes,
An imaging step of imaging each of the pattern on the printed circuit board and the tip of the one or more inspection probes at a position where the one or more inspection probes have moved in the probe moving step;
An error detection step of detecting a position error between the one or more specified positions and the corresponding tip of the one or more inspection probes from the image captured in the imaging step;
A correction value calculating step of calculating a position correction value of the one or more inspection probes with respect to the pattern on the printed circuit board based on the position error detected in the error detecting step;
An inspection step of performing electrical inspection by moving the plurality of inspection probes in consideration of the position correction value calculated in the correction value calculation step and bringing the inspection probes into contact with the pattern on the printed circuit board. A printed circuit board inspection method.

Images