JP2008303077A - Insulating protective coating material - Google Patents

Insulating protective coating material Download PDF

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JP2008303077A
JP2008303077A JP2007149023A JP2007149023A JP2008303077A JP 2008303077 A JP2008303077 A JP 2008303077A JP 2007149023 A JP2007149023 A JP 2007149023A JP 2007149023 A JP2007149023 A JP 2007149023A JP 2008303077 A JP2008303077 A JP 2008303077A
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glass material
glass
layer
insulating
filler
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Naoya Hayakawa
直也 早川
Jun Hamada
潤 濱田
Kazutoshi Nakaya
和敏 中屋
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Central Glass Co Ltd
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Central Glass Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/14Silica-free oxide glass compositions containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/14Silica-free oxide glass compositions containing boron
    • C03C3/145Silica-free oxide glass compositions containing boron containing aluminium or beryllium
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/14Silica-free oxide glass compositions containing boron
    • C03C3/15Silica-free oxide glass compositions containing boron containing rare earths
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/14Silica-free oxide glass compositions containing boron
    • C03C3/15Silica-free oxide glass compositions containing boron containing rare earths
    • C03C3/155Silica-free oxide glass compositions containing boron containing rare earths containing zirconium, titanium, tantalum or niobium

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Glass Compositions (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an insulating coating glass material and sealing glass material, from which an insulating protective coating film can be formed in the form of a single layer and the generation of bubbles caused by a reaction with an electrode can be suppressed and which are excellent in flatness and wear resistance and required in the development of electronic material substrates represented by thermal print heads. <P>SOLUTION: The insulating coating glass material and sealing glass material each contains, by weight, 0-12% SiO<SB>2</SB>, 10-32% B<SB>2</SB>O<SB>3</SB>, 22-42% ZnO, 10-30% Bi<SB>2</SB>O<SB>3</SB>, 17-40% RO(MgO+CaO+SrO+BaO), and 0-5% Al<SB>2</SB>O<SB>3</SB>, and further, may contain 0.1-4.5 wt.% filler. The insulating coating glass material and sealing glass material each has a coefficient of thermal expansion at 30-300°C of (65-90)×10<SP>-7</SP>/°C and a softening point of 500-620°C. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、サーマルプリントヘッド等に代表される電子材料基板用の絶縁性被膜材料及び封着材料に関する。   The present invention relates to an insulating coating material and a sealing material for an electronic material substrate typified by a thermal print head or the like.

感熱記録(サーマル)方式の画像記録装置は、装置の構成がシンプルで小型化・低価格化・軽量化・低消費電力化に有利であり、各種のプリンタなどを始めとして様々な記録用途に幅広く使用されている。   The thermal recording type image recording device has a simple structure and is advantageous for downsizing, price reduction, weight reduction, and power consumption. It is widely used for various recording applications including various printers. in use.

この感熱記録方式に用いられるサーマルプリントヘッドは、例えばラインヘッドであれば、抵抗発熱体を絶縁性基板上にライン状形成した発熱部と、電極とを有している。そして記録紙またはインクリボンなどを介した記録紙に発熱部を接触させ、各抵抗発熱体に記録情報を電気信号として順次入力して主走査方向の記録を行い、それとともに記録紙を走行させて副走査方向の記録を行なうことで2次元の記録画像を得ている。   If the thermal print head used in this thermal recording system is, for example, a line head, it has a heat generating part in which a resistance heating element is formed in a line on an insulating substrate, and an electrode. Then, the heating part is brought into contact with the recording paper or the recording paper via the ink ribbon, etc., and the recording information is sequentially inputted as electric signals to each resistance heating element to perform the recording in the main scanning direction, and the recording paper is run along with the recording information. A two-dimensional recorded image is obtained by performing recording in the sub-scanning direction.

サーマルヘッドにおいて、絶縁性基板上にはグレーズ層と酸化物から成る抵抗発熱体、アルミニウム(Al)などから成る電極が、各層の成膜工程を経て形成されている。このように抵抗発熱体上に形成された電極パターンにより、それら電極間の抵抗発熱体を微細に発熱させることができる。そしてそれらの上に、抵抗発熱体および電極を覆うように保護層が形成されている。   In the thermal head, a glaze layer, a resistance heating element made of an oxide, and an electrode made of aluminum (Al) are formed on an insulating substrate through a film forming process of each layer. Thus, the electrode pattern formed on the resistance heating element allows the resistance heating element between the electrodes to generate heat finely. And the protective layer is formed on them so that a resistance heating element and an electrode may be covered.

上記のような構成のサーマルプリントヘッドにおける保護層については、記録紙への高精細画像を得る目的で、保護層表面の高平滑性、すなわち表面粗度が小さいことが要求され、また記録紙との摺動に対する高い耐磨耗性が要求される。   With respect to the protective layer in the thermal print head having the above-described configuration, for the purpose of obtaining a high-definition image on the recording paper, it is required that the surface of the protective layer has a high smoothness, that is, a low surface roughness. High wear resistance against sliding is required.

従来そのような保護層として、例えばCVD法やスパッタリング法などの薄膜作製技術による保護層が使用されているが、所望の厚さの厚膜を得るためには成膜速度が遅いため層形成に長時間を要し、また成膜装置も高価で多大な製造コストがかかるという問題点があった。   Conventionally, as such a protective layer, for example, a protective layer by a thin film manufacturing technique such as a CVD method or a sputtering method is used. There is a problem that it takes a long time, and the film forming apparatus is expensive and requires a large manufacturing cost.

これに対して低コストの保護層として、印刷・焼成などの厚膜作製技術で形成されたガラスから成る保護層も多用されている。この保護層のガラス中には、耐磨耗性を高め、さらに熱伝導性も良好なものとするために、アルミナ(Al)やジルコニア(ZrO)などの微結晶粒子のフィラーを含有させている。 On the other hand, as a low-cost protective layer, a protective layer made of glass formed by a thick film manufacturing technique such as printing and baking is also frequently used. In the glass of this protective layer, a filler of microcrystalline particles such as alumina (Al 2 O 3 ) or zirconia (ZrO 2 ) is used in order to increase the wear resistance and to improve the thermal conductivity. It is included.

このようなガラスからなる保護層に関して、熱抵抗層・電極・発熱抵抗体層・保護層を絶縁物基板上に順次積層した厚膜型感熱記録ヘッドにおいて、保護層が発熱抵抗体層に面するアルミナフィラー含有ガラス層の下層と、その上層に形成したアルミナフィラー含有量がゼロないしは前記ガラス層中よりも少量である非晶質ガラス層を含む2層タイプのものが提案されている(特許文献1参照)。これにより上層の表面平滑度を小さくできる。   In a thick film type thermal recording head in which a thermal resistance layer, an electrode, a heating resistor layer, and a protection layer are sequentially laminated on an insulating substrate, the protection layer faces the heating resistor layer. A two-layer type has been proposed that includes a lower layer of an alumina filler-containing glass layer and an amorphous glass layer in which the content of alumina filler formed in the upper layer is zero or less than that in the glass layer (Patent Literature). 1). Thereby, the surface smoothness of the upper layer can be reduced.

また、絶縁基板上に抵抗発熱体と該抵抗発熱体に電力を供給する電極とを形成すると共に前記発熱抵抗体及び電極を覆うようにフィラー含有ガラスからなる保護膜を成したサーマルヘッドにおいて、前記保護膜に低比重で平均粒径の非常に小さい0.5μm以下のフィラーを含有させ、保護層表面にフィラーを突出させるものが提案されている(特許文献2参照)。   Further, in the thermal head in which a resistance heating element and an electrode for supplying power to the resistance heating element are formed on an insulating substrate and a protective film made of filler-containing glass is formed so as to cover the heating resistor and the electrode. There has been proposed a protective film containing a filler having a low specific gravity and a very small average particle diameter of 0.5 μm or less and protruding the filler on the surface of the protective layer (see Patent Document 2).

さらにまたグレーズ基板と、このグレーズ基板上に設けられた発熱体部分および導電層部分と、これらの上に形成された耐磨耗ガラス層とからなるサーマルヘッドにおいて、発熱体部分および導電層部分上に、少なくとも 300Aの厚さの酸化シリコン・アルミナなどの酸化物薄膜を介して耐磨耗ガラス層を設けることが提案されている。そして酸化物薄膜はCVD法、スパッタリング法で形成し、耐磨耗ガラスにはホウケイ酸鉛ガラス(SiO−B −PbO)に少量のアルミナや酸化カリウムを加えたものを印刷・焼成することが開示されている(特許文献3参照)。 Furthermore, in a thermal head comprising a glaze substrate, a heating element portion and a conductive layer portion provided on the glaze substrate, and an abrasion-resistant glass layer formed thereon, the heating element portion and the conductive layer portion Further, it has been proposed to provide a wear-resistant glass layer through an oxide thin film such as silicon oxide / alumina having a thickness of at least 300A. The oxide thin film is formed by CVD or sputtering, and the wear-resistant glass is printed and fired with lead borosilicate glass (SiO 2 —B 2 O 3 —PbO) plus a small amount of alumina or potassium oxide. (See Patent Document 3).

これによりガラス層と発熱抵抗体部分との密着強度を上げることができるとともに、ガラス層は発熱抵抗体部分の酸化防止膜及び不純物の発熱抵抗体部分へ拡散防止機能も有するというものである。
特開昭63−216760号公報 特許第3477194号公報 特開昭61−229570号公報
Thus, the adhesion strength between the glass layer and the heating resistor portion can be increased, and the glass layer also has a function of preventing diffusion of the antioxidant film of the heating resistor portion and the impurity heating resistor portion.
JP 63-216760 A Japanese Patent No. 3477194 JP-A-61-229570

しかしながら、上記の各公報に記載された構成によっても以下のような問題点があることが判明した。   However, it has been found that the configuration described in each of the above publications has the following problems.

すなわち上記特開昭63−216760号公報、特開昭61−229570号公報のように保護層を2層構造にする場合は、保護層表面の平滑性は良好にできるものの、保護層の作製工程が増加して材料および作製コストが増加してしまうという問題点があった。さらに、CVD法やスパッタリング法による積層も作製コストを上昇させる要因である。   That is, when the protective layer has a two-layer structure as described in JP-A-63-216760 and JP-A-61-229570, although the surface of the protective layer can be made smooth, the process for producing the protective layer As a result, the material and production cost increase. Furthermore, lamination by CVD or sputtering is another factor that increases production costs.

また、PbO系のガラスでは、耐磨耗性が低く、印刷紙の摺動に耐えることが出来ない。そのため、特許第3477194号公報のようにセラミックスフィラーを多量に含有させた複合系ガラスセラミックスを用いて、耐磨耗性を向上させようとするが、セラミックスフィラーが保護層上部に偏析して平坦性を劣化させ、印刷紙に傷が入る不具合があった。また、粒径の非常に小さなフィラーは凝集しやすく2次粒子となるために、表層で異常突起物となりやすく、かつ非常に高価でコストアップになる。   Also, PbO-based glass has low wear resistance and cannot withstand sliding of printing paper. For this reason, the composite glass ceramic containing a large amount of ceramic filler as disclosed in Japanese Patent No. 3477194 tries to improve the wear resistance, but the ceramic filler segregates on the upper part of the protective layer and is flat. There was a problem that the print paper was damaged. Further, since the filler having a very small particle diameter is easily aggregated and becomes secondary particles, the surface layer tends to be abnormal protrusions, and is very expensive and expensive.

また、アルカリ含有系のガラスを用いた場合では、被覆した電極との反応が顕著なために、反応泡が発生し、サーマルプリントヘッドの性能を劣化させるという問題点もあった。   Further, when alkali-containing glass is used, the reaction with the coated electrode is remarkable, so that reaction bubbles are generated and the performance of the thermal print head is deteriorated.

さらに軟化点の高いガラスにより電極の反応抑制を試みると、焼成温度が高温なため、電極の劣化、及び発熱体の抵抗値が大きく変化するために、構成材料に制約が生じる。   Further, when an attempt is made to suppress the reaction of the electrode with a glass having a high softening point, since the firing temperature is high, the electrode is deteriorated and the resistance value of the heating element is greatly changed, so that the constituent materials are restricted.

本発明は上記事情に鑑みて本発明者等が鋭意研究を進めた結果完成されたものであり、その目的は、ガラスから成る保護層を単層で形成したサーマルヘッドにおいて、保護層表面の平滑性を確保しつつ耐磨耗性を高め、電極との反応を抑制した保護被膜用材料を提供することにある。   The present invention has been completed as a result of diligent research conducted by the present inventors in view of the above circumstances. The purpose of the present invention is to provide a thermal head in which a protective layer made of glass is formed as a single layer. An object of the present invention is to provide a material for a protective coating that enhances the wear resistance while ensuring the properties and suppresses the reaction with the electrode.

本発明は、サーマルプリントヘッド等に代表される電子材料基板用の絶縁性被膜ガラス材料及び封着ガラス材料において、該ガラス材料の組成が、重量%でSiOを0〜12、Bを10〜32、ZnOを22〜42、Biを10〜30、RO(MgO+CaO+SrO+BaO)を17〜40、Alを0〜5含むことを特徴とする絶縁性被膜ガラス材料及び封着ガラス材料である。 The present invention, in the insulating coated glass material and sealing glass material for an electronic material substrate represented by a thermal print head or the like, the composition of the glass material, the SiO 2 by weight% 0~12, B 2 O 3 10 to 32, ZnO 22 to 42, Bi 2 O 3 10 to 30, RO (MgO + CaO + SrO + BaO) 17 to 40, Al 2 O 3 0 to 5 It is a glass material.

また、0.1wt%〜4.5wt%のフィラーを含有することを特徴とする、上記の絶縁性被膜ガラス材料及び封着ガラス材料である。   Moreover, it is said insulating film glass material and sealing glass material characterized by containing 0.1 wt%-4.5 wt% filler.

さらに、30℃〜300℃における熱膨張係数が(65〜90)×10−7/℃、軟化点が500℃以上620℃以下であることを特徴とする上記の絶縁性被膜ガラス材料及び封着ガラス材料である。 Furthermore, the above-mentioned insulating coated glass material and sealing, wherein the coefficient of thermal expansion at 30 ° C. to 300 ° C. is (65 to 90) × 10 −7 / ° C., and the softening point is 500 ° C. or more and 620 ° C. or less. It is a glass material.

さらに、上記の絶縁性被膜ガラス材料及び封着ガラス材料を使用していることを特徴とする電子材料用基板である。   Furthermore, it is an electronic material substrate characterized by using the above-mentioned insulating coated glass material and sealing glass material.

さらにまた、上記の絶縁性被膜ガラス材料及び封着ガラス材料を使用していることを特徴とするサーマルプリントヘッド用基板である。   Furthermore, it is a substrate for a thermal print head characterized by using the above-mentioned insulating coating glass material and sealing glass material.

本発明は、サーマルプリントヘッド等に代表される電子材料基板用の絶縁性被膜ガラス材料及び封着ガラス材料において、該ガラス材料の組成が、重量%でSiOを0〜12、Bを10〜32、ZnOを22〜42、Biを10〜30、RO(MgO+CaO+SrO+BaO)を17〜40、Alを0〜5含むことを特徴とする絶縁性被膜ガラス材料及び封着ガラス材料である。 The present invention, in the insulating coated glass material and sealing glass material for an electronic material substrate represented by a thermal print head or the like, the composition of the glass material, the SiO 2 by weight% 0~12, B 2 O 3 10 to 32, ZnO 22 to 42, Bi 2 O 3 10 to 30, RO (MgO + CaO + SrO + BaO) 17 to 40, Al 2 O 3 0 to 5 It is a glass material.

SiOはガラス形成成分であり、安定したガラスを形成することができるもので、0〜12%(重量%、以下においても同様である)で含有させる。12%を越えると、ガラスの軟化点が上昇し焼成温度が高くなるために、構成材料である電極が劣化したり、発熱体の抵抗値が大きく変化する。より好ましくは、1〜7%の範囲である。 SiO 2 is a glass forming component and can form a stable glass, and is contained in an amount of 0 to 12% (wt%, the same applies hereinafter). If it exceeds 12%, the softening point of the glass rises and the firing temperature rises, so that the electrode as the constituent material deteriorates or the resistance value of the heating element changes greatly. More preferably, it is 1 to 7% of range.

はSiO同様のガラス形成成分であり、ガラス溶融を容易とし、ガラスの熱膨張係数において過度の上昇を抑え、かつ、焼付け時にガラスに適度の流動性を与えるものである。ガラス中に10〜32%で含有させるのが好ましい。10%未満ではガラスの流動性が不充分となり、焼結性が損なわれる。他方32%を越えるとガラスの安定性を低下させる。より好ましくは13〜27%の範囲である。 B 2 O 3 is a glass-forming component similar to SiO 2 , facilitates glass melting, suppresses an excessive increase in the thermal expansion coefficient of glass, and imparts appropriate fluidity to the glass during baking. It is preferable to make it contain in 10 to 32% in glass. If it is less than 10%, the fluidity of the glass becomes insufficient and the sinterability is impaired. On the other hand, if it exceeds 32%, the stability of the glass is lowered. More preferably, it is 13 to 27% of range.

ZnOはガラスの軟化点を下げ、熱膨張係数を適宜範囲に調整する成分で、ガラス中に22〜42%の範囲で含有させるのが好ましい。22%未満ではその作用を発揮し得ず、42%を超えると安定性が劣化する。より好ましくは23〜35%の範囲である。   ZnO is a component that lowers the softening point of the glass and adjusts the thermal expansion coefficient to an appropriate range, and is preferably contained in the range of 22 to 42% in the glass. If it is less than 22%, the effect cannot be exhibited, and if it exceeds 42%, the stability deteriorates. More preferably, it is 23 to 35% of range.

Biはガラスの軟化点を下げ、熱膨張係数を適宜範囲に調整する成分で、ガラス中に10〜30%の範囲で含有させるのが好ましい。10%未満ではその作用を発揮し得ず、30%を超えるとガラスの耐磨耗性が劣化する。より好ましくは13〜28%の範囲である。 Bi 2 O 3 is a component that lowers the softening point of the glass and adjusts the thermal expansion coefficient to an appropriate range, and is preferably contained in the range of 10 to 30% in the glass. If it is less than 10%, the effect cannot be exhibited, and if it exceeds 30%, the wear resistance of the glass deteriorates. More preferably, it is 13 to 28% of range.

RO(CaO,SrO,BaO)はガラスの軟化点を下げ、焼結性を向上させる。ガラス中に17〜40%で含有させるのが好ましい。17%未満ではガラスの軟化点の低下が不十分で、焼結性が損なわれる。他方40%を越えるとガラスの熱膨張係数が高くなりすぎる。より好ましくは20〜35%の範囲である。   RO (CaO, SrO, BaO) lowers the softening point of glass and improves sinterability. It is preferable to make it contain in a glass at 17 to 40%. If it is less than 17%, the softening point of the glass is not sufficiently lowered, and the sinterability is impaired. On the other hand, if it exceeds 40%, the thermal expansion coefficient of the glass becomes too high. More preferably, it is 20 to 35% of range.

Alはガラスの安定性を向上させる成分で、0〜5%の範囲で含有させることが好ましい。5%を越えると軟化点が高くなりすぎる。より好ましくは0〜4%の範囲である。 Al 2 O 3 is a component that improves the stability of the glass and is preferably contained in the range of 0 to 5%. If it exceeds 5%, the softening point becomes too high. More preferably, it is 0 to 4% of range.

O(LiO、NaO、KO)はガラスの軟化点を下げ、適度に流動性を与え、熱膨張係数を適宜範囲に調整するものであり、0〜1%の範囲で含有させても良い。1%を越えると電極との反応泡が発生する。 R 2 O (Li 2 O, Na 2 O, K 2 O) lowers the softening point of glass, imparts moderate fluidity, and adjusts the thermal expansion coefficient to an appropriate range, and is in the range of 0 to 1%. You may make it contain. If it exceeds 1%, reaction bubbles with the electrode are generated.

この他にも、一般的な酸化物で表すCuO,TiO、V、MnO、CoO、NiO、CeO,La、In、SnO、TeO、Fe、ZrOなどを、熱膨張係数および軟化点を変化させない範囲で0〜1%加えてもよい。 In addition, CuO, TiO 2 , V 2 O 5 , MnO 2 , CoO, NiO, CeO 2 , La 2 O 3 , In 2 O 3 , SnO 2 , TeO 2 , Fe 2 represented by general oxides. O 3 , ZrO 2 or the like may be added in an amount of 0 to 1% within a range in which the thermal expansion coefficient and the softening point are not changed.

実質的にPbOを含まないことにより、人体や環境に与える影響を皆無とすることができる。ここで、実質的にPbOを含まないとは、PbOがガラス原料中に不純物として混入する程度の量を意味する。例えば、低融点ガラス中における0.3wt%以下の範囲であれば、先述した弊害、すなわち人体、環境に対する影響、絶縁特性等に与える影響は殆どなく、実質的にPbOの影響を受けないことになる。   By substantially not containing PbO, it is possible to eliminate the influence on the human body and the environment. Here, “substantially free of PbO” means an amount of PbO mixed as an impurity in the glass raw material. For example, if it is in the range of 0.3 wt% or less in the low-melting glass, there is almost no influence on the adverse effects described above, that is, the influence on the human body and the environment, the insulation characteristics, etc., and it is not substantially affected by PbO. Become.

さらに上記ガラスに、0.1wt%〜4.5wt%のフィラーを含有することもでき、4.5%以上ではフィラーの突出により平坦性が劣化したり、ガラスとの分離が生じる。好ましくは2〜4%の範囲である。フィラーには、一般的なAl、ZrOなどが使用できる。 Further, the glass can contain 0.1 wt% to 4.5 wt% filler. If it is 4.5% or more, the flatness is deteriorated due to the protrusion of the filler, or separation from the glass occurs. Preferably it is 2 to 4% of range. As the filler, general Al 2 O 3 , ZrO 2 or the like can be used.

30℃〜300℃における熱膨張係数が(65〜90)×10−7/℃、軟化点が500℃以上650℃以下であるのが良い。熱膨張係数が(65〜90)×10−7/℃を外れると厚膜形成時に被膜の剥離、基板の反り等の問題が発生する。また、軟化点が620℃を越えると保護膜形成時の焼成により電極が劣化するなどの問題が発生する。軟化点が500℃より低い場合、発熱抵抗体層の抵抗値が大きく変化する。好ましくは、500℃以上600℃以下である。 The coefficient of thermal expansion at 30 ° C. to 300 ° C. may be (65 to 90) × 10 −7 / ° C., and the softening point may be 500 ° C. or more and 650 ° C. or less. When the thermal expansion coefficient is outside (65 to 90) × 10 −7 / ° C., problems such as peeling of the coating film and warping of the substrate occur when the thick film is formed. In addition, when the softening point exceeds 620 ° C., there arises a problem that the electrode is deteriorated due to baking at the time of forming the protective film. When the softening point is lower than 500 ° C., the resistance value of the heating resistor layer changes greatly. Preferably, it is 500 degreeC or more and 600 degrees C or less.

この絶縁性被膜ガラス材料及び封着ガラス材料は、電子材料用基板やサーマルプリント用基板などに好適である。   This insulating coating glass material and sealing glass material are suitable for an electronic material substrate, a thermal printing substrate, and the like.

さらにまた、上記の絶縁性被膜材料と有機ビヒクルとからなるガラスペーストである。有機ビヒクルとしては一般にガラスペーストなどに用いられているものであればいずれでもよく、エチルセルロースなどの樹脂をαテルピネオールやブチルカルビトールアセテートなどの有機溶剤に溶かしたものに代表される。有機ビヒクルと混合し、ガラスペーストとして提供することで様々な分野における材料として使用することができる。   Furthermore, it is a glass paste made of the above insulating coating material and an organic vehicle. Any organic vehicle may be used as long as it is generally used for glass pastes, and it is represented by a resin such as ethyl cellulose dissolved in an organic solvent such as α-terpineol or butyl carbitol acetate. By mixing with an organic vehicle and providing it as a glass paste, it can be used as a material in various fields.

以下、実施例に基づき、説明する。   Hereinafter, a description will be given based on examples.

(低融点ガラス混合ペーストの作製)
SiO源として微粉珪砂を、B源としてほう酸を、ZnO源として亜鉛華を、LiO源として炭酸リチウムを、NaO源として炭酸ナトリウムを、KO源として炭酸カリウムを、CuO源として酸化第二銅を、MnO源として二酸化マンガンを、MgO源として炭酸マグネシウムを、CaO源として炭酸カルシウムを、SrO源として炭酸ストロンチウムを、BaO源として炭酸バリウムを、Bi源として酸化ビスマスを要した。これらを所望の低融点ガラス組成となるべく調合したうえで、白金ルツボに投入し、電気加熱炉内で1000〜1300℃、1〜2時間で加熱溶融して表1の実施例1〜8、表2の比較例1〜5に示す組成のガラスを得た。
(Production of low melting point glass mixed paste)
The fine silica sand as a SiO 2 source, a boric acid as a B 2 O 3 source, a zinc oxide as a ZnO source, lithium carbonate as Li 2 O source, sodium carbonate as Na 2 O source, potassium carbonate as K 2 O source Cupric oxide as the CuO source, manganese dioxide as the MnO 2 source, magnesium carbonate as the MgO source, calcium carbonate as the CaO source, strontium carbonate as the SrO source, barium carbonate as the BaO source, Bi 2 O 3 Bismuth oxide was required as a source. After preparing these as a desired low melting glass composition, it puts into a platinum crucible, heat-melts in 1000-1300 degreeC for 1-2 hours in an electric heating furnace, Examples 1-8 of Table 1, Table 1 The glass of the composition shown in 2 comparative examples 1-5 was obtained.

Figure 2008303077
Figure 2008303077

Figure 2008303077
Figure 2008303077

ガラスの一部は型に流し込み、ブロック状にして熱物性(熱膨張係数、軟化点)測定用に供した。残余のガラスは急冷双ロール成形機にてフレーク状とし、粉砕装置で平均粒径0.5〜4μm、最大粒径15μm未満の粉末状に整粒した。   A part of the glass was poured into a mold, made into a block shape, and used for measurement of thermal properties (thermal expansion coefficient, softening point). The remaining glass was flaked with a rapid cooling twin roll molding machine and sized with a pulverizer into a powder having an average particle size of 0.5 to 4 μm and a maximum particle size of less than 15 μm.

次いで、αテルピネオールとブチルカルビトールアセテートからなるペーストオイルにバインダーとしてのエチルセルロースと上記ガラス粉およびフィラーを混合し、粘度、300±50ポイズ程度のペーストを調製した。なお、フィラーはZrOおよびSiOで、平均粒系2〜5μmのものを使用した。 Next, paste oil composed of α-terpineol and butyl carbitol acetate was mixed with ethyl cellulose as a binder and the above glass powder and filler to prepare a paste having a viscosity of about 300 ± 50 poise. The filler used was ZrO 2 and SiO 2 with an average grain size of 2 to 5 μm.

(絶縁性被膜の形成)
厚み2〜3mm、サイズ100mm角のアルミナ基板に、焼付け後の膜厚が約10μmとなるべく勘案して、アプリケーターを用いて前記ペーストを塗布し、塗布層を形成した。 次いで、乾燥後、650℃以下で10〜60分間焼成することにより、絶縁保護被膜層を形成させた。
(Formation of insulating coating)
The paste was applied to an alumina substrate having a thickness of 2 to 3 mm and a size of 100 mm square so that the film thickness after baking was about 10 μm, and an application layer was formed using an applicator. Subsequently, after drying, the insulating protective coating layer was formed by baking at 650 ° C. or lower for 10 to 60 minutes.

平坦性は、触針式表面走査計により算出された表面粗さRa値が0.3μm以下をOKとした。   The flatness was determined to be OK when the surface roughness Ra value calculated by a stylus type surface scan meter was 0.3 μm or less.

耐磨耗性は、形成された絶縁保護被膜上を、研磨紙#4000;荷重100g/cmの条件下で10000回摺動させたときの膜厚の減少が20%以下のものはOKと判定した。 Abrasion resistance is OK when the formed protective film is slid on 10,000 times under the condition of abrasive paper # 4000; load of 100 g / cm 2 and the decrease in film thickness is 20% or less. Judged.

電極反応抑制は、絶縁保護被膜と電極界面の顕微鏡観察、もしくは断面SEM観察から判定した。   The suppression of the electrode reaction was determined by microscopic observation of the insulating protective film and the electrode interface, or cross-sectional SEM observation.

(結果)
低融点ガラス組成および、各種試験結果を表に示す。
(result)
The low melting point glass composition and various test results are shown in the table.

表1における実施例1〜8に示すように、本発明の組成範囲内においては、平坦性、耐磨耗性、電極反応泡の抑制が従来と比べて格段に優れていた。   As shown in Examples 1 to 8 in Table 1, within the composition range of the present invention, the flatness, wear resistance, and suppression of electrode reaction bubbles were significantly superior to those of the prior art.

他方、本発明の組成範囲を外れる表2における比較例1〜5は、従来と同様、電極反応泡が顕著である、或いは、好ましい物性値を示さず、サーマルプリントヘッド等の絶縁性被膜ガラス材料及び封着ガラス材料として適用し得ない。   On the other hand, Comparative Examples 1 to 5 in Table 2 that depart from the composition range of the present invention, as in the prior art, have noticeable electrode reaction bubbles, or do not exhibit preferable physical properties, and an insulating coated glass material such as a thermal print head. And it cannot be applied as a sealing glass material.

Claims (6)

電子材料基板用の絶縁性被膜ガラス材料及び封着ガラス材料において、該ガラス材料の組成が、重量%でSiOを0〜12、Bを10〜32、ZnOを22〜42、Biを10〜30、RO(MgO+CaO+SrO+BaO)を17〜40、Alを0〜5含むことを特徴とする絶縁性被膜ガラス材料及び封着ガラス材料。 In an insulating coating glass material and a sealing glass material for an electronic material substrate, the composition of the glass material is 0 to 12 for SiO 2 , 10 to 32 for B 2 O 3 , 22 to 42 for ZnO, Bi. the 2 O 3 10~30, RO (MgO + CaO + SrO + BaO) of 17 to 40, insulative coating glass material and the sealing glass material, characterized in that the Al 2 O 3 containing 0-5. 0.1wt%〜4.5wt%のフィラーを含有することを特徴とする、請求項1に記載の絶縁性被膜ガラス材料及び封着ガラス材料。 The insulating coated glass material and the sealing glass material according to claim 1, wherein the filler contains 0.1 wt% to 4.5 wt% filler. 30℃〜300℃における熱膨張係数が(65〜90)×10−7/℃、軟化点が500℃以上620℃以下であることを特徴とする請求項1又は請求項2に記載の絶縁性被膜ガラス材料及び封着ガラス材料。 The coefficient of thermal expansion at 30 ° C to 300 ° C is (65 to 90) × 10 -7 / ° C, and the softening point is 500 ° C or higher and 620 ° C or lower. Coating glass material and sealing glass material. 請求項1乃至3のいずれか1項に記載の絶縁性被膜ガラス材料及び封着ガラス材料を使用することを特徴とする電子材料用基板。 A substrate for electronic materials, wherein the insulating coated glass material and the sealing glass material according to any one of claims 1 to 3 are used. 請求項1乃至3のいずれか1項に記載の絶縁性被膜ガラス材料及び封着ガラス材料を使用することを特徴とするサーマルプリントヘッド用基板。 A substrate for a thermal print head, wherein the insulating coated glass material and the sealing glass material according to any one of claims 1 to 3 are used. 請求項1乃至3のいずれか1項に記載の絶縁性被膜材料と有機ビヒクルとからなることを特徴とするガラスペースト。
A glass paste comprising the insulating coating material according to any one of claims 1 to 3 and an organic vehicle.
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CN111320390A (en) * 2018-12-17 2020-06-23 Agc株式会社 Glass composition, composite powder material paste, print head for laser printer, and thermal print head
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