JP2008302478A - Washing device and method of polishing head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely wash and eliminate foreign matter adhering in a pore of an elastic sheet without increasing washing man-hours. <P>SOLUTION: This washing device washes retainer ring 5 and elastic sheet 4 provided in a lower surface part of a polishing head 3. The washing device curves and holds the elastic sheet 4 by air blow, etc., and is provided with: a washing nozzle 17 for supplying washing liquid or air to a protective sheet part 4B, etc. of the elastic sheet 4; and a pressure reducing mechanism such as a water suction pump 22 for lowering pressure of a closed space part in a head washing part 6. The elastic sheet 4 is washed in the curved state of the elastic sheet 4 by reducing pressure of the head washing part 6. In this case, the foreign matter 29 in the pore 27 is washed in an easy removal state by expanding an opening part of the pore 27 of the protective sheet part 4B, and thereby the foreign matter 29 is surely washed and removed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a polishing head cleaning apparatus and cleaning method, and more particularly to a polishing head cleaning apparatus and cleaning method that removes and cleans foreign substances adhering to pores on the surface of an elastic sheet.

  Conventionally, a CMP apparatus for chemically and mechanically polishing a wafer surface includes a polishing head for pressing the wafer against a rotating polishing pad. The polishing head has a retainer ring provided on the lower outer peripheral portion of the polishing head, a carrier provided on the upper side of the wafer, and a bendable elastic sheet provided between the carrier and the wafer. It has been known. Further, the wafer is pressed downward by an elastic sheet by air pressure during polishing, so that the wafer is pressed against the upper surface of the polishing pad with uniform pressure.

  As described above, the wafer is held by the retainer ring provided in the polishing head and is polished by holding the wafer with the elastic sheet inside the retainer ring. However, foreign matter adheres to the surface of the retainer ring or the elastic sheet. If so, defects such as damage (scratch) occur on the wafer surface due to the foreign matter. Further, due to the foreign matter, the pressure distribution of the wafer at the time of polishing becomes uneven, and defects such as polishing failure occur on the surface of the wafer.

Therefore, in order to prevent the foreign matter from being damaged on the wafer surface, the lower surface of the polishing head is periodically cleaned with a brush or the like (see, for example, Patent Document 1).
JP 2003-289058 A

  By the way, when an elastic sheet having a protective sheet part bonded to the lower surface of the membrane sheet part is used, a large number of pores (cavities) are formed on the surface of the protective sheet part in the manufacturing process. For this reason, foreign matter such as fine dust (about 40 to 80 μm) is likely to adhere and remain in the pore. That is, as shown in FIG. 6, the protective sheet portion S made of synthetic resin has pores A formed therein during the molding process.

  In the next step, after the protective sheet portion S is scraped off by sandpaper along the scraping line CL, the pore A is exposed to the scraping surface and the foreign matter P adheres to the pore A as shown in FIG. . In particular, when pressing is performed after the protective sheet portion A is bonded to the membrane sheet portion, the foreign matter P adheres and remains in the pore A in a compressed state. Further, even when polishing is performed for a long time using the same elastic sheet, the foreign matter P adheres and is buried in the pore A in a compressed state.

  The conventional cleaning method using a brush can remove foreign substances adhering to the surface of the protective sheet. However, foreign substances adhering to the pores in a compressed state have a narrow pore opening. It is difficult to remove them even if they are rubbed or sprayed with strong washing water into the pores. When the wafer is polished using an elastic sheet with foreign matter remaining in the pores, as described above, the pressure distribution in the wafer surface becomes uneven, so defects such as damage to the wafer surface (including the back surface) Occurs and degrades the device performance of the wafer.

In particular, in recent years, with the miniaturization of semiconductors, defects such as damage occurring on the wafer surface have been strictly checked. Therefore, it is a big problem to surely remove the foreign matter adhering to the pores of the elastic sheet surface, particularly the protective sheet portion surface, without increasing the number of cleaning steps.

  Therefore, there is a technical problem to be solved in order to effectively clean and remove the foreign matter adhering in the pores on the elastic sheet surface without increasing the number of cleaning steps, and the present invention solves this problem. For the purpose.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a polishing head cleaning apparatus in which an elastic sheet is curvedly stretched inside a retainer ring. A head cleaning section having a concave longitudinal section formed so as to be opened in the upper surface portion of the apparatus and fitted with a lower surface portion of the polishing head so that it can be cleaned, water, air, etc. at least on the lower surface of the elastic sheet of the polishing head A cleaning nozzle that sprays the cleaning medium and a pressure reducing mechanism that depressurizes the inside of the head cleaning unit. The elastic sheet is sprayed with the cleaning medium in a curved state, and the inside of the head cleaning unit is depressurized and cleaned. Provided is a polishing head cleaning apparatus configured as described above.

  According to this configuration, when cleaning the polishing head, first, the lower surface portion of the polishing head is fitted and attached to the head cleaning portion so that it can be cleaned, and a sealed space for cleaning is provided between the polishing head and the head cleaning portion. Form. Next, the elastic sheet of the polishing head is bent downward by air pressure or the like. At this time, since the shape of the pore on the lower surface side of the elastic sheet is deformed and the opening of the pore is enlarged, the foreign matter adhering to the pore in a compressed state is relaxed (uncompressed), and a part of the foreign matter is It diffuses and moves out of the opening of the pore.

  Thereafter, a cleaning medium such as water or air is sprayed at a predetermined pressure on at least the lower surface of the elastic sheet on the lower surface of the polishing head by a cleaning nozzle. In this case, since the opening area of the pore is increased, the cleaning medium directly reaches the inner depth of the pore.

  As a result, the impact force of the cleaning medium against the foreign matter is increased, and the discharging action of the foreign matter is promoted. Further, by reducing the pressure in the cleaning sealed space by the pressure reducing mechanism, the suction pressure reducing action is further increased, and the foreign matters remaining in the pore are completely removed and cleaned.

  According to a second aspect of the present invention, there is provided the polishing head cleaning apparatus according to the first aspect, wherein the head cleaning section has an ultrasonic vibrator at the bottom.

  According to this configuration, after the lower surface portion of the polishing head is submerged, the ultrasonic vibrator is driven and cleaned. Thereby, cavitation acts on both the front and back surfaces of the retainer ring and the elastic sheet. Therefore, an explosion of small bubbles is caused in the water, and the foreign matter in the pore is surely removed by the impact force.

  A third aspect of the present invention provides the polishing head cleaning apparatus according to the first aspect, wherein the pressure reducing mechanism is a pressure reducing valve and / or a pump.

  According to this configuration, by using a valve and / or a pump as a pressure reducing mechanism of the head cleaning unit, not only a high suction pressure reducing action can be obtained, but also fluid such as water and air in the head cleaning unit / Or discharged by the suction action of the pump. That is, the foreign matter removed from the surface of the retainer ring and the elastic sheet is discharged to the outside together with water and air.

According to a fourth aspect of the present invention, the head cleaning section includes a sealing mechanism for sealing a gap formed between the polishing head and the polishing head when the polishing head is fitted and mounted. A polishing head cleaning apparatus is provided.

  According to this configuration, the gap between the head cleaning unit and the polishing head is reliably sealed by the sealing mechanism, so that the airtightness of the sealed space in the head cleaning unit is improved. Therefore, the suction pressure reducing action by the pressure reducing mechanism is further increased during head cleaning.

  The invention according to claim 5 is a cleaning method using the polishing head cleaning device according to claim 1, 2, 3 or 4, and a step of fitting and mounting the lower surface portion of the polishing head to the head cleaning portion; A step of spraying a cleaning medium such as water or air onto at least the lower surface of the elastic sheet of the polishing head with a cleaning nozzle; and a step of reducing the pressure inside the head cleaning unit with a pressure reducing mechanism, wherein the elastic sheet is bent downward. Provided is a polishing head cleaning method in which a cleaning medium is sprayed and cleaning is performed by reducing the pressure in the head cleaning section.

  According to this cleaning method, first, the lower surface portion of the polishing head is fitted and attached to the head cleaning portion so as to be cleaned, and a cleaning sealed space is formed between the polishing head and the head cleaning portion. Next, the elastic sheet of the polishing head is bent downward by air pressure or the like. At this time, since the shape of the pore on the lower surface side of the elastic sheet is deformed and the opening of the pore is enlarged, the foreign matter adhering to the pore in the compressed state is relaxed, and a part of the foreign matter is diffused and moved. It is discharged outside from the opening.

  Thereafter, a cleaning medium such as water or air is sprayed at a predetermined pressure on at least the elastic sheet on the lower surface of the polishing head by the cleaning nozzle. In this case, since the opening area of the pore is increased, the cleaning medium directly reaches the inner depth of the pore. As a result, the impact force of the cleaning medium against the foreign matter is increased, and the discharging action of the foreign matter is promoted. Further, by reducing the pressure in the cleaning sealed space by the pressure reducing mechanism, the suction pressure reducing action is increased, and the foreign matter remaining in the pore is completely removed and cleaned.

  According to the first aspect of the present invention, the pores formed on the lower surface of the elastic sheet are enlarged and washed in a reduced pressure state, so that foreign matters in the pores can be reliably washed and removed without increasing the number of washing steps. The device performance is improved by preventing various defects based on the surface.

  Since the invention according to claim 2 causes cavitation to act on both the front and back surfaces of the retainer ring and the elastic sheet during head cleaning, in addition to the effect of the invention of claim 1, the cleaning effect on both the front and back surfaces of the retainer ring and elastic sheet Can be further improved, and in particular, foreign matter in the pore can be efficiently removed.

  The invention according to claim 3 not only provides a high suction pressure reducing action by the pressure reducing valve and / or the pressure reducing pump, but also removes the cleaned foreign matter together with water, air and the like. In addition to the effects of the described invention, it is possible to further enhance the suction effect and the exclusion effect on foreign matters.

  According to the fourth aspect of the present invention, since the sealed space in the head cleaning section can be effectively sucked and reduced by the sealing mechanism, in addition to the effect of the first and second aspects of the invention, the remaining foreign matter in the pore due to the suction and pressure reducing action can be reduced. The suction removal effect is further enhanced.

  According to the fifth aspect of the present invention, since the pores on the lower surface side of the elastic sheet are widened and cleaned in a reduced pressure state, foreign matters in the pores can be effectively removed and cleaned without increasing the number of cleaning steps.

In order to achieve the object of completely removing foreign matter in the pores of an elastic sheet without increasing the number of cleaning steps, the present invention cleans a polishing head in which an elastic sheet is stretched so as to bend inside a retainer ring. In the apparatus, a head cleaning portion having a concave longitudinal section formed in an upper surface portion of the cleaning device and fitted with a lower surface portion of the polishing head so as to be cleaned, and at least the lower surface of the elastic sheet of the polishing head A cleaning nozzle for spraying a cleaning medium such as water and air, and a pressure reducing mechanism for depressurizing the inside of the head cleaning unit, and the elastic sheet is sprayed in a state of being curved downward, and the inside of the head cleaning unit This was realized by washing under reduced pressure.

  A preferred embodiment of the present invention will be described below with reference to FIGS. This embodiment is applied to the case of cleaning the lower surface portion of the polishing head of the CMP apparatus. During cleaning, the inside of the head cleaning portion is sucked and depressurized and the elastic sheet provided on the lower surface portion of the polishing head is curved. The opening of the pore on the lower surface of the elastic sheet is enlarged, and particles (foreign matter such as dust) adhering in the pore are sucked and removed in a reduced pressure state.

  The overall configuration of the cleaning apparatus will be described with reference to the explanatory diagram of FIG. In the figure, reference numeral 1 denotes a cleaning device. When cleaning the lower surface of the polishing head 3 of the CMP device 2, for example, before or after polishing the wafer, or the bendable elastic sheet 4 or the retainer ring 5 is replaced. Sometimes used. On the upper surface of the cleaning device 1, a head cleaning section 6 having a concave longitudinal section having a cleaning space is formed to open upward, and the polishing head 3 is detachably fitted to the head cleaning section 6. It is comprised so that.

  The polishing head 3 includes a ring-shaped retainer ring 5 that is provided on the lower outer peripheral portion of the polishing head 3 and restricts movement of the wafer W in the radial direction, and a carrier 7 that is provided on the upper side of the wafer W. A bendable circular elastic sheet 4 provided between the carrier 7 and the wafer W is provided.

  A specific structure of the polishing head 3 is shown in FIG. 2, but is not limited to this configuration example. As shown in the figure, the retainer ring 5 is attached to the lower surface of a retainer ring holder 8 disposed on the outer peripheral side of the carrier 7 with bolts 9, and an elastic sheet 4 is stretched on the inner peripheral portion of the retainer ring 5. ing.

  As shown in FIG. 1, a suction / blowing groove 10 for air is formed on the lower surface of the carrier 7, and the suction / blowing groove 10 is connected to an intake pump 12 and an air supply pump via an air pipe 11. 13 is switchably connected.

  As shown in FIG. 3, the elastic sheet 4 has required flexibility and is composed of two upper and lower layers, and a lower layer portion (hereinafter referred to as “protective sheet portion 4B”) on the lower surface of the upper layer portion (hereinafter referred to as “membrane sheet portion 4A”). And then press working. As shown in FIG. 2, the elastic sheet 4 has a plurality of small holes 15, 15. The small holes 15, 15... Function as wafer suction holes during wafer conveyance, and function as air pressure supply holes during polishing.

  As shown in FIG. 4, the lower surface portion of the polishing head 3 is fitted and attached to the head cleaning unit 6 of the cleaning apparatus 1, and the retainer ring 5 and the elastic sheet 4 of the polishing head 3 are in the head cleaning unit 6 during cleaning. It is washed in the state of facing. Further, the elastic sheet 4 is held curvedly so as to protrude in a substantially arc shape on the lower side, that is, on the head cleaning unit 6 side during cleaning. In this case, by blowing air from the suction / blowing groove 10, the elastic sheet 4 can be inflated downward and bent by the air blow method.

  The suction / blowing groove 10 functions as a sheet bending means. However, the sheet bending means should not be limited to this, and a sheet bending means may be provided in the head cleaning unit 6. For example, an air suction mechanism 16 may be installed on the lower side of the elastic sheet 4 in the head cleaning unit 6, and the lower surface central portion of the elastic sheet 4 may be sucked downward and curved by the air suction mechanism 16.

  Next, the configuration of the cleaning device 1 will be described in more detail. A plurality or one of the cleaning nozzles 17 for ejecting a cleaning medium such as cleaning liquid and air are provided at appropriate positions of the head cleaning unit 6 of the cleaning apparatus 1, and the tip of the cleaning nozzle 17 covers the entire lower surface of the polishing head 3. It is arranged to be oriented. Further, a cleaning liquid pump and an air pump (not shown) are connected to the cleaning nozzle 17 in a switchable manner so that cleaning liquid (pure water) or air can be ejected from the cleaning nozzle 17 as necessary. It is configured.

  The cleaning nozzle 17 can serve both as a cleaning liquid spraying mechanism for injecting a cleaning liquid and an air spraying mechanism for injecting air to the lower surface of the polishing head 3, but the cleaning liquid spraying mechanism and the air spraying mechanism are mutually connected. It is also possible to provide them separately.

  Further, in the illustrated example, a water supply port 18 is provided at an appropriate position of the head cleaning unit 6. Therefore, by supplying water into the head cleaning unit 6 from the water supply port 18, the lower surface of the polishing head 3 mounted on the head cleaning unit 6, that is, the retainer ring 5 and the elastic sheet 4 are completely submerged. Can do.

  An ultrasonic transducer 19 is provided on the bottom surface of the head cleaning unit 6. Therefore, cavitation can be generated on both the front and back surfaces of the retainer ring 5 and the elastic sheet 4 by driving the ultrasonic vibrator 19 after the lower surface of the polishing head 3 is submerged. Further, the head cleaning unit 6 is provided with a pressure reducing mechanism for sucking and reducing the sealed space in the head cleaning unit 6, for example, a water absorption pump or an intake pump.

  FIG. 1 shows a configuration example using a water absorption pump as a pressure reducing mechanism. As shown in the figure, a passage 20 is opened on the lower surface of the head cleaning unit 6, and a drain valve 21 that can be opened and closed is installed on the downstream side of the passage 20. Further, a water suction pump 22 for suction and pressure reduction is provided on the downstream side of the drain valve 21. Therefore, the retainer ring 5 and the elastic sheet 4 can be cleaned by the water absorption pump 22 in a state where the sealed space in the head cleaning unit 6 is sucked and depressurized (including vacuum). In this case, an exhaust pump (not shown) for suction and decompression may be independently installed in the middle of the passage 20.

  When an intake pump is used as the pressure reducing mechanism, an exhaust valve 24 may be installed in place of the drain valve 21, and an intake pump 25 for suction / decompression may be installed in place of the water pump 22. In this case, a drainage pump (not shown) for suction and decompression may be installed independently in the passage 20.

  A seal mechanism 28 made of an O-ring, packing, or the like is provided on the peripheral edge of the opening of the head cleaning unit 6. For this reason, when the polishing head 22 is mounted on the head cleaning unit 6, the gap between the polishing head 22 and the head cleaning unit 6 is completely sealed by the seal mechanism 28. Accordingly, since the internal space of the head cleaning unit 6 is kept airtight, the pressure in the head cleaning unit 6 is sucked by sucking air and / or cleaning liquid present in the head cleaning unit 6 by the decompression mechanism during head cleaning. Decreases more reliably and quickly.

In addition, each drive part of the cleaning apparatus 1 according to the present embodiment, that is, an air suction mechanism (sheet bending means) 16, a cleaning nozzle 17, an ultrasonic vibrator 19, a water absorption pump 22, and an intake pump (decompression mechanism) 2.
5 etc. are electrically connected to a control means (not shown). Therefore, each drive unit of the cleaning apparatus 1 is controlled and controlled by the control unit.

  Next, an example of the cleaning process of the polishing head 3 will be described. First, after polishing the wafer W, the polishing head 3 is moved to the position of the head cleaning unit 6 of the cleaning apparatus 1. Then, by lowering the polishing head 3, the polishing head 3 is fitted and attached to the head cleaning unit 6, and the elastic sheet 4 and the retainer ring 5 on the lower surface of the polishing head 3 can be cleaned in the head cleaning unit 6. Let it come. At this time, the space between the head cleaning unit 6 and the polishing head 3 is hermetically sealed by the seal mechanism 28.

  Next, in the cleaning process, air is constantly ejected from the suction / blowing groove 10 below the carrier 7, whereby the elastic sheet 4 is inflated downward by an air blow method to be curved. In this way, when the elastic sheet 4 is bent, as shown in FIG. 5, the opening of the pore 27 on the surface of the protective sheet portion 4B is deformed so as to expand.

  Along with the deformation of the inner surface shape of the pore 27, a large number of particles 29 adhering in the pore 27 in a compressed state are relaxed so as to be separated from each other, and some of them diffuse and move toward the opening side of the pore 27. As a result, coupled with the reduced pressure in the pore 27, the particles 29 in the pore 27 are easily discharged to the outside, and a part of the particles 29 is discharged from the opening.

  Thereafter, while the elastic sheet 4 is held in a curved state, a cleaning liquid or air having a predetermined pressure is ejected from the cleaning nozzle 17, and the cleaning liquid or air is sprayed onto the surfaces of the retainer ring 5 and the protective sheet portion 4B of the elastic sheet 4. The particles 29 remaining in the pores 27 are discharged to the outside.

  Thereafter, in the cleaning apparatus 1 of the cleaning system that mainly sprays the cleaning liquid, pure water is supplied from the water supply port 18 so that the lower surface of the polishing head 3 attached to the head cleaning unit 6 is submerged (in FIG. 4). (The shaded area indicates pure water). Thus, by driving the ultrasonic vibrator 19 provided on the bottom surface of the head cleaning unit 6, cavitation occurs on both the front and back surfaces of the retainer ring 5 and the elastic sheet 4.

  As a result, the particles 29 adhering to both the front and back surfaces of the retainer ring 5 and the elastic sheet 4 are efficiently removed and washed. In addition, since the impact force due to cavitation acts directly on the inside of the pore 27, the particles 29 remaining inside the pore 27 are also efficiently removed and washed.

  Then, the drain valve 21 installed in the passage 20 on the bottom surface of the head cleaning unit 6 is opened, and the water suction pump 22 for pressure reduction is driven to discharge water (including air) in the head cleaning unit 6 to the outside. Thereby, the pressure in the head washing | cleaning part 6 falls rapidly, and it wash | cleans. In this case, since the water in the pore 27 is also sucked smoothly under reduced pressure, the particles 29 in the pore 27 move together with the water and are completely discharged to the outside of the pore 27.

  Further, in the cleaning apparatus 1 of the system that mainly cleans by blowing air, the exhaust valve 24 provided in the passage 20 is opened, and the decompression intake pump 25 is driven to remove the air in the head cleaning section 6 from the outside. To discharge. Thereby, the pressure in the head washing | cleaning part 6 falls rapidly, and it wash | cleans. In this case, since the air in the pore 27 is also smoothly sucked under reduced pressure, the particles 29 in the pore 27 move together with the air and are completely discharged to the outside of the pore 27.

As described above, according to the present embodiment, at the time of cleaning, the elastic sheet 4 is curved, the opening of the pore 27 of the protective sheet portion 4B forming the lower layer portion of the elastic sheet 4 is expanded, and the pore 2 remains in that state.
The cleaning liquid or air is jetted into 7 to perform cleaning. Thus, the particles 29 in the pores 27 are efficiently and reliably removed by washing. By performing the cleaning process according to this embodiment in a timely manner, it is possible to eliminate the adhesion and accumulation of particles 29 such as fine contaminants in the pore 27, and the polishing head 3 can be used continuously. Since the particles 29 in the pore 27 exist in a compressed state, it was difficult to remove them by the conventional technique.

  Further, by generating cavitation on the lower surface portion of the polishing head 3 by the ultrasonic vibrator 19, the cleaning effect on the particles adhering to both the front and back surfaces of the retainer ring 5 and the elastic sheet 4 is further improved. In particular, the particles 29 adhering in the pores 27 of the protective sheet portion 4B are reliably removed and washed.

  Further, since the inside of the head cleaning unit 6 can be cleaned while being suction-reduced by the suction pump 22 or the suction pump 25, the particles 29 in the pores 27 are more effectively sucked and removed by the suction-depressurization action.

  Furthermore, since the sealing mechanism 28 is provided between the head cleaning unit 6 and the polishing head 3, the sealed space in the head cleaning unit 6 is kept airtight during cleaning. Therefore, the sealed space in the head cleaning unit 6 is more effectively reduced by suction.

  The present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified one.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional front view (explanatory view) illustrating a cleaning apparatus in a state where a polishing head is mounted according to an embodiment of the present invention. FIG. 3 is a detailed cross-sectional view partially showing a configuration example of a polishing head according to an embodiment. The front view which shows the elastic sheet of the two-layer structure which concerns on one Example. Explanatory drawing which illustrates a state when mounting | wearing the polishing head with the washing | cleaning apparatus which concerns on one Example. Sectional drawing explaining the state which curved the elastic sheet which concerns on one Example. It is a figure explaining the pore of the protection sheet part of an elastic sheet, and sectional drawing which shows the state before cutting an elastic sheet with sandpaper. It is a figure explaining the pore of the protection sheet part of an elastic sheet, and sectional drawing which shows a state after shaving an elastic sheet with sandpaper.

Explanation of symbols

1 Cleaning device 2 CMP device (wafer polishing device)
3 Polishing head (wafer holding head)
4 Elastic sheet 4A Membrane sheet part 4B Protective sheet part 5 Retainer ring 6 Head cleaning part 10 Suction / blowing groove 15 Small hole 16 Air suction mechanism (sheet bending means)
17 Cleaning nozzle 19 Ultrasonic vibrator 22 Water absorption pump (pressure reduction mechanism)
25 Intake pump (pressure reduction mechanism)
27 Pore 28 Sealing mechanism 29 Particle (foreign matter)

Claims (5)

In a polishing head cleaning device in which an elastic sheet is stretched in a retainer ring so as to be bent,
A head cleaning section having a concave longitudinal section that is formed in an upper surface of the cleaning device and is fitted and mounted so that the lower surface of the polishing head can be cleaned;
A cleaning nozzle that sprays a cleaning medium such as water or air onto at least the lower surface of the elastic sheet of the polishing head;
A depressurization mechanism for depressurizing the inside of the head cleaning unit,
An apparatus for cleaning a polishing head, wherein the elastic sheet is sprayed with a cleaning medium while being curved downward, and the inside of the head cleaning section is depressurized and cleaned.   2. The polishing head cleaning apparatus according to claim 1, wherein the head cleaning section has an ultrasonic vibrator at a bottom.   2. The polishing head cleaning apparatus according to claim 1, wherein the pressure reducing mechanism is a pressure reducing valve and / or a pump.   3. The polishing head cleaning apparatus according to claim 1, wherein the head cleaning section includes a sealing mechanism for sealing a gap generated between the polishing head and the polishing head when the polishing head is fitted and mounted. . A cleaning method using the polishing head cleaning device according to claim 1, 2, 3, or 4,
Fitting and mounting the lower surface of the polishing head to the head cleaning section;
A step of spraying a cleaning medium such as water or air onto at least the lower surface of the elastic sheet of the polishing head with a cleaning nozzle;
Including depressurizing the inside of the head cleaning section with a depressurization mechanism,
A method of cleaning a polishing head, wherein a cleaning medium is sprayed in a state where the elastic sheet is bent downward, and the inside of the head cleaning section is depressurized and cleaned.

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