JP2008300359A - Treatment method of surface of soldering terminal - Google Patents

Treatment method of surface of soldering terminal Download PDF

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JP2008300359A
JP2008300359A JP2008187782A JP2008187782A JP2008300359A JP 2008300359 A JP2008300359 A JP 2008300359A JP 2008187782 A JP2008187782 A JP 2008187782A JP 2008187782 A JP2008187782 A JP 2008187782A JP 2008300359 A JP2008300359 A JP 2008300359A
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terminal
soldering
laser
irradiation
solder
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Inventor
Taisuke Miki
泰典 三木
Hiroshi Yanagida
浩 柳田
Shoichi Nagata
祥一 永田
Makoto Sato
信 佐藤
Yoshiyuki Uchinono
良幸 内野々
Kenji Jonen
健二 常念
Masaharu Ishikawa
正治 石川
Hiroshi Iwano
博 岩野
Shunichi Nakayama
俊一 中山
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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Priority to JP2008187782A priority Critical patent/JP2008300359A/en
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Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Manufacturing Of Electrical Connectors (AREA)
  • Laser Beam Processing (AREA)
  • Multi-Conductor Connections (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment method of a surface of a soldering terminal, which can prevent the soldering from going up from the terminal part to a contact part, while applying gilding on the whole surface of the soldering terminal. <P>SOLUTION: In the soldering terminal 1 which is formed preparing a terminal and contact part and in which a gilding 8 is applied to the surface of a underplating 9, laser L is radiated onto the surface of the soldering terminal 1 in a portion between the terminal 2 and contact part 3, and part of the soldering terminal 1 is heated with the energy of the laser L, thereby diffusing the metal of the underplating 9 onto the layer of the gilding 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、半田付け端子の端子部を半田付けする前の前処理として行なわれる、半田付け端子の表面の処理方法に関するものである。   The present invention relates to a method for treating a surface of a soldering terminal, which is performed as a pretreatment before soldering a terminal portion of the soldering terminal.

図１７はコネクタ（ソケット）Ａの一例を示すものであり、コネクタ基台１０に多数本の半田付け端子（コネクタ端子）１を平行に２列取り付けることによって形成されている。半田付け端子１は一端部に端子部２を、他端部に接点部３を設けるように折り曲げ加工して形成されており、端子部２がコネクタ基台１０の下面に配置されるように取り付けてある。また半田付け端子１の表面には一般に、Ｎｉメッキの下地メッキを施した上に、金メッキが施してある。   FIG. 17 shows an example of a connector (socket) A, which is formed by attaching a large number of soldering terminals (connector terminals) 1 to a connector base 10 in two rows in parallel. The soldering terminal 1 is formed by bending so that the terminal portion 2 is provided at one end and the contact portion 3 is provided at the other end, and the terminal portion 2 is attached so as to be disposed on the lower surface of the connector base 10. It is. In general, the surface of the soldering terminal 1 is plated with Ni and then plated with gold.

そしてこのような半田付け端子１を組み込んで形成したコネクタＡは、図１８に示すようにプリント配線板１１に実装して使用されるものであり、プリント配線板１１の上にコネクタＡを配置して、半田付け端子１の端子部２をプリント配線板１１に半田付けすることによって、コネクタＡの実装を行なうようになっている（例えば、特許文献１参照）。   A connector A formed by incorporating such a soldering terminal 1 is used by being mounted on a printed wiring board 11 as shown in FIG. 18. The connector A is disposed on the printed wiring board 11. The connector A is mounted by soldering the terminal portion 2 of the soldering terminal 1 to the printed wiring board 11 (see, for example, Patent Document 1).

上記のようにプリント配線板１１の上にコネクタＡを配置して、半田付け端子１の端子部２を半田付けするにあたって、半田付け端子１の表面の全面には金メッキが施してあるので、金に対する半田の濡れ易さなどから、半田が端子部２から接点部３へと半田付け端子１の金メッキを施した表面に沿って上がり、この結果、端子部２に十分な量の半田が残らず、プリント配線板１１との半田接合強度が不足するおそれがあるという問題がある。   When the connector A is arranged on the printed wiring board 11 as described above and the terminal portion 2 of the soldering terminal 1 is soldered, the entire surface of the soldering terminal 1 is plated with gold. The solder rises along the gold-plated surface of the soldering terminal 1 from the terminal portion 2 to the contact portion 3 due to the ease of solder wetting to the terminal portion 2, and as a result, a sufficient amount of solder does not remain in the terminal portion 2. There is a problem that the solder joint strength with the printed wiring board 11 may be insufficient.

そこで、半田付け端子１のうち、表面を金メッキで被覆することが必要な端子部２と接点部３のみに金メッキを施し、端子部２と接点部３の間の部分には金メッキが施されないように、部分金メッキを行なうことが検討されている（例えば、特許文献２、特許文献３参照）。このように端子部２と接点部３の間に金メッキを施さず、ニッケルの下地メッキを露出させたままにしておくことによって、ニッケルに対する半田の濡れ難さなどから、端子部２から接点部３へと半田が上がることを遮断して防ぐことができるのである。
特開２００２−８７５３号公報（段落［００２８］） 特開平２−１５６６２号公報（特許請求の範囲、第３頁） 特開平６−２０４３７７号公報（特許請求の範囲、第３頁） Therefore, in the soldering terminal 1, only the terminal portion 2 and the contact portion 3 whose surfaces need to be coated with gold plating are plated, and the portion between the terminal portion 2 and the contact portion 3 is not plated with gold. In addition, partial gold plating has been studied (see, for example, Patent Document 2 and Patent Document 3). In this way, the gold plating is not applied between the terminal portion 2 and the contact portion 3, and the nickel base plating is left exposed, so that the solder portion does not easily get wet with respect to nickel. It is possible to prevent and prevent the solder from going up.
JP 20028753 A (paragraph [0028]) JP-A-2-15662 (Claims, page 3) JP-A-6-204377 (Claims, page 3)

しかし、半田付け端子１は図１６に示すように長尺の金属帯板１２にその長手方向の側端縁に沿って多数本突設して形成されているものであり、これをフープ材１３の態様にして、フープ材１３を長手方向に送りながら金メッキ浴に浸漬することによって、半田付け端子１に金メッキを施すようにしてある。従って半田付け端子１は全体が金メッキ浴に浸漬されるので、半田付け端子１に部分的に金メッキを施すようにすることは難しく、敢えて半田付け端子１に部分的に金メッキを施すようにすればフープ材１３の送り速度を数分の一程度に減速せざるを得なくなり、生産性に問題が生じることになるものであった。   However, as shown in FIG. 16, the soldering terminals 1 are formed by projecting a plurality of long metal strips 12 along side edges in the longitudinal direction. In this manner, the soldering terminal 1 is plated with gold by immersing it in a gold plating bath while feeding the hoop material 13 in the longitudinal direction. Accordingly, since the entire soldering terminal 1 is immersed in the gold plating bath, it is difficult to partially apply the gold plating to the soldering terminal 1. The feeding speed of the hoop material 13 has to be reduced to about a fraction of the speed, which causes a problem in productivity.

本発明は上記の点に鑑みてなされたものであり、半田付け端子の全面に金メッキを施しながら、半田が端子部から接点部へと上がることを防ぐことができる半田付け端子の表面の処理方法を提供することを目的とするものである。   The present invention has been made in view of the above points, and a method for treating the surface of a soldering terminal capable of preventing the solder from rising from the terminal portion to the contact portion while performing gold plating on the entire surface of the soldering terminal. Is intended to provide.

本発明の請求項１に係る半田付け端子の表面の処理方法は、端子部２と接点部３とを設けて形成され、下地メッキ９の表面に金メッキ８を施した半田付け端子１において、端子部２と接点部３との間の部分にレーザーを照射して加熱し、金メッキ８の層に下地メッキ９の金属を拡散させることを特徴とするものである。   According to the first aspect of the present invention, there is provided a method for treating a surface of a soldering terminal in which a terminal portion 2 and a contact portion 3 are provided and the surface of a base plating 9 is provided with a gold plating 8. The portion between the portion 2 and the contact portion 3 is heated by irradiating a laser, and the metal of the base plating 9 is diffused into the gold plating 8 layer.

この発明によれば、金メッキの層のうち下地メッキの金属が拡散した部分は半田の濡れ性が低くなり、半田付け端子の端子部をプリント配線板などに半田付けする際に、半田が端子部から金メッキの表面を上がっても、下地メッキの金属が拡散した箇所で半田上がりは停止し、半田が接点部にまで上がって端子部に十分な量の半田が残らなくなることを防ぐことができ、プリント配線板への端子部の半田接合強度を高く保つことができる。また、金メッキを部分的に除去する必要はないので、耐腐食性に問題が生じることもない。   According to the present invention, the portion of the gold plating layer in which the metal of the base plating has diffused has low solder wettability, and when the terminal portion of the soldering terminal is soldered to a printed wiring board or the like, the solder is the terminal portion. Even if the surface of the gold plating goes up, the soldering stops at the location where the metal of the base plating has diffused, and it can be prevented that the solder goes up to the contact part and a sufficient amount of solder does not remain in the terminal part. The solder joint strength of the terminal portion to the printed wiring board can be kept high. Further, since it is not necessary to remove the gold plating partially, there is no problem in corrosion resistance.

また請求項２の発明は、請求項１において、端子部２と接点部３との間の部分の２面を同時にレーザー照射できる方向に半田付け端子１を設置してレーザーを２面照射し、この２面照射を端子部２と接点部３との間の部分の全周に行うことを特徴とする。   Further, the invention of claim 2 is that in claim 1, the soldering terminal 1 is installed in a direction in which two surfaces of the portion between the terminal portion 2 and the contact portion 3 can be simultaneously irradiated with laser, and the laser is irradiated on two surfaces, This two-surface irradiation is performed on the entire circumference of the portion between the terminal portion 2 and the contact portion 3.

この発明によれば、半田付け端子の全周に亘って金メッキを除去、あるいは金メッキの層に下地メッキ金属を拡散させることができ、半田上がりを確実に防止することができる。さらに１回の照射で２面を同時に照射するので照射回数を低減することができて効率の向上を図ることができる。   According to the present invention, the gold plating can be removed over the entire circumference of the soldering terminal, or the base plating metal can be diffused in the gold plating layer, and soldering can be reliably prevented. Furthermore, since two surfaces are irradiated simultaneously by one irradiation, the frequency | count of irradiation can be reduced and the improvement of efficiency can be aimed at.

また請求項３の発明は、請求項２において、端子部２と接点部３との間のレーザー照射部以外の部分へのレーザーの照射を最小限に抑える方向に半田付け端子１を設置することを特徴とする。   According to a third aspect of the present invention, in the second aspect, the soldering terminal 1 is installed in a direction that minimizes laser irradiation to a portion other than the laser irradiation portion between the terminal portion 2 and the contact portion 3. It is characterized by.

この発明によれば、レーザー照射部以外の部分へのレーザーの影響を最小限に抑えることができる。   According to this invention, the influence of the laser on the part other than the laser irradiation part can be suppressed to the minimum.

また請求項４の発明は、請求項２または３において、レーザー照射は、端子部２から接点部３への半田上がりを防止可能な幅より広いスポット径Ｄを有する波長１１００ｎｍ以下のレーザーを一方向にずらしながら一列に照射してナゲットＮを形成し、隣り合うナゲットＮは互いに重複する部分を形成して、該重複した部分の半田上がり方向の幅は半田上がりを防止可能な幅より広いことを特徴とする。   According to a fourth aspect of the present invention, in the second or third aspect, the laser irradiation is performed in one direction with a laser having a wavelength 1100 nm or less having a spot diameter D wider than a width capable of preventing the solder from the terminal portion 2 to the contact portion 3. The nuggets N are formed by irradiating in a line while shifting, and the adjacent nuggets N form overlapping portions, and the width of the overlapping portions in the solder rising direction is wider than the width capable of preventing the solder rising. Features.

この発明によれば、生産性の向上、及び照射位置の位置ずれ防止を図ることができる。   According to the present invention, it is possible to improve productivity and prevent displacement of the irradiation position.

以上説明したように、本発明では、半田付け端子の全面に金メッキを施しながら、半田が端子部から接点部へと上がることを防ぐことができるという効果がある。   As described above, according to the present invention, it is possible to prevent the solder from rising from the terminal portion to the contact portion while performing gold plating on the entire surface of the soldering terminal.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（実施形態１）
半田付け端子（コネクタ端子）１は既述のように、一端部に端子部２を、他端部に接点部３を設けるように折り曲げ加工して形成されているものであり、端子部２と接点部３の間の部分はＵ字状に屈曲する屈曲部１９として形成されており、長尺の金属帯板１２をプレス加工することによって、既述の図１６のように金属帯板１２の長手方向の一側端縁に沿って多数本を平行に配列して、金属帯板１２と一体に形成してある。そして多数本の半田付け端子１を一体に設けた金属帯板１２をフープ材１３の態様にして長手方向に送ることによって、多数本の各半田付け端子１に生産性高く加工を行なうことができるようにしてある。すなわち、フープ材１３を長手方向に送りながらニッケル浴に浸漬することによって、まず半田付け端子１の表面の全面にニッケルの下地メッキを施し、さらにフープ材１３を長手方向に送りながら金メッキ浴に浸漬することによって、下地メッキの上から、半田付け端子１の表面の全面に金メッキを施すことができるものである。 (Embodiment 1)
As described above, the soldering terminal (connector terminal) 1 is formed by bending so that the terminal portion 2 is provided at one end portion and the contact portion 3 is provided at the other end portion. A portion between the contact portions 3 is formed as a bent portion 19 that is bent in a U-shape. By pressing the long metal strip 12, the metal strip 12 is pressed as shown in FIG. A large number are arranged in parallel along one side edge in the longitudinal direction and are formed integrally with the metal strip 12. Then, by sending a metal strip 12 integrally provided with a large number of soldering terminals 1 in the longitudinal direction in the form of a hoop material 13, it is possible to process each of the large number of soldering terminals 1 with high productivity. It is like that. That is, by immersing the hoop material 13 in the nickel bath while feeding it in the longitudinal direction, first, the entire surface of the soldering terminal 1 is plated with nickel, and further, the hoop material 13 is dipped in the gold plating bath while feeding it in the longitudinal direction. By doing so, gold plating can be applied to the entire surface of the soldering terminal 1 from above the base plating.

しかしながら、金メッキを除去して下地メッキを露出させることによって半田上がりを停止させるようにした場合には、半田付け端子１の一部においてＮｉの下地メッキが露出し、この部分で耐腐食性に問題が生じるおそれがある。   However, when the soldering is stopped by removing the gold plating and exposing the base plating, the Ni base plating is exposed in a part of the soldering terminal 1, and there is a problem in the corrosion resistance in this part. May occur.

そこで、請求項１の発明では、半田付け端子１の表面の全面にフープ材１３の態様で下地メッキ９及び金メッキ８を施した後、端子部２と接点部３との間の部分を加熱するようにしてある。このように加熱を行なうと、金メッキ８の下側の下地メッキ９のニッケル金属が金メッキ８の層に拡散し、図１（ｂ）のように金メッキ８のこの部分の層にＡｕ−Ｎｉの合金層８ａが形成される。金メッキ８を加熱して合金層８ａを形成する箇所は端子部２と接点部３との間であればどの箇所であってもよいが、端子部２に近い箇所であることが望ましい。   Therefore, in the first aspect of the present invention, after the base plating 9 and the gold plating 8 are applied to the entire surface of the soldering terminal 1 in the form of the hoop material 13, the portion between the terminal portion 2 and the contact portion 3 is heated. It is like that. When heating is performed in this manner, the nickel metal of the base plating 9 on the lower side of the gold plating 8 diffuses into the gold plating 8 layer, and an Au—Ni alloy is formed in this portion of the gold plating 8 as shown in FIG. Layer 8a is formed. The location where the gold plating 8 is heated to form the alloy layer 8a may be any location between the terminal portion 2 and the contact portion 3, but is preferably a location close to the terminal portion 2.

このように端子部２と接点部３の間の部分の金メッキ８に合金層８ａを形成した後、半田付け端子１を帯板１２から切り離し、半田付け端子１をコネクタ基台１０の両側部にそれぞれ複数本ずつ平行に取り付けることによって、既述の図１７のようなコネクタＡを作製することができるものである。そして、このように半田付け端子１を組み込んで形成したコネクタＡをプリント配線板１１に実装するにあたって、既述の図１８のようにプリント配線板１１の上にコネクタＡを配置し、半田付け端子１の端子部２をプリント配線板１１に半田付けする際に、半田が端子部２から金メッキの表面を上がっても、Ａｕ−Ｎｉの合金層８ａは半田の濡れ性が低いので、合金層８ａの箇所で半田上がりは停止し、それ以上半田は上がらなくなる。従って、半田が接点部３にまで上がって端子部２に十分な量の半田が残らなくなることを防ぐことができ、プリント配線板１１への端子部２の半田接合強度を高く保つことができるものである。またこのものでは、金メッキ８を部分的に除去して下地メッキ９を露出させるものではないので、耐腐食性に問題が生じることもないものである。   After the alloy layer 8 a is formed on the gold plating 8 in the portion between the terminal portion 2 and the contact portion 3 in this way, the soldering terminal 1 is separated from the strip 12, and the soldering terminal 1 is placed on both sides of the connector base 10. By attaching a plurality of each in parallel, the connector A as shown in FIG. 17 can be manufactured. When the connector A formed by incorporating the soldering terminal 1 in this way is mounted on the printed wiring board 11, the connector A is arranged on the printed wiring board 11 as shown in FIG. When soldering the terminal portion 2 of 1 to the printed wiring board 11, even if the solder goes up from the terminal portion 2 to the surface of the gold plating, the alloy layer 8a of the Au—Ni alloy is low in solder wettability. At this point, the soldering stops, and the solder can no longer rise. Accordingly, it is possible to prevent the solder from going up to the contact portion 3 and leaving a sufficient amount of solder in the terminal portion 2, and the solder joint strength of the terminal portion 2 to the printed wiring board 11 can be kept high. It is. In this case, since the gold plating 8 is not partially removed to expose the base plating 9, there is no problem in corrosion resistance.

半田付け端子１の表面の金メッキ８の一部に合金層８ａを形成するには、例えば、図１（ａ）及び図２に示すように端子部２と接点部３との間の部分において半田付け端子１の表面にレーザーＬを照射し、レーザーＬのエネルギーで半田付け端子１の一部を加熱することによって行なうことができる。ここで、レーザーＬの出力は、金メッキ８をレーザーＬの照射で除去する場合よりも低出力にする必要があり、レーザーＬの出力条件は数Ｗ〜数１００Ｗの範囲（例えば１０〜３０Ｗ）に調整し、照射時間を数ｎｓに設定するのが良好である。またレーザーＬのモードはパルス又は連続波（ＣＷ）のいずれでもよい。   In order to form the alloy layer 8a on a part of the gold plating 8 on the surface of the soldering terminal 1, for example, soldering is performed at a portion between the terminal portion 2 and the contact portion 3 as shown in FIGS. This can be performed by irradiating the surface of the soldering terminal 1 with a laser L and heating a part of the soldering terminal 1 with the energy of the laser L. Here, the output of the laser L needs to be lower than when the gold plating 8 is removed by irradiation with the laser L, and the output condition of the laser L is in the range of several W to several hundred W (for example, 10 to 30 W). It is good to adjust and set the irradiation time to several ns. The mode of the laser L may be either pulse or continuous wave (CW).

（実施形態２）
本実施形態では、実施形態１の図１、図２で説明したレーザー（電磁波）照射の他の形態について以下説明する。請求項２の発明では、端子部２と接点部３との間の部分の２面を同時にレーザー照射できる方向に半田付け端子１を設置してレーザーを２面照射し、この２面照射を端子部２と接点部３との間の部分の全周に行うようにし、さらに請求項３の発明では、端子部２と接点部３との間のレーザー照射部以外の部分へのレーザーの照射を最小限に抑える方向に半田付け端子１を設置したものである。これはレーザー装置（電磁波装置）を２台用い、各々のレーザー装置において、加工点を中心として半田付け端子１の端子部２と接点部３との間の部分の２面に対して同時にレーザー照射しており、まず第１のレーザー装置によるレーザー照射を図３〜図６に示す。ここで照射部は端子部２に近く、端子部２から略Ｌ字に折曲した箇所であって、その全周は面Ｓ１〜Ｓ４で構成される。まず、レーザーＬ１の照射方向に対して照射部の接点部３側の面Ｓ１を垂直にし、半田付け端子１を面Ｓ１の面方向に搬送することによって１回の照射で面Ｓ１のみを照射するように配置したときを基準位置とし、この基準位置においては半田付け端子１を搬送する送り方向角度φ１＝０°、送り方向角度φ１に対して垂直方向の傾きである照射角度θ１＝０°とする。そして、送り方向角度φ１＝４０°（図４参照）、照射角度θ１＝４５°（図５（図４のＡ１方向からみた図）参照）に角度調節することで、照射部の面Ｓ１及び面Ｓ２の２面をレーザーＬ１によって同時にレーザー照射することができるとともに（図４〜図６中の太線部にレーザーＬ１の照射による加工箇所を示す）、該照射部以外の部分へのレーザー照射の影響を最小限に抑えている。 (Embodiment 2)
In the present embodiment, another form of laser (electromagnetic wave) irradiation described in FIGS. 1 and 2 of the first embodiment will be described below. According to the second aspect of the present invention, the soldering terminal 1 is installed in the direction in which the two surfaces between the terminal portion 2 and the contact portion 3 can be simultaneously irradiated with the laser, and the two surfaces of the laser are irradiated. In the invention of claim 3, the laser irradiation is performed on the part other than the laser irradiation part between the terminal part 2 and the contact part 3. The soldering terminal 1 is installed in the direction to minimize it. This uses two laser devices (electromagnetic wave devices), and in each laser device, laser irradiation is simultaneously performed on two surfaces between the terminal portion 2 and the contact portion 3 of the soldering terminal 1 around the processing point. First, laser irradiation by the first laser device is shown in FIGS. Here, the irradiating part is close to the terminal part 2 and is a portion bent from the terminal part 2 into a substantially L shape, and its entire circumference is composed of surfaces S1 to S4. First, the surface S1 on the contact portion 3 side of the irradiation unit is perpendicular to the irradiation direction of the laser L1, and the soldering terminal 1 is conveyed in the surface direction of the surface S1, thereby irradiating only the surface S1 by one irradiation. In this reference position, the feed direction angle φ1 = 0 ° for conveying the soldering terminal 1 and the irradiation angle θ1 = 0 ° that is the inclination in the direction perpendicular to the feed direction angle φ1 are as follows. To do. Then, by adjusting the feed direction angle φ1 = 40 ° (refer to FIG. 4) and the irradiation angle θ1 = 45 ° (refer to FIG. 5 (viewed from the A1 direction in FIG. 4)), the surface S1 and the surface of the irradiation unit The two surfaces of S2 can be simultaneously irradiated with the laser L1 (the thick line portions in FIGS. 4 to 6 indicate the processing points by the irradiation of the laser L1), and the influence of the laser irradiation on the portions other than the irradiated portion Is kept to a minimum.

次に、第２のレーザー装置によるレーザー照射を図７〜図１１に示す。レーザーＬ２の照射方向に対して照射部の端子部２側の面Ｓ３を垂直にした状態で、半田付け端子１を面Ｓ３の面方向に搬送することによって１回の照射で面Ｓ３のみを照射するように配置したときを基準位置とし、この基準位置においては半田付け端子１を搬送する送り方向角度φ２＝０°、送り方向角度φ２に対して垂直方向の傾きである照射角度θ２＝０°とする。そして、送り方向角度φ２＝４０°（図８参照）、照射角度θ２＝１５°（図９（図８のＡ２方向からみた図）参照）に角度調節することで、照射部の面Ｓ３及び面Ｓ４の２面を同時にレーザーＬ２によってレーザー照射することができるとともに（図８〜図１０中の破線部にレーザーＬ２の照射による加工箇所を示す）、該照射部以外の部分へのレーザー照射の影響を最小限に抑えている。なお、図１１は第２のレーザー装置によるレーザー照射の斜視図を示す。   Next, laser irradiation by the second laser device is shown in FIGS. In a state where the surface S3 on the terminal portion 2 side of the irradiation portion is perpendicular to the irradiation direction of the laser L2, the soldering terminal 1 is conveyed in the surface direction of the surface S3 to irradiate only the surface S3 by one irradiation. The reference position is a position where the soldering terminals 1 are arranged. At this reference position, the feed direction angle φ2 = 0 ° for conveying the soldering terminal 1 and the irradiation angle θ2 = 0 ° which is the inclination in the direction perpendicular to the feed direction angle φ2. And Then, by adjusting the feed direction angle φ2 = 40 ° (refer to FIG. 8) and the irradiation angle θ2 = 15 ° (refer to FIG. 9 (viewed from the A2 direction in FIG. 8)), the surface S3 and the surface of the irradiation unit The two surfaces of S4 can be simultaneously irradiated with the laser L2 (the broken line portion in FIGS. 8 to 10 indicates the processing position by the irradiation of the laser L2), and the influence of the laser irradiation on the portion other than the irradiation portion Is kept to a minimum. FIG. 11 is a perspective view of laser irradiation by the second laser device.

このように半田付け端子１の照射部の全周（面Ｓ１〜Ｓ４）に亘ってレーザーを照射し、加熱して金−ニッケルの合金層を形成することができ、端子部２から接点部３への半田上がりを確実に防止している。さらに、１回の照射で照射部の２面を同時に照射するので照射回数を低減することができて効率の向上を図っている。   In this way, the laser can be irradiated over the entire circumference (surfaces S1 to S4) of the irradiated portion of the soldering terminal 1 and heated to form a gold-nickel alloy layer. The solder is reliably prevented from rising. Furthermore, since two surfaces of the irradiation unit are irradiated simultaneously by one irradiation, the number of irradiations can be reduced, and the efficiency is improved.

（実施形態３）
本実施形態では、実施形態１、及び実施形態２で説明したレーザー（電磁波）照射についてレーザーＬのモードがパルスの場合について以下詳述する。請求項４の発明では、レーザー照射は、端子部２から接点部３への半田上がりを防止可能な幅より広いスポット径を有する波長１１００ｎｍ以下のレーザーを一方向にずらしながら一列に照射してナゲットを形成し、隣り合うナゲットは互いに重複する部分を形成して、該重複した部分の半田上がり方向の幅は半田上がりを防止可能な幅より広くしたものである。ここでスポット径は照射物に当たるレーザーＬのビーム径であり、ナゲット径はレーザーＬが照射物に当たった後の照射物の加工跡のことであり、互いの径の大きさは殆ど等しくなる。 (Embodiment 3)
In the present embodiment, the case where the mode of the laser L is a pulse for the laser (electromagnetic wave) irradiation described in the first and second embodiments will be described in detail below. In the invention of claim 4, the laser irradiation is performed by irradiating a laser beam having a spot diameter wider than the width capable of preventing the solder rise from the terminal portion 2 to the contact portion 3 with a wavelength of 1100 nm or less in one line while shifting in one direction. The adjacent nuggets form overlapping portions, and the width of the overlapping portions in the solder rising direction is wider than the width capable of preventing the solder rising. Here, the spot diameter is the beam diameter of the laser L that hits the irradiated object, and the nugget diameter is a processing trace of the irradiated object after the laser L hits the irradiated object, and the sizes of the diameters are almost equal.

従来のレーザーＬは図１９に示すように、ほぼ円形のナゲットＮ’を半田付け端子１の照射部に直線状に複数列形成しており、照射パルス数が多いことによる生産性の低下、及び複数列の照射による照射位置の位置ずれが発生していた。   In the conventional laser L, as shown in FIG. 19, a plurality of substantially circular nuggets N ′ are linearly formed in the irradiation portion of the soldering terminal 1, and the productivity decreases due to a large number of irradiation pulses, and The positional deviation of the irradiation position due to the irradiation of a plurality of rows occurred.

対して本実施形態のレーザーＬによるナゲットＮは図１２に示すようにナゲット径Ｄを有するほぼ円形で、ナゲットＮを形成するためのレーザースポット径Ｄ’は半田上がりを防止するための必要最小限幅より大きい値に設定されており、ここでは半田上がりを防止できる必要最小限幅０．１３ｍｍに対してスポット径Ｄ’＝０．１５ｍｍに設定されている。そして、このナゲットＮを図１３に示すように一方向（矢印方向）にずらしながら一列形成して、互いに隣り合うナゲットＮは重複部分を形成しており、その重複部分の半田上がり方向の幅は必要最小限幅０．１３ｍｍ以上に形成されて重複部分でも半田上がりを防止している。さらに一列照射を行うことで、従来の複数列照射に比べて、照射パルス数の低減による生産性の向上、及び照射位置の位置ずれ防止を図っている。   On the other hand, the nugget N by the laser L of the present embodiment is substantially circular having a nugget diameter D as shown in FIG. 12, and the laser spot diameter D ′ for forming the nugget N is the minimum necessary for preventing solder rise. It is set to a value larger than the width. Here, the spot diameter D ′ is set to 0.15 mm with respect to the necessary minimum width 0.13 mm that can prevent the solder from rising. Then, the nuggets N are formed in a row while being shifted in one direction (arrow direction) as shown in FIG. 13, and the nuggets N adjacent to each other form an overlapping portion, and the width of the overlapping portion in the solder rising direction is The minimum required width is 0.13 mm or more to prevent the solder from rising even at the overlapping portion. Further, by performing one-line irradiation, productivity is improved by reducing the number of irradiation pulses and prevention of misalignment of the irradiation position as compared with conventional multiple-line irradiation.

図１４は隣り合う２つのナゲットＮが重複した状態を示しており、ナゲット径Ｄでバイトサイズ（ナゲットＮのピッチ間隔）Ｂの間隔で形成されており、隣り合うナゲットＮの半田上がり方向の重複部分幅Ｈ＝√（Ｄ２−Ｂ２）となる。そして、隣り合うナゲットＮに対して常に重複部分を形成し、この重複部分幅Ｈを半田上がりを防止するための必要最小限幅以上とするために、バイトサイズＢをナゲット径Ｄの半分以下（０＜Ｂ≦Ｄ／２）としている。 FIG. 14 shows a state in which two adjacent nuggets N overlap each other, which are formed with a nugget diameter D and a byte size (pitch interval of the nugget N) B, and overlap between adjacent nuggets N in the solder rising direction. The partial width H = √ (D 2 −B 2 ). In order to always form an overlapping portion with respect to the adjacent nuggets N, and to set the overlapping portion width H to a necessary minimum width or more for preventing solder rise, the bite size B is less than half of the nugget diameter D ( 0 <B ≦ D / 2).

図１５（ａ）〜（ｇ）は、ナゲット径Ｄ＝０．１５ｍｍのナゲットＮのバイトサイズＢを変化させることによる重複部分幅Ｈの変化を示しており、（ａ）：バイトサイズＢ＝０ｍｍ、重複部分幅Ｈ＝０．１５ｍｍ、（ｂ）：バイトサイズＢ＝０．００８ｍｍ、重複部分幅Ｈ≒０．１５０ｍｍ、（ｃ）：バイトサイズＢ＝０．０１６ｍｍ、重複部分幅Ｈ＝０．１４９ｍｍ、（ｄ）：バイトサイズＢ＝０．０３２ｍｍ、重複部分幅Ｈ＝０．１４７ｍｍ、（ｅ）：バイトサイズＢ＝０．０４８ｍｍ、重複部分幅Ｈ＝０．１４２ｍｍ、（ｆ）：バイトサイズＢ＝０．０７５ｍｍ、重複部分幅Ｈ＝０．１３０ｍｍ、（ｇ）：バイトサイズＢ＝０．１５ｍｍ、重複部分幅Ｈ＝０ｍｍの各状態を示す。まず、（ｂ）〜（ｆ）において重複部分幅Ｈは半田上がりを防止するための必要最小限幅以上であって、加熱することで金−ニッケルの合金層を形成することができ、半田上がりを確実に防止している。対して（ａ）は同一箇所に照射し続ける状態であって、金メッキ８、ニッケルの下地メッキ９が除去されて、半田付け端子１の銅部分が露出してしまい、（ｇ）は重複部分幅Ｈがない状態であって、半田上がりが発生してしまう。   FIGS. 15A to 15G show changes in the overlapped portion width H by changing the byte size B of the nugget N having a nugget diameter D = 0.15 mm. (A): the byte size B = 0 mm , Overlapping portion width H = 0.15 mm, (b): byte size B = 0.008 mm, overlapping portion width H≈0.150 mm, (c): byte size B = 0.016 mm, overlapping portion width H = 0. 149 mm, (d): byte size B = 0.032 mm, overlapped portion width H = 0.147 mm, (e): byte size B = 0.048 mm, overlapped portion width H = 0.142 mm, (f): byte size B = 0.075 mm, overlapped part width H = 0.130 mm, (g): each state of byte size B = 0.15 mm, overlapped part width H = 0 mm. First, in (b) to (f), the overlapping portion width H is equal to or larger than the minimum necessary width for preventing solder rise, and a gold-nickel alloy layer can be formed by heating. Is surely prevented. On the other hand, (a) is a state in which the same portion is continuously irradiated, the gold plating 8 and the nickel base plating 9 are removed, and the copper portion of the soldering terminal 1 is exposed, and (g) is the overlapping portion width. In the state without H, the solder rises.

またレーザーＬは、金−ニッケルの合金層８ａを形成させるために、１パルス当たりのエネルギーとして１〜５ｍＪ／ｐｕｌｓｅ、単位面積当たりのエネルギーとして４００〜２０００ｍＪ／ｍｍ２を確保している。 In order to form the gold-nickel alloy layer 8a, the laser L secures 1 to 5 mJ / pulse as energy per pulse and 400 to 2000 mJ / mm 2 as energy per unit area.

実施形態１の半田付け端子の表面の処理方法を示すものであり、（ａ），（ｂ）はそれぞれ拡大した一部の断面図である。The method for treating the surface of the soldering terminal according to the first embodiment is shown, and (a) and (b) are enlarged partial sectional views. 同上を示す正面図である。It is a front view showing the same. 実施形態２の半田付け端子の表面の処理方法を示す斜視図である。It is a perspective view which shows the processing method of the surface of the soldering terminal of Embodiment 2. 同上のレーザー照射時の送り方向角度を示す平面図である。It is a top view which shows the feed direction angle at the time of laser irradiation same as the above. 同上のレーザー照射角度を示す平面図である。It is a top view which shows a laser irradiation angle same as the above. 同上のレーザー照射時の送り方向を示す平面図である。It is a top view which shows the feed direction at the time of laser irradiation same as the above. 同上を示す斜視図である。It is a perspective view which shows the same as the above. 同上のレーザー照射時の送り方向角度を示す平面図である。It is a top view which shows the feed direction angle at the time of laser irradiation same as the above. 同上のレーザー照射角度を示す平面図である。It is a top view which shows a laser irradiation angle same as the above. 同上のレーザー照射時の送り方向を示す平面図である。It is a top view which shows the feed direction at the time of laser irradiation same as the above. 同上を示す斜視図である。It is a perspective view which shows the same as the above. 実施形態３のナゲット形状を示す平面図である。10 is a plan view showing a nugget shape of Embodiment 3. FIG. 同上のレーザー照射を示す平面図である。It is a top view which shows laser irradiation same as the above. 同上のレーザー照射の重複部分を示す平面図である。It is a top view which shows the duplication part of laser irradiation same as the above. 同上のレーザー照射を示すものであり、（ａ）〜（ｇ）はそれぞれバイトサイズを変化させたときの平面図である。The laser irradiation same as the above is shown, and (a) to (g) are plan views when the byte size is changed. 金属帯材に半田付け端子を一体に設けて形成されるフープ材を示すものであり、（ａ）は正面図、（ｂ）は平面図、（ｃ）は側面図である。The hoop material formed by providing a soldering terminal integrally with a metal strip is shown, (a) is a front view, (b) is a plan view, and (c) is a side view. コネクタのソケットを示すものであり、（ａ）は正面図、（ｂ）は平面図、（ｃ）は側面図である。FIG. 1 shows a socket of a connector, (a) is a front view, (b) is a plan view, and (c) is a side view. コネクタのソケットをプリント配線板に実装する状態を示す断面図である。It is sectional drawing which shows the state which mounts the socket of a connector on a printed wiring board. 従来のレーザー照射を示す平面図である。It is a top view which shows the conventional laser irradiation.

符号の説明Explanation of symbols

１ 半田付け端子
８ 金メッキ
９ 下地メッキ
Ｌ レーザ 1 Soldering terminal 8 Gold plating 9 Base plating L Laser

Claims (4)

端子部と接点部とを設けて形成され、下地メッキの表面に金メッキを施した半田付け端子において、端子部と接点部との間の部分にレーザーを照射して加熱し、金メッキの層に下地メッキの金属を拡散させることを特徴とする半田付け端子の表面の処理方法。 A soldering terminal that is formed by providing a terminal part and a contact part, and the surface of the base plating is gold-plated. The part between the terminal part and the contact part is heated by laser irradiation, and the gold-plated layer is grounded. A method for treating a surface of a soldering terminal, characterized by diffusing plated metal. 端子部と接点部との間の部分の２面を同時にレーザー照射できる方向に半田付け端子を設置してレーザーを２面照射し、この２面照射を端子部と接点部との間の部分の全周に行うことを特徴とする請求項１に記載の半田付け端子の表面の処理方法。 Soldering terminals are installed in the direction where laser irradiation can be performed simultaneously on the two surfaces between the terminal portion and the contact portion, and laser irradiation is performed on the two surfaces, and this two-surface irradiation is applied to the portion between the terminal portion and the contact portion. The method for treating a surface of a soldering terminal according to claim 1, wherein the method is performed all around. 端子部と接点部との間のレーザー照射部以外の部分へのレーザーの照射を最小限に抑える方向に半田付け端子を設置することを特徴とする請求項２記載の半田付け端子の表面の処理方法。 3. The surface treatment of a soldering terminal according to claim 2, wherein the soldering terminal is installed in a direction that minimizes laser irradiation to a portion other than the laser irradiation portion between the terminal portion and the contact portion. Method. レーザー照射は、端子部から接点部への半田上がりを防止可能な幅より広いスポット径を有する波長１１００ｎｍ以下のレーザーを一方向にずらしながら一列に照射してナゲットを形成し、隣り合うナゲットは互いに重複する部分を形成して、該重複した部分の半田上がり方向の幅は半田上がりを防止可能な幅より広いことを特徴とする請求項２または３に記載の半田付け端子の表面の処理方法。 Laser irradiation forms a nugget by irradiating lasers with a wavelength of 1100 nm or less having a spot diameter wider than the width capable of preventing solder from the terminal portion to the contact portion in one direction while shifting in one direction, and adjacent nuggets are mutually connected 4. The method of treating a surface of a soldering terminal according to claim 2, wherein overlapping portions are formed, and the width of the overlapping portions in the solder rising direction is wider than a width capable of preventing the solder rising.
JP2008187782A 2002-10-10 2008-07-18 Treatment method of surface of soldering terminal Pending JP2008300359A (en)

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CN109196725B (en) * 2016-06-02 2020-11-27 泰连德国有限公司 Lubricated contact element and method of making same
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