JP2008300342A - Metal solder material containing carbon nanotube, conductive material, and semiconducting material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cope with a problem of expected development of an inexpensive and high-quality material, since how to achieve energy-saving and resource-saving influences on protection of earth environment, and rising cost of a solder material or electronic components due to rise of metal prices in a world-wide scale could not overlook, in the present industrial world. <P>SOLUTION: By using excellent characteristics of a carbon nanotube, and using it as a raw material, a device can be downsized, energy-saved, and last long. Especially in a solder industry, an inexpensive solder material or electric component material can be developed for substituting of lead-free soldering. This invention is not only for above, but also has a lot of possibilities. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

An object of the present invention is to make a composite material in which carbon nanotubes are mixed with metal, ceramics, glass, and the like, and use them as wire materials, solder materials, and other various materials.

Technical background

Currently, in order to protect the global environment, resource saving and energy saving are being screamed in various industrial fields. Metals, ceramics, glass and mixed materials are used as materials for electrical and electronic parts and molecular sieves, but new materials with higher physical and chemical properties and longer life than these conventional products have been developed. It is desired. In the solder industry, Pb-free solder materials that do not use lead in place of the conventionally used tin-lead alloy solder (typically 96.5% tin, silver 3) %, 0.5% copper ECO solder, etc.) are becoming mainstream. Pb-free solder is more expensive and has a higher melting point (Pb-free 210-220 ° C, eutectic 183.3 ° C) than conventional lead-containing eutectic solder (composition example, 63% tin, 37% lead). The thermal effect of components during mounting soldering has also become a problem.

In view of the above problems, the present invention has focused on carbon nanotubes as a new material. Improve the properties of the metal itself by mixing carbon nanotubes with high material properties such as conductivity five times that of copper and strength 20 times that of steel into metals and ceramics in an amount of 0.1% to several percent. I can do it. This aims to make the Japanese industry with few resources permanent prosperity by reducing the size, performance and life of the product.

A method for producing and using a mixed material centering on a carbon nanotube applicable in the present invention is as follows.

Carbon nanotubes have excellent electrical properties of several times to several tens of times that of pure copper and several times that of silver. When carbon nanotubes are mixed with copper, nickel, aluminum, etc. in the range of several to several percent, the response speed is fast due to the potential difference and it can be applied to highly sensitive sensor materials.

Carbon nanotubes have high heat resistance and excellent physical properties that are strong against metal erosion. By mixing with a metal material and adding the wettability of the metal, a material such as a soldering iron chip having a long life and high conductivity as described above can be obtained.

In addition, carbon nanotubes have a fine structure at the atomic level, and by taking advantage of this property, they can be granulated or mixed with activated carbon or granulated coal as a binder to form nitrogen or oxygen as an adsorbent molecular sieve. It can be applied to generators and oxygen generators.

When used as a solder material, it can be applied to powder, paste, wire solder, spear wire solder, bar solder, washer spring and the like.

Since carbon nanotubes are, of course, nanoparticles, the metal and ceramic materials mixed with them are easier to mix with nanoparticles or molecules close to them. Uniform molecular distribution is achieved by processing such as cure, press cure, and sintering. Can be mixed.

Since carbon nanotubes have high physical and chemical properties as described above, they are effective for miniaturization of the apparatus and, consequently, energy saving.

Embodiments will be described below with reference to the accompanying drawings as examples.

FIG. 1 is a schematic diagram when the present invention is used as a chip material for a soldering iron. By mixing the metal with the carbon nanotube, tin alloy solder or the like melts at a temperature to cause a diffusion reaction with the metal at the tip of the chip, so that a so-called wettability state is achieved in which it is difficult to slip off against the direction of gravity. In addition, due to the characteristics of carbon nanotubes, thermal conductivity and electrical conductivity are higher than that of metal-only chips, and wear due to heat is reduced.

FIG. 2 is a schematic view when the present invention is used as an oxygen adsorbent used in a nitrogen generator. The carbon nanotube material packed in the cylinder or the molecular sieve of the composite adsorbs oxygen, and nitrogen gas is taken out. Since the adsorptivity is higher than that of the conventional molecular sieve, the size can be reduced.

3 and 4 are schematic views when the present invention is used as a solder material. The black dots in the figure represent carbon nanotubes, which are superior in electrical conductivity and thermal conductivity compared to conventional solder materials, so that a small amount is required, and work efficiency is improved.

These are the schematic diagrams at the time of utilizing this invention as a chip material of a soldering iron. These are the schematic diagrams at the time of utilizing this invention as an oxygen adsorbent used for a nitrogen generator. These are the schematic diagrams at the time of utilizing this invention as a cream solder material. These are the schematic diagrams at the time of utilizing this invention as a solder core wire solder.

Claims (11)

Metals and their alloys (gold, platinum, silver, copper, nickel, zinc, iron, lead, palladium, silicon, magnesium, aluminum, indium, nichrome, chrome, bismuth, antimony, titanium, stainless steel, beryllium, beryllium oxide, brass , Kanthal, Inconel, etc.) based on conductive materials mixed with carbon nanotubes (mixing ratio varies from 0.1% to several pickups depending on metal and alloy properties). The material of claim 1 is made into a powder of several nanometers to several micrometers and mixed with a flux to obtain a cream solder material in the form of a cream paste, or it is sintered or melted to form a bar, a plate, a wire (with a flux resin in the center) Wire-soldered molded products and coil wire materials. A semiconductor material mixed or sintered with the material of claim 1 or 2 and ceramics (aluminum oxide, titanium oxide, beryllium oxide, silicon nitride, aluminum titanate, carbon, etc.), and carbon nanotube-metal, Mixed materials or composite materials such as alloys, ceramics and glass. The wire material, press molding material, and injection molding material of the new material according to claim 1, claim 2, and claim 3. A coil material, thermocouple, compensating lead wire, terminal, filament, LED light emitting material, electrode, bus bar lead wire, Peltier material, heater material, IC, IC chip, resistor, capacitor, motor wire, applying claims 1 to 4 All conductive materials and semiconductive materials such as coil materials, sensor materials, sensor coil materials. Photoelectric conversion elements for photovoltaic power generation, storage batteries and capacitor materials for storage batteries, motor materials for electric vehicles, and other new materials for automobiles, ships, spacecrafts, medical care, biotechnology, distribution industry, environment, robots and sports. Spring materials, screws, nuts, washers, gears, jigs, bearing garments, houses, shafts, pillars, roofs, tiles, fences, and other building materials, FA devices, televisions, refrigerators, and other home appliances that apply claims 1 to 4 New material that can be applied to. Conductive paste material mixed with carbon nanotube and conductive paste material Superconductive paste material mixed with carbon nanotube and conductive paste material Superconductive paste material in which metal powder is mixed in claims 8 to 9 A heat-resistant conductive paste material obtained by mixing a ceramic material with claims 8 to 10

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