JP2008298975A - Droplet ejection apparatus and its controlling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a droplet ejection apparatus which can achieve high-speed droplet ejection and reduce the system cost. <P>SOLUTION: The droplet ejection apparatus includes: a droplet ejection means 104 which is arranged parallel to the surface of substrate and has a plurality of ejection holes; an ejection control means 106 which controls ejection from each hole based on delivery instruction information; a ejection-instruction-information generating means 103 which generates relative position attitude information when the droplet ejection means 104 goes through the surface of substrate as well as delivery instruction information; a ejection position control means 102 which controls an in-plane relative position attitude on the surface of substrate based on position attitude instruction information; and a relative position measuring means 116 which detects or presumes in-plane relative position attitudes of the droplet ejection means 104 and the surface of substrate. The ejection instruction information 111 includes the combination of: a ejection-starting relative position of the standard ejection hole when ejection action is started; a number of ejection; an ejection distance or ejection interval time; unit delivery instruction information which is a set of differences in ejection position between the standard ejection hole and other ejection holes in the direction of moving of ejection; and delivery mask information which shows a hole actually ejecting among the ejection holes of ejection action. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a droplet discharge device that discharges a liquid in which a solvent and fine particles are mixed, and a control method thereof.

  As a droplet discharge device for the purpose of manufacturing a liquid crystal display device, for example, there is a “drawing pattern data generation device and a functional droplet discharge device including the same” disclosed in Patent Document 1. The drawing pattern data generation device secures an array area of drawing pattern data based on the image data, generates pattern data by writing drawing image information in the array area, and outputs the pattern data in binary. Based on this drawing pattern data, functional droplets are selectively ejected from the droplet ejection head to the work to generate a display panel of the liquid crystal display device.

JP 2003-233476 A

  Liquid crystal panel display devices are required to have larger size and higher pixel density. In addition to this, in manufacturing, multiple throughputs and multiple coatings from one substrate, multiple line simultaneous scanning with multiple heads, etc. are being attempted to improve throughput. From these facts, it is clear that the number of scanning steps required for coating and, consequently, the pattern data capacity increases. The increase in capacity affects the calculation time of data generation in the arithmetic unit, the amount of memory required for data retention, and the communication time between the data generation means and the head control means. This is necessary and leads to an increase in equipment cost.

  An object of the present invention is to provide a droplet discharge device that can realize high-speed droplet discharge and can reduce the cost of the device, and a control method therefor, in view of the above-mentioned problems of the prior art.

  In order to achieve the above object, the present invention provides a droplet for ejecting functional droplets onto a substrate having one or more target regions in a plane in which a plurality of pixel pieces are arranged in a row direction and a column direction orthogonal to each other. A droplet discharge means having a plurality of discharge holes arranged in parallel to the substrate surface, and a discharge control means for performing discharge control of each hole of the droplet discharge means based on discharge command information; Position / orientation command information indicating information on the relative position and orientation in a plane through which the droplet discharge means passes through the substrate surface, discharge command information generating means for generating the discharge command information corresponding to the information, and the droplet discharge means Supply means for supplying a mixture of solvent and fine powder, and discharge position control for controlling the relative position and orientation in the plane between the droplet discharge means and the substrate surface based on the position and orientation command information generated by the discharge command information generating means Means and Information is exchanged between the relative position measurement means for detecting or estimating the relative position and orientation of the droplet discharge means and the substrate surface in the plane, and the discharge command information generation means, the discharge position control means, the discharge control means, and the supply means. It has overall control means for arbitrating and giving an operation command to each means, and the discharge command information includes the discharge start relative position of the reference discharge hole that first reaches the target area at the start of the discharge operation, the number of discharges, and the discharge distance Unit discharge with a set of interval or discharge time interval and the difference in discharge position between other discharge holes and reference discharge holes with respect to the movement direction at the time of discharge, or the time difference between other discharge holes and reference discharge holes It is characterized by comprising a combination of command information and discharge mask information indicating holes that actually discharge among the discharge holes during the discharge operation.

  The discharge control means includes a parameter setting and timing generation unit, a discharge timing generation unit for each head, a discharge timing control unit for each nozzle, and a bit mask setting unit, each of which is configured by hardware or software It is characterized by being.

  The method for controlling a droplet discharge device according to the present invention includes a plurality of discharge holes arranged in parallel with the substrate surface, and the discharge control from each hole is performed based on discharge command information. In-plane relative position and orientation between the droplet discharge means and the substrate surface are detected or estimated, and position and orientation command information indicating information on the relative position and orientation in the plane passing through the substrate surface, and ejection command information corresponding to this are generated. The discharge command information includes the discharge start relative position of the reference discharge hole that first reaches the target region at the start of the discharge operation, the number of discharges, the discharge distance interval or the discharge time interval, and other discharges related to the movement direction during discharge. Unit discharge command information, which is a set of the difference in discharge position between the hole and the reference discharge hole, or the difference in time at which the other discharge hole and the reference discharge hole pass, and actual discharge from among the discharge holes during the discharge operation Discharge mass indicating a hole It becomes a combination of information, and performs ejection control of the plurality Anaana.

  The present invention is a liquid crystal substrate forming apparatus for forming a spacer on a liquid crystal substrate glass, wherein the formation of the spacer is performed using the droplet discharge device.

  According to the present invention, since the lattice-point application pattern can be expressed with very few parameters, the entire pattern data can be reduced. As a result, the calculation time for data generation, the amount of memory required for data retention, and the increase in communication time between the data generation means and the head control means can be suppressed. It is not necessary, and throughput can be improved and apparatus cost can be reduced.

  ADVANTAGE OF THE INVENTION According to this invention, the droplet discharge apparatus which can control the discharge head and its relative position with respect to the liquid crystal panel substrate which is application object, and can mainly form the spacer of a liquid crystal panel substrate can be provided.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. In the following, coating refers to a state in which a plurality of droplets are distributed on the surface by one or more ejections, and coating mode refers to a state in which each nozzle can be turned on / off with a discharge pattern according to data. . Further, the difference between scanning and coating is that the scanning region includes the coating region, and whether or not coating is performed at each position in the scanning region depends on the pattern data.

  FIG. 1 is a block diagram showing the configuration of a droplet discharge apparatus according to the present invention. The overall control means 101 performs overall control of the entire apparatus. By instructing other means, generation of information necessary for droplet discharge control, control of the discharge sequence, sequence control of the relative positions of the droplet discharge means 104 and the substrate, and the amount and quality of the liquid discharged from the nozzle Take control. The ejection command information generation means 103 generates data for determining an ejection pattern and sequence data when the substrate moves relative to the head during ejection. The discharge position control means 102 controls the relative position of the substrate and the head so that the head can scan the substrate surface without excess or deficiency (the head having nozzles moves on the target surface in the coating mode). The ejection control means 106 controls the ejection of liquid droplets from the head in cooperation with the ejection position control means 102 so that the liquid droplets land at a predetermined position (the ejected liquid droplets hit the target surface and stop). The supply means 105 controls the flow rate, density uniformity, and liquid pressure (water head difference) of the liquid (ink) discharged as droplets.

  The overall control unit 101 issues a discharge command information generation command 115 to the discharge command information generation unit 103, and the discharge command information generation unit 103 performs a calculation based on parameters included in the command 115. The discharge command information generation unit 103 generates relative position / orientation command information 110 between the droplet discharge unit 104 and the substrate, and discharge command information 111 which is a discharge pattern corresponding to the relative position / orientation command information 110. The discharge command information 111 is the basis of the operation command (operation state) information 107 of the discharge position control means 102. The relative position / orientation command information 110 is sent to the overall control means 101 and converted into operation command information 107 of the discharge position control means 102. The discharge command information 111 is sent to the discharge control means 106 and held therein.

  Next, the overall control means 101 informs the discharge control means 106 of the run-up distance of the discharge position control means 106 until the start of discharge. Various signals for realizing the distance information and a procedure necessary for transmitting the distance information are included in the discharge control / discharge state information 109. At the same time, the overall control means 101 sends a supply operation command 113 to the supply means 105. The supply means 105 supplies the droplet / discharge means 104 with the solvent / particle mixture liquid 114 adjusted to an appropriate blending ratio.

  As described above, when the data necessary for discharge and the supply state of the liquid are prepared, the overall control unit 101 sends the operation command information 107 to the discharge position control unit 102. Receiving this, the discharge position control means 102 detects (or estimates) the relative position (and orientation) by the relative position measurement means 116 in order to maintain the time-relative relative position and orientation relationship between the droplet discharge means 104 and the substrate. Then, the control operation is performed so that the obtained actual position / orientation information 117 matches the target value included in the operation command information 107. The position detection means 116 uses encoder pulses, but it is also possible to use a potentiometer voltage value or a tachometer voltage value integrated over time.

  In operation, target position / orientation information 108 that changes with time is emitted from the discharge position control means 102. The target position / orientation information 108 is information used for controlling the ejection position, and is generated based on the position / orientation information 117. However, the resolution, generation timing, and the like do not necessarily match the position / orientation information 117. The discharge control means 106 compares the above-mentioned running distance with the target position / posture information 108 and waits for the predetermined distance to finish the running. After determining that the run-up has ended, every time the vehicle moves by a preset amount, the drive signal 112 of the droplet discharge means 104 is output in accordance with the discharge command information 111 to control discharge from each discharge hole.

  FIG. 2 is a specific apparatus configuration example for realizing the droplet discharge apparatus of FIG. The overall control computer 201 uses a PC or the like, and a program for generating application pattern data and sequence data operates. On the other hand, a command is given to each controller and the data is transferred. The stage operation control panel 202 uses a PLC or the like, and controls the relative position and angle of the head 204 according to the transferred sequence data. A liquid crystal substrate 212 having a color cell formed on the surface in the previous process is placed on the stage 208, and is sucked and fixed on the stage surface by a vacuum pump 203. The head 204 is moved from time to time to an arbitrary position on the substrate by positioning mechanisms 209 and 210 in the x and y directions according to a sequence planned in advance. The head 204 is rotated by the head angle determining mechanism 211 with the stage vertical direction as an axis, and the angle can be controlled.

  The nozzle arrangement interval (nozzle pitch) of the head 204 is fixed, but by changing the inclination of the head 204, it is possible to realize various sub-scanning application pitches (droplet discharge intervals) of various widths. The pressure of the liquid mixture discharged from the head as droplets is controlled by the control pump 206, and is adjusted appropriately so that no liquid dripping or air suction occurs in the head 204. The head discharge operation controller 207 takes in the movement displacement amounts 209 to 211 from a detection means such as an encoder. 205 is a mixture liquid supply bowl.

  In the overall control computer 201, in addition to a program group that performs overall control, a program that generates ejection data corresponding to the ejection command information generation unit 103 is executed. Of the generated data, data related to the control of the stage and the like are sent to the operation control panel 202 for the stage and the like, and data related to the discharge data to the head discharge operation controller 207, respectively. When a coating command is issued from the overall control computer 201, the stage operation control panel 202 and the head discharge operation controller 207 exchange data such as a run-up distance and various status signals, and at a predetermined timing at a predetermined position on the substrate. The liquid droplets are discharged while following the above. The substrate suction vacuum pump 203, the supply hydraulic pressure control pump 206, the x-direction moving mechanism 209, the y-direction moving mechanism 210, and the head angle determining mechanism 211 are in response to a command from the overall control computer 201. Control.

  The x-direction moving mechanism 209 moves the table with the substrate 212 adsorbed on the surface in a direction parallel to and parallel to the paper surface. The y-direction moving mechanism 210 is a stage on which a head 204, a mixed liquid supply basket 205, a head discharge operation controller 207, and a head angle determining mechanism 211 are placed in a direction that is orthogonal and horizontal to the moving direction of the table. Move 208. The y-direction moving mechanism 210 is fixed with respect to the stage 208 and moves independently of the x-direction moving mechanism 209. The translation movement of the head itself is only in the y direction, and the relative position of the head and the stage in the x direction is controlled by moving the table on which the substrate is placed in the x direction.

  The head 204 is provided with discharge holes (nozzles) at equal intervals on the opposing surfaces of the table and the substrate. In order to match this interval with the y-direction pitch of the ejection pattern, the head angle determining mechanism 211 rotates the head around an axis parallel to the paper surface and perpendicular to the substrate 212 to take an arbitrary angle with the x direction. Note that FIG. 2 is merely an example of an apparatus configuration. For example, the head moves instead of the stage to change the relative position of the head and the substrate in the x direction, or the relative position is changed by moving the stage in the x and y directions. Etc. are also conceivable.

  The steps performed by the present droplet discharge apparatus are generally as follows. FIG. 19 shows a state (a) viewed from the bottom surface of the head and a state (b) viewed from the side surface of the head. As shown in (a), a plurality of nozzles arranged at equal intervals are provided on the bottom surface 1901 of the head 204. As shown in (b), a liquid mixture (hereinafter referred to as ink) discharged from these nozzles is supplied to the head 204 and circulates through the flow paths 1903 and 1904. The fine particles forming the spacers are uniformly distributed in the ink. Although not shown, each nozzle has a liquid chamber, and the discharge timing can be controlled independently through a drive signal line 1902. The ink 1905 ejected from the nozzles fly as droplets and land on the opposing liquid crystal substrate. In the drawing, the droplets are drawn from all the nozzles, but in actuality, each nozzle is ejected with good timing when it reaches the nearest position to the target position.

  FIG. 20 shows a liquid crystal substrate. As shown on the left side of the figure, one liquid crystal substrate 2005 has a plurality of unit regions (hereinafter referred to as unit application surfaces). Each unit coating surface is separated from the substrate in a later step and becomes a panel portion of the liquid crystal display device. In the unit coating surface area, as shown on the right side of the figure, a set of three color cells for red (R) 2001, green (G) 2002, and blue (B) 2003 are arranged vertically and horizontally by the number of pixels. Yes. This was created by the previous process. In the case of an HDTV-compatible liquid crystal television, the number is, for example, 1920 × 1080. In the present embodiment, the ink 2004 is landed on the gaps between these color cells and at the four corners of each cell.

  FIG. 21 shows the state of ink immediately after landing on the substrate. As shown on the left side of the figure, the microparticles 2101 are distributed in the droplets. As the appropriate time elapses, the solvent portion evaporates, the microparticles gather together, and finally, several layers are formed as shown on the right side of the figure. Since the solvent also contains a component that promotes adhesion to the substrate, the mountain is fixed in this state. When another glass sheet is overlapped in the post-process, the minute particle piles serve as spacers. Liquid crystal is injected into the gap generated by this.

  Next, details of each control unit in FIG. 1 will be described when the droplet discharge device applies a lattice-like pattern to a plurality of regions arranged in the substrate. First, preconditions such as arrangement in a coating region in a substrate, which is a corresponding range of the present invention, are shown.

  FIG. 3 shows a state in which a plurality of application regions (unit application surfaces) are arranged on a substrate made of a single glass. As described above, the glass substrate is separated for each unit coating surface in a subsequent process. A rectangle 301 is a unit application surface, and a parallelogram 302 indicated by a dotted line is one scanning area of the head. A series of scans in which one scan region is arranged without overlapping as shown in FIG. 14 and covers all unit application surfaces arranged vertically and horizontally is collectively referred to as one process.

  As preconditions, the unit application surface (shaded portion) is rectangular, the x-direction length is an x-direction application pitch (discharge position interval, hereinafter referred to as xd), and the y-direction length is an integral multiple of the y-direction application pitch (hereinafter referred to as yd). And xd and yd are common in the process. The length in the y direction of the unit coating surfaces in the same column and the length in the x direction of the unit coating surfaces in the same row are the same. Further, the ejection is performed up to the edge of the unit coating surface.

As shown in FIG. 4, the unit coating surface having the m-th row in the x direction and the n-th column (m = 1... M, n = 1... N) in the y direction When (discharge target position) 401 exists, the number of dots in the x direction is nx, and the number of dots in the y direction is ny, the x direction length h [m] is the expression (1), and the y direction length w [n]. Becomes equation (2).
h = xd * (nx [m] -1) (1)
w = yd * (ny [n] −1) (2)
Incidentally, the area surrounded by the lattice points is one color cell, and there are three small cells of RGB in it. As a premise, the upper side of each unit coating surface in the first row is on the same straight line and parallel to the y-direction coordinate, and the left side of the unit coating surface in the first row is on the same straight line and parallel to the x-direction coordinate. (Gap) is an integral multiple of yd, and the gap in the x direction is an integral multiple of the minimum position measurement resolution (for example, one pulse of the encoder). Based on the above premise, each unit coating surface arranged in the substrate is scanned to land the discharged liquid near the target position.

FIG. 5 is an explanatory diagram showing the relationship between the head position and posture during ejection and the offset between nozzles. The head 501 is tilted so that the y-direction projection of the nozzle pitch (interval between nozzles 502 in the head) Np coincides with yd. In the case of yd <Np, the inclination angle θ is obtained as shown in Equation (3).
θ = arccos (yd / Np) (3)
In the case of (n−1) * Np ≦ yd <n * Np (n> 1), Np is set to n * Np, and nozzles may be used every (n−1). In consideration of comb scanning or the like, several angles are conceivable depending on the relationship between the lengths of yd and Np, but these are not mentioned because they are out of the gist of the present invention. For the sake of simplicity, the following description will be given only for the case of yd <Np, but the same replacement as described above is possible.

As shown in FIG. 5, when the head and the unit application surface are relatively close to each other, the first nozzle (the nozzle that reaches the application area first) and the x of nozzles 2, 3,. The offset for the direction is Δxd, 2 * Δxd,..., (K−1) * Δxd. Here, Δxd can be obtained by the equation (4) or (5) when θ is used. Here, sqrt (x) is a function that returns the positive square root of x.
Δxd = yd * tan θ (4)
Δxd = sqrt (Np * Np−yd * yd) (5)
In FIG. 5, in order for each nozzle of the head to discharge at each discharge target position arranged in a row on the upper side of the unit application surface 301, the discharge timing of the nozzle 1 as the head nozzle is managed. The nozzles 2, 3,..., K may be controlled to discharge at the moment the head advances by Δxd, 2 * Δxd,..., (K−1) * Δxd after passing. . In that case, as shown in FIG. 13A, the relative position of the first and last nozzles is shorter than the x-direction application pitch. In other words, when Nn is the number of nozzles of the head, if the relationship of equation (6) is satisfied, the discharge pulse of the head nozzle is branched to nozzle 2 and the subsequent nozzles and moved at the position offset by the position offset of each nozzle as described above. Just send it out.
xd> (Nn−1) * Δxd (6)
However, in the case of the dimensional relationship as shown in FIG. 13B, that is, the relationship of the expression (7), the first nozzle is moved to the next or subsequent row before the last nozzle reaches the discharge position of the certain row. As a result, a pulse to be generated in the nozzle on the way is accumulated (enters the queue).
xd ≦ (Nn−1) * Δxd (7)
Therefore, for the nozzles other than the head, it is necessary to manage the ejection pulses with a cue or counter and perform control according to increase or decrease of the number. Details of this control method will be described with reference to FIGS.

  FIG. 6 is a block diagram showing the configuration of the discharge control means, control parameters, and information flow. Reference numeral 601 denotes a parameter setting and higher-order timing generation unit, 602 denotes a discharge timing generation unit for each head, 603 denotes a nozzle discharge timing control unit, and 604 denotes a bit mask setting unit. Reference numeral 605 denotes an encoder pulse, reference numeral 606 denotes a flow of bit mask information, and reference numeral 607 denotes a flow of encoder count number information PdT corresponding to an x-direction application pitch.

  In this embodiment, since the application pitch in the x direction is the same for all nozzles, this count number information is set to one value, PdT. However, when patterning with a higher degree of freedom is considered, different application pitches are used for each nozzle. The count number information may be set as PdT (k).

  Reference numeral 608 denotes a flow of encoder count number information Pdt (k) corresponding to a position offset with respect to the head nozzle of the nozzle k (k = 1... Nn, where Nn is the number of nozzles in one head). 609 is a flow of a high-order reset signal, 610 is a flow of the number of application dots nx [i] in the x direction on the i-th unit coating surface to be passed, 611 is a flow of ejection pulses for each head, and 612 is a flow before the bit mask. It is the flow of each nozzle discharge pulse. Reference numeral 613 denotes the flow of each nozzle ejection pulse after passing through the bit mask according to the scanning position (y direction).

  That is, this discharge control means has a control part which controls discharge command and its timing with respect to each nozzle. The control unit for each nozzle has a queue for storing a discharge command multiple times, the control unit for each nozzle has position offset information with respect to the head nozzle in the main scanning direction, and the control unit for each nozzle has a position offset with respect to the head nozzle ( (Displacement of discharge timing) can be set arbitrarily and independently. In addition, the control unit of each nozzle can independently set the interval (position or time) at which multiple discharge commands accumulated in the waiting queue take effect, and the discharge timing of each nozzle is relative to the discharge timing of the representative (first) nozzle. Adjust with position offset. Alternatively, the stage speed and the position offset are converted into a time offset, and the timing is adjusted by a common clock between the nozzles.

Each item of the parameter setting and upper timing generation unit 601 will be described. The application pitch in the x direction needs to be accurately controlled in units of the minimum position resolution xe of the encoder pulse 605 (distance corresponding to one pulse). Therefore, xd is divisible by xe and is in the relationship of equation (8).
PdT = xd / xe (8)
On the other hand, since the position offset of the nozzle k with respect to the first nozzle (here, nozzle 1) is (k−1) * Δxd, it may be divided by xe. However, in general, Δxd is not an integral multiple of xe, and Pdt ( k) is expressed as in equation (9).

Pdt (k) = LEQ ((k−1) * Δxd, xe) (9)
However, LEQ (a, b) is a function that obtains a multiple x * b (x is an integer) of b closest to a and returns x. x_gap [j] (j = 1... M-1) is a gap width between the unit application surface on the j-th row and the unit application surface on the j + 1-th row.

  The bit mask represents whether or not each nozzle is ejected by a bit string. As shown in the preconditions, the y-direction coating pitch in one process is the same, and the y-direction gap is an integral multiple of the coating pitch. For example, in a process as shown in FIG. 14, when a part or all of one scanning region deviates from the unit coating surface in the y direction, the bit string corresponding to the nozzle that scans the deviating part is set to 0, and the ejection pulse By taking the logical product with, discharge can be performed only in a desired region. This is the role of the bit mask.

If the presence or absence of ejection is expressed by the product logic with each bit of the mask pattern, there are five possible bit mask patterns shown in FIGS. Hereinafter, procedures (0) to (4) for dividing one process into one scanning area and obtaining a bit mask for each area will be described.
(0) The number of dots of one scanning width is set to ws = Nn (number of nozzles).
(1) The number of dots in the sub-scanning direction is (ny [1] + ny [2] +... + Ny [N]) on the coating surface when the unit coating surface on the substrate is arranged in N rows. There are (y_gap [1] -1) + (y_gap [1] -1) +... + (Y_gap [N-1] -1) between the planes. However, y_gap [i] is the gap between the unit application surfaces of the i-th column and the (i + 1) -th column and is expressed by the number of coating pitches. Therefore, the number of dots present there is one less than that. Assuming that the total of these is Nd, Nd is obtained by the equation (10).
Nd = (ny [1] + ny [2] +... + Ny [N]) + (y_gap [1] -1) + (y_gap [1] -1) + ... + (y_gap [N- 1] -1) (10)
The number J of scanning planes can be obtained from equation (11). However, the function ceil (x) returns the smallest integer greater than or equal to x.
J = ceil (Nd / ws) (11)
As a result, when one scanning area is numbered sequentially from the left and represented by an index j, the range is j = 1. . . J.
(2) The j-th one scanning area is represented by p [j].
(3) As shown in FIG. 17, the y-coordinates of the left end and the right end of each scanning area are yl [j] and yr [j] (however, the unit application surface origin of the unit application surface in the first row (the upper left corner) ) Is represented by the number of dots with 1). At this time, y_offset [i] represents the y coordinate of the origin of the unit application surface in the i-th column, and is in the relationship of equations (12) to (15).
yl [l] = y_offset [1] = 1 (12)
yl [j] = yl [1] + ws * (j−1) (13)
yr [j] = yl [j] + ws-1 (14)
y_offset [n] = (ny [1] + ny [2] +... + ny [n-1]) +
(y_gap [1] −1) + (y_gap [1] −1) +... + (y_gap [n−1] −1) +1 (15)
However, in the formula (15), n> 1.
(4) Assuming j = 1, the following is executed until j = J is reached.
With regard to p [j] (j = 1... J) (4-1), he is passing through the n-th column unit coated surface (1 ≦ n ≦ N).
(4-2) The case is classified in the range of y where the coated surface exists.

  (A) As shown in FIG. 18A, ((y_offset [n] ≦ yl [j] ≦ y_offset [n] + ny [n] −1) and (y_offset [n] ≦ yr [j] ≦ y_offset [n ] + Ny [n] −1)). That is, if both yl [j] and yr [j] are within the above range, the bit mask is set to all 1 bits, and j = j + 1 is moved to the right one scanning region, and this (a) is repeated. Otherwise consider (b) below.

  (B) As shown in (b-1) and (b-2) of FIG. 18, (y_offset [n] + ny [n] −1 <yr [j]) and (yr [j] <y_offset [n + 1] ]), That is, when the right end of one scanning region currently considered is in the gap, the following (b-1) and (b-2) are examined.

  (B-1) If (yl [j] ≦ y_offset [n] + ny [n] −1), that is, if the left end is in the nth column, bh = (y_offset [n] + ny [n] −1 -As yl [j]) + 1, the bit mask sets bit 1 to bit bh to 1 and the rest to 0. After that, by setting j = j + 1, attention is shifted to one scanning area rightward and the process returns to the process (b). Otherwise consider (c).

  (B-2) If (y_offset [n] + ny [n] -1 <yl [j]), that is, if the left end is also in the gap, the bit mask is set to all 0 bits. By setting j = j + 1, attention is shifted to one scanning area rightward and the process returns to the process (b). Otherwise consider (c).

  (C) As in (c-1) and (c-2) of FIG. 18, if (y_offset [n + 1] ≦ yr [j]), that is, the right end is in the n + 1th column, Consider (c-1) and (c-2).

  (C-1) If (y_offset [n] + ny [n] -1 <yl [j]), that is, only the right end applies to the (n + 1) th column, bt = (yr [j] -y_offset [n + 1]) As the bit mask, bit (Nn−bt + 1) to bit Nn are 1 and the rest are 0. After that, by setting j = j + 1, attention is shifted to one scanning area rightward, and by further setting n = n + 1, the target unit coating surface row is shifted rightward by one. Then, the process returns to (4-1).

  (C-2) If (yl [j] ≦ y_offset [n] + ny [n] −1), that is, the left end is in the nth column and the right end is in the (n + 1) th column, bh = (y_offset [n] + ny [n] -1−yl [j]) + 1, bt = (yr [j] −y_offset [n + 1]) + 1), the bit mask is bit 1 to bit bh and bit (Nn−bt + 1) to bit Nn Is 1 and the rest is 0. By setting j = j + 1, attention is shifted to one scanning area to the right, and by setting n = n + 1, the unit coating surface row to be focused is shifted to the right by one. After that, return to (4-1).

  In the above description, a unit coating surface having a length in the y direction narrower than the width of one scanning region is not assumed. However, it goes without saying that the bit mask may be set in the same procedure as described above. The configuration of the bit mask setting unit 604 can be implemented by a simple logic circuit as shown in FIG. 12, for example.

  Next, the operation of each part in FIG. 6 will be described in detail. Symbols surrounded by rectangles in the discharge timing generation unit 602 for each head and the nozzle discharge timing control unit 603 are storage areas such as registers, and the values of the storage areas can be set for the parameters and the arrow from the upper timing generation unit 601 Indicates that it is structured. In this embodiment, 601 inputs only a parameter for generating a pattern, and the generation rule is realized by a circuit operating in real time at the time of ejection.

  FIG. 7 shows an operation procedure of the parameter setting and upper timing setting unit 601. Each parameter is set by the discharge command information generating means 103. After the start of the process, parameters PdT and Pdt (k) are set in the registers of the per-head ejection timing generation unit 602 and the nozzle ejection timing control unit 603, which are the corresponding modules. At the same time, the bit mask pattern is set to 601 bit mask, and the number of rows i of the unit coating surface array is initialized to 1 (step 701). Next, the number of dots nx [i] in the x direction on the i-th unit application surface is set in the corresponding register in 602 (step 702). FIG. 7 shows the operation of the module 601, but the generation rule can also be realized by software as shown.

  After the stage on which the substrate 209 is placed starts to move, the subordinate system such as 603 is reset when the leading nozzle comes to the front of the upper side of the unit application surface by xd (step 703). From there, it waits until the top nozzle discharges nx [i] times (step 704). If i = M, that is, if it has not reached the unit coating surface of the last row, it is sent from the upper side of the next unit coating surface to xd before, the number of rows is increased by 1, and the processing returns to 702 (steps 705 and 707). When scanning to the unit coating surface of the last row is completed, one scanning is finished (step 706). When scanning is completed for all scanning regions, the process ends. Otherwise, the process returns to 701 to perform the next one scan (step 708).

  FIG. 8 is a block diagram showing the configuration and operation of the discharge timing generator 602 for each head. In the figure, reference numeral 801 denotes a block that counts the number of discharges nx and performs comparison processing, and 802 denotes a block that counts the number of encoder pulses corresponding to the movement distance and performs comparison processing. The encoder pulse is controlled to pass by AND logic or the like. Here, it is assumed that the latch output is ON, that is, the encoder pulse is passed.

  FIG. 9 is a flowchart showing the operation of the discharge timing generation unit 602 for each head. Although the blocks 801 and 802 in FIG. 8 basically operate in parallel, it is difficult to describe the operation in a normal flowchart because one output is involved in the transition of the other operation state. Here, the expression is expanded by using symbols not shown in the normal flowchart in the figure. That is, an arrow with a black triangle head is a state transition path that can also be seen in a normal flow chart, a thick horizontal bar is a gate that suppresses the state transition until the trigger input, and an arrow with a V-shaped head is a trigger that opens the gate. In FIG. 8, it is assumed that one single pulse (rise-finite time elapse-fall) is triggered once.

  Initially, the discharge timing generation unit 602 is in a waiting state for resetting from the parameter setting and upper timing setting unit 601 (step 901). When an upper reset is input thereto, the counter T and counter nx are cleared to zero, and at the same time the latch output is set to L (step 902). This opens the encoder gate and allows the encoder pulse to pass. When an encoder pulse is waited in this state (step 903), the encoder pulse is input as a trigger as the stage moves, and the number of pulses is counted by the counter T (step 904). The value of the counter T and the register value PdT are compared at the count-up timing of the counter T (step 905), and when they match (step 906), a count-up pulse propagated to 603 of each nozzle is output (step 907). ) If PdT> T, return to 903 and wait for encoder pulse.

  The pulse output at step 907 is also transmitted to the counter nx (step 908). With this pulse as a trigger, the state transitions and the value of the counter nx is incremented by 1 (step 910). The value is compared with the register value nx at the timing when the counter nx counts up (step 911), and when they match (step 912), latch set (output H) is performed to prevent the encoder pulse from passing (step 913). Return to the upper reset wait state 901. If they do not match, the process proceeds to a state of waiting for a count-up pulse generated at 907 (step 909).

  Although FIG. 8 represents the configuration of the ejection timing generation unit 602 as a hardware image, any implementation is possible as long as the operation is performed as shown in FIG. 9, and realization with software is also conceivable. Needless to say.

  FIG. 10 is a block diagram illustrating the configuration and operation of the nozzle discharge timing control unit 603. In the figure, reference numeral 1001 is a block for counting and comparing the ejection pulses, 1002 is a block for counting and comparing the number of encoder pulses corresponding to the distance offset from the head nozzle, and 1003 is the number of encoder pulses corresponding to the x-direction application pitch. Is a block for counting and comparing.

  As in the blocks 801 and 802 in FIG. 8, 1001 to 1003 basically operate in parallel. However, since the output and the transition of the operation state interfere with each other, this also describes the operation in the normal flowchart. Is difficult. When the discharge pulse from 602 is transmitted to the control unit for nozzle k and the counter P counts up in 1001, the value is 1, that is, when the value of P transitions from 0 to 1, the position offset is Pdt (k) (After moving by Pdt (k) from the position at the moment of counting up), a discharge pulse is generated once (1002). The counter P is counted down by returning the nozzle k discharge pulse which is the output of this control unit, and when the result is 1 or more, the position offset is added by PdT and the discharge pulse is generated once. If it is 0, nothing is done (1003).

  FIG. 11 is a flowchart showing details of the operation of the nozzle discharge timing control unit. Also in this figure, the expression of the flowchart is extended using the same symbols as in FIG. In the figure, the portion surrounded by a broken line 1130 represents the operation of the block 1001, the portion surrounded by 1131 represents the operation of the block 1002, and the portion surrounded by 1132 represents the operation of the block 1003.

  First, after the counter P is cleared to zero by the upper reset, the control unit 603 is in a trigger pulse waiting state for causing a state transition (step 1101). The state transitions when a discharge pulse for each head outputted every xd movement comes from the upper 602, and the value of the counter P is incremented by 1 (step 1102). Immediately after the value of P increases, this value is compared with 1 (step 1103). If the count value is greater than 1, the process returns to 1101 to wait for a pulse (step 1104). When the count value of P is equal to 1, the counter t used for comparison with Pdt (k) is reset (zero cleared) and latch reset (L) with the same logic as in FIG. 9 so that the encoder pulse can pass. (Step 1105). In step 1105, state transition arrows come from the left and right. The arrow that goes up to the upper left indicates that the counter P returns to the pulse waiting state.

  The right arrow indicates that the processing related to the counter t starts from 1106, and the value of the counter t is compared with the register value Pdt (k) (step 1106). If they do not match (step 1107), the encoder pulse waiting state for the gate trigger is entered (step 1110), and the value of the counter t is incremented by 1 each time an encoder pulse comes (step 1111), and the comparison in 1106 matches. Repeat this until. Thereafter, when the value coincides with 1107, a discharge pulse of nozzle k is generated (step 1108), and at the same time, latch setting (H) is performed with this pulse to suppress the input of the encoder pulse (step 1109).

  This ejection pulse acts as a countdown pulse for the counter P that is in a pulse waiting state in step 1101. That is, when the upper right gate in the figure is opened with the pulse from step 1109 as a trigger, the value of the counter P is decremented by 1 (step 1112). The result is compared with 0 (step 1113), and if they match, the counter P in which the number of pulses waiting for ejection becomes 0 returns to the state waiting for pulses. Since the upper right gate is closed at this time, if an ejection pulse for each head comes from the upper position in this state, the upper left gate opens and the state shifts to the left. If it is determined that there is a mismatch in step 1114, the counter T used for comparison with PdT is reset (zero cleared) and latch reset (L) with the same logic as in FIG. 9 so that the encoder pulse can pass (step 1115). As in step 1105, the arrow that goes up to the left indicates that the counter P returns to the pulse waiting state.

  On the other hand, the counter T starts from a pulse waiting state (step 1116). First, the state is changed by opening the gate using the encoder pulse as a trigger, and the value of the counter T is incremented by 1 (step 1117). The result is compared with the register value PdT (step 1118), the process returns to the pulse waiting state (step 1116) until it is determined that the values match in step 1119, and steps 1116 to 1118 are repeated. If it is determined in step 1119 that they match, a discharge pulse for nozzle k is generated (step 1120), and the latch reset in step 1115 is set (H) using that pulse as a trigger to suppress encoder pulse input. (Step 1121). As in the case of transition from step 1107, this ejection pulse further acts as a countdown pulse for the counter P that is in a pulse waiting state in step 1101.

  Like FIG. 8 and FIG. 9, FIG. 10 represents the configuration as a hardware image by a circuit. However, any implementation may be used as long as the operation is performed as shown in FIG. It goes without saying that realization in Japan is also conceivable.

The above description is a case where each scanning area in the process is scanned in only one direction of the forward path. However, reciprocal scanning is essential to increase the throughput of the manufacturing apparatus. FIG. 15 shows an example of reciprocal scanning. In the forward path (a), the nozzle 1 is the head nozzle, but in the backward path (b), the nozzle Nn (Nn is the number of nozzles in the head) is the head. In that case, Pdt (k) may be set as shown in equation (16).
Pdt (k) = (Nn−k) * Δxd (16)
Further, as shown in FIG. 22, in order to apply in a so-called staggered pattern, xd is replaced with 2 * xd in equation (8) and Pdt may be set as in equation (17).
PdT = 2 * xd / xe (17)
That is, by adding the position offset of xd only to the even nozzles in the equation (9), it can be realized as the equation (18).

Pdt (k) = LEQ ((k−1) * Δxd + xd * ((k−1) mod2), xe) (18)
However, mod is a remainder operator, and a mod b (a and b are integers) returns a remainder obtained by dividing a by b. In addition to this, it goes without saying that various patterns can be applied by changing the settings of PdT and Pdt (k).

  In this embodiment, as shown in FIGS. 6 to 12, the position detection is performed by counting the encoder pulses. This is performed by using the potentiometer voltage value, the integrated value of the tachometer voltage, or the second-order integration of the acceleration sensor. You may do by value. At this time, in the present embodiment, the rising edge of the encoder pulse is used to generate the timing of the circuit operation. This is calculated by using the potentiometer voltage value, the integrated value of the tachometer generator, or the second-order integrated value of the acceleration sensor and the fixed interval. A timing comparison may be made when the result is larger than the threshold value set in (2).

  In order to configure the blocks 601 to 604 that operate with the logic and timing as described above, the circuit logic can be designed by describing it in a language, the circuit data is generated by processing the language, and It is preferable to use an FPGA that can be mounted. However, depending on conditions, a similar operation can be realized by a processor board equipped with an operating system capable of real-time multitask processing and an I / O coupled thereto. It is considered appropriate to configure the above two in accordance with the processing cycle, processing time, required calculation complexity, and the like.

  As described so far, according to the present invention, it is possible to significantly reduce data by expressing the nozzle discharge pattern by the inter-nozzle position offset corresponding to the head tilt and the application pitch. Furthermore, based on this, pattern data and start position coordinate data necessary for various application examples can be obtained without performing coordinate calculation itself again. Thereby, it is possible to suppress an increase in the calculation time of data generation in the calculation device, the amount of memory required for data retention, and the increase in communication time between the data generation means and the head control means. For this reason, high-speed and large-capacity resources are not required for realizing the performance, and throughput can be improved and apparatus cost can be reduced.

  The description in the embodiment of the present invention mainly relates to an apparatus for the purpose of spacer formation, but by changing the contents of functional droplets, color filter production, organic EL production, metal wiring formation, lens formation, It can also be used for resist formation and light diffuser formation.

1 is a block diagram showing a configuration of a droplet discharge device according to an embodiment of the present invention. The apparatus block diagram which shows the specific structure of a droplet discharge apparatus. Explanatory drawing which shows arrangement | positioning of the application | coating area | region in a board | substrate. Explanatory drawing of the parameter in a unit application surface. Explanatory drawing which shows the relationship between the head position and orientation at the time of discharge, and the offset between nozzles. The block diagram which shows the structure of a discharge control means, the parameter of control, and the flow of information. The flowchart which shows the flow of operation | movement of a parameter setting and a high-order timing generation part. The block diagram which shows the structure and operation | movement of a discharge timing generation part. The flowchart which shows the flow of operation | movement of a discharge timing generation part. The block diagram which shows the structure and operation | movement of a discharge timing control part. The flowchart which shows the flow of operation | movement of a discharge timing control part. The circuit diagram by one Example of a bit mask setting part. Explanatory drawing which shows the positional relationship of a head inclination, a nozzle, and a grating | lattice. Explanatory drawing which shows the arrangement | positioning relationship of one scanning area | region within an application | coating area | region. Explanatory drawing which shows the head nozzle in an outward / return path. Explanatory drawing which shows the 5 types of assumed bit mask patterns. Explanatory drawing which shows the positional relationship of each scanning area | region and an application surface. Explanatory drawing which shows the positional relationship of the scanning area | region which is paying attention and the nth / n + 1th line unit application surface. The block diagram which shows the state seen from the bottom face of the head, and the state seen from the side surface. The top view of a liquid crystal substrate. Explanatory drawing which shows the state of the ink immediately after board | substrate landing. Explanatory drawing which shows the arrangement | positioning relationship of the scanning apply | coated to a zigzag form.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 101 ... Overall control means, 102 ... Discharge position control means, 103 ... Discharge command information generation means, 104 ... Droplet discharge means, 105 ... Supply means, 106 ... Discharge control means, 107 ... Operation command (operation state information), 108 ... target position and orientation information, 109 ... discharge control information and discharge state information, 110 ... position and orientation command information, 111 ... discharge command information, 112 ... drive signal, 113 ... supply operation command / operation state information, 114 ... solvent / particle Liquid mixture, 115 ... Discharge command information generation command, 116 ... Relative position / orientation measuring means, 117 ... Relative position / orientation information, 201 ... Computer for overall control, 202 ... Operation control panel for stage etc., 203 ... Vacuum pump for substrate adsorption, 204 ... Functional droplet discharge head, 205 ... Mixed liquid supply tank, 206 ... Supply liquid pressure control pump, 207 ... Head discharge operation controller, 208 ... Stage (base), 209 ... X direction moving mechanism, 210 ... Y direction movement Mechanism, 211 ... Head angle determining mechanism, 212 ... Substrate, 301 ... Unit Fabric surface, 302 ... one scanning area of head, 401 ... lattice point that is application target position, 501 ... head, 502 ... nozzle, 601 ... parameter setting and upper timing generation unit, 602 ... discharge timing generation unit, 603 ... nozzle discharge Timing control unit, 604 ... bit mask setting unit, 605 ... encoder pulse, 606 ... flow of bit mask information, 607 ... flow of encoder count number information PdT, 608 ... flow of encoder count number information Pdt (k), 801 ... discharge Block for counting the number of times nx and performing comparison processing, 802... Block for counting the number of encoder pulses corresponding to the moving distance and performing comparison processing, 1001... Block for counting discharge pulses and performing comparison processing, 1002. Block for counting and comparing the number of encoder pulses corresponding to the offset, 1003... Counting and comparing the number of encoder pulses corresponding to the application pitch in the x direction. Cormorant block.

Claims (11)

A liquid droplet ejection apparatus that ejects functional liquid droplets onto a substrate having one or more target regions in a plane in which a plurality of pixel pieces are arranged in a row direction and a column direction orthogonal to each other,
A droplet discharge means having a plurality of discharge holes arranged in parallel to the substrate surface; a discharge control means for performing discharge control of each hole of the droplet discharge means based on discharge command information; and the droplet discharge means Position / orientation command information indicating information on the relative position / orientation in a plane passing through the substrate surface, and discharge command information generating means for generating the discharge command information corresponding thereto,
Supply means for supplying a mixture of a solvent and fine powder to the droplet discharge means;
A discharge position control means for controlling the in-plane relative position and orientation of the droplet discharge means and the substrate surface based on the position and orientation command information generated by the discharge command information generation means;
A relative position measuring means for detecting or estimating an in-plane relative position and orientation of the droplet discharge means and the substrate surface;
A general control unit that arbitrates information exchange between the discharge command information generation unit, the discharge position control unit, the discharge control unit, and the supply unit and issues an operation command to each unit;
The discharge command information includes the discharge start relative position of the reference discharge hole that first reaches the target area at the start of the discharge operation, the number of discharges, the discharge distance interval or the discharge time interval, and other discharge holes related to the movement direction during discharge. Unit discharge command information, which is a set of the difference in discharge position between the reference discharge hole and the reference discharge hole, or the difference in time at which the other discharge hole and the reference discharge hole pass, and actual discharge of the discharge holes during the discharge operation A droplet discharge apparatus comprising a combination of discharge mask information indicating holes and performing discharge control of the plurality of hole holes.   In the droplet discharge means, a plurality of discharge holes are linearly arranged at equal intervals, and the relative position between the droplet discharge means and the substrate is set in a state where the linear direction has an arbitrary angle with respect to the row direction and the column direction. , Detecting or estimating while moving in the row direction or column direction by the discharge position control means, and controlling the discharge of functional droplets from each discharge hole based on the discharge command information corresponding to the relative position. The droplet discharge device according to claim 1.   2. The liquid droplet ejection apparatus according to claim 1, wherein the relative position measurement unit expresses detection of the relative position or movement distance by an integral multiple of the minimum position resolution xe.   The difference in position between the reference discharge hole and another discharge hole is expressed by a value whose theoretical value is quantized with the minimum position resolution xe and whose error from the theoretical value is minimized. 4. The droplet discharge device according to 3.   2. The liquid according to claim 1, wherein the discharge mask information used by the droplet discharge means is expressed by a bit string in which the presence / absence of droplet discharge from one discharge hole is expressed by one bit and arranged by the number of discharge holes. Drop ejection device.   2. The liquid according to claim 1, wherein the relative position and orientation control during the droplet discharge according to the discharge command information of the discharge position control unit performs only translation in the column or row direction. Drop ejection device.   2. The droplet discharge apparatus according to claim 1, wherein the position / orientation command information includes an inclination angle of the droplet discharge unit, a start position coordinate of one or more translations, and an identifier of discharge command information used for each translation. .   In the discharge process for one target region or a collective region composed of a set of target regions, the relative movement of the droplet discharge means with respect to the substrate is a continuous reciprocal translation operation along one direction, and the next translation from the end of a certain translation The movement operation from the translation end position to the next translation start position is performed before the start of the movement, and the reciprocation and the movement between them are repeated until the passage area of the droplet discharge means includes the target area or the collection area. The droplet discharge device according to claim 1.   The discharge control means includes a parameter setting and timing generation unit, a discharge timing generation unit for each head, a discharge timing control unit for each nozzle, and a bit mask setting unit, each of which is configured by hardware or software The droplet discharge device according to claim 1, wherein A method for controlling a droplet discharge apparatus, which discharges functional droplets to a substrate having one or more target regions in a plane in which a plurality of pixel pieces are arranged in a row direction and a column direction orthogonal to each other,
When the droplet discharge means is arranged in parallel with the substrate surface and has a plurality of discharge holes, and the discharge control from each hole is performed based on discharge command information, the droplet discharge means and the substrate surface are in-plane relative Detect or estimate the position and orientation, and generate position and orientation command information indicating information on the relative position and orientation in the plane through the substrate surface, and discharge command information corresponding thereto,
The discharge command information includes the discharge start relative position of the reference discharge hole that first reaches the target area at the start of the discharge operation, the number of discharges, the discharge distance interval or the discharge time interval, and other discharge holes related to the movement direction during discharge. Unit discharge command information, which is a set of the difference in discharge position between the reference discharge hole and the reference discharge hole, or the difference in time at which the other discharge hole and the reference discharge hole pass, and actual discharge of the discharge holes during the discharge operation A method for controlling a droplet discharge apparatus, comprising: a combination of discharge mask information indicating holes, wherein discharge control of the plurality of hole holes is performed. A liquid crystal substrate forming apparatus for forming a spacer on a liquid crystal substrate glass,
The liquid crystal substrate forming apparatus according to claim 1, wherein the spacer is formed by using the droplet discharge device according to claim 1.

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