JP2008294592A - Piezoelectric device for surface mounting - Google Patents

Piezoelectric device for surface mounting Download PDF

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Publication number
JP2008294592A
JP2008294592A JP2007136065A JP2007136065A JP2008294592A JP 2008294592 A JP2008294592 A JP 2008294592A JP 2007136065 A JP2007136065 A JP 2007136065A JP 2007136065 A JP2007136065 A JP 2007136065A JP 2008294592 A JP2008294592 A JP 2008294592A
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Prior art keywords
opening end
crystal piece
metallic ring
container body
main body
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JP2007136065A
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Japanese (ja)
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Makoto Shiroishi
誠 城石
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Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce height dimensions of a surface mounting crystal device hermetically sealed by seam welding. <P>SOLUTION: In the surface mounting piezoelectric device wherein at least a crystal piece 2 is stored in a recessed container main body 1 made of laminated ceramics and the extended outer peripheral part of a drawing electrode of the crystal piece 2 is fixed by a conductive adhesive 10 and a metallic cover 3 is joined to a metallic ring 6 provided to the opening end face of the container main body 1, the metallic ring 6 is partially buried in the opening end face of the container main body 1 and has its tip end side projected. Joining strength can be maintained same as conventional devices because of seam welding using the metallic ring. Since the metallic ring 6 is partially buried in the opening end face, height dimensions can be reduced. Since a part of the side face where the metallic ring 6 is buried is not exposed, electric short circuit to an excess portion of the conductive adhesive can be prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は表面実装用の圧電デバイス(以下、表面実装デバイスとする)を技術分野とし、特にシーム溶接によって気密封止した水晶デバイスに関する。   The present invention relates to a surface mount piezoelectric device (hereinafter referred to as a surface mount device), and more particularly to a quartz crystal device hermetically sealed by seam welding.

(発明の背景)
表面実装用の圧電デバイス例えば水晶振動子(以下、表面実装振動子とする)は小型・軽量であることから、例えば携帯電話で代表される携帯型の電子機器に周波数や時間の基準源として内蔵される。このようなものの一つに、シーム溶接によって気密封止した表面実装振動子がある。
(Background of the Invention)
Surface mount piezoelectric devices such as crystal resonators (hereinafter referred to as surface mount resonators) are small and light, so they are built into portable electronic devices such as mobile phones as a reference source for frequency and time. Is done. One of these is a surface-mounted vibrator that is hermetically sealed by seam welding.

(従来技術の一例)
第3図は一従来例を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は水晶片の平面図である。
(Example of conventional technology)
FIGS. 3A and 3B are diagrams for explaining a conventional example. FIG. 3A is a cross-sectional view of a surface mount vibrator, and FIG. 3B is a plan view of a crystal piece.

表面実装振動子は凹状とした容器本体1内に水晶片2を収容し、金属カバー3を被せて密閉封入してなる。容器本体1は底壁1aと枠壁1bとの積層セラミックからなり、水晶保持端子4を内底面に有する。水晶保持端子4は積層面を経て例えば一組の対角部となる外底面の実装端子5に電気的に接続する。   The surface-mount oscillator is formed by housing a crystal piece 2 in a container body 1 having a concave shape and covering a metal cover 3 in a hermetically sealed manner. The container body 1 is made of a laminated ceramic of a bottom wall 1a and a frame wall 1b, and has a crystal holding terminal 4 on the inner bottom surface. The crystal holding terminal 4 is electrically connected to the mounting terminal 5 on the outer bottom surface which becomes a pair of diagonal portions, for example, through the laminated surface.

容器本体1の開口端面には図示しない金属膜が設けられ、シーム溶接用の金属リング6が銀ロウ7によって接合される。金属膜は容器本体1の枠壁1bに設けられたスルーホール8及び積層面を経て、他組の対角部となる外底面のアース端子としての実装端子5に接続する。   A metal film (not shown) is provided on the opening end face of the container body 1, and a metal ring 6 for seam welding is joined by a silver solder 7. The metal film is connected to the mounting terminal 5 as the ground terminal on the outer bottom surface which is a diagonal portion of another set through the through hole 8 provided in the frame wall 1b of the container body 1 and the laminated surface.

水晶片2は両主面に励振電極9aを有し、一端部両側に引出電極9bを延出する。そして、引出電極9bの延出した一端部両側が導電性接着剤10によって容器本体1の水晶保持端子4に固着される。金属カバー3は図示しない一対のローラ電極を用いたシーム溶接によって金属リング6に接合され、開口面を気密封止する。そして、外底面のアース端子としての実装端子5に接続したシールド構造とする。
特開2003−8288号公報 特開平11−312748号公報 特開2004−297620号公報
The quartz crystal piece 2 has excitation electrodes 9a on both main surfaces, and extends extraction electrodes 9b on both sides of one end. Then, both ends of the extended end portion of the extraction electrode 9 b are fixed to the crystal holding terminal 4 of the container body 1 by the conductive adhesive 10. The metal cover 3 is joined to the metal ring 6 by seam welding using a pair of roller electrodes (not shown) to hermetically seal the opening surface. And it is set as the shield structure connected to the mounting terminal 5 as a ground terminal of an outer bottom face.
JP 2003-8288 A JP 11-31748 A JP 2004-297620 A

(従来技術の問題点)
しかしながら、上記構成の表面実装振動子では、シーム溶接用の金属リング6を有するので、高さ寸法が大きくなる問題があった。このことから、例えば金属リング6に代えて金属厚膜を用いたダイレクトシームの採用が考えられる(特許文献2)。しかし、この場合は、金属厚膜との接合なので接合強度が小さくなる。また、ローラ電極による溶接時に容器本体1に直接的に押圧力が作用し、容器本体1を破損させる等の問題があった。
(Problems of conventional technology)
However, the surface-mounted vibrator having the above configuration has a problem that the height dimension becomes large because the metal ring 6 for seam welding is provided. From this, for example, it is conceivable to employ a direct seam using a metal thick film instead of the metal ring 6 (Patent Document 2). However, in this case, the bonding strength is reduced because of the bonding with the thick metal film. In addition, there is a problem that a pressing force is directly applied to the container main body 1 at the time of welding with the roller electrode to damage the container main body 1.

また、容器本体1の枠壁1bを金属枠として兼用としたものもあるが(特許文献3)、この場合は、導電性接着剤10の余剰分が金属枠に付着して電気的短絡を生ずる問題があった。   Moreover, although there exists what used the frame wall 1b of the container main body 1 as a metal frame (patent document 3), the surplus of the conductive adhesive 10 adheres to a metal frame, and an electrical short circuit is produced in this case. There was a problem.

(発明の目的)
本発明は高さ寸法を小さくし得る表面実装デバイスを提供することを目的とする。
(Object of invention)
An object of this invention is to provide the surface mount device which can make a height dimension small.

本発明は、積層セラミックからなる凹状とした容器本体に少なくとも水晶片を収容し、前記水晶片の引出電極の延出した外周部を導電性接着剤によって固着し、前記容器本体の開口端面に設けられた金属リングに金属カバーを接合してなる表面実装用の圧電デバイスにおいて、前記容器本体の開口端面内に前記金属リングの一部を埋設して先端側を突出した構成とする。   According to the present invention, at least a crystal piece is accommodated in a concave container body made of a laminated ceramic, and an outer peripheral portion of the extraction electrode of the crystal piece is fixed by a conductive adhesive, and provided on the opening end surface of the container body. In the surface mounting piezoelectric device in which a metal cover is bonded to the metal ring thus formed, a part of the metal ring is embedded in the opening end surface of the container body, and the tip side is projected.

このような構成であれば、金属リングを使用したシーム溶接なので接合強度を従来通りに維持する。そして、金属リングの一部が開口端面内に埋設するので、高さ寸法を小さくできる。また、金属リングの埋設した一部の側面は露出しないので、導電性接着剤の余剰分との電気的短絡を防止する。   With such a configuration, since the seam welding uses a metal ring, the joining strength is maintained as usual. And since a part of metal ring is embed | buried in an opening end surface, a height dimension can be made small. In addition, since a part of the side surface where the metal ring is embedded is not exposed, an electrical short circuit with an excess of the conductive adhesive is prevented.

(実施態様項)
請求項1において、前記水晶片の引出電極の延出した外周部は前記容器本体の開口端面よりも低い位置にする。これにより、導電性接着剤の余剰分による電気的短絡を確実に防止する。
(Embodiment section)
In Claim 1, the outer peripheral part which the extraction electrode of the said crystal piece extended is made into a position lower than the opening end surface of the said container main body. Thereby, the electrical short circuit by the excess part of an electroconductive adhesive agent is prevented reliably.

第1図は本発明の一実施形態を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は容器本体の平面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。   FIG. 1 is a view for explaining an embodiment of the present invention. FIG. 1 (a) is a cross-sectional view of a surface-mounted vibrator, and FIG. 1 (b) is a plan view of a container body. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.

表面実装振動子は前述したように底壁1aと枠壁1bとの積層セラミックからなり、凹状とした容器本体1の内底面に設けた水晶保持端子4に、引出電極9bの延出した水晶片2の一端部両側を導電性接着剤10によって固着する。水晶保持端子4は一組の対角部の外底面に設けた実装端子5に接続する。   As described above, the surface mount vibrator is made of the laminated ceramic of the bottom wall 1a and the frame wall 1b, and the crystal piece in which the extraction electrode 9b extends to the crystal holding terminal 4 provided on the inner bottom surface of the concave container body 1. Both sides of one end of 2 are fixed by the conductive adhesive 10. The crystal holding terminal 4 is connected to a mounting terminal 5 provided on the outer bottom surface of a pair of diagonal portions.

そして、容器本体1の開口端面に設けた金属リング6にシーム溶接によって金属カバー3を接合してなる。金属カバー3は他組の対角部のアース端子としての実装端子5に接続する。   And the metal cover 3 is joined to the metal ring 6 provided in the opening end surface of the container main body 1 by seam welding. The metal cover 3 is connected to a mounting terminal 5 as a ground terminal of another set of diagonal portions.

ここでのシーム溶接用の金属リング6は、容器本体1の開口端面(枠壁端面)に一部が埋設して表面側が開口端面から突出する。具体的には、容器本体1の枠壁1b端面に型枠によって、枠壁1b上面を周回する環状の溝11を設けるとともに、他組の対角部に貫通孔12を設ける。溝11及び貫通孔12の内表面には下地電極としての例えばタングステン(W)を印刷する(所謂スルーホール8)。   The metal ring 6 for seam welding here is partially embedded in the opening end surface (frame wall end surface) of the container body 1 and the surface side protrudes from the opening end surface. Specifically, an annular groove 11 that circulates around the upper surface of the frame wall 1b is provided on the end surface of the frame wall 1b of the container body 1 by a mold, and through holes 12 are provided in the other diagonal portions. For example, tungsten (W) as a base electrode is printed on the inner surface of the groove 11 and the through hole 12 (so-called through hole 8).

そして、水晶保持端子4及び実装電極としてのWによる下地電極が形成された底壁1aに、タングステンが内表面に形成されて環状の溝11及び貫通孔12を有する枠壁1bを積層して焼成する。焼成後には例えばニッケル(N)及び金(Au)が電解メッキによって露出したタングステン上に形成される。その後、環状の溝11内に銀ロウ7を流し込み、金属リング6の一部を埋設して接合する。   Then, a frame wall 1b in which tungsten is formed on the inner surface and has an annular groove 11 and a through hole 12 is laminated and fired on the bottom wall 1a on which the crystal holding terminal 4 and the base electrode made of W as a mounting electrode are formed. To do. After firing, for example, nickel (N) and gold (Au) are formed on the exposed tungsten by electrolytic plating. Thereafter, silver solder 7 is poured into the annular groove 11, and a part of the metal ring 6 is buried and joined.

そして、引出電極9bの延出した水晶片2の一端部両側を前述のように導電性接着剤10によって内底面の水晶保持端子4に固着する。この場合、水晶片2の一端部両側の高さは容器本体1(積層セラミック)の枠壁1b上面よりも下方の低い位置とし、ここでは導電性接着剤10も含めて枠壁1b上面よりも低い位置とする。そして、金属カバー3を一対の電極ローラを用いたシーム溶接によって金属リング6に接合する。   Then, both ends of one end portion of the crystal piece 2 from which the extraction electrode 9b extends are fixed to the crystal holding terminal 4 on the inner bottom surface by the conductive adhesive 10 as described above. In this case, the height of both sides of one end of the crystal piece 2 is lower than the upper surface of the frame wall 1b of the container body 1 (laminated ceramic), and here the conductive adhesive 10 and the upper surface of the frame wall 1b are also included. Lower position. Then, the metal cover 3 is joined to the metal ring 6 by seam welding using a pair of electrode rollers.

このような構成であれば、発明の効果の欄に記載したように、金属リング6を使用したシーム溶接なので、金属リング6との接合強度を従来通りに維持する。そして金属リング6の一部が容器本体1の開口端面内に埋設するので、高さ寸法を小さくできる。   With such a configuration, as described in the column of the effect of the invention, seam welding using the metal ring 6 is performed, so that the bonding strength with the metal ring 6 is maintained as usual. And since a part of metal ring 6 is embed | buried in the opening end surface of the container main body 1, a height dimension can be made small.

また、金属リング6の埋設した一部の側面は枠内となって露出しないので、導電性接着剤10の余剰分との電気的短絡を基本的に防止する。ここでは、水晶片2の引出電極9bの延出した外周部は導電性接着剤10を含めて容器本体1の開口端面よりも低い位置にするので、導電性接着剤10の余剰分による電気的短絡を確実に防止する。   Further, since some of the side surfaces embedded with the metal ring 6 are not exposed within the frame, an electrical short-circuit with the surplus of the conductive adhesive 10 is basically prevented. Here, since the extended outer peripheral portion of the extraction electrode 9b of the crystal piece 2 is positioned lower than the opening end surface of the container body 1 including the conductive adhesive 10, the electrical conductivity due to the excess of the conductive adhesive 10 Make sure to prevent short circuit.

(他の事項)
上記実施形態では金属リング6を開口端面に埋設するとしたが、例えば第2図に示したように、金属リング6の外側面は露出してもよい。ここでは、この場合も含めて埋設とする。また、表面実装振動子を例として説明したが、例えば発振回路を形成するICチップとともに水晶片2を収容した表面実装発振器でも適用できる。この場合、両主面に凹部を有して一方の凹部に水晶片2を、他方の凹部にICチップを収容した場合でも同様である。
(Other matters)
In the above embodiment, the metal ring 6 is embedded in the opening end surface. However, as shown in FIG. 2, for example, the outer surface of the metal ring 6 may be exposed. Here, it is assumed to be buried including this case. Further, although the surface mount vibrator has been described as an example, for example, a surface mount oscillator in which the crystal piece 2 is housed together with an IC chip that forms an oscillation circuit can be applied. In this case, the same applies to the case where the concave portions are provided on both main surfaces, the crystal piece 2 is accommodated in one concave portion, and the IC chip is accommodated in the other concave portion.

本発明の一実施形態を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は容器本体の平面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining one Embodiment of this invention, The figure (a) is sectional drawing of a surface mount vibrator | oscillator, The figure (b) is a top view of a container main body. 本発明の一実施形態の他の例を説明する表面実装振動子の断面図である。It is sectional drawing of the surface mount vibrator explaining the other example of one Embodiment of this invention. 一従来例を説明する図で、同図(a)は表面実装振動子の断面図、同図(b)は水晶片の平面図である。It is a figure explaining one prior art example, the figure (a) is a sectional view of a surface mount vibrator, and the figure (b) is a top view of a crystal piece.

符号の説明Explanation of symbols

1 容器本体、2 水晶片、3 金属カバー、4 水晶保持端子、5 実装端子、6 金属リング、7 銀ロウ、8 スルーホール、9 電極、10 導電性接着剤、11 環状の溝、12 貫通孔。   DESCRIPTION OF SYMBOLS 1 Container body, 2 Crystal piece, 3 Metal cover, 4 Crystal holding terminal, 5 Mounting terminal, 6 Metal ring, 7 Silver brazing, 8 Through hole, 9 Electrode, 10 Conductive adhesive, 11 Annular groove, 12 Through-hole .

Claims (2)

積層セラミックからなる凹状とした容器本体に少なくとも水晶片を収容し、前記水晶片の引出電極の延出した外周部を導電性接着剤によって固着し、前記容器本体の開口端面に設けられた金属リングに金属カバーを接合してなる表面実装用の圧電デバイスにおいて、前記容器本体の開口端面内に前記金属リングの一部を埋設して先端側を突出したことを特徴とする表面実装用の圧電デバイス。   A metal ring provided on the opening end surface of the container body, in which at least a crystal piece is accommodated in a concave container body made of a multilayer ceramic, and an outer peripheral portion of the crystal piece with the lead electrode extended is fixed by a conductive adhesive. A surface mounting piezoelectric device having a metal cover bonded to a surface thereof, wherein a part of the metal ring is embedded in the opening end surface of the container body and the tip side protrudes. . 請求項1において、前記水晶片の引出電極の延出した外周部は前記容器本体の開口端面よりも低い位置にある表面実装用の圧電デバイス。   2. The surface-mount piezoelectric device according to claim 1, wherein an extended outer peripheral portion of the extraction electrode of the crystal piece is located at a position lower than an opening end surface of the container body.
JP2007136065A 2007-05-23 2007-05-23 Piezoelectric device for surface mounting Pending JP2008294592A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022012045A1 (en) * 2020-07-15 2022-01-20 青岛凯瑞电子有限公司 Low-resistance high-current-carrying lead structure of surface-mounted ceramic metal housing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022012045A1 (en) * 2020-07-15 2022-01-20 青岛凯瑞电子有限公司 Low-resistance high-current-carrying lead structure of surface-mounted ceramic metal housing

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