JP2008288311A5 - - Google Patents

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Publication number
JP2008288311A5
JP2008288311A5 JP2007130440A JP2007130440A JP2008288311A5 JP 2008288311 A5 JP2008288311 A5 JP 2008288311A5 JP 2007130440 A JP2007130440 A JP 2007130440A JP 2007130440 A JP2007130440 A JP 2007130440A JP 2008288311 A5 JP2008288311 A5 JP 2008288311A5
Authority
JP
Japan
Prior art keywords
land shape
shape according
circular portion
spring
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007130440A
Other languages
Japanese (ja)
Other versions
JP2008288311A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007130440A priority Critical patent/JP2008288311A/en
Priority claimed from JP2007130440A external-priority patent/JP2008288311A/en
Publication of JP2008288311A publication Critical patent/JP2008288311A/en
Publication of JP2008288311A5 publication Critical patent/JP2008288311A5/ja
Pending legal-status Critical Current

Links

Claims (7)

円形部の外周に凸部を放射状に備えることを特徴とするランド形状。   A land shape characterized in that convex portions are provided radially on the outer periphery of the circular portion. 前記円形部の接線方向に沿って前記凸部がカットされていることを特徴とする請求項１に記載のランド形状。   The land shape according to claim 1, wherein the convex portion is cut along a tangential direction of the circular portion. 前記円形部にかからない任意の線に沿って前記凸部がカットされていることを特徴とする請求項１に記載のランド形状。   The land shape according to claim 1, wherein the convex portion is cut along an arbitrary line not extending to the circular portion. 前記円形部は搭載部品の円形座とほぼ同径であることを特徴とする請求項１から３のいずれか一項に記載のランド形状。   The land shape according to any one of claims 1 to 3, wherein the circular portion has substantially the same diameter as a circular seat of a mounted component. 前記搭載部品はバネ式ピン接点部品であることを特徴とする請求項４に記載のランド形状。   The land shape according to claim 4, wherein the mounting component is a spring-type pin contact component. 前記バネ式ピン接点部品はスプリングピンであることを特徴とする請求項５に記載のランド形状。   The land shape according to claim 5, wherein the spring-type pin contact part is a spring pin. 請求項１〜６のいずれか一項に記載のランド形状を備えることを特徴とする基板。The board | substrate provided with the land shape as described in any one of Claims 1-6.
JP2007130440A 2007-05-16 2007-05-16 Land shape Pending JP2008288311A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007130440A JP2008288311A (en) 2007-05-16 2007-05-16 Land shape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007130440A JP2008288311A (en) 2007-05-16 2007-05-16 Land shape

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012013224A Division JP2012080141A (en) 2012-01-25 2012-01-25 Soldering structure and electronic apparatus with soldering structure

Publications (2)

Publication Number Publication Date
JP2008288311A JP2008288311A (en) 2008-11-27
JP2008288311A5 true JP2008288311A5 (en) 2010-02-25

Family

ID=40147770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007130440A Pending JP2008288311A (en) 2007-05-16 2007-05-16 Land shape

Country Status (1)

Country Link
JP (1) JP2008288311A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01133769U (en) * 1988-03-03 1989-09-12
JPH0238772U (en) * 1988-09-05 1990-03-15
JPH09107173A (en) * 1995-10-11 1997-04-22 Tokai Rika Co Ltd Pad structure and wiring board device
JP2002164104A (en) * 2000-11-22 2002-06-07 Ando Electric Co Ltd Probe card
JP2004055582A (en) * 2002-07-16 2004-02-19 Matsushita Electric Ind Co Ltd Connection structure of electrode terminal
JP2004319778A (en) * 2003-04-16 2004-11-11 Mitsubishi Electric Corp Printed circuit board

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