JP2008288264A - Pattern correction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern correction method by which an electrode disconnection part can be corrected by using a thin line of about 10 μm in diameter, and a corrected pattern having an optional shape can be stably obtained without contamination of the periphery of a failure part. <P>SOLUTION: Laser light is applied to the surface of a film 3 to form a recess 3c that is comprised of a plurality of linear grooves 3b and based on a failure part 2a, and through holes 3a are formed on the bottoms of the respective grooves 3b. The opening of the recess 3c is made to face the failure part 2a at specified spacing, and the film 3 is pressed onto a substrate 1 in a specified range including the recess 3c and the through holes 3a. At the same time, a correcting paste 10 is applied to the failure part 2a through the through hole 3a, and the film 3 is peeled off from a substrate 1 by a restoring force of the film 3. As a result, the quantity of the correcting paste 10 is limited by the through hole 3a, so that the entry of the correcting paste 10 between the film 3 and the substrate 1 can be suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a pattern correction method, and more particularly to a pattern correction method for correcting a defective portion of a fine pattern formed on a substrate. More specifically, the present invention relates to a pattern correction method for correcting an open defect of an electrode that occurs in a flat panel display manufacturing process.

  In recent years, with the increase in size and definition of flat panel displays such as plasma displays, liquid crystal displays, and EL displays, the probability of defects in electrodes and liquid crystal color filters formed on glass substrates has increased. A method for correcting a defect has been proposed in order to improve the yield.

  For example, electrodes are formed on the surface of a glass substrate of a liquid crystal display. If this electrode is disconnected, apply the conductive correction paste (correction solution) attached to the tip of the application needle to the disconnection part, and apply the electrode several times while shifting the application position in the length direction of the electrode. It corrects (for example, refer patent document 1).

In addition, a film is provided so as to cover the defective part, the defective part and the film are removed almost simultaneously using laser light, and a correction ink (correction liquid) is applied to the removed part using the film as a mask. There is a method of peeling and removing (for example, see Patent Documents 2 and 3).
JP-A-8-292442 Japanese Patent Laid-Open No. 11-125895 JP 2005-95971 A

  However, in the method of correcting the electrode, the conductive correction paste is attached to the tip of the application needle, and the correction paste is transferred to the disconnected portion. Therefore, the coating diameter is determined by the surface of the tip being processed flat, and is about 10 μm. It was difficult to realize the coating diameter, and it was also difficult to form a thin line using this.

  On the other hand, in the method using a film as a mask, it is possible to correct the electrode disconnection portion with a thin wire of about 10 μm, but at the time when the correction ink is applied to the hole, a capillary phenomenon occurs in the gap between the film and the substrate. It is also conceivable that the correction ink or its solvent is sucked in and contaminates the substrate.

  In addition, the correction pattern is not limited to a straight line, and a correction pattern having an arbitrary shape (for example, an L shape or a U shape) may be required. However, a method for stably forming an arbitrary shape correction pattern is disclosed. It has not been.

  Therefore, the main object of the present invention is to correct a pattern where an electrode disconnection or the like can be corrected with a thin wire of about 10 μm, contamination around the defect is small, and a correction pattern having an arbitrary shape can be obtained stably. Is to provide a method.

  The pattern correction method according to the present invention is a pattern correction method for correcting a defect portion of a fine pattern formed on a substrate, wherein the film is irradiated with a laser beam and shaped according to the defect portion formed of a plurality of linear grooves. And forming a through-hole in the bottom of each groove, opening the opening of the recess against the defective portion with a predetermined gap and pressing the film against the substrate within a predetermined range including the recess The correction liquid is applied to the defective portion through the through hole, and the film is peeled off from the substrate by the restoring force of the film.

Preferably, each groove is connected to another groove.
Preferably, the length in the length direction of the corresponding groove of at least one of the plurality of through holes is substantially the same as the length of the corresponding groove.

  Preferably, after the surface of the film is irradiated with laser light to form a recess and a plurality of through holes, the front and back of the film are reversed so that the opening of the recess faces the defect.

  In the pattern correction method according to the present invention, the film is irradiated with a laser beam to form a concave portion having a shape corresponding to a defective portion including a plurality of linear grooves, and a through hole is formed at the bottom of each groove. The opening portion is opposed to the defective portion with a predetermined gap, the film is pressed against the substrate within a predetermined range including the concave portion, and the correction liquid is applied to the defective portion through the plurality of through holes. Therefore, it is possible to form a correction pattern having an arbitrary shape that is the same shape as the concave portion, and it is possible to correct an electrode disconnection portion or the like with a thin wire of about 10 μm. In addition, the amount of the correction liquid flowing into the groove can be limited by the through hole, and the correction liquid can be prevented from entering between the film and the substrate to contaminate the periphery of the defective portion.

  Before describing the embodiment, a pattern correction method as the basis of the present invention will be described. FIG. 1 is a diagram showing a substrate 1 to be corrected. In FIG. 1, an electrode 2 that is a fine pattern is formed on a substrate 1, and an open defect portion (disconnection defect portion) 2 a is generated in the electrode 2.

  In this pattern correction method, as shown in FIG. 2, a film 3 having a hole 3a having a shape corresponding to the defect 2a is used as a mask. The film 3 is opposed to the upper surface of the substrate 1 with a gap G in a state where the hole 3a is aligned with the defective portion 2a. The film 3 is, for example, a thin film polyimide film, and the width of the film 3 only needs to be a width sufficient for use as a mask. For example, the film 3 is a roll-shaped film slit to about 5 mm to 15 mm. The thickness Ft of the film 3 is preferably such that the underside can be seen through, for example, about 10 to 25 μm.

  As shown in FIG. 2, the hole 3a has, for example, a rectangular shape with a short axis length Sw and a long axis length Sl. The major axis length Sl is set longer than the defect portion 2a so that the correction paste is applied to the normal electrode surfaces 2b located at both ends of the defect portion 2a. Thereby, while reducing the resistance value of a correction part, the adhesiveness of a correction part can be improved.

  The holes 3a are formed by irradiating the surface of the film 3 with laser light. As the laser, a pulse laser such as a YAG third harmonic laser, a YAG fourth harmonic laser, or an excimer laser is used. For example, as shown in FIG. 3, the laser unit 4 is provided at the upper part of the observation optical system 5, and the objective lens 6 is provided at the lower end of the observation optical system 5. The film 3 is stretched between the objective lens 6 and the substrate 1 by two fixed rollers 7. Laser light is applied to the film 3 from the laser unit 4 via the observation optical system 5 and the objective lens 6. The shape and size of the hole 3 a are determined by, for example, a variable slit (not shown) built in the laser unit 4, and the hole 3 a is processed into a cross-sectional shape of the laser light collected by the objective lens 6. At this time, it is preferable to arrange the shielding plate 8 between the film 3 and the substrate 1 so that foreign matter (dust) generated by laser ablation does not fall on the substrate 1.

  Thus, since the hole 3a is not processed by the laser beam in a state where the film 3 is attached or adhered to the defect portion 2a, the vicinity of the electrode 2 and the defect portion 2a is not damaged by the laser power. Moreover, since the hole 3a is opened in a state where the film 3 is floated, it is possible to prevent foreign matter from adhering to the back surface of the film 3.

  When the formation of the hole 3a is completed, foreign matter (dust) generated when the hole 3a portion is removed (laser ablation) is scattered on the upper surface of the film 3 around the hole 3a. You may irradiate a laser beam with weak power to the wide range around the hole 3a. At this time, if the laser is switched to the YAG second harmonic laser and the laser beam is irradiated to a wide range centering on the hole 3a with a weak laser power, it is possible to remove only the foreign matter. Occurrence can be prevented. In addition, if the mechanism which reverses the film 3 is provided, the back surface of the film 3 can be processed similarly. As the laser unit 4, a laser unit that can selectively emit one of two types of laser beams, that is, a laser beam for opening the hole 3 a and a laser beam for removing foreign matter may be used.

  The film 3 is supplied from a film supply reel (not shown) and is collected by a film take-up reel (not shown) via a fixed roller 7. The film 3 can be moved in the XYZ directions by an XYZ stage (not shown). The XYZ stage is used for position adjustment between the defect portion 2a and the hole 3a.

  Next, for example, the film 3 is moved relative to the substrate 1 based on the image processing result or the respective position coordinate data, and as shown in FIG. 2, the hole 3a of the film 3 is located above the defect 2a. Is positioned so that the film 3 and the substrate 1 face each other with a gap G therebetween. This step may be performed manually. The film 3 is in a state of being stretched by a certain tension. The gap G varies depending on the distance between fulcrums (for example, the fixed roller 7 shown in FIG. 3) for supporting the film 3 and the thickness of the film 3, but is set to about 10 to 1000 μm, for example. When the surface of the substrate 1 is uneven, the film 3 facing the substrate 1 may maintain a gap G so as not to contact the substrate 1, and a minute range including the hole 3 a does not contact the defective portion 2 a. Such a gap G may be maintained.

  For example, an application needle 9 shown in FIG. 4 is used as the correction paste application means. The tip of the application needle 9 is sharp, but the tip is processed flat. The diameter of the flat surface 9a at the tip of the application needle 9 is, for example, about 30 to 100 μm, and an optimum diameter is selected according to the size of the hole 3a. It is preferable to select and use the applicator needle 9 so that the holes 3a can all fit in the flat surface 9a. If such an application needle 9 is used, the correction paste 10 can be filled in the entire hole 3a by a single application operation.

  If the application needle 9 is pressed from above with the correction paste 10 attached around the flat surface 9a at the tip of the application needle 9 so as to close the opening of the hole 3a with the flat surface 9a, the film 3 is deformed. The film 3 in a minute range around the hole 3a adheres to the periphery of the defect 2a, and the defect paste 2a is filled with the correction paste 10. The application needle 9 is configured to be able to move up and down on a guide (linear motion bearing) (not shown), and pushes the film 3 only by the weight of the movable part including the application needle 9. Even if the application needle 9 descends and comes into contact with the film 3 and tries to descend further after the film 3 is brought into contact with the substrate 1, the application needle 9 retracts upward along the guide. The flat surface 9a is not overloaded. A driving means (not shown) for the application needle 9 is time-controlled and controlled by a control means (not shown).

  The time in which the film 3 in a minute range including the hole 3a contacts the periphery of the defect 2a is only while the coating needle 9 is pressing the film 3, and the correction paste 10 is in the film 3 and the substrate 1 (near the defect 2a). The coating needle 9 is retracted upward before flowing into the gap due to capillary action. When the application needle 9 is separated from the film 3, the film 3 returns to its original state due to the elasticity of the film 3, and the film 3 in a minute range including the hole 3a is separated from the periphery of the defect portion 2a. Therefore, the time for the film 3 to contact the substrate 1 is very short.

  FIG. 5 shows a state in which the application needle 9 is retracted upward, and the film 3 has returned to a state away from the substrate 1, and the defect layer 2a has a correction layer 10A having substantially the same shape as the hole 3a. Remains. Further, the excessively applied correction paste 10 remains on the surface of the film 3. Thus, since correction is performed using the film 3 as a mask, it becomes possible to obtain a correction layer 10A (pattern) that is finer than the application shape of the application needle 9.

  The applied correction paste 10 is subjected to ultraviolet curing, heat curing, or drying according to the specifications of the correction paste 10. You may perform a hardening process in the state of FIG.

  Further, if it is necessary to deposit a metal film by a thermal decomposition reaction by laser irradiation, the film 3 may be removed from above the defect portion 2a, and then a curing process (metal film deposition process) may be performed with a continuous wave laser. . In this case, the mechanism is simple if the laser unit 4 is of a type that can switch between pulse oscillation and continuous oscillation. However, if the switching cannot be performed, an observation optical system from a continuous oscillation laser (not shown) separate from the laser unit 4 is used. The laser beam may be introduced into 5. Alternatively, laser irradiation may be performed by preparing an optical system different from the observation optical system 5.

  If the defect portion 2a is corrected by such a method, the applied correction paste 10 is not sucked into the gap between the substrate 1 and the film 3 by capillary action, and the substrate 1 extends over a wider area than the hole 3a. No worries about polluting. Further, since the film 3 is completely separated from the defective portion 2a and the substrate 1 when the application is finished, when the film 3 is removed in the subsequent process, the film 3 comes into contact with the correction layer 10A and is corrected. There is no worry of breaking the layer 10A.

  If the viscosity of the correction paste 10 is large, the possibility of being sucked into the gap between the substrate 1 and the film 3 by a capillary phenomenon is reduced, but conversely, the fluidity deteriorates and does not enter the entire hole 3a. It is also assumed that the correction paste 10 does not adhere to the surface. On the other hand, in the above-described method, the film 3 in the vicinity of the hole 3a is pressed against the substrate 1 only at the time of application, so that the influence of capillary action can be minimized. Therefore, the viscosity of the correction paste 10 may be small.

  Further, when correcting one defective portion 2a, it is preferable to complete the correction by one application. The reason is that as the number of times of application increases, the amount of the correction paste 10 adhering to the holes 3a increases, so that the correction paste 10 can be sucked into the gap between the film 3 and the substrate 1 or the shape of the correction layer 10A can collapse. Because sex is also considered. On the other hand, since the thickness of the correction layer 10A can be increased by applying the same multiple times to the same position, it is desirable to determine the number of times of application according to the specification of the correction paste 10 to be used.

  Further, as the correction paste 10, when correcting the defect 2a of the electrode 2, a metal nano paste, a metal complex solution (for example, a palladium complex solution), or a metal colloid using metal nanoparticles such as gold or silver is used. Can do.

  It is desirable that the size of the hole 3a be such that the flat surface 9a of the application needle 9 can press the entire opening of the hole 3a at one time. For example, if the diameter of the flat surface 9a of the application needle 9 is 50 μm The major axis length S1 of the hole 3a is 50 μm or less. In addition, if the minor axis length Sw of the opening of the hole 3a and the thickness Ft of the film 3 satisfy the relationship of Ft> Sw, a force for retaining the correction paste 10 in the hole 3a in the hole 3a ( Adhesion force) F1 is larger than the suction force F2 due to capillary action acting on the gap between the film 3 and the substrate 1, and the correction paste 10 can be prevented from being sucked into the gap between the film 3 and the substrate 1. . However, since the forces F1 and F2 vary depending on the surface tension and viscosity of the correction paste 10 and the wettability of the substrate 1 and the film 3, in order to increase the stability of correction, the relationship of Ft / 2> Sw It is more preferable to satisfy the above condition.

  The above is the description of the pattern correction method that is the basis of the present invention. In the above description, the shape of the correction layer 10A is a straight line, but actually, there is a case where the correction layer 10A having an arbitrary shape such as a U-shape or an L-shape is required. For example, when the defect portion 2a is bypassed and corrected with the U-shaped correction layer 10A, a U-shaped hole 3a is formed in the film 3 by laser irradiation as shown in FIG. . When forming by laser irradiation through a fixed slit, a U-shaped hole 3a is obtained all at once, but when processing using a biaxial variable slit, the hole 3a has three holes 3a1, 3a2, and 3a2. It is divided into 3a3.

  Even in the case of correcting with the U-shaped correction layer 10A, the application needle 9 is one whose flat surface 9a can cover the entire U-shaped hole 3a. A circle indicated by a two-dot chain line in FIG. 6A represents the size of the flat surface 9a. As shown in FIG. 4, when the film 3 including the hole 3a is pressed with the application needle 9 having the correction paste 10 attached to the tip, a U-shaped pattern (correction layer) as shown in FIG. 10A) can be formed by a single coating operation. However, depending on the viscosity and type of the correction paste 10 to be used, as shown in FIG. 6C, the corner portion 10Aa of the correction layer 10A swells and the correction quality deteriorates. This is because the correction paste 10 flows into the corner portion 10Aa from a plurality of holes (for example, the hole 3a1 and the hole 3a2).

  Here, when the length of the long axis of the hole 3a is as long as 100 μm, it can be considered that the hole 3a is coated with the application needle 9 in a plurality of times in the direction of the long axis. It is preferable to correct by one application using the application needle 9 having a large diameter (in this case, 100 μm or more) capable of closing the whole hole 3a.

  However, when the area of the flat surface 9a of the application needle 9 increases, the amount of the correction paste 10 applied at one time increases. When the diameter of the flat surface 9a is changed from 50 μm to 100 μm, the area of the flat surface 9a is quadrupled, so that the correction paste 10 exceeding four times is applied to the surface of the film 3 including the holes 3a. For this reason, it is assumed that the correction pattern 10 is fed into the hole 3a more than necessary, and the drawing pattern swells as the flat surface 9b of the application needle 9 increases. The present invention can solve this problem.

[Embodiment 1]
FIG. 7 is a diagram showing the pattern correction method according to the first embodiment of the present invention, and is a view of the film 3 as seen from the side pressed by the application needle 9. In this pattern correction method, the concave portion 3c having an opening substantially equal to the shape of the correction layer 10A (in this case, a U-shape) determined according to the shape of the defect portion 2a is formed on the surface of the film 3 on the substrate 2 side. It is formed. The concave portion 3c includes three linear grooves 3b corresponding to the three sides of the U-shape. A minute through hole 3a is formed in the approximate center of each groove 3b. The width of the through hole 3 a is equal to or smaller than the width of the groove 3 b, and the length of the through hole 3 a is shorter than the groove 3.

  FIG. 8A is a cross-sectional view taken along the line VIIIA-VIIIA of FIG. 7 and shows a cross section including the center line in the length direction of the groove 3b. In FIG. 8A, the opening of the recess 3c is opposed to the defect 2a with a predetermined gap. A constant tension is applied to the film 3, and the film 3 is arranged substantially parallel to the substrate 1. The gap between the substrate 1 and the film 3 is, for example, about 100 μm.

  Next, as shown in FIG. 8B, in the state where the correction paste 10 is attached around the flat surface 9a at the tip of the application needle 9, the application surface is covered with the flat surface 9a so as to cover the through hole 3a and the recess 3c. When 9 is pressed from above, the film 3 is deformed and the film 3 in a minute range around the recess 3c adheres to the periphery of the defect 2a, and the defect 2a is filled with the correction paste 10. At this time, since the liquid amount of the correction paste 10 flowing into the recess 3c is reduced by being reduced by the minute through-hole 3a, it is possible to suppress the correction paste 10 from being sucked into the gap between the defect portion 2a and the film 3. it can.

  In addition, when the application needle 9 presses the micro-range film 3 including the recess 3c from above, the time during which the micro-range film 3 including the recess 3c is in contact with the periphery of the defect 2a is as follows. Only during pressing, the application needle 9 is retracted upward before the correction paste 10 flows into the gap between the film 3 and the substrate 1 (near the defective portion 2a) by capillary action. When the application needle 9 is separated from the film 3, the film 3 returns to its original state due to the elasticity of the film 3, and the film 3 in a minute range including the concave portion 3c is separated from the periphery of the defect portion 2a.

  If the fine pattern is formed by such a method, even if there is a large amount of the correction paste 10 to be applied, the correction paste 10 flowing to the defect portion 2a can be reduced, so that the pattern swells greatly or the film 3 and the substrate 1 It is possible to prevent the correction paste 10 from being sucked into the gap and contaminating the substrate 1. In this case, a pattern as shown in FIG. 6B can be obtained without swelling the corners of the U-shape.

  As shown in FIG. 8B, when applying the correction paste 10 attached to the flat surface 9a of the application needle 9, as shown by a two-dot chain line in FIG. 7, the entire recess 3c and the hole 3a are closed. An application needle 9 having a flat surface 9a that can be used is used. If the viscosity of the correction paste 10 is high and it is difficult for the correction paste 10 to flow from the through hole 3a to the recess 3c, the through hole 3a may be formed long in the extending direction of the corresponding groove 3b.

  FIGS. 9A to 9C are diagrams showing a modification of the first embodiment and are compared with FIG. In FIG. 9A, an L-shaped recess 3c composed of two linear grooves 3b arranged at right angles is formed on the surface of the film 3 on the substrate 1 side, and a through-hole is formed in the approximate center of each groove 3b. 3a is formed. In this case, an L-shaped correction pattern can be formed.

  In FIG. 9B, a cross-shaped concave portion 3c composed of four linear grooves 3b arranged in a cross shape is formed on the surface of the film 3 on the substrate 1 side, and a through-hole is formed in the approximate center of each groove 3b. 3a is formed. In this case, a cross-shaped correction pattern can be formed.

  In FIG. 9 (c), a quadrangular annular recess 3c composed of four linear grooves 3b arranged in a square shape is formed on the surface of the film 3 on the substrate 1 side, and penetrates substantially at the center of each groove 3b. A hole 3a is formed. In this case, a square annular correction pattern can be formed. In addition, although it is structurally impossible to form an annular mask with only the through hole 3a, it becomes possible by making each side of the square a groove 3b as shown in FIG. 9C.

  FIG. 10 is a diagram showing another modification of the first embodiment, and is a diagram contrasted with FIG. In FIG. 10, only one of the three sides of the U-shape is constituted by a groove 3b and a through hole 3a formed at the center thereof, and each of the two parallel sides has a linear opening. 3a. When the total length of the pattern to be drawn becomes long like a U-shape, if the inflow amount of the correction paste 10 is suppressed by narrowing down all sides, pattern omission occurs depending on the correction paste 10 used. there is a possibility. In such a case, it is possible to correct the inflow amount of the correction paste 10 by configuring the entire at least one side with the through hole 3a. In the example of FIG. 10, the through hole 3 a and the groove 3 b are overlapped at the corners, and a part of the correction paste 10 that has flowed from the through hole 3 a also flows into the groove 3 b, and is corrected to the entire U-shape. Paste 10 is distributed.

  In addition, also in the modified examples shown in FIGS. 9A to 9C, as shown in FIG. 10, some of the sides are configured by the through holes 3 a to adjust the inflow amount of the correction paste 10. It doesn't matter.

[Embodiment 2]
FIGS. 11A and 11B are cross-sectional views showing the configuration and operation of the main part of the pattern correction apparatus according to the second embodiment of the present invention. In FIG. 11A, the belt-like film 3 is supplied from a film supply reel (not shown), guided between the objective lens 6 and the substrate 1 via the fixed roller 12, and folded back by the fixed roller 11a. And is collected by a film take-up reel (not shown) via a fixed roller 11b. The upper film 3A supported by the fixed rollers 12 and 11a and the lower film 3B supported by the fixed rollers 11a and 11b are opposed to each other substantially parallel to the substrate 1. These are the main components of the film supply unit 13 and can be moved in the XYZ directions by an XYZ stage (not shown). The XYZ stage is used for position adjustment between the defective portion 2a and the groove 3b. Further, the film supply unit 13 may be provided with a rotating means (θ mechanism).

  First, the surface of the upper film 3A is irradiated with laser light to form the grooves 3b and the through holes 3a. At this time, the shielding plate 8 may be disposed between the films 3 </ b> A and 3 </ b> B stretched in parallel vertically so that dust generated by laser ablation does not fall on the substrate 1. Even when there is no shielding plate 8, the lower film 3 </ b> B receives dust, so that the dust does not fall directly on the substrate 1.

  Fig.12 (a) is the figure which looked at the upper film 3A from upper direction, FIG.12 (b) is the XIIB-XIIB sectional view taken on the line of Fig.12 (a). The groove 3b constitutes one side of a U-shaped recess 3c having an opening that is substantially equal to the pattern shape for correcting the defect 2a. If the laser power and the number of laser shots are known in advance, the groove 3b can be easily formed. A laser slit shape (not shown) for setting the laser irradiation shape is adjusted to form a groove 3b having a width Sw and a length Sl.

  After the groove 3b is formed, the slit shape is changed while maintaining the positional relationship as it is, and a through hole 3a having a width Sw and a length Sm is formed at substantially the center of the bottom of the groove 3b. The length Sm of the through hole 3a is determined in consideration of the viscosity of the correction paste 10, the size of the flat surface 9a of the application needle 9, and the width of the hole 3a is set to be equal to or smaller than the width Sw of the groove 3b. In the example of FIGS. 12A and 12B, the width of the groove 3b and the width of the hole 3a are the same.

  Thus, after forming the groove 3b, the film 3 and the laser irradiation position can be changed without changing the laser irradiation position, and the processing can be performed by changing the length of the laser processing slit as it is. Can be omitted. Moreover, even if there is position adjustment, it is very small and convenient. In addition, after forming the through-hole 3a, you may form the groove | channel 3b and the formation order of the through-hole 3a and the groove | channel 3b is not ask | required. By repeating the step of forming the groove 3b and the through hole 3a three times, a U-shaped recess 3c and three through holes 3a are formed.

  FIG. 13 is a cross-sectional view taken along the line XIII-XIII of FIG. 12A and shows the cross-sectional shapes of the groove 3b and the through hole 3a. The cross-sectional shapes of the through holes 3a and the grooves 3b are tapered so as to become narrower as they approach the back surface (laser through surface) of the film 3. This is also a feature of laser processing. The depth Dt of the groove 3b is smaller than the thickness Ft of the film 3, for example, about 1/3 of the thickness Ft of the film 3. Further, in the case where the through hole 3a has a width on the laser irradiation surface side as Sw, the width Sw1 on the side through which the laser passes is Sw> Sw1 due to the characteristics of laser processing. If the width Sw is too small or the film 3 to be used is too thick, the hole 3a cannot penetrate, so the dimensions of the groove 3b and the through hole 3a are set after grasping the width Sw and the thickness Ft of the film 3 .

  After the formation of the groove 3b and the through hole 3a is completed, as shown in FIG. 11B, the film 3 is wound in the R direction (clockwise direction) in the figure, and the laser irradiation surface of the film 3 faces downward. Invert the film 3 as follows. Next, the film 3 is moved relative to the substrate 1 based on the image processing result, and the groove 3b and the defective portion 2a are aligned so that the substrate 1 and the film 3 face each other. This step may be performed manually.

  The film 3 is in a state of being stretched by a certain tension. The gap G varies depending on the distance between fulcrums (for example, the fixed rollers 11a and 11b) that support the film 3 and the thickness of the film 3, but is set to about 10 to 1000 μm, for example. When the surface of the substrate 1 is uneven, the film 3 facing the substrate 1 may maintain a gap G so as not to contact the substrate 1, and a minute range including the groove 3 b does not contact the defective portion 2 a. Such a gap G may be maintained. Thereafter, the coating means is inserted into the space between the upper and lower films 3, and the correction is performed by applying the correction paste 10 from above the through-hole 3a by the method shown in FIGS. 8 (a) and 8 (b). .

  At this time, since the cross-section of the through hole 3a is shaped like a taper that tapers upward, the correction paste 10 in the through hole 3a has a narrower side, that is, above the through hole 3a. The pulling force works by capillary action. Therefore, it is possible to suppress the correction paste 10 from flowing into the gap between the film 3 and the substrate 1, and as a result, it is possible to stabilize the drawing shape.

  As shown in FIG. 14, a plurality (two in the figure) of through holes 3a may be formed in the groove 3b. Thereby, even when the groove 3b is long, the correction paste 10 can be uniformly supplied to the entire groove 3b. Also in this case, the plurality of through holes 3a can be easily formed by relatively moving the laser part 4 and the film 3 by a minute distance in the length direction of the groove 3b.

[Embodiment 3]
In Embodiment 2, since the film 3 exists up and down, it is necessary to insert an application means between the upper and lower films 3 at the time of application, and the interval between the upper and lower films 3 cannot be reduced. Therefore, it is difficult to align the defective portion 2a and the concave portion 3c using the high-magnification objective lens 6. In this case, since the defective portion 2a is observed through two films, it is assumed that the position adjustment becomes difficult. Therefore, in the third embodiment, a part of the upper film 3A is mechanically moved to expose the through hole 3a of the lower film 3B, and then the correction paste 10 is applied to the defective portion 2a through the through hole 3a. Apply.

  15 (a) to 15 (d) are cross-sectional views showing the configuration and operation of the main part of the pattern correcting apparatus according to the third embodiment of the present invention, and FIG. 15 (b) is an XVB- line in FIG. 15 (a). FIG. 15D is a sectional view taken along line XVB, and FIG. 15D is a sectional view taken along line XVD-XVD in FIG. In FIG. 15A, a detachable film supply reel and a film take-up reel (not shown) are mounted on the film supply unit 15. The film 3 supplied from the film supply reel is guided between the objective lens 6 and the substrate 1 via the fixed rollers 16 to 18, folded back by the fixed roller 19 and guided onto the substrate 1, and the fixed roller 20. Is taken up on a film take-up reel.

  The fixed rollers 17 and 18 are fixed to the movable member 21 and are movable in the vertical direction within a certain range. In FIG. 15A, the movable member 21 is in a fixed state at an upper position. In this state, the upper film 3A in the section L1 between the fixed rollers 17 and 18 and the lower film 3B in the section L2 between the fixed rollers 19 and 20 are substantially parallel to each other while maintaining a constant interval, for example, about 10 mm. In addition, the substrate 1 is arranged substantially parallel to the substrate 1. The section L2 (film placement portion 15a) of the film supply unit 15 is inserted below the objective lens 6 and used for correction using the film 3 as a mask.

  A hook 22 including a flat plate member and two claws 22a is disposed under the upper film 3A in the section L1. The hook 22 is movable in a direction perpendicular to the upper film 3A and substantially parallel to the substrate 1 (width direction of the upper film 3A). In FIG. 15A, the hook 22 is not in contact with the upper film 3A, and a certain gap is secured.

  In this state, the upper film 3A substantially at the center of the section L1 is irradiated with laser light to form a concave portion 3c having a shape corresponding to the shape of the defective portion 2a, and each groove 3b constituting the concave portion 3c is shorter than the groove 3b. One or a plurality of through holes 3a are formed. At this time, the hook 22 functions as a substitute for the shielding plate and receives foreign matter (dust) generated by laser ablation, so that the substrate 1 can be prevented from being contaminated. At this time, a recess (not shown) for receiving dust may be formed on the upper surface of the hook 22.

  At the time when the formation of the recess 3c and the hole 3a is completed, dust generated during laser ablation is scattered on the laser irradiation surface of the film 3. In order to remove dust, a step of irradiating laser light with a weak power may be put in a wide range around the recess 3c and the hole 3a. At this time, by switching to the YAG second harmonic laser and irradiating a wide range centered on the recess 3c and the hole 3a with a weak laser power, it is possible to remove only dust, and new dust is generated. This can be prevented.

  Next, as shown in FIG. 15C, the concave portion 3c and the hole 3a are moved to the approximate center of the lower film 3B in the section L2 while winding the film 3 around the film supply reel. After the hook 22 is moved rearward, the movable member 21 is lowered so that the fixed rollers 17 and 18 fixed to the movable member 21 are positioned below the fixed rollers 19 and 20. At this time, since the film take-up reel side (not shown) does not return the film 3, the upper film 3 A is supplied as shown in FIG. 15 (d) while the film 3 is supplied from the film supply reel (not shown). The lower film 3B including the hole 3a is exposed when viewed from above by being pulled by the claw 22a of the hook 22 and moving backward. Note that there are wrinkles at both ends of the fixed roller 19 so that the film 3 does not come off the roller 19.

  15 (c) and 15 (d), the upper film 3A is translated in the shape as it is with respect to the substrate 1 by the hook 22, but actually, the film 3 in the hook 22 is folded. However, there is no functional problem because the film 3 is flexible.

  Next, the defect portion 2a and the recess 3c are aligned so that the lower film 3B including the recess 3c and the substrate 1 face each other with a certain gap G. Thereafter, as in the step described with reference to FIG. 4, if the correction paste 10 is applied with the application needle 9, the correction is completed without contaminating the vicinity of the defective portion 2a.

  In the third embodiment, the film 3 is folded back by the fixed roller 19, and the upper film 3A is mechanically moved laterally while the upper film 3A and the lower film 3B are vertically arranged at regular intervals. Since the correction is performed with one piece of 3B, the alignment between the defective portion 2a and the concave portion 3c becomes easy. Further, since the through-hole 3a is formed in the lower film 3B, the position of the recess 3c can be easily determined by focusing the objective lens 6 on the through-hole 3a.

  In addition, since there is no object such as the film 3 above the hole 3a of the lower film 3B, it is possible to perform alignment by switching to a high-magnification objective lens (for example, 20 times). In addition, since the interference between the coating means and the upper film 3A can be avoided, the distance between the upper film 3A and the lower film 3B can be narrowed, and switching to a high-magnification objective lens is facilitated.

  Since the method described so far can easily and stably form a fine line pattern, it is necessary to form a pattern of 10 μm or less, for example, for electrode correction of a TFT (thin film transistor) panel of a liquid crystal panel. It can be applied to any case. In addition to the electrodes, the black matrix of the liquid crystal color filter has a line width of less than 20 μm with higher definition, and can be applied to this correction.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure which shows the board | substrate of correction object. It is a figure which shows the pattern correction method used as the foundation of this invention. It is sectional drawing which shows the method of making a hole in the film shown in FIG. It is sectional drawing which shows the method of apply | coating correction paste to the defective part shown in FIG. It is sectional drawing which shows the state which retracted the application needle | hook shown in FIG. 4 upwards. It is a figure for demonstrating the problem of the pattern correction method shown in FIGS. It is a figure which shows the pattern correction method by Embodiment 1 of this invention. It is sectional drawing which shows the method of apply | coating correction paste to a defect part using the film shown in FIG. 6 is a diagram illustrating a modification example of the first embodiment. FIG. It is a figure which shows the other example of a change of Embodiment 1. FIG. It is sectional drawing which shows the principal part of the pattern correction apparatus by Embodiment 2 of this invention. It is a figure which shows the groove | channel and through-hole of an upper film shown in FIG. It is a figure which shows the cross-sectional shape of the groove | channel and through-hole which were shown in FIG. It is a figure which shows the example of a change of Embodiment 2. FIG. It is sectional drawing which shows the principal part and operation | movement of the pattern correction apparatus by Embodiment 3 of this invention.

Explanation of symbols

  1 substrate, 2 electrode, 2a open defect part, 2b electrode surface, 3 film, 3A upper film, 3B lower film, 3a through hole, 3b groove, 3c recess, 4 laser part, 5 observation optical system, 6 objective lens, 7 , 11a, 11b, 12, 16-20 Fixed roller, 8 shielding plate, 9 application needle, 9a flat surface, 10 correction paste, 10A correction layer, 13, 15 film supply unit, 15a film placement unit, 21 movable member, 22 Hook, 22a nail.

Claims (4)

In a pattern correction method for correcting a defective portion of a fine pattern formed on a substrate,
Irradiating the film with laser light to form a concave portion having a shape corresponding to the defect portion composed of a plurality of linear grooves and forming a through hole at the bottom of each groove,
The opening of the recess is opposed to the defective portion with a predetermined gap,
While pressing the film against the substrate in a predetermined range including the concave portion, applying a correction liquid to the defective portion through the plurality of through holes,
A pattern correction method, wherein the film is peeled from the substrate by a restoring force of the film.   The pattern correction method according to claim 1, wherein each groove is connected to another groove.   The length in the length direction of the corresponding groove of at least one through hole among the plurality of through holes is substantially the same as the length of the corresponding groove. The pattern correction method described.   The surface of the film is irradiated with laser light to form the recess and the plurality of through holes, and then the front and back of the film are reversed so that the opening of the recess faces the defect. The pattern correction method according to claim 1.

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