JP2008282831A - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
JP2008282831A
JP2008282831A JP2007122934A JP2007122934A JP2008282831A JP 2008282831 A JP2008282831 A JP 2008282831A JP 2007122934 A JP2007122934 A JP 2007122934A JP 2007122934 A JP2007122934 A JP 2007122934A JP 2008282831 A JP2008282831 A JP 2008282831A
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circuit board
flexible printed
printed circuit
connector
plating lead
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JP2007122934A
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JP4882857B2 (en
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Shinichi Ishizawa
真一 石澤
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which can prevent a plated lead provided on the end from peeling when the circuit board is inserted into a connector or withdrawn therefrom. <P>SOLUTION: In the flexible printed circuit board in which a circuit terminal portion for connector connection to be connected to a contact portion of a connector to execute electric connection is provided on one end of the circuit board, a plated lead with a predetermined width is formed from the terminal portion to the tip of the circuit board and the plated lead has a width enhanced from a predetermined position to the tip of the circuit board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、フレキシブルプリント回路板に関する。   The present invention relates to a flexible printed circuit board.

近年のエレクトロニクス機器は、小型化，薄型化が求められており、これに伴い回路自体もＩＣやＬＳＩ、チップ部品等の使用によって高密度化が図られている。従来より、プリント回路板間の接続にはフレキシブルプリント回路板が用いられており、相互間の接続にはフレキシブルプリント回路板用のコネクタが用いられている。   In recent years, electronic devices have been required to be reduced in size and thickness, and accordingly, the circuit itself has been increased in density by using ICs, LSIs, chip parts, and the like. Conventionally, flexible printed circuit boards have been used for connections between printed circuit boards, and connectors for flexible printed circuit boards have been used for connections between the printed circuit boards.

上記コネクタに接続されるフレキシブルプリント回路板は、端部に配線パターンが露呈された接続部が形成されており、この接続部をコネクタの挿入口に挿入して該コネクタの係止機構で固定することにより、コネクタの接点と各配線パターンとが接続する。また、高密度化のために狭ピッチ化されたコネクタでは、接続されるフレキシブルプリント配線板の接続部にて露呈される配線パターンの面積が小さくなって接触不良が発生しやすくなるという問題がある。そのため、０．３ｍｍピッチなどの狭ピッチのフレキシブルプリント配線板用コネクタでは、接続部の配線パターンを千鳥状に配置することで、端子の間隔を広くしている（例えば特許文献１）。   The flexible printed circuit board connected to the connector has a connection portion with an exposed wiring pattern at the end, and the connection portion is inserted into the insertion port of the connector and fixed by the locking mechanism of the connector. As a result, the contact of the connector and each wiring pattern are connected. In addition, a connector with a narrow pitch for high density has a problem that the area of the wiring pattern exposed at the connecting portion of the flexible printed wiring board to be connected becomes small and contact failure is likely to occur. . Therefore, in the connector for flexible printed wiring boards having a narrow pitch of 0.3 mm or the like, the interval between the terminals is widened by arranging the wiring patterns of the connecting portions in a staggered manner (for example, Patent Document 1).

図２は従来の接続部１６０に千鳥配列の端子を持つフレキシブル配線基板１００を示す図である。端子１１０に電気めっきを施すため、めっきリード１２０が設けられているが、端部のめっきリード幅が細いことにより、コネクターへの挿抜時端部のめっきリードが剥がれ隣接するめっきリードや端子に接触し短絡を起こすことがあった。
特開２００３−３４７６９９号公報 FIG. 2 is a view showing a flexible wiring board 100 having a staggered arrangement of terminals in a conventional connecting portion 160. A plating lead 120 is provided to perform electroplating on the terminal 110, but due to the narrow width of the plating lead at the end, the plating lead at the end peels off when the connector is inserted into or removed from, and contacts the adjacent plating lead or terminal. Then there was a short circuit.
JP 2003-347699 A

本発明は、上記事情に鑑みてなされたものであり、その目的は、コネクターへの挿抜時、端部に設けられためっきリードの剥がれのないフレキシブルプリント回路板を提供することである。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flexible printed circuit board in which a plating lead provided at an end portion does not peel off when being inserted into and removed from a connector.

本発明によるフレキシブルプリント回路板は、コネクターのコンタクト部に接続して電気的接続をはかるためのコネクター接続用回路端子部を回路板の一端に有するフレキシブルプリント回路板であって、前記端子部から、めっきリードが所定の線巾で回路板先端部まで形成されているとともに、前記めっきリードは、所定の位置から前記回路板先端部に向かって前記線巾か拡径していることを特徴とする。   A flexible printed circuit board according to the present invention is a flexible printed circuit board having a connector connection circuit terminal part at one end of a circuit board for connecting to a contact part of a connector to make an electrical connection, from the terminal part, The plating lead is formed up to the circuit board tip with a predetermined line width, and the plating lead is enlarged in diameter from the predetermined position toward the circuit board tip. .

このフレキシブルプリント回路板においては、所定の位置から前記回路板先端部に向かって前記線巾か拡径している。これにより、回路板先端部の、めっきリード幅が所定の幅より広くなり、コネクターへの挿抜時めっきリード端部の剥がれのないフレキシブルプリント回路板を提供することができる。   In this flexible printed circuit board, the line width is increased from a predetermined position toward the tip of the circuit board. As a result, it is possible to provide a flexible printed circuit board in which the plating lead width at the front end portion of the circuit board is wider than a predetermined width and the plating lead end portion is not peeled off when being inserted into and removed from the connector.

コネクターへの挿抜時、端部に設けられためっきリードの剥がれのないフレキシブルプリント回路板を提供することができる。   It is possible to provide a flexible printed circuit board in which the plating lead provided at the end portion does not peel off when being inserted into and removed from the connector.

以下、本発明のフレキシブルプリント回路板の好適な一実施例について説明する。   Hereinafter, a preferred embodiment of the flexible printed circuit board of the present invention will be described.

図１に示すように、コネクターのコンタクト部に接続して電気的接続をはかるためのコネクター接続用回路端子部１１０を回路板の一端に有するフレキシブルプリント回路板１００であって、端子部１１０から、めっきリード１２０が所定の線巾で回路板先端部１３０まで形成されているとともに、めっきリード１２０は、所定の位置から回路板先端部１３０に向かって線巾が拡径し拡径部１２３を有している。   As shown in FIG. 1, a flexible printed circuit board 100 having a connector connection circuit terminal portion 110 at one end of a circuit board for connecting to a contact portion of a connector to make an electrical connection, The plating lead 120 is formed with a predetermined line width up to the circuit board front end portion 130, and the plating lead 120 has a diameter increasing portion 123 having a diameter increasing from a predetermined position toward the circuit board front end portion 130. is doing.

フレキシブルプリント回路板１００は、基材１０１、導体回路１０３、端子部１１０、めっきリード１２０、カバーフィルム１５０で構成されている。フレキシブルプリント回路板１００の少なくとも一端には接続部１６０が形成されている。接続部１６０はカバーフィルム１５０によって被覆されておらず、そこに露出する端子部１１０により先端側端子列２ａと根元側端子列２ｂの２列の端子列が形成され、それぞれの端子列からは端子部１１０のめっき処理のためのめっきリード１２０が基板先端まで延びている。また接続部１６０の裏面には補強のための補強板２００（不図示）が貼り付けられている。めっきリード１２０は、所定の回路幅で形成されている。めっきリード１２０の回路幅としては、端子部１１０ａと端子部１１０ｂの間隔の約１／３とすることが好ましい。たとえば、端子部１１０ａ，端子部１１０ｂの間の間隔が、０．９ｍｍとしたとき、めっきリード１２０の幅は、０．３ｍｍとすることが好ましい。   The flexible printed circuit board 100 includes a base material 101, a conductor circuit 103, a terminal portion 110, a plating lead 120, and a cover film 150. A connecting portion 160 is formed on at least one end of the flexible printed circuit board 100. The connecting portion 160 is not covered with the cover film 150, and the terminal portion 110 exposed there forms two terminal rows of the tip side terminal row 2a and the root side terminal row 2b. A plating lead 120 for plating the portion 110 extends to the tip of the substrate. Further, a reinforcing plate 200 (not shown) for reinforcement is attached to the back surface of the connecting portion 160. The plating lead 120 is formed with a predetermined circuit width. The circuit width of the plating lead 120 is preferably about 1/3 of the interval between the terminal portion 110a and the terminal portion 110b. For example, when the distance between the terminal portion 110a and the terminal portion 110b is 0.9 mm, the width of the plating lead 120 is preferably 0.3 mm.

拡径部１２３は、所定の位置から、回路板先端部に向かって設けられている。拡径を開始する位置については、特に限定はされないが、先端側端子列２ａより、回路板先端部の位置から開始することが好ましい。また、拡径し先端部の回路幅は、めっきリード幅の２倍程度が好ましい。これにより、先端部に設けられためっきリードの引き剥がし強さが二倍となりコネクター挿抜時めっきリードのはがれを防止することができる。   The enlarged diameter portion 123 is provided from a predetermined position toward the tip of the circuit board. The position at which the diameter expansion is started is not particularly limited, but it is preferable to start from the position of the front end portion of the circuit board from the front end side terminal row 2a. Further, the circuit width of the enlarged tip portion is preferably about twice the plating lead width. This doubles the peeling strength of the plating lead provided at the tip, and prevents the plating lead from peeling off when the connector is inserted or removed.

回路板１００を構成する基材１０１としては、例えば樹脂フィルム基材等が挙げられる。樹脂フィルム基材としては、例えばポリイミド樹脂フィルム、ポリエーテルイミド樹脂フィルム、ポリアミドイミド樹脂フィルム等のポリイミド樹脂系樹脂フィルム、ポリアミド樹脂フィルム等のポリアミド樹脂系フィルム、ポリエステル樹脂フィルム等のポリエステル樹脂系フィルムが挙げられる。このうち、弾性率と耐熱性を向上させる観点から、特にポリイミド樹脂系フィルムが好ましく用いられる。   Examples of the substrate 101 constituting the circuit board 100 include a resin film substrate. Examples of the resin film substrate include polyimide resin films such as polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films such as polyamide resin films, and polyester resin films such as polyester resin films. Can be mentioned. Of these, a polyimide resin film is particularly preferably used from the viewpoint of improving the elastic modulus and heat resistance.

基材１０１の厚さは、特に限定されないが、５〜５０μｍが好ましく、特に１２．５〜２５μｍが好ましい。厚さがこの範囲内であると、特に屈曲性に優れる。   Although the thickness of the base material 101 is not specifically limited, 5-50 micrometers is preferable and 12.5-25 micrometers is especially preferable. When the thickness is within this range, the flexibility is particularly excellent.

導体回路１０３は、さらに表面の一部を残して表面被覆層１５０で覆われていてもよい。表面被覆層は、絶縁性樹脂フィルムと接着剤で構成されるカバーレイフィルムでもよいし、熱硬化性樹脂を含む液状体の樹脂組成物をスクリーン印刷法などにより形成し加熱硬化してもよい。   The conductor circuit 103 may be further covered with the surface coating layer 150 leaving a part of the surface. The surface coating layer may be a cover lay film composed of an insulating resin film and an adhesive, or a liquid resin composition containing a thermosetting resin may be formed by screen printing or the like and cured by heating.

本発明の実施形態による回路板１００の製造方法は、特に限定はされるものではなく、一般に知られている両面回路板の製造方法によってることが出来る。   The method for manufacturing the circuit board 100 according to the embodiment of the present invention is not particularly limited, and can be performed by a generally known method for manufacturing a double-sided circuit board.

本発明の一実施形態である回路板の先端部分を示す平面図である。It is a top view which shows the front-end | tip part of the circuit board which is one Embodiment of this invention. 従来の回路板の先端部分を示す平面図である。It is a top view which shows the front-end | tip part of the conventional circuit board.

符号の説明Explanation of symbols

１００ 回路板
１１０ 導体部
１１２ 電気めっき
１１５ ブラインドビア
１２０ めっきリード
１３０ 一方の面側の導体回路
１５０ 他方の面側の導体回路
２１０ 基材 DESCRIPTION OF SYMBOLS 100 Circuit board 110 Conductor part 112 Electroplating 115 Blind via 120 Plating lead 130 Conductor circuit 150 on one surface side Conductor circuit 210 on the other surface side Base material

Claims (2)

コネクターのコンタクト部に接続して電気的接続をはかるためのコネクター接続用回路端子部を回路板の一端に有するフレキシブルプリント回路板であって、
前記端子部から、めっきリードが所定の線巾で回路板先端部まで形成されているとともに、前記めっきリードは、所定の位置から前記回路板先端部に向かって前記線巾か拡径していることを特徴とするフレキシブルプリント回路板。 A flexible printed circuit board having a connector terminal for connecting to a contact part of a connector for electrical connection at one end of the circuit board,
A plating lead is formed from the terminal portion to the front end of the circuit board with a predetermined line width, and the plating lead is enlarged in diameter from the predetermined position toward the front end of the circuit board. The flexible printed circuit board characterized by the above-mentioned. 前記端子部は、前記回路板先端側とその根本側の二列の端子列からなる千鳥配列を有している請求項１に記載のフレキシブルプリント回路板。   2. The flexible printed circuit board according to claim 1, wherein the terminal portion has a staggered arrangement composed of two rows of terminal rows on a front end side of the circuit board and a root side thereof.
JP2007122934A 2007-05-08 2007-05-08 Flexible printed circuit board Active JP4882857B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110048791A1 (en) * 2009-08-28 2011-03-03 Nitto Denko Corporation Printed circuit board and method of manufacturing the same
CN103068159A (en) * 2012-12-14 2013-04-24 意力(广州)电子科技有限公司 Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC

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JP2002057424A (en) * 2000-08-09 2002-02-22 Internatl Business Mach Corp <Ibm> Printed wiring board and its manufacturing method
JP2003347699A (en) * 2002-05-24 2003-12-05 Canon Inc Flexible printed wiring board
JP2004207650A (en) * 2002-12-26 2004-07-22 Sumitomo Electric Printed Circuit Inc Substrate for flexible printed wiring
JP2006173239A (en) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd Wiring substrate, its manufacturing method, and electronic equipment using the same

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JPS6312872A (en) * 1986-07-01 1988-01-20 Aisan Ind Co Ltd Air bleed controller for carburetor
JP2002057424A (en) * 2000-08-09 2002-02-22 Internatl Business Mach Corp <Ibm> Printed wiring board and its manufacturing method
JP2003347699A (en) * 2002-05-24 2003-12-05 Canon Inc Flexible printed wiring board
JP2004207650A (en) * 2002-12-26 2004-07-22 Sumitomo Electric Printed Circuit Inc Substrate for flexible printed wiring
JP2006173239A (en) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd Wiring substrate, its manufacturing method, and electronic equipment using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110048791A1 (en) * 2009-08-28 2011-03-03 Nitto Denko Corporation Printed circuit board and method of manufacturing the same
JP2011049462A (en) * 2009-08-28 2011-03-10 Nitto Denko Corp Printed circuit board and method of manufacturing the same
CN102006718A (en) * 2009-08-28 2011-04-06 日东电工株式会社 Printed circuit board and method of manufacturing the same
CN103945642A (en) * 2009-08-28 2014-07-23 日东电工株式会社 Printed circuit board and method of manufacturing the same
CN103957662A (en) * 2009-08-28 2014-07-30 日东电工株式会社 Printed circuit board and method of manufacturing the same
US8895870B2 (en) 2009-08-28 2014-11-25 Nitto Denko Corporation Printed circuit board and method of manufacturing the same
CN107846773A (en) * 2009-08-28 2018-03-27 日东电工株式会社 Wired circuit board and its manufacture method
CN103068159A (en) * 2012-12-14 2013-04-24 意力(广州)电子科技有限公司 Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC
CN103068159B (en) * 2012-12-14 2015-12-09 意力(广州)电子科技有限公司 A large FPC and composition method when making FPC

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