JP2008277864A - Method for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, which can efficiently manufacture an electronic device, such as very small coil in which conductor wirings are hardly short-circuited each other, without entailing a large amount of time and work. <P>SOLUTION: The method includes the steps of winding or laminating a multilayer film 4 comprising a conductor wiring 2 and an insulating layer 3 so as to form a wound body 5 as a laminate; bonding the layers of the wound body 5; cutting the wound body 5 to be a predetermined thickness; etching a cutting surface of the wound body 5; after etching process, melting the insulating layer 3 which remains on the edge of the cutting surface, and covering the edge of the cutting surface of the electronic component with the insulating layer 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing an electronic component suitable for a small and thin planar motor and a coil used for the same.

  As a conventional flat motor, a thin flat motor in which a driving coil and a magnet are arranged to face each other and torque is generated by electromagnetic interaction is already known. For example, Patent Documents 1 to 3 disclose a method for manufacturing a coil used in such a flat motor. As one of the coil manufacturing methods, a film made of an insulating layer and a conductor layer is wound around a winding core. There is a method of cutting to a predetermined thickness after winding.

A conventional coil manufacturing method will be described below with reference to FIGS. 6 (a) to 6 (c) and (c ′). In FIG. 6A, 1 is a winding core made of a conductive material, 2 is a conductor wiring, and 3 is an insulating layer. The conductor wiring 2 and the insulating layer 3 are bonded together to form a film 4 composed of two layers. The winding core 1 is joined to the conductive wiring 2 while ensuring electrical continuity, and the film 4 is wound around the winding core 1 while applying tension, thereby obtaining a wound body 5 as shown in FIG. Next, the wound body 5 was cut into a predetermined thickness to obtain a coil 6 as shown in FIGS. 6 (c) and 6 (c '). As a specific method of cutting, methods such as a dicing saw, a wire saw, and electric discharge machining have been used.
Japanese Patent Laid-Open No. 10-303013 JP-A-10-223427 Japanese Patent Laid-Open No. 10-341549

  However, as shown in FIGS. 6C and 6C, the coil 6 obtained by such a method is generally cut out and the conductor wiring 2 is generally exposed to the outside. . For this reason, as shown in FIGS. 7A and 7B, the process until the coil 6 is connected to the substrate, for example, the coil 6 is attracted by the suction nozzle 12 to be handled on the platform 13. When temporarily pressed, for example, the conductive foreign material 15 adheres to the cross section 6a of the coil 6 (external surface exposed by cutting in the cutting process) 6a, or the cross section 6a of the coil 6 has conductivity. There is a possibility that the adjacent conductive wirings 2 may come into contact with each other due to the foreign matter 15 having the foreign matter 15 placed thereon, and cause a defect such as an interlayer short circuit.

  As a method for dealing with this, a measure for preventing an interlayer short circuit has been taken by adding a step of forming a coating film of an insulator such as a resin to a portion where the conductive wiring 2 is exposed in the cross section 6a of the coil 6. However, in practice, the winding core 1 made of a conductive material is often used as an electrode. Therefore, it is necessary to form an insulating film so as to avoid the winding core 1. Conventionally, the coil 6 has a relatively large diameter of several tens to several millimeters. However, in recent years, with the miniaturization of products, a minute coil 6 having a diameter of about 1 mm is required. Furthermore, in order to realize a high space factor, the thickness of the insulating layer 3 between layers is also reduced. However, in such a small coil 6 having a diameter smaller than about 5 mm, it is difficult to apply an insulating film only to the outer surface portions of the conductor wiring 2 and the insulating layer 3, so that much labor and time are required. As a result, productivity has been reduced. Further, since it is necessary to bring the insulating film supply device itself close to the conductor wiring 2, the supply device collides with the outer surface of the conductor wiring 2, and the conductor wirings 2 are short-circuited with each other, or the outer surface of the conductor wiring 2. In addition, there is a problem that foreign matter attached to the supply device adheres.

  The present invention solves the above-mentioned problems and problems, and efficiently manufactures electronic parts such as coils that are difficult to short-circuit between conductor wirings even when the size is extremely small, without much time and effort. An object of the present invention is to provide a method for manufacturing an electronic component.

  In order to solve the above problems and problems, the electronic component manufacturing method of the present invention forms a laminate by winding or laminating a multilayer film comprising at least one conductor layer and at least one insulating layer. A step of bonding the layers of the laminate, a step of cutting the laminate into a shape having a predetermined thickness, a step of etching the cut surface of the laminate, and an insulating layer remaining on the end surface of the cut surface after the etching process And a step of melting and covering an end face of the cut surface of the electronic component with an insulating layer. As a result, even when the electronic component is extremely small in size, it is possible to efficiently manufacture an electronic component such as a coil in which the conductor wirings are not easily short-circuited.

  In addition, the method for manufacturing an electronic component according to the present invention is characterized in that the insulating layer is formed to be thicker than the conductor wiring by etching the cut surface of the laminate. Thereby, the production efficiency is further improved.

  According to the present invention, after the etching process, the insulating layer remaining on the end surface of the cut surface is melted and the end surface of the electronic component is covered with the insulating layer. Thus, even when the electronic components are extremely small in size, it is possible to efficiently manufacture electronic components such as coils that are difficult to short-circuit the conductor wires.

  Further, the production efficiency is further improved by collectively performing the process of melting the insulating layer remaining on the end face by the heat treatment when mounting the electronic component on the substrate.

  According to the first aspect of the invention, a step of winding or laminating a multilayer film comprising at least one conductor layer and at least one insulating layer to form a laminate, and bonding the layers of the laminate A step of cutting the laminate into a shape having a predetermined thickness, a step of etching the cut surface of the laminate, and after the etching process, the insulating layer remaining on the end surface of the cut surface is dissolved to cut the end surface of the electronic component. And a step of covering with an insulating layer.

According to this method, since the insulating layer remaining on the end surface of the cut surface is dissolved and the end surface of the electronic component is covered with the insulating layer, the end surface of the electronic component can be efficiently covered with the insulating layer material.
According to a second aspect of the present invention, in the method of manufacturing an electronic component according to the first aspect, the insulating layer is formed in a shape that remains thicker than the conductor wiring by etching the cut surface of the laminate. And

  According to a third aspect of the present invention, in the method of manufacturing an electronic component according to the first or second aspect, the insulating layer remaining on the end surface is melted by heat treatment when the electronic component is mounted on the substrate to thereby remove the end surface of the electronic component. It is characterized by covering with an insulating layer.

  According to this method, the process of melting the insulating layer remaining on the end face can be performed in a batch by the heat treatment when mounting the electronic component on the substrate. Efficiency is improved.

  According to a fourth aspect of the present invention, in the method of manufacturing an electronic component according to any one of the first to third aspects, the insulating layer is sandwiched around the winding core made of the first metal as the center electrode. A step of forming a conductor wiring made of a second metal different from the first metal in a spiral shape to form an electronic component, and then etching the entire electronic component to determine the thickness of the conductor wiring. And a step of making it thinner than the thickness of the core.

  According to this method, since the thickness along the axial direction of the winding core is thicker than the thickness of the conductor wiring, when the electronic component is placed on a mounting base, only the winding core contacts the mounting base. In this case, the outer surface of the conductor wiring is in a posture with a gap from the mounting base and the like, and it is difficult for foreign matter to adhere to the conductor wiring, thereby making it difficult to short-circuit the conductor wiring.

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
FIG. 1 shows a coil and a manufacturing method thereof according to an embodiment of the present invention.
In FIG. 1A, 1 is a winding core that finally becomes a central electrode of a coil 6 (see FIG. 1D), 2 is a conductor wiring made of a conductive foil, and 3 is an insulating layer that also serves as an adhesive layer. . Here, the core 1 used as a center electrode should just use an electroconductive material, for example, copper, aluminum, or an alloy containing these, iron, stainless steel, etc. are used. A conductive material may be used as the material of the conductor wiring 2 made of the conductive foil, and for example, copper, aluminum, or an alloy containing them may be used. More preferably, copper is preferable for the conductor wiring 2 in order to reduce the electric resistance. Moreover, as the insulating layer 3, an insulating resin film or the like may be used, and if an adhesive layer having an adhesive property is further coated thereon, an interlayer adhesive force between the conductor wiring 2 and the insulating layer 3 can be obtained. Can do. Moreover, if the insulating layer 3 is made of, for example, a PET resin film that exhibits adhesiveness by heat treatment, the insulating layer 3 and the adhesive layer can be used as a single layer, which is even better.

Here, in particular, as the material of the winding core 1, a material that is more difficult to dissolve than the conductor wiring 2 in the etching process that dissolves the metal is selected.
A manufacturing method for obtaining the coil 6 as described above will be described below with reference to FIG.

  First, as shown in FIG. 1A, the end portion of the film 4 composed of two layers of the conductor wiring 2 and the insulating layer 3 is joined to the winding core 1. The joining method of the winding core 1 and the conductor wiring 2 can be realized by joining with a conductive adhesive or solder, or ultrasonic joining.

  Next, the two-layer film 4 is wound around the winding core 1 a predetermined number of times, and a wound body 5 shown in FIG. 1B is created (a wound body creating step). For example, a material having a trapezoidal cross section with a diameter of about 1.0 mm and a length of 60 mm is used as the material of the winding core 1, and a conductor wiring 2 made of copper having a thickness of 4 μm and an insulating layer 3 made of PET also serving as an adhesive layer having a thickness of 1 μm. Is wound around the core 1 30 times, the wound body 5 has a diameter of about 1.3 mm.

  The wound body 5 was subjected to interlayer adhesion by a heat treatment at 120 ° C. for 30 minutes (interlayer adhesion process), and then cut into a thickness of 250 μm using a dicing saw (cutting process). FIG. 1 (c) and FIG. The coil 6 shown in (c ′) was obtained. That is, in the coil 6, the conductor wiring 2 made of Cu layer and the insulating layer 3 made of PET are alternately arranged around the core 1 that is the center electrode.

  Next, in order to remove the interlayer short of the conductor wiring 2 on the cut surface of the wound body 5 (cross section 6a of the coil 6), the temperature range is 22.5 ° C. ± 0. Etching was performed for 6 minutes at 5 ° C. (etching step). Furthermore, ultrasonic cleaning with pure water was performed for 5 minutes and cleaning with running water was performed for 10 minutes to remove residual ions. By this etching process, the conductor wiring 2 (Cu) of the cross section 6a of the coil 6 is retreated by 10 to 20 μm, and the interlayer short is completely removed.

  At this time, as the material of the winding core 1, a material that is harder to be etched than the material of the conductor wiring 2 and the insulating layer 3 is used. Therefore, as shown in FIG. The thickness becomes thicker than the thickness of the conductor wiring 2 and the insulating layer 3, and a step is generated. Due to this step, as shown in FIG. 2, even when there is a foreign object 15 on the mounting table 13, the foreign object 15 contacts the cross section 6 a of the coil 6 when handling using the suction nozzle 12. The possibility of damaging the cross section 6a of the coil 6 by the foreign material 15 can be reduced. Further, it is possible to reduce the possibility of being damaged by dust or foreign matter existing on the substrate when the coil 6 is mounted.

  The difference between the thickness of the winding core 1 and the thickness of the conductor wiring 2 is desirably 5 μm or more. With this configuration, it is possible to reduce the probability that the foreign matter 15 comes into contact with or strongly hits the cross section 6a of the coil 6. Further, in order to make the difference between the thickness of the winding core 1 and the thickness of the conductor wiring 2 larger than 50 μm, the processing time in the etching process becomes extremely long and the production efficiency is lowered. The difference between the thickness of the conductor wire 2 and the thickness of the conductor wiring 2 is desirably 50 μm or less.

In addition, the etching treatment for dissolving the metal may use either a chemical reaction with a chemical solution or a dissolution reaction by applying electricity.
In the above embodiment, since the ultrasonic cleaning is performed for 5 minutes after performing the etching process, the thickness of the insulating layer 3 is substantially equal to the thickness of the conductor wiring 2. The sonic cleaning time may be set to 3 minutes or less, or the ultrasonic cleaning may not be performed. According to this, as shown in FIG. 1 (e), a coil 6 having a shape in which the insulating layer 3 made of PET remains thicker than the conductor wiring 2 can be obtained.

  In this case, the conductor wiring 2 retreats by 10 to 20 μm by the etching process, but the insulating layer 3 remains as it is, so that the insulating layer 3 protrudes from the conductor wiring 2 by 10 to 20 μm. Further, after washing with running water for 20 minutes, the coils 6 are arranged on a clean glass plate 10 and subjected to heat treatment at 120 ° C. for 10 minutes in a heating furnace. During the heat treatment, the insulating layer 3 is softened, and the protective layer 9 made of the material of the insulating layer 3 having a thickness of about 1 to 10 μm is formed on the surface of the coil cross section 6a excluding the winding core 1 by the surface tension. By this method, the protective layer 9 can be satisfactorily formed on the surface of the coil cross section 6a excluding the winding core 1 even for an extremely small coil 6.

  That is, conventionally, a method of applying a resin to the cross section for protecting the coil cross section 6a has been tried. If the size of the coil is as large as 5 mm or more, the conductor wiring 2 of the coil 6 is used. The wiring width w (see FIG. 1D) was relatively large and easy to apply. However, as shown in the above embodiment, in the case of the small coil 6 having a diameter of approximately 5 mm or less, the wiring width w is Application was difficult because it was only about 0.15 mm. However, according to the above embodiment, the protective layer 9 can be satisfactorily formed even for the extremely small coil 6.

  Further, as shown in FIGS. 3 and 4, this heat treatment step may be performed simultaneously with the mounting of the coil 6 on the substrate, and in this case, it is not necessary to provide a special heating step. There is no fear. 3A and 3B, a heater 10 is provided at the tip of the suction nozzle 12, the coil 6 is conveyed to the land 14 on the substrate 11, and the winding core 1 of the coil 6 is placed on the substrate 11. The case where the protective layer 9 is formed by heating the coil 6 with the heater 10 when mounted on the land 14 is shown. 4A and 4B, the substrate 11 itself is placed on the heater 10, the coil 6 is conveyed to the land 14 on the substrate 11, and the winding core 1 of the coil 6 is placed on the substrate 11. The case where the protective layer 9 is formed by heating the coil 6 through the substrate 11 by the heater 10 when mounted on the land 14 is shown.

  Furthermore, as shown in FIG. 5, a recess 16 may be formed at a location on the substrate 11 where the winding core 1 of the coil 6 is mounted. That is, by making the thickness along the axial direction of the winding core 1 thicker than the thickness of the conductor wiring 2, the coil 6 is formed with a convex portion 17 consisting of a stepped portion of the winding core 1. Alternatively, it may be mounted by being fitted into a recess 16 provided on the substrate 11.

  According to this method, since the convex portion 17 formed of the winding core 1 itself can be fitted into the concave portion 16 of the substrate 11 and aligned, alignment that is the alignment of the coil 6 with the substrate 11 can be performed easily and accurately. It can be carried out.

  Moreover, in the said embodiment, although the case where the coil 6 as an electronic component was manufactured was demonstrated, it is not restricted to this, It is also possible to apply to another electronic component and its manufacturing method.

  Further, by using the coil 6 (including the one with the substrate 11) shown in these embodiments for a planar motor as an example of an electronic apparatus, the planar motor is small and thin, and is reliable. Can achieve something high. Furthermore, by using this planar motor for a vibration motor as another example of an electronic device, a vibration motor that is small and thin and has high reliability can be realized.

  In addition, by using this vibration motor for receiving operation of a mobile terminal as another example of an electronic device, it is possible to realize a small, thin, and highly reliable mobile terminal, By using a planar motor as a rotating means of a recording medium, a drive device for magnetic recording, layer change recording, or magneto-optical recording as still another example of an electronic device can be reduced in size and thickness, and Reliability can be improved.

(A)-(f) shows the coil as an electronic component which concerns on embodiment of this invention, (a) is a winding core of a coil, and a perspective view of a film, (b) is a wound body preparation process. (C) is a front view of a state immediately after cutting the wound body of the coil, (c ′) is a cross-sectional view of the state immediately after cutting the wound body of the coil, and (d) is the same as FIG. Sectional view of coil, (e) is a sectional view before heating a coil according to another embodiment of the present invention, (f) is a sectional view after overheating of the coil The figure which shows schematically the state which handled the coil as an electronic component which concerns on embodiment of this invention with the suction nozzle. (A) And (b) is a figure which shows schematically the state before mounting the coil as an electronic component which concerns on other embodiment of this invention with a suction nozzle, and the state after mounting, respectively. (A) And (b) is a figure which shows schematically the state before mounting the coil as an electronic component which concerns on other embodiment of this invention with a suction nozzle, and the state after mounting, respectively. (A) And (b) is a figure which shows schematically the state before mounting the coil as an electronic component which concerns on further another embodiment of this invention with a suction nozzle, and the state after mounting, respectively. (A)-(c ') shows the conventional coil, (a) is a perspective view of the winding core and film of the conventional coil, (b) is a perspective view which shows the wound body preparation process of the conventional coil. (C) is a front view of the state immediately after cutting the winding body of the conventional coil, and (c ') is a cross-sectional view of the state immediately after cutting the winding body of the conventional coil. (A) is a figure which shows the state which handled the conventional coil with the suction nozzle schematically, (b) is the figure which shows the state where the foreign substance has adhered on the conventional coil

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Winding core 2 Conductor wiring 3 Insulating layer 4 Film 5 Winding body 6 Coil 6a Section 9 Protective layer 10 Heater 11 Substrate 12 Adsorption nozzle 13 Platform 14 Land 15 Foreign substance 16 Concave part 17 Convex part

Claims (4)

Winding a multilayer film comprising at least one layer of conductor wiring and at least one layer of insulating layer, or laminating to form a laminate;
Bonding the layers of the laminate,
Cutting the laminate into a predetermined thickness; and
Etching the cut surface of the laminate;
And a step of dissolving the insulating layer remaining on the end surface of the cut surface after the etching process and covering the end surface of the electronic component with the insulating layer.   The method of manufacturing an electronic component according to claim 1, wherein the insulating layer is formed to be thicker than the conductor wiring by etching the cut surface of the laminate.   3. The method of manufacturing an electronic component according to claim 1, wherein the insulating layer remaining on the end surface is melted by heat treatment when the electronic component is mounted on the substrate, and the end surface of the electronic component is covered with the insulating layer. A step of forming an electronic component by arranging a conductor wire made of a second metal different from the first metal in a spiral manner around a winding core made of the first metal as a center electrode, with an insulating layer interposed therebetween; ,
The electronic device according to claim 1, further comprising a step of etching the entire electronic component to make the thickness of the conductor wiring thinner than the thickness of the winding core. A manufacturing method for parts.

Images