JP2008270691A - Brazed flow channel plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a brazed flow channel plate in which the occurrence of the clogging of the flow channel caused by a molten brazing material is suppressed, in the brazed flow channel plate including a plurality of brazing sheets stacked on top of one another, and bonded to each other with a flow channel formed therebetween. <P>SOLUTION: Outermost brazing sheets 12A and 12D in the stacking direction of the brazing sheets 12A, 12B, 12C and 12D configuring the brazed flow channel plate has brazing material escape through holes 14 and 15 reaching the extending surface of a bonding surface facing the flow channel 11b and 11c spaces. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a brazing flow path plate used for, for example, a radiator that cools a passing liquid.

  For example, a cooling system for a CPU (heat source) that generates heat has, as a basic component, a cooling jacket that contacts the CPU and takes heat away, a radiator, and a liquid pump that circulates a cooling liquid between the cooling jacket and the radiator. Each element is miniaturized and highly reliable so that it can be mounted on a small device such as a notebook PC.

  Of these, a brazing flow path plate in which a radiator is generally bonded using at least two brazing sheets each having a sheet core material made of a metal material and a brazing material formed on and attached to at least one surface of the sheet core material. Is used. By superposing these brazing sheets and heating them with a flow path formed between them, the brazing material is melted and bonded. The adhesion structure and adhesion method of the brazing flow path plate using such a brazing sheet are well known.

In such a brazing flow path plate, there has been a problem that the melted excess brazing material may block the flow path.
Japanese Patent Laid-Open No. 11-87583 JP 2005-283093 A JP 2005-166030 A

However, the radiator developed by the present applicant is required to be extremely thin and small, and one channel cross-sectional area is as small as about ² mm ² . For this reason, there is a possibility that a small amount of brazing material overflows in the flow path and the flow path cannot be secured.

  The present invention is based on the above problem awareness, and in a brazed flow path plate in which a plurality of brazing sheets are laminated to form a flow path, the flow path can be maintained even with a melted brazing material, even when the flow path cross-sectional area is small. An object of the present invention is to obtain a brazed flow path plate with a low possibility of blocking.

  According to the present invention, a brazing sheet positioned on the outermost side in the laminating direction is provided with a solder escape through hole that reaches the extended surface of the adhesive facing surface facing the flow path space. This is based on the viewpoint that the portion can be released to the outside from the solder escape through hole, and the possibility that the brazing material can block the flow path can be reduced.

  That is, the present invention laminates and bonds a plurality of (at least two) brazing sheets having a sheet core material made of a metal material and a brazing material adhered and formed on at least one surface of the sheet core material. In the brazed flow path plate that forms a flow path between the brazing sheets, at least one of the pair of brazing sheets located on the outermost side in the stacking direction reaches the extended surface of the adhesive facing surface facing the flow path space. It is characterized by forming a through hole.

  In one specific embodiment, the plurality of brazing sheets are a central sheet having flow-through holes; and the flow-through holes of the central sheet are closed, and an adhesive facing surface is formed at a portion other than the flow-through holes. A front and back sheet having a wax escape through hole reaching the top.

  It is preferable that a wax escape through hole communicating with the wax escape through holes of the front and back sheets is further formed in the center sheet.

  The central sheet can be in one mode, but when all brazing sheets are thin and have the same thickness, a plurality of central sheets can be used to increase the flow area, and the front and back sheets can each be one sheet. is there.

  In another aspect, the plurality of brazing sheets are composed of a pair of front and back surfaces in which at least one channel recess is formed, and at least one of the brazing sheets is positioned at a portion other than the channel recess to form a row escape through hole can do.

  In this aspect, it is possible to form the wax escape through holes by matching at least a part of the planar positions on the front and back brazing sheets. Of course, the planar position may be completely coincident.

  In either embodiment, when the solder escape through hole is formed in a long shape along the flow path, it is possible to more effectively prevent the brazing material from escaping into the flow path. Moreover, it is preferable that the wax escape through hole is intermittently formed along the flow path.

For example, when the flow path has a plurality of linear portions that are parallel to each other, the wax escape through hole may be formed between adjacent linear flow paths in parallel with the linear flow path.

  According to the present invention, in the brazed flow path plate in which a plurality of brazing sheets are stacked and a flow path is formed between the brazing sheets, at least one of the outermost brazing sheets faces the flow path space. Since the solder escape through hole reaching the extended surface of the bonding facing surface is formed, the melted brazing material can be released from the solder escape through hole to the outside. For this reason, it is possible to obtain a brazed flow path plate with a low possibility that the melted brazing material will block the flow path.

  1 to 3 show an embodiment in which a brazing flow path plate according to the present invention is applied to a flow path sheet (heat dissipating sheet) 10 of a liquid cooling system for cooling a CPU 101 and a GPU 102 of a notebook PC. A CPU 101, a GPU 102, a piezoelectric pump 20, a radiator 40, and a reserve tank 50 are mounted on one surface of the flow path sheet 10. The CPU 101 and the GPU 102 are installed on the flow path sheet 10 via cooling jackets 101a and 102a, respectively.

  A flow path 11 is formed in the flow path sheet 10. When this flow path 11 is followed in order from the piezoelectric pump 20, the flow path 11 a that exits the discharge port 34 of the piezoelectric pump 20 reaches the inlet hole 51 of the reserve tank 50, and the flow path that exits the exit hole 52 of the reserve tank 50. 11 b reaches the inlet hole 102 c of the flow path 102 b of the cooling jacket 102 a of the GPU 102 after turning around the outer periphery of the flow path sheet 10. The flow path 11c that exits the outlet hole 102d of the flow path 102b reaches the inlet hole 101c of the flow path 101b of the cooling jacket 101a of the CPU 101. The channel 11d that has exited the outlet hole 101d of the channel 101b reaches the inlet hole 47 of the radiator 40, flows through the channel in the radiator 40, reaches the outlet hole 48, and then passes through the channel 11e and passes through the piezoelectric pump 20. The suction port 35 is returned to. A cooling fan (sirocco fan) 60 (FIG. 1) is installed on the side surface of the radiator 40.

  The flow path sheet 10 is arranged with the piezoelectric pump 20, the radiator 40, the reserve tank 50, the cooling jacket 101a (CPU 101), and the cooling jacket 102a (GPU 102) facing downward in the keyboard of the notebook PC. For the sake of convenience, a figure drawn upside down is also included.

  In the liquid cooling system described above, the liquid discharged from the piezoelectric pump 20 absorbs heat while passing through the cooling jacket 101a of the CPU 101 and the cooling jacket 102a of the GPU 102, and the heated liquid flows in the radiator 40. In addition, the cooling air received by the sirocco fan 60 is cooled and the circulation returning to the piezoelectric pump 20 is repeated. In addition, while the liquid is flowing through the flow path 11, the heat of the liquid is partly dissipated by the flow path sheet 10, and there is an effect of making the heat distribution of the entire cooling system uniform.

  4 to 6 show a specific embodiment of the flow path sheet 10 used in the above liquid cooling system. The flow path sheet 10 of this embodiment is formed by stacking and bonding four brazing sheets 12A, 12B, 12C, and 12D having the same thickness (for example, 0.4 mm). As schematically shown in FIG. 6, the brazing sheets 12 </ b> A to 12 </ b> D include a sheet core material s made of a metal material (generally an aluminum alloy), and a brazing material r formed on the front and back surfaces of the sheet core material s. The through holes can be formed in an arbitrary shape by pressing, and the brazing materials r are melted and bonded to each other by heating them under pressure while being brought into contact with each other. The brazing plate generally has a thickness of about 0.2 mm to 0.5 mm, but the configuration of the brazing sheet is not limited in the present invention.

  As shown in FIG. 4, the two central brazing sheets 12B and 12C have the same shape, and the flow path through holes 13 constituting the flow paths 11a to 11e and the flow path through holes 13 are positioned. Are formed (drilled). In FIG. 4, the flow path through hole 13 is hatched. The row escape through-holes 14 are intermittently formed along the flow-path through-holes 13 and are individually long. The flow passage through holes 13 have linear portions parallel to each other, and the wax escape through holes 14 are parallel to the flow passage through holes 13 between the adjacent flow passage through holes 13. Is formed.

  The brazing sheets 12A and 12D on the front and back sides (outermost in the stacking direction) are not formed with holes in the portions corresponding to the flow-through holes 13 of the central brazing sheet 12B (12C). 12C), the front and back of the flow path through hole 13 are closed, and flow paths 11a to 11e are formed. The brazing sheets 12A and 12D are formed with a row escape through hole 15 corresponding to the row escape through hole 14 of the brazing sheet 12B (12C) and positioned at the same plane position as the row escape through hole 14 ( Drilled). The wax escape through hole 15 passes through an extended surface of the adhesion facing surface facing the flow paths (spaces) 11a to 11e. That is, the bonding facing surfaces of the brazing sheets 12A and 12B, the bonding facing surfaces of the brazing sheets 12B and 12C, and the bonding facing surfaces of the brazing sheets 12C and 12D face the flow paths (spaces) 11a to 11e, respectively. Wax escape holes 14 and 15 are formed in the extended surface.

  On the brazing sheet 12D (surface on which the CPU 101, GPU 102, piezoelectric pump 20, radiator 40 and reserve tank 50 of the flow path sheet 10 are mounted), as shown in FIG. 35, the passage holes 35 'and 34' communicating with 35, the passage holes 51 'and 52' corresponding to the inlet hole 51 and the outlet hole 52 of the reserve tank 50, and the inlet hole 102c and the outlet hole 102d of the cooling jack 102a. Channel holes 102c ′ and 102d ′, channel holes 101c ′ and 101d ′ communicating with the inlet hole 101c and outlet hole 101d of the cooling jack 101a, and channel holes 47 ′ communicating with the inlet hole 47 and outlet hole 48 of the radiator 40 And 48 'are respectively drilled. These flow path holes communicate with the flow path 11 (flow path through hole 13).

  When the above brazing sheets 12A to 12D are joined with their planar positions aligned, the flow passage through holes 13 of the brazing sheet (center sheet) 12B (12C) are closed by the brazing sheets (front and back sheets) 12A and 12D, A flow path 11 (11a to 11e) is formed. At this time, a part of the brazing material r which is about to leak into the flow paths 11a to 11e escapes to the outside through the solder escape through holes 14 and 15. For this reason, possibility that a brazing material will block a flow path can be made low. Moreover, since these wax escape through holes 14 and 15 are in contact with the outside air and increase the surface area of the passage sheet 10 with respect to the outside air, the heat dissipation of the passage sheet 10 itself can be increased.

  In the above embodiment, the wax escape through hole 14 is formed in the central brazing sheet 12B (12C), and the wax escape through hole 15 formed in the brazing sheet 12A (12D) on the front and back sides. Are communicating. Thus, if the solder escape through hole penetrates the entire flow path sheet 10, the brazing material r can be effectively discharged. However, even if the solder relief through hole 15 is formed only in the front and back brazing sheets 12A (12D) and the solder relief through hole 14 is not formed in the central brazing sheet 12B (12C), a certain brazing material discharging effect is obtained. Can be expected.

  Moreover, the above embodiment can change (set) a required flow-path cross-sectional area by making the brazing sheets 12A thru | or 12D into the same thickness, and increasing / decreasing the number of center brazing sheets 12B (12C). There are advantages. However, as shown in FIG. 7, it is needless to say that the central brazing sheet 12B ′ may be a single sheet. In FIG. 7, the same elements as those of FIG. In this aspect, the thickness of the central brazing sheet 12B ′ can be changed according to the required flow path cross-sectional area.

  FIG. 8 is an embodiment in which the present invention is applied to a mode in which the flow path sheet 10 is formed by two (a pair) brazing sheets (front and back sheets) 12E and 12F. The brazing sheet 12E is formed with a channel recess 16 that forms the channels 11a to 11e. One of the brazing sheets 12E and 12F (to the right of the channel recess 16 in the figure) or both (the channel recess 16 in the figure). On the left side, a wax escape through hole 15 reaching the extended surface of the adhesive facing surface facing the flow paths 11a to 11e is formed. In the embodiment in which the low relief through holes 15 are formed in both the brazing sheets 12E and 12F, the planar positions of the low relief through holes 15 may be shifted as well as shown in the drawing. By matching at least some of the planar positions, the brazing material can be discharged to the outside more easily.

  In the present invention, the configurations of the piezoelectric pump 20 and the radiator 40 are not limited, but the configurations of the piezoelectric pump 20 and the radiator 40 of the illustrated embodiment will be described as follows. The piezoelectric pump 20 has a lower housing 21 and an upper housing 22 as shown in FIGS.

  The lower housing 21 is provided with the discharge port 34 and the suction port 35 in parallel to each other so as to be orthogonal to the plate thickness plane of the housing. The discharge port 34 and the suction port 35 are liquid-tightly connected to the flow-path hole 34 ′ and the flow-path hole 35 ′ of the flow-path sheet 10 through appropriate liquid-tight means. A piezoelectric vibrator (diaphragm) 28 is sandwiched and supported between the lower housing 21 and the upper housing 22 via an O-ring 29, and a pump is interposed between the piezoelectric vibrator 28 and the lower housing 21. Chamber P is configured. An atmospheric chamber A is formed between the piezoelectric vibrator 28 and the upper housing 22.

  The piezoelectric vibrator 28 is a unimorph type having a shim 28a at the center and a piezoelectric body 28b formed on one surface of the front and back of the shim 28a (upper surface in FIG. 6). A shim 28a faces the pump chamber P and comes into contact with the liquid. The shim 28a is made of a conductive metal thin plate material, for example, a metal thin plate formed of stainless steel having a thickness of about 50 to 300 μm, 42 alloy, or the like. The piezoelectric body 28b is made of, for example, PZT (Pb (Zr, Ti) O3) having a thickness of about 300 μm, and is polarized in the front and back directions. Such a piezoelectric vibrator is well known.

  The discharge port 34 and the suction port 35 of the lower housing 21 are provided with check valves (umbrellas) 32 and 33, respectively. The check valve 32 is a suction-side check valve that allows a fluid flow from the suction port 35 to the pump chamber P and does not allow the reverse fluid flow. The check valve 33 transfers from the pump chamber P to the discharge port 34. This is a discharge-side check valve that allows the fluid flow of the fluid but does not permit the reverse fluid flow.

The check valves 32 and 33 have the same configuration, and are provided with umbrellas 32b and 33b made of an elastic material on perforated substrates 32a and 33a that are bonded and fixed to the flow path. Such a check valve (umbrella) itself is well known.

  In the piezoelectric pump 20 described above, when the piezoelectric vibrator 28 is elastically deformed (vibrated) in the forward and reverse directions, the suction-side check valve 32 is opened and the discharge-side check valve 33 is closed in the process of expanding the volume of the pump chamber P. Therefore, the liquid flows into the pump chamber P from the suction port 35 (the channel hole 35 ′ of the channel sheet 10). On the other hand, in the process of reducing the volume of the pump chamber P, the discharge side check valve 33 is opened and the suction side check valve 32 is closed. ) Liquid flows out. Therefore, the piezoelectric vibrator 28 is continuously elastically deformed (vibrated) in the forward and reverse directions to obtain a pump action, and the liquid circulates from the flow path 11a to the flow path 11e.

  As shown in FIGS. 11 to 14, the radiator 40 includes a flow path unit 41 that is stacked in a plurality of stages. Each flow path unit 41 has the same structure except for the uppermost flow path unit 41.

  Each flow path unit 41 is constituted by a pair of flow path plates 42U and 42L that are coupled in an overlapping manner. The flow path plates 42U and 42L are made of, for example, a press-formed product of a metal material (brazing sheet) having excellent heat conductivity, and have a symmetrical shape (same single shape) with respect to the overlapping surface (laminated surface). Yes. FIG. 14 shows a single shape of the flow path plate 42U (42L). The flow path plate 42U (42L) has an elongated shape, and has a flat joint surface 45 at the periphery of the planar U-shaped flow path recess 46. Spacer portions 47S and 48S are formed at both ends of the U-shaped channel recess 46 (the end opposite to the U-shaped folded portion) so as to protrude outward from the U-shaped channel recess 46 portion. An inlet hole 47 and an outlet hole 48 are formed in the spacer portions 47S and 48S.

  The flow path plates 42U and 42L are overlapped with each other so that the flow path recess 36 faces outward, and the joint surfaces 45 are joined by brazing, for example. Then, the flat U-shaped flow path 11X is formed by the U-shaped flow path recessed part 46 which protrudes in the opposite direction up and down. Further, the spacer portions 47S (48S) of the upper and lower flow path units 41 come into contact with each other, and the inlet holes 47 and the outlet holes 47 of the upper and lower flow path units 41 communicate with each other. A cooling air passage space S (FIG. 13) is formed between the superimposed flow path units 41, and cooling air from the sirocco fan 60 passes through the space S. An inlet hole 47 (outlet hole 48) is not formed in the spacer portion 47S (48S) of the flow path plate 42U above the uppermost flow path unit 41. The inlet hole 47 and the outlet hole 48 of the lowermost flow path unit 41 are in fluid-tight communication with the flow path hole 47 ′ and the flow path hole 48 ′ of the brazing sheet 12D (flow path sheet 10), respectively. The flow passage unit 41 may be formed with the wax escape through hole of the present invention.

  15 to 17 show another embodiment of the present invention. In this embodiment, when a notebook PC has an NB (North Bridge) 103 as a heat source in addition to the CPU 101 and the GPU 102, these are cooled by a single flow path sheet (heat radiating sheet) 100. As shown in FIG. 15, the piezoelectric pump 20, the NB 103, the CPU 101, the first radiator 40 </ b> A, the GPU 102, the second radiator 40 </ b> B, the third radiator 40 </ b> C, and the reserve tank are disposed on the front and back surfaces of the flow sheet 100. 50 is installed. In this embodiment, the CPU 101 and the NB 103 are installed on the flow path sheet 10 via a cooling jacket 101a and a cooling jacket 103a, and the GPU 102 is installed via a heat spreader 102s. The basic configuration of the piezoelectric pump 20, the cooling jacket 101a, each radiator 40 (first to third radiators 40A, 40B, and 40C) and the reserve tank 50 is the same as that of the above-described embodiment.

  On the other hand, in this embodiment, the first radiator 40A and the second radiator 40B are arranged in parallel, and one cooling fan (sirocco fan) 60A cools the two radiators arranged in parallel. The third radiator 40C is cooled by another cooling fan (sirocco fan) 60B.

  A flow path 111 is formed in the flow path sheet 100. When the flow path 111 is sequentially followed from the piezoelectric pump 20, the flow path 111a exiting the discharge port 34 of the piezoelectric pump 20 flows from the inlet hole 103b of the NB 103 through the flow path 103c in the cooling jacket 103a to the outlet hole 103d. The inlet hole 101c of the flow path 101b of the CPU 101 is reached via the flow path 111b. The channel 111c that exits the outlet hole 101d of the channel 101b reaches the inlet hole 471 of the first radiator 40A, flows through the channel in the first radiator 40A and reaches the outlet hole 481, and then passes through the channel 111d. , Reaches the inlet hole 482 of the second radiator 40B, further flows through the flow path in the second radiator 40B, and reaches the outlet hole 472. The flow path 111e that exits the outlet hole 482 reaches the inlet hole 473 of the third radiator 40C, flows through the flow path in the third radiator 40C and reaches the outlet hole 483, and then flows through the flow path 111f to the reserve tank 50. To the inlet port 51 and return from the outlet hole 52 to the suction port 35 of the piezoelectric pump 20.

  The GPU 102 is disposed on a portion where the above flow paths 111d and 111e are concentrated, and the liquid flowing through these flow paths absorbs heat from the heat spreader 102s and cools the GPU 102.

  As shown in FIG. 17, the flow path sheet 100 is formed by stacking and bonding four brazing sheets 112A, 112B, 112C, and 112D. The configuration of these four brazing sheets is the same as that of the above-described embodiment.

  That is, the two central brazing sheets 112B and 112C have the same shape, and the flow path through holes 113 constituting the flow paths 111a to 111g and the flow path through holes 113 have different positions. An escape through hole 114 is formed (drilled). In FIG. 17, the flow path through hole 113 is hatched. The row escape through hole 114 is formed as large as possible intermittently along the flow path through hole 113 or between the adjacent flow path through holes 113.

  The brazing sheets 112A and 112D on the front and back sides (outermost in the stacking direction) are not formed with holes in the portions corresponding to the flow-through holes 113 of the central brazing sheet 112B (112C). 112C), the front and back of the flow passage through hole 113 are closed, and flow passages 111a to 111g are formed. Also, the brazing sheets 112A (112D) on the front and back sides correspond to the row escape through holes 114 of the center brazing sheet 112B (112C) and are positioned at the same plane position as the row escape through holes 114, and the row escape through holes 115 is formed (drilled). The wax escape through hole 115 passes through an extended surface of the adhesion facing surface facing the flow paths (spaces) 111a to 111g. That is, the bonding facing surfaces of the brazing sheets 112A and 112B, the bonding facing surfaces of the brazing sheets 112B and 112C, and the bonding facing surfaces of the brazing sheets 112C and 112D face the flow paths (spaces) 111a to 111g, respectively. Wafer escape through holes 114 and 115 are formed in the extended surface.

  As shown in FIG. 4, the brazing sheet 112D (the surface on which the CPU 101, the GPU 102, the NB 103, the piezoelectric pump 20, the first to third radiators 40A, 40B, 40C, and the reserve tank 50 of the flow path sheet 100 are mounted). In addition, passage holes 35 ′ and 34 ′ communicating with the discharge port 34 and the suction port 35 of the piezoelectric pump 20, connection holes 103 b ′ and 103 d ′ communicating with the inlet hole 103 b and the outlet hole 103 d of the NB 103, and the first radiator 40 A Channel holes 471 'and 481' communicating with the inlet hole 471 and outlet hole 481, channel holes 472 'and 482' communicating with the inlet hole 472 and outlet hole 482 of the second radiator 40B, and inlet hole of the third radiator 40C Corresponding to the passage holes 473 ′ and 483 ′ communicating with the 473 and the outlet hole 483, and the inlet hole 51 and the outlet hole 52 of the reserve tank 50. The channel holes 51 ′ and 52 ′ are respectively drilled. These flow path holes communicate with the flow path 111 (flow path through hole 113).

When the above brazing sheets 112A to 112D are joined with their planar positions aligned, the flow passage through holes 113 of the brazing sheet (center sheet) 112B (112C) are closed by the brazing sheets (front and back sheets) 112A and 112D, A flow path 111 (111a to 111g) is formed. At this time, a part of the brazing material r which is about to leak into the flow paths 111a to 111g escapes to the outside through the solder escape through holes 114 and 115. For this reason, possibility that a brazing material will block a flow path can be made low. Moreover, since these wax escape through holes 114 and 115 are in contact with the outside air and increase the surface area of the passage sheet 10 with respect to the outside air, it is possible to increase the heat dissipation of the passage sheet 100 itself.

It is a top view (back view) which shows one Embodiment which applied the brazing flow path board of this invention to the liquid cooling system of notebook PC. It is a front view of FIG. It is a side view of FIG. It is a top view of the four brazing sheets which comprise the brazing flow path board used for the liquid cooling system of FIG. It is sectional drawing which follows the VV line of FIG. It is a schematic cross section of a brazing sheet. It is sectional drawing corresponding to FIG. 5 which shows another embodiment of the brazing flow path board of this invention. It is sectional drawing corresponding to FIG. 5, FIG. 6 which shows another embodiment of the brazing flow path board of this invention. It is a top view of the piezoelectric pump single-piece | unit used for the liquid cooling system of FIG. It is sectional drawing which follows the XX line of FIG. It is a perspective view of a radiator simple substance. It is sectional drawing which follows the XII-XII line | wire of FIG. It is sectional drawing which follows the XIII-XIII line | wire of FIG. It is a top view of the channel plate simple substance which comprises each channel unit of a radiator. It is a top view (rear view) corresponding to FIG. 1 which shows another embodiment which applied the brazing flow path board of this invention to the liquid cooling system of notebook PC. FIG. 16 is a front view of FIG. 15. It is a top view of the four brazing sheets which comprise the brazing flow path plate used for the liquid cooling system of FIG. 15 corresponding to FIG.

Explanation of symbols

10 channel sheet 11 111 channel 11a to 11e channel 111a to 111g channel 11X cooling fluid channel 12A brazing sheet (front and back sheet)
12B Brazing sheet (center sheet)
12C Brazing sheet (center sheet)
12D brazing sheet (front and back sheet)
12E Brazing sheet (front and back sheet)
12F brazing sheet (front and back sheet)
12B 'Brazing sheet (center sheet)
112A Brazing sheet (front and back sheet)
112B Brazing sheet (center sheet)
112C Brazing sheet (center sheet)
112D Brazing sheet (front and back sheet)
13 113 Flow-through hole 14 114 Low escape through-hole 15 115 Low escape through-hole 16 Flow passage recess 20 Piezoelectric pump 40 Radiator 40A First radiator 40B Second radiator 40C Third radiator 41 Channel unit 50 Reserve tank 51 Inlet hole 51 'channel hole 52 outlet hole 52' channel hole 60 60A 60B sirocco fan 101 CPU
101a Cooling jack 101b Channel 101c Inlet hole 101c 'Channel hole 101d Outlet hole 101d' Channel hole 102 GPU
102s Heat spreader 102b Channel 102c Inlet hole 102c 'Channel hole 102d Outlet hole 102d' Channel hole 103 NB
103a Cooling jacket 103b Inlet hole 103c Flow path 103d Outlet hole 103b '103d' Connecting hole s Core material r Brazing material P Pump chamber A Air chamber

Claims (9)

A plurality of brazing sheets having a sheet core material made of a metal material and a brazing material attached to at least one surface of the sheet core material are laminated and bonded together, and a brazing material forming a flow path between the brazing sheets. In the attached flow path plate,
A brazing flow path plate, wherein a solder relief through hole reaching an extended surface of an adhesive facing surface facing the flow path space is formed in at least one of a pair of brazing sheets positioned on the outermost side in the stacking direction. 2. The brazed flow path plate according to claim 1, wherein the plurality of brazing sheets include a central sheet having a through hole for the flow path; and a through hole for the flow path of the central sheet, other than the through hole for the flow path. A brazing flow path plate comprising: a front and back sheet having a solder escape through hole reaching a bonding facing surface in a portion. The brazing flow path plate according to claim 2, wherein the central sheet is further formed with a solder escape through hole communicating with the solder relief through hole of the front and back sheets. The brazing flow path plate according to claim 2 or 3, wherein a plurality of sheets having the same shape are stacked, and the front and back sheets are each one sheet. 2. The brazed flow path plate according to claim 1, wherein the plurality of brazing sheets are formed of a pair of front and back surfaces each having a flow path recess formed in at least one, and at least one of the brazing sheets is positioned in a portion other than the channel recess. A brazed flow path plate in which a solder escape through hole is formed. 6. The brazing flow path plate according to claim 5, wherein the brazing sheet on the front and back sides is formed with the above-mentioned solder relief through holes in which at least a part of the planar positions coincide. The brazing flow path plate according to any one of claims 1 to 6, wherein the solder escape through hole is formed in an elongated shape along the flow path. The brazing flow path plate according to any one of claims 1 to 7, wherein the solder escape through hole is formed intermittently along the flow path. 9. The brazing flow path plate according to claim 7 or 8, wherein the flow path has a plurality of linear portions that are parallel to each other, and the solder escape through hole is located between adjacent linear flow paths. Brazed flow path plate formed in parallel with the path.

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