JP2008270574A - Method of determining direction of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of determining the direction of a substrate, capable of improving throughput of a product such as a mounting substrate. <P>SOLUTION: The method of determining the direction of a substrate includes an evaluation step S400 in which a takt time required for producing a mounting substrate by a component mounter while using a substrate carried in the direction of the substrate is calculated for each direction of a substrate and an evaluation value indicating the influence imposed on production efficiency is calculated; and a determining step S402 in which the direction of a substrate having the shortest takt time is determined as the direction of a substrate to be determined on the basis of an evaluation value for each direction of a plurality of substrates. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method and apparatus for determining the orientation of a board to be transported to a production facility such as a component mounter.

  A component mounting machine, which is a kind of production equipment, is an apparatus that produces a mounting board by mounting electronic components or the like on a transported board. By connecting a plurality of such component mounting machines and other production facilities, it is possible to configure a production line for producing, for example, a complex mounting board at high speed.

Here, the board is transported to the component mounting machine in a state in which it is oriented in a predetermined direction. Further, the orientation of the substrate is determined so that the longitudinal direction of the substrate (or the long side of the substrate if the shape of the substrate is rectangular) is along the transport direction of the substrate, as is conventionally done. (For example, refer to Patent Document 1).
JP 2006-287150 A

  However, the conventional method for determining the orientation of the substrate used in the electronic component mounting method of Patent Document 1 has a problem that the throughput of the mounting substrate (the number of sheets produced per unit time) is reduced.

  Specifically, in the electronic component mounting method disclosed in Patent Document 1, when a board is transported into a component mounter (electronic component mounting apparatus), a range in which components can be mounted on the component mounter (mountable) When the board protrudes from the area, first, components are mounted on the board within the mountable area. When the component mounting is completed, the board is transported again so that the area that protrudes from the mountable area of the board enters the mountable area. So-called two-time conveyance is performed.

FIG. 19 is an explanatory diagram for explaining the two-time conveyance.
For example, the rectangular substrate 20 is conveyed to the component mounter 900. At this time, in the conventional method for determining the orientation of the substrate, the orientation of the substrate 20 is determined so that the long side of the substrate 20 is along the transport direction of the substrate 20.

  When the board 20 is transported to the component mounter 900 in the orientation determined in this way, the component mounter 900 transports the board 20 into the component mounter 900 as shown in FIG. Then, it is sought to place the board 20 within a range (mountable range) Ma in which components can be mounted. However, since the length of the long side (longitudinal direction) of the substrate 20 is longer than the width of the mountable range Ma, a part of the substrate 20 (the left end region in FIG. 19A) can be mounted. It protrudes from Ma.

  Therefore, the component mounter 900 first mounts components only on the area within the mountable range Ma of the substrate 20 (area shown by the thick diagonal lines in FIG. 19A). Then, as illustrated in FIG. 19B, the component mounting machine 900 transports the substrate 20 once again, and puts the region that protrudes from the mountable range Ma into the mountable range Ma. That is, the component mounter 900 carries the substrate 20 twice. The component mounter 900 mounts components on the area of the substrate 20 newly accommodated in the mountable range Ma, that is, the area of the substrate 20 that has not been mounted in the previous component mounting.

  Thus, when a component is mounted by carrying twice, there exists a tendency for the throughput of a mounting board to fall compared with the case where a board | substrate 20 is conveyed only once and a component is mounted.

  Therefore, if the orientation of the board 20 is determined inappropriately, the component mounter 900 may have to carry it twice, and as a result, the throughput of the mounting board may decrease.

  In addition, the throughput of the mounting substrate may be reduced even when all the substrates 20 once transported fall within the mountable range Ma.

FIG. 20 is an explanatory diagram for explaining another example of a decrease in throughput.
For example, the rectangular substrate 20 is conveyed to the component mounter 900. At this time, in the conventional method for determining the orientation of the substrate, the orientation of the substrate 20 is determined so that the long side of the substrate 20 is along the transport direction of the substrate 20 as described above.

  When the board 20 is transported in such a determined direction, the component mounter 900 transports the board 20 to the inside of the component mounter 900 as shown in FIG. 20, and within the mountable range Ma. The substrate 20 is accommodated.

  However, of the two heads 912a and 912b provided in the component mounting machine 900, the moving distance of the head 912b is remarkably increased.

  That is, the head 912a sucks the component supplied from the component supply unit 915a, moves to the substrate 20 within the mountable range Ma, mounts the component on the substrate 20, and moves again to the component supply unit 915a. . Similarly, the head 912b picks up the component supplied from the component supply unit 915b, moves to the substrate 20 within the mountable range Ma, mounts the component on the substrate 20, and moves again to the component supply unit 915b. . However, the substrate 20 is long in the transport direction and short in the direction perpendicular to the transport direction. Further, the substrate 20 is arranged closer to the component supply unit 915a than the component supply unit 915b. As a result, the head 912b must move a long distance to mount the component on the board 20.

  Thus, when the moving distance of one of the heads is extremely long, the throughput of the mounting board tends to decrease.

  Therefore, if the orientation of the substrate 20 is determined inappropriately, the moving distance of the head becomes extremely long, and as a result, the throughput of the mounting substrate may decrease.

  Therefore, the present invention has been made in view of such a problem, and an object of the present invention is to provide a method for determining the orientation of a substrate in order to improve the throughput of a product such as a mounting substrate.

  To achieve the above object, a substrate orientation determination method according to the present invention is a method for determining the substrate orientation to be set with respect to a substrate transported to a production facility, the substrate orientation An evaluation step for calculating an evaluation value indicating an influence on the production efficiency by the production facility when the substrate is directed to the direction and transported to the production facility, and the orientation of the substrate And determining a direction of any one of the plurality of substrate orientations as the orientation of the substrate to be set based on each evaluation value. For example, the production equipment is a component mounting machine, and a mounting board is produced as a product by a production operation by the production equipment for the board. Further, in the evaluation step, for each direction of the substrate, a tact time required for the production facility to produce one product using the substrate transported in the direction is calculated as the evaluation value, In the determining step, the direction of the substrate having the shortest tact time is determined as the direction of the substrate to be set from among the plurality of substrate directions.

  As a result, an evaluation value such as a tact time (tact) indicating the influence on the production efficiency is calculated for each direction of the substrate, and the direction of the substrate with the shortest tact time is determined. If it is transported to a production facility such as a component mounting machine, the throughput of the product such as the mounting substrate can be improved.

  Further, the production facility is a component mounter that produces a mounting board as the product by mounting a component on a board, and holds and moves the supplied parts, and is mounted in advance on the board. In the evaluation step, each mounting point of the board that has stopped when the board is directed to the direction and transported to the production facility for each direction of the board, The total movement time for the head to move between a predetermined position may be calculated as the tact time. For example, the predetermined position is the position of the camera that captures the part held by the head.

  As a result, the total movement time for the head to move between each mounting point on the board and the position of the camera is calculated as a tact time (virtual tact). Compared to the case where the tact time is calculated in consideration of the order or the like, the tact time can be easily calculated with a reduced processing load.

  The substrate orientation determination method further includes a constraint determination step for determining whether or not there is a constraint on mounting of components by the production facility for the mounting point for each mounting point of the substrate, and the evaluation In the step, the total movement time may be calculated by adding a weight to the movement time for the head to move between the mounting point determined to be restricted and the predetermined position. For example, in the constraint determination step, if there is a nozzle that is provided in the head and cannot be used to mount a component on the mounting point among a plurality of nozzles that suck the component, the mounting point is limited. Determine that there is.

Thereby, the tact time can be calculated easily and accurately.
In the constraint determination step, the weight for the movement time of the mounting point may be increased as the number of nozzles that cannot be used for mounting the component at the mounting point increases.

Thereby, the tact time can be calculated more accurately.
Further, the production facility includes two heads and two cameras for photographing parts held by the heads, and one head moves to the stopped substrate through the vicinity of one camera. The other head moves to the stopped substrate through the vicinity of the other camera, and in the evaluation step, the one head moves between each mounting point of the stopped substrate and the position of the one camera. By adding the first total movement time during which the other head moves and the second total movement time during which the other head moves between each mounting point of the stopped board and the position of the other camera. The total movement time may be calculated.

  Thereby, the tact time of the so-called alternating component mounting machine can be calculated easily and accurately.

  The production facility performs a production operation on the stopped substrate by moving a moving member. In the evaluation step, the production facility is configured such that the substrate is directed in the direction for each direction of the substrate. The movement distance of the moving member required for the production operation by the production facility to be performed on the stopped substrate is calculated as the evaluation value, and in the determination step, the movement distance The direction of the shortest substrate may be determined as the direction of the substrate to be set. For example, when the production facility is a component mounter, the moving member is a head that picks up and moves the component and mounts the component on the substrate.

  Thereby, for example, even if the substrate is directed in any direction, even if the work target area of the substrate is within the workable range of the production facility, that is, once the substrate is directed in any direction. Even when transport is performed, an evaluation value such as a movement distance indicating the effect on production efficiency is calculated for each direction of the substrate, and the direction of the substrate with the shortest movement distance is determined. If the board is directed in the determined direction and transported to a production facility such as a component mounting machine, the throughput of a product such as a mounting board can be improved.

  The method for determining the orientation of the substrate further includes an information acquisition step of acquiring region information indicating a work target region that is a target of a production work by the production facility on the substrate, and the evaluation step includes the substrate Between the center of the work target area indicated by the area information on the stopped substrate and a predetermined position when the substrate is directed to the direction and transported to the production facility. The distance in a direction perpendicular to the substrate transport direction may be calculated as the movement distance. For example, when the production facility is a component mounter, the above-described predetermined position is a position of a camera that captures a component adsorbed on the head. Further, when the entire mounting surface of the substrate is the work target region, the center of the work target region is the center of the substrate.

  Thus, if the substrate transport direction is the X-axis direction and the direction perpendicular to the transport direction is the Y-axis direction, the distance in the Y-axis direction between the center of the substrate and the camera position is calculated as the movement distance. Therefore, the moving distance can be easily calculated without requiring complicated calculation.

  In order to achieve the above object, a substrate orientation determination method according to the present invention is a method for determining the substrate orientation to be set with respect to a substrate transported to a production facility, wherein the production The facility performs a production operation only on an area within the workable range of the production facility on the stopped substrate, and the method for determining the orientation of the substrate is a target of the production operation by the production facility on the substrate. An information acquisition step for acquiring area information indicating a work target area; and for each direction of the substrate, the work target area indicated by the area information when the substrate is directed to the direction and transported to the production facility; and Based on the positional relationship with the workable range, a transfer time for calculating the number of times the substrate is transferred so that the production work by the production facility is performed on all the work target areas. A calculation step, the orientation of the smallest substrate is the transport number, characterized in that it comprises a determining step of determining a direction of the substrate to be set. For example, the production equipment is a component mounting machine, and a mounting board is produced as a product by a production operation by the production equipment for the board.

  As a result, the number of times of conveyance is calculated for each direction of the board, and the direction of the board with the smallest number of times of conveyance is determined, so if the board is directed to the determined direction and conveyed to a production facility such as a component mounter Twice conveyance can be prevented and the throughput of a product such as a mounting substrate can be improved.

  Further, in the transfer count calculation step, it is determined whether or not all work target areas indicated by the area information are within the workable range in one transfer. It is also possible to calculate the number of times of transportation as two or more when it is determined that it does not fit.

As a result, the number of conveyances can be reliably calculated.
In order to achieve the above object, a substrate orientation determination method according to the present invention is a method for determining the substrate orientation to be set with respect to a substrate transported to a production facility, wherein the production The facility performs a production operation only on an area within the workable range of the production facility on the stopped substrate, and the method for determining the orientation of the substrate is a target of the production operation by the production facility on the substrate. An information acquisition step for acquiring region information indicating a work target region, and every work target region indicated by the region information when the substrate is directed to the direction and transported to the production facility for each direction of the substrate A determination step for determining whether or not the work area falls within the workable range, and a direction of the substrate determined in the determination step that all work target areas are within the workable range. It may be characterized by including a determining step of determining a direction of the substrate to be.

  Thereby, twice conveyance etc. can be prevented and the improvement of the throughput of products, such as a mounting substrate, can be aimed at.

  In order to achieve the above object, a substrate orientation determination method according to the present invention is a method for determining the substrate orientation to be set with respect to a substrate transported to a production facility, wherein the substrate The direction of the substrate in which the longitudinal direction of the substrate is perpendicular to the substrate transport direction is determined as the direction of the substrate to be set.

  As a result, it is possible to prevent two-time conveyance, and in the case where the production equipment is a component mounting machine equipped with a head, the moving distance of the head can be shortened, so that the throughput of a product such as a mounting board is improved. Can be achieved.

  The present invention can be realized not only as a method for determining the orientation of a substrate, but also as an apparatus and program for determining the orientation of a substrate according to the method, and a storage medium for storing the program. it can. Furthermore, the present invention can also be realized as a component mounting method and a component mounter for mounting components on a substrate by determining the orientation of the substrate according to the method.

  The method for determining the orientation of a substrate according to the present invention has the effect of improving the throughput of a product such as a mounting substrate.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an external view of a component mounting system according to an embodiment of the present invention.
The component mounting system in the present embodiment is a determining device that determines the orientation of a plurality of component mounters 100 (six component mounters 100 in the example shown in FIG. 1) and a circuit board (hereinafter simply referred to as a board) 20. 200.

  The plurality of component mounting machines 100 are configured as a production line that mounts components such as electronic components while sending the substrate 20 from upstream to downstream. That is, each component mounting machine 100 receives the substrate 20 from the upstream side, mounts the component on the substrate 20, and sends the substrate 20 on which the component is mounted to the downstream side. The substrate 20 on which components are mounted by a production line composed of a plurality of such component mounting machines 100 or the substrate 20 on which components are mounted by one component mounting machine 100 is hereinafter referred to as a mounting substrate.

  The determination device 200 determines the orientation of the substrate 20 that flows (conveys) to the production line or one component mounting machine 100 so that the throughput of the mounting substrate is improved. Then, the determination device 200 instructs the operator who uses, manages, or operates the component mounting system, the transport device that transports the substrate 20, and the like so that the substrate 20 flows in the determined direction.

FIG. 2 is an external view of the component mounter 100.
The component mounter 100 includes two component supply units 115a and 115b that supply a plurality of types of components, and the substrate 20 inserted from the carry-in port 130 is conveyed into the component mounter 100 and stopped. Then, the component mounter 100 sequentially takes out the components supplied from the two component supply units 115a and 115b, and mounts the removed components on the stopped substrate 20.

FIG. 3 is a diagram illustrating a main configuration inside the component mounter 100.
The component mounting machine 100 includes two mounting units 110 a and 110 b for mounting components on the substrate 20, two substrate transport rails 122 a and 122 b for transporting the substrate 20, and two main rails 140. Yes. The two mounting units 110a and 110b cooperate to mount components alternately on the substrate 20 on the substrate transport rails 122a and 122b.

  The mounting unit 110a and the mounting unit 110b have the same configuration. That is, the mounting unit 110a includes a component supply unit 115a, a component recognition camera 116a, a head 112a, a beam 121a, and a nozzle station 119a. Similarly, the mounting unit 110b includes a component supply unit 115b, a component recognition camera 116b, a head 112b, a beam 121b, and a nozzle station 119b.

  Here, a detailed configuration of the mounting unit 110a will be described. The detailed configuration of the mounting unit 110b is the same as that of the mounting unit 110a, and will not be described.

  The component supply unit 115a includes an array of a plurality of component cassettes (feeders) 114 that store component tapes. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chip parts, specifically, 0402 chip parts and 1005 chip parts.

  The head 112a is a head called a multi-mounting head, for example, and can include a maximum of 10 suction nozzles (hereinafter simply referred to as nozzles). 20 can be attached. Such a head 112a is slidably attached to a beam 121a configured in a shaft shape. Therefore, the head 112a moves along the beam 121a by driving a motor or the like, for example.

  The beam 121a is slidably mounted in the Y-axis direction on two main rails 140 arranged in parallel to each other along a direction (Y-axis direction) perpendicular to the transport direction (X-axis direction) of the substrate 20. Yes. Accordingly, the beam 121a moves along the Y-axis direction on the two main rails 140 by driving, for example, a motor. That is, the head 112a moves in the X axis direction and the Y axis direction by the main rail 140 and the beam 121a.

  The component recognition camera 116a is used for photographing a component sucked by the head 112a and inspecting the suction state of the component two-dimensionally or three-dimensionally. The component recognition camera 116a is disposed near the center along the X-axis direction in the component supply unit 115a.

  The nozzle station 119a is a table on which replacement nozzles corresponding to various types of component types are placed.

  Here, the substrate 20 inserted from the carry-in port 130 of the component mounting machine 100 is transported along the two substrate transport rails 122a and 122b and stopped by a stopper or the like. In addition, the component mounting machine 100 has a range Ma in which a component can be mounted (hereinafter, referred to as a mountable range) Ma for a structural reason of the component mounting machine 100 such as a movable range of the heads 112a and 112b. It has been.

  Therefore, the component mounter 100 transports the substrate 20 into the component mounter 100 and stops it so that the entire mounting target area of the substrate 20 inserted from the carry-in port 130 is within the mountable range Ma as much as possible. . For example, the component mounting machine 100 transports and stops the substrate 20 so that the front end in the transport direction of the mounting target area of the substrate 20 is as close as possible to the boundary of the mountable range Ma within the mountable range Ma. The mounting target area is an area on the mounting surface of the substrate 20 where a component is to be mounted. In the present embodiment, the entire mounting surface of the substrate 20 will be described as a mounting target area.

  Further, the substrate transport rails 122a and 122b are arranged so as to be parallel to the X-axis direction, respectively. Here, the board transport rail 122a is fixed toward the component supply unit 115a, and the board transport rail 122b moves in the Y-axis direction according to the size (width) of the board 20 to be transported.

FIG. 4 is a schematic diagram showing the positional relationship between the head 112a and the component cassette 114. As shown in FIG.
As described above, for example, a maximum of 10 nozzles nz can be attached to the head 112a. The head 112a to which the ten nozzles nz are attached can pick up components from each of up to ten component cassettes 114 at the same time (by one up and down movement).

FIG. 5 is a diagram illustrating an example of a component tape and a reel that contain components.
Components such as chip-type electronic components are housed in a housing recess 424a formed continuously at a predetermined interval on a carrier tape 424 shown in FIG. 5, and are covered with a cover tape 425 attached to the upper surface. The carrier tape 424 to which the cover tape 425 is thus attached is supplied to the user in a taping form wound around the reel 426 by a predetermined quantity. The carrier tape 424 and the cover tape 425 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  The mounting unit 110a of the component mounting machine 100 moves the head 112a to the component supply unit 115a, and causes the component supplied from the component supply unit 115a to be attracted to the head 112a. Then, the mounting unit 110a moves the head 112a onto the component recognition camera 116a at a constant speed, causes the component recognition camera 116a to capture images of all the components sucked by the head 112a, and accurately detects the suction position of the component. Let Further, the mounting unit 110 a moves the head 112 a to the substrate 20 and sequentially attaches all the sucked components to the mounting points of the substrate 20. The mounting unit 110a mounts all the predetermined components on the board 20 by repeatedly executing such operations of suction, movement, and mounting by the head 112a.

  Similarly to the mounting unit 110a, the mounting unit 110b also moves the head 112b to the component supply unit 115b and sucks the component supplied from the component supply unit 115b to the head 112b. Then, the mounting unit 110b moves the head 112b onto the component recognition camera 116b at a constant speed, causes the component recognition camera 116b to capture images of all the components sucked by the head 112b, and accurately detects the suction position of the component. Let Further, the mounting unit 110 b moves the head 112 b to the substrate 20 and sequentially attaches all the sucked components to the mounting points of the substrate 20. The mounting unit 110b mounts all the predetermined components on the substrate 20 by repeatedly executing such operations of suction, movement, and mounting by the head 112b.

  Then, each of the mounting unit 110a and the mounting unit 110b sucks a component from the component supply unit when the other mounting unit is mounting a component, and conversely, the other mounting unit sucks a component from the component supply unit. When mounting the components, the components are alternately mounted on the board 20 so as to mount the components. In other words, the component mounter 100 is configured as a so-called alternating component mounter.

FIG. 6 is a block diagram illustrating a functional configuration of the determination apparatus 200 according to the present embodiment.
The determination apparatus 200 according to the present embodiment includes an input unit 201, a display unit 202, an evaluation value calculation unit 203, an orientation determination unit 205, a communication unit 206, a first storage unit 207, a second storage unit 208, and a third storage unit. 209.

  The input unit 201 includes, for example, a keyboard and a mouse, receives an operation from the operator, and notifies the direction determination unit 205 of the operation result.

  The display unit 202 includes, for example, a liquid crystal display, and displays an operation state of the orientation determination unit 205 or the like, or is stored in the first storage unit 207, the second storage unit 208, the third storage unit 209, or the like. Or display the data that is being displayed.

  The orientation determination unit 205 determines the orientation of the board 20 to be transported with respect to a predetermined component mounter 100 or production line based on the calculation result of the evaluation value calculation unit 203. Then, the orientation determining unit 205 generates determined orientation data 208a indicating the determined orientation, and stores the determined orientation data 208a in the second storage unit 208 or displays the contents of the determined orientation data 208a on the display unit 202. I will let you.

  Hereinafter, the direction of the substrate 20, that is, the direction with respect to the transport direction of the substrate 20, is referred to as a substrate direction, and the substrate direction determined by the direction determining unit 205 among the possible substrate directions of the substrate 20 is referred to as an optimal substrate direction.

  The evaluation value calculation unit 203 calculates an evaluation value that is a value indicating the influence of the arrangement of the board 20 on the production efficiency of the component mounter 100. Specifically, the evaluation value calculation unit 203 includes a conveyance number calculation unit 203a and a tact calculation unit 203b.

  When the conveyance number calculation unit 203a of the evaluation value calculation unit 203 receives an instruction to start processing from the direction determination unit 205, the substrate 20 is transferred to the component mounter 100 in the substrate direction for each substrate direction. The number of conveyances required to mount the component on the entire 20 mounting target areas is calculated as an evaluation value. The number of times of conveyance is the number of times the substrate 20 is conveyed, and is a number that increases only once every time the substrate 20 is conveyed and stopped.

  When the tact calculation unit 203b of the evaluation value calculation unit 203 receives an instruction to start processing from the orientation determination unit 205, the component mounter 100 first mounts a component on the board 20 facing the board for each board direction. To optimize the mounting conditions. In other words, the tact calculation unit 203b determines a mounting condition that maximizes the throughput of the mounting board in each board direction for each board direction. The mounting conditions indicate, for example, the arrangement of the component cassettes 114, the mounting order of components, and the like. Then, the tact calculation unit 203b generates mounting condition data 209a indicating the determined mounting condition, and stores it in the third storage unit 209. Next, the tact calculating unit 203b takes a time required for the component mounting machine 100 to mount a component on the substrate 20 and produce one mounting substrate based on the determined mounting condition for each board orientation ( (Hereinafter referred to as “tact”) is calculated as the above-described evaluation value.

  Further, when determining the mounting conditions, the tact calculating unit 203b reads the NC data 207a and the component library 207b stored in the first storage unit 207, and determines the mounting conditions based on these data. Note that such mounting conditions are determined by executing a conventionally used optimization program, for example.

  The communication unit 206 communicates with each component mounter 100. For example, the communication unit 206 transmits the mounting condition data 209a stored in the third storage unit 209 to each component mounting machine 100, thereby mounting each component according to the mounting condition indicated by the mounting condition data 209a. The component mounter 100 is executed. Further, the communication unit 206 transmits the determined orientation data 208a stored in the second storage unit 208 to each component mounter 100, so that the rail width between the board transport rails 122a and 122b is the determined orientation data 208a. The substrate transport rail 122b is slid so as to have a width corresponding to the determined orientation shown.

  The first storage unit 207 stores NC data 207a indicating information on each mounting point of the board 20, and a component library 207b indicating information on each component.

FIG. 7 is a diagram illustrating an example of the NC data 207a.
The NC data 207a indicates information related to mounting points of all components to be mounted on the board 20. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 207b (see FIG. 8), the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board 20), and the control data is , The restriction information regarding the mounting of the component, for example, the type of nozzle nz that can be used, the maximum movement acceleration of the heads 112a and 112b, and the like. The mounting angle θi indicates an angle at which the nozzle nz that has picked up the component of the component type ci should rotate.

  Further, the NC data 207a indicates the mounting target area of the substrate 20 by the coordinates of each mounting point pi. That is, in the present embodiment, the NC data 207a includes area information indicating a mounting target area (work target area) that is a target of component mounting by the component mounting machine 100 on the board 20.

FIG. 8 is a diagram illustrating an example of the component library 207b.
The component library 207b is a library that collects unique information about each of all component types that can be handled by the component mounter 100. As shown in FIG. 8, the component library 207b includes a component size for each component type (component name), a tact in the component type, constraint information, and the like.

  The tact shown in the component library 207b is a time specific to the component type required to mount the component on the substrate 20 under a certain condition, and the constraint information includes, for example, types of usable nozzles nz (SX and , SA, etc.), the recognition method (reflection, etc.) by the component recognition cameras 116a, 116b, the maximum acceleration ratio of the heads 112a, 112b, and the like. Further, FIG. 8 also shows the appearances of components of each component type for reference. In addition, the component library 207b may include information such as the color and shape of the component.

FIG. 9 is an explanatory diagram for explaining a method of determining the substrate orientation by the orientation determining unit 205.
When the direction determination unit 205 receives, for example, an instruction for starting the substrate orientation determination process for the substrate 20 conveyed to a predetermined component mounting machine 100 from the input unit 201, the direction determination unit 205 evaluates the number of conveyances of the substrate 20 for each substrate direction. The calculation is performed by the conveyance number calculation unit 203a of the calculation unit 203. Here, for example, the substrate direction of the substrate 20 includes a substrate direction D1 and a substrate direction D2. The substrate direction D1 is the direction of the substrate 20 such that the long side (longitudinal direction) of the substrate 20 is along the X-axis direction, and the substrate direction D2 is the direction of the substrate 20 where the long side of the substrate 20 is along the Y-axis direction. The direction.

  When calculating the number of conveyance times, the conveyance number calculation unit 203a first reads the NC data 207a stored in the first storage unit 207 to know the mounting target area of the substrate 20.

  Next, the number-of-transfers calculation unit 203a includes the mounting target area, the mountable range Ma of the component mounter 100, and a stop position (initial stop position) at which the board 20 is transferred to the component mounter 100 and stopped first. ) And the number of conveyances for each substrate direction is calculated. Specifically, the conveyance number calculation unit 203a calculates the number of conveyances by determining whether or not the entire mounting target area falls within the mountable range Ma.

  The conveyance number calculation unit 203a stores in advance the size of the mountable range Ma of the component mounter 100. In addition, the number-of-transfers calculation unit 203a sets the position of the substrate 20 such that the front end in the transport direction of the mounting target area of the substrate 20 is as close as possible to the boundary of the mountable range Ma within the mountable range Ma. Position. Furthermore, in the present embodiment, the entire mounting surface of the substrate 20 is set as a mounting target area.

  If it is determined that the entire mounting target area of the substrate 20 falls within the mountable range Ma as a result of the determination as described above, the transfer count calculating unit 203a calculates the transfer count as one, and all the mount target areas are If it is determined that it does not fall within the mountable range Ma, the number of conveyances is calculated as two.

  For example, in the case of the board orientation D1, the conveyance number calculation unit 203a determines that the mounting target area of the substrate 20 does not fall within the mountable range Ma, and calculates the conveyance number as two.

  In the case of the board orientation D2, the conveyance number calculation unit 203a determines that the mounting target area of the substrate 20 falls within the mountable range Ma, and calculates the conveyance number as one.

  As a result, the orientation determining unit 205 determines that the number of times of conveyance in the substrate direction D2 (one time) is the smallest among the number of times of conveyance in the substrate directions D1 and D2, and the smallest number of conveyances among the substrate directions D1 and D2. The number of substrate orientations D2 is determined as the optimum substrate orientation.

  In addition, the orientation determination unit 205 causes the tact calculation unit 203b of the evaluation value calculation unit 203 to calculate the tact in each substrate direction when the number of times of conveyance in the substrate directions D1 and D2 is equal. As a result, the orientation determining unit 205 determines the substrate orientation with the shortest tact as the optimum substrate orientation from among the substrate orientations D1 and D2.

  FIG. 10 is a flowchart showing an example of the operation of the determination apparatus 200 in the present embodiment.

  When the orientation determination unit 205 of the determination apparatus 200 first receives an instruction to start determination processing for the substrate orientation from the input unit 201, the orientation determination unit 205 prompts the conveyance number calculation unit 203a of the evaluation value calculation unit 203 to calculate the number of conveyances. As a result, the conveyance number calculation unit 203a reads the NC data 207a stored in the first storage unit 207 to know the mounting target area of the substrate 20 (step S100). Then, the conveyance number calculation unit 203a calculates the number of conveyances for each substrate direction based on the mounting target area, the mountable range Ma, and the like (step S102).

  That is, in the method for determining the orientation of the board 20 in the present embodiment, an information acquisition step (step for acquiring area information indicating a mounting target area that is a target of component mounting (production work) by the component mounter 100 on the board 20 is performed. S100) and, for each board orientation, an evaluation value indicating the influence of the placement of the board 20 on the production efficiency of the component mounter 100 when the board 20 is directed toward the board and conveyed to the component mounter 100 is calculated. Evaluation step (step S102). In the evaluation step, for each board direction, based on the positional relationship between the mounting target area indicated by the area information and the mountable range Ma when the board 20 is directed to the board direction and transported to the component mounting machine 100. Thus, the number of times the board 20 is transferred so that the component mounting by the component mounting machine 100 is performed on all the mounting target areas is calculated as the evaluation value. Further, in this evaluation step, it is determined whether or not all the mounting target areas indicated by the area information are within the mountable range Ma in one transfer, and when it is determined that the transfer is performed, the transfer count is calculated as one. However, when it is determined that it does not fit, the number of conveyances is calculated as two or more.

  Next, when the number of transfers for each substrate direction is calculated, the orientation determination unit 205 determines whether the number of transfers in the substrate direction D1 is 1 and the number of transfers in the substrate direction D2 is 2. (Step S104).

  Here, when the orientation determining unit 205 determines that the number of conveyances in the substrate direction D1 is 1 and the number of conveyances in the substrate direction D2 is 2 (Y in step S104), the substrate direction D1 is set as the optimum substrate direction. Determination is made (step S106). On the other hand, when the orientation determining unit 205 determines that the number of times of transport in the substrate direction D1 is 1 and the number of times of transport in the substrate direction D2 is not 2 (N in step S104), the number of times of transport in the substrate direction D1 is 2 It is determined whether or not the number of conveyances in the substrate direction D2 is one (step S108).

  Here, when the orientation determining unit 205 determines that the number of conveyances in the substrate direction D1 is 2 and the number of conveyances in the substrate direction D2 is 1 (Y in step S104), the substrate direction D2 is set as the optimum substrate direction. Determine (step S110).

  That is, in the method for determining the orientation of the substrate 20 in the present embodiment, one of the plurality of substrate orientations is selected from the plurality of substrate orientations based on the evaluation value for each substrate orientation (the optimum substrate orientation). It includes a determination step (steps S106 and S110) for determining the direction. In this determination step, the substrate orientation with the smallest number of conveyances as an evaluation value is determined as the substrate orientation to be set.

  If the orientation determining unit 205 determines in step S108 that the number of conveyances in the substrate direction D1 is two and the number of conveyances in the substrate direction D2 is not one (N in step S108), the substrate orientation D1 and the substrate orientation It is determined that the number of conveyances of D2 is equal, that is, the number of conveyances of the substrate direction D1 and the substrate direction D2 is both once or twice. As a result, the tact calculation unit 203b calculates a tact for each substrate direction according to the determination result by the direction determination unit 205 (step S112).

  Then, the orientation determining unit 205 determines the substrate orientation of the shortest tact as the optimum substrate orientation based on the calculated tact for each substrate orientation (step S114).

  As described above, in this embodiment, for each orientation of the substrate 20, the number of conveyances indicating the influence on the production efficiency is calculated as an evaluation value, and the direction of the substrate 20 with the smallest number of conveyances is determined as the optimum substrate direction. If the substrate 20 is directed to the determined optimum substrate and conveyed to the component mounting machine 100, the conveyance twice can be prevented and the throughput of the mounting substrate can be improved.

  In the present embodiment, when the transfer number calculation unit 203a determines that all of the mounting target areas fall within the mountable range Ma, the transfer count is calculated as one, and all of the mounting target areas are included in the mountable range. When it was determined that it did not fit within Ma, the number of conveyances was calculated as two. However, if the component cannot be mounted on the entire mounting target area of the substrate 20 even after being transported twice, the transport count calculation unit 203a may calculate the transport count as 3 or more. In other words, the number-of-conveyance calculation unit 203a has been transported twice so that a region that does not fit in the mountable range Ma in the first transport among the mounting target regions of the substrate 20 is newly placed in the mountable range Ma. Assume the state of the substrate 20. As a result, when it is determined that there is an area that is not yet within the mountable range Ma among the mounting target areas of the substrate 20, the transfer count calculation unit 203 a calculates the transfer count as 3 times.

(Modification 1)
Here, a first modification of the present embodiment will be described. In the above-described embodiment, the substrate orientation is determined based on the number of times of conveyance. However, in the present modification, the substrate orientation is determined based on a movement distance described later.

  Specifically, in this modification, the orientation determination unit 205 prompts the tact calculation unit 203b to calculate the evaluation value instead of the conveyance number calculation unit 203a. As a result, the tact calculation unit 203b calculates a moving distance for mounting components on the board 20 as an evaluation value for each board direction. Then, the orientation determining unit 205 according to this modification determines the substrate orientation with the shortest movement distance as the optimum substrate orientation from among the plurality of substrate orientations.

  Here, the moving distance is the distance in the Y-axis direction (beams 121a and 121b) that the heads 112a and 112b must move in order to mount the components on the board 20 that is stopped and arranged in the component mounting machine 100. Is the longer one of the distances that must travel. For example, in the state of the component mounter 100 as shown in FIG. 11, since the substrate 20 is disposed near the component supply unit 115a, the distance in the Y-axis direction (hereinafter, the head 112b) that the head 112b must move to. (The Y-axis direction movement distance) is longer than the Y-axis direction distance that the head 112a must move. Therefore, in such a state of the component mounting machine 100, the Y-axis direction moving distance of the head 112b is adopted as the above-described moving distance. That is, the moving distance is a distance in the Y-axis direction between the center position of the mounting target area of the substrate 20 that is stopped and arranged in the component mounting machine 100 and the component recognition camera 116b.

  Further, such a moving distance has a correlation with tact, and if the moving distance is long, the tact becomes long, and if the moving distance is short, the tact becomes short. That is, the tact calculation unit 203b according to the present modification calculates a movement distance having a correlation with the tact instead of the tact with a simple calculation process, and performs a complex calculation process as necessary to perform the tact. Is calculated.

FIG. 11 is an explanatory diagram for explaining a substrate orientation determination method according to the present modification.
When the direction determining unit 205 receives, for example, an instruction to start determining processing of the board orientation for the board 20 conveyed to the predetermined component mounting machine 100 from the input unit 201, the movement distance of the board 20 for each board direction D1, D2 Is calculated by the tact calculating unit 203b of the evaluation value calculating unit 203.

  When calculating the movement distance, the tact calculation unit 203b first reads the NC data 207a stored in the first storage unit 207 to know the mounting target area of the substrate 20.

  Next, the tact calculation unit 203b assumes the state of the substrate 20 that has been transported toward the substrate direction and stopped for each substrate direction D1, D2, and calculates the Y coordinate of the center position of the mounting target region in that state. To do. In the present modification, the entire mounting surface of the substrate 20 is set as a mounting target area as in the above embodiment.

  Then, the tact calculating unit 203b calculates the difference between the Y coordinate of the center position of the mounting target area of the substrate 20 and the Y coordinate of the component recognition camera 116b as the above-described movement distance. The tact calculating unit 203b stores in advance the Y coordinate of the component recognition camera 116b.

  For example, the tact calculation unit 203b calculates the movement distance as y1 in the case of the substrate orientation D1. Further, the tact calculating unit 203b calculates the movement distance as y2 in the case of the substrate orientation D2.

  As a result, the direction determining unit 205 determines that the movement distance y2 in the substrate direction D2 is the shortest among the movement distances in the substrate directions D1 and D2, and the substrate having the shortest movement distance in the substrate directions D1 and D2. The direction D2 is determined as the optimum substrate direction.

FIG. 12 is a flowchart showing an example of the operation of the determination apparatus 200 according to this modification.
When the orientation determination unit 205 of the determination apparatus 200 first receives an instruction to start the determination process of the substrate orientation from the input unit 201, the orientation determination unit 205 prompts the tact calculation unit 203b of the evaluation value calculation unit 203 to calculate the movement distance. As a result, the tact calculation unit 203b reads the NC data 207a stored in the first storage unit 207 to know the mounting target area of the substrate 20 (step S200). Then, the tact calculation unit 203b calculates a movement distance for each board direction based on the mounting target area (step S202).

  When the movement distance for each substrate direction is calculated, the direction determination unit 205 determines whether or not the movement distance y1 in the substrate direction D1 is longer than the movement distance y2 in the substrate direction D2 (step S204).

  If the direction determining unit 205 determines that the moving distance y1 in the substrate direction D1 is longer than the moving distance y2 in the substrate direction D2 (Y in step S204), the direction determining unit 205 determines the substrate direction D2 as the optimum substrate direction (step S206). ).

  On the other hand, when the direction determining unit 205 determines in step S204 that the moving distance y1 in the substrate direction D1 is not longer than the moving distance y2 in the substrate direction D2 (N in step S204), the moving distance y1 in the substrate direction D1 is further determined. Is equal to the moving distance y2 in the substrate direction D2 (step S208).

  Here, when the direction determining unit 205 determines that the moving distance y1 in the substrate direction D1 is not equal to the moving distance y2 in the substrate direction D2, that is, the moving distance y1 in the substrate direction D1 is larger than the moving distance y2 in the substrate direction D2. If it is determined that the length is short (N in step S208), the substrate orientation D1 is determined as the optimum substrate orientation (step S210).

  That is, in the evaluation step (step S202) in the present modification, when the board 20 is directed to the board direction and conveyed to the component mounting machine 100 for each board direction, the component is The movement distances y1 and y2 of the head 112b necessary for component mounting by the mounting machine 100 are calculated as evaluation values, and in the determination steps (steps S206 and S210), the board orientation with the shortest movement distance is set. It is determined as the power board orientation (optimal board orientation). Further, in this evaluation step, for each board orientation, when the board 20 is directed to the board orientation and transported to the component mounting machine 100, the center of the mounting target area indicated by the area information on the board 20 stopped is preliminarily stored. The distance in the direction perpendicular to the transport direction of the substrate 20 between the determined position is calculated as the movement distance.

  On the other hand, when the direction determining unit 205 determines in step S208 that the moving distance y1 in the substrate direction D1 is equal to the moving distance y2 in the substrate direction D2 (Y in step S208), the direction determining unit 205 determines the tact calculating unit 203b for each substrate direction. A tact is calculated (step S212). That is, the tact calculating unit 203b performs a complicated calculation process and calculates a tact having a higher degree of strictness than the moving distance instead of the moving distance. For example, the tact calculation unit 203b calculates the tact by the process described in the second modification. Then, the orientation determining unit 205 determines the substrate orientation of the shortest tact as the optimum substrate orientation based on the calculated tact for each substrate orientation (step S214).

  As described above, in this modified example, the throughput of the mounting substrate can be improved as in the above-described embodiment. That is, in this modification, for each direction of the substrate 20, the movement distance indicating the influence on the production efficiency is calculated as the evaluation value, and the direction of the substrate 20 with the shortest movement distance is determined as the optimum substrate direction. Accordingly, even if the board 20 is directed in any direction, the mounting target area of the board 20 is within the mountable range Ma of the component mounting machine 100, that is, the board 20 is directed in any direction. Even if the transfer is performed once, if the substrate 20 is transferred to the component mounting machine 100 with the determined optimum substrate direction, the moving distance of the head 112b is short, so that the throughput of the mounting substrate is reduced. Can be improved.

  Further, in this modification, the distance in the Y-axis direction between the center position of the mounting target area of the substrate 20 that is stopped and arranged in the component mounter 100 and the component recognition camera 116b is calculated as the movement distance. Therefore, the movement distance can be calculated as a tact index very easily without requiring complicated calculation.

  In the present modification, the distance in the Y-axis direction between the center position of the mounting target area of the substrate 20 that is stopped and arranged in the component mounting machine 100 and the component recognition camera 116b is defined as the movement distance. Other distances may be used as the movement distance.

  For example, the sum of the distances in the Y-axis direction between the mounting points of the board 20 placed in a stopped state in the component mounter 100 and the component recognition camera 116b may be used as the movement distance.

FIG. 13 is an explanatory diagram for explaining another example of the movement distance.
For example, the tact calculation unit 203b assumes the state of the board 20 that has been transported into the component mounter 100 and stopped in the direction D1 of the board, and based on the Y coordinate of the mounting point indicated by the NC data 207a. The distances y1a to y1d in the Y axis direction between all the mounting points p1 to p4 and the component recognition camera 116b are calculated. Then, the tact calculation unit 203b calculates the sum of these distances y1a to y1d, that is, y1 = y1a + y1b + y1c + y1d as the movement distance y1 in the substrate direction D1.

  Thus, by calculating the movement distance based on the mounting point, it is possible to increase the accuracy of the movement distance that is the evaluation value and to determine a more appropriate board orientation.

  When determining the substrate orientation based on the movement distance based on the mounting point as described above, there are four orientations that the rectangular substrate 20 can take.

  In other words, when the board orientation is determined by the evaluation value such as the number of times of conveyance and the movement distance based on the center position of the mounting target area, the evaluation value for the predetermined board orientation and the board orientation are rotated by 180 degrees. It agrees with the evaluation value for the substrate orientation. Therefore, in such a case, the substrate orientations for which the evaluation value is calculated are only the two substrate orientations D1 and D2.

  However, when determining the board direction based on the movement distance based on the mounting point, the movement distances are generally different for the four board directions. Therefore, in such a case, the tact calculation unit 203b calculates the movement distance for each of the four substrate directions. The four substrate orientations are, for example, the substrate orientation D1 as a reference, the reference substrate orientation D1, the orientation obtained by rotating the substrate orientation D1 by 90 degrees, and the orientation obtained by rotating the substrate orientation D1 by 180 degrees. The substrate direction D1 is a direction rotated by 270 degrees.

  In the above example, the total distance in the Y-axis direction between each of the mounting points p1 to p4 and the component recognition camera 116b is the movement distance y1, but the head 112b is mounted among the mounting points p1 to p4. The sum of the distances in the Y-axis direction between each of the mounting points and the component recognition camera 116b may be calculated as the movement distance y1. Further, the moving distance y1 may be calculated using not the distance in the Y-axis direction between the mounting point and the component recognition camera 116b but the linear distance therebetween.

  FIG. 14 is a flowchart showing another example of the operation of the determination apparatus 200 according to this modification.

  When the orientation determination unit 205 of the determination apparatus 200 first receives an instruction to start the determination process of the substrate orientation from the input unit 201, the orientation determination unit 205 prompts the tact calculation unit 203b of the evaluation value calculation unit 203 to calculate the movement distance. As a result, the tact calculation unit 203b reads out the NC data 207a stored in the first storage unit 207 (step S300). Then, the tact calculation unit 203b calculates the distance in the Y-axis direction between each mounting point and the component recognition camera 116b for each board orientation, based on each mounting point indicated by the NC data 207a (step). S302).

  Further, the tact calculation unit 203b derives the movement distance in the board direction by adding the distances of the mounting points calculated in step S302 for each board direction (step S304). Then, the orientation determining unit 205 identifies the substrate orientation with the shortest movement distance (step S306).

  Here, the orientation determining unit 205 determines whether there are two or more substrate orientations identified in step S306 (step S308). If the orientation determination unit 205 determines that there is only one specified substrate orientation (N in step S308), the orientation determination unit 205 determines the specified substrate orientation, that is, the substrate orientation of the shortest movement distance as the optimum substrate orientation ( Step S310).

  On the other hand, when the orientation determining unit 205 determines that there are two or more substrate orientations identified in step S308 (Y in step S308), the orientation determining unit 205 causes the tact calculating unit 203b to calculate the tact for each substrate orientation (step). S312). Then, the orientation determining unit 205 determines the substrate orientation of the shortest tact as the optimum substrate orientation based on the calculated tact for each substrate orientation (step S314).

(Modification 2)
Here, a second modification of the present embodiment will be described. In the above-described embodiment, the substrate orientation is determined based on the evaluation values such as the number of times of conveyance and the moving distance. However, in this modification, the substrate orientation is determined based only on tact.

FIG. 15 is a flowchart illustrating an example of the operation of the determination apparatus 200 according to this modification.
First, when the direction determination unit 205 of the determination apparatus 200 receives an instruction to start determination processing of the substrate direction from the input unit 201, the direction determination unit 205 causes the tact calculation unit 203b of the evaluation value calculation unit 203 to calculate a tact for each substrate direction. (Step S400). Then, the orientation determining unit 205 determines the substrate orientation of the shortest tact as the optimum substrate orientation based on the calculated tact for each substrate orientation (step S402).

  That is, in the method for determining the orientation of the board 20 according to this modification, the component mounting machine 100 produces one mounting board (product) using the board 20 transported toward the board orientation for each board orientation. An evaluation step (step S400) for calculating a tact required for performing the evaluation as an evaluation value, and a determination for determining a direction of a substrate having the shortest tact among a plurality of substrate directions as a substrate direction to be set (optimum substrate direction) Step (step S402).

  As described above, in this modified example, the tact is calculated for each orientation of the substrate 20, and the orientation of the substrate 20 with the shortest tact is determined as the optimum substrate orientation. Therefore, the substrate 20 is directed to the determined optimum substrate orientation. If it is conveyed to the component mounting machine 100, the throughput of the mounting board can be improved.

  In the present modification as well, since there are four possible orientations of the rectangular substrate 20 as described above, the tact calculation unit 203b calculates the tact for each of the four substrate orientations.

  Here, in order to calculate the tact as described above, it is necessary to optimize the mounting conditions such as the component arrangement, and further, a complicated calculation using the optimized mounting conditions is required. As a result, the tact calculation requires a large processing load on the determination apparatus 200 and may require a long calculation time.

  Therefore, the tact may be calculated simply without optimizing the mounting conditions and without using the mounting conditions. Hereinafter, such a tact that is simply calculated is referred to as a virtual tact.

FIG. 16 is an explanatory diagram for explaining a method for calculating a virtual tact.
For example, as illustrated in FIG. 16, the tact calculation unit 203b assumes a state of the board 20 that has been transported and stopped in the component mounting machine 100 toward the board direction D1. As a result, the tact calculating unit 203b determines that the number of times of conveyance is one because the entire mounting target area of the substrate 20 is within the mountable range Ma. At this time, the tact calculation unit 203b specifies the entire mounting target area of the substrate 20 as the mountable target area.

  In the present modification, as in the above embodiment, the entire mounting surface of the substrate 20 is set as a mounting target area. The mountable target area is an area included in the mountable range Ma in the state of the substrate 20 assumed as described above, among the mount target areas of the substrate 20.

  Next, the tact calculating unit 203b determines the time during which the head 112a moves from the component recognition camera 116a to each mounting point p1 to p4 in the mountable target region (first head moving time) and the mountable target from the component recognition camera 116b. Recognize the time (second head movement time) during which the head 112b moves from the mounting points p1 to p4 in the region, the preset substrate transport time required for transporting the substrate 20, and the position of the stopped substrate 20 The total time required for the substrate recognition time set in advance is calculated as a virtual tact. Note that the position of the board 20 is recognized by the component mounter 100 in order to accurately mount the component at the mounting point of the board 20.

  Specifically, the tact calculation unit 203b first reads the NC data 207a in the first storage unit 207. The tact calculation unit 203b calculates distances La to Lh between the coordinates of the mounting points p1 to p4 indicated by the NC data 207a and the coordinates of the component recognition cameras 116a and 116b stored in advance. . Next, the tact calculation unit 203b calculates the total distance L = La + Lb + Lc + Ld + Le + Lf + Lg + Lh by adding the distances La to Lh. After that, the tact calculating unit 203b divides the total distance L by the moving speed V of the heads 112a and 112b, so that the head moving time Th = L that is the sum of the first head moving time and the second head moving time described above. / V is calculated. Then, the tact calculating unit 203b calculates the virtual tact TCv = Th + Tc + Td by adding the head moving time Th, the substrate transport time Tc, and the substrate recognition time Td.

  In the above-described example, by treating the moving speeds of the heads 112a and 112b equally, the head that is the sum of the first head moving time and the second head moving time is not calculated separately. Although the movement time Th is calculated, the first head movement time and the second head movement time may be calculated separately.

  In this case, the tact calculation unit 203b calculates the distance L1 = La + Lb + Lc + Ld and calculates the distance L2 = Le + Lf + Lg + Lh. Then, the tact calculating unit 203b calculates the first head moving time Tha = L1 / V1 by dividing the distance L1 by the moving speed V1 of the head 112a, and divides the distance L2 by the moving speed V2 of the head 112b. Thus, the second head moving time Thb = L2 / V2 is calculated. Thereafter, the tact calculating unit 203b calculates the virtual tact TCv = Tha + Thb + Tc + Td by adding up the first head moving time Tha, the second head moving time Thb, the substrate transport time Tc, and the substrate recognition time Td.

  Note that the tact calculation unit 203b assumes, for example, the state of the board 20 that has been transported and stopped in the component mounting machine 100 toward the board direction D1, and as a result, the entire mounting target area of the board 20 is within the mountable range Ma. If it does not fall within the range, it is determined that the number of times of conveyance is two. That is, in this case, the tact calculation unit 203b further assumes the state of the substrate 20 stopped by the second transfer, and specifies the mountable target area in the state of the substrate 20. Then, the tact calculation unit 203b calculates the virtual tact as described above for the unprocessed mounting points in the mountable target area. Then, the tact calculating unit 203b updates the virtual tact by adding the second virtual tact to the first virtual tact.

  The tact calculating unit 203b may adjust the moving speeds V1 and V2 of the heads 112a and 112b for each component type using the maximum acceleration ratio indicated by the component library 207b.

  Further, when the contribution of the substrate transport time Tc and the substrate recognition time Td to the tact is small, the tact calculation unit 203b does not use the substrate transport time Tc and the substrate recognition time Td, and the first head moving time Tha and the first time The virtual tact TCv = Tha + Thb may be calculated by summing the two-head moving time Thb. That is, in the evaluation step of this modification, when the board 20 is directed to the board direction and conveyed to the component mounting machine 100 for each board direction, each mounting point of the board 20 that has stopped is determined in advance. The total movement time for the head to move between the two positions is calculated as a virtual tact.

  As described above, when calculating the virtual tact, the processing load is easily reduced as compared with the case where the tact is calculated in consideration of the arrangement of the components provided in the component mounting machine 100 and the mounting order of the components. Tact can be calculated.

  By the way, none of the nozzles nz attached to the head 112a can mount components on the mounting points p1 and p4, and the nozzles nz that can be mounted on the mounting points p1 and p4 are limited. Has been. That is, even if the head 112a moves to the boundary of the mountable range Ma in the X-axis direction, the nozzle nz far from the boundary cannot mount a component on the mounting point near the boundary. Similarly, none of the nozzles nz attached to the head 112b can mount components on the mounting points p1 and p4, and the nozzles nz that can be mounted on the mounting points p1 and p4 are Limited. That is, even if the head 112b moves to the boundary of the mountable range Ma in the X-axis direction, the nozzle nz far from the boundary cannot mount a component on the mounting point near the boundary.

  Thus, the fact that the nozzles nz that can be mounted on the mounting point is limited means that the tact is long depending on the number of such mounting points and the degree of limitation (the number of nozzles nz that can be mounted). Tend to be.

  Therefore, the tact calculation unit 203b may calculate the virtual tact in consideration of the restriction of the nozzle nz with respect to the mounting point.

  FIG. 17 is an explanatory diagram for explaining a method for calculating a virtual tact in consideration of the restriction of the nozzle nz with respect to the mounting point.

  For example, as shown in FIG. 17A, the tact calculation unit 203b assumes the state of the board 20 that has been transported and stopped in the component mounting machine 100 toward the board direction D1. As a result, the tact calculating unit 203b determines that the number of times of conveyance is one because the entire mounting target area of the substrate 20 is within the mountable range Ma. At this time, the tact calculation unit 203b specifies the entire mounting target area of the substrate 20 as the mountable target area.

  Then, the tact calculation unit 203b uses a non-restricted range Mb set in advance in the mountable range Ma, and for each of the mount points in the mountable target area of the substrate 20, the mount point is the nozzle nz. It is determined whether or not the mounting point is subject to restriction (restricted mounting point). The non-restricted range Mb is a range in which components can be mounted without restriction of the nozzle nz. If the mounting point is within that range, any nozzle nz of the heads 112a and 112b can be mounted on the mounting point. Indicates that component mounting is possible.

  For example, since the mounting points p2 and p3 are within the non-restricted range Mb among the mounting points p1 to p4 in the mountable target area, the tact calculation unit 203b is not a limited mounting point. Judged as an unrestricted mounting point. In addition, the tact calculation unit 203b determines that the mounting points p1 and p4 are the restricted mounting points because the mounting points p1 and p4 are outside the non-restricted range Mb. In this way, the tact calculation unit 203b identifies the restricted mounting point and the non-restricted mounting point from among the mounting points in the mountable target area of the substrate 20.

  Then, the tact calculation unit 203b calculates distances La to Lh between the mounting points p1 to p4 and the component recognition cameras 116a and 116b, as described above. Next, the tact calculation unit 203b specifies the distances Lb, Lc, Lf, and Lg having the unrestricted mounting points p2 and p3 as base points among the distances La to Lh. Further, the tact calculation unit 203b uses the identified distances Lb, Lc, Lf, and Lg to calculate a movement time Ta1 = (Lb + Lc) / V1 required for the head 112a to move by the distances Lb and Lc. The movement time Ta2 = (Lf + Lg) / V2 required for the head 112b to move by the distances Lf and Lg is calculated.

  As a result, the tact calculating unit 203b calculates the moving time Ta = Ta1 + Ta2 of the heads 112a and 112b based on the unrestricted mounting points p2 and p3 by adding the moving time Ta1 and the moving time Ta2.

  Next, the tact calculation unit 203b determines a weighting coefficient K1 for the restricted mounting point p1 and a weighting coefficient K2 for the restricted mounting point p4. Here, each of the weighting factors K1 and K2 is an integer of 1 or more, and is determined to be larger as the number of nozzles nz that can be mounted with respect to the limited mounting point is smaller.

  Then, the tact calculating unit 203b calculates the moving time Tb1 required for the head 112a to move the distance La with the restricted mounting point p1 as a base point, using the above-described weighting factor K1, as Tb1 = La / V1 × K1. To do. Similarly, the tact calculation unit 203b sets the movement time Tb2 required for the head 112a to move the distance Ld with the restricted mounting point p4 as a base point as Tb2 = Ld / V1 × K2 using the above-described weighting factor K2. calculate.

  Similarly, the tact calculation unit 203b uses the weighting factor K1 described above to calculate the movement time Tb3 required for the head 112b to move the distance Le with the limited mounting point p1 as a base point, and Tb3 = Le / V2 × K1. Calculate as Similarly, the tact calculation unit 203b sets the movement time Tb4 required for the head 112b to move the distance Lh from the limited mounting point p4 as Tb4 = Lh / V2 × K2 using the above-described weighting factor K2. calculate.

  As a result, the tact calculating unit 203b calculates the moving time Tb = Tb1 + Tb2 + Tb3 + Tb4 of the heads 112a and 112b based on the restricted mounting points p1 and p4 by adding the moving times Tb1 to Tb4.

  The tact calculating unit 203b then moves the head movement time Ta with respect to the unrestricted mounting point, the head movement time Tb with respect to the restricted mounting point, the substrate transfer time Tc required for one transfer of the substrate 20, and the stopped substrate 20 The virtual tact TCv = Ta + Tb + Tc + Td is calculated by summing up the substrate recognition time Td required to recognize the position of.

  As described above, the tact calculation unit 203b assumes, for example, the state of the board 20 that has been transported and stopped in the component mounting machine 100 toward the board direction D1, and as a result, the entire mounting target area of the board 20 is If it does not fall within the mountable range Ma, it is determined that the number of times of conveyance is two. That is, in this case, the tact calculation unit 203b further assumes the state of the substrate 20 stopped by the second transfer, and specifies the mountable target area in the state of the substrate 20. Then, the tact calculation unit 203b calculates the virtual tact as described above for the unprocessed mounting points in the mountable target area. Then, the tact calculating unit 203b updates the virtual tact by adding the second virtual tact to the first virtual tact.

  On the other hand, the tact calculation unit 203b assumes a state of the board 20 that has been transported and stopped in the component mounting machine 100 toward the board direction D2, for example, as illustrated in FIG. As a result, the tact calculating unit 203b determines that the number of times of conveyance is one because the entire mounting target area of the substrate 20 is within the mountable range Ma, as in the case of the substrate direction D1. At this time, the tact calculation unit 203b specifies the entire mounting target area of the substrate 20 as the mountable target area.

  Then, the tact calculation unit 203b uses a non-restricted range Mb set in advance in the mountable range Ma, and for each of the mount points in the mountable target area of the substrate 20, the mount point is the nozzle nz. It is determined whether or not the mounting point is subject to restriction (restricted mounting point).

  Here, since all of the mounting points p1 to p4 in the mountable target area are within the non-restricted range Mb, the tact calculating unit 203b is not all of the mounting points p1 to p4, that is, non-restricted mounting. Judged as a point.

  Therefore, the tact calculating unit 203b calculates the distance L1 = La + Lb + Lc + Ld and calculates the distance L2 = Le + Lf + Lg + Lh as described above. Then, the tact calculating unit 203b calculates the first head moving time Tha = L1 / V1 by dividing the distance L1 by the moving speed V1 of the head 112a, and divides the distance L2 by the moving speed V2 of the head 112b. Thus, the second head moving time Thb = L2 / V2 is calculated. Thereafter, the tact calculating unit 203b calculates the virtual tact TCv = Tha + Thb + Tc + Td by adding the first head moving time Tha, the second head moving time Thb, the substrate transport time Tc, and the substrate recognition time Td.

  FIG. 18 is a flowchart illustrating an example of an operation in which the tact calculation unit 203b according to the present modification calculates a virtual tact in consideration of the restriction of the nozzle nz.

  When the orientation determination unit 205 of the determination device 200 first receives an instruction to start the substrate orientation determination process from the input unit 201, the orientation determination unit 205 prompts the tact calculation unit 203b to calculate a virtual tact. As a result, the tact calculation unit 203b reads the NC data 207a stored in the first storage unit 207, thereby obtaining the mounting target area of the substrate 20 and the coordinates of each mounting point (step S500).

  Next, the tact calculation unit 203b selects one of the plurality of substrate directions of the substrate 20 (step S502), and initially sets the virtual tact TCv to TCv = 0.

  Further, the tact calculation unit 203b assumes a state (stopped state) of the board 20 that has been transported into the component mounting machine 100 and stopped toward the selected board direction, and a mountable target of the board 20 in the stopped state. An area is specified based on the mounting target area and the mountable range Ma acquired in step S500 (step S506).

  Then, the tact calculation unit 203b determines whether each mounting point in the mountable target area is an unrestricted mounting point. In other words, the tact calculation unit 203b identifies an unrestricted mounting point and a restricted mounting point from a plurality of mounting points in the mountable target area (step S508).

  Next, the tact calculating unit 203b calculates the moving time Ta of the heads 112a and 112b based on the non-restricted mounting points and the moving time Tb of the heads 112a and 112b based on the limited mounting points, and adds them to the virtual tact TCv. As a result, the virtual tact TCv is updated (step S510).

  As described above, the determination method of the orientation of the board 20 according to the present modification includes a constraint determination step for determining whether or not there is a restriction on mounting of components by the component mounter 100 for each mounting point of the board 20. (Step S508), and in the evaluation step (Step S510), the moving time during which the heads 112a and 112b move between a mounting point determined to be restricted (restricted mounting point) and a predetermined position is set. A virtual tact is calculated by adding a weight.

  Further, the tact calculating unit 203b adds the substrate transport time Tc required until the substrate 20 is brought into the above-described stopped state and the substrate recognition time Td required for recognizing the position of the substrate 20 in the stopped state to the virtual tact TCv. As a result, the virtual tact TCv is updated.

  Here, the tact calculation unit 203b determines whether or not the next conveyance is necessary for the substrate 20 (step S514). That is, the tact calculation unit 203b determines whether or not all the mounting target areas of the substrate 20 are set as the mountable target areas. Specifically, if the mounting target area of the substrate 20 in the above-described stopped state protrudes from the mountable range Ma, the tact calculation unit 203b does not set the protruding part as the mountable target area. It is determined that the next conveyance is necessary.

  If the tact calculating unit 203b determines that the next transfer is necessary (Y in step S514), the process from step S506 is performed assuming that the substrate 20 in the above-described stopped state is further transferred and stopped. Run repeatedly. On the other hand, if the tact calculation unit 203b determines that the next conveyance is not necessary (N in step S514), the virtual tact TCv updated in the latest step S512 is used as the virtual tact TCv for the substrate orientation selected in step S502. (Step S516).

  After step S516, the tact calculation unit 203b determines whether there is another substrate orientation for which the virtual tact TCv has not been determined (step S518), and if it determines that there is another substrate orientation (Y in step S518). ), And repeats the processing from step S502. In step S502 in this case, the tact calculation unit 203b selects a substrate direction that has not yet been selected.

  In this modification, the tact of one component mounting machine 100 is calculated, and the orientation of the substrate 20 is determined based on the tact. However, the tact (line tact) of the production line is calculated, and based on the line tact. The orientation of the substrate 20 may be determined. In this case, the tact calculating unit 203b calculates a tact for each of the plurality of component mounting machines 100 configuring the production line, and sets the longest tact as the line tact. Further, the tact of the component mounter 100 used when calculating the line tact may be calculated as the above-described virtual tact.

  In this modification, as shown in FIG. 16 or FIG. 17, the tact calculation unit 203b determines the time for moving the head 112a from the component recognition camera 116a to each mounting point p1 to p4 in the mountable target area, and the component recognition. The time for the head 112b to move from the camera 116b to the mounting points p1 to p4 in the mountable target area was calculated as the first head moving time and the second head moving time, respectively. However, for example, if it is known that the head 112a mounts components on the mounting points p1 and p2 and the head 112b mounts components on the mounting points p3 and p4, the mounting point p1 is detected from the component recognition camera 116a. , P2 and the time when the head 112b moves from the component recognition camera 116b to the mounting points p3 and p4 may be calculated as the first head moving time and the second head moving time, respectively.

  In this modification, as shown in FIG. 16 or FIG. 17, the tact calculation unit 203b uses the linear distances La to Lh between the component recognition camera and each mounting point in order to calculate the virtual tact. As in Modification 1, the distance in the Y-axis direction between the component recognition camera and each mounting point, that is, the movement distance of the beams 121a and 121b may be used.

  As mentioned above, although the board | substrate direction determination method and determination apparatus based on this invention were demonstrated using the said embodiment and its modification, this invention is not limited to this.

  For example, in the present embodiment and its modifications, evaluation values such as the number of times of conveyance, movement distance, and tact (virtual tact) are calculated. The orientation of the substrate 20 that is perpendicular to the direction may be determined as the optimum substrate orientation.

  In addition, the substrate orientation determination method according to the present invention includes an information acquisition step of acquiring NC data 207a indicating a mounting target area that is a target of component mounting by the component mounter 100 on the substrate 20, and for each orientation of the substrate 20. A determination step for determining whether or not all the mounting target areas indicated by the NC data 207a within the mountable range Ma when the board 20 is directed and conveyed to the component mounting machine 100, and the determination A determination step of determining the orientation of the substrate 20 determined that all the mounting target areas are within the mountable range Ma in the step as the optimum substrate orientation may be included.

  Thus, as described above, it is possible to improve the throughput of a product such as a mounting board without calculating evaluation values such as the number of conveyances, a moving distance, and a tact (virtual tact).

  Further, in the present embodiment and its modification example 1, the orientation of the substrate 20 conveyed relative to one component mounting machine 100 is determined, but the orientation of the substrate 20 conveyed relative to the production line is determined. Also good. That is, the determining apparatus 200 determines the orientation of the substrate 20 for each of the plurality of component mounting machines 100 configuring the production line, for example, determines the largest orientation among the determined orientations as the optimum substrate orientation.

  In the present embodiment and its modification, the direction of the board 20 to be transported with respect to the component mounting machine 100 is determined. The orientation may be determined.

Further, the component mounter 100 may include a determination device 200.
Further, in the present embodiment and its modification 1, when the number of times of conveyance or the movement distances for a plurality of substrates are equal, the tact for each substrate is calculated. The virtual tact for each substrate direction may be calculated, and the substrate direction with the shortest virtual tact may be determined as the optimum substrate direction.

  The substrate orientation determination method of the present invention can improve the throughput of a product such as a mounting substrate, and is applied to, for example, a computer that determines the orientation of a substrate when the substrate is transported to a component mounting machine. be able to.

1 is an external view of a component mounting system in an embodiment of the present invention. It is an external view of a component mounting machine same as the above. It is a figure which shows the main structures of a component mounting machine same as the above. It is a schematic diagram which shows the positional relationship of a head same as the above and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated the components same as the above. It is a block diagram which shows the function structure of a determination apparatus same as the above. It is a figure which shows an example of NC data same as the above. It is a figure which shows an example of a component library same as the above. It is explanatory drawing for demonstrating the determination method of the board | substrate direction by the direction determination part same as the above. It is a flowchart which shows an example of operation | movement of a determination apparatus same as the above. It is explanatory drawing for demonstrating the determination method of the direction of the board | substrate which concerns on the modification 1 same as the above. It is a flowchart which shows an example of operation | movement of the determination apparatus which concerns on the modification 1 same as the above. It is explanatory drawing for demonstrating the other example of the movement distance which concerns on the modification 1 same as the above. It is a flowchart which shows the other example of operation | movement of the determination apparatus which concerns on the modification 1 same as the above. It is a flowchart which shows an example of operation | movement of the determination apparatus 200 which concerns on the modification 2 same as the above. It is explanatory drawing for demonstrating the calculation method of the virtual tact which concerns on the modification 2 same as the above. It is explanatory drawing for demonstrating the calculation method of the virtual tact which considered the restriction | limiting of the nozzle with respect to the mounting point which concerns on the modification 2 same as the above. It is a flowchart which shows an example of the operation | movement which the tact calculation part which concerns on the modification 2 same as the above calculates a virtual tact in consideration of the restriction | limiting of a nozzle. It is explanatory drawing for demonstrating the subject by the determination method of the direction of the conventional board | substrate. It is explanatory drawing for demonstrating the other subject same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 200 Determination apparatus 201 Input part 202 Display part 203 Evaluation value calculation part 203a Conveyance number calculation part 203b Tact calculation part 205 Orientation determination part 206 Communication part 207 1st storage part 207a NC data 207b Parts library 208 2nd storage part 208a Determination direction data 209 Third storage unit 209a Mounting condition data

Claims (10)

A method for determining an orientation of the substrate to be set with respect to a substrate conveyed to a production facility,
For each orientation of the substrate, an evaluation step for calculating an evaluation value indicating an effect on the production efficiency by the production facility when the substrate is directed to the orientation and transported to the production facility; and
Determining a direction of any one of the plurality of substrate orientations as an orientation of the substrate to be set based on an evaluation value for each orientation of the substrate, To determine the orientation of the board to be used. In the evaluation step, for each direction of the substrate, a tact time required for the production facility to produce one product using the substrate transported in the direction is calculated as the evaluation value,
The substrate orientation determination according to claim 1, wherein in the determining step, the orientation of the substrate having the shortest tact time among the orientations of the plurality of substrates is determined as the orientation of the substrate to be set. Method. The production facility is a component mounter that produces a mounting substrate as the product by mounting a component on a substrate, moves the component while holding the supplied component, and at a predetermined mounting point on the substrate. With a head to mount,
In the evaluation step, for each direction of the substrate, when the substrate is directed to the direction and transported to the production facility, a gap between each mounting point of the stopped substrate and a predetermined position is determined. The method for determining the orientation of a substrate according to claim 2, wherein the total movement time for the head to move is calculated as the tact time. The method for determining the orientation of the substrate further includes:
For each mounting point of the substrate, including a constraint determining step for determining whether there is a constraint on the mounting of parts by the production facility for the mounting point,
In the evaluation step, the total movement time is calculated by adding a weight to the movement time for the head to move between the mounting point determined to be restricted and the predetermined position. The method for determining the orientation of a substrate according to claim 3. The production facility includes two heads and two cameras that capture the parts held by each of the heads, and one head moves to the stopped substrate through the vicinity of one camera, The other head moves to the stopped substrate through the vicinity of the other camera,
In the evaluation step,
A first total movement time during which the one head moves between each mounting point of the board that has stopped and the position of the one camera;
The total movement time is calculated by adding the second total movement time during which the other head moves between each mounting point of the stopped board and the position of the other camera. The method for determining the orientation of a substrate according to claim 4. The production facility performs a production operation on the stopped substrate by moving the moving member,
In the evaluation step, for each orientation of the substrate, when the substrate is directed to the orientation and transported to the production facility, production work by the production facility is performed on the stopped substrate. Calculate the required moving distance of the moving member as the evaluation value,
2. The substrate orientation determination method according to claim 1, wherein in the determination step, the orientation of the substrate having the shortest moving distance is determined as the orientation of the substrate to be set. A determination device for determining an orientation of the substrate to be set with respect to a substrate transported to a production facility,
For each direction of the substrate, an evaluation means for calculating an evaluation value indicating an influence of the arrangement of the substrate on the production efficiency by the production facility when the substrate is directed to the direction and transferred to the production facility;
Determining means for determining, as the substrate orientation to be set, one of the plurality of substrate orientations based on an evaluation value for each of the substrate orientations, Decision device to do. A component mounting method for mounting a component on a board,
An orientation determining step for determining the orientation of the board to be set with respect to the board conveyed to the component mounting machine by the board orientation determining method according to claim 1;
A component mounting method comprising: a component mounting step for mounting a component on a substrate transported in a direction determined by the orientation determination step. A component mounter for mounting components on a board,
The determination apparatus according to claim 7, wherein an orientation of the board to be set with respect to the board conveyed to the component mounter is determined;
A component mounting machine comprising: mounting means for mounting a component on a board conveyed in a direction determined by the determining device. A program for determining the orientation of the substrate to be set with respect to the substrate conveyed to the production facility,
For each orientation of the substrate, an evaluation step for calculating an evaluation value indicating an effect on the production efficiency by the production facility when the substrate is directed to the orientation and transported to the production facility; and
Causing the computer to execute a determination step of determining any one of the plurality of substrate orientations as the orientation of the substrate to be set based on the evaluation value for each of the substrate orientations. A program characterized by

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