JP2008265234A - Inkjet recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent deformation of an inkjet recording head substrate by forming a beam in a common liquid chamber of a recording head. <P>SOLUTION: The inkjet recording head equipped with a liquid passing chamber, a substrate having a heating resistor to project an ink by heating the ink and generating bubbles, and an orifice plate having ejection openings formed on the substrate is characterized in that the substrate has the beam which reinforces the substrate, and the beam of the inkjet recording head is nearly rectangular. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an ink jet recording head for recording on a recording medium by ejecting ink and a method for manufacturing the same.

  Ink jet recording method (described in Japanese Patent Laid-Open No. 54-51837), in which bubbles are generated by heating ink, ink is ejected based on the generation of the bubbles, and this is deposited on a recording medium. Has the advantages of being capable of high-speed recording, relatively high recording quality, and low noise. This method is relatively easy to record a color image, can also be recorded on plain paper, etc., and the apparatus can be easily downsized, and furthermore, the discharge ports in the recording head can be arranged at high density. It has many excellent advantages such as being able to record high resolution and high quality images at high speed. A recording apparatus using this method can be used as an information output means in a copying machine, a printer, a facsimile, or the like.

  The general structure of such an ink jet recording system recording head is that a projecting port provided for ejecting ink, an ink path filled with ink in communication therewith, and a heat provided in the ink path. An electrothermal conversion element (hereinafter referred to as a heating element) for generating energy is provided. The heating element includes a heating resistance layer, an upper protective layer that protects it from ink, and a lower heat storage layer for storing heat. When this is energized in a pulsed manner (application of drive pulses) through the electrode wiring, heat energy is generated, and the liquid subjected to the action of the heat energy is overheated to generate bubbles, which is based on the bubble generation. Due to the acting force, a droplet is formed from the ejection port at the tip of the recording head, and the droplet adheres to the recording member to record information.

  In recent years, the demand for outputting image information with a large amount of data to a recording member has increased, and high-definition and high-speed recording has been desired. To output a high-definition image, small droplets are stably ejected. For this purpose, it is necessary to form ejection ports with high density and high accuracy.

  As the formation method thereof, a method of manufacturing an ejection port of an ink jet recording head disclosed in Japanese Patent Laid-Open Nos. 5-330066 and 6-286149 has been proposed. As a forming method, there has been proposed a forming method in which an orifice plate above an ink supply port portion has a rib structure.

  These ink jet recording heads eject ink droplets in a vertical direction with respect to a substrate on which a heating element is formed, and have a structure called “side shooter type” ink jet recording head.

  In the “side shooter type” ink jet recording head, the interval between the discharge ports becomes shorter as the definition becomes higher, and the ink flow path becomes narrower. When the ink flow path becomes narrower, the time required for the ink to fill the ink flow path after foaming (refill time) becomes longer, so the distance between the heating element and the ink supply port needs to be shortened. As a method for controlling the distance between the ink supply port and the heating element, silicon crystal anisotropic etching using an etching rate difference corresponding to the crystal orientation plane of silicon by an alkaline aqueous solution is known. In this method, generally, a silicon wafer having an azimuth plane of (100) is used as a substrate, and silicon crystal anisotropic etching is performed from the back surface of the substrate to accurately form the opening width of the ink supply port. Control the distance to the mouth. In order to provide a more accurate opening width, Japanese Patent Laid-Open No. 10-181032 proposes a method for producing an ink supply port that combines a sacrificial layer formed on the surface and anisotropic etching.

In addition to forming a high-definition ink jet recording head, silicon crystal anisotropic etching using such an alkaline aqueous solution is a useful technique that can accurately produce an ink supply port.
JP-A-54-51837 JP-A-5-330066 JP-A-6-286149 Japanese Patent Laid-Open No. 10-146979 Japanese Patent Laid-Open No. 10-181032 Japanese Patent Laid-Open No. 2-112832. Japanese Patent Laid-Open No. 2-112833 Japanese Patent Laid-Open No. 2-112834 Japanese Patent Laid-Open No. 2-114472

  However, in order to perform high-definition and high-speed printing, it is necessary in the manufacturing method disclosed in Japanese Patent Laid-Open Nos. 5-330066 and 6-286149 to have a head structure that increases the number of ejection ports and increases the print output width. That is, a long ink jet recording head (hereinafter referred to as a long head) with an increased number of ejection ports shown in FIG. When the number of ejection ports is increased, the opening length of the ink supply port becomes longer corresponding to the number of ejection ports, the mechanical strength of the substrate is lowered, and problems such as deformation and breakage of the substrate occur in manufacturing the ink jet recording head. In the method of Japanese Patent Laid-Open No. 10-146979 that proposes a structure in which ribs are raised on an orifice plate made of resin, it is possible to prevent deformation of the orifice plate when the orifice plate swells with ink, but the resin is inorganic. Compared with the substrate made of material, Young's modulus is about 2 to 5 digits smaller, and the mechanical strength of the inkjet recording head required for handling depends on the substrate, improving the mechanical strength corresponding to the increase in length. It is difficult to expect. Problems such as deformation and breakage of the substrate caused by a decrease in mechanical strength accompanying the increase in length will be specifically described below.

1) Deformation of substrate due to film stress A heat storage layer, a heating resistance layer, a protective layer, a wiring electrode, and an orifice plate are formed on the substrate. Such a substrate composed of a plurality of layers generates compressive or tensile stress in the substrate due to the thin film stress of each layer. For example, in the case of tensile stress, as shown in FIG. 2 (only the substrate portion of the head is shown in a simplified manner) as the length increases, the stress is released by forming the ink supply port, and the center of the ink supply port is released. Then, a bending moment is generated in the width direction, and the width of the ink supply port is different between the end portion and the center portion of the head, and the position of the protruding port is deviated from the desired position. Since this deviation depends on the length of the ink supply port, the deviation increases as the length increases. If this deviation becomes large when printing is performed, printing irregularities corresponding to the deviation of the protrusions and printing defects such as image distortion will be seen.

2) Substrate breakage due to handling In the above-described process of chipping a plurality of ink jet recording heads collectively formed on the substrate and sticking them to the flow path member, each of the elongated ink jet recording heads is handled and a predetermined position of the flow path member is obtained. Need to be aligned. When the ink supply port is long, the upper side and the lower side of the front view of FIG. 1 are separated by the ink supply port, and the substrate at the end of the head having the long ink supply port (FIG. 1). The head structure is held only by the part where the left and right upper and lower sides are connected. When handling an ink jet recording head, if a part of the head is gripped, a bending moment is generated, stress is concentrated on the end face of the head, and the head is damaged. As the length increases, the mechanical strength of the ink jet recording head decreases and the manufacturing yield decreases accordingly.

3) Deformation and damage of the substrate due to thermal stress when joining the flow path member To attach the head to the cartridge tank, chip multiple inkjet recording heads formed on the substrate at once and divide them into each projecting element of the head for mounting Are bonded to the flow path member and assembled into the cartridge holder. In an ink jet recording apparatus, a thermosetting adhesive is generally employed as an adhesive for joining a discharge element to a flow path member because of ink resistance. Further, the flow path member is made of a resin that is easy to process and inexpensive. When the discharge element and the resin flow path member are bonded using a thermosetting adhesive, thermal stress is generated in the discharge element when the discharge element and the flow path member return to normal temperature due to the difference in thermal expansion coefficient between the discharge element and the flow path member. To do. As a result, as shown in FIG. 3 (schematic diagram of the CC cross section in FIG. 1), the projecting port cannot maintain flatness, and an angle is generated in the projecting direction. If the ink supply port is made long, the mechanical strength of the discharge element is lowered, and the orifice plate is deformed by the deformation of the substrate of the discharge element due to thermal stress.

  Due to the above problems, if this deviation becomes large when printing is performed, printing irregularities corresponding to the angular deviation of the protrusions and printing defects such as image distortion will be seen. Furthermore, if the thermal stress exceeds the yield stress of the substrate, the substrate may crack.

  In the method in which the ink supply port is also elongated in accordance with the length of the ink jet recording head, the production yield is reduced and the printing failure occurs. As a method for solving these problems, a side shooter type in which a silicon (100) substrate is used as a substrate, an etching mask is formed on the back surface of the substrate, and a plurality of ink supply ports are formed by silicon crystal anisotropic etching. An ink jet recording head configuration is conceivable. FIG. 4 shows an example of an ink jet recording head comprising a plurality of ink supply ports (indicated by broken lines in the figure). FIG. 4A is a top view, and FIG. 4B is a schematic diagram of a DD section. In this configuration, as is apparent from FIG. 4B, even if a beam width of 50 μm is formed on the lower surface of the substrate, an angle formed between the (111) plane and the (100) plane is formed by silicon anisotropic etching. At a certain 54.7 °, silicon is etched from the back surface, the beam shape becomes an inverted trapezoid, and the beam width on the substrate surface is expanded to about 940 μm. As a result, the distance between the heating element located at the center of the beam on the surface and the ink supply port exceeds 400 μm, and the refill time in this heating element is extremely slow, making it impossible to obtain a practical printing speed. Cannot be printed.

  In order to form a high-definition ink jet recording head, it is necessary to use a method for forming an ink supply port of a silicon crystal anisotropic etching with a side shooter type structure. The method was difficult. In order to perform high-speed printing, it is necessary to shorten the refill time and lengthen the ink supply port. As a result, a manufacturing yield and a printing defect occur, and a good ink jet recording head cannot be formed.

The present invention has been made in view of the above-described problems of the prior art, and its purpose is as follows.
(1) The deformation of the substrate can be suppressed, and the positional deviation of the protrusion can be reduced.
(2) High mechanical strength and avoids damage during handling and mounting.
It is an object of the present invention to provide a long inkjet recording head capable of performing high-definition and high-speed recording capable of satisfactory printing and a method for manufacturing the same.

The inkjet recording head of the present invention that achieves this object and the method for producing the same are as follows:
First,
A common liquid chamber, a substrate having a heating resistor that heats the ink to generate bubbles and protrudes the ink, and an orifice plate having a discharge port provided on the substrate, from the discharge port of the orifice plate In an inkjet recording head for ejecting ink droplets in a direction perpendicular to the substrate surface, the substrate has a beam for reinforcing the substrate, and the beam is substantially rectangular.
Second,
The inkjet recording head according to claim 1, wherein the beam is resistant to an alkaline solution.
Third,
The inkjet beam according to any one of claims 1 to 2, wherein the beam is a metal.
Fourth,
The ink jet recording head according to any one of claims 1 to 3, wherein the metal is a noble metal.
Fifth,
The inkjet recording head according to any one of claims 1 to 4, wherein at least a part of the beam has a portion serving as an anchor with respect to the substrate.
Sixth,
The inkjet recording head according to claim 1, wherein at least a part of the anchor is a curved surface.
Seventh,
The inkjet beam according to any one of claims 1 to 6, wherein the beam is on the back surface of the substrate.
Eighth,
8. The inkjet recording head according to claim 1, wherein one of the surfaces constituting the beam is in the same plane as the back surface of the substrate,
Ninth,
The inkjet recording head according to any one of claims 1 to 8, wherein the substrate is a silicon single crystal.
Tenth,
10. The inkjet recording head according to claim 1, wherein a crystal orientation of the silicon single crystal constituting the common liquid chamber is a (111) plane.
Eleventh,
A printer equipped with the ink jet recording head according to any one of claims 1 to 10,
12th,
A common liquid chamber, a substrate having a heating resistor that heats ink to foam bubbles and ejects the ink, and an orifice plate having a discharge port provided on the substrate, from the discharge port of the orifice plate In a method of manufacturing an ink jet recording head that discharges ink droplets in a direction perpendicular to a substrate,
(A) A step of etching the substrate from the beam forming opening to form a beam forming groove (first etching step)
(B) A step of filling the beam forming groove with a beam material (c) A step of etching the substrate from the ink supply port forming opening to form an ink supply port forming groove (second etching step)
(D) A through hole is formed in a direction perpendicular to the substrate surface, a communication hole is formed to communicate with the adjacent ink supply port forming groove, a common liquid chamber is formed, and filling in step (d) A part of the object is exposed from the substrate to form a beam (third etching process)
The method for producing an ink jet recording head according to any one of claims 1 to 11, wherein any one of the steps is used.
13th
The method for producing an ink jet recording head according to any one of claims 1 to 12, comprising a step of forming a passivation layer on the substrate surface before the step (a).
14th,
14. The inkjet recording head according to claim 1, further comprising a step of forming a beam forming mask layer having a beam forming opening on the back surface of the substrate before the step (a). A production method,
Fifteenth,
15. The mask layer for forming an ink supply port having an opening for forming an ink supply port is formed by removing the beam forming mask layer before the step (c). A method for producing an ink jet recording head according to claim 1,
Sixteenth,
The method for producing an ink jet recording head according to claim 1, further comprising a step of removing the passivation layer from the back surface of the substrate after the step (d).
Seventeenth,
The method of manufacturing an ink jet recording head according to claim 1, wherein the beam is formed by an electrodeposition method.
Eighteenth,
The method of manufacturing an ink jet recording head according to any one of claims 1 to 17, wherein the beam is formed by an electroless plating method.
Nineteenth,
The method of manufacturing an ink jet recording head according to any one of claims 1 to 18, wherein the beam is formed by an evaporation method.
20th,
The method of manufacturing an ink jet recording head according to any one of claims 1 to 19, wherein the first and second etching steps are anisotropic etching.
21st
21. The method of manufacturing an ink jet recording head according to claim 1, wherein the first and second etching steps are reactive ion etching.
22nd
The inkjet recording head according to any one of claims 1 to 21, wherein the first and second etching steps use any one of a reactive gas such as an SF-based gas, a CF-based gas, and a Cl-based gas. A production method,
23rd,
The method of manufacturing an ink jet recording head according to any one of claims 1 to 22, wherein the first and second etching steps are repeated formation of a protective film and etching.
24th,
24. The method of manufacturing an ink jet recording head according to claim 1, wherein the third etching step is anisotropic etching.
25th,
25. The method of manufacturing an ink jet recording head according to claim 1, wherein the third etching step is crystal anisotropic etching using an alkaline aqueous solution.
26th
26. The method for manufacturing an ink jet recording head according to claim 1, wherein the third etching step uses an etching solution of KOH, EDP, TMAH, or hydrazine.

  As described above, the common liquid chamber of the present invention, a substrate having a heating resistor that heats ink to generate bubbles and protrudes the ink, and an orifice plate having an ejection port provided on the substrate. In the ink jet recording head for discharging ink droplets from the discharge port of the orifice plate in a direction perpendicular to the substrate surface, firstly, deformation of the substrate is suppressed by providing a beam in the common liquid chamber of the substrate. Secondly, the inkjet can reduce the positional deviation of the discharge port, and secondly, the mechanical strength of the substrate is high, the breakage at the time of handling and mounting can be avoided, and the long length capable of high-definition and high-speed recording can be performed. A recording head could be obtained.

  Further, by providing a beam on the back side of the substrate, the ink supply port becomes common to each heating element, the refill time is uniform in each ink flow path, and the frequency characteristics of ejection are uniform.

  In addition, by forming the beam on the back side of the substrate, the adhesion area with the flow path member can be increased, and the adhesion strength is improved.

  The ink jet recording head of the present invention and the production method thereof will be described below.

  The ink jet recording head of the present invention is shown in FIGS. 5, 6, and 7 are a perspective view, an AA cross-sectional view of FIG. 5, and a BB cross-sectional view of FIG. 5, respectively. The ink jet recording head includes a substrate 501, a heating element 507, an ink channel 505, and an orifice plate 504 having an ejection port 506, and supplies ink from the common liquid chamber 502 to the ink channel 505 on the surface of the substrate 501. For this purpose, an ink supply port 503 is formed by providing an opening. Further, a beam 508 is provided on the back surface side of the substrate 501, and this beam suppresses a decrease in mechanical strength caused by providing a long ink supply port of the ink jet recording head, thereby making it difficult to deform the substrate. It is possible to reduce the displacement of the discharge port due to the deformation.

  Further, as can be seen from FIG. 7, the beam is formed on the back side of the substrate, so that the substrate surface becomes a common liquid chamber, and the ink supply port is also shared, so that ink refilling to each heating element is performed. There is no shift or decline.

  The effect at the time of adhesion between the flow path member and the ink jet recording head will be described in detail with reference to FIG. 8 (the beam shape and the substrate are schematically shown for explaining the principle). FIG. 8A is a schematic cross-sectional view similar to FIG. 6 showing the structure of the substrate and beams of the ink jet recording head of the present invention. FIG. 8B is a cross-sectional comparison view in which the beam is near the center in the substrate thickness direction for explaining the ink jet recording head of the present invention. Regarding the deformation and breakage of the substrates 801 and 802 due to the thermal stress at the time of joining the flow path member described in the problem to be solved by the invention, the flow path member 805 made of resin after bonding has a thermal expansion coefficient with respect to the silicon substrate. It is large and shrinks when it returns to normal temperature. Thereby, a shear stress is generated at the interface between the flow path member and the head. In the ink jet recording head of the present invention, as shown in FIG. 8A, one of the surfaces constituting the beam 803 is in the same plane as the back surface of the substrate 801, has a large adhesion area, and is resistant to shear stress. On the other hand, when the beam 804 is arranged at the center position of the substrate thickness, the bonding area is smaller than that in FIG.

In addition, since the beam is on the back surface side, it is possible to increase the bonding area with the flow path member 805 and increase the bonding strength with the flow path member regardless of the presence or absence of shear stress. "
In this case, the width of the beam bonded to the flow path member can be controlled.

  Furthermore, as shown in FIGS. 5, 6, and 7, the side surface of the common liquid chamber is bent into a V-shape as compared with a conventional inkjet recording head using a substrate having a silicon orientation surface of (100), and the back surface. Since the size of the opening can be narrowed, the bonding area on the back surface can be widened.

  As described above, the ink jet recording head of the present invention is an ink jet recording head capable of performing high-definition and high-speed recording that enables good printing.

  Further, by forming the common liquid chamber by silicon anisotropic etching, a part of the surface constituting the common liquid chamber is made of the (111) plane of the silicon crystal orientation. Since the etching rate of the alkaline aqueous solution on the (111) surface is slow, the common liquid chamber is less likely to be corroded by the alkaline ink, and the common liquid chamber is excellent in corrosion resistance.

  Next, features of the method for producing the ink jet recording head of the present invention will be described in detail with reference to FIGS. A passivation layer 902 is provided on the front surface of the substrate 901, and a first mask layer 905 is formed on the back surface. A heating element, electrical wiring (not shown) for driving the heating element, and an orifice plate 904 are provided. A first opening 906 having a beam shape is formed in the first mask layer 905. The number of beams can be arbitrarily selected.

The beam 908 is formed by performing a first etching through the first opening to form the first groove 907 and filling the first groove with a beam material. (Because the beam 908 is exposed from the substrate through the second and third etching steps, it becomes a beam. However, in the present invention, the beam 908 is described as a beam even before and after exposure.)
Subsequently, a step of removing the first mask layer and forming a second mask layer 909 having a plurality of second openings 910 in order to form the common liquid chamber 1002 and the ink supply port 1003, the second opening from the second opening. Etching is performed to form the second groove 1007, and the second groove is connected by third etching to form a common liquid chamber and an ink supply port.

  In this case, when the steps of FIGS. 12 to 13 in which the second mask layer and the second opening are formed in advance before forming the first mask layer, thermal oxidation with an oxidizing gas is used as the second mask layer. The oxide film manufactured in step 1 can be used as a mask layer.

  In this case, the resistance to the second etching of the beam becomes unnecessary by setting the second mask layer wider than the width of the beam (FIG. 15). Further, as shown in FIG. 15C, it is possible to leave a part of the substrate, and this can be used as a beam.

  In this case, the beam can be formed in any shape, for example, it can be formed in a lattice shape, and it is possible to add a filter function to the lattice-like beam, so that dust in the ink can be removed near the discharge port. It is possible to reduce ink discharge failure.

  In this case, as shown in FIG. 11, the beam is formed to be at least longer than the short side of the common liquid chamber, and is held on the substrate even after the common liquid chamber and the ink supply port are formed. Etching having an anchor effect as shown in FIG. 17B by applying an anchor effect to the beam end as shown in FIGS. 16B, 16C and 16D and controlling the etching conditions. By making the shape, it is possible to avoid the beam from falling out.

  In this case, the beam shape is formed in a groove formed by a single etching process, but by performing multiple etching processes as necessary, it has superior mechanical properties and excellent anchor effect. It is also possible to obtain different shapes.

  The beam shape can be selected from a combination of the shapes of the first opening and the first groove.

  The beam shape (that is, the first opening shape) can be, for example, as shown in FIG. 16, and a beam having a convex shape in part can be produced so as to have an anchor effect on the substrate. Further, since the beam width can be selected, the width can be selected so as to withstand a compressive stress, a tensile stress, a thermal stress accompanying the attachment of the flow path member, and the like.

  In this case, by using a beam having a shape as shown in FIG. 16D, it is possible to prevent stress from being concentrated on a part of the interface between the beam and the substrate.

  The beam shape (that is, the first groove shape) can be, for example, a shape as shown in FIG. 17 and can be selected according to the beam forming method. Each first groove shape can be selected according to the etching conditions (for example, reactive ions). When etching is used, it can be selected depending on the flow rate or pressure of the etching gas.

  In this case, by using a beam having a cross-sectional shape in which the width of the first groove bottom portion is larger than that of the first opening as shown in FIG.

  The beam obtained by the above method has a high degree of freedom in mechanical design because a wide range of shapes and materials can be selected, and any material can be freely used in any direction such as vertical, horizontal, and diagonal with respect to the common liquid chamber. Therefore, it is possible to form an optimum beam with respect to various stresses generated on the substrate.

  Depending on the method of manufacturing the beam, a U-shaped beam shape can be obtained in the middle as shown in FIG. 21B, and it is also possible to manufacture a U-shaped beam using this shape. . By obtaining a U-shaped beam, it is possible to obtain a beam that is not easily deformed by stress from various directions.

  For the first etching, reactive ion etching, isotropic wet etching, ion milling, laser ablation using an excimer laser, YAG laser, or the like, physical etching by sandblasting, or the like can be used.

  When the electrodeposition method is used for producing the beam, for example, a process shown in FIG. 15 can be used. A conductive layer 1807 is formed on the substrate on which the first groove is formed (FIG. 18A) so as to cover the first groove (FIG. 18B). An electrodeposit layer 1808 is formed on this (FIG. 18 (c)), and an excess electrodeposit is removed by a polishing method such as CMP (Chemical Mechanical Polishing), whereby a beam filled in the first groove can be manufactured.

  In this case, for example, the conductive layer 1807 is patterned, and the remaining conductive layer is covered with an insulating mask layer so that only the conductive layer in the first groove is exposed. Can be reduced.

  As a method for forming the conductive layer, for example, thin film manufacturing techniques such as vapor deposition, sputtering, CVD, plating, and thin film coating can be used.

  When the electroless plating method is used for producing the beam, for example, a process shown in FIG. 19 can be used. An underlay layer 1907 as shown in FIG. 19B is formed on the substrate on which the first groove is formed. An unnecessary underlayer is removed together with the first mask layer, and an electroless plating layer is grown from the remaining underlayer (FIG. 19C), whereby a beam can be manufactured.

  In this case, by making the shape of the first groove reversely tapered as shown in FIG. 17B, the underlayer 1907 can be intermittently produced, and the underlayer can be left only in the first groove. The electroless plating layer can be grown only in the first groove. When the electroless plating layer is selectively grown on the substrate 1901, the underlying layer is not necessarily required. Further, similarly to the conductive layer 1807 shown in FIG. 18, the underlayer may be formed as a continuous film. In this case, the excess electroless plating layer is removed by a polishing method such as a CMP method.

  Here, the underlay layer refers to a material having physical properties that initiates electroless plating, and is selected according to the deposition species.

  As a method for forming the underlay layer, for example, thin film production techniques such as vapor deposition, sputtering, CVD, plating, and thin film coating can be used.

  When the vapor deposition method is used for producing the beam, as shown in FIG. 20B, the beam material is vapor-deposited on the first groove 2006 and the substrate 2001, and the extra vapor deposition layer is removed by a CMP method or the like to produce the beam. it can. Further, the beam material can be selectively deposited in the first groove by using a vapor deposition method such as selective-CVD as in the step shown in FIG. Further, as shown in FIG. 19B, the beam material may be intermittently deposited, and the deposit on the first mask layer may be removed together with the first mask layer.

  As the vapor deposition method, any other method such as thermal-CVD, LP-CVD, plasma-CVD, or the like can be selected. However, other vapor deposition methods, sputtering methods, and the like may be used as long as they are available.

  The beam material can be used in the above-described beam manufacturing method, and is selected from materials that have etching resistance to at least the third etching, are not easily corroded by the ink, and are resistant to various stresses. When the steps shown in FIGS. 9 to 10 are used, it is necessary to select a material having etching resistance for the second etching. However, as shown in FIG. 15, it is possible not to expose the beam during the second etching. In this case, etching resistance to the second etching is not necessary.

  The beam material is selected from materials that can be used in the above-described method and is resistant to at least the third etching. For example, Ti, Zr, Hf, V, Cr, Mo, W, Mn, Tc, Re, Fe Can be selected from materials such as Co, Ni, Ru, Os, Rh, Ir, Pd, Pt, Ag, Au, Ge, SiO2, Si3N4, Al2O3, BeO, etc. If there is, it is not limited to this.

  When the beam produced by the above method is made of a material such as metal or resin, for example, there is no fear of cleaving compared to a beam produced using a part of the substrate (silicon single crystal), and In the case of a material capable of plastic deformation, plastic deformation first occurs before the beam is broken, and the beam lasts longer.

  During the third etching, a membrane including a passivation layer, a channel member, and an orifice plate is formed. The passivation layer is made of a material having at least etching resistance with respect to the third etching. Further, when a groove is formed in the substrate by the second etching and the groove reaches the passivation layer, the passivation layer needs to have etching resistance to the second etching solution. As a method for forming the passivation layer, a conventionally known technique such as a vacuum deposition method, a sputtering method, a chemical vapor deposition method, a plating method, a thin film coating method, or the like can be used.

  For the second etching, any of reactive ion etching, isotropic wet etching, ion milling, laser ablation using an excimer laser, YAG laser, etc., physical etching by sandblasting, or the like can be used.

  The third etching is silicon crystal anisotropic etching using an etchant made of an alkaline aqueous solution, and an etching solution that causes an etching rate difference due to a crystal plane such as KOH, EDP, TMAH, hydrazine, or the like is used. Since the second etching is made of silicon crystal anisotropic etching, the accuracy of the width of the ink supply port can be maintained. By the third etching, the grooves formed in the plurality of openings by the second etching are etched in the side surface direction of the substrate and communicate with each other to form a common liquid chamber.

  As a method of forming the above-mentioned common liquid chamber by the third etching, a method of providing a sacrificial layer having a desired ink supply port size below the passivation can be used. In this case, by selecting the sacrificial layer from the material that is isotropically etched with respect to the etching solution for the third etching, the sacrificial layer and the silicon under the sacrificial layer are simultaneously etched during the third etching. When etching is performed from the back side of the substrate by providing a sacrificial layer for determining the opening length under the passivation layer and forming the passivation layer on the sacrificial layer, the thickness of the substrate, crystal defects in the substrate, OF The variation in the opening length caused by the angle variation and the concentration variation of the etching solution can be avoided. In other words, the size of the ink supply port can be controlled by the pattern of the sacrificial layer.

  As a material used for the sacrificial layer, various materials such as a semiconductor, an insulator, and a metal can be used as long as they are materials that can be isotropically etched with an etchant used for silicon crystal anisotropic etching and can form a thin film. For example, for a semiconductor, a material that can be easily dissolved in an alkaline aqueous solution such as polycrystalline silicon and porous silicon, such as aluminum for metals and ZnO for insulators, is preferable. In particular, the polycrystalline silicon film is excellent in compatibility with an LSI process, has high process reproducibility, and is suitable for a sacrificial layer. The thickness of the sacrificial layer is not particularly limited as long as a thin film can be formed. For example, when polycrystalline silicon of about several hundred angstroms is used for the sacrificial layer, isotropic etching of the sacrificial layer and anisotropic etching of the substrate are performed. Can be performed simultaneously.

  The ink jet recording head of the present invention has an effective configuration in the bubble continuous discharge method. The bubble continuous discharge method described here is an ink jet recording method in which bubbles generated by film boiling generated by heating ink for discharge are discharged by communicating with outside air near the discharge port. This is a method proposed in Japanese Patent Application Laid-Open No. 2-112832, Japanese Patent Application Laid-Open No. 2-112833, Japanese Patent Application Laid-Open No. 2-112834, Japanese Patent Application Laid-Open No. 2-114472, and the like. According to the continuous discharge method, it is possible to rapidly and reliably perform bubble growth in the vicinity of the discharge port, so that the refill property due to the ink path in the non-blocking state is also helped to achieve highly stable and high-speed recording. Further, by making the bubbles communicate with the atmosphere, the bubble defoaming process is eliminated, and damage to the heater and the substrate due to cavitation can be prevented. In addition, as a basic function of the bubble communication discharge method, there is a principle that all the ink on the discharge outlet side from the portion where the bubbles are generated is discharged as ink droplets in principle. Therefore, the amount of ejected ink can be determined by the structure of the recording head, such as the distance from the ejection outlet to the bubble generation site. As a result, according to the above-described bubble continuous discharge method, it is possible to perform discharge with a stable discharge amount without being significantly affected by changes in ink temperature or the like.

  The side shooter type ink jet recording head can easily control the distance between the ink protrusion and the heating element according to the thickness of the orifice plate. In the bubble continuous discharge method, the distance is one of the important factors for determining the protruding ink amount, and the ink jet recording head of the present invention has a structure suitable for the bubble continuous discharge method.

  Hereinafter, the ink jet recording head of the present invention and the manufacturing method thereof will be described in detail with reference to any of the process drawings of FIGS.

(First embodiment)
-Electroplated beam-
In this example, the first manufacturing method of the present invention of the ink jet recording head of the present invention shown in FIG. 5 will be described.

  Hereinafter, a manufacturing process of this example will be described with reference to process cross-sectional views of FIGS. 10 and 18 are cross-sectional views taken along the line BB in FIG. Also, in the drawing, the heating element and the wiring for energizing the heating element (applying a drive pulse) and the ink flow path to each heating element are omitted, and only the process of forming a beam in the width direction of the substrate is described. It is.

  A silicon substrate 1801 having a crystal orientation plane of (100) was used as the substrate. The substrate was thermally oxidized with an oxidizing gas to form silicon dioxide on the front and back surfaces of the substrate. Next, the portion corresponding to the ink supply port of silicon dioxide formed on the substrate surface and the entire back surface were removed with buffered hydrofluoric acid. Subsequently, a passivation layer 1802 was formed by forming a silicon nitride film by LPCVD (Low Pressure Chemical Vapor Deposition) method. The silicon nitride film formed on the back surface of the substrate was removed by reactive ion etching using CF4 gas to expose the substrate. Thereafter, as shown in FIG. 18A, a resin layer 1803 to be an ink flow path is provided by removing in a later step, and an orifice plate 1804 having an ejection port is provided on the resin layer.

  A first mask layer 1805 made of a photosensitive resist was formed on the back surface where the silicon was exposed, and a first opening for forming a beam was formed. The opening shape is a shape as shown in FIG. 16C, and has an anchor effect on the substrate.

  As the first etching, reactive ion etching using SF 6 gas was performed from the back surface to form the first groove 1806. In the first etching, the etching conditions were controlled to have a tapered shape as shown in FIG. The first mask layer remained even after the reactive ion etching (FIG. 18A). The remaining first mask layer was removed by ashing using O 2 gas.

(The reason why the shape of the first groove is the above-mentioned shape is that it is a suitable shape for obtaining the conductive layer as a continuous film, and the first groove has a shape that can be formed as a continuous film. If there is, it is not limited to this.)
A conductive layer 1807 made of Pt was formed in the first groove by sputtering using Ti as a binder with the substrate. Using this substrate as a workpiece, electroplating was performed using a Ni electroplating bath with a conductive layer as a cathode, and electroplating was performed until the first groove was filled with Ni electroplated material (FIG. 18C). Subsequently, a beam 1809 as shown in FIG. 18D was formed by CMP.

  In this case, as the electroplated material, for example, a noble metal such as Au may be obtained as a beam, and a beam resistant to an alkaline solution can be obtained.

  Next, a second mask layer having a second opening is formed by vapor deposition and patterning of a metal film, and the second etching is performed by reactive ion etching using SF6 gas, and the vertical dimension is approximately the same as the opening. A second groove 1001 was prepared (FIG. 10A).

  Next, silicon crystal anisotropic etching was performed as the third etching. In the third etching, the common liquid chamber 1002 (FIG. 10C) and the ink supply port 1003 were formed by etching the silicon substrate exposed from the second groove with a TMAH (tetramethylammonium hydroxide) aqueous solution.

  Finally, the passivation layer 1802 is removed by reactive ion etching using CF4 gas through the ink supply port, and the resin layer 1803 is dissolved and removed with a solvent of the resin layer to form an ink flow path. The ink jet recording head shown in FIG. 5 could be produced (FIG. 10 (d)).

  For comparison, an ink jet recording head of the conventional example shown in FIG. 1 having the same ejection element size as that of this embodiment and having no beam was produced. A destructive test in which a load was applied in the width direction of the ink supply port in FIG. 1 until the substrate was damaged was performed. When a load equal to the damaged load at this time was applied to the ink jet recording head of the present invention, the substrate was not damaged. In the ink jet recording head of the present invention manufactured by the manufacturing method of the present invention, a beam is formed on the substrate, and the mechanical strength is improved as compared with a head without a beam.

  In the ink jet recording head of the present invention, since one of the surfaces constituting the beam 1809 is in the same plane as the back surface of the substrate 1801, the bonding area is wider and the bonding strength with the flow path member is improved as compared with the conventional one.

  When printing is performed by the ink jet recording head of the present invention, it is possible to obtain a uniform frequency characteristic with respect to the refill characteristics, in which the distance from the ink supply port to the heating element is substantially equal, and the refill time in each head is almost the same. did it.

  As described above, the ink jet recording head of the present invention is an ink jet recording head capable of performing high-definition and high-speed recording that enables good printing.

(Second embodiment)
-Beams of electroless plating-
In this example, a second manufacturing method of the ink jet recording head of the present invention shown in FIG. 5 will be described.

  Hereinafter, a manufacturing process of this example will be described with reference to process cross-sectional views of FIGS. 10 and 19 are shown as cross-sectional views taken along the line BB in FIG. Also, in the drawing, the heating element and the wiring for energizing the heating element (applying a drive pulse) and the ink flow path to each heating element are omitted, and only the process of forming a beam in the width direction of the substrate is described. It is.

  A silicon substrate 1901 having a crystal orientation plane of (100) was used as the substrate. The substrate was thermally oxidized with an oxidizing gas to form silicon dioxide on the front and back surfaces of the substrate. Next, the portion corresponding to the ink supply port of silicon dioxide formed on the substrate surface and the entire back surface were removed with buffered hydrofluoric acid. Subsequently, a silicon nitride film was formed by LPCVD (Low Pressure Chemical Vapor Deposition) method to form a passivation layer 1902. The silicon nitride film formed on the back surface of the substrate was removed by reactive ion etching using CF4 gas to expose the substrate. Thereafter, as shown in FIG. 19A, a resin layer 1903 serving as an ink flow path is provided by removing in a later step, and an orifice plate 1904 having an ejection port is provided above the resin layer.

  A first mask layer 1905 made of a photosensitive resist was formed on the back surface where silicon was exposed, and a first opening for forming a beam was formed. The shape of the opening is as shown in FIG. 16D and has a shape having an anchor effect on the substrate.

  As the first etching, reactive ion etching using SF 6 gas was performed from the back surface to form the first groove 1906. In the first etching, the etching conditions were controlled, and a reverse taper shape as shown in FIG. The first mask layer remained even after the reactive ion etching (FIG. 19A).

(The reason why the shape of the first groove is the above-mentioned shape is that the anchor effect occurs in the beam, and in one, the underlay layer can be intermittently formed in the first groove and other portions. (This is not particularly limited as long as it is an etching shape that achieves the same effect.)
An underlayer 1907 made of Fe was formed in the first groove by sputtering. The underlying layer formed other than the first groove was removed together with the remaining first mask layer. This substrate was put into an electroless Ni plating bath, and electroless plating was performed until the first groove was filled with the Ni electroless plating product to form a beam (FIG. 19D).

  Next, a second mask layer having a second opening is formed by vapor deposition and patterning of a metal film, and the second etching is performed by reactive ion etching using SF6 gas, and the vertical dimension is approximately the same as the opening. A second groove 1001 was prepared (FIG. 10A).

  Next, silicon crystal anisotropic etching was performed as the third etching. In the third etching, the common liquid chamber 1002 (FIG. 10C) and the ink supply port 1003 were formed by etching the silicon substrate exposed from the second groove with a TMAH (tetramethylammonium hydroxide) aqueous solution.

  Finally, the passivation layer 1902 is removed by reactive ion etching using CF4 gas through the ink supply port, and the resin layer 1903 is dissolved and removed with a solvent of the resin layer to form an ink flow path. The ink jet recording head shown in FIG. 5 could be produced (FIG. 10 (d)).

  For comparison, an ink jet recording head of the conventional example shown in FIG. 1 having the same ejection element size as that of this embodiment and having no beam was produced. A destructive test in which a load was applied in the width direction of the ink supply port in FIG. 1 until the substrate was damaged was performed. When a load equal to the damaged load at this time was applied to the ink jet recording head of the present invention, the substrate was not damaged. In the ink jet recording head of the present invention manufactured by the manufacturing method of the present invention, a beam is formed on the substrate, and the mechanical strength is improved as compared with a head without a beam.

  In the ink jet recording head of the present invention, since one of the surfaces constituting the beam 1909 is in the same plane as the back surface of the substrate 1901, the bonding area is wider and the bonding strength with the flow path member is improved as compared with the conventional one.

  When printing is performed by the ink jet recording head of the present invention, it is possible to obtain a uniform frequency characteristic with respect to the refill characteristics, in which the distance from the ink supply port to the heating element is substantially equal, and the refill time in each head is almost the same. did it.

  As described above, the ink jet recording head of the present invention is an ink jet recording head capable of performing high-definition and high-speed recording that enables good printing.

(Third embodiment)
-Beam of deposited material (1)-
In this example, a third manufacturing method of the ink jet recording head of the present invention shown in FIG. 5 will be described.

  Hereinafter, a manufacturing process of this example will be described with reference to process cross-sectional views of FIGS. 10 and 21 are cross-sectional views taken along the line BB in FIG. Also, in the drawing, the heating element and the wiring for energizing the heating element (applying a drive pulse) and the ink flow path to each heating element are omitted, and only the process of forming a beam in the width direction of the substrate is described. It is.

  A silicon substrate 2101 having a crystal orientation plane of (100) was used as the substrate. The substrate was thermally oxidized with an oxidizing gas to form silicon dioxide on the front and back surfaces of the substrate. Next, the portion corresponding to the ink supply port of silicon dioxide formed on the substrate surface and the entire back surface were removed with buffered hydrofluoric acid. Subsequently, a silicon nitride film was formed by LPCVD (Low Pressure Chemical Vapor Deposition) method to form a passivation layer 2102. The silicon nitride film formed on the back surface of the substrate was removed by reactive ion etching using CF4 gas to expose the substrate. Thereafter, as shown in FIG. 21A, a resin layer 2103 to be an ink flow path is provided by removing in a later step, and an orifice plate 2104 having an ejection port is provided on the resin layer.

  A first mask layer 2105 made of a photosensitive resist was formed on the back surface where the silicon was exposed, and a first opening for forming a beam was formed. The opening shape was a line shape as shown in FIG.

  As the first etching, reactive ion etching using SF 6 gas was performed from the back surface to form the first groove 2106. In the first etching, the etching conditions were controlled, and a reverse taper shape as shown in FIG. The first mask layer remained even after the reactive ion etching (FIG. 21B).

(The reason why the shape of the first groove is the above-mentioned shape is that the anchor effect is generated in the beam, and in part, the CVD layer can be intermittently formed in the first groove and other portions. (This is not particularly limited as long as it is an etching shape that achieves the same effect.)
A vapor deposition layer 2107 made of W was selectively formed in the first groove by selective CVD. The W protruding from the first groove was polished and removed by the CMP method together with the first mask layer.

  Next, a second mask layer having a second opening is formed by vapor deposition and patterning of a metal film, and the second etching is performed by reactive ion etching using SF6 gas, and the vertical dimension is approximately the same as the opening. A second groove 1001 was prepared (FIG. 10A).

  Next, silicon crystal anisotropic etching was performed as the third etching. In the third etching, the common liquid chamber 1002 (FIG. 10C) and the ink supply port 1003 were formed by etching the silicon substrate exposed from the second groove with a TMAH (tetramethylammonium hydroxide) aqueous solution.

  Finally, the passivation layer 2102 is removed by reactive ion etching using CF4 gas through the ink supply port, and the resin layer 2103 is dissolved and removed with a solvent of the resin layer to form an ink flow path. The ink jet recording head shown in FIG. 5 could be produced (FIG. 10 (d)).

  For comparison, an ink jet recording head of the conventional example shown in FIG. 1 having the same ejection element size as that of this embodiment and having no beam was produced. A destructive test in which a load was applied in the width direction of the ink supply port in FIG. 1 until the substrate was damaged was performed. When a load equal to the damaged load at this time was applied to the ink jet recording head of the present invention, the substrate was not damaged. In the ink jet recording head of the present invention manufactured by the manufacturing method of the present invention, a beam is formed on the substrate, and the mechanical strength is improved as compared with a head without a beam.

  In the ink jet recording head of the present invention, since one of the surfaces constituting the beam 2109 is on the same plane as the back surface of the substrate 2101, the bonding area is wider and the bonding strength with the flow path member is improved as compared with the conventional one.

  When printing is performed by the ink jet recording head of the present invention, it is possible to obtain a uniform frequency characteristic with respect to the refill characteristics, in which the distance from the ink supply port to the heating element is substantially equal, and the refill time in each head is almost the same. did it.

  As described above, the ink jet recording head of the present invention is an ink jet recording head capable of performing high-definition and high-speed recording that enables good printing.

(Fourth embodiment)
-Beam of deposited material (2)-
In this example, a fourth method of manufacturing the ink jet recording head of the present invention shown in FIG. 5 will be described.

  Hereinafter, a manufacturing process of this example will be described with reference to process cross-sectional views of FIGS. 10 and 12 are cross-sectional views taken along the line BB in FIG. Also, in the drawing, the heating element and the wiring for energizing the heating element (applying a drive pulse) and the ink flow path to each heating element are omitted, and only the process of forming a beam in the width direction of the substrate is described. It is.

  A silicon substrate 1201 having a crystal orientation plane of (100) was used as the substrate. The substrate was thermally oxidized with an oxidizing gas to form silicon dioxide on the front and back surfaces of the substrate. Next, the portion corresponding to the ink supply port of silicon dioxide formed on the substrate surface and the second opening 1206 on the back surface (this opening is a first groove for forming the first groove as shown schematically in FIG. 14). The portion corresponding to the mask layer pattern was removed with buffered hydrofluoric acid. Subsequently, a silicon nitride film was formed by LPCVD (Low Pressure Chemical Vapor Deposition) method to form a passivation layer 1202. The silicon nitride film formed on the back surface of the substrate was removed by reactive ion etching using CF4 gas to expose the substrate (FIG. 12A). Further, as shown in FIG. 12A, a resin layer 1203 to be an ink flow path is provided by removing in a later step, and an orifice plate 1204 having an ejection port is provided on the resin layer. A first mask layer 1207 made of a photosensitive resist was formed on the back surface where the second opening was formed, and a first opening for forming a beam was formed. The opening shape was a line shape as shown as the first groove 1404 in FIG.

  As the first etching, reactive ion etching using SF 6 gas was performed from the back surface to form the first groove 1208. In the first etching, the etching conditions were controlled, and a reverse taper shape as shown in FIG. The first mask layer remained after the reactive ion etching (FIG. 12B).

(The reason why the shape of the first groove is the above-mentioned shape is that the anchor effect is generated in the beam, and in part, the CVD layer can be intermittently formed in the first groove and other portions. (This is not particularly limited as long as it is an etching shape that achieves the same effect.)
A beam 1209 made of W was formed on the back surface of the substrate by selective CVD. The W protruding from the back surface of the substrate was polished and removed by CMP, and the remaining first mask layer was removed by ashing using O 2 gas to obtain a substrate as shown in FIG.

  Next, second etching is performed using reactive ion etching using SF6 gas from a second mask layer prepared on the back surface of the substrate in advance, and a second opening (of which the W beam is formed) A vertical second groove having a size substantially the same as that of (not shown) was produced (not shown). At this time, the beam 1209 made of W was not etched because it was resistant to the second etching (that is, it had the same function as the second mask layer 1205).

  Next, silicon crystal anisotropic etching was performed as the third etching. In the third etching, the common liquid chamber 1301 (FIG. 13B) and the ink supply port 1302 were formed by etching the silicon substrate exposed from the second groove with a TMAH (tetramethylammonium hydroxide) aqueous solution.

  Finally, the passivation layer 1202 is removed by reactive ion etching using CF4 gas through the ink supply port, and the resin layer 1203 is dissolved and removed with a solvent of the resin layer to form an ink flow path. The ink jet recording head shown in FIG. 5 was able to be manufactured (FIG. 13C).

  For comparison, an ink jet recording head of the conventional example shown in FIG. 1 having the same ejection element size as that of this embodiment and having no beam was produced. A destructive test in which a load was applied in the width direction of the ink supply port in FIG. 1 until the substrate was damaged was performed. When a load equal to the damaged load at this time was applied to the ink jet recording head of the present invention, the substrate was not damaged. In the ink jet recording head of the present invention manufactured by the manufacturing method of the present invention, a beam is formed on the substrate, and the mechanical strength is improved as compared with a head without a beam.

  In the ink jet recording head of the present invention, since one of the surfaces constituting the beam 1209 is in the same plane as the back surface of the substrate 1201, the bonding area is wider and the bonding strength with the flow path member is improved as compared with the conventional one.

  When printing is performed by the ink jet recording head of the present invention, it is possible to obtain a uniform frequency characteristic with respect to the refill characteristics, in which the distance from the ink supply port to the heating element is substantially equal, and the refill time in each head is almost the same. did it.

  As described above, the ink jet recording head of the present invention is an ink jet recording head capable of performing high-definition and high-speed recording that enables good printing.

It is a front view explaining the subject accompanying lengthening of the conventional inkjet recording head. It is a front view explaining the deformation | transformation of the board | substrate accompanying lengthening of the conventional inkjet recording head. It is a front view explaining a deformation | transformation of the orifice plate accompanying the elongate of the conventional inkjet recording head. It is the front view (a) and sectional drawing (b) explaining the subject accompanying lengthening of the conventional inkjet recording head. It is a perspective view explaining the inkjet recording head of this invention. It is AA sectional drawing of FIG. 5 explaining the inkjet recording head of this invention. FIG. 6 is a cross-sectional view taken along the line BB in FIG. 5 for explaining the ink jet recording head of the present invention. It is a schematic diagram explaining the inkjet recording head of this invention. It is an example of the process figure which shows the preparation methods of the inkjet recording head of this invention. It is an example of the process figure which shows the preparation methods of the inkjet recording head of this invention. It is an example of the process figure which shows the preparation methods of the inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 4th inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 4th inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 4th inkjet recording head of this invention. It is an example of the process figure which shows the preparation methods of the inkjet recording head of this invention. It is an example of the shape of the opening part for producing the beam used for the inkjet recording head of this invention. It is an example of the shape of the opening part for producing the beam used for the inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 1st inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 2nd inkjet recording head of this invention. It is an example of the process figure which shows the preparation methods of the inkjet recording head of this invention. It is process drawing which shows the preparation methods of the 3rd inkjet recording head of this invention.

Explanation of symbols

101, 201, 301, 401, 501, 601, 701, 801, 802, 901, 1106, 1201, 1407, 1501, 1701, 1801, 1901, 2001, 2101 Substrate 102, 202, 303, 402, 503, 1003, 1302, 1509 Ink supply port 103, 304, 403, 504, 603, 703, 904, 1107, 1204, 1408, 1504, 1804, 1904, 2004, 2104 Orifice plate 104, 305, 404, 506, 605 Discharge port 302, 405, 502, 602, 702, 1002, 1301, 1508 Common liquid chamber 306 Ink droplet 406, 505, 604, 704 Ink flow path 507, 606 Heating element 508, 607, 705, 803, 804, 908, 1103 , 1209, 1406, 1505, 1809, 1909, 2008, 2108 Beam 805 Channel member 902, 1202, 1502, 1802, 1902, 2002, 2102 Passivation layer 903, 1203, 1503, 1803, 1903, 2003, 2103 Resin Layer 905, 1101, 1207, 1403, 1602, 1702, 1805, 1905, 2005, 2105 First mask layer 906, 1601 First opening 907, 1102, 1208, 1404, 1703, 1806, 1906, 2006, 2106 First Groove 909, 1104, 1205, 1401, 1506 Second mask layer 910, 1105, 1206, 1402 Second opening 1001, 1507 Second groove 1807 Conductive layer 1808 Electrodeposition layer 1907 Underlay layer 1908 Electrolytic plating layer 2007,2107 deposited layer

Claims (26)

  A common liquid chamber; a substrate having a heating resistor that heats ink to generate bubbles and protrudes the ink; and an orifice plate having a discharge port provided on the substrate, from the discharge port of the orifice plate An inkjet recording head for ejecting ink droplets in a direction perpendicular to the substrate surface, wherein the substrate has a beam for reinforcing the substrate, and the beam is substantially rectangular.   The ink jet recording head according to claim 1, wherein the beam is resistant to an alkaline solution.   The inkjet recording head according to claim 1, wherein the beam is made of metal.   The ink jet recording head according to claim 1, wherein the metal is a noble metal.   The inkjet recording head according to claim 1, wherein at least a part of the beam has a portion serving as an anchor with respect to the substrate.   6. The ink jet recording head according to claim 1, wherein at least a part of the anchor is a curved surface.   The ink jet recording head according to claim 1, wherein the beam is on a back surface of the substrate.   8. The ink jet recording head according to claim 1, wherein one of the surfaces constituting the beam is in the same plane as the back surface of the substrate.   The ink jet recording head according to claim 1, wherein the substrate is a silicon single crystal.   10. The ink jet recording head according to claim 1, wherein the crystal orientation of the silicon single crystal constituting the common liquid chamber is a (111) plane.   A printer equipped with the ink jet recording head according to claim 1. A common liquid chamber, a substrate having a heating resistor that heats ink to foam bubbles and ejects the ink, and an orifice plate having a discharge port provided on the substrate, from the discharge port of the orifice plate In a method of manufacturing an ink jet recording head that discharges ink droplets in a direction perpendicular to a substrate,
(A) A step of etching the substrate from the beam forming opening to form a beam forming groove (first etching step)
(B) A step of filling the beam forming groove with a beam material (c) A step of etching the substrate from the ink supply port forming opening to form an ink supply port forming groove (second etching step)
(D) A through hole is formed in a direction perpendicular to the substrate surface, a communication hole is formed to communicate with the adjacent ink supply port forming groove, a common liquid chamber is formed, and filling in step (d) A part of the object is exposed from the substrate to form a beam (third etching process)
The method for manufacturing an ink jet recording head according to claim 1, wherein any one of the steps is used.   The method for producing an ink jet recording head according to claim 1, further comprising a step of forming a passivation layer on the surface of the substrate before the step (a).   14. The inkjet recording head according to claim 1, further comprising a step of forming a beam forming mask layer having a beam forming opening on the back surface of the substrate before the step (a). Manufacturing method.   15. The mask layer for forming an ink supply port having an opening for forming an ink supply port is formed by removing the beam forming mask layer before the step (c). A method for producing an ink jet recording head described in 1.   16. The method of manufacturing an ink jet recording head according to claim 1, further comprising a step of removing the passivation layer from the back surface of the substrate after the step (d).   The method of manufacturing an ink jet recording head according to claim 1, wherein the beam is formed by an electrodeposition method.   18. The method of manufacturing an ink jet recording head according to claim 1, wherein the beam is formed by an electroless plating method.   The method of manufacturing an ink jet recording head according to claim 1, wherein the beam is formed by a vapor deposition method.   The method of manufacturing an ink jet recording head according to claim 1, wherein the first and second etching steps are anisotropic etching.   21. The method of manufacturing an ink jet recording head according to claim 1, wherein the first and second etching steps are reactive ion etching.   The inkjet recording head according to any one of claims 1 to 21, wherein the first and second etching steps use any one of a reactive gas such as an SF-based gas, a CF-based gas, and a Cl-based gas. Manufacturing method.   23. The method of manufacturing an ink jet recording head according to claim 1, wherein the first and second etching steps are repeated formation of a protective film and etching.   24. The method of manufacturing an ink jet recording head according to claim 1, wherein the third etching step is anisotropic etching.   25. The method of manufacturing an ink jet recording head according to claim 1, wherein the third etching step is crystal anisotropic etching using an alkaline aqueous solution.   26. The method of manufacturing an ink jet recording head according to claim 1, wherein the third etching step uses an etching solution of any one of KOH, EDP, TMAH, and hydrazine.

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