JP2008264790A - Mechanism of removing waste in grooving of string solder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent accumulation of generated machining wastes; to always maintain machining conditions in the optimum state by the removal of the machining wastes; and to contribute to automatic soldering productivity and reduction of quality deterioration of soldered articles. <P>SOLUTION: In the mechanism, there are installed a tubular discharge guide for the prevention of accumulation of machining wastes in the bottom of a guide roller groove, a scraper guide for removing the machining wastes that stick to a circular blade, and an accumulation pool with a discharge path for discharging accumulated machining wastes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a yarn solder grooving supply device.

In the thread solder grooving processing and supply device during the manual operation, the processing waste is cleaned by removing the processing waste manually or by attaching a simple brush along the rotary blade.
Japanese Patent Application No. 11-332310 Japanese Patent Application No. 2006-3143351 Japanese Patent Application No. 2006-357718 Design Registration No. 1277887

    When automatic soldering is performed by combining a thread solder grooving supply device with a robot or the like, it is required to eliminate the manual work and to maintain a normal state at all times. If the processing waste generated during processing adheres to and accumulates on the groove bottom of the guide roller, the thread solder is pushed up, and the cutting depth of the circular blade changes, reducing the solder scattering prevention effect, and ultimately processing defects. In addition, the processing waste adhering to the circular blade is scattered around the peripheral portion, and the work periphery is contaminated, or adheres to the product and causes quality deterioration, which increases the man-hours for equipment maintenance.

    According to the present invention, the pipe-shaped discharge guide on the discharge side after the thread solder grooving process is provided with a shape for preventing processing waste from accumulating at the bottom of the guide roller groove.

    Further, a scraper guide having a shape for removing the processing waste adhering to the circular blade, preventing the processed thread solder from being wound around the cutting edge, and guiding the processed thread solder to the pipe-shaped discharge guide is attached.

  The generated processing waste is accumulated and discharged.

  By removing the processing waste and not storing it, the solder splash prevention effect of the grooving yarn solder is always kept normal, and by preventing the processing waste from being scattered, the quality of the soldered product is prevented from degrading and the burden of maintenance of the grooving processing supply device Reduce.

  It has been possible to remove thread solder grooving scraps from circular blades and guide rollers and to prevent storage while supplying grooving.

  FIG. 1 is a cross-sectional view showing an apparatus for grooving a thread solder to which a mechanism of the present invention is attached, wherein the groove is formed while being fed between a circular blade and a guide roller.

  FIG. 2 is a cross-sectional view showing that the thread solder has opened the section of the thread solder with a circular blade.

  FIGS. 3 and 4 show that the processing waste accumulated in the bottom of the guide roller groove can be removed by the six pipe-shaped discharge guides attached to the mechanism of the present invention so as to reach the groove bottom 5 of the four guide rollers. Shown: 10 scraper guides have a scraper function of processing scraps attached to the cutting edge attached along the cutting edge of 3 circular blades, and 1 thread solder wound around 3 circular blades is inserted into 6 pipe-shaped discharge guides It is an upper surface sectional view showing that it also has a guide function for prompting.

  In FIG. 3, 7 swaying pipe-shaped discharge guide holders, 8 swaying angle adjustment variable stoppers, 7 swaying holder thrusting, 9 springs, 6 pipe-shaped discharge guides with 5 guide rollers It shows that it can be set to the optimum position of the groove bottom.

  FIG. 5 is a top cross-sectional view showing that 11 surrounding accumulation reservoirs are provided around 3 circular blades and 4 guide rollers, and that processing waste can be discharged from a discharge path of 12 to the outside.

It is explanatory drawing which shows the thread | yarn solder grooving apparatus which attaches this invention mechanism. It is an expansion explanatory view showing the state where thread solder is grooving processed. 1 is a top cross-sectional view showing Example 1. FIG. 1 is a side view and a side development view of Example 1. FIG. 6 is a top cross-sectional view showing Example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thread solder 2 Flux 3 Circular blade 4 Guide roller 5 Guide roller groove bottom 6 Pipe-shaped discharge guide 7 Shaking holder 8 Variable stopper 9 Spring 10 Scraper guide 11 Accumulated reservoir 12 Discharge path

Claims (8)

  When grooving into thread solder using a circular blade and guide roller, the pipe-shaped discharge guide for discharging thread solder immediately after grooving has a function to prevent machining waste from accumulating at the bottom of the guide roller groove. Have it.   A mechanism in which the pipe-shaped discharge guide according to claim 1 can swing toward the bottom of the guide roller groove.   3. The swing mechanism according to claim 2, wherein the position of the pipe-shaped discharge guide with respect to the guide roller groove bottom is adjusted.   3. The swaying mechanism according to claim 2, wherein the pipe-like discharge guide has a pressing force by a spring or the like so as to face the bottom of the guide roller groove.   After removing thread scraps attached to the cutting edge of the circular blade on the discharge side after thread solder grooving with a circular blade, and removing the processing waste adhering to the cutting edge and preventing winding of the thread solder on the circular blade after processing A scraper guide for guiding thread solder after processing to the pipe-shaped discharge guide according to Item 1.   A processing blade accumulation reservoir provided around the circular blade and the guide roller for collecting the processing blade generated by the circular blade, the guide roller, the pipe-shaped discharge guide, and the scraper guide according to claim 5.   A discharge path for taking out the processing waste accumulated in the accumulation reservoir according to claim 6 from the accumulation reservoir to the outside around the circular blade and the guide roller by its own weight or blowing away.    The processing waste is discharged by blowing away from the discharge path of claim 7 automatically every predetermined time or by an arbitrary operation.

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