JP2008258481A - Laminated ceramic electronic component, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component (such as a laminated ceramic capacitor having a small size and a large capacitance) having a small size and high characteristics which can have a large surface area of internal electrode with respect to product dimensions, and to provide a method of manufacturing the laminated ceramic electronic component. <P>SOLUTION: Ceramic green sheets each having a conductor film 2 having a spot-like conductor film nonformation region 13 formed by a thin film formation method are laminated so that the conductor film nonformation regions 13 are located at such positions as to overlapped in a plane form for each layer to thereby form a mother laminate, the laminate is cut into individual separated ceramic laminates 1, each of the laminates 1 has such a structure that a vertical cut line intersects a horizontal cut line in the conductor nonformation region, the conductor films 2 (2a, 2b) are led out for each other layer at one of a pair of corners 4a, 4b, and the conductor films not led out at one corner are led out at the other corner, and then external electrodes 5a, 5b are formed to be electrically connected with leads-out 12 (12a, 12b) of the conductor films. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a multilayer ceramic electronic component and a method for manufacturing the same, and more specifically, in a ceramic laminate, a plurality of conductor films are laminated via ceramic layers, and a plurality of conductor films are alternately arranged in the ceramic laminate. The present invention relates to a multilayer ceramic electronic component having a structure drawn to different sides of a pair of regions and connected to an external electrode, and a method for manufacturing the same.

  In recent years, monolithic ceramic capacitors have been widely used for various applications, and the demand for miniaturization and large capacity of monolithic ceramic capacitors has increased as electronic devices have become smaller and higher performance.

  Under such circumstances, as a method for making the dielectric layer thin and enabling a reduction in size and capacity, a thin film forming method is adopted as a method for forming an internal electrode, and an oil mask method is used as a patterning method. A method has been proposed in which an internal electrode having a predetermined pattern shape is obtained (see Patent Document 1).

  Also, the internal electrode layer is not patterned and formed as a full surface electrode on the surface of the ceramic green sheet. After the ceramic green sheet (dielectric layer) having this internal electrode layer is laminated, unnecessary portions of the full surface electrode are removed. A method for manufacturing a multilayer ceramic capacitor in which an external electrode is formed so as to be patterned and then electrically connected to the internal electrode has been proposed (Patent Document 2).

  However, in the case of the method disclosed in Patent Document 1, when an attempt is made to produce a multilayer ceramic electronic component in conformity with the standard size, a sufficient overlapping area of internal electrodes (area contributing to capacity acquisition in the case of a multilayer ceramic capacitor) is sufficiently ensured. There is a problem that it is difficult to increase the capacity. This is because the processing margin needs to be determined in consideration of the patterning accuracy of the internal electrode, deformation during stacking, linearity when cutting the mother stack, etc., and the dimensions of the internal electrode rather than the planar area of the ceramic stack This is because it must be reduced to such an extent that a margin can be secured.

Further, in the case of the method of Patent Document 2, the internal electrode layer is a full-surface electrode. Therefore, as described in Patent Document 1, product dimensions associated with patterning the internal electrode in order to ensure a margin around the internal electrode. In contrast, the problem that the plane area of the internal electrode is reduced can be reduced, but after the lamination, unnecessary portions of the internal electrode are removed to ensure insulation, so that sufficient insulation can be secured. However, it takes time to remove the internal electrode layer, and the productivity is low.
JP 2003-234241 A JP 2003-109841 A

  The present invention solves the above-mentioned problem, and it is possible to increase the area of the internal electrode with respect to the product dimensions. For example, in the case of a multilayer ceramic capacitor, it is possible to achieve a small size and a large capacity, It is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component that can efficiently manufacture a small and high-performance multilayer ceramic electronic component without having to remove unnecessary portions of internal electrodes.

In order to solve the above-described problems, a method for manufacturing a multilayer ceramic electronic component according to the present invention includes: a plurality of conductor films laminated in a ceramic laminate through ceramic layers, and each conductor facing through the ceramic layers; A method of manufacturing an electronic component having a structure in which films are alternately drawn out to different sides of a pair of regions on a side surface of a ceramic laminate and electrically connected to external electrodes disposed in each of the pair of regions. There,
Forming a conductive film having a conductive film non-formation region in a spot shape at a predetermined position on one main surface of the ceramic green sheet by a thin film forming method;
A step of forming a mother laminate by laminating a plurality of the ceramic green sheets so that the conductor film non-formation regions formed on one main surface of the ceramic green sheets are overlapped in a plane every other layer; and
When the mother laminate is cut in the vertical and horizontal directions when viewed from the plane direction, the mother laminated body is cut so that the vertical cutting lines and the horizontal cutting lines intersect in the conductor film non-forming region, Each of the ceramic laminates has a structure in which the conductor film is drawn every other layer at the corner portion, and the conductor film not drawn out at the one corner portion is drawn at the other corner portion. Dividing the body,
Forming an external electrode at the pair of corner portions of the ceramic laminate so as to be electrically connected to the conductor film lead portions drawn to the pair of corner portions.

  After forming the external electrode, it is desirable to cover the main part of the ceramic laminate with the coating layer in such a manner that the external electrode is exposed without being coated and the conductor film is coated and not exposed to the outside.

  In addition, before forming the external electrode, the conductive film drawn out to the corner is exposed, and the conductive film is not exposed from areas other than the corner. After coating with the coating layer, an external electrode may be formed so as to be electrically connected to the lead portion of the conductor film drawn to the corner portion.

  Moreover, when forming the conductor film provided with the conductor film non-formation region, the conductor film provided with the conductor film non-formation region can be formed by an oil mask method.

In the method for manufacturing a multilayer ceramic electronic component according to the present invention, a conductor film having a conductor film non-formation region in a spot shape at a predetermined position is formed on one main surface of a ceramic green sheet, and the ceramic green sheet is formed in a conductor film non-formation region A mother laminate is formed by laminating a plurality of sheets so that the layers overlap each other in a plane, and when this mother laminate is cut in the vertical and horizontal directions when viewed from the plane, Cut so that the transverse cutting line intersects in the conductor film non-formation region, the conductor film is drawn every other layer in one corner portion of the pair of corner portions, and the other corner portion has the above-mentioned The step of dividing into individual ceramic laminates having a structure in which the conductor film not drawn to one corner is drawn, and the external electrode is formed so as to be electrically connected to the lead of the conductor film. A pair of regions on the side surface of the ceramic laminate, each of the conductive films facing each other through the ceramic layer efficiently without needing to remove unnecessary portions of the internal electrodes. Can be pulled out to different sides.
As a result, it is possible to increase the area of the internal electrode relative to the product dimensions, and it is possible to efficiently manufacture small and high characteristic multilayer ceramic electronic components, such as small and large capacity multilayer ceramic capacitors. Become.

  In addition, according to the present invention, since it is possible to handle the ceramic green sheet in which the conductor film is disposed on almost the entire main surface of one side of the ceramic green sheet, the presence or absence of the formation of the conductor film (electrode) It is possible to eliminate the in-plane strength difference of the ceramic green sheet, and it is possible to suppress handling damage and form a highly reliable ceramic laminate.

  In addition, after the external electrode is formed, the external electrode is exposed without being covered, and the conductor film is covered and not exposed to the outside. It is possible to obtain a highly reliable multilayer ceramic electronic component by preventing the electrode from conducting to the outside without going through the external electrode.

  In addition, before forming the external electrode, the conductive film drawn out to the corner is exposed, and the conductive film is not exposed from areas other than the corner. Even when the external electrode is formed so as to be electrically connected to the lead portion of the conductor film after being covered with the covering layer, a highly reliable multilayer ceramic electronic component can be obtained.

  In forming a conductor film having a conductor film non-formation region, a conductor film having a conductor film non-formation region can be easily and surely formed by forming the conductor film non-formation region using a so-called oil mask method. Can be formed.

  In the oil mask method, for example, a fluororesin is printed (applied) in a spot shape by a method such as ink jet at a position where the conductive film non-formation region on one main surface of the ceramic green sheet is to be formed. A mask is formed, and in this state, a film is formed on one main surface of the ceramic green sheet by a thin film forming method. A region where the oil mask is applied is defined as a conductive film non-formed region, and a conductor is formed in a region where the oil mask is not applied. This is a method for forming a film.

  In addition, in forming a ceramic green sheet having a conductor film having a conductor film non-formation region by an oil mask method, in addition to the above method, an oil mask is formed on a substrate such as a PET film, Examples thereof include a method in which a conductor film is formed by a thin film forming method and a ceramic green sheet is further formed thereon. Also by this method, it is possible to obtain a ceramic green sheet having a conductor film having a conductor film non-formation region on one main surface.

The oil mask can also be formed by a flexographic printing method using a thick, highly elastic flexographic plate.
Furthermore, the conductor film non-formation region of the conductor film can also be formed by an etching method by photolithography.

  In addition, when a region of the ceramic laminate other than the corner portion where the external electrode is formed is covered with an insulating coating layer, the conductive film lead portion exposed at the corner portion is given water repellency, and then the lead portion is exposed. Efficiently coating the ceramic laminate with the coating layer by applying a method of coating the ceramic laminate with the coating layer by applying the coating layer material having a repelling property or by dipping in the coating layer material Can do.

  In addition, by giving water repellency to the lead portion of the conductor film, for example, the ceramic laminate is immersed in the material constituting the coating layer and the lead portion is exposed, or the entire surface of the ceramic laminate or a predetermined portion is exposed. For example, a thin covering layer of 30 μm or less can be formed in the region. Furthermore, a uniform coating layer of about 10 μm can be formed by adjusting the constituent material of the coating layer.

  Further, in the present invention, having water repellency means having the property of repelling the coating material, and the water repellency in the present invention is literally water. It is a concept including not only the water repellency in the sense of repelling but also the meaning of oil repellency that can repel an oil-based coating material, for example.

  Specifically, a method of forming a water-repellent plating film on the exposed portion of the conductor film, or forming a gold plating film on the lead portion of the conductor film, and applying fluorine-modified thiol on the surface to self-organize Water repellency can be imparted to the drawn-out portion of the conductor film by a method of forming a chemical film on the surface of the gold plating film.

  Examples of the present invention will be described below to describe the features of the present invention in more detail.

FIG. 1 is a perspective view showing an external configuration of a multilayer ceramic electronic component (in this embodiment, a multilayer ceramic capacitor) according to one embodiment of the present invention, and FIG. 2 is a drawing of an internal electrode lead portion and an external electrode that are conductor films. It is a figure which shows a connection aspect, (a) is a figure which shows the internal electrode which conducts with an external electrode in one corner part, (b) is a figure which shows the internal electrode which conducts with an external electrode in the other corner part. .
3 is a cross-sectional view taken along line AA of FIGS.

  In this multilayer ceramic capacitor 10, as shown in FIGS. 1 to 3, a plurality of internal electrodes (conductor films) 2 are laminated via a ceramic layer 3 in a ceramic laminate 1. Further, the plurality of internal electrodes 2 (2a, 2b) are drawn out to a pair of corner portions 4a, 4b in the ceramic laminate 1 at diagonal positions.

  The plurality of internal electrodes 2 (2a, 2b) are alternately drawn out to different sides of the pair of corner portions 4a, 4b located at the opposite corners of the ceramic laminate 1, and the lead portions 12 (12a, 12b) are drawn out. Through which the external electrodes 5a and 5b disposed in the pair of corner portions 4a and 4b are electrically connected. Moreover, the area | region where the external electrodes 5a and 5b are not arrange | positioned of the ceramic laminated body 1 is coat | covered with the coating layer 6 which consists of insulating resin, and the planar area of the internal electrode 2 (2a, 2b) is ceramic. The internal electrodes 2 (2a, 2b) are configured not to be short-circuited with the outside, although they are almost the same size as the planar area of the multilayer body 1.

Next, a method for manufacturing this multilayer ceramic capacitor will be described.
(1) On one main surface of the ceramic green sheet 20, a conductor film having a conductor film non-formation region in a spot shape at a predetermined position is formed by a thin film forming method.
In this embodiment, as shown in FIG. 4, the fluororesin is printed (applied) in a spot shape by a method such as inkjet at a position where the conductor film non-formation region 13 on one main surface of the ceramic green sheet 20 is to be formed. Then, an oil mask 11 is formed, and in that state, a conductor film is formed on the entire surface of one main surface of the ceramic green sheet 20 by, for example, a thin film forming method such as a sputtering method. The conductor film 2 having the conductor film non-formation region 13 is formed.
In addition, as a ceramic green sheet, what was normally supported by carrier films, such as PET film, is used.

  In Example 1, the oil mask 11 is formed by printing (applying) a fluorine-based resin in a spot shape at a position where the conductor film non-formation region 13 on one main surface of the ceramic green sheet 20 is to be formed. However, an oil mask is formed on a substrate such as a PET film, a conductor film is formed on the substrate by a thin film formation method, and a ceramic green sheet is further formed thereon to form a conductor film. It is also possible to produce a ceramic green sheet having a conductor film having a region on one main surface.

  (2) Then, the adjacent ceramic green sheets 20 (see FIG. 5) so that the conductor film non-formation regions 13 of the conductor film 2 formed on one main surface of the ceramic green sheet 20 overlap each other in a plane. 5 (a)) is laminated by shifting the position by a predetermined amount as shown in FIG. 5 (b) to form the mother laminate 14.

In addition, as a method of laminating the ceramic green sheets 20, use any method of peeling from the carrier film and then pressing, or after pressing one by one and then peeling the carrier film and repeating this method. Is also possible.
In addition, when laminating the exterior sheets on the upper and lower sides of the ceramic laminate, in the step of laminating the ceramic green sheets, it is also possible to stack in the same manner, and after the ceramic green sheet laminating step It is also possible to integrate with a press.

  (3) Then, the mother laminate 14 is cut along predetermined cutting lines L1 and L2 in the vertical and horizontal directions as seen from the plane direction (see FIG. 6). At this time, the cutting is performed so that the vertical cutting line L1 and the horizontal cutting line L2 intersect at the center of the conductor film non-forming region 13.

  As a result, the conductor film 2 (2a) is pulled out every other corner portion (for example, 4a) of the pair of corners 4a and 4b, and the other corner portion (for example, 4b) The conductor film 2 (2b) that is not drawn to one corner 4a is divided into individual ceramic laminates having a drawn structure (see FIGS. 1 to 3).

(4) Next, after firing the ceramic laminate 1 under predetermined conditions, external electrodes are connected so as to be electrically connected to the lead portions 12a and 12b of the conductor films (internal electrodes 2a and 2b) drawn to the corner portions 4a and 4b. 5a and 5b are formed.
The external electrodes 5a and 5b can be formed by various known methods such as a method of applying and baking a conductive paste.

(5) Then, a region other than the region where the external electrodes 5 a and 5 b are formed is covered with the insulating coating layer 6. Thereby, a multilayer ceramic capacitor 10 having a structure as shown in FIG. 1 is obtained.
In addition, as a method of coating the ceramic laminate 1 with the coating layer 6, for example, a method in which the insulating resin is cured after being immersed in a solvent solution of the insulating resin raw material can be applied.

  Note that the external electrodes 5a and 5b may be covered with the coating layer 6 depending on the method of coating with the coating layer 6. In this case, for example, the surface of the external electrodes 5a and 5b is coated by a method such as sandblasting. Can be exposed.

  Further, by applying water-repellent plating to the external electrodes 5a and 5b so that the external electrodes 5a and 5b are not covered with the coating layer 6, the coating layer can be easily formed by a method such as dipping.

  In forming a mother laminate, it is also possible to obtain the required number of layers by a method of repeatedly forming a conductor film and forming a sheet. For example, after repeatedly laminating 10 layers, this is punched out. It is also possible to obtain the required number of layers by laminating.

According to the method of manufacturing the multilayer ceramic electronic component of Example 1, since the ceramic green sheet having the conductor film disposed on almost the entire surface is used, the strength of the ceramic green sheet alone that does not include the conductor film is used. Compared with the case, the ceramic green sheet having a small thickness can be handled while avoiding handling damage. Specifically, it becomes possible to use a ceramic green sheet having a thickness of 0.8 μm before firing.
Further, regarding the obtained multilayer ceramic capacitor, it becomes possible to obtain a multilayer ceramic capacitor having a fired conductor film (internal electrode) thickness of 0.6 μm.

  As described above, according to the method of the first embodiment, a so-called multi-cavity method efficiently manufactures a small-sized and large-capacity monolithic ceramic capacitor in which the planar area of the product dimensions is substantially the same as the area of the internal electrodes. be able to.

A method for manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention will be described.
(1) First, the mother laminated body 14 is formed by the same method as described in the first embodiment (1) and (2).

(2) Then, as shown in FIGS. 7 and 8, through holes 23 (23a, 23b) having a diameter slightly smaller than that of the conductor film non-formation region 13 are formed in the conductor film non-formation region 13 described above. .
At this time, as shown in FIG. 8, the conductor films 2 (2a, 2b) are exposed on the inner peripheral surface of the pair of through holes 23 (23a, 23b) every other layer, and the pair of through holes 23 (23a, 23b). ) In some cases, different conductor films 2 (2a or 2b) are exposed on the inner peripheral surfaces thereof.

(3) Water repellency is imparted to the exposed portions 12 (12a, 12b) of the conductor film 2 by performing water-repellent plating.
In Example 2, a ceramic laminate is laminated on a plating bath containing an emulsion of a fluorine polymer and Ni, and a method of imparting water repellency by co-depositing the fluorine polymer together with Ni metal is used. Water repellent plating was performed to impart water repellency to the lead portions 12a and 12b.

  As the fluorine-based polymer, polytetrafluoroethylene (PTFE), polyperfluoroalkoxybutadiene (PFA), polyfluorovinylidene, or the like can be used alone or in combination. If the thickness of the water-repellent plating film is about 1 μm to 5 μm, the water repellency required in the present invention can be sufficiently secured.

In addition, when the thickness of the water-repellent plating film is less than 1 μm, the water repellency becomes insufficient, and the lead portion may be covered with the coating layer, which is not preferable. On the other hand, when the water-repellent plating film exceeds 5 μm, the water repellency is sufficient, but it is not preferable because it becomes difficult to apply to a conductor film (internal electrode) having a thickness of 1 μm or less.
Moreover, water repellency can be brought to the lead-out portion by applying gold plating to the lead-out portion of the conductor film and applying fluorine-modified thiol to the surface of the formed gold-plated film.

  (4) Next, the mother laminate 14 is cut along predetermined cutting lines L1 and L2 in the vertical and horizontal directions when viewed from the plane. At this time, the cutting line L1 in the vertical direction and the cutting line L2 in the horizontal direction are cut so as to intersect at the through hole 23 formed in the conductor film non-formation region 13, and divided into individual ceramic laminates 1.

(5) Then, the divided ceramic laminate 1 is covered with a coating layer made of a material repelled by the water repellent lead portions 12 (12a, 12b), and as shown in FIG. The lead portion 12 (12a, 12b) is exposed at 4a, 4b, and the coated ceramic laminate 11 having a structure in which other regions are covered with the coating layer 6 is formed.
In this embodiment, the coated ceramic laminate 11 is immersed in a ceramic slurry so that the lead portion 12 (12a, 12b) is exposed and the other region is coated with the coating layer 6 (6a) made of a ceramic layer. Form.

(6) After this coated ceramic laminate is integrally fired, the lead portions 12a and 12b are electrically connected to the pair of corner portions 4a and 4b of the coated ceramic laminate 11 where the drawn portions 12 (12a and 12b) are exposed. Thus, the external electrodes 5a and 5b are formed by applying and baking the conductive paste for forming the external electrodes. Thereby, a multilayer ceramic capacitor having a structure as shown in FIG. 10 is obtained.
According to the method of the second embodiment, the ceramic laminate 1 and the external electrodes 5a and 5b can be simultaneously fired by a single heat treatment, and the manufacturing process can be simplified.

  The method for imparting water repellency to the exposed portion of the conductor film is not limited to the method of forming a water-repellent plating film on the lead portion, but a gold plating film is formed on the lead portion of the conductor film and the surface thereof is formed. It is also possible to apply a method in which a fluorine-modified thiol is applied to form a self-assembled film on the surface of the gold plating film.

  In the above embodiment, the multilayer ceramic capacitor has been described as an example. However, the present invention can also be applied to multilayer ceramic electronic components other than the multilayer ceramic capacitor, such as LC composite components.

  In the above embodiment, the conductor portion is drawn out to the pair of corner portions at the diagonal position, but the conductor portion may be drawn out to the pair of corner portions on the same side instead of the diagonal position. Is possible.

  In other respects, the present invention is not limited to the above-described embodiments, and relates to the number of conductor films (internal electrodes) stacked, a specific method for forming a conductor film non-formation region, and the like within the scope of the invention. Various applications and modifications can be added.

As described above, according to the present invention, the area of the internal electrode can be made substantially the same as the plane area of the product dimensions, and it becomes possible to efficiently manufacture a small and high-performance multilayer ceramic electronic component, For example, in the case of a multilayer ceramic capacitor, it is possible to realize a small size and large capacity.
Therefore, the present invention can be widely used in the technical fields related to multilayer ceramic electronic components such as multilayer ceramic capacitors and multilayer LC composite components and their manufacture.

It is a perspective view which shows the structure of the multilayer ceramic electronic component (multilayer ceramic capacitor) concerning Example 1 of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the connection aspect of the drawer | drawing-out part of an internal electrode, and an external electrode of the multilayer ceramic capacitor concerning Example 1 of this invention, Comprising: (a) shows the internal electrode electrically connected with an external electrode in one corner part. FIG. 4B is a diagram showing the internal electrode that is electrically connected to the external electrode at the other corner. It is the sectional view on the AA line of FIGS. It is a figure explaining the method to form the conductor film provided with the conductor film non-formation area | region in the ceramic green sheet in the manufacturing process of the multilayer ceramic capacitor concerning Example 1 of this invention. (a), (b) is a figure explaining the method to laminate | stack a ceramic green sheet in the manufacturing process of the multilayer ceramic capacitor concerning Example 1 of this invention. It is a figure explaining the method to cut | disconnect a mother laminated body at the manufacturing process of the multilayer ceramic capacitor concerning Example 1 of this invention. It is a top view which shows the state which formed the through hole with a diameter smaller than it in the conductor film non-formation area | region in 1 process of the manufacturing method of the multilayer ceramic capacitor concerning Example 2 of this invention. It is front sectional drawing which shows typically the state which formed the through hole with a diameter smaller than it in the conductor film non-formation area | region in 1 process of the manufacturing method of the multilayer ceramic capacitor concerning Example 2 of this invention. It is sectional drawing which shows the covering ceramic laminated body formed at 1 process of the manufacturing method of the laminated ceramic capacitor concerning Example 2 of this invention. It is sectional drawing which shows the multilayer ceramic capacitor manufactured by the manufacturing method of the multilayer ceramic capacitor concerning Example 2 of this invention.

Explanation of symbols

1 Ceramic laminate 2 (2a, 2b) Internal electrode (conductor layer)
DESCRIPTION OF SYMBOLS 3 Ceramic layer 4a, 4b Corner part 5a, 5b External electrode 6 Coating layer 10 Multilayer ceramic capacitor 11 Oil mask 12 (12a, 12b) Lead part of internal electrode (conductor layer) 13 Conductor film non-formation area 14 Mother laminated body 20 Ceramic Green sheet 23 (23a, 23b) Through hole L1, L2 Cutting line

Claims (5)

In the ceramic laminate, a plurality of conductor films are laminated via a ceramic layer, and the respective conductor films facing each other via the ceramic layer are alternately drawn out to different sides of a pair of regions on the side surface of the ceramic laminate. A method of manufacturing an electronic component having a structure electrically connected to an external electrode disposed in each of the pair of regions,
Forming a conductive film having a conductive film non-formation region in a spot shape at a predetermined position on one main surface of the ceramic green sheet by a thin film forming method;
A step of forming a mother laminate by laminating a plurality of the ceramic green sheets so that the conductor film non-formation regions formed on one main surface of the ceramic green sheets are overlapped in a plane every other layer; and
When the mother laminate is cut in the vertical and horizontal directions when viewed from the plane direction, the mother laminated body is cut so that the vertical cutting lines and the horizontal cutting lines intersect in the conductor film non-forming region, Each of the ceramic laminates has a structure in which the conductor film is drawn every other layer at the corner portion, and the conductor film not drawn out at the one corner portion is drawn at the other corner portion. Dividing the body,
Forming an external electrode on the pair of corner portions of the ceramic laminate so as to be electrically connected to the conductor film lead portions drawn to the pair of corner portions. A manufacturing method for parts.   After forming the external electrode, the external electrode is exposed without being covered, and the conductive film is covered and not exposed to the outside, and the ceramic laminate is covered with an insulating coating layer. The method for producing a multilayer ceramic electronic component according to claim 1, wherein:   Prior to forming the external electrode, the lead-out portion of the conductor film drawn to the corner portion is exposed, and the conductor film is not exposed from a region other than the corner portion. 2. The multilayer ceramic electronic component according to claim 1, wherein the external electrode is formed so as to be electrically connected to the lead portion of the conductor film drawn to the corner portion after the body is covered with an insulating coating layer. Manufacturing method.   The method for producing a multilayer ceramic electronic component according to claim 1, wherein the conductor film having the conductor film non-formation region is formed by an oil mask method.   In covering the region other than the corner portion where the external electrode is formed of the ceramic laminate with an insulating coating layer, the lead portion of the conductor film exposed to the corner portion is given water repellency, and then the lead The ceramic laminate is coated with the coating layer by a method of applying a coating layer material having a property of being repelled by the coating portion or dipping in the coating layer material, and at least the lead portion is exposed, and the conductor film The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 4, wherein a ceramic multilayer body covered with an insulating coating layer is formed except for the lead portion.

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