JP2008257069A - Laser transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser transfer device represented by a laser repair device, wherein a transfer plate is allowed to accurately descend at high speed from a prescribed high position for movement from a defective point to a defective point to a prescribed low position (e.g. an approaching distance to a transfer object is 5 to 20 μm) for transfer treatment and to stand still without colliding against the transfer object. <P>SOLUTION: The laser transfer device includes a first transfer head descent control means making a transfer head descend at a prescribed high speed while integrating the descent distance until the integrated distance reaches a descent distance ä(A-B)-H1} to a first target height (H1) by driving and controlling a head positioning mechanism and a second transfer head descent control means making the transfer head descend at a prescribed low speed while integrating the descent distance until the integrated distance reaches a descent distance ä(A-B)-H1-H2} to a second target height (H2) at which own power floating action functions by driving and controlling the head positioning mechanism. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laser transfer apparatus suitable as, for example, a so-called laser repair apparatus that repairs a circuit defect of a liquid crystal display device or a plasma display device.

  2. Description of the Related Art Conventionally, in a display device such as a liquid crystal display or a plasma display, a laser repair device using a laser CVD method has been employed in order to repair a circuit pattern defect.

  This laser repair apparatus using the laser CVD method uses a chemical vapor deposition method using a laser, and specifically, irradiates a laser on a substrate placed in a raw material gas. By promoting the chemical / physical reaction of the source gas, a film of the source gas is grown on the repaired portion on the substrate.

  However, in such a laser repair apparatus using the conventional laser CVD method, only a material that can be gasified (W, Cr, Mo) can be used as a repair material, and the source gas on the laser irradiation surface is used. It has been pointed out that the repair speed is slow due to the use of chemical and physical reactions.

  On the other hand, as a laser repair apparatus capable of solving such problems, a laser repair apparatus using a laser transfer method (LMT: Laser Metal Transfer) is known (for example, see Patent Document 1).

  The principle of a laser repair apparatus using this laser transfer method is shown in FIG. In the figure, a is a quartz glass plate, b is a conductive metal thin film as a restoration material, c is a substrate, d is a circuit pattern, e is a lens, f is a laser beam, g is a defective portion on the circuit pattern, b ′ Is a metal thin film blown by laser beam irradiation. In this example, the integrated quartz glass plate a and thin film b corresponds to the transfer plate.

In this laser transfer method, first, as shown in FIG. 5A, a quartz glass plate a having a thin film b of a repair material on the objective surface is placed on a substrate c having a defective portion g at a fine distance. The laser beam f is focused to a predetermined spot shape through the lens e and irradiated as shown in FIG. Then, as shown in FIG. 6C, the thin film portion b ′ irradiated with the laser beam f is skipped, and as shown in FIG. Adhere to. At this time, when the line width of the repaired portion is 2 to 5 μm, the distance L is preferably about 5 to 20 μm.
JP 2000-31013 A

  In a laser repair apparatus using such a conventional laser transfer method, various metals such as Al, Ni, Ta, W, Ti, Au, Ag, Cu, and Cr can be selected as a repair material. Since it can be repaired instantly by simply irradiating the transfer plate with a laser, there is an advantage that the repair is completed in a very short time.

  By the way, in this type of laser repair apparatus, in order to clearly obtain a transfer film having a necessary line width on the surface of a display device or the like as a repair target, the distance between the transfer target surface and the transfer material thin film is always set. It is required to be maintained in a micron order (for example, 5 to 20 μm).

  As an object to be repaired, for example, assuming a large display device having a screen size of several tens of inches to one hundred inches, a laser beam is used to repair a plurality of defective portions scattered on the circuit pattern in a short time. At the time of transfer from a high position at the time of movement (for example, the distance to the surface of the transfer object is about 10 mm) as well as positioning control in the horizontal plane that moves the irradiation optical axis from the defective part on the circuit pattern to the defective part at high speed Position control in the height direction is also required to lower the transfer plate at a high speed to a low position (for example, the distance to the transfer object surface is 5 μm to 20 μm).

  Generally, for such high-precision positioning control in the height direction, a pulse motor or linear motor is actually measured according to the measured distance while actually measuring the distance to the approaching object via some measuring instrument. It is customary to employ a precise electric servo control technique that approaches the target object by controlling the speed.

  However, since the target approach distance of the transfer plate to the repair target in this type of laser transfer apparatus is on the order of microns (for example, 5 to 20 μm), even with such precise electric servo technology, It is not easy to always stop the transfer plate exactly at the target approach distance without colliding. In particular, since the surface of the repair target (display device substrate, etc.), which is an approach target, has micron-order irregularities in the first place, the target from any position on the repair target is from a high position. Therefore, it is practically impossible to bring the transfer plate close to the low position where the transfer plate is brought to rest without colliding with the object to be repaired by a servo control technique using a servo motor, a linear motor, or the like.

  The present invention has been made paying attention to such a conventional problem, and the object of the present invention is to transfer from a defective portion to a defective portion in this type of laser transfer device represented by a laser repair device. The transfer plate is lowered at high speed and accurately from a predetermined high position for movement or the like to a predetermined low position for transfer processing (for example, the approach distance to the transfer target is 5 to 20 μm), and the transfer target An object of the present invention is to provide a laser transfer apparatus that can be kept stationary without colliding with an object.

  Other objects and operational effects of the present invention will be easily understood by those skilled in the art by referring to the following description of the specification.

  The above technical problem can be solved by a laser transfer apparatus having the following configuration.

  That is, this laser transfer device is a transfer plate in which a transfer material thin film is attached to an objective surface of a plate-shaped piece having laser transparency so that the transfer material thin film faces the transfer plate. The transfer material thin film corresponding to the irradiation position is transferred to the transfer target surface of the transfer object by superimposing them on a slight gap and irradiating a laser beam from the upper surface side of the transfer plate. .

  The laser transfer apparatus includes a laser irradiation optical system including an objective lens for irradiating a laser beam incident from a laser source vertically to a target position on a transfer target surface of a transfer target, and a lower surface. On the side, the transfer plate is supported in a horizontal posture so as to be movable up and down, and on the upper surface side, a transfer window for exposing the transfer plate supported on the lower surface side is opened. When the aircraft is descending and approaching to a distance, a small gap necessary for transfer is formed between the transfer material thin film on the lower surface of the transfer plate and the transfer surface on the upper surface of the transfer object due to the self-levitation action by the gas injection onto the transfer surface. A transfer head structured to be held, a head positioning mechanism capable of moving the transfer head up and down at least in the vertical direction, and a lowering distance (A) from a predetermined reference height to the transfer target surface of the transfer object First to measure Descent distance measuring means, a second descent distance measuring means for measuring the descent distance (B) from the predetermined reference height to the transfer material thin film on the lower surface of the transfer plate, and the descent distance (A ) And the lowering distance (B) to the transfer material thin film, the distance calculating means for calculating the distance (A-B) between the transfer surface and the transfer material thin film, and the head positioning mechanism by driving and controlling the lowering distance. The first transfer head that lowers the transfer head at a predetermined high speed until the integrated distance reaches the lowering distance {(AB) -H1)} to the first target height (H1) while integrating. By driving and controlling the descent control means and the head positioning mechanism, the descent distance is accumulated, and the accumulated distance is the descent distance {(AB) to the second target height (H2) where the self-levitation function functions. ) -H1-H2} until the transfer head is And it includes a second transfer head drop control means for lowering at a constant low speed, the.

  According to such a laser transfer device, the transfer material on the lower surface of the transfer plate is caused by self-levitation by gas injection onto the transfer target surface when the machine body is lowered and approached from the transfer target surface of the transfer target object to a predetermined distance. For example, the second target height (H2) is adopted because the transfer head is configured so that a minute gap necessary for transfer is maintained between the thin film and the transfer target surface of the transfer target. Even if the aircraft descent distance exceeds the schedule and the transfer plate is about to collide with the transfer target, the transfer plate is supported so that it can move up and down, and the self-lifting function will function. Therefore, even if the transfer head is lowered, the transfer plate will rise, so the collision between the transfer plate and the transfer object is automatically avoided, and the circuit pattern where the transfer plate is the transfer object Collide with and destroy this It is possible to prevent the risk from occurring. Therefore, prior to the laser beam irradiation, the transfer plate can be guided to a height having a fine gap necessary for transfer by open loop control.

  In a preferred embodiment, the laser irradiation optical system is focused on a subject for adjusting the height of the laser focusing point and a subject that is always located at the laser focusing point height. And an electronic camera having a function of determining whether or not the subject is in focus based on the video output.

  The first descent distance measuring means is in a state in which the transfer head is retracted to a predetermined standby position via the head positioning mechanism so that nothing interrupts the irradiation optical axis of the laser irradiation optical system. By controlling the focal point height adjustment mechanism, the height of the laser focal point is lowered and the focus is lowered while monitoring whether or not there is a focus while adding the descent distance Is stored as a descending distance (A) from a predetermined reference height to the transfer target surface of the transfer object, and the second descending distance measuring means is configured to store the first descending distance. Following the measurement by the distance measuring means, in the state where the transfer head is returned to the predetermined operating position via the head positioning mechanism so that the optical axis of the laser irradiation optical system is blocked by the transfer plate, Adjustment mechanism By controlling the height of the laser focusing point while subtracting the ascent distance and monitoring whether or not there was focus through the camera, the distance as the subtraction result when there was focus, It is structured so as to be stored as a descending distance (B) from a predetermined reference height to the transfer material thin film.

  According to such a configuration, since the laser irradiation system itself functions as a distance measuring unit, there is an advantage that a separate processing measuring unit is not required.

  According to the present invention, in a state where the machine body descends and approaches from the transfer target surface of the transfer object to a predetermined distance, the transfer material thin film on the lower surface of the transfer plate and the upper surface of the transfer object are generated by self-levitation by gas injection onto the transfer target surface. Since a transfer head that is structured so that a minute gap necessary for transfer is maintained between the transfer target surface and the surface to be transferred, for example, the airframe descending distance to the second target height (H2) is Even if the transfer plate is about to collide with the object to be transferred, the transfer plate is supported so that it can move up and down, and the floating function is designed to function by itself. Even if the transfer head unit is lowered, the transfer plate is raised, so the collision between the transfer plate and the transfer object is automatically avoided, and the transfer plate collides with the circuit pattern that is the transfer object. Preventing the risk of damage etc. It can be. Therefore, according to the present invention, in this type of laser transfer apparatus represented by a laser repair apparatus, a predetermined low position for transfer processing from a predetermined high position for movement from a defective part to a defective part is provided. The transfer plate can be lowered at high speed and accurately to a position (for example, the approach distance to the transfer object is 5 to 20 μm), and can be stopped without colliding with the transfer object.

  Hereinafter, a wiring pattern repair device (also referred to as a “laser repair device”), which is an embodiment of a laser transfer device according to the present invention, will be described in detail with reference to the accompanying drawings.

  FIG. 1 is an external perspective view of an entire wiring pattern repair apparatus to which the present invention is applied, FIG. 2 is an external perspective view of a laser transfer unit included in the wiring pattern repair apparatus, and FIG. 2 shows a beam shaping mechanism included in the laser transfer unit. An explanatory diagram showing an example is shown in FIG.

  As shown in FIG. 1, the wiring pattern repairing apparatus 100 places a repair target (transfer target) 110 such as a liquid crystal display device or a plasma display device with the circuit pattern surface to be repaired facing upward. Stage 120, a unit positioning mechanism 130 that is positioned above the stage 120 and can be positioned at an arbitrary XY coordinate in the horizontal plane, and a laser transfer unit 140 that is supported by being suspended by the unit positioning mechanism 130. It is comprised including.

  The unit positioning mechanism 130 includes X-direction guide rails 131 and 131 that are parallel to each other and a Y-direction guide rail 132 that is orthogonal to the X-direction guide rails 131, and the laser transfer unit 140 is moved horizontally by a drive source such as a pulse motor or a linear motor (not shown). It can be positioned by moving to an arbitrary XY coordinate position.

  The laser transfer unit 140 includes a unit machine frame 140a that is suspended and supported above the stage 120 by the unit positioning mechanism 130, a head positioning mechanism 2 that is attached to the unit machine frame 140a, and the head positioning mechanism 2. The transfer head 1 is three-dimensionally positioned, and the laser irradiation optical system 3 is attached to the unit machine frame 140a via a condensing point height positioning mechanism 5 so as to be movable up and down. In the figure, reference numerals 51 and 51 denote left and right Z-direction guide rails constituting a condensing point height positioning mechanism.

  As shown in FIGS. 1 and 2, the head positioning mechanism 2 includes an X-direction (front-rear direction) drive unit 21, a Y-direction (left-right direction) drive unit 22 that supports the X-direction drive unit 21, and a Y-direction drive. The transfer head 1 (details will be described later) is attached to the X-direction drive unit 21. The Z-direction (vertical direction) drive unit 23 supports the unit 22. The transfer head 1 can be moved or positioned to an arbitrary position with respect to the objective lens 31 by appropriately driving and controlling the drive units 21, 22, and 23.

  As shown in FIGS. 1 and 2, the laser irradiation optical system 3 transmits a laser beam 41 coming from an upper laser source 4 from an incident port 36a to a lens barrel 36 via a beam shaping mechanism (not shown). A laser irradiation optical path C2 that guides the introduced laser beam to the beam separator 34 vertically downward, and imaging light from the objective lens 31 separated by the beam separator 34 are horizontally directed to An imaging optical path C3 guided to the electronic camera 38 via 37 and a laser beam arriving via the laser irradiation optical path C2 are guided vertically downward from the beam separator 34 to the objective lens 31 and the objective lens 31 And a common optical path C1 for guiding the imaging light arriving from to the beam separator 34 vertically upward. Reference numeral 35 denotes an LED illuminator for illuminating the visual field of the electronic camera 38.

  In other words, as shown in FIG. 4, the laser irradiation optical system 3 includes a vertical laser irradiation optical path C2, a horizontal photographing optical path C3, and a vertical shared optical path shared as a part of these optical paths. A coaxial incident optical system having C1 is configured.

  The laser beam emitted vertically downward from the objective lens 31 is condensed at a position separated by a predetermined distance on the emission optical path C21 by the condensing action of the objective lens 31, and a condensing point is generated. The thin film transfer process by laser irradiation is performed at a laser condensing point generated at a predetermined distance on the outgoing optical path.

  On the other hand, the electronic camera 38 is always focused so as to focus on the object located at the laser focusing point. In addition, the electronic camera 38 has a built-in function for determining and outputting to the outside whether or not the camera is in focus based on the video signal. Further, the entire laser irradiation optical system 3 is, as will be described later with reference to FIG. 4, a condensing point height positioning mechanism 5 including a drive motor 52, a ball screw mechanism 53, and a Z-direction guide rail 51. Thus, it is possible to move up and down in the vertical direction by an arbitrary distance.

  Therefore, if the focus determination output of the electronic camera 38 is monitored while raising or lowering the entire laser irradiation optical system 3, it can be determined whether or not the condensing point matches the laser irradiation object. In addition, if the focus determination output of the electronic camera 38 is monitored while measuring the descent distance from a certain reference height, the laser irradiation target from the reference height is measured based on the descent distance measurement value until the focus is achieved. You can know the descent distance to the object. As will be described later, in this embodiment, the height direction positioning control of the transfer plate is realized by utilizing the functions of the laser irradiation optical system 3 and the condensing point height positioning mechanism 5 described above.

  In FIG. 2, 32 is a revolver that holds a plurality of objective lenses on the circumference and rotates by an arbitrary angle, and 33 is a rotary encoder that is used to control the rotation angle of the revolver 32. Allows selection.

  An explanatory view showing an example of the beam shaping mechanism is shown in FIG. As shown in the figure, the beam shaping mechanism 39 is disposed immediately before the entrance 36a of the lens barrel 36 (see FIG. 2), and the cross section of the laser beam coming from the laser source 4 is parallel to each other extending in the X direction. The two mask plates and two mask plates extending in the Y direction and parallel to each other have a function of shaping into a rectangular shape having a long side and a short side having an arbitrary length.

  That is, as is apparent from FIG. 3, the beam shaping mechanism 39 is composed of two elongated rectangular mask plates (first mask plate 391a and second mask plate 391b) extending in the Y (left-right) direction and parallel to each other. ) And two mask plates (a first mask plate 395a and a second mask plate 395b) extending in the X (front-rear) direction and parallel to each other.

  A first mask plate 391a and a second mask plate 391b extending in the Y (left-right) direction are supported by a first slide block 392a and a second slide block 392b, respectively, and the slide blocks 392a, 392b are It is spring-biased so as to approach each other and is supported so as to be slidable in the X (front-rear) direction.

  A first roller 393a and a second roller 393b are disposed opposite to the slide blocks 392a and 392b, and a wedge block 394 having a V-shaped guide surface between the rollers 393a and 393b. Is supported to move up and down.

  Accordingly, by adjusting the descending distance (insertion distance between the rollers) of the wedge block 394, the interval between the first mask plate 391a and the second mask plate 391b is arbitrarily adjusted, so that the laser beam The X-direction width (front-rear direction width) of the cross section can be set.

  Similarly, the first mask plate 395a and the second mask plate 395b extending in the X (front-rear) direction are supported by the first slide block 396a and the second slide block 396b, respectively, and the slide blocks 396a. , 396b are spring-biased in a direction approaching each other and supported so as to be slidable in the Y (left-right) direction.

  A first roller 397a and a second roller 397b are disposed opposite to the slide blocks 396a and 396b, and a wedge block 398 having a V-shaped guide surface is provided between the rollers 397a and 397b. Supported to move up and down.

  Therefore, by adjusting the descending distance (insertion distance between the rollers) of the wedge block 398, the interval between the first mask plate 395a and the second mask plate 395b is arbitrarily adjusted, so that the laser beam The width in the Y direction (horizontal direction width) of the cross section can be set.

  Returning to FIG. 2, the laser beam 41 coming from the laser source 4 and the mark beam 61 coming from the focusing light source 6 are on the optical path of the laser beam 41 and before the beam shaping mechanism 39 described above. A beam combiner 7 (for example, a half mirror, a polarization beam splitter, or the like) is interposed.

  Then, via the beam combiner 7, as will be described later with reference to FIG. 37, the mark beam 61 from the focusing light source 6 is sent to the beam shaping mechanism 39, and the cross section of the mark beam 61 is obtained. By appropriately shaping through the beam shaping mechanism 39, it is possible to display a clear and high-contrast optical image corresponding to the focus adjustment mark on the surface of the laser irradiation object.

  FIG. 4 is a schematic diagram showing the laser transfer unit 140 described above centering on the specific mechanism, centering on the laser irradiation optical system 3. As shown in the figure, this laser irradiation optical system 3 is a horizontal photographing that connects a vertical laser irradiation optical path C2 connecting the laser source 4 and the beam separator 34, and the beam separator 34 and the electronic camera 38. And a vertical common optical path C1 that connects the beam separator 34 and the objective lens 31 and is shared by laser irradiation and camera photography.

  A beam combiner 7 for merging the mark beam 61 coming from the focusing light source 6 and the laser beam 41 is provided in a vertical laser irradiation optical path C2 connecting the laser source 4 and the beam separator 34. A beam shaper 39 for shaping the cross section of the laser beam 41 or the mark beam is interposed.

  When the laser source 4 is driven to emit a laser beam, the laser beam is emitted from the objective lens 31 vertically downward. At this time, due to the light condensing action of the objective lens 31, the laser beam is condensed at a position on the outgoing optical axis C21 of the objective lens 31 and away from the objective lens 31 by a predetermined distance. Will occur. In order to effectively carry out laser transfer, which is the basic principle of the present invention, as described above with reference to FIG. 38, this condensing point P is set to the height of the transfer material thin film (b) on the lower surface of the transfer plate. Must match exactly.

  On the other hand, in the electronic camera 38, a clear light image of the subject is formed on the light receiving surface of the built-in image sensor (not shown) only when the subject exists at the condensing point P. The optical system is designed so that the image is in a so-called focused state. Also, in the electronic camera 38, whether or not the camera is in focus is determined based on the state of the light image on the light receiving surface of the built-in image sensor (not shown) (for example, sharpness, brightness, etc.). A function for automatically determining and outputting the determination result to the outside is incorporated. Since such automatic focus determination processing is already known in various documents, detailed disclosure of specific focus automatic determination processing is omitted.

  The entire laser irradiation optical system 3 described above can be moved up and down via a condensing point height positioning mechanism 5. As described above, in this example, the condensing point height positioning mechanism 5 receives the rotational driving force of the motor 52 and moves the laser irradiation optical system 3 to the Z direction guide rails 51 and 51 (FIG. 1). And a ball screw mechanism 53 that moves up and down along the line (see FIG. 6). Therefore, the height of the condensing point P can be arbitrarily adjusted by driving and controlling the condensing point height positioning mechanism 5.

  Next, FIG. 5 is an external perspective view of the transfer head, FIG. 6 is an exploded perspective view thereof, FIG. 7 is a plan view thereof, FIG. 8 is an external perspective view (No. 1) in an upside down state, and FIG. The figure (the 2) is shown by FIG. 9, respectively.

  As is apparent from FIGS. 5 and 6, the transfer head 1 is mainly composed of a transfer head body 11. The transfer head body 11 has an attachment portion 11a for attachment to an X direction drive portion 21 (see FIG. 2) and a support portion 11b for supporting a transfer plate holder (details will be described later) 13. Yes.

  As shown in FIG. 6, a space 11c having a substantially square inner peripheral shape is formed in the center of the support portion 11b, and a substantially square outer peripheral shape having four corners obliquely cut in the space 11c. The transfer plate holder 13 is accommodated and is supported with respect to the transfer head base 11 so as to be movable up and down within a predetermined allowable range. In this example, a leaf spring 12 is used to support the transfer plate holder 13 in the space 11c so that it can move up and down within a predetermined allowable range.

  The leaf spring 12 has a substantially square shape, and an opening 12a for receiving the laser beam emitted from the objective lens 31 is formed at the center thereof, and punching holes 12b and 12c and screw holes are formed on the outer periphery of the opening 12a. 12d and 12e are formed. Among these punching holes, the arcuate punching hole 12b as a whole is for imparting a local spring property, and the arcuate punching hole 12c having a substantially circular large-diameter hole 12c ′ at the center is a local punching hole. In addition to the purpose of imparting springiness, as described later, the portion of the large-diameter hole 12c ′ serves as a viewing window for viewing the upper surface of the transfer object 110 located below the transfer head 1 with the electronic camera 38. Also works.

  That is, in the assembled state shown in FIG. 5, the large-diameter hole portion 12c ′ of the arc-shaped punching hole 12c of the leaf spring 12 has an outer peripheral surface of the transfer plate holder 13 on its lower surface side as shown in FIG. Positioning is performed so as to align with the gap between the recess 13d and the inner peripheral surface of the space 11c of the transfer head body 11. Therefore, in the assembled state shown in FIG. 5, the upper surface (transfer target surface) of the repair target object (transfer target object) 110 positioned below the large-diameter hole portion 12c ′ can be seen through, thereby increasing the size. The diameter hole portion 12c ′ is configured to function as a viewing hole for the electronic camera 38.

  Further, since the diameter of the peep hole (large-diameter hole portion 12c ′) is set sufficiently larger than the diameter of the laser beam passing through the peep hole, the diameter of the laser emission optical axis C21 is not limited to a mere peep hole. If the laser source is appropriately driven (one-shot drive, wobbling drive, etc.) in accordance with this, it is not a laser transfer process, but a laser cut process to remove part of the circuit pattern generated on the surface of the repair target Can also be used.

  The plate spring 12 and the transfer plate holder 13 are coupled through a screw hole 12e on the plate spring 12 side and a screw hole 13b on the transfer plate holder 13 side. The leaf spring 12 and the support portion 11b are coupled to each other through a screw hole 12d on the leaf spring 12 side and a screw hole 11d on the support portion 11b side. As a result, the transfer plate holder 13 is restricted from moving in the horizontal direction in the space 11c and is allowed to move in the vertical direction only within the elastic range of the leaf spring 12 while maintaining the horizontal posture. It is comprised so that.

  As shown in FIG. 6, a transfer window 13 a for receiving a laser beam emitted from the objective lens 31 is opened at the center of the transfer plate holder 13. The upper surface of the held circular transfer plate 14 (see FIGS. 8 and 9) is exposed. As described above with reference to FIG. 38, the transfer plate 13 is formed on the objective surface (the lower surface in this example) of a plate-like piece having laser transparency (in this example, a small piece of a quartz glass plate). A thin film of a transfer material (in this example, a conductive metal suitable for repairing a circuit pattern such as chromium) is deposited.

  As will be described in detail later with reference to FIG. 8, the circular transfer plate 14 has a plurality of compressed air injection holes 14a, 14a,. The transfer plate 14 maintains a horizontal posture by blowing downward pressure of an inert gas such as nitrogen gas toward the repair target object (transfer target object) 110 from these pressure air injection holes 14a, 14a. As it is, the transfer plate holder 13 is configured to float on the surface of the repair target (transfer target) 110 by a small floating distance (for example, 5 to 20 μm). Of course, the value of the fine flying distance is appropriately designed based on the number and arrangement of the pressure air injection holes provided in the transfer plate 14, the flow rate of the pressure air, the vertical movement resistance in the holder support mechanism, the weight of the transfer plate holder and the transfer plate, etc. It is realized by doing.

  In this example, the transfer plate 14 is fixed to the lower surface of the transfer plate holder 13 with an adhesive. However, a suction pipe (not shown) is formed inside the transfer plate holder 13 so as to be flexible from an external intake source. The transfer plate 14 may be sucked and held on the lower surface of the transfer plate holder 13 by communicating the suction tube and the suction hole on the lower surface of the transfer plate holder. In addition, as a mechanism for holding the transfer plate 14 on the lower surface side of the transfer plate holder 13, a known mechanism that satisfies such a holding function can be appropriately employed.

  The transfer plate holder 13 is allowed to move only in a predetermined upper and lower limit range while maintaining a horizontal posture while restricting movement in the horizontal direction in the space 11c while restricting movement in the horizontal direction. Needless to say, the mechanism is not limited to the leaf spring support structure, and various known mechanisms that achieve the same purpose can be employed.

  As another example other than the leaf spring support structure, the inner peripheral surface of the void 11c of the transfer head body 11 in which the transfer plate holder 13 is accommodated, and the outer peripheral surface of the transfer plate holder 13 accommodated in the void 11c. A steel ball bearing mechanism, a resin bearing mechanism, a fluid bearing (pneumatic bearing) and the like that allow the transfer plate holder 13 to move smoothly up and down while maintaining a horizontal posture are interposed between the bearings. A structure that restricts vertical movement through an appropriate upper and lower limit stopper mechanism can be given.

  At two locations on the outer peripheral surface of the transfer plate holder 13, pressurized air inlet holes (not shown) are provided. On the lower surface of the transfer plate holder 13, as shown in FIG. A plurality of compressed air outlet holes are arranged in an annular arrangement in alignment with 14a. An annular internal passage is formed between the inlet hole and the outlet hole. Further, the connectors 15e and 15f existing on the outer peripheral surface of the transfer plate holder 13 are fixed to a pressurized air inlet on the transfer plate holder 13 side.

  Two connectors 15c and 15d are fixed to the inner peripheral surface of the space 11c provided in the support portion 11b, and two connectors 15a and 15b are fixed to the outer peripheral surface of the support portion 11b. Here, the connector 15a communicates with the connector 15c, and the connector 15b communicates with the connector 15d. The connector 15e and the connector 15c are connected via a flexible tube 16a, and the connector 15f and the connector 15d are similarly connected via a flexible tube 16b. Since the connector 15a and the connector 15b are respectively formed with plugs for connecting tubes, by inserting a flexible tube from a pressure air source (not shown) into the connector 15a and the connector 15b, compressed air is supplied from the support portion 11b to the inside of the transfer plate holder 13. Can be supplied.

  A plurality of pressurized air injection holes 14a are arranged on the back surface of the transfer plate 14 at appropriate intervals along the circumference. When pressurized air is supplied from the connectors 15 a and 15 b, the supplied pressurized air passes through a passage in the transfer plate holder 13, and then is jetted from the lower surface of the transfer plate holder 13 to the lower surface of the transfer plate 14. The ink is supplied to the hole 14 a and is jetted downward from the ejection hole 14 a on the lower surface of the transfer plate 14 toward the transfer target object 110, whereby the transfer plate 14 floats with respect to the transfer target object together with the transfer plate holder 13. At this time, the pressure of the jetted air is set so that a fine gap of 5 to 20 μm is generated between the lower surface of the transfer plate and the transfer object.

  In order to allow the transfer plate 14 to stand up with respect to the transfer object 110 together with the transfer plate holder 13, the pressure air injection hole is not shown in FIG. As shown, it may be ejected downward from the lower surface of the transfer plate holder 13.

  That is, in the example of FIG. 9, a plurality of pressurized air injection holes 13 c, 13 c... Are arranged on the lower surface of the transfer plate holder 13 so as to surround the circular transfer plate 14. The pressurized air injection holes 13c, 13c, ... communicate with the connectors 15e, 15f. Therefore, in the same manner as in the example of FIG. 8, by supplying pressurized air from the connectors 15a and 15b, the pressurized air is ejected from the pressurized air injection holes 13c, 13c. 14 can be lifted. The ON / OFF control of the pressure air injected from the pressure air injection holes 14 a and 13 c on the lower surface of the transfer plate 14 or the lower surface of the transfer plate holder 13 is performed by a pressure air injection control valve 74 (in the middle of the pressure air pipe leading to the transfer head 1. (See FIG. 10).

  Next, the configuration of the control unit for controlling the operation of the wiring pattern repairing apparatus will be described. FIG. 10 is a block diagram schematically showing the configuration of the control unit.

  As shown in the figure, this control unit is mainly composed of a microcomputer. As is well known to those skilled in the art, the microcomputer 7 includes a microphone processor (MPU) that controls the entire apparatus, a ROM that stores system programs for realizing various control functions, and a microprocessor. The RAM includes a RAM for providing a work area for executing the system program, and various other external support circuits.

  As already described with reference to FIGS. 1 to 4, the microcomputer 7 includes a head positioning mechanism 2 that can three-dimensionally position the transfer head, and a laser source 4 that emits a laser beam for transfer. A focusing point height positioning mechanism 5 for positioning the laser irradiation optical system 3 in the vertical direction, a focusing light source 6 for performing automatic focusing determination at the time of photographing by the electronic camera 38, and a laser beam An electronic camera 38 focused on the irradiation point, a beam shaping mechanism 39 for shaping the beam cross section of the laser beam 41 or the mark beam 61, and communication control for receiving coordinate data corresponding to a repair location from the outside. Unit 71, operation unit 72 composed of numeric keys and function keys for performing various input / output operations, Display unit 73 for performing various guide displays during force operation, a pressure injection control valve 74 interposed in the middle of the pressure piping to the transfer head 1, and positioning control of the laser transfer unit 100 in the horizontal plane. The unit positioning mechanism 130 for performing is connected.

  Next, FIG. 11 shows a general flowchart showing the entire processing of the microcomputer 7 constituting the wiring pattern repairing apparatus. In the figure, when processing is started, first, in step 1101, the XY coordinates of the origin in the unit positioning mechanism 130 are received from the host device (not shown) via the communication control unit 21. On the unit positioning mechanism 130 side, a unique coordinate system is maintained by performing a known reset process. On the other hand, since the host device side also has its own coordinate system, it is necessary to match these coordinate systems, and the XY coordinate information of the origin from the host device is used for this matching process.

  In the subsequent step 1102, similarly, the XY coordinates of the repair position are received from the host device or the like. The XY coordinates are determined on the premise of the coordinate system on the host device side. However, since the calibration processing of the coordinate system is completed, the XY coordinates of the received repair position are the XY coordinates of the coordinate system after calibration. Is converted to

  In the subsequent step 1103, the laser transfer unit 140 is positioned so that the objective lens 31 is located immediately above the repair position specified by the XY coordinates after calibration. This positioning operation is performed via the unit positioning mechanism 130.

  Thus, if the laser transfer unit 140 is positioned so that the objective lens 31 is directly above the repair position, the first surface on which the repair object is to be measured and the second surface on which the transfer plate is to be measured. The transition to the two-surface measurement process is performed.

  In this two-surface measurement process, first, in step 1104, the distance (A) between the reference height (Href) and the repair object (transfer object) 110 is measured. The details of the distance (A) measurement process are shown in the flowchart of FIG. 12, and the outline of the distance (A) measurement process in the two-surface measurement process is shown in the explanatory diagrams of FIGS.

  When the processing is started in FIG. 12, first, in step 1201, as shown in FIG. 20, the transfer head 1 is moved from the transfer position to the retracted position as indicated by the arrow, for example, horizontally by a distance La. Is executed. The movement process of the transfer head 1 is performed by driving and controlling the head positioning mechanism 2 by the microcomputer 7.

  In subsequent steps 1202 to 1204, as indicated by arrows in FIG. 21, for each objective lens 31, the irradiation optical system 3 is lowered by a unit distance (step 1202), and the unit distance is added (step 1203). And a series of processes such as a process for reading the camera focus determination output (step 1204), and a process for determining whether or not the camera is in focus (step 1205) is repeatedly executed based on the camera focus determination output. The If it is determined that the subject is in focus while repeating the above (step 1205 YES), as shown in FIG. 22, the addition result is the distance (A) between the reference height (Href) and the repair object 110. Is stored (step 1206).

  Thus, in the distance (A) measurement process (step 1104) corresponding to the first descent distance measuring means of the present invention, as shown in the flowchart of FIG. 12 and the process explanatory diagrams of FIGS. In the state where the transfer head 1 is retracted to a predetermined standby position via the head positioning mechanism 2 (see FIG. 21) so that there is nothing to block the irradiation optical axis of the laser irradiation optical system 3. By controlling the light spot height adjusting mechanism 3, the laser condensing point P is added while adding the descending distance (step 1203) and monitoring whether or not the electronic camera 38 is in focus (step 1204 １２０ 1205). Is lowered (step 1202), and the distance as an addition result in the focused state (see FIG. 22) is determined from the predetermined reference height (Href) to the object to be transferred 110. Storing lowering distance as (A) up to Utsushimen (step 1206), and than is the series of processes is executed it said.

  Subsequently, returning to FIG. 11, as the measurement process of the second surface, a process of measuring the distance (B) between the reference height (Href) and the transfer plate is executed (step 1105). The details of the distance (B) measurement process are shown in the flowchart of FIG. 13, and the outline of the distance (B) measurement process in the two-plane measurement process is shown in the explanatory diagrams of FIGS.

  When the process is started in FIG. 13, first, in step 1301, as shown by an arrow in FIG. 22, a process of moving (returning) the transfer head 1 from the retracted position to the transfer position is executed (step 1301). . This process is also performed by driving and controlling the head positioning mechanism 2 by the microcomputer 7. In subsequent steps 1302 to 1305, as indicated by arrows in FIG. 23, the irradiation optical system 3 is raised by unit distance for each objective lens 31 (step 1302), and the unit distance is subtracted (step 1303). In addition, while repeatedly executing a series of processes such as reading the camera focus determination output (step 1304), the process of determining whether or not the camera is in focus (step 1305) is repeated based on the focus determination output of the electronic camera 38. Executed. If it is determined that the subject is in focus while repeating the above (step 1305 YES), the subtraction result is the distance (B) between the reference height (Href) and the repair object 110 as shown in FIG. Is stored (step 1306).

  Thus, in the measurement process (step 1105) of the distance (B) corresponding to the second descent distance measuring means of the present invention, the measurement of the laser irradiation optical system 3 is performed following the measurement by the first descent distance measuring means. In a state where the transfer head 1 is returned to a predetermined operation position via the head positioning mechanism 2 (see FIG. 23) so that the outgoing optical axis C21 is blocked by the transfer plate 14, the condensing point height adjusting mechanism 5 , The height of the laser focusing point P is increased while subtracting the ascending distance (step 1303) and monitoring whether or not the electronic camera 38 is in focus (steps 1304 and 1305). (Step 1302), the distance as the subtraction result when there is focus is stored as the descending distance (B) from the predetermined reference height (Href) to the transfer material thin film (Step 1). 06), and than is the series of processes is executed it said.

  Returning to FIG. 11, according to the above-described procedure, the descending distance (A) from the predetermined reference height (Href) to the transfer target surface of the transfer object 110 and the predetermined reference height (Href) to the transfer material thin film. Then, the height direction positioning processing of the transfer plate 14 is started.

In the height direction positioning process of the transfer plate 14, first, as shown in FIG. 32A, based on the descending distance (A) and the descending distance (B) from the measured reference height (Href). In addition, a process of calculating the distance (X) between the transfer plate 14 and the repair object 110 by the following equation (1) is executed (step 1106).

X = A−B (1)


If the distance (X) between the transfer plate and the repair object is calculated in this way, then, as shown in FIG. 32 (b), the lower surface of the transfer plate 14 has a first target height ( The process of lowering the transfer head body 11 at a high speed is executed by the amount of the descending distance (X−H1) until reaching H1) (step 1107).

  Details of the high-speed descent process to the first target height (H1) are shown in FIG. In the figure, when the process is started, first, in step 1401, (X-H1) is set as the descent target distance, and the descent distance is reset to zero. Thereafter, the transfer head body is lowered at a high speed by a unit distance (step 1402), and the lowering distance is added by a unit distance (step 1403), and each time the lowering distance reaches the target distance (X-H1). The process of determining whether (step 1404) is repeatedly executed until it is determined that the descent distance has reached the target distance (X-H1). During this time, if it is determined that the descent distance has reached the target distance (X-H1) (step 1404 YES), the descent is stopped as shown in FIG. 32B (step 1405).

  In this way, in the high speed descent process (step 1107) to the first target height (H1) corresponding to the first transfer head descent control means, the head positioning mechanism 2 is driven and controlled as shown in FIG. As a result, the transfer distance is integrated until the total distance reaches the lower distance {(AB) -H1)} to the first target height (H1) while integrating the lower distance (step 1403). A process of lowering at a predetermined high speed (step 1402) is executed.

  Returning to FIG. 11, when the high-speed descent process (step 1107) to the first target height (H1) is completed, then, as shown in FIG. 33, the lower surface of the transfer plate 14 is moved to the second target height ( A process of lowering the transfer head body 11 at a high speed is executed by the amount of the descending distance (X-H1-H2) until reaching H2) (step 1108).

  Details of the low-speed descent process to the second target height (H2) are shown in FIG. In the figure, when the process is started, first, in step 1501, a process of setting (X-H1-H2) as the target descent distance is executed. Subsequently, after the pressure air injection control valve 74 is switched from the off state to the on state to start the pressure air injection (step 1502), the transfer head body 11 is lowered at a low speed by a unit distance (step 1503), and the distance of the drop is reduced. Is added by the unit distance (step 1504), and in each case, the process of determining whether or not the descent distance has reached the target distance (X-H1-H2) (step 1505), the descent distance is the target distance (X-H1). It is repeatedly executed until it is determined that -H2) has been reached. During this time, if it is determined that the descent distance has reached the target distance (X-H1-H2) (step 1505 YES), the descent is stopped as shown in FIG. 33B (step 1506).

  Here, the value of the second target height (H2) is set to a height (for example, about 100 μm from the upper surface of the repair object (transfer object) 110) at which the self-lifting action of the transfer plate by the pressure air jet functions. ing. Therefore, as shown in FIG. 33B, the transfer head body 11 is lowered after the lower surface height of the transfer plate 14 reaches a predetermined height Hx (H2 <Hx <H1), but the transfer plate 14 33 floats together with the transfer plate holder 13, and as shown in FIG. 33 (b), a fine gap (for example, a laser transfer) between the repair target (transfer target) 110 and the transfer plate 14 is used. 5 to 20 μm) is secured.

  As described above, the pattern surface of the liquid crystal display device or plasma display device that is the repair object 110 has micron-order irregularities, and the electronic camera 38 performs optical processing in the processing of FIGS. 12 and 13. For the distances (A) and (B) that are measured automatically, an error of microns to several tens of microns is unavoidable for reasons of measurement principles. However, the transfer plate 14 is supported together with the transfer plate holder 13 so as to be movable up and down within a predetermined upper and lower limit range with respect to the transfer head body 11, and the transfer plate 14 floats by pressure air jet together with the transfer holder 13. Therefore, if the allowable range of movement of the transfer plate holder 13 is set so as to absorb the expected error, the target descent distance (X−H1) corresponding to the target heights (H1) and (H2) is assumed. ), (X-H1-H2) has a relatively large error. Therefore, the target descent distance (X-H1-H2) by the open loop control is too large, and the transfer plate 14 is the surface of the repair object 110. Even if it tries to collide, the transfer head body 11 continues to descend as shown in FIG. 33 (b) by the self-levitation action by the pressure air injection, while the transfer plate 14 floats. , The transfer plate 14 collide with the surface of the repair target 110, issues said Damaging the circuit pattern of the surface will not be caused.

  Returning to FIG. 11, in the subsequent step 1109, a process of positioning the height of the laser focusing point P to the height of the lower surface transfer material thin film of the transfer plate 14 is executed. The details of the laser focusing point positioning process on the transfer plate 14 are shown in FIG.

  When the processing is started in the figure, the laser irradiation optical system 3 is lowered by a unit distance for each objective lens (step 1601), and the camera focus determination output is read (step 1602). The process of determining whether or not (step 1603) is repeatedly executed. During that time, if it is determined that the subject is in focus (step 1603 YES), the descent of the laser irradiation optical system 3 is stopped (step 1604).

  Thereafter, returning to FIG. 11 again, the transfer material thin film transfer process is executed toward the repair object 110 by executing the beam shaping process and the one-shot drive process of the laser source (step 1110). At this time, the cross section of the laser beam is shaped into an elongated rectangular shape having a line width and a predetermined line length constituting the circuit pattern to be repaired. An elongated rectangular transfer material thin film having a predetermined film thickness is deposited.

  At this time, if the film thickness of the transfer material thin film is insufficient in one laser shot, the entire transfer head 1 is shifted horizontally by one pitch while maintaining the height of the transfer plate 14, and then the laser is re-executed. By repeating the shot processing as many times as necessary, a transfer film having a required film thickness is formed at the repair location. Even when the entire transfer head 1 is shifted horizontally by one pitch, the self-levitation action works and the distance between the transfer plate 14 and the repair object 110 is maintained at a necessary gap (for example, about 5 to 20 μm). During the horizontal movement, there is no possibility that the transfer plate 14 collides with the surface of the repair object 110 and breaks it.

  Furthermore, as described above, since the self-lifting function by the pressure air injection is incorporated in the transfer head 1, as described above, for example, as illustrated in FIG. 34, the case where the surface of the repair target 110 is greatly undulated has been described above. By executing the processes of FIGS. 11 to 16, a gap (for example, 5 to 20 μm) necessary for laser transfer between the transfer plate 14 and the repair target object 110 at any location on the repair target object 110. Can be maintained.

  The above processing (FIGS. 11 to 16) will be described together. When the wiring pattern repairing device performs repairing work, first, the unit positioning mechanism 130 is operated and the objective lens included in the laser transfer unit 140 is operated. 31 is positioned directly above the repair location (steps 1101 to 1103). For this positioning, open-loop positioning control based on the XY coordinates of the repair location and the XY coordinates of the optical axis of the objective lens 31, and the location of the repair location obtained by image processing of the video of the electronic camera 38 and the electronic camera Servo loop positioning control that is performed while measuring the distance from the reference point in the field of view is also used.

  If the optical axis of the objective lens 31 is positioned directly above the repair location, the head positioning mechanism 2 is then operated to retract the optical axis from the transfer position that blocks the optical axis of the objective lens 31. After the transfer head 1 is retracted (step 1201), the entire laser irradiation optical system 3 is lowered (step 1202), and the focus determination output of the electronic camera 38 is monitored (steps 1204 and 1205). The distance (A) from the predetermined reference height (Href) to the upper surface of the repair target is measured from the descent distance up to the matching point (steps 1203 and 1206).

  Next, after the head positioning mechanism 2 is actuated again and the transfer head 1 is returned from the retracted position where the optical axis of the objective lens 31 is not blocked to the transfer position where the optical axis of the objective lens 31 is blocked (step 1301), In the same manner as before, while raising the entire laser irradiation optical system 3 (step 1302), the focus determination output of the electronic camera 38 is monitored (steps 1304 and 1305), and from the ascending distance until the point of focus, The distance (B) from the predetermined reference height (Href) to the upper surface of the repair target is measured (steps 1303 and 1306).

  Next, after calculating the distance (X) {(A)-(B)} between the transfer plate and the repair object based on the distance (A) and the distance (B) (step 1106), the repair object is obtained. The height from the surface to the transfer plate 14 (H1: about 5 mm) is set as the first target height (step 1401), and the transfer head body 11 is controlled by open loop control by the descending distance (X-H1) up to that point. Lower (step 1402).

  If the transfer head body 11 is lowered by open loop control by the descending distance (X-H1) (YES in steps 1404 and 1405), then the height from the repair target surface to the transfer plate 14 (H2: about 100 μm). Degree) is set as the second target height (step 1501), while the pressurized air is injected (step 1502), only the descending distance (X-H1-H2) until then (steps 1504 and 1505) Lower by open loop control (steps 1503 and 1506).

  At this time, since the second target height (H2) is set within a height region (for example, about 100 μm) where the self-lifting action by the pressurized air injection starts to operate, the transfer head body 11 is set to the second target height (H2). The transfer plate holder 13 floats by itself relative to the transfer head body 11 while descending to the height (H2). Therefore, even if there is some error in the open loop control for approaching the first and second target heights, or even if the surface height fluctuates due to the repair object side, the transfer head 1 is lowered. In this process, it is possible to reliably avoid the possibility that the transfer plate 14 collides with the repair object and damages the surface, and the distance between the transfer plate 14 and the repair object is determined by the self-levitation action by the pressurized air injection. Therefore, the optimum range (for example, 5 to 20 μm) is maintained by appropriately setting the pressure or flow rate of the pressurized air.

  Thereafter, by driving the laser source 4 (step 1110), when the laser beam is irradiated with one shot, a thin film of a transfer material corresponding to the irradiation spot (for example, a line shape) is transferred to the repair target portion, and if necessary While the proximity distance is maintained, the transfer head 1 is shifted in the horizontal direction by a predetermined pitch, and the above one-shot irradiation is repeated a plurality of times.

  Then, a plurality of thin films of the transfer material are laminated at the repair target portion, and a necessary lamination thickness is obtained. During this horizontal shift, pressure air such as nitrogen gas is injected, so that the transfer portion is cooled and the gap is maintained at the same time. It is possible to prevent a situation in which a collision occurs and this is destroyed.

  As described above, according to the transfer head 1 of the present invention, the distance between the transfer plate 14 and the transfer object 110 can be kept at a predetermined fine distance by jetting pressurized air, so that the Z direction As for the electrical control via the drive unit 23, it is only necessary to roughly control until the transfer plate approaches the transfer target to some extent, and thereafter, the floating action by the gas injection acts on the transfer plate. Can be safely brought close to the transfer object, so even if there are many defective parts on the display device to be repaired, the transfer head must move to those parts sequentially at high speed. The process of lowering 1 can be repeated at high speed, and there is an advantage that the tact time of this kind of work can be greatly shortened.

  By the way, in the two-surface measurement processing described with reference to FIGS. 20 to 24, transfer is performed between the transfer position and the retracted position in order to retract the entire transfer head from the outgoing optical axis C <b> 21 for each repair location. The head 1 must be moved in the horizontal direction by a relatively large distance La, which causes a reduction in tact time.

  Such a problem can be solved by providing a viewing window penetrating vertically in the region of the transfer head 1 (that is, a part of members constituting the transfer head 1). The position of the viewing window is provided on the transfer head body 11 itself, on the transfer plate holder 13 supported by the transfer head body 11 so as to be movable up and down, or on the transfer plate 14 held on the lower surface of the transfer plate holder 13. Various configurations such as providing (see FIG. 25 and FIG. 26), or providing in the gap between the transfer head body 11 and the transfer plate holder 13 (see FIG. 6) can be adopted.

  FIG. 25 shows a first example of the configuration of the viewing window on the transfer plate. In this example, the transfer plate 14 is formed in a circular shape, and a viewing window 14c is provided at the center thereof. Reference numeral 14e denotes a region where the transfer thin film is present. As for the observation window 14c, as shown in FIG. 25A, the transfer material thin film 14b is provided with a local thin film missing portion 14d, or as shown in FIG. 25B, the transfer plate 14 is formed. A through-hole 14f may be formed in the plate-shaped small piece 14a itself constituting the structure.

  Further, as shown in FIG. 26A, a plurality of viewing windows 14c may be arranged concentrically, for example, or as shown in FIG. 26B, an elongated rectangular shape extending in the vertical direction in the figure. May be arranged in the center of the transfer plate 14. According to the example in which a plurality of concentric circles are arranged, the moving distance to the retreat position is even shorter because the observation window 14c is always present at a short distance regardless of the angular position of the transfer position. Become. Further, according to the example in which the elongated shape is arranged at the center, the transfer position can be always moved to the retracted position by moving the outgoing optical axis C21 in the left-right direction regardless of the transfer position. And movement control becomes easy.

  FIGS. 27 to 31 are explanatory diagrams of the two-surface measurement process in the case where such a viewing window is provided. Since these drawings correspond to FIGS. 20 to 24 in the normal two-surface measurement process described above, refer to the description of FIGS. 20 to 24 for the operation thereof. Specifically, FIGS. 20 and 27, FIGS. 21 and 28, FIGS. 22 and 29, FIGS. 23 and 30, and FIGS. 24 and 31 correspond to each other.

  That is, in this example, the distance between the transfer position and the retracted position is Lb (Lb << La), and the time for moving between the transfer position and the retracted position is greatly reduced, and the tact time is significantly shortened. can do.

  Note that the viewing hole of the electronic camera 38 is defined by the large-diameter hole portion 12c ′ of the arc-shaped punching hole 12c of the leaf spring 12 in the assembled state shown in FIG. 5 as described above with reference to FIG. Can also be realized.

  That is, the large-diameter hole portion 12c ′ of the arc-shaped punching hole 12c of the leaf spring 12 has a space between the outer peripheral surface recess 13d of the transfer plate holder 13 and the transfer head body 11 on its lower surface side as shown in FIG. Positioning is performed so as to be aligned with the gap between the inner peripheral surface of 11c. Therefore, in the assembled state shown in FIG. 5, the upper surface (transfer target surface) of the repair target object (transfer target object) 110 positioned below the large-diameter hole portion 12c ′ can be seen through, thereby increasing the size. The diameter hole portion 12 c ′ functions as a viewing hole for the electronic camera 38.

  Further, since the diameter of the peep hole (large-diameter hole portion 12c ′) is set sufficiently larger than the diameter of the laser beam passing through the peep hole, the diameter of the laser emission optical axis C21 is not limited to a mere peep hole. If the laser source is appropriately driven (one-shot drive, wobbling drive, etc.) in accordance with this, it is not a laser transfer process, but a laser cut process to remove part of the circuit pattern generated on the surface of the repair target Can also be used.

  On the other hand, in the two-surface measurement process described above (see FIGS. 12 and 13) and the condensing point positioning process for one-shot transfer (see FIG. 16), the condensing point P of the laser beam is applied to the surface of the irradiation object. Although accurate positioning is required, this greatly depends on the focus determination processing accuracy of the electronic camera 38. However, since the transfer material thin film on the transfer plate 14 that is the subject of the electronic camera 38 is a dark object having a uniform density and no pattern, when the electronic camera 38 takes an image of the transfer material thin film, it is on the light receiving surface of the image sensor. However, it is difficult to obtain a light image having a clear contrast.

  As shown in FIG. 35, the problem is that a focus adjustment mark is displayed on the transfer plate 14, and the determination as to whether or not the electronic camera is focused can be clearly distinguished from the transfer material thin film. This can be solved by performing based on the image of the focus adjustment mark displayed on the transfer plate.

  As shown in FIGS. 35 and 36, the focus mark is displayed by forming a line or dotted thin film absent portion in the transfer material thin film deposition area of the transfer plate 14 as shown in FIGS. In the case of drawing, as shown in FIG. 37, the mark beam 61 from the focusing mark light source 6 is subjected to cross-sectional shaping via mask plates 391 a and 391 b and 395 a and 395 b constituting the beam shaping mechanism 39. And a case where a clear optical image corresponding to the focus adjustment mark is drawn on the transfer plate.

  That is, in the example of FIG. 35, the focusing mark 14f is drawn at the center of the transfer plate 14. The focus mark 14f is a cross mark as shown in FIG. It should be noted that in the figure, black and white shading is shown inverted for convenience of explanation.

  On the other hand, in the example of FIG. 36, by drawing the X-direction partition line 14h and the Y-direction partition line 14i on the transfer plate 14, a clear square-shaped partition is displayed on the transfer plate. Yes. Since this type of laser transfer process is usually performed in each section partitioned vertically and horizontally on the transfer plate, if such partition lines 14h and 14i are used as focusing marks, a transfer optical axis is used. It is also suitable for the positioning work of C21. In FIGS. 35 and 36, reference numeral 14g denotes an injection hole for pressurized air injection.

  Further, in the example of FIG. 37, the mark beam 61 from the focusing light source 6 is subjected to transfer by shaping the cross section through the mask plates 391a, 391b and 395a, 395b constituting the beam cross section shaping mechanism 39. A clear light image 14j corresponding to the focus adjustment mark is drawn on the plate 14.

  As for the processing of the microcomputer for shaping the cross section of the mark beam 61, in the case of the two-surface measurement processing shown in FIGS. 12 and 13, as shown in FIGS. An alignment light source on process (steps 1207 to 1307) and a beam shaping process (steps 1208 and 1308) may be added, while the laser focusing point positioning process on the transfer plate for the laser shot shown in FIG. In this case, as shown in FIG. 19, a focusing light source on process (step 1605) and a beam shaping process (step 1606) may be added separately.

  According to such a configuration, whether or not the electronic camera is in focus is determined based on the image of the focusing mark displayed on the transfer plate so as to be clearly distinguishable from the transfer material thin film. Therefore, the accuracy of the focus match determination process by the electronic camera 38 is improved. As a result, after the transfer plate is brought close to the transfer surface, prior to irradiating the transfer plate with the laser beam, the laser focusing point is positioned at the height of the transfer plate. The positioning accuracy is improved, and even when the height of the transfer plate is measured before the transfer plate is brought close to the transfer surface, the positioning accuracy is improved, which contributes to the performance improvement of the laser repair device. is there.

  According to the present invention, in this type of laser transfer apparatus represented by a laser repair apparatus, a predetermined low position for transfer processing (for example, from a predetermined high position for movement from a defective part to a defective part) The transfer plate can be lowered at high speed and accurately to an approach distance of 5 to 20 μm), and can be kept stationary without colliding with the transfer object.

It is an external appearance perspective view of the whole wiring pattern repair apparatus with which this invention was applied. It is an external appearance perspective view of a laser transfer unit. It is explanatory drawing which shows an example of a beam shaping mechanism. It is a typical block diagram which shows a laser transfer unit centering on a laser irradiation optical system. It is an external perspective view of a transfer head. It is a disassembled perspective view of a transfer head. It is a top view of a transfer head. FIG. 3 is an external perspective view (No. 1) of a transfer head in an upside down state. FIG. 6 is an external perspective view (No. 2) of the transfer head in an upside down state. It is a block diagram which shows the structure of a control part schematically. It is a general flowchart which shows the whole process of a wiring pattern repair apparatus. It is a flowchart which shows the measurement process of distance (A). It is a flowchart which shows the measurement process of distance (B). It is a flowchart which shows the high-speed descent process to 1st target height (H1). It is a flowchart which shows the low speed fall process to 1st target height (H2). It is a flowchart which shows the laser condensing point positioning process to a transfer board. It is a flowchart which shows the modification of the measurement process of distance (A). It is a flowchart which shows the modification of the measurement process of distance (B). It is a flowchart which shows the modification of the laser condensing point positioning process to a transfer board. It is explanatory drawing of the 1st process of a 2 surface measurement process. It is explanatory drawing of the 2nd process of a 2 surface measurement process. It is explanatory drawing of the 3rd process of a 2 surface measurement process. It is explanatory drawing of the 4th process of a 2 surface measurement process. It is explanatory drawing of the 5th process of 2 surface measurement processing. It is FIG. (1) which shows the structural example of the observation window on a transfer board. It is FIG. (2) which shows the structural example of the observation window on a transfer board. It is explanatory drawing of the 1st process of a 2 surface measurement process (modification). It is explanatory drawing of the 2nd process of a 2 surface measurement process (modification). It is explanatory drawing of the 3rd process of a 2 surface measurement process (modification). It is explanatory drawing of the 4th process of a 2 surface measurement process (modification). It is explanatory drawing of the 5th process of a 2 surface measurement process (modification). It is explanatory drawing (the 1) of the height direction positioning control of a transfer plate. It is explanatory drawing (the 2) of the height direction positioning control of a transfer plate. It is operation | movement explanatory drawing of the height direction positioning control of the transfer board which concerns on this invention. It is the structural example (the 1) of the transfer board devised for focusing. It is the structural example (the 2) of the transfer board to which the device for focusing was given. It is explanatory drawing of the mark mark for a focusing by the light source for a focusing. It is explanatory drawing of the laser transfer method used as the premise of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer head 2 Head positioning mechanism 4 Laser source 5 Condensing point height positioning mechanism 6 Focusing light source 7 Beam merger 11 Transfer head machine 11a Mounting portion 11b Support portion 11c Space 12 Leaf spring 12a Opening 12b Punching hole 12c Punching Hole 12d Screw hole 12e Screw hole 13 Transfer plate holder 13a Transfer window 13b Screw hole 14 Transfer plate 14a Injection hole 15a Connector 15b Connector 15c Connector 15d Connector 15e Connector 15f Connector 16a Flexible tube 16b Flexible tube 21 X direction drive part 22 Y-direction drive unit 23 Z-direction drive unit 31 Objective lens 32 Revolver 33 Rotary encoder 34 Beam separator 35 LED illuminator 36a Entrance 37 Lens barrel 38 Electronic camera 39 Beam shaping mechanism 41 Laser beam 5 Z-direction guide rails 52 drive motor 53 ball screw mechanism 61 mark beam 100 wiring pattern repairing apparatus 110 repair object (transferred object)
120 Stage 130 Unit positioning mechanism 131 X direction guide rail 132 Y direction guide rail 140 Laser transfer unit 140a Unit machine frame 391a, 391b First and second mask plates (X direction)
392a, 392b First and second slide blocks (X direction)
393a, 393b First and second rollers (X direction)
394 wedge block (X direction)
395a, 395b First and second mask plates (Y direction)
396a, 396b First and second slide blocks (Y direction)
397a, 397b First and second rollers (Y direction)
398 Wedge block (Y direction)
C1 common optical axis C2 laser irradiation optical axis C3 imaging optical axis C21 outgoing optical axis

Claims (2)

A transfer plate formed by depositing a transfer material thin film on the objective surface of a plate-like piece having laser transparency is arranged with a slight gap on the transfer target surface of the transfer object so that the transfer material thin film faces. A laser transfer apparatus for transferring a transfer material thin film corresponding to an irradiation position onto a transfer target surface of a transfer object by irradiating a laser beam from the upper surface side of the superposition and transfer plate,
A laser irradiation optical system including an objective lens for irradiating a laser beam incident from a laser source vertically to a target position on a transfer target surface of a transfer object;
On the lower surface side, the transfer plate is supported in a horizontal posture so as to be movable up and down, and on the upper surface side, a transfer window for exposing the transfer plate supported on the lower surface side is opened, and further, from the surface to be transferred of the transfer object When the aircraft is lowered and approached to a predetermined distance, a small gap necessary for transfer is formed between the transfer material thin film on the lower surface of the transfer plate and the transfer surface on the upper surface of the transfer object due to self-levitation by gas injection onto the transfer surface. A transfer head that is structured to hold
A head positioning mechanism capable of moving the transfer head up and down at least vertically;
First descent distance measuring means for measuring a descent distance (A) from a predetermined reference height to the transfer target surface of the transfer object;
A second descending distance measuring means for measuring a descending distance (B) from a predetermined reference height to the transfer material thin film on the lower surface of the transfer plate;
A distance calculating means for calculating a distance (A−B) between the transfer surface and the transfer material thin film from a drop distance (A) to the transfer surface and a drop distance (B) to the transfer material thin film;
By driving and controlling the head positioning mechanism, the transfer head is accumulated until the accumulated distance reaches the lowered distance {(AB) -H1)} to the first target height (H1). First transfer head lowering control means for lowering at a predetermined high speed;
By driving and controlling the head positioning mechanism, the descent distance is accumulated, and the accumulated distance is the descent distance {(AB) -H1-H2 to the second target height (H2) at which the self-levitation function functions. }, A second transfer head lowering control means for lowering the transfer head at a predetermined low speed until reaching
Thereby, prior to laser beam irradiation, the transfer plate can be guided by open loop control to a height having a fine gap necessary for transfer. For laser irradiation optics,
A condensing point height adjusting mechanism for adjusting the height of the laser condensing point;
Including an electronic camera that is always focused on a subject positioned at the height of the laser condensing point and has a function of determining whether or not it is in focus based on video output;
The first descent distance measuring means is:
Control the condensing point height adjustment mechanism in a state where the transfer head is retracted to a predetermined standby position via the head positioning mechanism so that there is nothing to block the irradiation optical axis of the laser irradiation optical system. Therefore, while adding the descent distance and monitoring whether or not there is focus through the camera, the height of the laser condensing point is lowered, and the distance as the addition result when there is a focus is determined according to a predetermined standard. It is structured to memorize as the descending distance (A) from the height to the transfer surface of the transfer object,
The second descent distance measuring means is
In a state where the transfer head is returned to a predetermined operation position via the head positioning mechanism so that the optical axis of the laser irradiation optical system is interrupted by the transfer plate following the measurement by the first descending distance measuring means. By controlling the focal point height adjustment mechanism, the height of the laser focal point is raised while focusing while subtracting the ascending distance and monitoring whether or not the focal point has passed through the camera. 3. The laser transfer apparatus according to claim 2, wherein the distance as a subtraction result is stored as a descending distance (B) from a predetermined reference height to the transfer material thin film.

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