JP2007148362A - Laser beam/uv-irradiation peripheral exposure apparatus and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam/UV irradiation peripheral exposure apparatus, capable of responding to a substrate, even if an identification mark is formed at any position in a peripheral region. <P>SOLUTION: The apparatus comprises a stage 2 for holding a substrate W; an imaging means 4 for imaging a preliminarily determined position of the substrate and a positioning mark, disposed corresponding to a preliminarily determined reference position on the stage for acquiring image data; a moving and carrying mechanism 3 for moving the stage; a laser beam unit 5 on a moving path of the moving and carrying mechanism and for irradiating the substrate with a laser beam; a UV irradiation unit 9 for irradiating the peripheral region of the substrate with a light containing UV rays from an irradiation port; and a control means 20 for controlling the moving and carrying mechanism so as to align the substrate, based on the image data acquired from the imaging means, and to simultaneously expose the identification mark with a laser beam and to expose the peripheral region with a light containing UV rays. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention irradiates a peripheral region formed around a pattern region of a substrate with a laser beam to mark (expose) an identification mark such as a symbol or a character, and irradiates the peripheral region with light containing ultraviolet rays. The present invention relates to a laser beam / ultraviolet irradiation peripheral exposure apparatus and method for performing exposure.

  In general, the substrate on which the pattern is exposed in the exposure apparatus is, for example, a liquid crystal substrate having a size of about 500 mm × 500 mm at the time, but currently having a size enlarged to 2160 mm × 2460 mm. It has come to be. A substrate that is cut and separated into individual pieces set in advance from the large substrate and mounted on a normal image receiving device is manufactured. When a board is cut and separated from a large state, for the purpose of management and management of the manufacturing process, characters, symbols or figures, or identification symbols consisting of a combination thereof, and separation positions are provided on each board. A cutting position identification code for discrimination or an alignment mark (hereinafter referred to as an identification mark) is formed by exposing the substrate before separation with a laser beam or the like in advance.

  Further, unnecessary photoresist ink existing in the peripheral region that is the periphery of the pattern region on the substrate becomes a hindrance in a later process, and thus needs to be exposed in advance. As described above, it is necessary to display the identification mark in the peripheral area including unnecessary photoresist ink, and this peripheral area is set with a predetermined width. And the position where the identification mark is formed in the peripheral area is not only in the case where it is arranged in the central part of the peripheral area, but in the vicinity of the pattern area in a certain place, in the part of the edge of the substrate, or Or near the pattern area on the opposite side.

  The substrate is exposed by the peripheral exposure device so that the pattern region is exposed, and then the peripheral region is exposed to remove unnecessary photoresist ink and to be easily processed when cut and separated into individual pieces. (For example, refer to Patent Documents 1 and 2).

  In the manufacturing process of the substrate, various exposure apparatuses such as an exposure apparatus that exposes the pattern area, a peripheral exposure apparatus that exposes the photoresist ink in the peripheral area, and an exposure apparatus that exposes (displays) the identification mark exist in the production line. First, after exposing the pattern area by the exposure apparatus, the laser irradiation exposure apparatus irradiates the laser in the peripheral area of the substrate to mark (expose) the identification mark, and then the peripheral exposure apparatus Generally, exposure is performed by irradiating a peripheral region with light containing ultraviolet rays having a predetermined wavelength.

  An exposure apparatus that marks an identification mark by laser irradiation performs the following operation as an example. That is, a laser beam is output from an exposure unit arranged above a stage on which a substrate is placed at a place where an identification mark formed in a peripheral region of the substrate is marked. Then, the stage on which the substrate is placed and the exposure unit are sequentially scanned in time series in the linear direction and the orthogonal direction orthogonal to the linear direction, and the irradiation position is shifted in the relative movement direction. Thus, the identification mark is marked by aligning the irradiation point on the substrate with a plane serving as orthogonal coordinates (see, for example, Patent Document 3).

  In this identification mark formation method (display method), the substrate coated with the photoresist ink and the laser beam are always exposed at a position where the laser beam is relatively positioned, and the identification mark has a predetermined width. Since marking is performed, the identification mark is exposed while always scanning a minute laser beam in an orthogonal direction orthogonal to the direction in which the stage moves linearly.

  An exposure apparatus having a configuration in which a light source for exposing unnecessary photoresist ink in a peripheral region of a substrate is set by changing a magnification of an exit end of a light guide has been proposed (for example, a patent document). 4). This exposure apparatus employs a method of changing the size of the image onto which the laser beam is projected in the adjustment process. By expanding or reducing the optical path to be projected locally, the light emitted from the light guide is adjusted. Since the width is controlled, the irradiated exposure light has a width that is enlarged or reduced symmetrically with respect to the center of the optical path.

Further, an exposure apparatus in which a peripheral exposure unit is provided on at least one of a fixed guide rail or a movable guide rail installed above a substrate has been proposed (see, for example, Patent Document 5).
Japanese Patent No. 2910867 Japanese Patent No. 3418656 Japanese Patent No. 3547418 Japanese Patent No. 3175059 Japanese Patent No. 3091460

However, the conventional peripheral exposure apparatus or identification mark exposure apparatus has the following problems.
(1) In the manufacturing process for exposing a substrate, the manufacturing line becomes longer as the size of the substrate increases, so that a conventional identification mark exposure device and a peripheral exposure device for exposing a peripheral region are provided. It is desired to shorten the production line by integrating from separate structures.
However, in each exposure apparatus, when the alignment operation of the substrate is performed, the absolute position is determined. Therefore, the alignment operation standards are different, and the configuration cannot be simply integrated.

  (2) Further, when the process of exposing the identification mark and the process of exposing the peripheral area are continuously performed, the moving speed of the substrate is affected by the exposure speed of any of the exposure processes. At this time, since the photoresist ink is adjusted so that the sensitivity is high at a wavelength close to the wavelength of the ultraviolet light, the energy of the laser beam is lower than the wavelength of the ultraviolet light with respect to the substrate moving at a constant speed. Since the irradiation is performed at a constant illuminance, the amount of ultraviolet light to be irradiated is too strong depending on the exposure range of the photoresist ink in the peripheral region, which may lead to overexposure, and it is necessary to solve these problems.

  (3) When exposing the photoresist ink in the peripheral area after exposing the identification mark in the peripheral area, the exposure apparatus must shield the part of the identification mark in order to prevent double exposure. In order to shield the peripheral area where the identification mark is exposed, the width to be shielded and the position to be shielded must be changed each time. However, as in Patent Document 4, when the exposure light to be irradiated is enlarged or reduced symmetrically with respect to the center of the optical path, the identification mark is located at a position near the pattern area from the center of the peripheral area. However, there is a case where the exposure is biased with respect to the moving direction of the stage.

  The present invention has been devised in view of the above-described problems, and a unit for irradiating a laser beam and irradiating ultraviolet rays in a peripheral region can be installed in one exposure apparatus, and an identification mark is located at any position in the peripheral region. It is an object of the present invention to provide a laser beam / ultraviolet irradiation peripheral exposure apparatus and method that can be applied even if formed.

  In order to solve the above problems, a laser beam / ultraviolet irradiation peripheral exposure apparatus (hereinafter referred to as this apparatus) according to a first aspect is preset to a stage for holding a substrate, a predetermined position and a stage of the substrate. Imaging means for capturing image data by photographing a positioning mark provided corresponding to the reference position, and a rotation direction, a movement direction, and a movement direction orthogonal to a perpendicular line perpendicular to the surface of the substrate A moving conveyance mechanism that moves the stage in the orthogonal direction, a laser beam unit that irradiates a laser beam on the movement path of the moving conveyance mechanism, and a position adjacent to the laser beam unit, and an ultraviolet ray is provided in the peripheral area of the substrate. The substrate is aligned based on the image data acquired by the ultraviolet irradiation unit that irradiates light containing the To perform a peripheral exposure simultaneously by light containing exposure and ultraviolet identifying mark by beam, and a control means for controlling the movement transfer mechanism.

  The apparatus according to the first aspect configured as described above calculates the substrate position by photographing and analyzing the positioning mark of the stage and the substrate (alignment mark or edge, etc.) by the photographing means, and the relative position by the moving conveyance mechanism. The substrate alignment work is performed. Then, after the alignment operation, exposure of the identification mark with the laser beam and peripheral exposure with the light containing ultraviolet rays can be performed simultaneously. Further, the configuration of the exposure of the identification mark by the laser beam and the peripheral exposure by the light including ultraviolet rays are integrated.

Further, in the present apparatus according to the second aspect, the ultraviolet irradiation unit is disposed so as to be movable in the orthogonal direction.
The present apparatus configured as described above can adjust the irradiation position of the ultraviolet irradiation unit to an appropriate peripheral area corresponding to the peripheral area which varies corresponding to the substrate size and the circuit pattern area.

Further, the image pickup means is movably arranged in the apparatus according to the third aspect.
This device configured in this way is a device that integrates identification mark exposure with a laser beam and peripheral exposure with light containing ultraviolet rays, even when the substrate size changes from lot to lot, and supports multiple substrate sizes. Thus, alignment work can be performed.

  A laser beam / ultraviolet irradiation peripheral exposure method (hereinafter referred to as “this method”) according to a fourth aspect captures a predetermined position of a substrate held on a stage and a reference position of the stage to obtain a substrate position of the substrate. And a detection step for detecting the reference position of the stage, an alignment step for aligning the substrate based on the result of the detection step, and after the alignment operation, the substrate is moved at a predetermined moving speed while being moved to the peripheral region of the substrate by the laser beam. And an exposure step of exposing the identification mark and irradiating the remaining peripheral area with light including ultraviolet rays.

  In this method configured as described above, the substrate position and the stage position are detected by analyzing image data obtained by imaging a predetermined position of the stage and the substrate. In this method, the alignment operation of the substrate is performed by the alignment step, and thereafter, the identification mark is exposed by the laser beam, and at the same time, the peripheral region of the substrate can be irradiated with light including ultraviolet rays.

Further, in the method according to the fifth aspect, the portion of the peripheral area where the exposure step exposes the identification mark is shielded.
In this method configured as described above, the portion where the identification mark is formed is shielded by the laser beam so that the identification mark is not erased by light containing ultraviolet rays.

In the method according to the sixth aspect, in the method according to the sixth aspect, the exposure step determines the intensity of the laser beam applied to the substrate and the irradiation amount of light including ultraviolet rays based on the moving speed of the substrate. When laser beam irradiation and ultraviolet light irradiation are simultaneously performed in the respective peripheral regions of the substrate, insufficient exposure or overexposure of the identification mark by the laser beam, and insufficient exposure or exposure by the light including ultraviolet light Overexposure can be prevented.

In the method according to the seventh aspect, the exposure step includes rotating the substrate by 90 degrees after exposing the identification mark with a laser beam from one end to the other end in one direction of the substrate and performing peripheral exposure with light including ultraviolet rays. Thus, exposure of the identification mark with a laser beam and peripheral exposure with light including ultraviolet rays are performed from one end of the substrate to the other end in a direction orthogonal to one direction.
In this method as described above, it is not necessary to rotate the direction of the substrate by 90 degrees after unloading the substrate to the outside during irradiation of the laser beam unit or the ultraviolet irradiation unit, and then load the substrate into the apparatus again. For this reason, exposure accuracy can be improved.

Further, in the present method according to the eighth aspect, the exposure step includes the movement speed and movement of the substrate at the time of exposure based on the alignment position of the aligned substrate and the previously input product data indicating the product type of the substrate. Calculate the position.
Product type data (for example, substrate size, shape, position of peripheral area, position and shape of identification mark, etc.) is input in advance, and the substrate is irradiated with a laser beam based on the product type data and alignment position. It can also correspond to a start position or an exposure start position by ultraviolet light. In this method, the moving speed of the substrate during exposure can also be adjusted.

The laser beam / ultraviolet irradiation peripheral exposure apparatus and method according to the present invention have excellent effects as described below.
In this apparatus, the identification mark is exposed to the peripheral area of the substrate by a laser beam, and the peripheral area is exposed by irradiating the peripheral area with light containing ultraviolet light while being concealed by an integrated apparatus. Can do. Therefore, this apparatus can save the installation space in a production line. Furthermore, this apparatus can relatively perform alignment work by confirming the position of the stage and the position of the substrate, and can perform the alignment work in a wide range and quickly.

The best mode for carrying out a laser beam / ultraviolet irradiation peripheral exposure apparatus and method according to the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view schematically showing the inside of a laser beam / ultraviolet irradiation peripheral exposure apparatus with a part thereof omitted, and FIG. 2 is a part of the laser beam / ultraviolet irradiation peripheral exposure apparatus omitted. FIG. 3A and FIG. 3B are plan views showing an example of a substrate used in a laser beam / ultraviolet irradiation peripheral exposure apparatus, and FIG. 4 shows a laser. It is a side view which shows the stage of a beam and ultraviolet irradiation peripheral exposure apparatus.

  As shown in FIG. 1, a laser beam / ultraviolet irradiation peripheral exposure apparatus (hereinafter referred to as “this apparatus”) 1 includes a stage 2 that holds a substrate W to be loaded, and a substrate W and a stage that are held by the stage 2. 2 is a periphery of the pattern area Wp of the substrate W transported by the moving transport mechanism 3, the image transporting mechanism 4 that transports or moves the substrate W held on the stage 2, The laser beam unit 5 that exposes the identification mark M in the peripheral region Wc, and the light (hereinafter referred to as “the ultraviolet light having a predetermined wavelength) in the other peripheral region Wc while shielding the identification mark M exposed in the peripheral region Wc of the substrate W. An ultraviolet irradiation unit 9 for irradiating an ultraviolet light), a moving conveyance mechanism 3, a laser beam unit 5, and a control mechanism 20 for controlling the ultraviolet irradiation unit 9. It has to.

  As shown in FIGS. 3A and 3B, the substrate W is formed in a square shape, for example, forms a pattern region Wp of 2 rows and 3 columns, and a peripheral region Wc around each pattern region Wp. Is forming. The peripheral area Wc of the substrate W becomes a cutting allowance for cutting and separating each pattern area Wp, and a symbol, a character, a figure, or a combination thereof (hereinafter referred to as an identification mark) is formed. It is an area to be done. Here, the peripheral region Wc of the substrate W is formed here so that the identification marks M (M1, M2) are formed in the vertical and horizontal directions, and the irradiation areas of the respective identification marks M are equal. .

  As shown in FIGS. 1 and 4, the stage 2 is for holding the substrate W, and includes a base 2 a supported by the moving transport mechanism 3 and a support column 2 b erected on the base 2 a. In addition, a suction opening 2c formed at a position where the support pillar 2b and the substrate W face each other, and a positioning mark 2d for detecting the position of the stage 2 are provided.

  Here, the base 2a is formed in a flat rectangular parallelepiped having a plane having an area equal to or larger than the area of the substrate W to be handled, and a plurality of support columns 2b are orthogonal to the plane of the base 2a ( (Vertical direction). As long as this base 2a can support the some support pillar 2b in the orthogonal | vertical direction, it will not specifically limit about the shape, for example to make a disk shape etc., for example. In addition, it is convenient that the base 2a is provided in advance with a portion where the support pillars 2b are detachably installed in a grid pattern so that the number and positions of the support pillars 2b can be adjusted according to the size of the substrate W. Is good.

  The support pillar 2b is for abutting the substrate W and holding the substrate horizontally (a plane perpendicular to the vertical direction), and a plurality of support pillars 2b are installed on the base 2a at a predetermined height from the base 2a. Has been. Here, since the support pillar 2b assumes a robot hand (not shown) for carrying the substrate W, the back surface of the substrate W is held by two forks (not shown) of the robot hand. A plurality of them are arranged in a line in a state where a linear space that can be transferred by the fork is opened and the level of the substrate W can be maintained when it is carried in.

  In addition, the support pillar 2b is formed in a flat shape here at the tip position where it abuts against the substrate W, and a suction opening for holding the substrate W by vacuum suction on the planar portion. It has a part 2c. The suction opening 2c is provided in a state where it is communicated with a vacuum suction mechanism (not shown). The suction openings 2c may be formed in all the support columns 2b, or may be formed in the support columns 2b at predetermined positions as long as the substrate W can be held.

  The positioning mark 2d is erected on the plane side of the base 2a of the stage 2 so as to correspond to the reference position of the imaging means 4, or is erected along the side surface of the base 2a (see FIG. 2). It is formed at the tip of the column. The positioning marks 2d are formed, for example, as cross marks on the substrate side, which is the tip of the support column, and are formed at least at three locations, but the number corresponding to the number of the imaging means 4 (four in this case) May be installed. The shape and the installation height of the positioning mark are not particularly limited. Here, the positioning mark 2d is disposed inside the substrate surface because the substrate W is transparent. However, the positioning mark 2d is not transparent because the substrate W is covered with resist ink or the like. Of course, it is installed on the stage 2 at a position around the substrate W.

  Since the stage 2 is configured as described above, the support column 2b and the base 2a can hold the substrate W in a state where a plane is maintained at a position spaced apart from the base 2a. Therefore, it is not necessary to arrange a new carrying-in means, and the fact that the substrate W such as a robot hand (not shown) cannot be received as it is from a mechanism for transferring between the apparatuses is solved.

  The imaging means 4 is for imaging a predetermined position of the substrate W and the positioning mark 2 of the stage from above the substrate W. The imaging means 4 is installed on the support frame A1 so as to be movable in the X direction and the Y direction by a guide rail or the like (not shown). For example, a CCD camera or the like is used. The imaging means 4 images the positioning mark 2d at a preset reference position, and then freely moves in the straight X direction and the Y direction orthogonal to the X direction to move the alignment mark or substrate of the substrate W. It operates to image a predetermined position set in advance at one of the corners (edges) of W, and acquires each image data and outputs it to the control mechanism 20 described later.

  Then, based on the substrate position obtained by analyzing the image data acquired by the image pickup unit 4 and the stage position, alignment work is relatively performed via the moving conveyance mechanism 3 by a command from the control mechanism 20.

  The moving conveyance mechanism 3 performs the alignment operation of the substrate W, conveys the substrate W along the movement path L, and moves the substrate W at a predetermined speed during exposure (laser beam irradiation and ultraviolet light irradiation). Is to be moved. The moving transport mechanism 3 moves the stage 2 in the first linear guide direction 3A that moves the stage 2 in the X linear direction that is one linear direction, and the Y linear direction that is a linear direction orthogonal to the X linear direction. A second movement guide mechanism 3B and a third movement guide mechanism 3C for moving the stage 2 in a rotation direction (θ direction) around a perpendicular line perpendicular to the substrate surface held by the stage 2 are provided. The first to third moving guide mechanisms 3A to 3C used here are for moving in the linear direction or for moving the stage 2 in the rotational direction. However, the first moving guide mechanism 3A will be mainly described.

As shown in FIG. 2, the first moving guide mechanism 3A includes a linear motor 3a having a reacting plate that moves along a magnetic guide (primary side guide) in which S poles and N poles are alternately arranged, and the linear motor. Moving rails 3b and 3b installed along 3a are provided. The first moving guide mechanism 3A has a configuration in which moving rails 3b and 3b are installed on both sides of the linear motor 3a. However, the moving rail 3b may be either one, and the moving rail 3b
Instead of this, a fluid bearing using air or the like may be used. In addition, the first movement guide mechanism 3A is preferably configured to use the linear motor 3a, but may be a movement mechanism using a servo motor and a feed screw as long as the movement can be controlled with a certain degree of accuracy. It is not particularly limited.

  Here, the moving conveyance mechanism 3 moves the stage 2 in the rotational direction between the first movement guide mechanism 3A that moves the stage 2 in the X linear direction and the second movement guide mechanism 3B that moves the stage in the Y linear direction. Although the third movement guide mechanism 3C to be rotated is installed, the upper and lower positions of the second movement guide mechanism 3B and the third movement guide mechanism 3C may be installed interchangeably. When the substrate W is relatively aligned by the moving transport mechanism 3, the following operation is performed.

  First, the moving transport mechanism 3 moves the stage 2 holding the loaded substrate W to a preset reference position by the second movement guide mechanism 3B that moves in the Y linear direction. Then, the imaging means 4 images the positioning marks 2d, 2d, 2d of the stage 2 and sends the image data to the control mechanism 20 described later. Further, the imaging means 4 images the edge (or alignment mark (not shown)) of the substrate W and sends image data to the control mechanism 20. The control mechanism 20, which will be described later, analyzes the image data sent thereto, compares the substrate position with the stage position, calculates the alignment position of the substrate W, and controls the movement of the movable transport mechanism 3 to perform relative control. Consistently. In addition, while performing alignment work, based on the shape and position of the identification mark M (see FIG. 3) which is the product data of the substrate W inputted in advance, the transfer destination (laser beam exposure position (irradiation start position)) The position of the stage 2 may be adjusted to a position where it can be conveyed.

  In accordance with a signal from the control mechanism 20, the moving transport mechanism 3 performs the alignment operation of the substrate W mainly using the third moving guide mechanism 3C and the second moving guide mechanism 3B here. Of course, the alignment operation of the substrates W may be performed using the third movement guide mechanism 3C, the second movement guide mechanism 3B, or the first movement guide mechanism 3A. Further, after performing the alignment operation, the laser beam unit 5 is transported to a predetermined position in the X linear direction, and then moved in the Y linear direction to the exposure position by using the second movement guide mechanism 3B. It does not matter as a configuration.

  Next, the laser beam unit 5 will be described. As shown in FIGS. 1 and 2, the laser beam unit 5 is for exposing the identification mark M to the peripheral region Wc of the substrate W with a laser beam. As shown in FIG. 5, the laser beam unit 5 is supported and fixed by the support frame A1, and an optical path length adjusting unit 6 for adjusting the optical path length of the laser beam, and the optical path length adjusting unit 6 here. And a laser irradiation unit 7 that irradiates the peripheral region Wc of the substrate W with the laser beam whose optical path length is adjusted. FIG. 5 is a schematic diagram schematically showing the configuration of the laser beam unit of the present apparatus. As shown in FIG. 5, the laser beam unit 5 has three laser irradiation units 7 here, and the laser beams irradiated from one laser beam light source 5 a are branched to each laser irradiation unit 7. To three portions of the peripheral region Wc of the substrate W are irradiated with a laser beam.

As shown in FIG. 5, the optical path length adjusting unit 6 includes a laser beam light source 5a, an optical path adjusting reflector 5b, a CCD image pickup device 6b and a power meter 6c installed via a laser beam branching means 6a. ing.
For the laser beam light source 5a, a wavelength corresponding to the exposure region of the resist ink applied to the peripheral region Wc of the substrate W is selected, and for example, a pulse is output, and light emission and extinction are alternately repeated at high speed. in use. For this reason, it is possible to vary the integrated intensity of the laser beam within a predetermined time (sec) by varying the repetition frequency.

The optical path adjusting reflector 5b is used to change the optical path length of the laser beam emitted from the laser beam light source 5a.
In order to adjust the laser irradiation units 7, 7, 7 until they are incident, they are installed at predetermined positions. In this optical path adjusting reflecting mirror 5b, a total reflecting mirror that totally reflects the laser beam and a branch reflecting mirror (beam splitter) that branches and reflects the laser beam are respectively installed at predetermined positions. A branching reflecting mirror among the optical path adjusting reflecting mirrors 5b is installed at a position where the optical path from the laser beam light source 5a branches to the first and second laser irradiating units 7 and 7, and a third laser irradiating unit is provided. A total reflection mirror is disposed at a position where the light is reflected by 7 and other positions. The optical path adjusting reflector 5b is installed at a position where the optical path lengths of the laser beams incident on the laser irradiation units 7 from the laser beam light source 5a are all equal to each other, and after being reflected from the laser beam light source 5a for the first time. It is installed at a position where each laser irradiation unit 7 is reflected by two reflections.

  In the optical path in the optical path length adjusting unit 6, a CCD image pickup device 6b for measuring the irradiation diameter and irradiation position of the laser beam and the laser beam via a branching means 6a such as a beam splitter for branching the laser beam. A power meter 6c is installed for measuring the power. The measurement result measured here is sent to the control mechanism 20 described later. The measurement result sent to the control mechanism 20 is reflected in order to adjust the laser beam light source 5a.

  As shown in FIG. 5, the laser irradiation unit 7 reflects an acoustooptic element 7a that diffracts the laser beam reflected from the optical path adjusting reflector 5b, and reflects the laser beam diffracted by the acoustooptic element 7a in a predetermined direction. Reflecting mirrors 7b and 7b, a galvano mirror unit 7c that deflects and scans the laser beam reflected by the reflecting mirrors 7b and 7b, and an fθ lens 7d that irradiates the peripheral region of the substrate W with the laser beam from the galvano mirror unit 7c. And. A laser beam measurement adjustment mechanism 8 for measuring and adjusting the laser beam is installed in the optical path from the acousto-optic element 7a of the laser irradiation unit 7 to the fθ lens 7d.

  The acoustooptic device 7a diffracts the laser beam and adjusts the intensity (luminance) of the laser beam by amplitude modulation or frequency modulation. The acoustooptic device 7a may be installed at a position after the optical path is changed by the reflecting mirrors 7b and 7b.

  The reflecting mirror 7b adjusts the direction of the optical path of the laser beam, and here the laser beam is totally reflected. The reflecting mirror 7b is not particularly limited as long as it can reflect the laser beam.

  The galvano mirror unit 7c has a galvanometer mirror and deflects and scans the laser beam. The galvano mirror unit 7c deflects and scans the laser beam so that the identification mark M can be exposed by the laser beam by a signal from the control mechanism 20 described later. ing. The galvano mirror unit 7c is not limited to the configuration for controlling the galvano mirror.

  The fθ lens 7d is capable of condensing and scanning the laser beam deflected by the galvanometer mirror of the galvano mirror unit 7c on a flat image surface. The fθ lens 7d is not particularly limited as long as the configuration such as the entrance pupil diameter, the scanning angle, the scanning range, and the telecentricity corresponds to the wavelength of the galvanometer mirror and the laser beam.

As shown in FIG. 5, the laser beam measurement adjusting mechanism 8 includes a power meter 8a for measuring the power by branching the laser beam from the reflecting mirror 7b by a branching means such as a beam splitter, and the spot diameter or collimation of the laser beam. A beam expander 8c that performs operations such as expanding the range and a CCD imaging device 8b that branches the laser beam by a branching unit and measures the laser beam diameter and irradiation position are provided. Then, the result measured by the laser beam measurement adjusting mechanism 8 is sent to a control mechanism 20 to be described later, and an appropriate laser beam state is obtained.
As described above, the reflection is reflected through the acoustooptic device 7a or the beam expander 8c.

  The laser beam unit 5 having the above configuration operates as follows. That is, when the substrate W moves to the laser beam irradiation start position, the laser beam light source 5a is turned on, and the laser beam passes through each optical path adjustment reflecting mirror 5b of the optical path length adjustment unit 6 to each laser irradiation unit 7, 7, 7. The acoustooptic elements 7a, 7a, 7a are led to the laser beam heads 5A, 5A, 5A from the acoustooptic elements 7a, 7a, 7a via the galvano mirror units 7c, 7c, 7c and the fθ lenses 7d, 7d, 7d. A laser beam is irradiated to the peripheral region of the substrate W to expose the identification mark M1 (see FIG. 3). At this time, the irradiated laser beam scans in a direction orthogonal to the moving direction of the substrate W and exposes the identification mark M1 while moving the substrate W at a predetermined speed. In the laser beam unit 5, since the installation intervals of the laser beam heads 5A, 5A, 5A are fixed, the size of the substrate W or the width of the laser beam by the galvano mirror units 7c, 7c, 7c This corresponds to the formation position of the identification mark.

  As shown in FIGS. 1, 2, and 6, the ultraviolet irradiation unit 9 is installed at a position adjacent to the laser beam unit 5 above the movement path of the substrate W, and the ultraviolet irradiation unit 9 is exposed to the peripheral region Wc of the substrate W. It is for irradiating light. Here, two of the ultraviolet irradiation units 9 are installed via a moving mechanism 12 so that the ultraviolet irradiation unit 9 can move in a direction orthogonal to the X-linear direction of the substrate W. FIG. 6 is a cross-sectional view showing a configuration of the ultraviolet irradiation unit of the present apparatus with a part cut away.

  As shown in FIG. 6, the moving mechanism 12 includes the linear motor 12a and the LM guides (moving rails) 12b and 12b in the same manner as the first moving guide mechanism 3A described above, so that it can be quickly and accurately performed. Movement control can be performed.

  As shown in FIG. 6, the ultraviolet irradiation unit 9 includes a discharge lamp 9a that irradiates ultraviolet light, an elliptical reflecting mirror 9b that is provided in the discharge lamp 9a and reflects the light so as to collect light, and the elliptical reflecting mirror 9b. An optical path shutter mechanism 9c installed in the optical path condensed by the optical path shutter mechanism 9c, and a fly-eye lens 9d installed at the condensing position of the light from the elliptical reflecting mirror 9b in the optical path closer to the substrate W than the optical path shutter mechanism 9c, The irradiation lens 9e for irradiating the peripheral area Wc of the substrate W with the light transmitted through the fly-eye lens 9d as parallel light and at least a part of the light from the irradiation lens 9e are shielded (hidden). An irradiation area adjusting shutter mechanism 10 having a configuration and an irradiation area adjusting shutter mechanism 13 for changing the irradiation area are provided.

  The ultraviolet irradiation unit 9 has the components such as the discharge lamp 9a described above installed in the housing 9k, and the irradiation from the irradiation lens 9e is performed at a position facing the substrate W on the lower surface of the housing 9k. An irradiation port 9m is formed at a position that becomes an optical path of light. Further, the ultraviolet irradiation unit 9 includes a measuring instrument 11 for measuring the irradiation light to be irradiated in the housing 9k, or when the ultraviolet irradiation unit 9 moves to a predetermined position via the moving mechanism 12 and stops. A measuring instrument 11 is installed at a position that can be measured corresponding to the irradiation port 9m.

  The discharge lamp 9a emits ultraviolet light (light including ultraviolet light of a predetermined wavelength) that exposes the resist ink applied to the peripheral region Wc of the substrate W. For example, a mercury lamp that is lit by arc discharge is used. It has been.

  The elliptical reflecting mirror 9b is provided with a curved surface (part of an elliptical rotating curved surface) that condenses light emitted from the discharge lamp 9a at a predetermined position. The elliptical reflecting mirror 9b may have a configuration that transmits infrared rays and does not irradiate the substrate W side.

  The optical path shutter mechanism 9c blocks or passes light from the light source (discharge lamp 9a and elliptical reflecting mirror 9b) side, and serves as a pseudo light source. The optical path shutter mechanism 9c includes a light shielding plate 9c1 that shields (shields) the light path facing the optical path, and a drive unit 9c2 that moves the light shielding plate 9c1 to the optical path or a retracted position off the optical path. The optical path shutter mechanism 9c moves the light shielding plate 9c1 from the optical path to the retracted position when the peripheral area Wc of the substrate W is exposed and when the irradiation light is measured.

  The fly-eye lens 9d adjusts the illuminance distribution of light. The fly-eye lens 9d is a lens group in which a plurality of lenses are arranged in an array, or a plurality of such lens groups are arranged in the optical axis direction. For example, the fly-eye lens 9d is disposed at a position where light emitted from a light source is collected.

  The irradiation lens 9e is for irradiating the peripheral region Wc of the substrate W with the ultraviolet light having the illuminance distribution adjusted through the fly-eye lens 9d as parallel light. As the irradiation lens 9e, a convex lens is used here. If the light transmitted in a diffused state from the fly-eye lens 9d can be converted into parallel light, it can be either a single lens or a compound lens. It doesn't matter.

  Next, the configuration of the irradiation area adjustment shutter mechanism 10 will be described with reference to FIGS. FIG. 7 is a perspective view schematically showing the entire irradiation area adjustment shutter mechanism of the apparatus with a part of the housing cut away, and FIG. 8 is a configuration for moving the irradiation area adjustment shutter mechanism of the apparatus in the X linear direction. It is a disassembled perspective view which shows a part typically.

  The irradiation area adjustment shutter mechanism 10 adjusts the opening width of the irradiation port 9m so that ultraviolet light is not irradiated to the positions of the pattern area Wp and the identification mark M on the substrate W. The irradiation area adjusting shutter mechanism 10 includes three concealment plates T1 (pattern region concealment plate), T2 (first identification mark concealment plate), T3 (second identification mark concealment plate), and the concealment plate T1. , T2 and T3 are arranged so as to move in a predetermined direction. The concealing plate moving means 10A (third moving means), 10B (first moving means), 10C (fourth moving means) and Y direction moving means 10D (first moving means). 2 moving means). Here, the irradiation area adjusting shutter mechanism 10 controls the movement of one concealment plate T1 in the Y linear direction, and controls the movement of the two concealment plates T2 and T3 in the X linear direction and the Y linear direction. I am doing so.

  The concealing plate moving means 10A is provided in the first frame body 10A1, and includes a first drive motor 10A2 installed in the first frame body 10A1, and a feed screw 10A3 that transmits rotation from the first drive motor 10A2. A moving base 10A4 that moves along the feed screw 10A3, and a slide mechanism 10A5 for sliding a second frame body 10B1 described later that is fixed to the moving base 10A4 are provided.

  The first frame body 10A1 is installed inside the housing 9k of the ultraviolet irradiation unit 9 with a part thereof being fixed. The first frame body 10A1 is configured such that an opening having a predetermined area is formed in a plate frame 10a disposed along the feed screw 10A3, and the moving base 10A4 can move within the range of the opening. The first frame body 10A1 has plate frames 10b and 10c at positions facing to fix the first drive motor 10A2 and support the feed screw 10A3. Further, the first frame body 10A1 does not need to be provided with the plate frame 10a as long as the first frame body 10A1 is configured to face the positions where the plate frames 10b and 10c are separated at a predetermined interval (for example, on the plate frame 10a). A configuration in which a plate frame (not shown) is provided at a facing position, or a configuration in which the plate frames 10b and 10c are fixed to the housing 9k side).

The first drive motor 10A2 can perform rotation control of a servo motor or the like, and its configuration is not limited.
The configuration of the feed screw 10A3 is not limited as long as the rotation of the first drive motor 10A2 can be transmitted.
The moving base 10A4 is formed at a position corresponding to a female screw so as to move along the feed screw 10A3 by the rotation of the feed screw 10A3, and is configured to support a second frame body 10B1 described later. Yes.

  The slide mechanism 10A5 includes a guide rail 10A6 and a moving portion 10A7 that moves along the guide rail 10A6 on the first frame body 10A1 (plate frame 10a), and the second frame body 10B1 described later by the moving portion 10A7. It is fixed on the side. The slide mechanism 10A5 may be arranged on the left and right of the feed screw 10A3.

  The concealing plate moving means 10A having the above-described configuration drives the first drive motor 10A2 and rotates the feed screw 10A3 a predetermined number of times, so that the moving base 10A4 moves along the feed screw 10A3, whereby the second frame described later. The body 10B1 can be moved in the Y linear direction along the guide rail of the slide mechanism 10A5. Here, the first frame body 10A1 is configured to suspend the second frame body 10B1 and slide it in the Y linear direction to move it to a predetermined position.

  The concealing plate moving means 10B and the concealing plate moving means 10C are provided in the second frame body 10B1, and are respectively provided with the second drive motor 10B2, the third drive motor 10C2, the feed screws 10B3 and 10C3, and the feed screws 10B3. The moving bases 10B4 and 10C4 move along 10C3, and the slide mechanisms 10B5 and 10C5 arranged along the moving direction of the moving bases 10B4 and 10C4. The concealing plates T2 and T3 include the slide mechanisms 10B5 and 10C5. It is installed to move along.

  As described above, the second frame body 10B1 is suspended on the first frame body 10A1 so as to freely slide in the Y linear direction. The frame body 10b1 includes a plate frame 10d installed on the first frame body 10A1 side, and plate frames 10e and 10f provided so as to face both end sides of the plate frame 10d. The Y-direction moving means 10D that moves the concealment plate T1 in the Y linear direction is provided at a predetermined position of the plate frame 10d.

The second drive motor 10B2 and the third drive motor 10C2 can perform rotation control of a servo motor or the like, and the configurations thereof are not limited.
The feed screws 10B3 and 10C3 are arranged in parallel at a predetermined interval in a direction orthogonal to the feed screw 10A3, and can be configured as long as they can transmit the rotations of the second drive motor 10B2 and the third drive motor 10C2. It is not limited.

  The moving bases 10B4 and 10C4 are made of base bodies b1 and c1 that move along the feed screws 10B3 and 10C3 by rotation of the feed screws 10B3 and 10C3, and connection pieces b2 and c2 provided on the base bodies b1 and c1, respectively. It is equipped with. The moving bases 10B4 and 10C4 are formed with female screws at predetermined positions of the base main bodies b1 and c1 that move along the feed screws 10B3 and 10C3. Here, the connecting pieces b2 and c2 are connected to the base main body b1. , C1 are arranged at the upper end and the lower end, respectively, so that the connection pieces b2, c2 can move crossing each other when moving along the feed screws 10B3, 10C3.

The slide mechanisms 10B5 and 10C5 move along the guide rails 10B6 and 10C6 arranged in parallel with the feed screws 10B3 and 10C3, and the guide rails 10B6 and 10C6.
It has moving parts 10B7 and 10C7. In the slide mechanisms 10B5 and 10C5, the guide rails 10B6 and 10C6 are arranged in steps, and moving portions 10B7 and 10C7 that slide on the guide rails 10B6 and 10C6 are connected to the tips of the connection pieces b2 and c2. In addition, concealment plates T2 and T3 are detachably attached to the moving parts 10B7 and 10C7.

  A concealing plate T1 is provided via a Y-direction moving means 10D at the position (plate frame 10d) of the second frame body 10B1 on the side where the concealing plates T2 and T3 are disposed. The Y-direction moving means 10D includes a fourth drive motor 10D2 that can perform rotation control of a servo motor, a feed screw 10D3 that transmits the rotation of the fourth drive motor 10D2, and a movement along the feed screw 10D3. The concealing plate T1 can be moved in parallel to the irradiation port 9m. A concealing plate T1 is detachably attached to the moving unit 10D4.

  Here, the concealment plate T1 is formed of a metal plate that is not easily softened or deteriorated even when irradiated with ultraviolet light, and has a wider area than the opening width of the irradiation port 9m. Further, the concealing plates T2 and T3 are formed with concealing portions t2a and t3a on the leading end side, and openings t2b and t3b are formed continuously with the concealing portions t2a and t3a. The concealment plates T2 and T3 have a width smaller than the opening width of the irradiation port 9m and the same size. The concealment plates T2 and T3 are concealed to a predetermined size corresponding to the size of the identification mark M to be exposed. Portions t2a and t3b are formed. When the size of the identification mark M is different, the concealing plates T2 and T3 do not have to be formed in the same size, and may be appropriately changed according to the identification mark M. Further, as shown in FIG. 7, when the concealing plates T2 and T3 support the concealing portions t2a and t3a via the openings t2b and t3b, they do not want to shield light except at the positions of the concealing portions t2a and t3a. In addition, it is convenient to have a configuration in which a thin support line part t2c (t3c) is provided across the openings t2b and t3b so that it can withstand moving at high speed. The concealing portions t2a and t3a may be configured to be supported by only a plurality of the thin support line portions t2c (t3c) as long as the horizontal state is maintained when moved. Here, the concealment plates T1, T2, and T3 are respectively positioned at different heights and configured to be able to move in a crossing manner.

In the irradiation area adjusting shutter mechanism 10 configured as described above, the concealing plate moving unit 10B, the concealing plate moving unit 10C, and the Y direction moving unit 10D operate as follows.
That is, by rotating the feed screws 10B3 and 10C3 by driving the second drive motor 10B2 and the third drive motor 10C2, the moving bases 10B4 and 10C4 are moved to irradiate the concealing plates T2 and T3 along the slide mechanisms 10B5 and 10C5. Move across the mouth 9m. The concealment plates T2 and T3 are moved in the same direction at the same speed as the substrate W. When the concealment plates T2 and T3 are moved across the irradiation port 9m, the irradiation is performed at a predetermined timing at a high speed in a direction opposite to the direction moved so far. Cross the mouth 9m. In addition, positioning of the concealment plates T2 and T3 in the Y linear direction is performed by moving the second frame body B1 by the concealment plate moving means 10A. Further, the concealing plate T1 is positioned when the identification mark is not formed in the peripheral area Wc of the substrate W, or the position of one side of the irradiation port 9m is adjusted by the movement of the moving mechanism 12, and the irradiation port 9m The concealment plate T1 is used when there is a region where it is not desired to irradiate ultraviolet light on the other end side of.

  Next, the irradiation area adjusting shutter mechanism 13 will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing the irradiation area adjusting shutter mechanism of the present apparatus with a part of the housing cut away. As shown in FIG. 9, the irradiation area adjustment shutter mechanism 13 is for changing the irradiation area of irradiation light. The irradiation area adjusting shutter mechanism 13 is provided with shutter mechanisms 13A and 13A having the same configuration arranged facing the support 9f that supports the irradiation lens 9e. The shutter mechanism 13A includes a width adjustment light shielding plate 13a that adjusts the width of the irradiation light emitted from the irradiation lens 9e, a width adjustment light shielding plate moving unit 13b that linearly moves the width adjustment light shielding plate 13a, A feed screw 13c for transmitting the driving force of the width adjusting light shielding plate moving portion 13b and a frame 13d for supporting the feed screw 13c and the width adjusting light shielding plate moving portion 13b and fixing the same to the support 9f are provided.

The irradiation area adjusting shutter mechanism 13 moves the width adjusting light-shielding plates 13a and 13a in advance by control from the control mechanism 20 so that the irradiation area is in an appropriate state corresponding to the moving speed of the substrate W. That is, the space width between the width adjustment light-shielding plate 13 on one side and the width adjustment light-shielding plate 13a on the other side is adjusted. For example, the movement speed corresponding to the irradiation time for exposing the identification mark M with the laser beam is slower than the reference movement speed when the peripheral region Wc is exposed with ultraviolet light, and in the case of overexposure, the irradiation area is determined from the reference. Make it smaller. That is, the irradiation area adjusting shutter mechanism 13 increases the area covered by the width adjusting light-shielding plates 13a and 13a on one side or one side and the other side of the irradiation port 9m, and irradiates the peripheral region Wc of the substrate W. It is set so that the total irradiation energy for irradiating the ultraviolet light per unit area of the peripheral region Wc in the total time at the moving speed of the substrate becomes equal to the value set on the basis by narrowing the area. ing.
The reference position of the adjustment light shielding plates 13a and 13a is, for example, a position that covers a part from one side or one side and the other side of the irradiation port 9m, so that the irradiation area can be adjusted to be large or small. .
Further, the irradiation area adjusting shutter mechanism 13 may be configured to include either one of the shutter mechanisms 13A. The irradiation area adjusting shutter mechanism 13 determines the irradiation area by a signal from the control mechanism 20 when the moving speed of the substrate W is set by the control mechanism 20 described later. A specific operation for determining the irradiation area will be described later.

  Next, the ultraviolet light measuring instrument 11 will be described. As shown in FIG. 1, the measuring instrument 11 measures the illuminance of the ultraviolet light irradiated from the ultraviolet irradiation unit. The measuring instrument 11 includes an illuminance measuring unit 11a, and an illuminance measuring unit moving mechanism 11b that moves the illuminance measuring unit 11a to a measurement position on the irradiation optical path and a retracted position. And the measuring instrument 11 is sending to the control mechanism 20 which mentions the measured measurement result later. The measurement result measured by the measuring instrument 11 is reflected to adjust the irradiation light by adjusting the voltage or current applied to the discharge lamp 9a of the ultraviolet irradiation unit. For example, when the exposure work on the peripheral area Wc of the substrate W is completed, the measuring instrument 11 performs the measurement work by a signal from the control mechanism 20, and measures the irradiation light and adjusts the discharge lamp 9a based on the result. It is configured here to work.

  The configuration of the control mechanism 20 will be described with reference to FIG. FIG. 10 is a block diagram showing the control mechanism of this apparatus. As shown in FIG. 10, the control mechanism 20 includes an input unit 21, a camera drive control unit 22, an image data input unit 23, a position detection unit 24, an alignment unit 25, a substrate position calculation unit 26, and a movement. A transport mechanism drive control unit 27, a laser beam irradiation drive control unit 28, an ultraviolet irradiation drive control unit 29, a measurement unit 30, and a storage unit 31 are provided.

  The input means 21 is for inputting the product data of the substrate W and the like. The configuration of the input unit 21 is not particularly limited as long as data such as a keyboard, a scanner, and a mouse can be input.

  The type data input here includes the size of the substrate W, the size and position of the pattern area Wp, the size and position of the peripheral area Wc, the type of identification mark (character, symbol, figure, etc.), size, exposure position, Exposure illuminance and exposure speed, exposure illuminance (laser beam and ultraviolet light) in the peripheral area Wc (one linear direction and the other linear direction), etc., are previously input from the input means 21 and stored in the storage means 31. Yes. In the apparatus 1, data necessary for the peripheral exposure work such as the exposure speed of the laser beam unit 5, the exposure illuminance, or the exposure illuminance per unit area of the ultraviolet irradiation unit 9 is previously input from the input means 21 and stored. It is stored in the means 31.

  The camera drive control means 22 is for driving and controlling the image pickup means 4, and a start signal generated by a sensor or the like (not shown) and a position detection when the substrate W is carried into the stage 2 and held. The movement of the imaging means 4 is controlled by the signal from the means 24.

  The image data input means 23 is for inputting the image data picked up by the image pickup means 4, and outputs the input image data to the position detection means 24.

  The position detection means 24 analyzes the image data sent from the image data input means 23 to obtain position data, and detects the substrate position and the stage position. The position data of the substrate position and the stage position detected by the position detection unit 24 is output to the alignment unit 25 and a signal indicating that the detection is completed is output to the camera drive control unit 22.

  The aligning unit 25 calculates how much the movable transport mechanism 3 should be aligned based on the substrate position data and the stage position data sent from the position detecting unit 24. This is output to the moving conveyance mechanism drive control means 27.

  The substrate position calculation means 26 is based on the alignment position data of the substrate W sent from the alignment means 25 and the product data of the substrate W stored in the storage means 31, and the laser beam irradiation start position of the substrate W, An ultraviolet irradiation start position, a moving speed, a 90-degree rotational movement position of the substrate, a moving speed after the 90-degree rotational movement, a laser beam irradiation start position, an ultraviolet irradiation start position, and the like are calculated.

  For example, the substrate position calculation means 26 uses the substrate size, the pattern region size, the peripheral region size, the identification mark size, the data indicating the position of the identification mark, and the alignment position data of the substrate W as the product data of the substrate W. The laser beam irradiation start position of the substrate W is calculated in the laser beam unit 5. In addition, the substrate position calculation means 26 calculates the moving speed of the substrate W based on the size of the identification mark and the exposure illuminance of the identification mark. The result calculated by the substrate position calculation means 26 is output to the moving transport mechanism drive control means 27.

  Further, the substrate position calculating means 26 calculates the above-described positions, moving speeds, etc. by reflecting the substrate position data sent from the moving transport mechanism drive control means 27.

  The moving transport mechanism drive control means 27 drives and controls the moving transport mechanism 3 based on each data sent from the aligning means 25 or the substrate position calculating means 26. As a result of driving and controlling the moving and conveying mechanism 3, the moving and conveying mechanism drive control means 27 irradiates the laser beam with movement instruction data indicating the timing for irradiating the laser beam, the timing for irradiating ultraviolet rays, the timing for controlling the shutter mechanism 10, and the like. It is sent to the drive control means 28 and the ultraviolet irradiation drive control means 29.

  The laser beam irradiation drive control means 28 is based on the type data of the substrate W stored in advance in the storage means 31 and the position data of the substrate W sent from the moving transport mechanism drive control means 27. Is controlled. This laser beam irradiation drive control means 28 outputs an irradiation stop signal indicating that the irradiation of the laser beam is terminated to the laser beam unit 7, and on the basis of the measurement result data sent from the measuring means 30. Adjust unit 7. The laser beam irradiation drive control means 28, based on the measurement result data, specifically sets the laser beam light source 5a, the acoustooptic device 7a or the beam expander 8c of the laser beam unit 7 in advance. Adjustments are also made as appropriate so as to achieve the following conditions (illuminance, irradiation area, etc.).

  The ultraviolet irradiation drive control means 29 is based on the type data of the substrate W stored in advance in the storage means and the position data of the substrate W sent from the moving transport mechanism drive control means 27, and the ultraviolet irradiation unit 9 (irradiation). (Including the area adjustment shutter mechanism 10 and the irradiation area adjustment shutter mechanism 13). The ultraviolet irradiation drive control unit 29 outputs an irradiation stop signal for stopping the irradiation of ultraviolet light (blocking of the optical path by the optical path shutter mechanism) to the ultraviolet irradiation unit 9 and also outputs measurement result data sent from the measuring unit 30. Based on this, the ultraviolet irradiation unit 9 is adjusted. The ultraviolet irradiation drive control means 29 adjusts the input voltage or input current of the discharge lamp 9a based on the measurement result data to adjust to a preset light illuminance state.

  The measuring means 30 outputs measurement data from the optical path length adjusting unit 6, the laser beam measurement adjusting mechanism 8 and the measuring instrument 11 to the laser beam irradiation drive control means 28 and the ultraviolet irradiation drive control means 29.

  The storage means 31 is for storing the product data of the substrate W, and the configuration thereof is not limited as long as it can store data such as a hard disk.

  Next, the operation of the present apparatus 1 will be described mainly with reference to FIGS. 1 to 10 mainly with reference to FIGS. FIG. 11 is a flowchart showing the operation of the laser beam / ultraviolet irradiation peripheral exposure apparatus, and FIG. 12 schematically shows a state in which the peripheral region on the edge side of the substrate is exposed to light containing ultraviolet rays of a predetermined wavelength. FIG. 13 is a perspective view schematically showing a state in which a peripheral region on the center side of the substrate is exposed with light containing ultraviolet rays having a predetermined wavelength. In FIG. 13 shown here, the position of the concealment plate T1 in the vertical direction is shown below the concealment plates T2 and T3 for easy understanding, but the actual configuration is as shown in FIG. 7 and FIG. The concealment plate T1 is disposed above the concealment plates T2 and T3.

  As shown in FIG. 11, the apparatus 1 first carries the substrate W onto the stage 2 while the bottom surface of the substrate is sucked and held by a handler (not shown) or the like (S1). When the substrate W is carried into the stage 2, the substrate W is held by the stage 2 by being sucked by the suction opening 2c formed at the tip of the support column 2b (carrying-in step S2). ). Here, when the substrate W is carried in, the moving transport mechanism 3 moves the stage 2 in the Y linear direction by the second movement guide mechanism 3B to receive the substrate W.

  When the substrate W is held on the stage 2, a start signal is sent to the camera drive control means 22 of the control mechanism 20 to move the imaging means 4 to a preset reference position and move the moving transport mechanism 3 to the reference position. Then, the imaging unit 4 captures the positioning mark 2d of the stage 2 and moves the imaging unit 4 to a preset position on the substrate W to capture, for example, a substrate edge portion (or alignment mark (not shown)). Then, the image data is input to the control mechanism 20 by the image data input means 23, and the position detection means 24 analyzes the input image data to detect the substrate position and the stage position (detection step S3).

  When the positions of the substrate W and the stage 2 are detected, the stage 2 is aligned and moved based on the respective positions, and the movable transport mechanism 3 is operated via the aligning means 25, the movable transport mechanism drive control means 27, etc. Is performed (matching step S4). In this alignment operation, the alignment movement of the substrate W in the θ direction is performed, and then, when the substrate W is moved in the X linear direction and the Y linear direction, a laser beam irradiation and an ultraviolet light irradiation can be performed. The substrate W is aligned and moved to a specific position.

  The alignment unit 25 of the control mechanism 20 outputs the alignment position of the aligned substrate W to the substrate position calculation unit 26 and also outputs it to the moving transport mechanism drive control unit 27. In the substrate position calculation means 26, the movement position (laser beam irradiation) of the substrate W on the basis of the sent alignment position data of the substrate W and the product type data of the substrate W stored in the storage means 31. (Start position) and moving speed are calculated (calculation step S5). At this time, the movement position and movement speed when the substrate W described later is rotated 90 degrees are also calculated.

  When the movement position and movement speed of the substrate W are calculated, the movement / conveyance mechanism drive control means 27 passes the first movement guide mechanism 3A (or the second movement guide mechanism 3B) of the movement / conveyance mechanism to the X linear direction (or The stage 2 holding the substrate W is moved in the Y linear direction) and conveyed to a predetermined position (for example, the leading position of the identification mark in the peripheral area Wc of the substrate W) immediately below the laser beam unit 5 (S6). When the substrate W is transported to a predetermined position, the substrate W is moved at a predetermined speed and the laser beam unit 5 is operated to irradiate the laser beam from each of the laser beam heads 5A, 5A, and 5A to sequentially expose the identification marks. (Laser beam irradiation step S7).

  When irradiating the laser beam, the moving speed of the moving transport mechanism 3 for moving the substrate W and the exposure speed for performing exposure with the laser beam are synchronized. That is, the acousto-optic element 7a (AOM) and the galvano mirror unit 7c (galvano mirror) are synchronized, and the AOM diffracts the primary light from the high-speed shutter to secure the marking light, thereby enabling high-speed exposure. Yes. Therefore, the substrate W can be moved at a predetermined speed without stopping when laser beam irradiation is performed.

  At this time, on the ultraviolet irradiation unit 9 side, the apparatus 1 uses the control mechanism 20 to store the product data of the substrate W stored in the storage unit 31 and the position data of the substrate W sent from the moving transport mechanism drive control unit 27. Based on the above, the housing 9k is moved in the Y linear direction via the moving mechanism 12, and one end side of the irradiation port 9m is located at a position where the pattern region Wp of the substrate W is concealed and light can be irradiated to the peripheral region Wc side. They are adjusted together (S8) (see FIG. 12A). At the same time, when the identification mark M1 is exposed to the peripheral region Wc of the substrate W by the laser beam irradiation and sent to the ultraviolet irradiation unit 9 side, the control mechanism 20 determines that the irradiation position of the ultraviolet light is the substrate W. In the peripheral area Wc on both sides, the exposure area adjustment shutter mechanism 10 is controlled to use the concealment plates T2 and T3 without using the concealment board T1 of the irradiation area adjustment shutter mechanism 10, and the peripheral exposure is performed. Get ready to do. Then, when the substrate W actually reaches the ultraviolet light irradiation start position of the ultraviolet irradiation unit 9, the optical path shutter mechanism 9c is operated, and the ultraviolet light is transmitted to the peripheral region Wc of the substrate W by the concealing plates T1, T2, T3. Either one is used to irradiate ultraviolet light (ultraviolet irradiation step S10).

When the identification mark M1 in the X linear direction of the substrate W and the peripheral region Wc thereof are exposed, the substrate W has both the X linear direction (one linear method) and the Y linear direction (the other linear direction). It is determined whether the peripheral area Wc has been exposed (S11) (for example, due to the operating state of the third movement guide mechanism 3C with respect to one substrate W). The stage 2 is once returned to the movement start end, and the stage 2 is rotated 90 degrees by the third movement guide mechanism 3C of the movement transport mechanism 3 at either the movement end or the movement start end, and the substrate W is rotated 90 degrees. (S12). And I said above
Similarly, by performing the operations from step 6 (S6) to step 10 (S10) in the same manner, the identification mark M2 is exposed in the peripheral region Wc of the substrate W, and the remaining peripheral region Wc is exposed to expose the substrate W. The peripheral exposure for all peripheral regions Wc is finished.

  When the peripheral exposure of the substrate W is completed, the substrate W is moved from the carry-out side (not shown) formed on the movement end side of the substrate W or from the carry-in side into which the substrate W is loaded. (S13). Then, a new substrate W is carried in, and the above-described steps S1 to S13 are repeated, so that the peripheral exposure operation of the substrate W is appropriately performed.

Here, the moving speed of the stage 2 will be described.
The moving transport mechanism drive control means 27 of the control mechanism 20 determines the moving speed of the substrate W based on the preset irradiation energy. However, if the area of the identification mark M is large or the required exposure amount of the resist ink is large, marking by the laser beam unit 5 may take time. In such a case, the moving transport mechanism drive control means 27 calculates the time required for marking of the laser beam unit 5 and determines the moving speed Sa of the substrate W. On the other hand, at the moving speed Sa of the substrate W, the peripheral exposure in the ultraviolet irradiation unit 9 may be overexposed. For this reason, the ultraviolet irradiation drive control means 29 receives the moving speed Sa of the substrate W from the moving transport mechanism drive control means 27. Then, the irradiation area adjustment shutter mechanism 10 adjusts the position of the width adjustment light shielding plate 13a.
On the contrary, the moving transport mechanism drive control means 27 may determine the moving speed Sb of the substrate W during exposure in the ultraviolet irradiation unit 9 in relation to the necessary exposure amount of the resist ink with respect to the ultraviolet rays. In this case, the laser beam irradiation drive control unit 28 receives the moving speed Sb of the substrate W from the moving transport mechanism drive control unit 27. Then, the laser beam unit 5 determines the intensity of the laser beam according to the moving speed Sb.

  For example, when the signal sent from the moving transport mechanism drive control means 27 is the moving speed Sa, the irradiation area of the irradiation area adjusting shutter mechanism 13 corresponding to the moving speed Sa is changed to the ultraviolet irradiation driving control means. 29 to control. That is, the ultraviolet irradiation drive control means 29 substitutes the moving speed Sa into a predetermined arithmetic expression, for example, how much the irradiation area is with respect to the moving speed Sa to obtain an appropriate exposure state. Thus, the irradiation area is calculated, the movement amount (movement position) of the width adjustment light shielding plate 13a is obtained from the calculation result, and the width adjustment light shielding plate moving unit 13b is controlled.

When the signal sent from the moving transport mechanism drive control means 27 is the moving speed Sb, the laser beam irradiation drive control means 28 changes the excitation light quantity to the laser beam light source 5a to change the laser beam intensity. The integrated speed of the laser beam can be changed by changing the laser beam repetition frequency, or the laser beam intensity can be changed by modulation of the acousto-optic element 7a to correspond to the moving speed Sb. Further, the reflection direction of the laser beam at the galvano mirror unit 7c corresponding to the movement speed Sb is controlled via the laser beam irradiation drive control means 28 so as to correspond to the movement speed Sb.
Thus, the laser beam irradiation drive control means 28 and the ultraviolet irradiation drive control means 29 are configured to operate in accordance with the moving speed of the substrate W. When the moving speed Sa and the moving speed Sb are the same, the units 5 and 9 are controlled so that the exposure operation is performed by the operation set as a reference.

  Next, the case where the peripheral area Wc of the substrate W is specifically exposed will be further described with reference to FIGS. That is, as shown in FIGS. 12A and 12B, the irradiation area adjusting shutter mechanism 10 aligns the concealment plate T2 by the concealment plate moving means 10A in the Y linear direction via the slide mechanism 10A5, thereby concealing. The position of the concealing portion t2a of the plate T2 is set to a position where light is shielded by overlapping the position of the identification mark M1. Here, the concealing portion t2a is attached in advance so as to have the same area as the identification marks M1 and M2. When the peripheral region Wc of the substrate W approaches the irradiation port 9m, the ultraviolet irradiation unit 9 operates the optical path shutter mechanism 9c to move the light shielding plate 9c1 so as to retract from the optical path, so that the ultraviolet light from the discharge lamp 9a side is obtained. Is irradiated to the peripheral region Wc.

When the position of the identification mark M1 is sent along with the movement of the substrate W, the concealing part t2a of the concealing plate T2 overlapping the position of the identification mark is synchronized with the moving speed of the substrate W.
In this state, the remaining peripheral area Wc is irradiated with ultraviolet light in a state where it is moved across the irradiation port 9m and the identification mark M1 is concealed to perform peripheral exposure.

  Further, as shown in FIG. 12C, the concealment plate T3 is identified in the same manner as the concealment plate T2 because the next identification mark M1 continues to the irradiation port 9m in the peripheral region Wc of the substrate W. By moving in synchronization with the moving speed of the substrate W as a position overlapping with the mark M1, the next peripheral area Wc is irradiated with ultraviolet light while the next identification mark M1 is concealed to perform peripheral exposure. .

  Furthermore, as shown in FIG. 12 (d), the concealment plate T2 that has already concealed the identification mark M1 once across the irradiation port 9m has the irradiation port 9m in a direction opposite to the moving direction of the substrate W at a predetermined timing. Move at high speed to cross again. At this time, although the exposure work for the peripheral area Wc of the substrate W is performed, the exposure work for the peripheral area Wc is not hindered because the peripheral area Wc is moved at a high speed when crossing the irradiation port 9m. The concealment plate T2 is positioned at a position overlapping the third identification mark M1 as before, and moves across the irradiation port 9m at the same moving speed as the substrate W, thereby concealing the identification mark M1. Then, the other peripheral area Wc can be exposed.

  As described above, when the identification mark is concealed (light-shielded) by the concealment plates T2 and T3, the irradiation area adjusting shutter mechanism 10 moves at the same moving speed as the substrate W, crosses the irradiation port 9m, and corresponds to the next identification mark. In this case, it is possible to cope with an increase in the number of identification marks M1 (M2) by repeatedly performing movement in a direction opposite to the moving direction of the substrate W so as to cross the irradiation port 9m. .

  As shown in FIGS. 13A to 13D, when there are pattern regions on both sides of the peripheral region Wc of the substrate W, the concealing plate T1 is used together with the concealing plates T2 and T3. It corresponds.

  As shown in FIG. 13A, first, the housing 9k is moved in the Y linear direction via the moving mechanism 12, and one end of the irradiation port 9m is adjusted to a position where the pattern region Wp of the substrate W can be concealed. When the concealing plate T1 is used, the second frame body 10B1 is moved to a predetermined position along the slide mechanism 10A5, and the concealing plates T2 and T3 are positioned in the Y linear direction. Further, through the Y-direction moving means 10D, the concealment plate T1 is moved in the Y linear direction and sent to a position where the pattern area Wp can be concealed, so that the pattern area Wp opposite to the peripheral area Wc cannot be irradiated with light. A predetermined width in the Y straight direction of 9 m is shielded from light.

  Then, in the state where the irradiation area of the irradiation port 9m is narrowed by the concealment plate T1, the concealment plates T2 and T3 are used to change the identification mark M1 as already described with reference to FIGS. By exposing the peripheral area Wc while being shielded, the peripheral exposure is performed in a state where the pattern areas Wp are arranged on both sides of the peripheral area Wc. Note that the irradiation area adjusting shutter mechanism 10 is appropriately controlled by the ultraviolet irradiation drive control means 29 of the control mechanism 20 based on the product data of the substrate W and the position data of the substrate W.

When the identification mark M1 in the X linear direction of the substrate W and the peripheral region Wc thereof are exposed, the substrate W has both the X linear direction (one linear method) and the Y linear direction (the other linear direction). It is determined whether the peripheral area Wc has been exposed (S11) (for example, due to the operating state of the third movement guide mechanism 3C with respect to one substrate W). The stage 2 is once returned to the movement start end, and the stage 2 is rotated 90 degrees by the third movement guide mechanism 3C of the movement transport mechanism 3 at either the movement end or the movement start end, and the substrate W is rotated 90 degrees. Let And as mentioned above,
By performing the operations from step 6 (S6) to step 10 (S10) in the same manner, the identification mark M2 is exposed in the peripheral region Wc of the substrate W, and all the substrate W is exposed by exposing the remaining peripheral region Wc. The peripheral exposure for the peripheral region Wc is terminated.

  When the peripheral exposure of the substrate W is completed, the substrate W is moved from the carry-out side (not shown) formed on the movement end side of the substrate W or from the carry-in side into which the substrate W is loaded. It is carried out by.

  Depending on the type of the substrate W, there is a case where an identification mark is not formed in the middle peripheral region Wc of the substrate W shown in FIG. 3, and in that case, irradiation in the Y linear direction is performed only by the concealment plate T1 in FIG. The peripheral exposure can be completed by shielding the light from the opening 9m.

  Depending on the type of the substrate W, there is a substrate without the identification mark W2 as shown in FIG. 3 when rotated by 90 degrees. Since the substrate W without such an identification mark M2 only needs to be irradiated with ultraviolet light on the ultraviolet irradiation unit 9 side without using a laser beam, the positioning of the housing 9k by the moving mechanism 12 and irradiation region adjustment By aligning the concealment plate 1 of the shutter mechanism 10, an ultraviolet light exposure operation can be performed. Therefore, the control mechanism 20 performs control based on the product data of the substrate W so that the moving speed of the substrate W is changed from the initial state of the substrate W. Thus, since there is no identification mark M2, the moving speed of the substrate W when rotated 90 degrees is set in a state where the irradiation area by the irradiation area adjusting shutter mechanism 13 is maximized at the irradiation port 9m. It is set to increase the efficiency of the exposure work.

In the present apparatus 1, the ultraviolet irradiation unit 9 measures the illuminance by the measuring instrument 11 before the next substrate W is transported after the peripheral exposure in the peripheral region Wc of the substrate W is completed.
In the present apparatus 1, the illuminance measuring unit 11a of the measuring instrument 11 is moved from the retracted position to the measuring position by the illuminance measuring unit moving mechanism 11b, and is positioned immediately below the irradiation port 9m. And this apparatus 1 operates the light-shielding plate 9c1 of the optical-path shutter mechanism 9c, and irradiates light to the illuminance measurement part 11a from the irradiation port 9m, and measures the illuminance of light. Then, the measured measurement results are sent from the measuring means 30 of the control mechanism 20 to the ultraviolet irradiation drive control means 29, and the current or voltage for the discharge lamp 9a is adjusted to adjust the illuminance.

  Even in the laser beam unit 5, the apparatus 1 changes the state of the laser beam when the substrate W is not in a position to irradiate the laser beam, by changing the state of the laser beam to the CCD imaging device 6 b and the power meter 6 c or 8b. For example, by adjusting one or more of the adjustment of the laser beam light source 5a, the adjustment of the acoustooptic device 7a, and the adjustment of the beam expander 8c, the laser beam is always maintained in an appropriate state. is doing.

  The apparatus 1 may have a configuration of a laser beam unit 15 instead of the laser beam unit 5 as shown in FIG. FIG. 14 is a side view schematically showing another configuration of the laser beam unit. The configuration of the optical path length adjustment unit 6 is not different from that shown in FIG.

  The laser irradiation units 17 (three in this case) of the laser beam unit 15 are formed in the same configuration, and are configured such that a laser beam is sent from the optical path length adjustment unit 6 through the optical fiber 15a. Yes.

The laser irradiation unit 17 reflects the laser beam from the optical fiber 15a in a predetermined direction.
Reflecting mirror 17a, a digital micromirror device 17b that reflects the laser beam reflected by the reflecting mirror 17a as a predetermined laser beam diameter, and a laser beam reflected from the digital micromirror device 17b having a predetermined beam diameter. And beam irradiation lenses 17c and 17d for irradiating the peripheral area Wc of the substrate W.

  The digital micromirror device 17b includes a minute mirror 17b1 that reflects a laser beam, a torsion pin 17b2 that supports the mirror 17b1 on one end side, a yoke 17b3 provided on the other end side of the torsion pin 17b2, and the like. Since the torsion pin 17b2 can be tilted at a predetermined angle (for example, plus 12 degrees and minus 12 degrees) by the support shaft, the torsion pin 17b2 makes the mirror 17b1 at a predetermined angle in the state of current flowing through the yoke 17b3. By tilting, the direction of the reflected light is controlled.

  By using this digital micromirror device 17b, the laser irradiation unit 17 can irradiate the peripheral area Wc of the substrate W with a desired identification mark M by a laser beam for exposure.

  As described above, the installation position of the device 1 may be changed as long as the same function can be exhibited in each configuration. For example, the irradiation area adjusting shutter mechanism 13 may be installed outside the irradiation port 9m of the housing 9k and shield from the lower side of the irradiation port 9. Further, the number of ultraviolet irradiation units 9 may be one, three, or four. Further, the number of laser irradiation units 7 of the laser beam unit 9 may be three or more, the number of laser beam light sources 5a may be plural, and the number of laser irradiation units 7 may be three or more.

FIG. 2 is a cross-sectional view schematically showing the inside of the apparatus from the side direction with a part of the laser beam / ultraviolet irradiation peripheral exposure apparatus according to the present invention omitted. It is sectional drawing which abbreviate | omits a part of laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention, and shows the inside of an apparatus from a back direction typically. (A), (b) is a top view which shows an example of the board | substrate used with the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. It is a perspective view which shows the stage of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. It is a schematic diagram which shows typically the structure of the laser beam unit of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. It is sectional drawing which notches one part and shows the structure of the ultraviolet irradiation unit of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. FIG. 3 is a perspective view schematically showing the entire irradiation region adjusting shutter mechanism of the laser beam / ultraviolet irradiation peripheral exposure apparatus according to the present invention with a part of the housing cut away. It is a disassembled perspective view which shows typically the component part which moves in the X linear direction of the irradiation area adjustment shutter mechanism of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. Sectional drawing which shows typically the irradiation area adjustment shutter mechanism of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention by notching a part of housing | casing It is a block diagram which shows the control mechanism of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. It is a flowchart which shows the flow of operation | movement of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. (A)-(d) is a perspective view which shows typically the state of the peripheral exposure operation | work of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. (A)-(d) is a perspective view which shows typically the state of the peripheral exposure operation | work of the laser beam and ultraviolet irradiation peripheral exposure apparatus which concerns on this invention. It is a side view which shows typically the other structure of the laser beam unit of the laser beam and ultraviolet irradiation peripheral exposure apparatus concerning this invention.

Explanation of symbols

1. Laser beam / ultraviolet irradiation peripheral exposure device (this device)
DESCRIPTION OF SYMBOLS 2 ... Stage 2a ... Base 2b ... Supporting pillar 2c ... Opening part 2d ... Positioning mark 3 ... Movement conveyance mechanism 3A ... 1st movement guide mechanism 3A ... 3rd movement guide mechanism 3B ... 2nd movement guide mechanism 3C ... 1st 3 moving guide mechanism 3a ... linear motor 3b ... moving rail 4 ... imaging means 5 ... laser beam unit 5A ... laser beam head 5a ... laser beam light source 5b ... optical path adjusting reflector 6 ... optical path length adjusting unit 6a ... branching means 6b ... CCD Image sensor 6c ... Power meter 7 ... Laser irradiation unit 7a ... Acousto-optic device 7b ... Reflector 7c ... Galvano mirror unit 7d ... fθ lens 8 ... Laser beam measurement adjustment mechanism 8a ... Power meter 8b ... CCD image sensor 8c ... Beam expander DESCRIPTION OF SYMBOLS 9 Ultraviolet irradiation unit 9c1 ... Light-shielding plate 9c2 ... Drive part 9a ... Discharge lamp 9b ... Elliptic mirror 9c ... Optical path shutter mechanism 9d ... Fly eye lens 9e Irradiation lens 9k ... Housing 9m ... Irradiation port 10 ... Irradiation area adjustment shutter mechanism 10A ... Concealing plate moving means (third moving means) 10A1 ... First frame body DESCRIPTION OF SYMBOLS 10A2 ... 1st drive motor 10A3 ... Screw 10A4 ... Moving base 10A5 ... Slide mechanism 10A6 ... Guide rail 10A7 ... Moving part 10B ... Concealment board moving means (1st moving means) 10B1 ... 2nd frame body 10B2 ... 2nd drive motor 10B3 ... Screw 10B4 ... Moving base 10B5 ... Sliding mechanism 10b1 ... Frame body 10B6 ... Guide rail 10B7 ... Moving part 10C ... Hiding plate moving means (fourth moving means)
10C2 ... third drive motor 10D ... Y-direction moving means (second moving means)
DESCRIPTION OF SYMBOLS 10a ... Board frame 10b ... Board frame 10d ... Board frame 10e ... Board frame 10D2 ... 4th drive motor 10D3 ... Feed screw 10D4 ... Moving part 11 ... Measuring instrument 11a ... Illuminance measuring part 11b ... Illuminance measuring part moving mechanism 12 ... Moving mechanism DESCRIPTION OF SYMBOLS 12a ... Linear motor 12b ... Guide rail 13 ... Irradiation area adjustment shutter mechanism 13a ... Width adjustment light-shielding plate 13b ... Width adjustment light-shielding plate moving part 15 ... Laser beam unit 15a ... Optical fiber 17 ... Laser irradiation unit 17b1 ... Mirror 17b2 ... Torsion pin 17b3 ... Yoke 17a Reflector 17b ... Digital micromirror device
17c Beam irradiation lens 20 ... Control mechanism 21 ... Input means 22 ... Camera drive control means 23 ... Image data input means 24 ... Position detection means 25 ... Alignment means 26 ... Substrate position calculation means 27 ... Moving and transport mechanism drive control means 28 ... Laser beam irradiation drive control means 29 ... UV irradiation drive control means 30 ... Measuring means 31 ... Storage means A1 ... Support frame B1 ... Second frame body M ... Identification mark M1 ... Identification mark M2 ... Identification mark

T1 ... concealment plate (pattern region concealment plate)
T2 ... concealment plate (first identification mark concealment plate)
T3 ... concealment plate (second identification mark concealment plate)
W ... Substrate Wp ... Pattern area Wc ... Peripheral area b1, c1 ... Base body b2, c2 ... Connection piece t2b, t3b ... Opening t2c, t3c ... Support line part t2a, t3a ... Concealing part

Claims (8)

The substrate is moved along a predetermined moving direction to irradiate the peripheral area formed around the pattern area of the substrate with a laser beam to expose the identification mark, and to irradiate the peripheral area with light including ultraviolet rays. In laser beam / ultraviolet irradiation peripheral exposure equipment for exposure,
A stage for holding the substrate;
Imaging means for capturing image data by imaging a predetermined position set in advance on the substrate and a positioning mark provided in correspondence with a reference position set in advance on the stage;
A moving conveyance mechanism that moves the stage in a rotation direction that is a perpendicular line of a perpendicular perpendicular to the surface of the substrate, the moving direction, and an orthogonal direction that is orthogonal to the moving direction;
A laser beam unit for irradiating a laser beam on the moving path of the moving conveyance mechanism;
An ultraviolet irradiation unit which is provided at a position adjacent to the laser beam unit and irradiates light including ultraviolet rays from the irradiation port to the peripheral region of the substrate;
Control means for controlling the moving transport mechanism so that the substrate is aligned based on the image data acquired by the imaging means, and the exposure of the identification mark by the laser beam and the peripheral exposure by the light including the ultraviolet rays are simultaneously performed. When,
A laser beam / ultraviolet irradiation peripheral exposure apparatus characterized by comprising:   2. The laser beam / ultraviolet irradiation peripheral exposure apparatus according to claim 1, wherein the ultraviolet irradiation unit is arranged to be movable in the orthogonal direction.   The laser beam / ultraviolet irradiation peripheral exposure apparatus according to claim 1, wherein the imaging unit is movably arranged. A laser beam / ultraviolet irradiation peripheral exposure method in which a peripheral region formed around a pattern region of a substrate is irradiated with a laser beam to expose an identification mark, and the peripheral region is irradiated with ultraviolet rays for exposure.
Detecting a predetermined position of the substrate held on the stage and a reference position of the stage to detect the substrate position of the substrate and the reference position of the stage;
An alignment step for performing an alignment operation of the substrate according to a result of the detection step;
After the alignment operation, an exposure step of exposing the peripheral area of the substrate with a laser beam while moving the substrate at a predetermined moving speed and irradiating the remaining peripheral area with light containing ultraviolet rays. When,
A peripheral exposure method for laser beam / ultraviolet irradiation.   5. The laser beam / ultraviolet irradiation peripheral exposure method according to claim 4, wherein in the exposure step, a portion of a peripheral region where the identification mark is exposed is shielded.   The said exposure step determines the intensity | strength of the laser beam irradiated to the said board | substrate and the irradiation amount of the light containing the said ultraviolet-ray based on the moving speed of the said board | substrate. Laser beam / ultraviolet irradiation peripheral exposure method.   In the exposure step, after performing the exposure of the identification mark by the laser beam from one end to the other end in one direction of the substrate and the peripheral exposure by the light including the ultraviolet rays, the substrate is rotated by 90 degrees, and the one direction 7. The exposure of the identification mark with the laser beam and the peripheral exposure with the light including the ultraviolet rays from one end to the other end of the substrate with respect to a direction orthogonal to the substrate. The laser beam / ultraviolet irradiation peripheral exposure method according to the item. The exposure step calculates a moving speed and a moving position of the substrate at the time of exposure based on the aligned alignment position of the substrate and pre-input type data indicating the type of the substrate. The laser beam / ultraviolet irradiation peripheral exposure method according to any one of claims 4 to 7.