CN203380507U

CN203380507U - Laser processing device

Info

Publication number: CN203380507U
Application number: CN201320088070.8U
Authority: CN
Inventors: 中村达哉
Original assignee: Olympus Corp
Current assignee: Olympus Corp
Priority date: 2012-02-28
Filing date: 2013-02-26
Publication date: 2014-01-08
Anticipated expiration: 2023-02-26
Also published as: KR20130098838A; JP2013176788A

Abstract

The utility model provides a laser processing device capable of correctly performing laser processing regardless of configuration of plural pattern sections. The laser processing device is provided with a stage where a substrate is placed; a stage control part controlling movement of the stage and making the stage move to a defect correction position to be corrected; a matching part comparing a camera shooting image shot at the defect correction position with a reference image as a normal pattern; a mask generating part generating a plurality of mask images according to the reference image, and making the whole pattern and the pattern of the reference image the same, wherein, in the mask images, regions with laser irradiation are set as irradiation parts, and the other parts, namely, regions with no laser irradiation are set as non-irradiation parts; and a light beam shaping unit shaping the light beam cross section of laser to be a shape corresponding to the mask image, wherein, the mask generating part, under the condition that a plurality of irradiation parts are provided in the mask images, generates the mask images in a manner that the distance between irradiation parts is greater than a stipulated distance.

Description

Laser processing device

Technical field

The utility model relates to a kind of laser processing device, laser processing and laser beam machining program that forms mistake (defect) for repairing the pattern of generation when various substrates are carried out to pattern forming technology.

Background technology

In the past, plasma display panel), organic EL (Electro Luminescence: electroluminescent) FPD (the Flat Panel Display: flat-panel monitor) in the manufacture process of the various substrates such as substrate, semiconductor crystal wafer, printed circuit board (PCB) such as display at liquid crystal display (LCD:Liquid Crystal Display), PDP (Plasma Display Panel:, in order to improve its yield rate, after each pattern forming technology, check that successively the patterns such as short circuit, bad connection, broken string, the pattern whether have wiring be bad form mistake (defect).If the result of its inspection is to have defect, revise at any time its error location.

As the technology of revising above-mentioned defect, there is a kind of, technology so-called laser repairing (for example,, with reference to patent documentation 1) that revised to rejected region irradiation laser.In the disclosed defect correcting method of patent documentation 1 (laser processing device), the pattern image of machined object and normal pattern image (with reference to image) are compared to the defect of check pattern, and generation mask images, in this mask images, be provided with and the pattern of the machined object obtained from normal pattern image corresponding Ear Mucosa Treated by He Ne Laser Irradiation zone and non-irradiation area, use the micro mirror arrays (spatial modulation element) such as this mask images and DMD to carry out correspondingly to form with its pattern the cross sectional shape of laser, machined object is irradiated to laser, carry out thus defect correction.In this defect correcting method, can carry out defective pattern to again being shaped of desired pattern, remove near the defect be present in pattern.In addition, according to this defect correcting method, be not limited to defect as described above, can also remove the foreign matters such as the particulate that is attached to substrate surface, resist.

Patent documentation 1: TOHKEMY 2011-194432 communique

The utility model content

The problem that utility model will solve

In addition, in the disclosed defect correcting method in the past of patent documentation 1, form the corresponding mask images of pattern of the irradiation object of the cross sectional shape make laser and machined object.Figure 23 means the schematic diagram of the example with reference to image in laser processing device in the past.For example, shown in Figure 23, in the situation that be formed with three drafting department P101～P103 as irradiation object on reference image Dr100, generate the mask images Dm100 (mask information) for the cross sectional shape of laser is carried out to shaping.In mask images Dm100, arrange with three drafting department P101～P103 accordingly as the Pm101～Pm103 of irradiation section of the irradiation area of laser, other zone is not for irradiating the non-irradiation area (Figure 24 (a)) of laser.

At this, in the situation that it is narrow to be formed at the interval of the Pm101～Pm103 of each irradiation section of mask images Dm100, particularly, in the situation that use the laser of the wavelength band more than black light, the machining accuracy of the pattern form that sometimes will process reduces.As one of its reason, the distribution map that can enumerate the heat distribution of laser due to the thermal conductivity difference of the material of the machined surface that is used in machined object changes.Energy distribution when (b) of Figure 24 and 24 (c) illustrate the Ear Mucosa Treated by He Ne Laser Irradiation on the machined surface of machined object.For example, in the situation that be used in, thermal conductivity, the thermal absorptivity of material of machined surface of machined object is low or specific heat is large, as shown in the curve map that (b) of Figure 24 illustrates, become the distribution map with the heat distribution shown in the corresponding heat energy curve of the Pm101～Pm103 of irradiation section L1.On the other hand, in the situation that be used in, thermal conductivity, the thermal absorptivity of material of machined surface of machined object is high or specific heat is little, as shown in the curve map that (c) of Figure 24 illustrates, become the distribution map of the heat distribution shown in heat energy curve L2, the non-irradiation area of the laser between the Pm101～Pm103 of irradiation section is also applied to the heat of laser.In addition, the curve L3 in curve map illustrates the distribution map of the desirable heat distribution of an irradiation section.

In the situation that with (c) of Figure 24, illustrate, by the distribution map of the heat distribution shown in heat energy curve L2, machined object is irradiated to laser, shown in photographed images Da100 as shown in Figure 25, form the drafting department P104 be connected between the drafting department of adjacency in drafting department P101～P103 (with reference to Figure 23).In addition, even the irradiation area of laser is contrary with non-irradiation area, also the interval due to non-irradiation area produces same problem, when irradiation laser carrys out corrective pitting, likely removes the pattern of non-removal object.Like this, according to the configuration difference of drafting department, the likely not corresponding and Laser Processing that can't be expected of the pattern of the irradiation area of laser and expectation.

The utility model completes in view of the above problems, and it is a kind of no matter how the configuration of a plurality of drafting departments all can correctly carry out laser processing device, the laser processing of Laser Processing and the recording medium that has recorded the embodied on computer readable of laser beam machining program that purpose is to provide.

For the scheme of dealing with problems

In order to address the above problem, achieve the goal, the related laser processing device of the utility model irradiates laser to the substrate that is formed with predetermined pattern the defect on aforesaid substrate is carried out to correcting process, this laser processing device is characterised in that, possess: objective table, it loads aforesaid substrate, and can relatively move with respect to image pickup part, this image pickup part is for obtaining a part of enlarged image of this substrate; The objective table control part, it controls the movement of above-mentioned objective table, and makes above-mentioned objective table move to the defect correction position that will carry out above-mentioned correcting process; Matching part, its using photographed images with as the comparing with reference to image of normal pattern, this photographed images is to move at the objective table by being controlled by above-mentioned objective table control part the image that the above-mentioned defect correction position shooting that moves to obtains; The mask generating unit, its judgement based on above-mentioned matching part, according to above-mentioned with reference to image, generate whole pattern and the above-mentioned a plurality of mask images identical with reference to the pattern of image, in each mask images, the zone of irradiating laser is made as to irradiation section, and the zone that other parts are not irradiated to laser is made as non-irradiation section; And beam shaping unit, its in the future the beam cross-section shape of the laser of self-excitation light source be shaped as and the corresponding shape of aforementioned mask image, wherein, in the situation that have a plurality of above-mentioned irradiation section in the aforementioned mask image, the mode that the aforementioned mask generating unit is more than or equal to predetermined distance with the distance between each irradiation section generates mask images.

In addition, the related laser processing device of the utility model is characterised in that, in above-mentioned utility model, above-mentioned beam shaping unit comprises the two-dimensional modulation element.

In addition, the related laser processing device of the utility model is characterised in that, in above-mentioned utility model, also to possess extraction unit, this extraction unit is extracted in the defect area that above-mentioned defect correction position exists, and the aforementioned mask generating unit forms and above-mentioned defect area irradiation accordingly section.

In addition, the related laser processing device of the utility model is characterised in that, in above-mentioned utility model, the aforementioned mask generating unit is cut apart the zone of above-mentioned irradiation laser, cuts apart the zone obtained and forms respectively irradiation section in the mode that is more than or equal to the afore mentioned rules distance carrying out this.

In addition, the related laser processing of the utility model irradiates laser to the substrate of the pattern that is formed with regulation the defect on aforesaid substrate is carried out to correcting process, this laser processing is characterised in that, comprise the following steps: objective table moves step, makes the objective table that loads aforesaid substrate move to the defect correction position that will carry out above-mentioned correcting process; The shooting step, moving above-mentioned defect correction position that step moves to and taking the image of aforesaid substrate by above-mentioned objective table; The coupling step, will take the photographed images and comparing with reference to image as normal pattern obtained by above-mentioned shooting step; Mask generates step, judgement based on above-mentioned coupling step, according to above-mentioned with reference to image, generate whole pattern and the above-mentioned a plurality of mask images identical with reference to the pattern of image, in each mask images, the zone of irradiating laser is made as to irradiation section, and the zone that other parts are not irradiated to laser is made as non-irradiation section; And beam shaping step, the beam cross-section shape of the laser of self-excitation light source is shaped as and the corresponding shape of aforementioned mask image in the future, wherein, in aforementioned mask, generate in step, in the situation that have a plurality of above-mentioned irradiation section in the aforementioned mask image, the mode of distance more than predetermined distance of take between each irradiation section generates mask images.

In addition, the related computer-readable recording medium of the utility model has recorded laser beam machining program, this laser beam machining program irradiates for the substrate that makes computer carry out the pattern to being formed with regulation the correcting process that laser is revised the defect on aforesaid substrate, this computer-readable recording medium is characterised in that, comprise following process: the objective table moving process makes the objective table that loads aforesaid substrate move to the defect correction position that will carry out above-mentioned correcting process; The shooting process, at the image of the above-mentioned defect correction position shooting aforesaid substrate moved to by above-mentioned objective table moving process; Matching process, will take the photographed images and comparing with reference to image as normal pattern obtained by above-mentioned shooting process; The mask generative process, judgement based on above-mentioned matching process, according to above-mentioned with reference to image, generate whole pattern and the above-mentioned a plurality of mask images identical with reference to the pattern of image, in each mask images, the zone of irradiating laser is made as to irradiation section, and the zone that other parts are not irradiated to laser is made as non-irradiation section; And beam shaping process, the beam cross-section shape of the laser of self-excitation light source is shaped as and the corresponding shape of aforementioned mask image in the future, wherein, in the aforementioned mask generative process, in the situation that have a plurality of above-mentioned irradiation section in the aforementioned mask image, the mode of distance more than predetermined distance of take between each irradiation section generates mask images.

The effect of utility model

According to the utility model, to one with reference to image, the corresponding a plurality of mask information of configuration of the drafting department of generation and Ear Mucosa Treated by He Ne Laser Irradiation object, irradiate the laser formed with the corresponding cross sectional shape of each mask images, therefore play no matter how the configuration of a plurality of drafting departments all can correctly carry out this effect of Laser Processing.

The accompanying drawing explanation

Fig. 1 is installed to the concept map of summary of the defect correcting method of the related laser processing device of embodiment of the present utility model for explanation.

Fig. 2 means the schematic diagram of the Sketch of the laser processing device that embodiment of the present utility model is related.

Fig. 3 means the flow chart of the general flow that the defect correction of the Laser Processing processing that comprises that the related laser processing device of embodiment of the present utility model carries out is processed.

Fig. 4 means the schematic diagram of an example of the image of the defect correction object that embodiment of the present utility model is related.

Fig. 5 means the schematic diagram of the example with reference to image of storing in the storage part of the laser processing device related at embodiment of the present utility model.

Fig. 6 means the schematic diagram of an example of the defect extraction image that embodiment of the present utility model is related.

Fig. 7 means the schematic diagram of the opening and closing of each speculum in the micro mirror array of the laser processing device that embodiment of the present utility model is related.

Fig. 8 means the schematic diagram of the example with reference to image of storing in the storage part of the laser processing device related at embodiment of the present utility model.

Fig. 9 means the schematic diagram of an example of the first mask images generated in the laser processing device related at embodiment of the present utility model.

Figure 10 means the schematic diagram of an example of the second mask images generated in the laser processing device related at embodiment of the present utility model.

Figure 11 means the schematic diagram of the example that the defect correction of the laser processing device that embodiment of the present utility model is related is processed.

Figure 12 means the schematic diagram of the example that the defect correction of the laser processing device that embodiment of the present utility model is related is processed.

Figure 13 means the schematic diagram of the example that the defect correction of the laser processing device that embodiment of the present utility model is related is processed.

Figure 14 means the schematic diagram of the example that the defect correction of the laser processing device that embodiment of the present utility model is related is processed.

Figure 15 means the schematic diagram of the example that the defect correction of the laser processing device that embodiment of the present utility model is related is processed.

Figure 16 means the schematic diagram of the first mask images generated in the laser processing device related in the variation 1 of embodiment of the present utility model.

Figure 17 means the schematic diagram of the second mask images generated in the laser processing device related in the variation 1 of embodiment of the present utility model.

Figure 18 means the schematic diagram of the first mask images generated in the laser processing device related in the variation 2 of embodiment of the present utility model.

Figure 19 means the schematic diagram of the second mask images generated in the laser processing device related in the variation 2 of embodiment of the present utility model.

Figure 20 means the schematic diagram of the example with reference to image of storing in the storage part of the laser processing device related in the variation 3 of embodiment of the present utility model.

Figure 21 means the schematic diagram of the first mask images generated in the laser processing device related in the variation 3 of embodiment of the present utility model.

Figure 22 means the schematic diagram of the second mask images generated in the laser processing device related in the variation 3 of embodiment of the present utility model.

Figure 23 means the schematic diagram of the example with reference to image in laser processing device in the past.

Figure 24 means the schematic diagram of the distribution map of an example of the mask images that generates in laser processing device in the past and heat distribution.

Figure 25 means the schematic diagram of an example of the image after the Ear Mucosa Treated by He Ne Laser Irradiation in laser processing device in the past.

Description of reference numerals

100: laser processing device; 101: control part; 102: image processing part; 102a: extraction unit; 102b: matching part; 102c: mask generating unit; 103: region setting part; 104: the objective table control part; 105: display part; 106: input part; 107: storage part; 110: microscope section; 111: imaging apparatus; 112: light source; 116: objective table; 120: the laser repairing head; 121: lasing light emitter; 122:LED; 123: micro mirror array (DMD); Da, Da100: photographed images; Dr, Dr1, Dr2: with reference to image; Ds: defect image; Dm1a, Dm2a, Dm3a, Dm4a: the first mask images; Dm1b, Dm2b, Dm3b, Dm4b: the second mask images; P1～P6: drafting department; Pm1, Pm2, Pm1a～Pm1g, Pm2a～Pm2g, Pm3a～Pm3g, Pm4a, Pm4b: irradiation section.

The specific embodiment

Below, describe in detail with reference to the accompanying drawings for implementing mode of the present utility model.In addition, the utility model is not limited to following embodiment.In addition, each figure of reference is only that degree can understand content of the present utility model summarily shows shape, size and position relationship in the following description.That is, the utility model not only is defined in illustrative shape, size and position relationship in each figure.

(embodiment 1)

Below, use accompanying drawing to describe laser processing device, laser processing and the laser beam machining program of embodiment 1 of the present utility model in detail.

Fig. 1 is installed to the concept map of summary of defect correcting method of the laser processing device 100 (with reference to Fig. 2) of present embodiment 1 for explanation.In present embodiment 1, to laser processing device 100 such as inputting (the Automated Optical Inspection: the automatic visual inspection) coordinate of the definite defect in the visual examination unit such as system by AOI.Below, in the present note, by pattern form mistake, the foreign matter such as particulate, resist that is attached to substrate surface simply is called defect.In order to distinguish with other coordinate, this coordinate is called to defect coordinate.Each defect is added respectively to a defect coordinate.In addition, in the following description, the reference position on the housing that coordinate refers to be arranged at the objective table upper surface of mounting substrate (hereinafter referred to as workpiece) or to support objective table is initial point, the two-dimensional coordinate on surface of the work or objective table upper surface.

At the laser processing device 100 of present embodiment 1 in performed defect correcting method, as shown in Fig. 1 (a), at first, control objective table 116 and make it according to repairing the lip-deep defect coordinate be transfused to of object substrate (hereinafter referred to as workpiece), carry out travelling workpiece, take defect in the field of view R1 of the microscope section 110 (object lens) in laser processing device 100.Then, the field of view R1 of object lens M15 is taken to and the image that obtains is analyzed in microscope section 110, determine thus zone (defect recognition zone) G1 that enters the defect G in this image.Wherein, the zone that analyze can not be also integral image, but is less than the specific identified region R2 of the field of view R1 that is equivalent to integral image.In addition, also can in field of view R1, set a plurality of this identified region R2.

In addition, in present embodiment 1 in related microscope section, as object lens M15, object lens (hereinafter referred to as " low power objective ") that for example one times, twice, the multiplying power of five times are lower and ten times, 20 times are installed in nosepiece, the fiftyfold multiplying power with respect to low power objective is at least respectively one, powerful object lens (hereinafter referred to as " high power objective "), and can carries out the switching of object lens.The multiplying power of low power objective and high power objective is an example, as long as high power objective is high with respect to the low power objective multiplying power.In addition, now the object lens M15 of (field of view R1) is low power objective.

In addition, in this defect correcting method, determine the coordinate (with reference to (a) of Fig. 1) of the center of gravity C1 of definite in these cases defect recognition zone G1, then, carry out and follow the tracks for the treatment of S 1, follow the tracks of the part (identifying outer defect area G2) outside field of view R1 (or identified region R2) that extends to of defect G.In present embodiment 1, follow the tracks for the treatment of S 1, the following situation that (b) of exemplary graph 1 illustrates as this: carry out definite center of gravity C1 in (a) of Fig. 1 is dragged to the processing (centering) at field of view R1 center of the microscope section of laser processing device 100.By this, drag, as shown in Fig. 1 (b), outside the identification outside field of view R1 in defect G, at least a portion of defect area G2 or integral body are dragged in field of view R1, therefore can carry out laser repairing to trailing this part.Wherein, for example also can be only in the situation that the coordinate of the center of gravity C1 calculated is comprised near the outer end of identified region R2, be in identified region R2 and central area R3 beyond, carry out this tracking treatment S 1.

Then, in this defect correcting method, as shown in Fig. 1 (c), carry out and repair coordinate computing S2, determine the field of view R1 after dragging is taken and the defect recognition zone G1a that comprises in the image that obtains, calculate respectively centre coordinate (reparation coordinate) c1～c5 of more than one irradiation area (modification region) E1～E5 that this defect recognition zone G1a is distributed.

Then, object lens M15 is switched to high power objective (Laser Processing object lens), centre coordinate (reparation coordinate) c1～c5 that makes objective table 116 move to successively irradiation area (modification region) E1～E5 is felt relieved, and the image in the visual field of 110 pairs of Laser Processing object lens of microscope section is taken.Make to take by microscope section 110 being examined image and being stored in being mated with reference to image of storage part 107 as processing procedure in advance of obtaining, make mask images.In addition, if even low power also can be processed, the Laser Processing object lens also can use low power objective.

Afterwards, as shown in Fig. 1 (d), control part 101 is carried out repair process S3, in this repair process S3, according to the reparation coordinate c1～c5 calculated, drive successively two-dimensional modulation element (micro mirror array 123) according to the mask images obtained, defect G is carried out to Ear Mucosa Treated by He Ne Laser Irradiation, repair thus the rejected region of surface of the work.

By above-mentioned action, in present embodiment 1, even defect G, outside field of view R1, also can the part outside the field of view R1 by defect G drag in field of view R1 afterwards to defect G distribution irradiation area E1～E5 (repairing coordinate c1～c5).Thus, even in the situation that by once the shooting do not photograph defect G integral body fully, also can irradiate continuously laser to this defect G integral body, its result, can suppress the increase of number of strokes and the tediously long and repair-deficiency G integral body of activity duration.

Then, describe the laser processing device 100 of present embodiment 1 in detail with reference to accompanying drawing.Fig. 2 means the block diagram of Sketch of the laser processing device of present embodiment 1.As shown in Figure 2, laser processing device 100 possesses: objective table 116, and it can move in X-Y plane; Objective table control part 104, it controls moving horizontally of objective table 116; Microscope section 110, it is observed and loads the workpiece W10 in objective table 116 from top; Laser repairing 120, its output shines the laser that the defect repair of workpiece W10 is used; Image processing part 102, it is carried out various images to the view data got by microscope section 110 and processes; Storage part 107, its preservation comprises that the program of the laser processing of realizing present embodiment 1 is the various programs of laser beam machining program, various parameters etc.; Control part 101, the defect correcting method that the various programs that it is read from storage part 107 by execution and parameter realize present embodiment 1, and control each one in laser processing device 100; Region setting part 103, the beam cross-section shape (shape in the cross section vertical with the optical axis of laser) of the laser that it uses the defect repair by laser repairing 120 output under the control from control part 101 is adjusted; And user interface, it comprises display part 105 and input part 106, and wherein, this display part 105 shows image, the various information got by microscope section 110, and this input part 106 makes the user input various operations, the setting for laser processing device 100.In addition, not only objective table 116 is the structures that can move in X-Y plane, also microscope 110 can be made as to the structure that can move in X-Y plane, so long as make objective table 116 and microscope 110 relative to being moved microscope section 110 can scan the structure of workpiece W10, can be any-mode.

In said structure, as the workpiece W10 that repairs object, be to have formed glass substrate that the FPD of the pattern of regulation uses, semiconductor substrate, printed circuit board (PCB) etc.This workpiece W10 is loaded on objective table 116.Be provided with numerous hole on the mounting surface of objective table 116.This numerous hole floats workpiece W10 by the gas that never illustrated pump provides, and at this state, by not shown fixed part, workpiece W10 is remained on objective table 116.Perhaps, this numerous hole and not shown vavuum pump can also be linked, air-breathing by from this numerous hole, be fixed in objective table 116 by the workpiece W10 absorption loaded on objective table 116.In addition, as above on objective table 116 holding unit of holding workpiece W10, except above-mentioned situation, also can be made as the structure of a plurality of rollers by being rotated keep substrate roller platform in the mode that can move.And, also can be made as the structure of carrying out supporting substrates with machine assemblies such as fulcrum post, clamping devices.

Microscope section 110 comprises: light source 112, and it throws light on to the workpiece W10 on objective table 116; And the imaging apparatus 111 such as the ccd sensor that thrown light on workpiece W10 is taken, cmos sensor (being CCD in the present embodiment), as obtain by object substrate be workpiece W10 a part of enlarged image image pickup part and bring into play function.The illumination light of exporting from the light source 112 of microscope section 110 sees through relay lens M16, and the conduct light coaxial with the observation optical axis AX to workpiece W10 after reflection on semi-transparent semi-reflecting lens M14, by object lens M15 illumination workpiece W10.In addition, the picture of the workpiece W10 thrown light on like this is by comprising along the viewing optical system of object lens M15, semi-transparent semi-reflecting lens M14, relay lens M13 and the imaging len M12 of observation optical axis AX configuration, at the sensitive surface of imaging apparatus 111, for example amplifies several times～tens times imagings.In addition, the field of view of having passed through the imaging apparatus 111 of this viewing optical system is equivalent to the field of view R1 shown in Fig. 1.The scope of this field of view R1 is greater than an irradiation area.And the scope in the zone of being thrown light on by light source 112 at least is greater than field of view R1.And, be used to the illumination light from light source 112, from top at least roughly being thrown light on equably in field of view R1.

The view data got by imaging apparatus 111 is imported into image processing part 102.102 pairs of view data of inputting of image processing part are input to display part 105 by the view data after processing after carrying out various images processing.Thus, for example roughly show in real time the image of the field of view R1 got by microscope section 110 at display part 105.In addition, image processing part 102 has: extraction unit 102a, and it extracts defect area in the image got by imaging apparatus 111; Matching part 102b, it uses the image got by imaging apparatus 111 and is stored in and carries out matching treatment with reference to image (normal pattern image) in storage part 107; And mask generating unit 102c, it generates the mask information of the mask images at the processing object's position place that comprises workpiece W10 according to the matching result of matching part 102b based on the reference image.

In addition, objective table control part 104 makes objective table 116 be moved horizontally under the control from control part 101, makes the defect correction position (position coordinates of the regulation of defect coordinate, barycentric coodinates and reparation coordinate etc.) of inputting from control part 101 be positioned at the field of view R1 center of microscope section 110.Thus, microscope section 110 is controlled with the relative position of workpiece W10, made the field of view R1 center that is positioned at microscope section 110 from the coordinate of control part 101 inputs.

Laser repairing 120 comprises: lasing light emitter 121, and its output shines the laser (hereinafter referred to as repairing laser) of workpiece W10; As the micro mirror array 123 of spatial optical modulation element, its beam cross-section shape (hereinafter referred to as the laser cross sectional shape) as self-excitation light source 121 laser in future is shaped as the beam shaping unit performance function of the shape (with the corresponding shape of mask images described later) of expectation; And LED122, it exports the reparation laser of self-excitation light source 121 and for the light (hereinafter referred to as guiding light) of the visual field of adjusting viewing optical system, wherein, according to the image got by microscope section 110, workpiece W10 being irradiated is the laser that defect repair is used by spatial modulation.Guiding light from LED122 reflects on semi-transparent semi-reflecting lens M21, and its optical axis is consistent with the optical axis of lasing light emitter 121 thus.

In addition, carry out the reparation laser of self-excitation light source 121 and reflect on semi-transparent semi-reflecting lens M24 by after high reflection mirror M22, micro mirror array 123 and high reflection mirror M23 from the optical axis of the guiding light of LED122, its optical axis is consistent with observation optical axis AX thus.Thereby, the reparation laser reflected on semi-transparent semi-reflecting lens M24 and guiding light by relay lens M13, semi-transparent semi-reflecting lens M14 and object lens M15 from above shine the workpiece W10 objective table 116 along observation optical axis AX.In addition, micro mirror array 123 is for example used DMD (Digital Micromirror Device: digital micro-mirror device) get final product.In addition, as the beam shaping unit, instead product are used other devices such as spatial modulation element of the transmission-types such as other MEMS device, liquid crystal shutter.In the situation that adopt this other device, the technology general knowledge in edition with parallel text field, be made as above-mentioned optical system to have used and the corresponding suitable configuration of optical condition, the structure of parts.In addition, in order to confirm by guiding light or to adjust the irradiation position of repairing laser and use above-mentioned LED122, therefore also can omit above-mentioned LED122 as required.

In addition, the micro mirror array 123 as spatial optical modulation element for example possesses the structure that the tiny mirror as one of micro devices is arranged in to the two-dimensional array shape.The angle of reflection of each tiny mirror can switch to an angle in open angle and these at least two angles of closing angle under the control from control part 101.Open angle refers to that the reparation laser reflected on the tiny mirror in this state is projected onto the angle of the workpiece W10 on objective table 116, and closing angle refers to that the reparation laser reflected on the tiny mirror in this state shines the angle of the laser dampers such as the not shown light-blocking member that is arranged at outside light path, absorption piece as unwanted light.Thereby, switching to open angle or closing angle by the tiny mirror angle of reflection separately that will be arranged in the two-dimensional array shape, can be controlled the cross sectional shape of the reparation laser that projects workpiece W10.Control the switching of open angle and closing angle according to mask images described later.Thus, in the future the cross sectional shape of the reparation laser of self-excitation light source 121 is adjusted into the shape of repairing pattern (described later irradiation section) and shines workpiece W10.This reparation pattern is to irradiate the reparation pattern of repairing laser except normal wiring pattern, such as in the situation that repair pattern, to remove the defect such as bad be following pattern: will the tiny mirror corresponding with the zone of normal wiring in irradiation area etc. be made as closing angle and tiny mirror that will be corresponding with zone in addition is made as open angle.

About repairing the setting of pattern, except setting according to normal wiring pattern as described above, can also set according to defect shape.In this case, the cross sectional shape that makes to repair laser is consistent with defect shape, and tiny mirror that will be corresponding with defect area is made as open angle, will the tiny mirror corresponding with the zone beyond defect area be made as closing angle and gets final product.

Region setting part 103 is controlled respectively the angle of reflection of the tiny mirror of micro mirror array 123 according to the reparation pattern (mask images) from control part 101 inputs, will repair thus the cross sectional shape of laser and control as repairing the shape of pattern.

In addition, as mentioned above, the defect correcting method that the various programs that control part 101 is read from storage part 107 by execution and parameter realize present embodiment 1, and each ones in laser processing device 100 are controlled.At this, describe the defect correcting method of being carried out by control part 101 in detail with reference to accompanying drawing.Fig. 3 means the flow chart of the general flow of the defect correcting method that comprises that Laser Processing that the related laser processing device of present embodiment carries out is processed.In addition, in the following description, with each one under the control at control part 101, moved to illustrate.

At first, to obtain the coordinate of the defect definite by outside inspection unit be defective locations information (step S101) to control part 101.After getting defective locations information, objective table control part 104 makes objective table 116 move to defective locations, makes and comprise defect (step S102) in the field of view of object lens M15.After objective table 116 moves to defective locations, CCD111 is taken the image of the field of view of these object lens M15, with picture signal, is exported (step S103).Picture signal by CCD111 output is taken into image processing part 102 (step S104).

When picture signal is taken into image processing part 102, extraction unit 102a is from the pre-stored corresponding position of field of view with reference to image (normal pattern image), extracting and photograph.Matching part 102b is to being mated with reference to image and the corresponding image of picture signal be taken into of being extracted by extraction unit 102a.Afterwards, extraction unit 102a extracts the defect area (step S105) in image according to the comparative result of matching part 102b.

In addition, in this matching treatment, according to the ratio of the white area in image etc., calculate the coupling mark of the image that obtains as shooting and matching degree (ratio of grade of fit, coupling) with reference to image.According to the comparative result of this matching part 102b, the image that decides shooting to obtain is corresponding with which position with reference in image.

In addition, for example, shown in Fig. 4, form the pattern P of regulation in the photographed images Da in the field of view of object lens M15, have defect G3 between the pattern P of a certain adjacency.Now, in the situation that according to the comparative result of matching part 102b, determine with reference to image be shown in Fig. 5 with reference to image Dr, according to photographed images Da with reference to image Dr, extract Fig. 6 by extraction unit 102a such defect area Gd is shown, by image processing part 102, will comprise the extraction image Ds of this defect area Gd with image signal output.

Control part 101 judges whether to carry out defect correction (step S106) according to the defect area extracted by extraction unit 102a.At this, in the situation that control part 101 is judged as and does not need to carry out defect correction (step S106: "No") according to the defect area extracted, be transitioned into step S107, obtain next defective locations information, driving objective table control part 104 moves objective table 116.Afterwards, control part 101 turns back to step S103, and the shooting that makes CCD111 carry out next defective locations place is processed.

On the other hand, in the situation that control part 101 be judged as and need to carry out defect correction (step S106: "Yes"), control part 101 is transitioned into step S108, judges whether to exist the exposure object of a plurality of laser according to the defect area extracted.At this, in the situation that be judged as the exposure object of laser, not that a plurality of (step S108: "No"), control part 101 is transitioned into step S109, and object lens M15 is switched to object lens for Laser Processing (high power objective).

Afterwards, CCD111 is taken the image of the field of view of these object lens M15 (Laser Processing object lens), with picture signal, is exported, and the picture signal of exporting is taken into image processing part 102 (step S110).In addition, when picture signal is taken into image processing part 102, extraction unit 102a extracts the defect area (step S111) in image according to the comparative result of the matching part 102b to this image.

When the extraction of the defect area got with object lens by Laser Processing in step S111 finishes, mask generating unit 102c generates the mask information that at least comprises mask images.Mask images is for example according to the pattern P with reference to image Dr shown in Fig. 5, the zone beyond pattern P to be made as to the irradiation section (controlling the zone for open angle) of irradiating laser the formation zone of pattern P to be made as to the mask images of the non-irradiation section (other parts beyond irradiation section are the zones that are controlled as closing angle) of not irradiating laser, generates the mask information that comprises this mask images.In addition, in mask information, except mask images, also comprise for the open angle of the tiny mirror to micro mirror array 123 (DMD123) and the indication information that closing angle is controlled etc.

When the generation processing of the mask information of step S112 finishes, region setting part 103 is controlled respectively the angle of reflection of the tiny mirror of micro mirror array 123 according to the mask information from control part 101 inputs, will repair thus the cross sectional shape of laser and control as repairing the shape (step S113) of pattern.Afterwards, by opening lasing light emitter 121, the Ear Mucosa Treated by He Ne Laser Irradiation formed with the corresponding cross sectional shape of mask images is arrived as the workpiece W10 (step S114) that checks object.

Now, mask generating unit 102c can also generate the mask images had with the shape irradiation accordingly section of defect area Gd, is controlled to irradiate cross sectional shape and the corresponding laser of defect area Gd.In this case, in each tiny mirror M of micro mirror array 123, when take hatching while show to control being the tiny mirror of open angle, form Fig. 7 such open angle control area Gm is shown.By each tiny mirror M controlled like this, can irradiate the corresponding laser of cross sectional shape and defect area Gd (defect G3).

After Ear Mucosa Treated by He Ne Laser Irradiation, the Laser Processing of CCD111 after to Ear Mucosa Treated by He Ne Laser Irradiation taken with the image of the field of view of object lens, with picture signal, exported, and the picture signal of exporting is taken into image processing part 102 (step S115).Control part 101 is according to the image of this picture signal be taken into, and by matching treatment etc., judged whether defect correction (reparation) (step S116).

At this, in the situation that be judged as in the image after Ear Mucosa Treated by He Ne Laser Irradiation and repaired, (step S116: "Yes"), control part 101 finishes defect correction to be processed.In addition, in the situation that be judged as in the image after Ear Mucosa Treated by He Ne Laser Irradiation and do not complete reparation (step S116: "No"), control part 101 is transitioned into step S110, again is taken into picture signal, carries out the Ear Mucosa Treated by He Ne Laser Irradiation processing.

On the other hand, in the situation that the exposure frequency with reference to image laser be judged as with respect to irradiation object is a plurality of (a plurality of exposure object) (step S108: "Yes"), control part 101 is transitioned into step S117, and object lens M15 is switched to object lens for Laser Processing (high power objective).At this, as whether being the judgement of a plurality of exposure object, for example can enumerate following situation: the needs of the defect area extracted carry out the shape of defect correction processing, the material that machined surface is thermal conductivity, thermal absorptivity is high or specific heat is little of workpiece W10, workpiece W10, or at this region memory in the zone that is set to the non-irradiation of laser section, comprise the pattern that may have above-mentioned heat affecting.

After switching object lens M15, CCD111 is taken the image of the field of view of these object lens M15 (Laser Processing object lens), with picture signal, is exported, and the picture signal of exporting is taken into image processing part 102 (step S118).In addition, when picture signal is taken into image processing part 102, extraction unit 102a extracts the defect area (step S119) in image according to the comparative result of the matching part 102b to this image.

When the extraction of the defect area obtained with object lens by Laser Processing by step S119 finishes, carry out the centering (step S120) of the defect area in image, mask generating unit 102c generates the mask information (step S121) that comprises mask images.In the situation that the exposure object of laser is a plurality of, mask images is also with reference to image, to generate a plurality of for one.

For example, be made as corresponding with the photographed images that comprises defect area with reference to image be shown in Fig. 8 with reference to image Dr1.With reference to image Dr1, in forming regional Ps, pattern is formed with a plurality of drafting department P1～P3 about this.Each drafting department P1～P3 in pattern forms regional Ps from the paper left side according to the order spread configuration of drafting department P1, drafting department P3, drafting department P2.In addition, take this with reference to image Dr1 in drafting department P1～P3 as the Ear Mucosa Treated by He Ne Laser Irradiation zone, describe.

At this, between drafting department P1 and drafting department P3 apart between d1 and drafting department P2 and drafting department P3, apart from d2, likely being subject to respectively the heat affecting (with reference to (c) of Figure 24) according to above-mentioned heat energy curve L2.Therefore, mask generating unit 102c generates respectively the first and second mask information, and this first and second mask information comprises respectively a plurality of mask images (the first mask images, the second mask images) for avoiding heat affecting.The pattern of this first and second mask images integral body is identical with the pattern with reference to image Dr1.In addition, can be subject to the distance of heat affecting is decided by the energy of the intensity of laser, Ear Mucosa Treated by He Ne Laser Irradiation, the width that irradiates size or drafting department, the thermal conductivity that is used in the material (material of machined surface, pattern forming material) of pattern in forming, thermal absorptivity, specific heat, thickness, density etc.As for example, for avoiding the distance of heat affecting, more than being set as 3 μ m.At this, the material of machined surface can be the individual layer consisted of a kind of material, can be also the multilayer by different a plurality of materials are laminated mutually.In addition, in the situation that machined surface forms multilayer, preferably consider the above-mentioned characteristic of each material.

Fig. 9 means the schematic diagram of the first mask images Dm1a generated in the laser processing device related in present embodiment 100.The first mask images Dm1a forms the corresponding mask pattern of regional Ps at the pattern with reference image Dr1 and forms in regional Pms, forms the Pm1 of irradiation section, the Pm2 that irradiates laser in the position corresponding with drafting department P1, P2.At this, in the situation that there is a plurality of irradiation section in mask images as the Pm1 of irradiation section, Pm2, between the Pm1 of irradiation section, Pm2 is to be set as the distance that is not subject to the such heat affecting of above-mentioned heat energy curve L2 apart from d3.

Figure 10 means the schematic diagram of the second mask images Dm1b generated in the laser processing device related in present embodiment 100.The second mask images Dm1b forms the corresponding mask pattern of regional Ps at the pattern with reference image Dr1 and forms in regional Pms, forms the Pm3 of irradiation section that irradiates laser in the position corresponding with drafting department P3.

When the generation processing of the first and second mask information of step S121 finishes, at first region setting part 103 is controlled respectively the angle of reflection of the tiny mirror of micro mirror array 123 according to the first mask images Dm1a from control part 101 inputs, will repair thus the cross sectional shape of laser and control as repairing the shape (step S122) of pattern.Afterwards, by opening lasing light emitter 121, using forming with the Pm1 of irradiation section of mask images, the Ear Mucosa Treated by He Ne Laser Irradiation of the corresponding cross sectional shape of Pm2, arrive as the workpiece W10 (step S123) that checks object.

Afterwards, according to the second mask images Dm1b from control part 101 inputs, the angle of reflection of the tiny mirror of micro mirror array 123 is controlled respectively, will be repaired thus the cross sectional shape of laser and control as repairing the shape (step S124) of pattern.Afterwards, by opening lasing light emitter 121, formation and the Ear Mucosa Treated by He Ne Laser Irradiation of the corresponding cross sectional shape of the Pm3 of irradiation section of mask images are arrived as the workpiece W10 (step S125) that checks object.

After according to a plurality of mask information, carrying out Ear Mucosa Treated by He Ne Laser Irradiation, the Laser Processing of CCD111 after to Ear Mucosa Treated by He Ne Laser Irradiation taken with the image of the field of view of object lens, with picture signal, exported, the picture signal of exporting is taken into image processing part 102 (step S126).Control part 101, according to the image of this be taken into picture signal, judges by matching treatment etc. whether defect correction (reparation) completes (step S127).

At this, in the situation that be judged as in the image after Ear Mucosa Treated by He Ne Laser Irradiation and repaired, (step S127: "Yes"), control part 101 finishes defect correction to be processed.In addition, in the situation that in the image after Ear Mucosa Treated by He Ne Laser Irradiation judgement repair and not complete that (step S127: "No"), control part 101 is transitioned into step S118, again is taken into picture signal, carries out the Ear Mucosa Treated by He Ne Laser Irradiation processing.

Figure 11～15 mean the schematic diagram of the example that the defect correction of the related laser processing device of present embodiment 100 is processed.Specifically, in above-mentioned steps S110～S114 and S118～S125, as one for example the schematic diagram shown in Figure 11～15 carry out like that the defect correction processing.As shown in figure 11, the drafting department P5 of concave shape section that is formed with the drafting department P4 that is convex roughly and there is the ledge of pattern P of accommodating 4, at the region memory of the concave shape section of the ledge that comprises this pattern P 4 and drafting department P5 at defect G4.

Set for the defect G4 shown in Figure 11 the mask pattern that carries out a plurality of exposure-processed and form regional Pms1 (S117～S127 is corresponding with step), part beyond this mask pattern forms regional Pms1, generate and the corresponding mask images of drafting department P5, irradiate laser (with reference to Figure 12).

Process by the Ear Mucosa Treated by He Ne Laser Irradiation shown in Figure 12, remove the defect G4 that mask pattern forms regional Pms1 part in addition, become the state (with reference to Figure 13) of residual defects G4a in mask pattern forms regional Pms1.To this, the mask pattern that can be subject to heat affecting according to the interval setting of pattern forms regional Pms2 (S117～S127 is corresponding with step), part beyond this mask pattern forms regional Pms2, generate and drafting department P4 and corresponding the first mask images of P5, irradiate laser (with reference to Figure 13).

Afterwards, for the defect G4b residued between drafting department P4 and P5, generate and drafting department P4 and corresponding the second mask images of P5, irradiate laser (with reference to Figure 14).Thus, can access drafting department P4 and the P5 (with reference to Figure 15) that has removed defect G4.

Process by above-mentioned Laser Processing, even in the situation that the configuration of drafting department can be subject to the heat affecting of laser, also can correctly carry out Laser Processing.; the utility model is a kind of following laser processing: have image pickup part; this image pickup part is for obtaining a part of enlarged image of the workpiece W10 to being formed with predetermined pattern; use the image got by image pickup part to irradiate to workpiece W10 the correcting process that laser carries out the defect on workpiece W10; in this laser processing; the defect correction position that objective table is moved to carry out correcting process; this objective table mounting workpiece W10, with respect to image pickup part, relatively moving on can the plane parallel at the plate face with workpiece W10, (objective table moves step: S102); Take image (the shooting step: step S118) of workpiece W10 in the defect correction position moved to; Generate mask images according to the reference image, form the irradiation section that will irradiate laser in this mask images, it is non-irradiation section that other parts are made as to the zone of not irradiating laser, this irradiation section is the photographed images that shooting is obtained and compares with reference to image, (the mask generation step: step S121) that the judgement based on by this comparison forms; And the beam cross-section shape of the laser of self-excitation light source is shaped as and the corresponding shape of mask images (beam shaping step: step S122, S124) in the future, wherein, at mask, generate in step, in the situation that there are a plurality of patterns corresponding with irradiation section in the reference image, the mode of distance more than predetermined distance between each irradiation section of take on mask images generates a plurality of mask images, as the technical solution of the utility model, do not need in Fig. 3 the institute in steps.

According to above-mentioned embodiment, to the corresponding a plurality of mask information of configuration with reference to the drafting department of image generation and Ear Mucosa Treated by He Ne Laser Irradiation object, irradiate the laser formed with the corresponding cross sectional shape of each mask images, therefore no matter how the configuration of a plurality of drafting departments all can correctly carry out Laser Processing.Thus, even drafting department is fine drafting department, also can use laser to carry out microfabrication.In addition, even in the situation that use the laser of the wavelength band more than black light, the machining accuracy ground that also can not reduce processed pattern form carries out Laser Processing.

In addition, as technology in the past, as the defect correcting method that there is no heat affecting, enumerate the method for having used ultraviolet ray (wavelength 266nm), but need in the method micro mirror array 123 (DMD123) is replaced with and array corresponding to ultraviolet ray, need to consider that DMD that the cost caused due to this replacement increases, caused by this wavelength (266nm) is deteriorated etc. on installing and the impact of irradiation object is designed.

Figure 16, the 17th, be illustrated respectively in the schematic diagram of first, second mask images generated in the related laser processing device of modified embodiment of the present embodiment 1.In addition, whole corresponding and drafting department P1～P3 irradiation laser is described with reference to image Dr1 with shown in Fig. 8 of related the first and second mask images with variation 1.In the above-described embodiment, correspondingly to form shape with each drafting department and the roughly the same irradiation section of drafting department is illustrated, but the shape that also can cut apart drafting department, form respectively irradiation section to become mode more than predetermined distance cutting apart the zone obtained.

Form the Pm1a of irradiation section, Pm2a, the Pm3a that alongst halves such by drafting department P1～P3 of Fig. 8 in the first mask images Dm2a shown in Figure 16.At this, in variation 1, the Pm1a of irradiation section, Pm2a, Pm3a are identical with respect to the relative position of each drafting department P1～P3.

In addition, in the second mask images Dm2b shown in Figure 17, with the Pm1a of irradiation section, Pm2a, Pm3a similarly, form the Pm1b of irradiation section, Pm2b, the Pm3b alongst halve such by drafting department P1～P3 of Fig. 8.At this, the Pm1b of irradiation section, Pm2b, Pm3b are identical respectively with respect to the relative position of each drafting department P1～P3, for drafting department P1～P3, are configured in and the Pm1a of irradiation section, a side that Pm2a, Pm3a are contrary.

Now, between the Pm1a of irradiation section and the Pm3a of irradiation section apart between d4, the Pm2a of irradiation section and the Pm3a of irradiation section apart between d5 and the Pm1b of irradiation section and the Pm3b of irradiation section apart between d6, the Pm2b of irradiation section and the Pm3b of irradiation section apart from d7 be there is no the predetermined distance of heat affecting more than.Thus, as embodiment described above, by using the first and second mask images, irradiate by stages laser, no matter how the configuration of a plurality of drafting departments all can correctly carry out Laser Processing.

Figure 18, the 19th, be illustrated respectively in the schematic diagram of first, second mask images generated in the related laser processing device of modified embodiment of the present embodiment 2.In addition, related the first and second mask images and variation 1 whole corresponding and drafting department P1～P3 irradiation laser is described with reference to image Dr1 with shown in Fig. 8 similarly with variation 2.

The first mask images Dm3a shown in Figure 18 is by length direction five deciles of the drafting department P1 of Fig. 8, and the position of rejecting at interval forms respectively the Pm1c of irradiation section, Pm1d, Pm1e.In addition, similarly, drafting department P2 is also formed to the Pm2c of irradiation section, Pm2d, Pm2e with same interval, drafting department P3 is also formed to the Pm3c of irradiation section, Pm3d with same interval.At this, in order to ensure and the irradiation section of the drafting department of adjacency between distance, the Pm3c of irradiation section, Pm3d is configured in and the Pm1c of irradiation section, Pm1d, Pm1e and the Pm2c of irradiation section, Pm2d, Pm2e adjoining position place not.

In addition, in the second mask images Dm3b shown in Figure 19, in the Pm1c of the irradiation section that do not configure of the drafting department P1 of five deciles, the position of Pm1d, Pm1e, form the Pm1f of irradiation section, Pm1g.In addition, similarly, drafting department P2 is formed to the Pm2f of irradiation section, Pm2g.To drafting department P3, in the mode contrary with drafting department P1, P2, in the position that does not configure the Pm3c of irradiation section, Pm3d, form the Pm3e of irradiation section, Pm3f, Pm3g.

Now, more than the interval of each irradiation section (relative distance) is respectively the predetermined distance that there is no heat affecting.Thus, as embodiment described above, no matter how the configuration of a plurality of drafting departments all can correctly carry out Laser Processing.

Figure 20 means the schematic diagram of the example with reference to image of storing in the storage part of the laser processing device related in modified embodiment of the present embodiment 3.Figure 21, the 22nd, be illustrated respectively in the schematic diagram of first, second mask images generated in the related laser processing device of modified embodiment of the present embodiment 3.In addition, with variation 3, related the first and second mask images are whole corresponding with the pattern with reference to image Dr2 shown in Figure 20 and the drafting department P6 irradiation laser that is the L word shape is described.

In the first mask images Dm4a shown in Figure 21, the position corresponding at a straight line portion of the L word of the drafting department P6 with Figure 20 forms the Pm4a of irradiation section.In addition, in the second mask images Dm4b shown in Figure 22, the position corresponding at another straight line portion of the L word of the drafting department P6 with Figure 20 forms the Pm4b of irradiation section.

As mentioned above, in the situation that, as there is the angle below 90 ° in the pattern of L word shape, by being cut apart to irradiate, can form more accurately the angle of pattern as the Pm4a of irradiation section, Pm4b.

In addition, above-mentioned embodiment with and variation be only for implementing example of the present utility model, the utility model is not limited to these examples, carry out various distortion also in scope of the present utility model according to specification etc., and, according to above-mentioned record, it is apparent can carrying out other various embodiments in scope of the present utility model.Certainly, for example to each embodiment suitably illustrative variation also can be applied to other embodiment.

For example, in the laser processing device 100 of above-mentioned embodiment, the objective table 116 that formation can move in X-Y plane and the objective table control part 104 that moving horizontally of objective table 116 controlled, by objective table 116, workpiece W10 is moved in X-Y plane, but, in addition, also can be made as following structure: fixation workpiece W10 on objective table moves microscope section 110 and laser repairing 120 in X-Y plane.That is, if the mobile unit that the relative position of microscope section 110, laser repairing 120, workpiece W10 is changed and the mobile control division of controlling this mobile unit can comprise any structure.

In addition, in the above-described embodiment, as the beam shaping unit, used the micro mirror array 123 as spatial light modulator, but conduct beam shaping unit in addition also can be used variable gap, liquid crystal shutter etc.That is,, if the cross sectional shape of laser beam is shaped as to the beam shaping unit of the shape of expectation, can comprise any structure.

In addition, in the above-described embodiment, show to have defect is irradiated to the example of defect correction device that laser carries out the defect correction section of defect repair, but be not limited to the defect correction section of this use laser, such as also can replace with mode with probes such as distributor, pins, ink-jetting style, transfer printing mode etc. to defect revised material coating, describe, defect correction section (being generically and collectively referred to as coating correction) that the mode of defect repair is carried out in transfer printing etc., such as use the probe such as pin to defect cut off, the defect correction section of excision, shaping.In this case, the laser processing of above-mentioned embodiment and the repair process in laser beam machining program (carry out and repair) are processed from the processing that the repair process of being undertaken by Ear Mucosa Treated by He Ne Laser Irradiation for example replaces with coating by revising material, describes, transfer printing is carried out, can be made as laser processing shared in various laser processing devices and laser beam machining program thus.

As mentioned above, related laser processing device, the defect correcting method of the utility model and the recording medium that recorded the embodied on computer readable of defect correction program are being useful no matter how the configuration of a plurality of irradiation patterns is all correctly carried out aspect Laser Processing.

Claims

1. a laser processing device, irradiate laser to the substrate that is formed with predetermined pattern the defect on aforesaid substrate carried out to correcting process, and this laser processing device is characterised in that to possess:

Objective table, it loads aforesaid substrate, and can relatively move with respect to image pickup part, and this image pickup part is for obtaining a part of enlarged image of this substrate;

The objective table control part, it controls the movement of above-mentioned objective table, and makes above-mentioned objective table move to the defect correction position that will carry out above-mentioned correcting process;

Matching part, its using photographed images with as the comparing with reference to image of normal pattern, this photographed images is to move at the objective table by being controlled by above-mentioned objective table control part the image that the above-mentioned defect correction position shooting that moves to obtains;

The mask generating unit, its judgement based on above-mentioned matching part, according to above-mentioned with reference to image, generate whole pattern and the above-mentioned a plurality of mask images identical with reference to the pattern of image, in each mask images, the zone of irradiating laser is made as to irradiation section, and the zone that other parts are not irradiated to laser is made as non-irradiation section; And

The beam shaping unit, its in the future the beam cross-section shape of the laser of self-excitation light source be shaped as and the corresponding shape of aforementioned mask image,

Wherein, in the situation that have a plurality of above-mentioned irradiation section in the aforementioned mask image, the mode that the aforementioned mask generating unit is more than or equal to predetermined distance with the distance between each irradiation section generates mask images.

2. laser processing device according to claim 1, is characterized in that,

Above-mentioned beam shaping unit comprises the two-dimensional modulation element.

3. laser processing device according to claim 1, is characterized in that,

Also possess extraction unit, this extraction unit is extracted in the defect area that above-mentioned defect correction position exists,

The aforementioned mask generating unit forms and above-mentioned defect area irradiation accordingly section.

4. laser processing device according to claim 1, is characterized in that,

The aforementioned mask generating unit is cut apart the zone of above-mentioned irradiation laser, cuts apart the zone obtained and forms respectively irradiation section in the mode that is more than or equal to the afore mentioned rules distance carrying out this.