JP2008254344A - Metal mask and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a metal mask capable of surely preventing a recognition mark from dropping out and easily forming the recognition mark to a foil article. <P>SOLUTION: The metal mask 1 is manufactured by the first process wherein a thin film resist 2 is formed on one face of the metal mask 1 on which an opening pattern for applying and forming a solder paste or the like on a printed wiring board is formed, the second process wherein the resist 2 on a part for forming the recognition mark is removed from one face of the metal mask 1, the third process wherein the part for forming the recognition mark of the metal mask 1 and an electrode 4 are immersed in an electrolyte 5 and the metal mask 1 and the electrode 4 are connected with an AC power source 6 to form a film 1b with a color darker than that of the other part on a specified position on one face of the metal mask 1 by an electrolytic treatment, and the fourth process wherein after the film is formed, the resist 2 is removed from the one face of the metal mask 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a metal mask provided with a recognition mark and a manufacturing method thereof.

  In order to mount various electronic components on a printed wiring board, conventionally, a method of applying and forming a solder paste (cream solder) or the like on a printed wiring board by a screen printing method using a metal mask has been employed. Generally, in a screen printing method using a metal mask, a solder paste or the like is sequentially applied to each printed wiring board that moves and stops below the metal mask by a conveyor or the like. For this reason, a recognition mark for alignment with a printed wiring board is formed on one side or both sides of the metal mask. Before applying solder paste or the like, the metal mask and each of the metal masks are used as a reference. Alignment with the printed wiring board is performed.

  Conventionally, when forming a recognition mark on a metal mask, an opening (opening pattern) for applying a solder paste or the like to a printed wiring board is formed on the metal mask, and then an etching solution is used at a predetermined position of the metal mask. A method has been employed in which a concave portion is formed (half etching), and toner (a mixture of fine carbon powder and adhesive) is filled in the concave portion and dried.

  Further, as a conventional technique for forming a recognition mark on a metal mask, a metal mask manufactured by electroforming has been proposed in which a concave portion of a recognition mark is formed simultaneously with the formation of an opening (for example, a patent). Reference 1). The method described in Patent Document 1 is intended to improve the relative positional accuracy between the opening and the recognition mark. However, even if the concave portion is formed at a predetermined position of the metal mask by the above method, the recognition mark In order to complete the toner, a process of filling the recess with toner and drying it was further required.

JP-A-7-256855

  In conventional metal masks that use toner to form recognition marks, including those described in Patent Document 1, toner may be removed from the recesses of the recognition marks. In such a case, alignment to the printed wiring board may occur. There was a problem of being unable to do so.

  In many cases, the toner drops from the recesses when the metal mask is cleaned. Particularly in recent years, since the openings of the metal mask are densely packed, ultrasonic cleaning is often used to remove solder paste and the like. For this reason, the toner easily falls off from the concave portion due to the cavitation effect or the like, which is a cause of frequent occurrence of the above problems.

  Further, if the toner of the recognition mark falls off after the metal mask is incorporated into the production line, it is necessary to stop the production line and refill the recess with the toner. Furthermore, when the user of the metal mask cannot perform the filling operation, for example, it is necessary to call an engineer of the metal mask manufacturer to perform the filling operation. For this reason, once the toner has dropped out, there has been a problem that the productivity of the production line including the metal mask as a part thereof is significantly reduced.

  Further, in the conventional method, since the etching solution is used to form the concave portion of the recognition mark, the waste solution comes out and is not environmentally preferable.

  Furthermore, in the conventional method, since the recognition mark is formed by filling the concave portion with the toner, the concave portion needs a predetermined depth (for example, a depth of 50 μm or more) for filling the toner. Therefore, the method of forming a recognition mark using toner is difficult to apply to a foil metal mask, and in particular, when it is necessary to form a recognition mark on both sides, the application is impossible. .

  The present invention has been made to solve the above-described problems. The object of the present invention is to reliably prevent the recognition mark from falling off and to easily form the recognition mark on a foil. A metal mask that can be used, and a method for manufacturing the same.

  The metal mask according to the present invention is provided close to the opening pattern formed for applying and forming a solder paste or the like on the printed wiring board and the opening pattern for alignment with the printed wiring board. And a plurality of recognition marks engraved by.

  The metal mask manufacturing method according to the present invention includes a first step of forming a thin-film resist on one surface of a metal mask on which an opening pattern for applying and forming a solder paste or the like on a printed wiring board is formed. A second step of removing the resist in the part where the recognition mark is to be formed from one surface of the metal mask, and the part in which the recognition mark is to be formed in the metal mask and the electrode are immersed in an electrolytic solution so that the metal mask and the electrode are exchanged with each other. By connecting to a power source, a third step of forming a film having a darker color than other parts by electrolytic treatment at a predetermined position on one surface of the metal mask, and after forming the film, from one surface of the metal mask And a fourth step of removing the resist.

  According to the present invention, it is possible to reliably prevent the recognition mark from dropping off and to easily form the recognition mark on the foil.

  In order to explain the present invention in more detail, it will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1 FIG.
1 to 10 are views showing a metal mask manufacturing process according to the first embodiment of the present invention. The process of forming recognition marks on both sides of the metal mask will be described in detail with reference to FIGS.

  First, an opening (opening pattern) (not shown in FIGS. 1 to 10) for applying and forming a solder paste or the like on a printed wiring board at a predetermined position of the metal mask 1 by electroforming or laser processing. Form. Then, a metal mask 1 in which processing of the opening has been completed is prepared (see FIG. 1), and oil adhering to both surfaces of the metal mask 1 is removed with a degreasing solution (see FIG. 2). After removing the oil with a degreasing solution, a thin resist 2 (photosensitive film) is formed on each side of the metal mask 1 (the surface on which the recognition mark is formed) using a resist solution or a dry film ( (See FIG. 3).

  Next, on each resist 2 formed on both surfaces of the metal mask 1, a film 3 provided with a positive type recognition mark portion 3a is placed and baked (see FIG. 4). In the above process, as a matter of course, the film 3 is arranged with the recognition mark portion 3a provided on the film 3 aligned with the position where the recognition mark of the metal mask 1 is formed, and then exposed. Here, since light does not pass through the black portion of the recognition mark portion 3a during exposure, the resist 2 in the portion located below the recognition mark portion 3a is not cured. On the other hand, since light is transmitted through the portions other than the recognition mark portion 3a in the film 3, the resist 2 positioned below the portion other than the recognition mark portion 3a is cured.

  FIG. 4 shows an exposure process when the negative resist 2 is used. On the other hand, when the positive type resist 2 is used, the film 3 provided with the negative type recognition mark portion 3a may be used. In this case, contrary to the above case, light is transmitted only through the recognition mark portion 3a, and the resist 2 in the portion located below the recognition mark portion 3a is dissolved.

  After the exposure step is completed, the film 3 is peeled off from each resist 2, and only the portion of the resist 2 that has not been cured in the exposure step (uncured resist portion 2a) is developed on both surfaces of the metal mask 1 with a developer. Remove from above (see FIG. 5). Through the above-described steps, the resist 2 on the portion where the recognition mark is to be formed (the recognition mark forming portion 1a) can be removed from both surfaces of the metal mask 1, and the recognition mark forming portion 1a is formed on both surfaces of the metal mask 1. The resist 2 opened only in part is completed (see FIG. 6).

  Next, a recognition mark is imprinted (electrolytic marking) on a predetermined position (recognition mark forming portion 1a) of the metal mask 1 by electrolytic treatment. The specific process is as follows. First, as shown in FIG. 7, the electrode 4 and the recognition mark forming portion 1 a on the surface of the metal mask 1 are immersed in an electrolytic solution 5, and the electrode 4 and the metal mask 1 are connected to an AC power source 6. Then, when the metal mask 1 side becomes an anode, metal ions dissolve into the electrolytic solution 5 from the surface of the recognition mark forming portion 1a. The metal ions dissolved in the electrolytic solution 5 react with OH groups in the electrolytic solution 5 to cause a chemical change and change to a dark color such as black.

  Then, when the polarity is switched and the metal mask 1 side becomes the cathode, the metal ions changed to black or the like in the electrolytic solution 5 return to the metal mask 1, whereby a predetermined position of the metal mask 1 (in the recognition mark forming portion 1 a). The film 1b having a darker color than that of the other part is formed at the position). That is, the coating 1b serves as a recognition mark (see FIG. 8). As shown in FIG. 8, in the step of forming the film 1b, metal ions are dissolved into the electrolytic solution 5 from the surface of the metal mask 1, so that the portion where the recognition mark is formed is dug very shallowly. It will be in a rare state. For example, the surface of the film 1b is disposed at a position deeper by about t = 5 to 10 μm than the surface of the other part of the metal mask 1.

  After the recognition mark (film 1b) is formed on the surface of the metal mask 1 by the above process, the recognition mark is also formed on the back surface of the metal mask 1 by the same procedure, that is, the electrolytic marking process. Then, after forming recognition marks at predetermined positions on both surfaces of the metal mask 1, all the resist 2 is removed from both surfaces of the metal mask 1 with a stripping solution (see FIG. 9), and the metal masks shown in FIGS. Complete 1

  FIG. 11 is a plan view showing the metal mass in the first embodiment of the present invention. In the metal mask 1 shown in FIG. 11, a plurality of recognition marks for alignment with the printed wiring board are arranged in the vicinity of an opening (opening pattern) 1c for applying and forming solder paste or the like on the printed wiring board. These recognition marks are imprinted by electrolytic treatment as described above.

  According to the first embodiment of the present invention, since the recognition mark is engraved on the metal mask 1 by electrolytic processing, it is never dropped even when the metal mask 1 is cleaned. Therefore, it is a particularly effective means for those requiring ultrasonic cleaning. In addition, since an etching solution is not used to form a recognition mark as in the prior art, it is environmentally friendly and no post-treatment of the waste solution is required. If a substantially neutral electrolyte is used, post-treatment such as neutralization becomes unnecessary.

  Furthermore, since a recognition mark can be formed if the thickness is about t = 5 to 10 μm, it can be easily applied to a foil metal mask. Therefore, when it is necessary to form recognition marks on both sides of the foil metal mask, this is an effective means. In particular, it is preferable when a part of the recognition marks engraved on both surfaces of the metal mask 1 (the surface facing the printed wiring board and the surface opposite to the facing surface) are arranged overlapping in plan view.

  The steps shown in FIGS. 7 and 8 are for explaining the principle for forming a recognition mark by electrolytic marking, and are not practical means. In actual electrolytic marking, for example, a method as shown in FIG. 12 is adopted.

  Here, 7 in FIG. 12 is a roller device for forming a recognition mark. The roller device 7 includes, for example, a roller 8, a support portion 9 that rotatably supports the roller 8 in both directions, and a handle 10 fixed to the support portion 9, and is connected to an AC power supply 6. The surface of the roller 8 is constituted by a cloth or the like soaked with an electrolytic solution, and the surface corresponding to the electrode 4 in FIGS. 7 and 8 is always in contact with the portion of the roller 8 containing the electrolytic solution. It is provided as follows. For this reason, the state (each state of the connection of the electrode 4, the electrolyte solution 5, and the alternating current power supply 6) shown in FIG.7 and FIG.8 is implement | achieved by making the outer peripheral part of the roller 8 lightly contact the recognition mark formation part 1a. Can do.

  Therefore, after connecting the metal mask 1 and the electrode in contact with the portion containing the electrolytic solution of the roller 8 to the AC power source 6, the roller 8 is set so that the roller 8 contacts the recognition mark forming portion 1a of the metal mask 1. By rolling, it is possible to form a film 1b having a darker color than the other portions at a predetermined position of the metal mask 1.

  According to the above configuration, as shown in FIG. 6, after completing the resist 2 opened only at the portion where the recognition mark is to be formed, the recognition mark can be easily engraved on the metal mask 1 using the roller device 7. It becomes possible. That is, the coating 1b is formed on all the recognition mark forming portions 1a by a simple operation of rolling the roller 8 of the roller device 7 on the metal mask 1 (on the resist 2 formed on the metal mask 1). Will be able to.

  Conventionally, when it is necessary to form a large number of recognition marks on the metal mask 1, after forming recesses at predetermined positions on the metal mask 1 and filling the recesses with toner, unnecessary toner is removed from the metal mask 1. It was necessary to wipe off from 1. The toner wiping operation requires a lot of labor and time. However, when forming the recognition marks using the roller device 7, even if a large number of recognition marks are formed on the metal mask 1, all the recognition marks are formed only by reciprocating the roller 8 several times. The dark black film 1b can be formed on the portion 1a, and the working efficiency when forming the recognition mark can be greatly improved. Therefore, like the metal mask 1 shown in FIG. 13, a plurality of identical opening patterns 1c are provided on the surface (both sides) of the metal mask 1, and it is necessary to form a plurality of recognition marks for each opening pattern 1c. In some cases, it is a particularly effective means.

Embodiment 2. FIG.
In the first embodiment, the case where the film 3 is used as shown in FIG. 4 has been described as the step of exposing a part of the resist 2 on the metal mask 1. However, such an exposure step can also be performed by a method of directly drawing a predetermined portion of the resist 2 with a laser beam. In such a case, for example, an exposure reference part whose relative position is specified with respect to the opening pattern 1c is provided so that a part directly exposed by laser light or a part not exposed can be easily recognized even after formation of the resist 2. It is necessary to provide the metal mask 1 at a predetermined position or a base material when the metal mask 1 is manufactured. When a part of the resist 2 is actually exposed using laser light, the position where the recognition mark is formed is specified with reference to the position of the exposure reference portion, and the laser light is irradiated.

The step of forming the exposure reference portion is specifically performed by the following method.
a) When the material of the metal mask 1 is stainless steel When the material of the metal mask 1 is stainless steel, when the opening pattern 1c is formed, the portion which becomes the adhesive margin 1d (bonding portion with the ridge) of the metal mask 1 A reference hole 1e (through hole) made of an exposure reference portion is formed in advance. After the opening pattern 1c is formed, a resist 2 is applied to both surfaces of the metal mask 1 in the steps shown in FIGS. 1 to 3, and then the metal mask 1 is set on a direct drawing machine, and a part of the resist 2 is formed. Exposure. At this time, the position where the recognition mark is formed is specified based on the position of the reference hole 1e, and the irradiation position is aligned (see FIG. 14).

b) When the plate thickness is thick by the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thicker than the predetermined thickness, when the resist corresponding to the opening pattern 1c is formed, the metal mask 1 A resist is formed in advance so that the reference hole 1e made of the exposure reference portion is formed in the portion that becomes the adhesive margin portion 1d. Therefore, the reference hole 1e is formed in the adhesive margin 1d by plating. In addition, after peeling from a base material after plating formation, it exposes by the process similar to the case of said a) (refer FIG. 14).

c) When the plate thickness is thin with the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thinner than a predetermined thickness, the base material 11 is made to be more than the portion where the metal mask 1 is formed. A reference hole 11a made of the exposure reference portion is formed in advance on the outer portion. Then, a resist corresponding to the opening pattern 1c is formed on the base material 11, and the resist is peeled off from the base material 11 after the plating is formed. Thereafter, without removing the metal mask 1 with the opening pattern 1c from the base material 11, the resist 2 is applied to the side surface of the metal mask 1 in the steps shown in FIGS. Part is exposed. At this time, the position where the recognition mark is formed is specified with reference to the position of the reference hole 11a, and the irradiation position is aligned (see FIG. 15).
In the case where the reference hole 11a is not formed in the base material 11 before the resist is applied, the reference hole 11b formed of the exposure reference portion is formed at a portion outside the metal mask 1 simultaneously with the formation of the opening pattern 1c. Form. Then, after the plating is formed, the resist 2 is applied again without peeling off the resist. At this time, since the portion where the reference hole 11b is formed looks darker than the surrounding portion, the position where the recognition mark is formed with reference to the position of the reference hole 11b (the portion that looks dark) after being set in the direct drawing machine. Is specified, and the irradiation position is aligned (see FIG. 16).

It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the metal mass in Embodiment 1 of this invention. It is a figure which shows the other example of the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the other example of the metal mask in Embodiment 1 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal mask 1a Recognition mark formation part 1b Film | membrane 1c Opening part (opening pattern)
1d Paste area 1e Reference hole 2 Resist 2a Uncured resist part 3 Film 3a Recognition mark part 4 Electrode 5 Electrolyte 6 AC power supply 7 Roller device 8 Roller 9 Support part 10 Handle 11 Base material 11a, 11b Reference hole

  The present invention relates to a metal mask provided with a recognition mark and a manufacturing method thereof.

  In order to mount various electronic components on a printed wiring board, conventionally, a method of applying and forming a solder paste (cream solder) or the like on a printed wiring board by a screen printing method using a metal mask has been employed. Generally, in a screen printing method using a metal mask, a solder paste or the like is sequentially applied to each printed wiring board that moves and stops below the metal mask by a conveyor or the like. For this reason, a recognition mark for alignment with a printed wiring board is formed on one side or both sides of the metal mask. Before applying solder paste or the like, the metal mask and each of the metal masks are used as a reference. Alignment with the printed wiring board is performed.

  Conventionally, when forming a recognition mark on a metal mask, an opening (opening pattern) for applying a solder paste or the like to a printed wiring board is formed on the metal mask, and then an etching solution is used at a predetermined position of the metal mask. A method has been employed in which a concave portion is formed (half etching), and toner (a mixture of fine carbon powder and adhesive) is filled in the concave portion and dried.

  Further, as a conventional technique for forming a recognition mark on a metal mask, a metal mask manufactured by electroforming has been proposed in which a concave portion of a recognition mark is formed simultaneously with the formation of an opening (for example, a patent). Reference 1). The method described in Patent Document 1 is intended to improve the relative positional accuracy between the opening and the recognition mark. However, even if the concave portion is formed at a predetermined position of the metal mask by the above method, the recognition mark In order to complete the toner, a process of filling the recess with toner and drying it was further required.

JP-A-7-256855

  In conventional metal masks that use toner to form recognition marks, including those described in Patent Document 1, toner may be removed from the recesses of the recognition marks. In such a case, alignment to the printed wiring board may occur. There was a problem of being unable to do so.

  In many cases, the toner drops from the recesses when the metal mask is cleaned. Particularly in recent years, since the openings of the metal mask are densely packed, ultrasonic cleaning is often used to remove solder paste and the like. For this reason, the toner easily falls off from the concave portion due to the cavitation effect or the like, which is a cause of frequent occurrence of the above problems.

  Further, if the toner of the recognition mark falls off after the metal mask is incorporated into the production line, it is necessary to stop the production line and refill the recess with the toner. Furthermore, when the user of the metal mask cannot perform the filling operation, for example, it is necessary to call an engineer of the metal mask manufacturer to perform the filling operation. For this reason, once the toner has dropped out, there has been a problem that the productivity of the production line including the metal mask as a part thereof is significantly reduced.

  Further, in the conventional method, since the etching solution is used to form the concave portion of the recognition mark, the waste solution comes out and is not environmentally preferable.

  Furthermore, in the conventional method, since the recognition mark is formed by filling the concave portion with the toner, the concave portion needs a predetermined depth (for example, a depth of 50 μm or more) for filling the toner. Therefore, the method of forming a recognition mark using toner is difficult to apply to a foil metal mask, and in particular, when it is necessary to form a recognition mark on both sides, the application is impossible. .

  The present invention has been made to solve the above-described problems. The object of the present invention is to reliably prevent the recognition mark from falling off and to easily form the recognition mark on a foil. A metal mask that can be used, and a method for manufacturing the same.

  The metal mask according to the present invention is provided close to the opening pattern formed for applying and forming a solder paste or the like on the printed wiring board and the opening pattern for alignment with the printed wiring board. And a plurality of recognition marks engraved by.

The metal mask according to the present invention includes an opening pattern and a plurality of recognition marks provided in the vicinity of the opening pattern for screen printing alignment and engraved by electrolytic treatment. .

The metal mask according to the present invention includes an opening pattern and a plurality of recognition marks for alignment that are provided in the vicinity of the opening pattern and are engraved by electrolytic treatment.

  The metal mask manufacturing method according to the present invention includes a first step of forming a thin-film resist on one surface of a metal mask on which an opening pattern for applying and forming a solder paste or the like on a printed wiring board is formed. A second step of removing the resist in the part where the recognition mark is to be formed from one surface of the metal mask, and the part in which the recognition mark is to be formed in the metal mask and the electrode are immersed in an electrolytic solution so that the metal mask and the electrode are exchanged with each other. By connecting to a power source, a third step of forming a film having a darker color than other parts by electrolytic treatment at a predetermined position on one surface of the metal mask, and after forming the film, from one surface of the metal mask And a fourth step of removing the resist.

According to the metal mask manufacturing method of the present invention, the first step of forming a thin film resist on one surface of the metal mask on which the opening pattern is formed and the recognition mark is formed from the one surface of the metal mask. A surface of the metal mask by immersing a portion of the metal mask recognition mark forming portion and the electrode in an electrolytic solution and connecting the metal mask and the electrode to an AC power source. A third step of forming a film having a darker color than the other portions by electrolytic treatment at a predetermined position, and a fourth step of removing the resist from one surface of the metal mask after the film is formed. It is provided.

According to the present invention, in a metal mask used when applying and forming solder paste or the like on a printed wiring board, it is possible to reliably prevent the recognition mark from falling off and to easily apply the recognition mark to a foil. Can be formed.

Moreover, according to this invention, in the metal mask used for screen printing, it is possible to reliably prevent the recognition mark from dropping off and to easily form the recognition mark on the foil.

In addition, according to the present invention, it is possible to reliably prevent the recognition mark from falling off in a metal mask having an opening pattern regardless of what is used for screen printing, and to easily recognize a recognition mark on a foil. Can be formed.

  In order to explain the present invention in more detail, it will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1 FIG.
1 to 10 are views showing a metal mask manufacturing process according to the first embodiment of the present invention. The process of forming recognition marks on both sides of the metal mask will be described in detail with reference to FIGS.

  First, an opening (opening pattern) (not shown in FIGS. 1 to 10) for applying and forming a solder paste or the like on a printed wiring board at a predetermined position of the metal mask 1 by electroforming or laser processing. Form. Then, a metal mask 1 in which processing of the opening has been completed is prepared (see FIG. 1), and oil adhering to both surfaces of the metal mask 1 is removed with a degreasing solution (see FIG. 2). After removing the oil with a degreasing solution, a thin resist 2 (photosensitive film) is formed on each side of the metal mask 1 (the surface on which the recognition mark is formed) using a resist solution or a dry film ( (See FIG. 3).

  Next, on each resist 2 formed on both surfaces of the metal mask 1, a film 3 provided with a positive type recognition mark portion 3a is placed and baked (see FIG. 4). In the above process, as a matter of course, the film 3 is arranged with the recognition mark portion 3a provided on the film 3 aligned with the position where the recognition mark of the metal mask 1 is formed, and then exposed. Here, since light does not pass through the black portion of the recognition mark portion 3a during exposure, the resist 2 in the portion located below the recognition mark portion 3a is not cured. On the other hand, since light is transmitted through the portions other than the recognition mark portion 3a in the film 3, the resist 2 positioned below the portion other than the recognition mark portion 3a is cured.

  FIG. 4 shows an exposure process when the negative resist 2 is used. On the other hand, when the positive type resist 2 is used, the film 3 provided with the negative type recognition mark portion 3a may be used. In this case, contrary to the above case, light is transmitted only through the recognition mark portion 3a, and the resist 2 in the portion located below the recognition mark portion 3a is dissolved.

  After the exposure step is completed, the film 3 is peeled off from each resist 2, and only the portion of the resist 2 that has not been cured in the exposure step (uncured resist portion 2a) is developed on both surfaces of the metal mask 1 with a developer. Remove from above (see FIG. 5). Through the above-described steps, the resist 2 on the portion where the recognition mark is to be formed (the recognition mark forming portion 1a) can be removed from both surfaces of the metal mask 1, and the recognition mark forming portion 1a is formed on both surfaces of the metal mask 1. The resist 2 opened only in part is completed (see FIG. 6).

  Next, a recognition mark is imprinted (electrolytic marking) on a predetermined position (recognition mark forming portion 1a) of the metal mask 1 by electrolytic treatment. The specific process is as follows. First, as shown in FIG. 7, the electrode 4 and the recognition mark forming portion 1 a on the surface of the metal mask 1 are immersed in an electrolytic solution 5, and the electrode 4 and the metal mask 1 are connected to an AC power source 6. Then, when the metal mask 1 side becomes an anode, metal ions dissolve into the electrolytic solution 5 from the surface of the recognition mark forming portion 1a. The metal ions dissolved in the electrolytic solution 5 react with OH groups in the electrolytic solution 5 to cause a chemical change and change to a dark color such as black.

  Then, when the polarity is switched and the metal mask 1 side becomes the cathode, the metal ions changed to black or the like in the electrolytic solution 5 return to the metal mask 1, whereby a predetermined position of the metal mask 1 (in the recognition mark forming portion 1 a). The film 1b having a darker color than that of the other part is formed at the position). That is, the coating 1b serves as a recognition mark (see FIG. 8). As shown in FIG. 8, in the step of forming the film 1b, metal ions are dissolved into the electrolytic solution 5 from the surface of the metal mask 1, so that the portion where the recognition mark is formed is dug very shallowly. It will be in a rare state. For example, the surface of the film 1b is disposed at a position deeper by about t = 5 to 10 μm than the surface of the other part of the metal mask 1.

  After the recognition mark (film 1b) is formed on the surface of the metal mask 1 by the above process, the recognition mark is also formed on the back surface of the metal mask 1 by the same procedure, that is, the electrolytic marking process. Then, after forming recognition marks at predetermined positions on both surfaces of the metal mask 1, all the resist 2 is removed from both surfaces of the metal mask 1 with a stripping solution (see FIG. 9), and the metal masks shown in FIGS. Complete 1

  FIG. 11 is a plan view showing the metal mass in the first embodiment of the present invention. In the metal mask 1 shown in FIG. 11, a plurality of recognition marks for alignment with the printed wiring board are arranged in the vicinity of an opening (opening pattern) 1c for applying and forming solder paste or the like on the printed wiring board. These recognition marks are imprinted by electrolytic treatment as described above.

  According to the first embodiment of the present invention, since the recognition mark is engraved on the metal mask 1 by electrolytic processing, it is never dropped even when the metal mask 1 is cleaned. Therefore, it is a particularly effective means for those requiring ultrasonic cleaning. In addition, since an etching solution is not used to form a recognition mark as in the prior art, it is environmentally friendly and no post-treatment of the waste solution is required. If a substantially neutral electrolyte is used, post-treatment such as neutralization becomes unnecessary.

  Furthermore, since a recognition mark can be formed if the thickness is about t = 5 to 10 μm, it can be easily applied to a foil metal mask. Therefore, when it is necessary to form recognition marks on both sides of the foil metal mask, this is an effective means. In particular, it is preferable when a part of the recognition marks engraved on both surfaces of the metal mask 1 (the surface facing the printed wiring board and the surface opposite to the facing surface) are arranged overlapping in plan view.

  The steps shown in FIGS. 7 and 8 are for explaining the principle for forming a recognition mark by electrolytic marking, and are not practical means. In actual electrolytic marking, for example, a method as shown in FIG. 12 is adopted.

  Here, 7 in FIG. 12 is a roller device for forming a recognition mark. The roller device 7 includes, for example, a roller 8, a support portion 9 that rotatably supports the roller 8 in both directions, and a handle 10 fixed to the support portion 9, and is connected to an AC power supply 6. The surface of the roller 8 is constituted by a cloth or the like soaked with an electrolytic solution, and the surface corresponding to the electrode 4 in FIGS. 7 and 8 is always in contact with the portion of the roller 8 containing the electrolytic solution. It is provided as follows. For this reason, the state (each state of the connection of the electrode 4, the electrolyte solution 5, and the alternating current power supply 6) shown in FIG.7 and FIG.8 is implement | achieved by making the outer peripheral part of the roller 8 lightly contact the recognition mark formation part 1a. Can do.

  Therefore, after connecting the metal mask 1 and the electrode in contact with the portion containing the electrolytic solution of the roller 8 to the AC power source 6, the roller 8 is set so that the roller 8 contacts the recognition mark forming portion 1a of the metal mask 1. By rolling, it is possible to form a film 1b having a darker color than the other portions at a predetermined position of the metal mask 1.

  According to the above configuration, as shown in FIG. 6, after completing the resist 2 opened only at the portion where the recognition mark is to be formed, the recognition mark can be easily engraved on the metal mask 1 using the roller device 7. It becomes possible. That is, the coating 1b is formed on all the recognition mark forming portions 1a by a simple operation of rolling the roller 8 of the roller device 7 on the metal mask 1 (on the resist 2 formed on the metal mask 1). Will be able to.

  Conventionally, when it is necessary to form a large number of recognition marks on the metal mask 1, after forming recesses at predetermined positions on the metal mask 1 and filling the recesses with toner, unnecessary toner is removed from the metal mask 1. It was necessary to wipe off from 1. The toner wiping operation requires a lot of labor and time. However, when forming the recognition marks using the roller device 7, even if a large number of recognition marks are formed on the metal mask 1, all the recognition marks are formed only by reciprocating the roller 8 several times. The dark black film 1b can be formed on the portion 1a, and the working efficiency when forming the recognition mark can be greatly improved. Therefore, like the metal mask 1 shown in FIG. 13, a plurality of identical opening patterns 1c are provided on the surface (both sides) of the metal mask 1, and it is necessary to form a plurality of recognition marks for each opening pattern 1c. In some cases, it is a particularly effective means.

Embodiment 2. FIG.
In the first embodiment, the case where the film 3 is used as shown in FIG. 4 has been described as the step of exposing a part of the resist 2 on the metal mask 1. However, such an exposure step can also be performed by a method of directly drawing a predetermined portion of the resist 2 with a laser beam. In such a case, for example, an exposure reference part whose relative position is specified with respect to the opening pattern 1c is provided so that a part directly exposed by laser light or a part not exposed can be easily recognized even after the resist 2 is formed. It is necessary to provide the metal mask 1 at a predetermined position or a base material when the metal mask 1 is manufactured. When a part of the resist 2 is actually exposed using laser light, the position where the recognition mark is formed is specified with reference to the position of the exposure reference portion, and the laser light is irradiated.

The step of forming the exposure reference portion is specifically performed by the following method.
a) When the material of the metal mask 1 is stainless steel When the material of the metal mask 1 is stainless steel, when the opening pattern 1c is formed, the portion which becomes the adhesive margin 1d (bonding portion with the ridge) of the metal mask 1 A reference hole 1e (through hole) made of an exposure reference portion is formed in advance. After the opening pattern 1c is formed, a resist 2 is applied to both surfaces of the metal mask 1 in the steps shown in FIGS. 1 to 3, and then the metal mask 1 is set on a direct drawing machine, and a part of the resist 2 is formed. Exposure. At this time, the position where the recognition mark is formed is specified based on the position of the reference hole 1e, and the irradiation position is aligned (see FIG. 14).

b) When the plate thickness is thick by the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thicker than the predetermined thickness, when the resist corresponding to the opening pattern 1c is formed, the metal mask 1 A resist is formed in advance so that the reference hole 1e made of the exposure reference portion is formed in the portion that becomes the adhesive margin portion 1d. Therefore, the reference hole 1e is formed in the adhesive margin 1d by plating. In addition, after peeling from a base material after plating formation, it exposes by the process similar to the case of said a) (refer FIG. 14).

c) When the plate thickness is thin with the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thinner than a predetermined thickness, the base material 11 is made to be more than the portion where the metal mask 1 is formed. A reference hole 11a made of the exposure reference portion is formed in advance on the outer portion. Then, a resist corresponding to the opening pattern 1c is formed on the base material 11, and the resist is peeled off from the base material 11 after the plating is formed. Thereafter, without removing the metal mask 1 with the opening pattern 1c from the base material 11, the resist 2 is applied to the side surface of the metal mask 1 in the steps shown in FIGS. Part is exposed. At this time, the position where the recognition mark is formed is specified with reference to the position of the reference hole 11a, and the irradiation position is aligned (see FIG. 15).
In the case where the reference hole 11a is not formed in the base material 11 before the resist is applied, the reference hole 11b formed of the exposure reference portion is formed at a portion outside the metal mask 1 simultaneously with the formation of the opening pattern 1c. Form. Then, after the plating is formed, the resist 2 is applied again without peeling off the resist. At this time, since the portion where the reference hole 11b is formed looks darker than the surrounding portion, the position where the recognition mark is formed with reference to the position of the reference hole 11b (the portion that looks dark) after being set in the direct drawing machine. Is specified, and the irradiation position is aligned (see FIG. 16).

It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the metal mass in Embodiment 1 of this invention. It is a figure which shows the other example of the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the other example of the metal mask in Embodiment 1 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal mask 1a Recognition mark formation part 1b Film | membrane 1c Opening part (opening pattern)
1d Paste area 1e Reference hole 2 Resist 2a Uncured resist part 3 Film 3a Recognition mark part 4 Electrode 5 Electrolyte 6 AC power supply 7 Roller device 8 Roller 9 Support part 10 Handle 11 Base material 11a, 11b Reference hole

  The present invention relates to a metal mask provided with a recognition mark and a manufacturing method thereof.

  In order to mount various electronic components on a printed wiring board, conventionally, a method of applying and forming a solder paste (cream solder) or the like on a printed wiring board by a screen printing method using a metal mask has been employed. Generally, in a screen printing method using a metal mask, a solder paste or the like is sequentially applied to each printed wiring board that moves and stops below the metal mask by a conveyor or the like. For this reason, a recognition mark for alignment with a printed wiring board is formed on one side or both sides of the metal mask. Before applying solder paste or the like, the metal mask and each of the metal masks are used as a reference. Alignment with the printed wiring board is performed.

  Conventionally, when forming a recognition mark on a metal mask, an opening (opening pattern) for applying a solder paste or the like to a printed wiring board is formed on the metal mask, and then an etching solution is used at a predetermined position of the metal mask. A method has been employed in which a concave portion is formed (half etching), and toner (a mixture of fine carbon powder and adhesive) is filled in the concave portion and dried.

  Further, as a conventional technique for forming a recognition mark on a metal mask, a metal mask manufactured by electroforming has been proposed in which a concave portion of a recognition mark is formed simultaneously with the formation of an opening (for example, a patent). Reference 1). The method described in Patent Document 1 is intended to improve the relative positional accuracy between the opening and the recognition mark. However, even if the concave portion is formed at a predetermined position of the metal mask by the above method, the recognition mark In order to complete the toner, a process of filling the recess with toner and drying it was further required.

JP-A-7-256855

  In conventional metal masks that use toner to form recognition marks, including those described in Patent Document 1, toner may be removed from the recesses of the recognition marks. In such a case, alignment to the printed wiring board may occur. There was a problem of being unable to do so.

  In many cases, the toner drops from the recesses when the metal mask is cleaned. Particularly in recent years, since the openings of the metal mask are densely packed, ultrasonic cleaning is often used to remove solder paste and the like. For this reason, the toner easily falls off from the concave portion due to the cavitation effect or the like, which is a cause of frequent occurrence of the above problems.

  Further, if the toner of the recognition mark falls off after the metal mask is incorporated into the production line, it is necessary to stop the production line and refill the recess with the toner. Furthermore, when the user of the metal mask cannot perform the filling operation, for example, it is necessary to call an engineer of the metal mask manufacturer to perform the filling operation. For this reason, once the toner has dropped out, there has been a problem that the productivity of the production line including the metal mask as a part thereof is significantly reduced.

  Further, in the conventional method, since the etching solution is used to form the concave portion of the recognition mark, the waste solution comes out and is not environmentally preferable.

  Furthermore, in the conventional method, since the recognition mark is formed by filling the concave portion with the toner, the concave portion needs a predetermined depth (for example, a depth of 50 μm or more) for filling the toner. Therefore, the method of forming a recognition mark using toner is difficult to apply to a foil metal mask, and in particular, when it is necessary to form a recognition mark on both sides, the application is impossible. .

  The present invention has been made to solve the above-described problems. The object of the present invention is to reliably prevent the recognition mark from falling off and to easily form the recognition mark on a foil. A metal mask that can be used, and a method for manufacturing the same.

The metal mask according to the present invention is provided close to the opening pattern formed for applying and forming the solder paste on the printed wiring board and the opening pattern for alignment with the printed wiring board. And a plurality of recognition marks stamped.

Further, a metal mask according to the present invention, an opening pattern is provided near the opening pattern for for alignment of screen printing, in which and a plurality of recognition marks engraved by electrolytic treatment .

A metal mask manufacturing method according to the present invention includes a first step of forming a thin film resist on one surface of a metal mask on which an opening pattern for applying a solder paste to a printed wiring board is formed, and a metal A second step of removing the resist in the portion where the recognition mark is to be formed from one surface of the mask, the portion where the recognition mark is formed in the metal mask and the electrode are immersed in an electrolytic solution, and the metal mask and the electrode are connected to an AC power source. A third step of forming a darker film than the other part by electrolytic treatment at a predetermined position on one surface of the metal mask, and after forming the film, a resist is formed on one surface of the metal mask. And a fourth step of removing.

The metal mask manufacturing method according to the present invention includes a first step of forming a thin film resist on one surface of a metal mask for screen printing on which an opening pattern is formed, and one surface of the metal mask. A second step of removing the resist in the portion where the recognition mark is to be formed; and by immersing the portion in which the recognition mark of the metal mask is to be formed and the electrode in an electrolytic solution and connecting the metal mask and the electrode to an AC power source, A third step of forming a film having a darker color than other parts by electrolytic treatment at a predetermined position on one surface of the metal mask; and a fourth step of removing the resist from the one surface of the metal mask after forming the film. And a process.

According to the present invention, in a metal mask used when applying and forming a solder paste on a printed wiring board, it is possible to reliably prevent the recognition mark from dropping and easily form a recognition mark on a foil. can do.

Moreover, according to this invention, in the metal mask used for screen printing, it is possible to reliably prevent the recognition mark from dropping off and to easily form the recognition mark on the foil .

  In order to explain the present invention in more detail, it will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1 FIG.
1 to 10 are views showing a metal mask manufacturing process according to the first embodiment of the present invention. The process of forming recognition marks on both sides of the metal mask will be described in detail with reference to FIGS.

  First, an opening (opening pattern) (not shown in FIGS. 1 to 10) for applying and forming a solder paste or the like on a printed wiring board at a predetermined position of the metal mask 1 by electroforming or laser processing. Form. Then, a metal mask 1 in which processing of the opening has been completed is prepared (see FIG. 1), and oil adhering to both surfaces of the metal mask 1 is removed with a degreasing solution (see FIG. 2). After removing the oil with a degreasing solution, a thin resist 2 (photosensitive film) is formed on each side of the metal mask 1 (the surface on which the recognition mark is formed) using a resist solution or a dry film ( (See FIG. 3).

  Next, on each resist 2 formed on both surfaces of the metal mask 1, a film 3 provided with a positive type recognition mark portion 3a is placed and baked (see FIG. 4). In the above process, as a matter of course, the film 3 is arranged with the recognition mark portion 3a provided on the film 3 aligned with the position where the recognition mark of the metal mask 1 is formed, and then exposed. Here, since light does not pass through the black portion of the recognition mark portion 3a during exposure, the resist 2 in the portion located below the recognition mark portion 3a is not cured. On the other hand, since light is transmitted through the portions other than the recognition mark portion 3a in the film 3, the resist 2 positioned below the portion other than the recognition mark portion 3a is cured.

  FIG. 4 shows an exposure process when the negative resist 2 is used. On the other hand, when the positive type resist 2 is used, the film 3 provided with the negative type recognition mark portion 3a may be used. In this case, contrary to the above case, light is transmitted only through the recognition mark portion 3a, and the resist 2 in the portion located below the recognition mark portion 3a is dissolved.

  After the exposure process is completed, the film 3 is peeled off from each resist 2, and only the part of the resist 2 that has not been cured in the exposure process (uncured resist part 2a) is developed on both surfaces of the metal mask 1 with a developer. Remove from above (see FIG. 5). Through the above-described steps, the resist 2 on the portion where the recognition mark is to be formed (the recognition mark forming portion 1a) can be removed from both surfaces of the metal mask 1, and the recognition mark forming portion 1a is formed on both surfaces of the metal mask 1. The resist 2 opened only in part is completed (see FIG. 6).

  Next, a recognition mark is imprinted (electrolytic marking) on a predetermined position (recognition mark forming portion 1a) of the metal mask 1 by electrolytic treatment. The specific process is as follows. First, as shown in FIG. 7, the electrode 4 and the recognition mark forming portion 1 a on the surface of the metal mask 1 are immersed in an electrolytic solution 5, and the electrode 4 and the metal mask 1 are connected to an AC power source 6. Then, when the metal mask 1 side becomes an anode, metal ions are dissolved into the electrolytic solution 5 from the surface of the recognition mark forming portion 1a. The metal ions dissolved in the electrolytic solution 5 react with OH groups in the electrolytic solution 5 to cause a chemical change and change to a dark color such as black.

  Then, when the polarity is switched and the metal mask 1 side becomes the cathode, the metal ions changed to black or the like in the electrolytic solution 5 return to the metal mask 1, whereby a predetermined position of the metal mask 1 (in the recognition mark forming portion 1 a). The film 1b having a darker color than that of the other part is formed at the position). That is, the coating 1b serves as a recognition mark (see FIG. 8). As shown in FIG. 8, in the step of forming the film 1b, metal ions are dissolved into the electrolytic solution 5 from the surface of the metal mask 1, so that the portion where the recognition mark is formed is dug very shallowly. It will be in a rare state. For example, the surface of the film 1b is disposed at a position deeper by about t = 5 to 10 μm than the surface of the other part of the metal mask 1.

  After the recognition mark (film 1b) is formed on the surface of the metal mask 1 by the above process, the recognition mark is also formed on the back surface of the metal mask 1 by the same procedure, that is, the electrolytic marking process. Then, after forming recognition marks at predetermined positions on both surfaces of the metal mask 1, all the resist 2 is removed from both surfaces of the metal mask 1 with a stripping solution (see FIG. 9), and the metal masks shown in FIGS. Complete 1

  FIG. 11 is a plan view showing the metal mass in the first embodiment of the present invention. In the metal mask 1 shown in FIG. 11, a plurality of recognition marks for alignment with the printed wiring board are arranged in the vicinity of an opening (opening pattern) 1c for applying and forming solder paste or the like on the printed wiring board. These recognition marks are imprinted by electrolytic treatment as described above.

  According to the first embodiment of the present invention, since the recognition mark is engraved on the metal mask 1 by electrolytic processing, it is never dropped even when the metal mask 1 is cleaned. Therefore, it is a particularly effective means for those requiring ultrasonic cleaning. In addition, since an etching solution is not used to form a recognition mark as in the prior art, it is environmentally friendly and no post-treatment of the waste solution is required. If a substantially neutral electrolyte is used, post-treatment such as neutralization becomes unnecessary.

  Furthermore, since a recognition mark can be formed if the thickness is about t = 5 to 10 μm, it can be easily applied to a foil metal mask. Therefore, when it is necessary to form recognition marks on both sides of the foil metal mask, this is an effective means. In particular, it is preferable when a part of the recognition marks engraved on both surfaces of the metal mask 1 (the surface facing the printed wiring board and the surface opposite to the facing surface) are arranged overlapping in plan view.

  The steps shown in FIGS. 7 and 8 are for explaining the principle for forming a recognition mark by electrolytic marking, and are not practical means. In actual electrolytic marking, for example, a method as shown in FIG. 12 is adopted.

  Here, 7 in FIG. 12 is a roller device for forming a recognition mark. The roller device 7 includes, for example, a roller 8, a support portion 9 that rotatably supports the roller 8 in both directions, and a handle 10 fixed to the support portion 9, and is connected to an AC power supply 6. The surface of the roller 8 is constituted by a cloth or the like soaked with an electrolytic solution, and the surface corresponding to the electrode 4 in FIGS. 7 and 8 is always in contact with the portion of the roller 8 containing the electrolytic solution. It is provided as follows. For this reason, the state (each state of the connection of the electrode 4, the electrolyte solution 5, and the alternating current power supply 6) shown in FIG.7 and FIG.8 is implement | achieved by making the outer peripheral part of the roller 8 lightly contact the recognition mark formation part 1a. Can do.

  Therefore, after connecting the metal mask 1 and the electrode in contact with the portion containing the electrolytic solution of the roller 8 to the AC power source 6, the roller 8 is set so that the roller 8 contacts the recognition mark forming portion 1a of the metal mask 1. By rolling, it is possible to form a film 1b having a darker color than the other portions at a predetermined position of the metal mask 1.

  According to the above configuration, as shown in FIG. 6, after completing the resist 2 opened only at the portion where the recognition mark is to be formed, the recognition mark can be easily engraved on the metal mask 1 using the roller device 7. It becomes possible. That is, the coating 1b is formed on all the recognition mark forming portions 1a by a simple operation of rolling the roller 8 of the roller device 7 on the metal mask 1 (on the resist 2 formed on the metal mask 1). Will be able to.

  Conventionally, when it is necessary to form a large number of recognition marks on the metal mask 1, after forming recesses at predetermined positions on the metal mask 1 and filling the recesses with toner, unnecessary toner is removed from the metal mask 1. It was necessary to wipe off from 1. The toner wiping operation requires a lot of labor and time. However, when forming the recognition marks using the roller device 7, even if a large number of recognition marks are formed on the metal mask 1, all the recognition marks are formed only by reciprocating the roller 8 several times. The dark black film 1b can be formed on the portion 1a, and the working efficiency when forming the recognition mark can be greatly improved. Therefore, like the metal mask 1 shown in FIG. 13, a plurality of identical opening patterns 1c are provided on the surface (both sides) of the metal mask 1, and it is necessary to form a plurality of recognition marks for each opening pattern 1c. In some cases, it is a particularly effective means.

Embodiment 2. FIG.
In the first embodiment, the case where the film 3 is used as shown in FIG. 4 has been described as the step of exposing a part of the resist 2 on the metal mask 1. However, such an exposure step can also be performed by a method of directly drawing a predetermined portion of the resist 2 with a laser beam. In such a case, for example, an exposure reference part whose relative position is specified with respect to the opening pattern 1c is provided so that a part directly exposed by laser light or a part not exposed can be easily recognized even after formation of the resist 2. It is necessary to provide the metal mask 1 at a predetermined position or a base material when the metal mask 1 is manufactured. When a part of the resist 2 is actually exposed using laser light, the position where the recognition mark is formed is specified with reference to the position of the exposure reference portion, and the laser light is irradiated.

The step of forming the exposure reference portion is specifically performed by the following method.
a) When the material of the metal mask 1 is stainless steel When the material of the metal mask 1 is stainless steel, when the opening pattern 1c is formed, the portion which becomes the adhesive margin 1d (bonding portion with the ridge) of the metal mask 1 A reference hole 1e (through hole) made of an exposure reference portion is formed in advance. After the opening pattern 1c is formed, a resist 2 is applied to both surfaces of the metal mask 1 in the steps shown in FIGS. 1 to 3, and then the metal mask 1 is set on a direct drawing machine, and a part of the resist 2 is formed. Exposure. At this time, the position where the recognition mark is formed is specified based on the position of the reference hole 1e, and the irradiation position is aligned (see FIG. 14).

b) When the plate thickness is thick by the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thicker than the predetermined thickness, when the resist corresponding to the opening pattern 1c is formed, the metal mask 1 A resist is formed in advance so that the reference hole 1e made of the exposure reference portion is formed in the portion that becomes the adhesive margin portion 1d. Therefore, the reference hole 1e is formed in the adhesive margin 1d by plating. In addition, after peeling from a base material after plating formation, it exposes by the process similar to the case of said a) (refer FIG. 14).

c) When the plate thickness is thin with the plating method mask When the metal mask 1 is manufactured by the plating method and the plate thickness is thinner than a predetermined thickness, the base material 11 is made to be more than the portion where the metal mask 1 is formed. A reference hole 11a made of the exposure reference portion is formed in advance on the outer portion. Then, a resist corresponding to the opening pattern 1c is formed on the base material 11, and the resist is peeled off from the base material 11 after the plating is formed. Thereafter, without removing the metal mask 1 with the opening pattern 1c from the base material 11, the resist 2 is applied to the side surface of the metal mask 1 in the steps shown in FIGS. Part is exposed. At this time, the position where the recognition mark is formed is specified with reference to the position of the reference hole 11a, and the irradiation position is aligned (see FIG. 15).
In the case where the reference hole 11a is not formed in the base material 11 before the resist is applied, the reference hole 11b formed of the exposure reference portion is formed at a portion outside the metal mask 1 simultaneously with the formation of the opening pattern 1c. Form. Then, after the plating is formed, the resist 2 is applied again without peeling off the resist. At this time, since the portion where the reference hole 11b is formed looks darker than the surrounding portion, the position where the recognition mark is formed with reference to the position of the reference hole 11b (the portion that looks dark) after being set in the direct drawing machine. Is specified, and the irradiation position is aligned (see FIG. 16).

It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a figure which shows the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the metal mask in Embodiment 1 of this invention. It is a figure which shows the other example of the manufacturing process of the metal mask in Embodiment 1 of this invention. It is a top view which shows the other example of the metal mask in Embodiment 1 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention. It is a figure for demonstrating the exposure process in Embodiment 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal mask 1a Recognition mark formation part 1b Film | membrane 1c Opening part (opening pattern)
1d Paste area 1e Reference hole 2 Resist 2a Uncured resist part 3 Film 3a Recognition mark part 4 Electrode 5 Electrolyte 6 AC power supply 7 Roller device 8 Roller 9 Support part 10 Handle 11 Base material 11a, 11b Reference hole

Claims (7)

An opening pattern formed for applying and forming a solder paste or the like on a printed wiring board;
A plurality of recognition marks provided in the vicinity of the opening pattern for alignment with the printed wiring board, and stamped by electrolytic treatment;
A metal mask characterized by comprising A plurality of identical opening patterns are formed,
The metal mask according to claim 1, wherein a plurality of recognition marks are imprinted on each of the opening patterns.   The recognition mark is engraved on both sides of a surface facing the printed wiring board and a surface opposite to the facing surface, and a part of what is engraved on the both surfaces is disposed so as to overlap in plan view. The metal mask according to claim 1 or 2. A first step of forming a thin-film resist on one surface of a metal mask on which an opening pattern for applying a solder paste or the like to a printed wiring board is formed;
A second step of removing the resist in a part for forming a recognition mark from one surface of the metal mask;
A portion of the metal mask where the recognition mark is to be formed and an electrode are immersed in an electrolytic solution, and the metal mask and the electrode are connected to an AC power source, so that a predetermined position on one surface of the metal mask is subjected to electrolytic treatment. A third step of forming a darker film than the other parts;
A fourth step of removing the resist from one surface of the metal mask after forming the film;
A method for producing a metal mask, comprising: The second step is
A step of exposing a part of the resist made of a photosensitive film in accordance with the position where the recognition mark is formed on the metal mask,
After the exposure step, the step of removing the portion of the resist that forms the recognition mark from one surface of the metal mask with a developer;
The method of manufacturing a metal mask according to claim 4, comprising: The second step is
Forming an exposure reference portion whose relative position is specified with respect to the opening pattern;
Identifying a position where a recognition mark is formed on a metal mask with reference to the position of the exposure reference portion, and directly exposing a part of the resist made of a photosensitive film using a laser beam;
After the exposure step, the step of removing the portion of the resist that forms the recognition mark from one surface of the metal mask with a developer;
The method of manufacturing a metal mask according to claim 4, comprising:   In the third step, after the metal mask and the electrode that contacts the roller containing the electrolyte are connected to an AC power source, the roller is rotated so that the roller contacts the portion of the metal mask where the recognition mark is to be formed. The metal according to any one of claims 4 to 6, wherein a film having a darker color than other portions is formed by electrolytic treatment at a predetermined position on one surface of the metal mask. Mask manufacturing method.

Images