JP2008251627A - Processor, processing method, and storage medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processor and a processing method for preventing influence on a transfer chamber of radiated heat by shielding the radiated heat to the transfer chamber from each processing unit when a gate valve is opened. <P>SOLUTION: A shutter mechanism 40 is maintained in the state with the gate valve G closed. When a process is being executed in each unit 1 to 4, it is maintained in the state with the gate valve G opened. When a semiconductor substrate W is carried in or carried out to or from the processing unit 1 to 4 with the transfer device 12, the gate valve G is intermediately closed leaving a gap to allow carry-in or carry-out of the semiconductor wafer W, namely the gate valve G is maintained to be open. This gate valve is controlled to be perfectly closed for preparation for exchange of the semiconductor wafer W in the transfer device 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a processing apparatus for processing a target object such as a semiconductor wafer, a processing method, and a storage medium storing a program for executing the method.

Recently, in response to demands for higher speeds of semiconductor devices, finer wiring patterns, and higher integration, device characteristics have been improved, and in response to this, multiple processes are performed without breaking the vacuum. A multi-chamber type processing apparatus that can be used is used (for example, Patent Document 1).

The multi-chamber type processing apparatus is configured by connecting a plurality of processing units to each side of a polygonal transfer chamber via a gate valve. Each processing chamber communicates with the transfer chamber by opening the corresponding gate valve, and is shut off from the transfer chamber by closing the corresponding gate valve. In the transfer chamber, a transfer device for carrying in and out the semiconductor wafer is provided for a plurality of processing units, and the transfer device can be used without breaking the vacuum in a state where the transfer chamber and each processing chamber are held in vacuum. Thus, the semiconductor wafer can be carried into and out of each processing unit. The transfer device is disposed substantially at the center of the transfer chamber, and a transfer device having a blade for holding a semiconductor wafer at the tip of a rotatable / extensible / retractable portion is used.

  In the multi-chamber type processing apparatus as described above, when a semiconductor wafer to be processed is loaded from the transfer chamber into each processing unit, or the processed semiconductor wafer is transferred from each processing unit to the transfer chamber. In this case, the gate valve is opened and the semiconductor wafer is carried in and out by the blade of the transfer device.

That is, when the semiconductor wafer is loaded / unloaded, the gate valve between the transfer chamber and the processing unit is always opened, and the transfer chamber and the processing unit are communicated with each other.

  By the way, when the processing unit is to be processed in a high temperature atmosphere such as a CVD apparatus, when the semiconductor wafer is loaded / unloaded, the gate valve is opened, and the transfer chamber and the processing unit are communicated with each other. Radiant heat in the processing unit affects the transfer chamber.

If the influence of such radiant heat is exerted in the transfer chamber, the blades and arms of the transfer device may be thermally expanded, causing a transfer error. Radiant heat also adversely affects various sensors in the transfer chamber. For this reason, it is required to eliminate as much as possible the influence of radiant heat exerted on the transfer chamber from the processing unit.
JP 2003-59861 A

The present invention has been made in view of such circumstances, and when the gate valve is opened, it can block the radiant heat from each processing unit to the transfer chamber and prevent the influence of the radiant heat on the transfer chamber. An object is to provide a processing apparatus and a processing method.
Another object of the present invention is to provide a storage medium storing a program for executing such a processing method.

In order to solve the above-described problems, according to a first aspect of the present invention, there is provided at least one processing unit for processing a target object, and a transfer device for carrying the target object into and out of the processing unit. A gate valve that opens and closes the processing unit and the transfer chamber by opening and closing, and is openable on the transfer chamber side of the gate valve, and opens the gate valve. And a shutter mechanism for closing radiant heat from the processing unit to the transfer chamber.

  In the first aspect, a control mechanism may be further provided that controls the shutter mechanism to be closed when the gate valve is open. The control mechanism can open the shutter mechanism when the gate valve is in a closed state and processing is being performed in the processing unit. Further, the control mechanism may be configured such that the gate valve is closed and processing is being performed in the processing unit, or the gate valve is opened, and the control device is configured to be covered by the transfer device. When loading or unloading the processing body to or from the processing unit, the shutter mechanism is opened and the gate valve is opened, and when preparing to replace the processing object by the transport device, The shutter mechanism can be closed. Further, the control mechanism is in a state where the gate valve is closed, and when the processing is being performed in the processing unit, the shutter mechanism is opened and the gate valve is opened. When the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is intermediately closed leaving a gap allowing the object to be carried in / out, and the gate valve In the opened state, the shutter mechanism can be completely closed when preparing to replace the object to be processed in the transport apparatus.

  In the first aspect, the transport device includes a blade that holds an object to be processed, and the shutter mechanism includes a notch that allows the blade to pass when the shutter mechanism is closed. can do. In this case, the gate valve is opened, and when the blade on which the object to be processed is not placed is inserted to replace the object to be processed, the gate valve is opened. When the blade after transporting the object to be processed to the processing unit is retracted from the processing unit, the shutter mechanism is closed, and the blade passes through the notch. It can be set as the structure which further comprises the control mechanism which controls a shutter mechanism. The control mechanism is configured such that when the processing is being performed in the processing unit with the gate valve being closed, or when the gate valve is in the open state, When the body is carried into or out of the processing unit, the shutter mechanism is opened and the gate valve is opened, and when preparing to replace the object to be processed by the transfer device The shutter mechanism can be closed.

  Moreover, as a processing apparatus, what has two or more said processing units and these processing units are provided corresponding to the some edge | side of the said conveyance chamber, respectively can be used suitably.

In the second aspect of the present invention, at least one processing unit, a transfer chamber provided with a transfer device for loading and unloading an object to be processed into the process unit, and opening and closing the processing unit and the transfer chamber, And a shutter mechanism that is provided on the transfer chamber side of the gate valve and blocks radiant heat from the processing unit to the transfer chamber when the gate valve is opened. A processing method of a processing apparatus, wherein the shutter mechanism is opened when the gate valve is in a closed state and processing is being performed in the processing unit. A processing method is provided.

  In the second aspect, when the gate valve is in a closed state and processing is being performed in the processing unit, or when the gate valve is in an open state, When the processing body is carried into or out of the processing unit, when the shutter mechanism is opened and the gate valve is opened, and when preparing to replace the workpiece by the transport device The shutter mechanism can be closed.

In the second aspect, when the gate valve is in a closed state and processing is being performed in the processing unit, the shutter mechanism is opened and the gate valve is opened. When the processing object is carried into or out of the processing unit by the transfer device, the shutter mechanism is intermediately closed leaving a gap allowing the processing object to be carried in / out. In addition, when the gate valve is in an open state, and the preparation for replacing the object to be processed is performed in the transfer device, the shutter mechanism can be completely closed.

Furthermore, in the second aspect, the transport device includes a blade that holds an object to be processed, and the shutter mechanism includes a notch that allows passage of the blade when closed. When the gate valve is in a closed state and processing is being performed in the processing unit, the shutter mechanism is opened, the gate valve is opened, and the transfer device When the object to be processed is carried into or out of the processing unit, the shutter mechanism is opened, the gate valve is opened, and preparations for replacing the object to be processed in the transfer device are made. In doing so, the shutter mechanism is closed, the gate valve is opened, and the object to be processed is not placed for replacement of the object to be processed. The shutter mechanism is closed when a blade is inserted into the processing unit, and when the gate valve is opened and the blade after the object to be processed is transferred to the processing unit is retracted from the processing unit. In this state, the blade can pass through the notch.

  According to a third aspect of the present invention, there is provided a storage medium that stores a program that operates on a computer and controls a processing device, and the control program executes the processing method according to the second aspect at the time of execution. A storage medium is provided that causes a computer to control the processing device.

  Since the shutter mechanism that blocks the radiant heat from the processing unit to the transfer chamber when the gate valve is opened, the radiant heat from each processing unit to the transfer chamber is blocked when the gate valve is opened, The influence of radiant heat on the transfer chamber can be prevented. Therefore, thermal expansion of the blades and arms of the transport device can be suppressed, and there is little risk of causing transport errors. In addition, adverse effects of various sensors in the transfer chamber due to radiant heat can be prevented as much as possible.

In addition, each processing unit is configured to open and close the shutter mechanism in conjunction with execution of processing in the processing unit, opening and closing of the gate valve, loading and unloading of the target object, and preparation for replacement of the target object. Can suppress the influence of the radiant heat on the transfer chamber as much as possible.

Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings.
[First Embodiment]
FIG. 1A is a horizontal sectional view showing a schematic structure of a multi-chamber type processing apparatus for carrying out the semiconductor device manufacturing method according to the first embodiment, and FIG. 1B is a side sectional view thereof. FIG.

The processing apparatus includes four processing units 1, 2, 3, and 4. Each of these units 1 to 4 is provided corresponding to each of the four sides of the transfer chamber 5 having a hexagonal shape. Load lock chambers 6 and 7 are provided on the other two sides of the transfer chamber 5, respectively. A load / unload chamber 8 is provided on the opposite side of the load lock chambers 6 and 7 from the transfer chamber 5, and a semiconductor wafer W can be accommodated on the opposite side of the load lock chambers 6 and 7 of the load / unload chamber 8. Ports 9, 10 and 11 for attaching two carriers C are provided. The processing units 1, 2, 3, 4 perform processing while heating the semiconductor wafer therein, for example, CVD film formation processing, and the temperature therein is high, for example, 600 ° C. To be held.

  The processing units 1 to 4 and the load lock chambers 6 and 7 are connected to each side of the transfer chamber 5 via a gate valve G, as shown in the figure, by opening the corresponding gate valve G. By communicating with the transfer chamber 5 and closing the corresponding gate valve G, the transfer chamber 5 is shut off. A gate valve G is also provided at a portion of the load lock chambers 6, 7 connected to the carry-in / out chamber 8, and the load-lock chambers 6, 7 open the corresponding gate valve G by opening the corresponding gate valve G. 8 is closed from the loading / unloading chamber 8 by closing the corresponding gate valve G.

  In the transfer chamber 5, a transfer device 12 that loads and unloads the semiconductor substrate W with respect to the processing units 1 to 4 and the load lock chambers 6 and 7 is provided. The wafer transfer device 12 is disposed substantially at the center of the transfer chamber 5 and has two blades 14 a and 14 b that hold the semiconductor substrate W at the tip of a rotatable / extensible / retractable portion 13 that can be rotated and extended. These two blades 14a and 14b are attached to the rotating / extending / contracting portion 13 so as to face opposite directions. The inside of the transfer chamber 5 is maintained at a predetermined degree of vacuum. Further, the blades 14a and 14b are of a twin type, but may be a single type.

  Shutters (not shown) are provided in the three ports 9, 10, and 11 for attaching the carrier C in the loading / unloading chamber 8. The ports 9, 10, and 11 accommodate the semiconductor substrate W or are empty carriers C. Is attached directly, and when it is attached, the shutter comes off and communicates with the carry-in / out chamber 8 while preventing intrusion of outside air. An alignment chamber 15 is provided on the side surface of the loading / unloading chamber 8 where the semiconductor substrate W is aligned.

  In the loading / unloading chamber 8, a transfer device 16 for loading / unloading the semiconductor substrate W into / from the carrier C and loading / unloading the semiconductor substrate W into / from the load lock chambers 6 and 7 is provided. The transfer device 16 has an articulated arm structure and can travel on the rail 18 along the arrangement direction of the carrier C. The semiconductor substrate W is placed on the hand 17 at the tip of the transfer device 16 and transferred. I do.

  This processing apparatus has a process controller 20 composed of a microprocessor (computer) that controls each component, and each component is connected to and controlled by this process controller 20. The process controller 20 is connected to a user interface 21 including a keyboard for an operator to input commands for managing the processing device, a display for visualizing and displaying the operating status of the processing device, and the like. .

  In addition, the process controller 20 has a control program for realizing various processes executed by the processing device under the control of the process controller 20 and causes each component of the processing device to execute processing according to processing conditions. A storage unit 22 in which a program, that is, a recipe is stored, is connected. The recipe is stored in a storage medium in the storage unit 22. The storage medium may be a hard disk or semiconductor memory, or may be portable such as a CDROM, DVD, flash memory or the like. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example.

  If necessary, an arbitrary recipe is called from the storage unit 22 by an instruction from the user interface 21 and is executed by the process controller 20, so that a desired process in the processing apparatus is controlled under the control of the process controller 20. Is done.

FIG. 2 is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus shown in FIG.
In the present embodiment, flanges 30 communicating with each other are fitted on the side wall between the gate valve G and the transfer chamber 5. A shutter mechanism 40 that blocks leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 5 when the gate valve G is opened is provided on the transfer chamber 5 side of the flange 30.

The shutter mechanism 40 has two upper and lower shielding plates 41a and 41b, and the material thereof is preferably aluminum which has good thermal conductivity and excellent radiation.

  A drive actuator 42 driven by an electric motor, compressed air, or the like is connected to each of the two shielding plates 41a and 41b, so that the shutter mechanism 40 can be opened and closed in conjunction with each other. It has become.

The opening / closing response speed of the shutter mechanism 40 is faster than the opening / closing speed of the gate valve G, and is preferably about the same as the opening / closing speed of the shutter mechanism of the camera, for example.

Further, since the inside of the transfer chamber 5 is maintained at a predetermined degree of vacuum, a bellows 43 is attached to the drive actuator 42.
Further, the shutter mechanism 40 and the flange 30 may be unitized, and if the unit is made according to the size of the processing apparatus, the handling of the shutter mechanism 40 and the like becomes simple, and the installation is extremely easy. It can be done easily.

FIG. 3A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus shown in FIG. 1, and FIG. 3B is a schematic diagram showing a three-stage opening / closing process of the shutter mechanism. is there.

FIG. 4 is a schematic side view corresponding to the three-stage opening / closing process of the shutter mechanism of FIG.
The shutter mechanism 40 is controlled to take the following three stages of opening / closing processes.

When the gate valve G is closed and processing is being performed in the processing units 1 to 4, the shutter mechanism 40 is in an open state.
Next, when the gate valve G is opened and the semiconductor device W is carried into and out of the processing units 1 to 4 by the transfer device 12, the shutter mechanism 40 leaves a gap that allows the semiconductor substrate W to be loaded and unloaded. In the middle, it is closed.

As the third stage, when the gate valve G is opened and the transfer device 12 prepares for replacement of the semiconductor wafer W, the shutter mechanism 40 is completely closed.

  As described above, in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented. . Therefore, the blades 14a, 14b, etc. of the transport device 12 do not thermally expand, the blades 14a, 14b, etc. do not expand and contract, and there is no incentive for transport errors. Further, various sensors in the transfer chamber 12 are not adversely affected by the radiant heat.

In addition, the shutter mechanism 40 is controlled to open and close in conjunction with execution of processing in the processing units 1 to 4, opening and closing of the gate valve G, loading and unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor substrate W. ing. Therefore, although the radiant heat slightly affects the transfer chamber 5 through the intermediate closing gap of the shutter mechanism 40 as the semiconductor substrate W is loaded / unloaded, the transfer chambers are transferred from the processing units 1 to 4. The leakage of radiant heat to 12 can be suppressed as much as possible.

[Second Embodiment]
FIG. 5A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus according to the second embodiment of the present invention, and FIG. 5B is a two-stage opening / closing process of the shutter mechanism. It is a schematic diagram which shows.
FIG. 6 is a timing chart showing a two-stage opening / closing process of the shutter mechanism.

In the present embodiment, the shutter mechanism 40 is controlled to take the following two-stage opening / closing process.
When the gate valve G is closed and processing is being performed in the processing units 1 to 4, or when the gate valve G is opened and the semiconductor wafer W is carried into and out of the processing units 1 to 4 by the transfer device 12. In other words, the shutter mechanism 40 is opened.

Next, the gate valve G is opened, and the shutter mechanism 40 is closed when the transfer device 12 prepares to replace the semiconductor wafer W.

In the timing chart of FIG. 6, the shutter mechanism 40 is closed before the blade 14b is carried into the processing units 1 to 4 in (A). When the blade 14b enters 1 to 4, the shutter mechanism 40 is in an open state.

In (C), when the blade 14b is carried out, the shutter mechanism 40 is in an open state. However, during the transition from (B) to (C), the shutter mechanism 40 may be in an intermediately closed state so as not to interfere with the blade 14b on which the semiconductor wafer W is placed.

In (D), as preparation for exchanging the semiconductor wafer W, a blade 14b on which the semiconductor wafer W unloaded from one of the processing units 1 to 4 is placed and a blade 14a on which the semiconductor wafer W to be loaded into the processing unit is placed. The shutter mechanism 40 is in a closed state when the rotation / expansion / contraction part 13 having a rotation angle of 180 ° is turned.
In (E), when the blade 14a enters the processing units 1 to 4, the shutter mechanism 40 is opened. In (F), the shutter mechanism 40 is also opened when the blade 14a is carried out. However, when shifting from (E) to (F), the shutter mechanism 40 may be in an intermediately closed state so as not to interfere with the blade 14a.

Also in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented.

Further, although the opening / closing process of the shutter mechanism 40 is a two-stage process, for the execution of processing in the processing units 1 to 4, opening / closing the gate valve G, loading / unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor wafer W Since the shutter mechanism 40 is controlled to open and close in conjunction with each other, as the semiconductor substrate W is loaded and unloaded, the transfer chamber 5 is somewhat affected by the radiant heat through the open portion of the shutter mechanism 40. Although the influence is greater than that of the first embodiment, leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 12 can be effectively suppressed.

[Third Embodiment]
FIG. 7A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus according to the third embodiment of the present invention, and FIG. 7B is a two-stage opening / closing process of the shutter mechanism. It is a schematic diagram which shows.
In the present embodiment, the shielding plates 41a and 41b of the shutter mechanism 40 have notches 44a and 44b that allow the blades 14a and 14b of the transport device 12 to pass when closed.

The shutter mechanism 40 is controlled to take the following two-stage opening / closing process.
When the gate valve G is closed and processing is being performed in the processing units 1 to 4, the shutter mechanism 40 is opened. The shutter mechanism 40 is also opened when the gate valve G is opened and the semiconductor device W is carried into and out of the processing unit by the transfer device 12. However, the semiconductor wafer W may be in an intermediately closed state to the extent that loading / unloading of the semiconductor wafer W can be permitted.

Further, the gate valve G is opened, and the shutter mechanism 40 remains closed when the transfer device 12 prepares to replace the semiconductor wafer W. Specifically, when the blade 4b is inserted to receive the wafer W as shown in FIG. 6B, and after the wafer W is transferred from the blade 4a to the processing unit as shown in FIG. 6F. When the blade 4a is retracted from the processing unit, the blade 14a or 14b is passed through the notches 44a and 44b.

Also in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented.

In addition, although the opening / closing process of the shutter mechanism 40 is in two stages, it is linked to the execution of processing in the processing units 1 to 4, opening / closing the gate valve G, loading / unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor substrate W Thus, the shutter mechanism 40 is controlled to open and close. Therefore, although the radiant heat slightly affects the transfer chamber 5 through the notches 44a and 44b as the semiconductor substrate W is loaded and unloaded, the influence is less than in the second embodiment. Leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 12 can be more effectively suppressed than in the second embodiment.

The present invention can be variously modified without being limited to the above embodiment. For example, in the above-described embodiment, the shutter mechanism 40 opens and closes in two stages or three stages. However, the shutter mechanism 40 may be configured to open and close in four stages or more.

  Further, the processing apparatus of the present invention is not limited to the multi-chamber type processing apparatus as in the above embodiment.

(A) is a horizontal sectional view which shows schematic structure of the multi-chamber type processing apparatus for enforcing the manufacturing method of the semiconductor device which concerns on 1st Embodiment, (b) is the side sectional drawing. The expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus shown in FIG. (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus shown in FIG. 1, (b) is a schematic diagram showing a three-stage opening / closing process of the shutter mechanism. The schematic diagram of the side view corresponding to the three-step opening / closing process of the shutter mechanism of FIG.3 (b). (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus which concerns on the 2nd Embodiment of this invention, (b) shows the two-step opening / closing process of a shutter mechanism. Pattern diagram. The timing chart which shows the two-step opening / closing process of a shutter mechanism. (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus which concerns on the 3rd Embodiment of this invention, (b) shows the two-step opening / closing process of a shutter mechanism. Pattern diagram.

Explanation of symbols

1-4; Processing unit 5; Transfer chamber 12; Transfer device 20; Process controller 22; Storage unit (storage medium)
30; flange 40; shutter mechanisms 41a and 41b; shielding plate W; semiconductor substrate

Claims (14)

Among them, at least one processing unit for processing the object to be processed;
A transfer chamber provided with a transfer device for transferring the object to be processed into and out of the processing unit;
A gate valve that communicates and blocks the processing unit and the transfer chamber by opening and closing; and
A shutter mechanism that is provided on the transfer chamber side of the gate valve so as to be openable and closable, is closed when the gate valve is opened, and blocks radiation heat from the processing unit to the transfer chamber. A processing device.   The processing apparatus according to claim 1, further comprising a control mechanism that controls the shutter mechanism to be closed when the gate valve is open.   The processing apparatus according to claim 2, wherein the control mechanism opens the shutter mechanism when the gate valve is in a closed state and processing is performed in the processing unit. . The control mechanism is
When the processing is being performed in the processing unit with the gate valve being closed, or when the gate valve is in an open state, the object to be processed is transferred to the processing unit by the transfer device. When carrying in or out, the shutter mechanism is opened,
3. The processing apparatus according to claim 2, wherein the shutter mechanism is closed when the gate valve is in an open state and the transfer apparatus prepares to replace the object to be processed. The control mechanism is
When the gate valve is in a closed state and processing is being performed in the processing unit, the shutter mechanism is opened,
When the workpiece is carried into or out of the processing unit by the transfer device when the gate valve is in an open state, the shutter mechanism leaves a gap that allows loading and unloading of the workpiece, Closed
3. The processing apparatus according to claim 2, wherein the shutter mechanism is completely closed when the gate valve is in an open state and the transfer apparatus prepares to replace the object to be processed. The said conveying apparatus has a braid | blade which hold | maintains a to-be-processed object, The said shutter mechanism has a notch part which accept | permits the passage of the said blade, when closed. Processing equipment. When the gate valve is opened, when a blade on which a workpiece is not placed is inserted into the processing unit for replacement of the workpiece, and when the gate valve is opened. When the blade after transporting the object to be processed is retracted from the processing unit, the shutter mechanism is closed and the shutter mechanism is controlled so that the blade passes through the notch. The processing apparatus according to claim 6, further comprising a control mechanism. The control mechanism is
When the processing is being performed in the processing unit with the gate valve being closed, or when the gate valve is in an open state, the object to be processed is transferred to the processing unit by the transfer device. When carrying in or out, the shutter mechanism is opened,
The processing apparatus according to claim 7, wherein the shutter mechanism is closed when the gate valve is in an open state and the transfer apparatus prepares to replace the object to be processed. The process according to any one of claims 1 to 7, wherein a plurality of the processing units are provided, and the processing units are provided corresponding to the plurality of sides of the transfer chamber, respectively. apparatus. At least one processing unit; a transfer chamber provided with a transfer device that loads and unloads the object to be processed; and a gate valve that opens and closes the processing unit and the transfer chamber to communicate with each other. A processing method for a processing apparatus, comprising: a shutter mechanism that is provided on the transfer chamber side of the gate valve and blocks radiation heat from the processing unit to the transfer chamber when the gate valve is opened. ,
A processing method comprising: opening the shutter mechanism when the processing is being performed in the processing unit with the gate valve being closed. When the processing is being performed in the processing unit with the gate valve being closed, or when the gate valve is being opened, the object to be processed is transferred to the processing unit by the transfer device. When carrying in or out, keep the shutter mechanism open,
11. The process according to claim 10, wherein the shutter mechanism is closed when the gate valve is in an opened state and the transfer device is prepared to replace the object to be processed. Method. When the gate valve is closed and processing is being performed in the processing unit, the shutter mechanism is opened,
When the workpiece is carried into or out of the processing unit by the transfer device when the gate valve is in an open state, the shutter mechanism leaves a gap that allows loading and unloading of the workpiece, In a closed state,
11. The shutter mechanism according to claim 10, wherein the shutter mechanism is completely closed when the gate valve is in an open state and the transfer device is prepared to replace the object to be processed. Processing method. The transport device includes a blade that holds an object to be processed, and the shutter mechanism includes a notch that allows the blade to pass when the shutter is closed.
When the gate valve is closed and processing is being performed in the processing unit, the shutter mechanism is opened,
When the gate valve is in an opened state and the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened,
When the gate valve is in an opened state and preparing to replace the object to be processed in the transfer device, the shutter mechanism is closed,
When the gate valve is opened, when a blade on which a workpiece is not placed is inserted into the processing unit for replacement of the workpiece, and when the gate valve is opened. When the blade after transporting the object to be processed is retracted from the processing unit, the shutter mechanism is closed and the blade is allowed to pass through the notch. The processing method according to claim 10.   A storage medium that operates on a computer and stores a program for controlling a processing device, wherein the control program executes the processing method according to any one of claims 9 to 12 at the time of execution. A storage medium that controls the processing apparatus.

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