JP4963075B2 - Processing apparatus, processing method, and storage medium - Google Patents

Description

  The present invention relates to a processing apparatus for processing a target object such as a semiconductor wafer, a processing method, and a storage medium storing a program for executing the method.

Recently, in response to demands for higher speeds of semiconductor devices, finer wiring patterns, and higher integration, device characteristics have been improved, and in response to this, multiple processes are performed without breaking the vacuum. A multi-chamber type processing apparatus that can be used is used (for example, Patent Document 1).

The multi-chamber type processing apparatus is configured by connecting a plurality of processing units to each side of a polygonal transfer chamber via a gate valve. Each processing chamber communicates with the transfer chamber by opening the corresponding gate valve, and is shut off from the transfer chamber by closing the corresponding gate valve. In the transfer chamber, a transfer device for carrying in and out the semiconductor wafer is provided for a plurality of processing units, and the transfer device can be used without breaking the vacuum in a state where the transfer chamber and each processing chamber are held in vacuum. Thus, the semiconductor wafer can be carried into and out of each processing unit. The transfer device is disposed substantially at the center of the transfer chamber, and a transfer device having a blade for holding a semiconductor wafer at the tip of a rotatable / extensible / retractable portion is used.

  In the multi-chamber type processing apparatus as described above, when a semiconductor wafer to be processed is transferred from the transfer chamber into each processing unit, or the processed semiconductor wafer is transferred from each processing unit to the transfer chamber. In this case, the gate valve is opened and the semiconductor wafer is carried in and out by the blade of the transfer device.

That is, when the semiconductor wafer is loaded / unloaded, the gate valve between the transfer chamber and the processing unit is always opened, and the transfer chamber and the processing unit are communicated with each other.

  By the way, when the processing unit is to be processed in a high temperature atmosphere such as a CVD apparatus, when the semiconductor wafer is loaded / unloaded, the gate valve is opened, and the transfer chamber and the processing unit are communicated with each other. Radiant heat in the processing unit affects the transfer chamber.

If the influence of such radiant heat is exerted in the transfer chamber, the blades and arms of the transfer device may be thermally expanded, causing a transfer error. Radiant heat also adversely affects various sensors in the transfer chamber. For this reason, it is required to eliminate as much as possible the influence of radiant heat exerted on the transfer chamber from the processing unit.
JP 2003-59861 A

The present invention has been made in view of such circumstances, and when the gate valve is opened, it can block the radiant heat from each processing unit to the transfer chamber and prevent the influence of the radiant heat on the transfer chamber. An object is to provide a processing apparatus and a processing method.
Another object of the present invention is to provide a storage medium storing a program for executing such a processing method.

In order to solve the above-described problems, in the first aspect of the present invention, at least one processing unit that performs processing while heating the object to be processed therein, and conveyance that carries the object into and out of the processing unit By opening the transfer chamber provided with the apparatus, the processing unit and the transfer chamber are communicated with each other so that the object to be processed can be transferred between them. preparative a gate valve for blocking, openably provided on the transfer chamber side of the gate valve, and a shutter mechanism for opening and closing between said transfer chamber and the processing unit operates at a speed higher than the gate valve , and a control mechanism for controlling the opening and closing of the gate valve and the shutter mechanism, the control mechanism, is a state of the gate valve is opened, by the conveying device When loading or unloading the processing body to or from the processing unit, the shutter mechanism is opened, the gate valve is opened, and preparations for replacing the processing object are performed by the transfer device. In this case, a processing device is provided that controls the shutter mechanism to be closed .

In the second aspect of the present invention, at least one processing unit that performs processing while heating the object to be processed therein, and a transfer chamber that includes a transfer device that carries the object into and out of the processing unit; A gate valve that allows the processing unit and the transfer chamber to communicate with each other by being opened, and allows the object to be processed to be transferred therebetween, and is closed to shut off the processing unit and the transfer chamber; A shutter mechanism that is openable and closable on the transfer chamber side of the gate valve and that opens and closes between the processing unit and the transfer chamber by operating at a higher speed than the gate valve; and the gate valve and the shutter A control mechanism for controlling opening and closing of the mechanism, wherein the control mechanism is configured such that the gate valve is opened, and the object to be processed is transferred to the processing unit by a transfer device. When loading or unloading, the shutter mechanism is closed in the middle, leaving a gap that allows loading and unloading of the object to be processed, and the gate valve is opened, so that the substrate is covered by the transfer device. Provided is a processing device characterized in that when preparing to replace a processing body, the shutter mechanism is controlled to be completely closed .

  In the third aspect of the present invention, at least one processing unit that performs processing while heating the object to be processed therein, and a transfer chamber that includes a transfer device that carries the object into and out of the processing unit; A gate valve that allows the processing unit and the transfer chamber to communicate with each other by being opened, and allows the object to be processed to be transferred therebetween, and is closed to shut off the processing unit and the transfer chamber; A shutter mechanism that is openable and closable on the transfer chamber side of the gate valve and that opens and closes between the processing unit and the transfer chamber by operating at a higher speed than the gate valve; and the gate valve and the shutter A control mechanism that controls opening and closing of the mechanism, and the transport device includes a blade that holds the object to be processed, and the shutter mechanism is configured to move the blade when closed. The controller has a notch that allows excess, and the control unit is in a state where the gate valve is opened, and when the object to be processed is carried into or out of the processing unit by the transfer device, When the shutter mechanism is opened and the gate valve is opened, and the preparation for replacing the object to be processed is performed by the transfer device, the shutter mechanism is closed and the gate valve is When the blade is placed in the opened state, and the blade on which the workpiece is not placed for replacement of the workpiece is inserted into the processing unit, and the gate valve is opened, the workpiece When the blade after having been transported to the processing unit is withdrawn from the processing unit, the shutter mechanism is closed so that the blade passes through the notch. Providing a processing apparatus and controls.

In the first to third aspects, the control mechanism controls the shutter mechanism to open when the gate valve is in a closed state and processing is being performed in the processing unit. It is preferable to do. Moreover, as a processing apparatus, what has two or more said processing units and these processing units are provided corresponding to the some edge | side of the said conveyance chamber, respectively can be used suitably.

According to a fourth aspect of the present invention, there is provided at least one processing unit for performing processing while heating the object to be processed therein, and a transfer chamber provided with a transfer device for carrying the object into and out of the processing unit. A gate valve that allows the processing unit and the transfer chamber to communicate with each other by being opened, and allows the object to be processed to be transferred therebetween, and is closed to shut off the processing unit and the transfer chamber ; And a processing device provided with a shutter mechanism that is provided on the transfer chamber side of the gate valve so as to be openable and closable and that operates at a higher speed than the gate valve and opens and closes between the processing unit and the transfer chamber . a had been processing method, it is a state in which the gate valve is opened, when loading or unloading the workpiece relative to the processing unit by the conveying apparatus, the shutter The structure was opened, is a state in which the gate valve is opened, the when preparing to replace the workpiece by the conveying apparatus, processing method characterized by closing said shutter mechanism I will provide a.

In a fifth aspect of the present invention, at least one processing unit that performs processing while heating the object to be processed therein, and a transfer chamber that includes a transfer device that carries the object into and out of the processing unit; A gate valve that allows the processing unit and the transfer chamber to communicate with each other by being opened, and allows the object to be processed to be transferred therebetween, and is closed to shut off the processing unit and the transfer chamber; And a processing device provided with a shutter mechanism that is provided on the transfer chamber side of the gate valve so as to be openable and closable and that operates at a higher speed than the gate valve and opens and closes between the processing unit and the transfer chamber. In the processing method, when the gate valve is opened and the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is processed. When the intermediate valve is closed, leaving a gap allowing the loading / unloading of the body, the gate valve is opened, and the transfer device is preparing to replace the object to be processed Provides a processing method characterized in that the shutter mechanism is completely closed .

  In a sixth aspect of the present invention, there is provided at least one processing unit for performing processing while heating the object to be processed therein, and a transfer chamber provided with a transfer device for carrying the object into and out of the processing unit. A gate valve that allows the processing unit and the transfer chamber to communicate with each other by being opened, and allows the object to be processed to be transferred therebetween, and is closed to shut off the processing unit and the transfer chamber; A transfer mechanism provided on the transfer chamber side of the gate valve so as to be openable and closable and operating at a higher speed than the gate valve to open and close between the processing unit and the transfer chamber. Is a processing method using a processing device having a blade that holds an object to be processed, and the shutter mechanism has a notch that allows passage of the blade when closed. A state where the gate valve is opened, and when the workpiece is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened, and the gate valve is opened. Then, when preparing to replace the object to be processed by the transport device, the shutter mechanism is closed, the gate valve is opened, and the object to be processed is replaced. Therefore, when the blade on which the object to be processed is not inserted is inserted into the processing unit and the gate valve is opened, the blade after the object to be processed is transferred to the processing unit is transferred to the processing unit. A method of processing, wherein the shutter mechanism is closed when retracted from the blade so that the blade passes through the notch. Subjected to.

  In the fourth to sixth aspects, it is preferable that the shutter mechanism is opened when the gate valve is in a closed state and processing is performed in the processing unit.

According to a seventh aspect of the present invention, there is provided a storage medium that stores a program that operates on a computer and controls a processing device, and the control program executes the above-described fourth to sixth aspects when executed . Provided is a storage medium characterized by causing a computer to control the processing device so that the processing method is performed.

  Since the shutter mechanism that blocks the radiant heat from the processing unit to the transfer chamber when the gate valve is opened, the radiant heat from each processing unit to the transfer chamber is blocked when the gate valve is opened, The influence of radiant heat on the transfer chamber can be prevented. Therefore, thermal expansion of the blades and arms of the transport device can be suppressed, and there is little risk of causing transport errors. In addition, adverse effects of various sensors in the transfer chamber due to radiant heat can be prevented as much as possible.

In addition, each processing unit is configured to open and close the shutter mechanism in conjunction with execution of processing in the processing unit, opening and closing of the gate valve, loading and unloading of the target object, and preparation for replacement of the target object. Can suppress the influence of the radiant heat on the transfer chamber as much as possible.

Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings.
[First Embodiment]
FIG. 1A is a horizontal sectional view showing a schematic structure of a multi-chamber type processing apparatus for carrying out the semiconductor device manufacturing method according to the first embodiment, and FIG. 1B is a side sectional view thereof. FIG.

The processing apparatus includes four processing units 1, 2, 3, and 4. Each of these units 1 to 4 is provided corresponding to each of the four sides of the transfer chamber 5 having a hexagonal shape. Load lock chambers 6 and 7 are provided on the other two sides of the transfer chamber 5, respectively. A load / unload chamber 8 is provided on the opposite side of the load lock chambers 6 and 7 from the transfer chamber 5, and a semiconductor wafer W can be accommodated on the opposite side of the load lock chambers 6 and 7 of the load / unload chamber 8. Ports 9, 10 and 11 for attaching two carriers C are provided. The processing units 1, 2, 3, 4 perform processing while heating the semiconductor wafer therein, for example, CVD film formation processing, and the temperature therein is high, for example, 600 ° C. To be held.

  The processing units 1 to 4 and the load lock chambers 6 and 7 are connected to each side of the transfer chamber 5 via a gate valve G, as shown in the figure, by opening the corresponding gate valve G. By communicating with the transfer chamber 5 and closing the corresponding gate valve G, the transfer chamber 5 is shut off. A gate valve G is also provided at a portion of the load lock chambers 6, 7 connected to the carry-in / out chamber 8, and the load-lock chambers 6, 7 open the corresponding gate valve G by opening the corresponding gate valve G. 8 is closed from the loading / unloading chamber 8 by closing the corresponding gate valve G.

  In the transfer chamber 5, a transfer device 12 that loads and unloads the semiconductor substrate W with respect to the processing units 1 to 4 and the load lock chambers 6 and 7 is provided. The wafer transfer device 12 is disposed substantially at the center of the transfer chamber 5 and has two blades 14 a and 14 b that hold the semiconductor substrate W at the tip of a rotatable / extensible / retractable portion 13 that can be rotated and extended. These two blades 14a and 14b are attached to the rotating / extending / contracting portion 13 so as to face opposite directions. The inside of the transfer chamber 5 is maintained at a predetermined degree of vacuum. Further, the blades 14a and 14b are of a twin type, but may be a single type.

  Shutters (not shown) are provided in the three ports 9, 10, and 11 for attaching the carrier C in the loading / unloading chamber 8. The ports 9, 10, and 11 accommodate the semiconductor substrate W or are empty carriers C. Is attached directly, and when it is attached, the shutter comes off and communicates with the carry-in / out chamber 8 while preventing intrusion of outside air. An alignment chamber 15 is provided on the side surface of the loading / unloading chamber 8 where the semiconductor substrate W is aligned.

  In the loading / unloading chamber 8, a transfer device 16 for loading / unloading the semiconductor substrate W into / from the carrier C and loading / unloading the semiconductor substrate W into / from the load lock chambers 6 and 7 is provided. The transfer device 16 has an articulated arm structure and can travel on the rail 18 along the arrangement direction of the carrier C. The semiconductor substrate W is placed on the hand 17 at the tip of the transfer device 16 and transferred. I do.

  This processing apparatus has a process controller 20 composed of a microprocessor (computer) that controls each component, and each component is connected to and controlled by this process controller 20. The process controller 20 is connected to a user interface 21 including a keyboard for an operator to input commands for managing the processing device, a display for visualizing and displaying the operating status of the processing device, and the like. .

  In addition, the process controller 20 has a control program for realizing various processes executed by the processing device under the control of the process controller 20 and causes each component of the processing device to execute processing according to processing conditions. A storage unit 22 in which a program, that is, a recipe is stored, is connected. The recipe is stored in a storage medium in the storage unit 22. The storage medium may be a hard disk or semiconductor memory, or may be portable such as a CDROM, DVD, flash memory or the like. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example.

  If necessary, an arbitrary recipe is called from the storage unit 22 by an instruction from the user interface 21 and is executed by the process controller 20, so that a desired process in the processing apparatus is controlled under the control of the process controller 20. Is done.

FIG. 2 is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus shown in FIG.
In the present embodiment, flanges 30 communicating with each other are fitted on the side wall between the gate valve G and the transfer chamber 5. A shutter mechanism 40 that blocks leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 5 when the gate valve G is opened is provided on the transfer chamber 5 side of the flange 30.

The shutter mechanism 40 has two upper and lower shielding plates 41a and 41b, and the material thereof is preferably aluminum which has good thermal conductivity and excellent radiation.

  A drive actuator 42 driven by an electric motor, compressed air, or the like is connected to each of the two shielding plates 41a and 41b, so that the shutter mechanism 40 can be opened and closed in conjunction with each other. It has become.

The opening / closing response speed of the shutter mechanism 40 is faster than the opening / closing speed of the gate valve G, and is preferably about the same as the opening / closing speed of the shutter mechanism of the camera, for example.

Further, since the inside of the transfer chamber 5 is maintained at a predetermined degree of vacuum, a bellows 43 is attached to the drive actuator 42.
Further, the shutter mechanism 40 and the flange 30 may be unitized, and if the unit is made according to the size of the processing apparatus, the handling of the shutter mechanism 40 and the like becomes simple, and the installation is extremely easy. It can be done easily.

FIG. 3A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus shown in FIG. 1, and FIG. 3B is a schematic diagram showing a three-stage opening / closing process of the shutter mechanism. is there.

FIG. 4 is a schematic side view corresponding to the three-stage opening / closing process of the shutter mechanism of FIG.
The shutter mechanism 40 is controlled to take the following three stages of opening / closing processes.

When the gate valve G is closed and processing is being performed in the processing units 1 to 4, the shutter mechanism 40 is in an open state.
Next, when the gate valve G is opened and the semiconductor device W is carried into and out of the processing units 1 to 4 by the transfer device 12, the shutter mechanism 40 leaves a gap that allows the semiconductor substrate W to be loaded and unloaded. In the middle, it is closed.

As the third stage, when the gate valve G is opened and the transfer device 12 prepares for replacement of the semiconductor wafer W, the shutter mechanism 40 is completely closed.

  As described above, in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented. . Therefore, the blades 14a, 14b, etc. of the transport device 12 do not thermally expand, the blades 14a, 14b, etc. do not expand and contract, and there is no incentive for transport errors. Further, various sensors in the transfer chamber 12 are not adversely affected by the radiant heat.

In addition, the shutter mechanism 40 is controlled to open and close in conjunction with execution of processing in the processing units 1 to 4, opening and closing of the gate valve G, loading and unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor substrate W. ing. Therefore, although the radiant heat slightly affects the transfer chamber 5 through the intermediate closing gap of the shutter mechanism 40 as the semiconductor substrate W is loaded / unloaded, the transfer chambers are transferred from the processing units 1 to 4. The leakage of radiant heat to 12 can be suppressed as much as possible.

[Second Embodiment]
FIG. 5A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus according to the second embodiment of the present invention, and FIG. 5B is a two-stage opening / closing process of the shutter mechanism. It is a schematic diagram which shows.
FIG. 6 is a timing chart showing a two-stage opening / closing process of the shutter mechanism.

In the present embodiment, the shutter mechanism 40 is controlled to take the following two-stage opening / closing process.
When the gate valve G is closed and processing is being performed in the processing units 1 to 4, or when the gate valve G is opened and the semiconductor wafer W is carried into and out of the processing units 1 to 4 by the transfer device 12. In other words, the shutter mechanism 40 is opened.

Next, the gate valve G is opened, and the shutter mechanism 40 is closed when the transfer device 12 prepares to replace the semiconductor wafer W.

In the timing chart of FIG. 6, the shutter mechanism 40 is closed before the blade 14b is carried into the processing units 1 to 4 in (A). When the blade 14b enters 1 to 4, the shutter mechanism 40 is in an open state.

In (C), when the blade 14b is carried out, the shutter mechanism 40 is in an open state. However, during the transition from (B) to (C), the shutter mechanism 40 may be in an intermediately closed state so as not to interfere with the blade 14b on which the semiconductor wafer W is placed.

In (D), as preparation for exchanging the semiconductor wafer W, a blade 14b on which the semiconductor wafer W unloaded from one of the processing units 1 to 4 is placed and a blade 14a on which the semiconductor wafer W to be loaded into the processing unit is placed. The shutter mechanism 40 is in a closed state when the rotation / expansion / contraction part 13 having a rotation angle of 180 ° is turned.
In (E), when the blade 14a enters the processing units 1 to 4, the shutter mechanism 40 is opened. In (F), the shutter mechanism 40 is also opened when the blade 14a is carried out. However, when shifting from (E) to (F), the shutter mechanism 40 may be in an intermediately closed state so as not to interfere with the blade 14a.

Also in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented.

Further, although the opening / closing process of the shutter mechanism 40 is a two-stage process, for the execution of processing in the processing units 1 to 4, opening / closing of the gate valve G, loading / unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor wafer W Since the shutter mechanism 40 is controlled to open and close in conjunction with each other, as the semiconductor substrate W is loaded and unloaded, the transfer chamber 5 is somewhat affected by the radiant heat through the open portion of the shutter mechanism 40. Although the influence is greater than that of the first embodiment, leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 12 can be effectively suppressed.

[Third Embodiment]
FIG. 7A is an enlarged side cross-sectional view of the main part of the gate valve and the transfer chamber of the processing apparatus according to the third embodiment of the present invention, and FIG. 7B is a two-stage opening / closing process of the shutter mechanism. It is a schematic diagram which shows.
In the present embodiment, the shielding plates 41a and 41b of the shutter mechanism 40 have notches 44a and 44b that allow the blades 14a and 14b of the transport device 12 to pass when closed.

The shutter mechanism 40 is controlled to take the following two-stage opening / closing process.
When the gate valve G is closed and processing is being performed in the processing units 1 to 4, the shutter mechanism 40 is opened. The shutter mechanism 40 is also opened when the gate valve G is opened and the semiconductor device W is carried into and out of the processing unit by the transfer device 12. However, the semiconductor wafer W may be in an intermediately closed state to the extent that loading / unloading of the semiconductor wafer W can be permitted.

Further, the gate valve G is opened, and the shutter mechanism 40 remains closed when the transfer device 12 prepares to replace the semiconductor wafer W. Specifically, when the blade 4b is inserted to receive the wafer W as shown in FIG. 6B, and after the wafer W is transferred from the blade 4a to the processing unit as shown in FIG. 6F. When the blade 4a is retracted from the processing unit, the blade 14a or 14b is passed through the notches 44a and 44b.

Also in the present embodiment, when the gate valve G is opened, the radiant heat from each of the processing units 1 to 4 to the transfer chamber 5 can be blocked, and the influence of the radiant heat on the transfer chamber 5 can be prevented.

In addition, although the opening / closing process of the shutter mechanism 40 is in two stages, it is linked to the execution of processing in the processing units 1 to 4, opening / closing of the gate valve G, loading / unloading of the semiconductor substrate W, and preparation for replacement of the semiconductor substrate W. Thus, the shutter mechanism 40 is controlled to open and close. Therefore, although the radiant heat slightly affects the transfer chamber 5 through the notches 44a and 44b as the semiconductor substrate W is loaded and unloaded, the influence is less than in the second embodiment. Leakage of radiant heat from the processing units 1 to 4 to the transfer chamber 12 can be more effectively suppressed than in the second embodiment.

The present invention can be variously modified without being limited to the above embodiment. For example, in the above-described embodiment, the shutter mechanism 40 opens and closes in two stages or three stages. However, the shutter mechanism 40 may be configured to open and close in four stages or more.

  Further, the processing apparatus of the present invention is not limited to the multi-chamber type processing apparatus as in the above embodiment.

(A) is a horizontal sectional view which shows schematic structure of the multi-chamber type processing apparatus for enforcing the manufacturing method of the semiconductor device which concerns on 1st Embodiment, (b) is the side sectional drawing. The expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus shown in FIG. (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus shown in FIG. 1, (b) is a schematic diagram showing a three-stage opening / closing process of the shutter mechanism. The schematic diagram of the side view corresponding to the three-step opening / closing process of the shutter mechanism of FIG.3 (b). (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus which concerns on the 2nd Embodiment of this invention, (b) shows the two-step opening / closing process of a shutter mechanism. Pattern diagram. The timing chart which shows the two-step opening / closing process of a shutter mechanism. (A) is an expanded side sectional view of the principal part of the gate valve and transfer chamber of the processing apparatus which concerns on the 3rd Embodiment of this invention, (b) shows the two-step opening / closing process of a shutter mechanism. Pattern diagram.

Explanation of symbols

1-4; Processing unit 5; Transfer chamber 12; Transfer device 20; Process controller 22; Storage unit (storage medium)
30; flange 40; shutter mechanisms 41a and 41b; shielding plate W; semiconductor substrate

Claims (10)

At least one processing unit for performing processing while heating the object to be processed therein
A transfer chamber provided with a transfer device for transferring the object to be processed into and out of the processing unit;
By opening the gate, the processing unit and the transfer chamber communicate with each other to enable transfer of the object to be processed between them, and by closing the gate valve, the processing unit and the transfer chamber are shut off.
A shutter mechanism which is provided on the transfer chamber side of the gate valve so as to be openable and closable, and which operates at a higher speed than the gate valve to open and close between the processing unit and the transfer chamber ;
A control mechanism for controlling the opening and closing of the gate valve and the shutter mechanism ,
The control mechanism is
The gate valve is opened, and when the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened,
When the gate valve is in an opened state and the transfer device is preparing to replace the object to be processed , the processing device is controlled to close the shutter mechanism .   At least one processing unit that performs processing while heating the object to be processed therein,
  A transfer chamber provided with a transfer device for transferring the object to be processed into and out of the processing unit;
  By opening the gate, the processing unit and the transfer chamber communicate with each other to enable transfer of the object to be processed between them, and by closing the gate valve, the processing unit and the transfer chamber are shut off.
  A shutter mechanism which is provided on the transfer chamber side of the gate valve so as to be openable and closable, and which operates at a higher speed than the gate valve to open and close between the processing unit and the transfer chamber;
  A control mechanism for controlling opening and closing of the gate valve and the shutter mechanism;
Comprising
  The control mechanism is
  The gate valve is in an opened state, and when the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism leaves a gap that allows the object to be carried in / out, Closed in the middle,
When the gate valve is in an opened state and the transfer device is prepared to replace the object to be processed, the processing device controls the shutter mechanism to be completely closed. .   At least one processing unit that performs processing while heating the object to be processed therein,
  A transfer chamber provided with a transfer device for transferring the object to be processed into and out of the processing unit;
  By opening the gate, the processing unit and the transfer chamber communicate with each other to enable transfer of the object to be processed between them, and by closing the gate valve, the processing unit and the transfer chamber are shut off.
  A shutter mechanism which is provided on the transfer chamber side of the gate valve so as to be openable and closable, and which operates at a higher speed than the gate valve to open and close between the processing unit and the transfer chamber;
  A control mechanism for controlling opening and closing of the gate valve and the shutter mechanism;
Comprising
  The transport device includes a blade that holds an object to be processed, and the shutter mechanism includes a notch that allows the blade to pass when the shutter is closed.
  The controller is
  The gate valve is opened, and when the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened,
When the gate valve is in an opened state and preparing to replace the object to be processed by the transfer device, the shutter mechanism is closed,
  When the gate valve is opened, when a blade on which a workpiece is not placed is inserted into the processing unit for replacement of the workpiece, and when the gate valve is opened. When the blade after the object to be processed is conveyed to the processing unit is retracted from the processing unit, the shutter mechanism is closed, and the blade is controlled to pass through the notch. A processing apparatus characterized by the above. The control mechanism is a state in which the gate valve is closed, when the processing is executed in the processing unit, from claim 1, wherein the controller controls so as to open said shutter mechanism The processing apparatus of any one of Claim 3 . A plurality of said processing unit, the processing according to claims 1, these processing units, characterized in that are provided corresponding to the plurality of sides of the transfer chamber to any one of claims 4 apparatus. The processing unit is opened by opening at least one processing unit that performs processing while heating the object to be processed, and a transfer chamber having a transfer device that carries the object into and out of the processing unit. A gate valve that communicates with the transfer chamber to enable the transfer of the object to be processed between them, and shuts off the processing unit and the transfer chamber by closing, and the transfer valve side of the gate valve openably provided, a processing method using the processing apparatus including a shutter mechanism for opening and closing between said transfer chamber and the processing unit operates at a speed higher than the gate valve,
When the gate valve is in an opened state, when the workpiece is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened,
A processing method comprising: closing the shutter mechanism when the gate valve is in an opened state and the transfer device is preparing to replace the object to be processed .   The processing unit is opened by opening at least one processing unit that performs processing while heating the object to be processed, and a transfer chamber having a transfer device that carries the object into and out of the processing unit. A gate valve that communicates with the transfer chamber to enable the transfer of the object to be processed between them, and shuts off the processing unit and the transfer chamber by closing, and the transfer valve side of the gate valve A processing method using a processing apparatus provided with a shutter mechanism that opens and closes, operates at a speed faster than the gate valve, and opens and closes between the processing unit and the transfer chamber,
  The gate valve is in an opened state, and when the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism leaves a gap that allows the object to be carried in / out, Let it be in the middle closed state,
  A processing method, wherein the shutter mechanism is completely closed when the gate valve is in an opened state and the transfer device is preparing to replace the object to be processed.   The processing unit is opened by opening at least one processing unit that performs processing while heating the object to be processed, and a transfer chamber having a transfer device that carries the object into and out of the processing unit. A gate valve that communicates with the transfer chamber to enable the transfer of the object to be processed between them, and shuts off the processing unit and the transfer chamber by closing, and the transfer valve side of the gate valve And a shutter mechanism that opens and closes between the processing unit and the transfer chamber by operating at a speed higher than that of the gate valve, and the transfer device is a blade that holds an object to be processed. And the shutter mechanism is a processing method using a processing device having a notch that allows passage of the blade when closed.
  The gate valve is in an opened state, and when the object to be processed is carried into or out of the processing unit by the transfer device, the shutter mechanism is opened.
When the gate valve is in an opened state and preparing to replace the object to be processed by the transfer device, the shutter mechanism is closed,
  When the gate valve is opened, when a blade on which a workpiece is not placed is inserted into the processing unit for replacement of the workpiece, and when the gate valve is opened. When the blade after transporting the object to be processed is retracted from the processing unit, the shutter mechanism is closed so that the blade passes through the notch. Characteristic processing method.
  9. The shutter mechanism is opened when the gate valve is in a closed state and processing is being performed in the processing unit. 10. The processing method described. A storage medium that operates on a computer and stores a program for controlling a processing device, wherein the control program is executed so that the processing method according to any one of claims 6 to 9 is performed at the time of execution. A storage medium that controls the processing apparatus.

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