JP2008249988A - Manufacturing method of color filter substrate, color filter substrate, and liquid crystal display device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a color filter having enhanced contact strength of a seal part at low cost without patterning a transparent protective layer nor transparent conductive film. <P>SOLUTION: The manufacturing method of the color filter substrate used for the liquid crystal display device which has the color filter substrate and a counter substrate stuck together via liquid crystal and also has a seal material formed on a circumference of both substrates is characterized in that a resin black matrix is formed at at least a seal material formation position on the color filter substrate, the entire surface of the color filter substrate is coated with a transparent resin material, then the transparent resin is cured by drying or baking in two stages, and a transparent conductive film is formed on the entire surface of the color filter. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a color filter used in a liquid crystal display device, in particular, a method for producing a color filter having a resin black matrix, a transparent protective film, and a transparent conductive film, and a color filter and a liquid crystal display device using the same.

  Since the liquid crystal display device is thin, lightweight, and has low power consumption, it is used as a display device for a wide range of electronic devices such as notebook computers, electronic notebooks, mobile phones, and portable game machines. As these applications, in order to meet the demand for higher definition of images, in recent years, the use of a color liquid crystal display device provided with a color filter has become the mainstream.

  A general configuration of a color liquid crystal display device including a color filter will be briefly described. For example, as shown in FIG. 2, at least three of R (red), G (green), and B (blue) are provided on a transparent substrate 10. Color filter layer 12 (12R, 12G, 12B) (colored layer), black matrix layer 11 that blocks light leakage between pixels, and the purpose of protecting the colored layer and the black matrix layer and flattening the surface The transparent protective layer 13, the color filter 101 including the transparent conductive film 14, the alignment film 15 on another transparent substrate 10, and the array substrate 102 (wiring substrate) including the transparent pixel electrode 16 are connected by the spacer 19. It has a structure in which the liquid crystal layer 18 is sealed by holding the liquid crystal layer 18 at predetermined intervals, sealing the periphery with a sealant 20 to form a pair of transparent substrates. In particular, when the black matrix layer is formed of a resin in which a light-shielding agent is dispersed, the unevenness of the color filter surface increases depending on the thickness of the black matrix layer, and thus a transparent protective layer is essential to flatten the color filter surface. .

  The seal part (region A) sealed with the sealant 20 is required to have high adhesion so as not to be peeled off in a reliability test or the like of the liquid crystal display device. However, when the seal portion is on the transparent conductive film, the adhesion between the transparent protective film and the transparent conductive film of the seal portion is not so strong, and thus there is a problem that seal peeling occurs in the reliability test of the liquid crystal display device. there were.

  In order to solve this problem, a method of obtaining a liquid crystal display device as shown in FIG. 2 by patterning a transparent protective film or a transparent conductive film so that the transparent protective film and the transparent conductive film are not laminated in the seal portion. Is disclosed (for example, Patent Document 1). However, this method requires a member such as an individual photomask depending on the size and arrangement of the display screen, which increases costs.

  Further, a surface treatment agent that repels the transparent protective film is formed in advance on the seal portion, and after the transparent protective film is applied to the entire surface of the color filter, the surface treatment agent is removed to obtain a liquid crystal display device as shown in FIG. A method is disclosed (for example, Patent Document 2). However, in this method, since two steps of forming and removing the surface treatment agent are added, the cost increases.

Also disclosed is a method of forming a transparent conductive film after exposing the transparent protective film to atmospheric pressure plasma (for example, Patent Document 3). By applying this method, the adhesion between the transparent protective film and the transparent conductive film is greatly improved while minimizing the cost increase. However, in recent years, there is a tendency that the seal width becomes narrower as the liquid crystal display device is miniaturized, and even with this method, the adhesion of the seal portion may be insufficient.
Japanese Patent Laid-Open No. 5-265209 Japanese Patent Laid-Open No. 7-110471 JP 2005-283785 A

  In view of the above problems, an object of the present invention is to improve the adhesion of a seal portion without increasing the cost in a method for producing a color filter in which a resin black matrix, a transparent protective film, and a transparent conductive film are formed.

As a result of intensive studies on the above problems, the present inventors have found that in order to solve the above problems, it is necessary to sufficiently consider a drying method when forming a transparent protective film, and the present invention has been completed. It was. That is, the color filter manufacturing method, color filter, and liquid crystal display device of the present invention are as follows.
(1) In a method of manufacturing a color filter substrate used in a liquid crystal display device in which a color filter substrate and a counter substrate are bonded to each other via a liquid crystal and a sealing material is formed between the two substrates, at least the color filter substrate A resin black matrix is formed at the sealing material forming position, then a transparent resin material is applied to the entire surface of the color filter substrate, and then the transparent resin is cured by performing drying or baking in at least two stages. A method for producing a color filter substrate, comprising providing a transparent conductive film on the substrate.
(2) The method for producing a color filter substrate according to (1), wherein in the at least two-stage drying or baking process, the first drying or baking process is a vacuum drying process.
(3) The method for producing a color filter substrate according to (1) or (2), wherein in the vacuum drying step, the temperature of the color filter substrate during vacuum drying is 80 ° C. or higher.
(4) In the said vacuum drying process, the temperature of the color filter substrate at the time of vacuum drying is 100 degrees C or less, The manufacturing method of the color filter as described in (3) characterized by the above-mentioned.
(5) A color filter substrate manufactured using the method for manufacturing a color filter substrate according to any one of (1) to (4).
(6) A liquid crystal display device using the color filter substrate according to (5).

  Since the color filter manufacturing method of the present invention can improve the adhesion of the seal portion of the liquid crystal display device, even when the seal width is small, such as a small liquid crystal display device, seal peeling does not occur and the reliability is high. A liquid crystal display device can be provided.

  Hereinafter, the present invention will be described in detail together with preferred embodiments.

  The color filter manufacturing method of the present invention is a color filter having a structure in which at least a seal portion of a color filter substrate has a structure in which a resin black matrix in which a light shielding agent is dispersed in a resin, a transparent protective film, and a transparent conductive film are laminated. It is a manufacturing method.

  The transparent substrate used in the present invention is not particularly limited, but glass having high light transmittance, excellent mechanical strength and dimensional stability is optimal, and quartz glass, borosilicate glass, aluminosilicate Inorganic glasses such as salt glass, soda glass and alkali-free glass are suitable. In addition, a plastic plate such as a polyimide resin, an acrylic resin, a polyester resin, or a polycarbonate resin, a film wound up in a roll shape, or the like can be used. In particular, it is preferable to select glass from the viewpoint of excellent mechanical strength.

  The resin used for the black matrix used in the present invention is not particularly limited, but is photosensitive or non-photosensitive such as epoxy resin, acrylic resin, urethane resin, polyester resin, polyimide resin, polyolefin resin and the like. These materials are preferably used. The resin used for the black matrix is preferably a resin having higher heat resistance than the resin used for the pixel or the protective film, and is preferably a resin resistant to the organic solvent used in the process after the resin black matrix is formed. In particular, a polyimide resin is preferably used.

  Here, the polyimide resin is not particularly limited, but usually a polyimide precursor (n = 1 to 2) mainly composed of a structural unit represented by the following general formula (I) is heated or appropriate. Those imidized with a suitable catalyst are preferably used.

  Further, the polyimide resin may contain bonds other than imide bonds such as amide bonds, sulfone bonds, ether bonds, and carbonyl bonds in addition to imide bonds.

  In the general formula (I), R1 is a trivalent or tetravalent organic group having at least two carbon atoms. From the viewpoint of heat resistance, R1 contains a cyclic hydrocarbon, an aromatic or an aromatic heterocycle, and is preferably a trivalent or tetravalent group having 6 to 30 carbon atoms. Examples of R1 include phenyl group, biphenyl group, terphenyl group, naphthalene group, perylene group, diphenyl ether group, diphenylsulfone group, diphenylpropane group, benzophenone group, biphenyltrifluoropropane group, cyclobutyl group, cyclopentyl group and the like. It is not limited to these.

  R2 is a divalent organic group having at least 2 carbon atoms. From the viewpoint of heat resistance, R2 contains a cyclic hydrocarbon, an aromatic ring or an aromatic resin ring, and has 6 to 30 carbon atoms. These divalent groups are preferred. Examples of R2 include phenyl group, biphenyl group, terphenyl group, naphthalene group, perylene group, diphenyl ether group, diphenylsulfone group, diphenylpropane group, benzophenone group, biphenyltrifluoropropane group, diphenylmethane group, cyclohexylmethane group and the like. However, it is not limited to these. In the polymer having the structural unit (I) as a main component, R1 and R2 may each be composed of one of these, or may be a copolymer composed of two or more of each. Furthermore, in order to improve the adhesion to the substrate, it is preferable to copolymerize bis (3-aminopropyl) tetramethyldisiloxane having a siloxane structure as a diamine component within a range that does not lower the heat resistance.

  Specific examples of the polymer having the structural unit (I) as a main component include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4, The group consisting of 4′-biphenyltrifluoropropanetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenylsulfonetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic acid dianhydride, and the like One or more carboxylic dianhydrides selected from the group consisting of paraphenylenediamine, 3,3'-diaminophenyl ether, 4,4'-diaminophenyl ether, 3,4'-diaminophenyl ether, 3,3'- Diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 4,4′-diaminodicyclohexylmethane, 4,4′-diaminodiphenylmethane, etc. However, it is not limited to these. These polyimide precursors are synthesized by a known method, that is, by selectively combining tetracarboxylic dianhydride and diamine and reacting them in a solvent.

  As a light-blocking agent for resin black matrix, a mixture of metal oxide powder such as carbon black, titanium oxynitride, titanium oxide and iron tetroxide, metal sulfide powder and metal powder, as well as a mixture of red, blue and green pigments Etc. can be used. Among these, carbon black and titanium oxynitride are particularly preferable because of their excellent light shielding properties. In order to adjust the chromaticity and the like, it is preferable to mix a pigment with the light-shielding agent to make an achromatic color.

  When the black matrix resin is polyimide, the black paste solvent is usually an amide polar solvent such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, γ-butyrolactone, etc. The lactone polar solvent is preferably used.

  Examples of the method for dispersing the light-shielding agent and other pigments with respect to the light-shielding agent include, for example, mixing a light-shielding agent and a dispersing agent in the polyimide precursor solution, and then, for example, three rolls, a sand grinder, and a ball mill. Although there is a method of dispersing in a disperser, it is not particularly limited to this method. Various additives may be added to improve the dispersibility of the light-shielding agent or to improve the coating property and leveling property.

  As a method for forming the resin black matrix, patterning is performed after a black paste is applied on a transparent substrate and dried. As a method for applying the black paste, a dipping method, a roll coater method, a spinner method, a die coating method, a method using a wire bar, and the like are preferably used. Thereafter, heat drying (semi-cure) is performed using an oven or a hot plate. Do. Semi-cure conditions vary depending on the resin, solvent, and paste coating amount used, but it is usually preferable to heat at 50 to 200 ° C. for 1 to 60 minutes.

  The black paste film is formed by the above method using a paste using a photosensitive or non-photosensitive resin. When the resin is a non-photosensitive resin, after forming a positive type photoresist film thereon, and when the resin is a photosensitive resin, either as it is or after forming an oxygen blocking film, Perform exposure and development. If necessary, the positive photoresist or the oxygen blocking film is removed and heat-dried (main cure). In the case of obtaining a polyimide resin from a precursor, the present curing conditions are generally slightly increased depending on the coating amount, but are generally heated at 200 to 350 ° C. for 1 to 60 minutes. Through the above process, a resin black matrix is formed on the transparent substrate.

  The film thickness of the resin black matrix is preferably 0.5 to 2.0 μm, more preferably 0.7 to 1.5 μm. When this film thickness is thinner than 0.5 μm, it is not preferable because the light shielding property becomes insufficient.

  Openings are provided between the resin black matrices. If necessary, a plurality of colored layers of the three primary colors can be arranged so as to cover at least the openings. That is, one opening is covered with any one colored layer of the three primary colors, and a plurality of colored layers of each color are arranged.

  The colored layer constituting the color filter includes at least three primary colors. That is, when color display is performed by the additive color method, three primary colors of red (R), green (G), and blue (B) are selected, and when color display is performed by the subtractive color method, cyan (C) and magenta. Three primary colors (M) and yellow (Y) are selected. In general, an element including these three primary colors can be used as a unit as a color display picture element. For the colored layer, a resin colored with a colorant is used.

  As the colorant used in the colored layer, organic pigments, inorganic pigments, dyes and the like can be suitably used, and various additives such as ultraviolet absorbers, dispersants, and leveling agents may be added. . As the organic pigment, phthalocyanine, azirake, condensed azo, quinacridone, anthraquinone, perylene, and perinone are preferably used.

  As the resin used for the colored layer, a photosensitive or non-photosensitive material such as an epoxy resin, an acrylic resin, a urethane resin, a polyester resin, a polyimide resin, or a polyolefin resin is preferably used. It is preferable to disperse or dissolve in these resins for coloring. Photosensitive resins include photodegradable resins, photocrosslinkable resins, photopolymerizable resins, and the like, and in particular, monomers, oligomers or polymers having an ethylenically unsaturated bond and an initiator that generates radicals by ultraviolet rays. A photosensitive composition, a photosensitive polyamic acid composition, and the like are preferably used. As the non-photosensitive resin, those that can be developed with the above-mentioned various polymers are preferably used. However, the non-photosensitive resin has heat resistance that can withstand the heat applied in the transparent conductive film forming process and the liquid crystal display manufacturing process. A resin having a property is preferable, and a resin having resistance to an organic solvent used in a manufacturing process of a liquid crystal display device is preferable, and a polyimide resin is particularly preferably used. Here, as a preferable polyimide resin, a polyimide resin preferably used as the material of the above-described resin black matrix can be exemplified.

  As a method for forming the colored layer, patterning is performed after coating and drying on the substrate on which the resin black matrix is formed. As a method of dispersing or dissolving a colorant to obtain a colored paste, after mixing a resin and a colorant in a solvent, there is a method of dispersing in a disperser such as a triple roll, sand grinder, ball mill, etc. The method is not particularly limited.

  As a method for applying the colored paste, as in the case of the black paste, a dip method, a roll coater method, a spinner method, a die coating method, a method using a wire bar, etc. are preferably used, and then an oven or a hot plate is used. Heat drying (semi-cure). Semi-cure conditions vary depending on the resin, solvent, and paste application amount to be used, but it is usually preferable to heat at 60 to 200 ° C for 1 to 60 minutes.

  When the resin is a non-photosensitive resin, the colored paste film thus obtained is formed after a positive photoresist film is formed thereon, and when the resin is a photosensitive resin. As it is or after forming an oxygen blocking film, exposure and development are performed. If necessary, the positive photoresist or the oxygen blocking film is removed and heat-dried (main cure). Although this curing condition changes with resin, when obtaining polyimide-type resin from a precursor, although it changes a little with coating amounts, it is common to heat at 200-300 degreeC normally for 1 to 60 minutes. Through the above process, a patterned colored layer is formed on the substrate on which the black matrix is formed.

  The film thicknesses of the three primary colors are preferably formed to be 0.2 to 2.5 μm, and more preferably 0.5 to 2.0 μm. When the film thickness is thicker than 2.5 μm, it is not preferable because the surface step becomes too large.

  In the present invention, a transparent protective film is formed on the entire surface of the color filter. This transparent protective film not only protects the surface of the color filter, but also improves the flatness of the display area to improve the display characteristics, and contamination of the liquid crystal layer by pigments and organic substances used in the light shielding layer and colored layer. Also has a role to prevent.

The transparent protective layer used in the present invention is formed by curing a transparent resin material. The material of the transparent resin material is not particularly limited, but an epoxy resin, an acrylic resin, a urethane resin, a polyester resin, a polyimide resin, a polyolefin resin, gelatin, or the like is preferably used. A resin having heat resistance capable of withstanding the heat applied in the manufacturing process of the liquid crystal display device or the liquid crystal display device is preferable, and a resin having resistance to an organic solvent used in the liquid crystal display device manufacturing device is preferable. A resin, an acrylic resin, or an epoxy resin is preferably used.
As a method for applying the transparent resin material, a dipping method, a roll coater method, a spinner method, a die coating method, a method using a wire bar, and the like are preferably used as in the case of a black paste and a colored paste.
In the present invention, the transparent protective film is formed by curing the transparent resin material by at least two stages of drying or baking. In the two-stage drying or baking process, the first drying or baking process is preferably a vacuum drying process. In the vacuum drying step, the temperature of the color filter during vacuum drying is desirably 80 ° C. or higher, and more preferably 85 ° C. or higher. If the temperature is less than 80 ° C., it is not preferable because the adhesion strength sufficient to withstand the long-term reliability test of the liquid crystal display device cannot be obtained in many cases. The temperature is desirably 100 ° C. or less, and more desirably 95 ° C. or less. When the temperature is higher than 100 ° C., the flatness of the transparent protective film is lost due to the occurrence of bumping of the solvent and the influence of the airflow in the apparatus, which is not preferable. After the vacuum drying step, preheating (semi-cure) may be performed as necessary. The semi-cure conditions vary depending on the type of transparent resin material to be used, the solvent, and the coating amount of the transparent resin material, but it is usually preferable to heat at 60 to 200 ° C. for 1 to 60 minutes. Although a baking process changes with kinds and application quantity of transparent resin material to be used, it is preferable to heat at 200-300 degreeC normally for 1 to 60 minutes.

  Although the film thickness of a transparent protective layer is not specifically limited, 0.05-3.0 micrometers is preferable.

  In this invention, after forming a transparent protective film, a transparent conductive film is formed. The material of the transparent conductive film is not particularly limited, but indium oxide, tin oxide, zinc oxide, a mixture of indium oxide and tin oxide (hereinafter referred to as ITO), gold, silver, copper, aluminum, palladium, platinum, and the like Alternatively, it is preferable to use a mixture or a laminate, and ITO is particularly preferable because a material excellent in transparency is preferable.

There are no particular limitations on the method for forming the transparent conductive film, and vacuum deposition, CVD, sputtering, EB, and the like are preferably used.
The film thickness of the transparent conductive film is preferably 10 to 5000 angstroms.

  The color filter obtained as described above is subjected to a rubbing process after forming an alignment film, and then subjected to a rubbing process after forming an alignment film on a driving element substrate composed of a thin film transistor (TFT) element, a scanning line, a signal line, and a transparent electrode. A pair of transparent substrates is obtained by facing the applied counter substrate and pasting with a sealant. After injecting liquid crystal from a liquid crystal injection port provided in a part of the seal portion of the pair of transparent substrates, the injection port is sealed. Next, a liquid crystal display device is obtained by attaching a polarizing plate to the outside of the substrate and mounting an IC driver or the like.

  The adhesion strength of the seal portion of the color filter can be measured as follows.

  That is, a sealing agent is adhered to a region (hereinafter referred to as a sealing portion) where a sealing agent is applied in the color filter, and a tensile test is performed. A tensile load was applied until fracture occurred, and the adhesion strength was determined from the maximum point load obtained and the seal diameter.

  The sealant used for the tensile test is an epoxy thermosetting sealant that is generally used as a sealant for liquid crystal display devices. For example, “STRUCT BOND” XN-21-S-B (Mitsui Chemicals) is preferable as the sealant. The sealant, which has been stored frozen, is returned to room temperature and then dropped onto the seal portion of the color filter to semi-cure the sealant. The semi-cure temperature and time vary depending on the sealant used, but in the case of “STRUCT BOND” XN-21-S-B (Mitsui Chemicals), it is preferably performed at 90 ° C. for about 15 minutes. After semi-cure, it is cooled to room temperature, a spacer film is placed around the sealing agent in order to make the thickness of the sealing agent constant, and a cover glass having a size of about 18 × 10 mm and a thickness of about 1.1 mm is covered and cured by heating. The heat-curing time varies depending on the sealant used, but in the case of “STRUCT BOND” XN-21-S-B (Mitsui Chemicals), it is preferably performed at 160 ° C. for 90 minutes. Adhere a hexagonal nut on the cover glass and apply a tensile load by pulling the hexagonal nut. As the tensile load, a commercially available tensile tester is used, and “EZTest” (manufactured by Shimadzu Corporation) is particularly preferable. Such a test is performed 20 times or more, and a value obtained by dividing the maximum load by the seal area is calculated. Each seal area is x, each maximum load is y, and the value of y when x is approximated as a power function of x is the adhesion strength.

EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on a preferable Example, the efficacy of this invention is not restrict | limited at all by the following Example.
[Example 1]
A non-photosensitive black paste obtained by stirring and mixing a black pigment made of carbon black, polyamic acid, and solvent is applied to a glass substrate (Corning, Eagle 2000) with a curtain flow coater, and heated at 135 ° C. for 10 minutes. It dried and formed the black resin coating film. 1. A positive photoresist (manufactured by Clariant, AZ RFP250SA) was applied with a curtain flow coater, pre-baked at 90 ° C. for 5 minutes with a hot plate, exposed to 120 mJ / cm 2 ultraviolet rays using an ultra-high pressure mercury lamp, and exposed to a mask. Using 25% tetramethylammonium hydroxide aqueous solution, photoresist development and resin coating etching are simultaneously performed to form a pattern, the resist is peeled off with methyl cellosolve acetate, and heated on a hot plate at 290 ° C. for 10 minutes. This was imidized to form a black matrix having a film thickness of 1.25 μm.

  After washing the substrate on which the black matrix is formed, a non-photosensitive blue paste obtained by stirring and mixing the blue pigment, polyamic acid, and solvent is applied with a curtain flow coater, and dried at 120 ° C. for 10 minutes on a hot plate, A blue resin coating was formed. After that, a positive photoresist (manufactured by Clariant, AZ RFP250SA) is applied with a curtain flow coater, prebaked at 90 ° C. for 5 minutes with a hot plate, and exposed to a mask with 120 mj / cm 2 ultraviolet rays using an ultrahigh pressure mercury lamp. , Using a 2.25% aqueous solution of tetramethylammonium hydroxide, simultaneously developing the photoresist and etching the resin coating, forming a pattern, stripping the resist with methyl cellosolve acetate, and 280 ° C., 10 ° C. with a hot plate The mixture was imidized by heating to form a blue colored pattern having a film thickness of 1.5 μm.

  The substrate on which the black matrix and the blue colored pattern were formed was washed with water, and similarly, a red paste was applied and patterned to form a red colored pattern having a thickness of 1.5 μm.

  The substrate on which the black matrix, blue, and red colored patterns were formed was further washed with water, and then a green paste was applied and patterned in the same manner to form a green colored pattern with a film thickness of 1.5 μm.

  After washing the substrate on which the black matrix, red, green, and blue coloring pattern is formed, apply an epoxy resin solution to the entire surface of the substrate with a curtain flow coater, and vacuum dry for 60 seconds while heating the substrate to 80 ° C. After the application, the epoxy resin was cured by heating and baking at 280 ° C. for 10 minutes on a hot plate to form a transparent protective film having a thickness of 1.5 μm.

  The substrate on which the black matrix, red, green and blue coloring patterns and the transparent protective film were formed was washed with water, and then the substrate was subjected to surface treatment by exposing it to atmospheric pressure plasma, and an ITO film having a thickness of 140 nm was formed on the entire surface of the substrate.

  The adhesion strength at the seal portion of the obtained color filter was measured as described above and found to be 10.4 MPa.

In addition, a polyimide-based alignment film was provided on the obtained color filter and on the facing wiring substrate, respectively, and subjected to rubbing treatment. A sealant was applied and bonded to the two substrates so as to cover the resin black matrix. Next, after injecting liquid crystal from the injection port provided in the seal portion, the injection port was sealed, and a polarizing plate was bonded to the outside of the substrate, thereby manufacturing a liquid crystal display device having the structure shown in FIG. When the completed liquid crystal display device was subjected to a long-term reliability test, no defects such as peeling of the seal portion were observed, and high reliability was obtained. The display of the liquid crystal display device was good.
[Example 2]
In the formation of the transparent protective film, a color filter and a liquid crystal display device were produced in the same manner as in Example 1 except that vacuum drying was performed for 60 seconds while heating so that the substrate temperature was 90 ° C.

The adhesion strength at the seal portion of the obtained color filter was measured and found to be 15.2 MPa. Further, when the obtained liquid crystal display device was subjected to a long-term reliability test, no defects such as peeling of the seal portion were observed, and high reliability was obtained. The display of the liquid crystal display device was good.
[Example 3]
A color filter and a liquid crystal display device were produced in the same manner as in Example 1 except that in the formation of the transparent protective film, vacuum drying was performed for 60 seconds while heating so that the substrate temperature was 100 ° C.

The adhesion strength at the seal portion of the obtained color filter was measured and found to be 14.1 MPa. Further, when the obtained liquid crystal display device was subjected to a long-term reliability test, no defects such as peeling of the seal portion were observed, and high reliability was obtained. The display of the liquid crystal display device was good.
[Comparative Example 1]
In the formation of the transparent protective film, a color filter and a liquid crystal display device were produced in the same manner as in Example 1 except that vacuum drying was not performed.

It was 6.5 MPa when the adhesion strength in the seal part of the obtained color filter was measured. Further, when the obtained liquid crystal display device was subjected to a long-term reliability test, peeling was observed at the interface between the transparent protective layer and ITO in the seal portion. Further, display unevenness was observed in the liquid crystal display device due to surface irregularities caused by uneven drying of the transparent protective film on the surface of the color filter.
[Comparative Example 2]
In the formation of the transparent protective film, a color filter and a liquid crystal display device were produced in the same manner as in Example 1 except that vacuum drying was performed for 60 seconds while heating so that the substrate temperature was 75 ° C.

The adhesion strength at the seal portion of the obtained color filter was measured and found to be 8.9 MPa. Further, when the obtained liquid crystal display device was subjected to a long-term reliability test, peeling was observed in some places at the interface between the transparent protective layer and the ITO in the seal portion. The display of the liquid crystal display device was good.
[Comparative Example 3]
A color filter and a liquid crystal display device were produced in the same manner as in Example 1 except that in the formation of the transparent protective film, vacuum drying was performed for 60 seconds while heating so that the substrate temperature was 105 ° C.

  The adhesion strength at the seal portion of the obtained color filter was measured and found to be 12.9 MPa. Further, when the obtained liquid crystal display device was subjected to a long-term reliability test, no defects such as peeling of the seal portion were found. However, unevenness on the surface of the color filter due to bumping of the transparent resin material during vacuum drying caused display unevenness in the liquid crystal display device.

It is an example of the schematic cross section of the liquid crystal display device using the color filter in the Example of this invention. It is an example of the schematic cross section of the conventional common liquid crystal display device.

Explanation of symbols

10: Transparent substrate 11: Resin black matrix 12: Colored layer 13: Transparent protective film 14: Transparent conductive film 15: Alignment film 16: Transparent pixel electrode 18: Liquid crystal 19: Spacer 20: Sealant 101: Color filter 102: Wiring substrate

Claims (6)

In a method for manufacturing a color filter substrate used in a liquid crystal display device in which a color filter substrate and a counter substrate are bonded to each other via a liquid crystal and a sealing material is formed between both substrates, at least the sealing material of the color filter substrate is used. A resin black matrix is formed at the formation position, then a transparent resin material is applied to the entire surface of the color filter substrate, and then the transparent resin is cured by performing at least two stages of drying or baking, and further transparent conductive material is applied to the entire surface of the color filter. A method for producing a color filter substrate, comprising providing a film. 2. The method of manufacturing a color filter substrate according to claim 1, wherein in the at least two stages of drying or baking process, the first stage of drying or baking process is a vacuum drying process. The method for producing a color filter substrate according to claim 1 or 2, wherein, in the vacuum drying step, the temperature of the color filter substrate during vacuum drying is 80 ° C or higher. The method for producing a color filter according to claim 3, wherein in the vacuum drying step, the temperature of the color filter substrate during vacuum drying is 100 ° C. or less. A color filter substrate manufactured using the method for manufacturing a color filter substrate according to claim 1. A liquid crystal display device using the color filter substrate according to claim 5.

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