JP2008248044A5 - - Google Patents
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- Publication number
- JP2008248044A5 JP2008248044A5 JP2007090000A JP2007090000A JP2008248044A5 JP 2008248044 A5 JP2008248044 A5 JP 2008248044A5 JP 2007090000 A JP2007090000 A JP 2007090000A JP 2007090000 A JP2007090000 A JP 2007090000A JP 2008248044 A5 JP2008248044 A5 JP 2008248044A5
- Authority
- JP
- Japan
- Prior art keywords
- binder resin
- resin layer
- conductive adhesive
- anisotropic conductive
- particle movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 230000001070 adhesive Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 230000001105 regulatory Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000009940 knitting Methods 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 230000000717 retained Effects 0.000 description 1
Description
本発明の請求項1に記載の異方性導電接着材は、熱硬化性樹脂材料からなるバインダ樹脂層と、前記バインダ樹脂層中に分散保持された複数の導電性粒子と、前記バインダ樹脂層が軟化して流動性を示す温度に加熱されつつ加圧されることによる前記バインダ樹脂層の流動に伴う前記導電性粒子の移動を規制する粒子移動規制部材と、を有し、前記粒子移動規制部材は、前記バインダ樹脂層の前記熱硬化性樹脂材料が軟化して流動性を示す温度より高い温度で、且つ前記熱硬化性樹脂材料の硬化温度よりも低い温度の融点を有する材料で形成されることを特徴とするものである。 Anisotropic conductive adhesive according to claim 1 of the present invention, the binder resin layer made of a thermosetting resin material, a plurality of conductive particles dispersed retained in the binder resin layer, before Symbol binder resin A particle movement regulating member that regulates the movement of the conductive particles accompanying the flow of the binder resin layer by being pressurized while being heated to a temperature at which the layer softens and exhibits fluidity, and the particle movement The regulating member is formed of a material having a melting point that is higher than a temperature at which the thermosetting resin material of the binder resin layer softens and exhibits fluidity and lower than a curing temperature of the thermosetting resin material. It is characterized by that.
Claims (4)
前記バインダ樹脂層中に分散保持された複数の導電性粒子と、
前記バインダ樹脂層が軟化して流動性を示す温度に加熱されつつ加圧されることによる前記バインダ樹脂層の流動に伴う前記導電性粒子の移動を規制する粒子移動規制部材と、
を有し、
前記粒子移動規制部材は、前記バインダ樹脂層の前記熱硬化性樹脂材料が軟化して流動性を示す温度より高い温度で、且つ前記熱硬化性樹脂材料の硬化温度よりも低い温度の融点を有する材料で形成されることを特徴とする異方性導電接着材。 A binder resin layer made of a thermosetting resin material;
A plurality of conductive particles dispersed and held in the binder resin layer;
And particle movement restricting member for restricting the movement of the conductive particles with the flow of the binder resin layer due to the previous SL binder resin layer is pressurized while being heated to a temperature showing a fluidity softens,
Have
The particle movement regulating member has a melting point that is higher than a temperature at which the thermosetting resin material of the binder resin layer softens and exhibits fluidity and lower than a curing temperature of the thermosetting resin material. anisotropic conductive adhesive, characterized in that it is formed of a material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007090000A JP2008248044A (en) | 2007-03-30 | 2007-03-30 | Anisotropic electroconductive adhesive material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007090000A JP2008248044A (en) | 2007-03-30 | 2007-03-30 | Anisotropic electroconductive adhesive material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008248044A JP2008248044A (en) | 2008-10-16 |
JP2008248044A5 true JP2008248044A5 (en) | 2010-03-25 |
Family
ID=39973383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007090000A Pending JP2008248044A (en) | 2007-03-30 | 2007-03-30 | Anisotropic electroconductive adhesive material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008248044A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5974147B1 (en) | 2015-07-31 | 2016-08-23 | 株式会社フジクラ | Wiring assembly, structure with conductor layer, and touch sensor |
US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
-
2007
- 2007-03-30 JP JP2007090000A patent/JP2008248044A/en active Pending
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