JP2008248044A5 - - Google Patents

Download PDF

Info

Publication number
JP2008248044A5
JP2008248044A5 JP2007090000A JP2007090000A JP2008248044A5 JP 2008248044 A5 JP2008248044 A5 JP 2008248044A5 JP 2007090000 A JP2007090000 A JP 2007090000A JP 2007090000 A JP2007090000 A JP 2007090000A JP 2008248044 A5 JP2008248044 A5 JP 2008248044A5
Authority
JP
Japan
Prior art keywords
binder resin
resin layer
conductive adhesive
anisotropic conductive
particle movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007090000A
Other languages
Japanese (ja)
Other versions
JP2008248044A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007090000A priority Critical patent/JP2008248044A/en
Priority claimed from JP2007090000A external-priority patent/JP2008248044A/en
Publication of JP2008248044A publication Critical patent/JP2008248044A/en
Publication of JP2008248044A5 publication Critical patent/JP2008248044A5/ja
Pending legal-status Critical Current

Links

Description

本発明の請求項1に記載の異方性導電接着材は、熱硬化性樹脂材料からなるバインダ樹脂層と、前記バインダ樹脂層中に分散保持された複数の導電性粒子と、記バインダ樹脂層が軟化して流動性を示す温度に加熱されつつ加圧されることによる前記バインダ樹脂層の流動に伴う前記導電性粒子の移動を規制する粒子移動規制部材と、を有し、前記粒子移動規制部材は、前記バインダ樹脂層の前記熱硬化性樹脂材料が軟化して流動性を示す温度より高い温度で、且つ前記熱硬化性樹脂材料の硬化温度よりも低い温度の融点を有する材料で形成されることを特徴とするものである。 Anisotropic conductive adhesive according to claim 1 of the present invention, the binder resin layer made of a thermosetting resin material, a plurality of conductive particles dispersed retained in the binder resin layer, before Symbol binder resin A particle movement regulating member that regulates the movement of the conductive particles accompanying the flow of the binder resin layer by being pressurized while being heated to a temperature at which the layer softens and exhibits fluidity, and the particle movement The regulating member is formed of a material having a melting point that is higher than a temperature at which the thermosetting resin material of the binder resin layer softens and exhibits fluidity and lower than a curing temperature of the thermosetting resin material. It is characterized by that.

Claims (4)

熱硬化性樹脂材料からなるバインダ樹脂層と、
前記バインダ樹脂層中に分散保持された複数の導電性粒子と、
記バインダ樹脂層が軟化して流動性を示す温度に加熱されつつ加圧されることによる前記バインダ樹脂層の流動に伴う前記導電性粒子の移動を規制する粒子移動規制部材と
を有し、
前記粒子移動規制部材は、前記バインダ樹脂層の前記熱硬化性樹脂材料が軟化して流動性を示す温度より高い温度で、且つ前記熱硬化性樹脂材料の硬化温度よりも低い温度の融点を有する材料で形成されることを特徴とする異方性導電接着材。
A binder resin layer made of a thermosetting resin material;
A plurality of conductive particles dispersed and held in the binder resin layer;
And particle movement restricting member for restricting the movement of the conductive particles with the flow of the binder resin layer due to the previous SL binder resin layer is pressurized while being heated to a temperature showing a fluidity softens,
Have
The particle movement regulating member has a melting point that is higher than a temperature at which the thermosetting resin material of the binder resin layer softens and exhibits fluidity and lower than a curing temperature of the thermosetting resin material. anisotropic conductive adhesive, characterized in that it is formed of a material.
前記粒子移動規制部材は、熱可塑性樹脂材料からなる糸を編んで形成され、前記バインダ樹脂層に包含された網目クロス材であることを特徴とする請求項1に記載の異方性導電接着材。   2. The anisotropic conductive adhesive according to claim 1, wherein the particle movement regulating member is a mesh cloth material formed by knitting yarn made of a thermoplastic resin material and included in the binder resin layer. . 前記粒子移動規制部材は、前記導電性粒子を保持するバインダ樹脂層の一方の表面に重畳設置され、前記バインダ樹脂層に接する表面が断面が三角形をなす複数の突条を平行に並設してなる凹凸面に形成されている制動層であることを特徴とする請求項1に記載の異方性導電接着材。   The particle movement restricting member is arranged to overlap with one surface of the binder resin layer holding the conductive particles, and a plurality of protrusions having a triangular cross section in parallel with the surface in contact with the binder resin layer are arranged in parallel. The anisotropic conductive adhesive according to claim 1, wherein the anisotropic conductive adhesive is a braking layer formed on the uneven surface. 前記粒子移動規制部材は、前記導電性粒子を保持するバインダ樹脂層の一方の表面に重畳設置され、複数の穴が所定の配置で厚さ方向に穿設されている制動層であることを特徴とする請求項1に記載の異方性導電接着材。   The particle movement regulating member is a braking layer that is superimposed on one surface of a binder resin layer that holds the conductive particles, and a plurality of holes are formed in a predetermined arrangement in the thickness direction. The anisotropic conductive adhesive according to claim 1.
JP2007090000A 2007-03-30 2007-03-30 Anisotropic electroconductive adhesive material Pending JP2008248044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007090000A JP2008248044A (en) 2007-03-30 2007-03-30 Anisotropic electroconductive adhesive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007090000A JP2008248044A (en) 2007-03-30 2007-03-30 Anisotropic electroconductive adhesive material

Publications (2)

Publication Number Publication Date
JP2008248044A JP2008248044A (en) 2008-10-16
JP2008248044A5 true JP2008248044A5 (en) 2010-03-25

Family

ID=39973383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007090000A Pending JP2008248044A (en) 2007-03-30 2007-03-30 Anisotropic electroconductive adhesive material

Country Status (1)

Country Link
JP (1) JP2008248044A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5974147B1 (en) 2015-07-31 2016-08-23 株式会社フジクラ Wiring assembly, structure with conductor layer, and touch sensor
US10388627B1 (en) * 2018-07-23 2019-08-20 Mikro Mesa Technology Co., Ltd. Micro-bonding structure and method of forming the same

Similar Documents

Publication Publication Date Title
JP2013516328A5 (en)
JP2014528983A5 (en)
JP2016078451A5 (en)
JP5503644B2 (en) Electronic fabric
JP2013515379A5 (en)
JP2017501904A5 (en)
JP2016078452A5 (en)
JP2009502540A5 (en)
JP2012516247A5 (en)
JP2015110791A5 (en)
JP2009502499A5 (en)
JP2010537275A5 (en)
JP2012514546A5 (en)
JP2009541033A5 (en)
JP2009518209A5 (en)
JP2013516768A5 (en)
JP2008248044A5 (en)
JP2015502988A5 (en)
WO2012131289A3 (en) Pressure sensitive polymer composite material adapted for touch screen
JP2016183328A5 (en)
US20160102748A1 (en) Rack and rack manufacturing method
JP2020519500A5 (en)
JP2012082394A5 (en)
JP2013118180A5 (en)
JP5920971B2 (en) Method for forming a material having nanoparticles