JP2008246556A - Energy measuring method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce measuring time in energy measurement required for compensating energy fluctuation and to improve productivity, in a device using an energy source in which energy fluctuates with lapse of time. <P>SOLUTION: This is an energy measuring method applicable to energy compensation of a device (1) having an energy source (31) in which energy fluctuates with lapse of time. Energy values (E1-E5) from the energy source (31) which are preliminarily measured at a plurality of positions (X1-X5) are obtained as an energy table (T). Then, on the basis of an energy value (E1') measured after the lapse of time at a reference position (X1) among the plurality of positions (X1-X5) and on the basis of data in the energy table (T), an estimate is made on energy values (E2'-E5') after the lapse of time in positions (X2-X5) other than the reference positions (X1) among the plurality of positions (X1-X5), which is the characteristic of this method. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an energy measuring method and an energy measuring device. More particularly, the present invention relates to an energy measuring method and apparatus applied to energy correction of an apparatus having an energy source whose energy varies with time.

An inner glass marking (hereinafter simply referred to as IGM) apparatus is a processing apparatus configured to form markings such as letters and symbols inside a glass substrate (see, for example, Patent Document 1), and a pulsed laser beam. A laser light source that emits light, a substrate holding stage for placing and holding a glass substrate to be marked, and a laser beam emitted from the laser light source is converged inside the glass substrate and scanned by a scanning signal corresponding to the marking The processing head is configured, and driving means for relatively driving the substrate holding stage and the processing head are provided. In such an IGM apparatus, it is possible to mark a plurality of processing positions by changing the relative positions of the substrate holding stage and the processing head by the driving means.
JP 2001-276985 A

  By the way, in the IGM apparatus, with the movement of the machining head (X direction in FIG. 1), the optical axis shift and the beam diameter change, or the optical path length of the laser beam emitted from the laser light source changes. Therefore, even when the energy of the laser light source is constant, the energy at each processing position may vary. Furthermore, energy fluctuations over time of the laser light source are inevitable. As the energy intensity varies in this way, there may be inconveniences such as the marking not being fixed depending on the processing position or the processing date and time.

  Therefore, in the IGM apparatus, in order to eliminate the above inconveniences, correction of energy fluctuation of the laser beam at each processing position is performed.

  However, in the conventional method, such energy fluctuation correction is performed based on the energy values measured at all the processing positions (X1 to X5 in FIG. 1) of the energy of the laser beam irradiated from the processing head. It was. For this reason, there was a problem that the time spent for the measurement was long. Considering that it is necessary to stop the machining head at each machining position when measuring energy, the measurement time becomes very long as the machining position increases, and the productivity becomes low.

  The present invention has been made in view of the above-mentioned problems. In an apparatus using an energy source whose energy varies with time, the measurement time of energy measurement necessary for correcting the energy variation is shortened, and productivity is improved. An object of the present invention is to provide an energy measuring method and an energy measuring apparatus that can lead to improvement.

  In order to achieve the above object, an energy measurement method according to the present invention is an energy measurement method applied to energy correction of an apparatus (1) including an energy source (31) whose energy varies over time, Energy values (E1 to E5) from the energy source (31) measured in advance at a plurality of positions (X1 to X5) are acquired as an energy table (T), and a reference position (X1) among the plurality of positions (X1 to X5). ), And the energy value after the elapse of time at the non-reference position (X2 to X5) among the plurality of positions (X1 to X5) based on the energy value (E1 ′) actually measured after elapse of time and the data in the energy table (T). (E2 ′ to E5 ′) are predicted.

  Further, another energy measuring method according to the present invention is an energy measuring method applied to energy correction of a processing apparatus (1) provided with an energy source (31) whose energy varies with time. (1) is an energy source (31) that emits an energy medium (L) and an energy medium (31) that can be selectively moved and arranged at a plurality of processing positions (X1 to X5) and that is emitted from the energy source (31) ( L) energy that can measure the energy values (E1 to E5) of the processing head (5) that can be irradiated and the energy medium (L) that the processing head (5) has irradiated at each processing position (X1 to X5). A monitor (6), an energy source (31), a processing head (5), and a control computer (7) for controlling the energy monitor (6). A step (100) of acquiring energy values (E1 to E5) emitted at a number of machining positions (X1 to X5) as an energy table (T) in advance, and a reference position (of a plurality of machining positions (X1 to X5) after time) A step (210) of disposing the machining head (5) at X1) and an energy value (E1 ′) of the energy medium (L) emitted from the machining head (5) arranged at the reference position (X1) as an energy monitor (6) ), The energy value (E1 ′) measured at the reference position (X1), and the data in the energy table (T), the non-processing position (X1 to X5) And (240) predicting energy values (E2 ′ to E5 ′) irradiated from the machining head (5) at the reference positions (X2 to X5). The features.

  Moreover, the energy measuring device according to the present invention is an energy measuring device applied to energy correction of a device including an energy source (31) whose energy varies with time, and a plurality of positions by the energy source (31). The energy values (E1 to E5) from the energy monitor (6) for measuring the energy values (E1 to E5) at (X1 to X5) and the energy source (31) measured in advance at a plurality of positions (X1 to X5). E5) has an energy table (T) acquired, and the energy value (E1 ′) actually measured by the energy monitor (6) after a lapse of time at the reference position (X1) among the plurality of positions (X1 to X5) and the energy table ( Based on the data at T), the energy value (E) after time at the non-reference position (X2 to X5) among the plurality of positions (X1 to X5). '~E5'), characterized in that it comprises a prediction means for predicting (7).

  Another energy measuring device according to the present invention is an energy measuring device applied to energy correction of a processing device (1) provided with an energy source (31) whose energy fluctuates with time. L) and an energy source (31) that emits the energy medium (L) emitted from the energy source (31) can be selectively moved and arranged at a plurality of processing positions (X1 to X5). A processing head (5), an energy monitor (6) capable of measuring energy values (E1 to E5) of an energy medium (L) irradiated by the processing head (5) at each processing position (X1 to X5), and before aging Energy values (E1 to E5) emitted by the machining head (5) at a plurality of machining positions (X1 to X5) in advance as an energy table (T), and a plurality of machining positions ( 1 to X5) based on the energy value (E1 ′) measured by the energy monitor (6) from the machining head (5) disposed at the reference position (X1) and the data in the energy table (T). Control computer (7) configured to predict energy values (E2 ′ to E5 ′) irradiated from the machining head (5) at non-reference positions (X2 to X5) among the machining positions (X1 to X5) of It is characterized by having.

  In the present invention, energy correction is also included in energy measurement. In addition, the reference numerals in parentheses attached to each component in this column (the column for means for solving the problem) indicate the correspondence with the specific unit described in the embodiments described later.

  According to the present invention, in an apparatus using an energy source whose energy fluctuates with time, it is possible to shorten the measurement time of energy measurement necessary for correcting the energy fluctuation, and as a result, it leads to improvement of productivity. Can do. In the present invention, energy at all machining positions is measured in advance to obtain an energy table, and when correcting energy fluctuations over time, only the minimum necessary machining position is measured, and the energy at other machining positions is Since the prediction is made from the measured value and the energy table obtained in advance, the measurement time is shortened. If there are N machining positions and one machining position (reference position) is measured, the measurement time is simply 1 / N. This effect is greater as the machining position is increased. Shortening measurement time leads to improved productivity.

  FIG. 1 is a diagram showing a schematic configuration of an IGM device 1 to which an energy measuring device according to the present invention is applied, and FIG. 2 is a view taken along the line I-I in FIG. As shown in FIGS. 1 and 2, the IGM apparatus 1 includes a substrate holding stage 2, a light source unit 3, an optical system 4, a processing head 5, a power monitor 6, a control computer 7, and the like. 1 and 3, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal plane is the XY plane, and the vertical direction is the Z direction.

  The substrate holding stage 2 has a holding surface 2a capable of holding the glass substrate K to be marked by vacuum suction, and can be moved and stopped at any position in the Y direction by the stage driving device 21. The stage driving device 21 is composed of, for example, a ball screw and a servo motor that rotationally drives the ball screw.

  The light source unit 3 includes a laser oscillator 31 and a power adjuster 32. As the laser oscillator 31, for example, a green laser or a UV laser can be used. The power adjuster 32 is configured to be able to adjust the energy value based on a signal from the control computer 7.

  The optical system 4 includes a pair of mirrors 41 that guide the laser beam L emitted from the laser oscillator 31 to the machining head 5.

  The processing head 5 is configured to focus the laser beam L guided from the optical system 4 inside the glass substrate K placed and held on the substrate holding stage 2 and to scan with a scanning signal corresponding to the marking, Although not shown, a shutter, a mirror, a galvanometer mirror, an fθ lens, and the like are provided inside. The machining head 5 can be moved and stopped at machining positions X1 to X5 along the X direction by the head driving device 51. The head driving device 51 includes, for example, a ball screw and a servo motor that rotationally drives the ball screw.

  The power monitor 6 is provided below the side surface of the substrate holding stage 2, and the light receiving surface 6 a is directed upward, which is the arrival direction of the laser beam L. The power monitor 6 can be moved and stopped to an arbitrary position in the X direction by the monitor driving device 61. The monitor driving device 61 includes, for example, a ball screw and a servo motor that rotationally drives the ball screw.

  The control computer 7 includes an input / output device such as a touch panel, appropriate hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a computer program for operating the hardware, and data communication with each component. The IGM device 1 is configured to send a command signal for performing a series of marking operations to each component. A part of the series of marking operations may be performed by a PLC (programmable logic controller).

  Next, the operation of the IGM apparatus 1 will be described with reference to FIGS. The initial state of the IGM device 1 is as follows. That is, the power is turned on, the laser transmitter 31 is turned on, and the glass substrate K to be marked is placed and held on the holding surface 2 a of the substrate holding stage 2. As shown in FIG. 2, the glass substrate K has a total of 25 planned marking positions P11 to P55.

  FIG. 3 is a flowchart showing an outline of a series of operations of the IGM apparatus 1. As shown in FIG. 3, the operation of the IGM apparatus 1 is roughly divided into an energy table acquisition process [Step 100], a time-dependent correction process [Step 200], and a marking process [Step 300].

  FIG. 4 is a flowchart showing the operation of the energy table acquisition processing, FIG. 5 is a diagram for explaining a procedure for creating various data in the energy table T, FIG. 6 is a diagram showing the energy table T, and FIG. FIG. 8 is a diagram for explaining various data used for the temporal correction processing, FIG. 9 is a diagram for explaining the fluctuation of energy of the laser oscillator 31 over time, and FIG. 10 shows the marking processing operation. It is a flowchart.

  The user inputs an operation start command from the input / output device in the control computer 7. Thereby, as shown in FIG. 4, first, an energy table acquisition process [step 100] is started. That is, the machining head 5 is driven to the machining position X1 by the head driving device 51. The power monitor 6 is driven directly below the machining position X1 by the monitor driving device 61 [Step 110]. In this state, the machining head 5 emits a laser beam L toward the power monitor 6 by opening an internal shutter. The power monitor 6 receives the laser beam L, measures its energy value, and sends the measurement result to the control computer 7. The control computer 7 stores the energy value sent from the power monitor 6 [step 120].

  When the energy measurement at the machining position X1 is completed, the machining head 5 is driven to the machining position X2 by the head driving device 51. The power monitor 6 is driven directly below the machining position X2 by the monitor driving device 61 in synchronization with the machining head 5 [Step 110]. Then, the energy measurement at the machining position X2 is performed in the same manner as the energy measurement at the machining position X1 [step 120]. Thereafter, energy measurement is similarly performed on the machining positions X3 to X5.

  When the energy measurement from the machining position X1 to the machining position X5 is completed [Yes in Step 130], the control computer 7 stores the energy value of the laser beam L measured at each machining position X1 to X5 [ See FIG. 5A]. Here, the energy values of the laser beam L obtained at the processing positions X1, X2, X3, X4, and X5 are defined as E1, E2, E3, E4, and E5, respectively.

  The control computer 7 calculates the following offset amount based on the energy values E1 to E5. That is, with the machining position X1 as a reference position, the difference between the energy value E1 measured at the machining position X1 and the energy values E2, E3, E4, E5 measured at the other machining positions X2, X3, X4, and X5 is offset. It calculates as quantity (beta) 2, (beta) 3, (beta) 4, (beta) 5 [refer FIG.5 (B)].

  Further, the control computer 7 determines the energy correction amount γ1 before aging for each of the machining positions X1, X2, X3, X4, and X5 based on the energy values E1, E2, E3, E4, and E5 and the energy target value E0. , Γ2, γ3, γ4, γ5. The energy target value E0 is an energy value of the laser beam L that is appropriate for the marking operation by the IGM apparatus 1, and this value is the same value at all the planned marking positions P11 to P55. The energy correction amounts γ1 to γ5 before aging are γ1 = (E1-E0), γ2 = (E2-E0), γ3 = (E3-E0), γ4 = (E4-E0), and γ5 = (E5- E0) (see FIG. 5C). Each data calculated as described above is stored as an energy table T shown in FIG. 6 [step 140]. In this example, the energy target value E0 is the same value at each of the machining positions X1 to X5, but may be a different value depending on the machining variation of the workpiece and the machining purpose.

  Subsequently, as shown in FIG. 7, the time correction process [step 200] starts. The time correction process is a process for correcting the output fluctuation of the laser oscillator 31 over time, and is applied after a predetermined time has passed since the laser oscillator 31 was turned on. The machining head 5 is driven to the machining position X1, which is the reference position, by the head driving device 51 [Step 210]. The power monitor 6 is driven directly below the machining position X1 by the monitor driving device 61. In this state, the machining head 5 emits a laser beam L toward the power monitor 6 by opening an internal shutter. The power monitor 6 receives the laser beam L, measures its energy value, and sends the measurement result to the control computer 7. The control computer 7 stores the energy value sent from the power monitor 6 [step 220]. Here, the energy value of the laser beam L obtained at the processing position (reference position) X1 is defined as E1 '[see FIG. 8A]. FIG. 8A shows a state in which the energy of the laser oscillator 31 decreases with time.

  The control computer 7 calculates a difference (E1′−E1) between the energy value E1 stored in the energy table T and the energy value E1 ′ acquired in step 220 as a temporal variation amount α [step 230]. Each machining position is subtracted from the energy values E2, E3, E4, and E5 before the aging at the machining positions X2, X3, X4, and X5 excluding the reference position X1, with the machining position X1 as a reference position. An energy value after time at positions X2, X3, X4, and X5 is predicted [step 240].

  As shown in FIG. 8B, the estimated energy values after the lapse of time at the machining positions X2, X3, X4, and X5 are (E2-α), (E3-α), (E4-α), ( E5-α). Here, the energy values at the machining positions X2, X3, X4, and X5 are all calculated by subtraction of the time variation α, but the ratio of the time variation α to the energy value E1 depends on the change mechanism of the system with time. It is also conceivable to use (α / E1 × 100 = δ%) and add to the energy value at each machining position, for example, (E2 + δ × E2 / 100). In other words, any calculation method may be used as long as the mechanism of the system change with time can be expressed by a relational expression.

Specifically, the correction amount after the lapse of time has the following value as shown in FIG.
The correction amount after the lapse of time at the processing position X1 is γ1-α.
The correction amount after the elapse of time at the machining position X2 is γ2-α = γ1-β2-α.
The correction amount after the elapse of time at the machining position X3 is γ3-α = γ1-β3-α.
The correction amount after the lapse of time at the processing position X4 is γ4-α = γ1-β4-α.
The correction amount after the lapse of time at the processing position X5 is γ5-α = γ1-β5-α.

  As described above, the energy values at the machining positions X2 to X5 excluding the reference position X1 are not actually measured by the power monitor 6, but the temporal variation amount α, the offset amounts β2 to β5, and the energy correction amount before the temporal time. Predict based on γ1. Each of these data is stored in the energy table T. Therefore, the time spent for the measurement is saved, and as a result, the productivity of the IGM apparatus 1 can be improved.

  The reason why the energy values at the machining positions X2 to X5 excluding the reference position X1 can be predicted based on the data stored in the energy table T is as follows. That is, as shown in FIG. 9A, when the energy of the laser oscillator 31 varies with time, the energy at each processing position X2 to X5 except the reference position X1 also varies by the same amount as the energy at the reference position X1. Because it does. Specifically, as shown in FIG. 9B, in the energy fluctuation with time at each machining position X2 to X5, the energy at time a and the amount of time variation α of energy at time b are each machining position. This is because X2 to X5 are the same. In FIG. 9B, the energy values at the machining positions X1 to X5 at time a are shown in the upper broken line graph of FIG. 8B, and the machining positions X1 to X1 at time b. The energy value at X5 is shown in the lower solid line graph of FIG.

  When the time correction process is completed, the marking process [step 300] starts as shown in FIG. This marking process is a process for marking each of the planned marking positions P11 to P55 on the glass substrate K during a period in which the energy fluctuation is considered to have increased since the laser oscillator 31 was turned on.

  Due to the relative movement between the substrate holding stage 2 and the processing head 5, the processing head 5 is arranged directly above the planned marking position P11 [step 310]. At this time, the machining head 5 is at the machining position X1. The control computer 7 sends the energy correction amount (γ1-α) obtained in the temporal correction process [step 200] to the power adjuster 32 [step 320]. Thereby, the laser beam L emitted from the laser oscillator 31 is controlled so as to be the energy target value E0. The processing head 5 scans the pulsed laser beam L focused inside the glass substrate K by driving a galvanometer mirror with a scanning signal corresponding to the marking. As a result, markings such as characters and symbols are formed inside the glass substrate K corresponding to the planned marking position P11 [step 330].

  When the marking for the planned marking position P11 is finished, the processing head 5 is disposed immediately above the planned marking position P21 by the relative movement of the substrate holding stage 2 and the processing head 5 [Step 310]. At this time, the machining head 5 is at the machining position X2. The control computer 7 sends the energy correction amount ([gamma] 2- [alpha] = [gamma] 1- [beta] 2- [alpha]) obtained in the time correction process of step 200 to the power adjuster 32 [step 320]. Thereby, the laser beam L emitted from the laser oscillator 31 is controlled so as to be the energy target value E0. The processing head 5 scans the pulsed laser beam L focused inside the glass substrate K by driving a galvanometer mirror with a scanning signal corresponding to the marking. As a result, markings such as characters and symbols are formed inside the glass substrate K corresponding to the planned marking position P21 [step 330].

  Thereafter, in the same manner, as shown by an arrow D in FIG. 2, for example, markings are formed in the order of marking positions P31, P41, P51, P52, P42, P32,. Step 330].

  The glass substrate K for which marking has been completed at all the planned marking positions P11 to P55 is carried out to a subsequent process by a carry-out mechanism such as a robot hand. Then, the next new glass substrate K is placed and held on the substrate holding stage 2, and marking is formed by the operation procedure from Step 310 to Step 330.

  As mentioned above, although embodiment of this invention was described, embodiment disclosed above is an illustration to the last, Comprising: The scope of the present invention is not limited to this embodiment. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, in the above-described embodiment, the number of measurement points is 5, but may be 2 or more, 4 or less, or 6 or more. The present invention can be applied to all devices that require energy correction, such as marking devices other than the IGM device, exposure devices, drilling devices, and other processing devices, inspection devices that require an energy source, and illumination devices.

  FIG. 11 shows measured data corresponding to FIGS. 8C and 9B. In this embodiment, the number of machining positions is 16 in total. FIG. 11A shows actual measurement data corresponding to FIG. In FIG. 11A, a graph G1 indicates the energy value at each machining position before correction. Graph G2 shows the energy value (energy target value) after correction accompanying energy fluctuation with time at each machining position. That is, a state in which correction is performed so that the energy value at each machining position becomes the same set value is shown. FIG. 11B shows actual measurement data corresponding to FIG. When the variation with time of the correction amount at each machining position was measured, as shown in FIG. 11B, the absolute value of the correction amount at each machining position was different, but the variation range of the correction amount was almost the same. Become.

It is a figure which shows the structure outline | summary of the IGM apparatus to which the energy measuring device which concerns on this invention is applied. It is the II arrow directional view of FIG. It is a flowchart which shows the outline | summary of a series of operation | movement of an IGM apparatus. It is a flowchart which shows operation | movement of an energy table acquisition process. It is a figure for demonstrating the creation procedure of various data in an energy table. It is a figure which shows an energy table. It is a flowchart which shows operation | movement of a time-dependent correction process. It is a figure for demonstrating the various data used for a time-dependent correction process. It is a figure for demonstrating the fluctuation | variation of the energy of a laser oscillator with time. It is a flowchart which shows operation | movement of a marking process. This is actual measurement data corresponding to FIGS. 8C and 9B.

Explanation of symbols

1 IGM equipment (apparatus, processing equipment)
5 Processing head 6 Power monitor (energy monitor)
7 Control computer (prediction means)
31 Laser transmitter (energy source)
32 Power regulator (output control device)
51 Head drive device (propagation length adjustment mechanism)
100 steps 220 steps 240 steps E1 to E5 energy values E1 ′ to E5 ′ energy values K glass substrate (work material)
L Laser beam (energy medium)
X1 Machining position (reference position, position)
X2 to X5 machining position (non-reference position, position)
T energy table

Claims (16)

An energy measurement method applied to energy correction of an apparatus having an energy source whose energy varies with time,
Obtain energy values from energy sources measured in advance at multiple locations as an energy table,
An energy measurement method for predicting an energy value after elapse at a non-reference position among a plurality of positions based on an energy value measured after elapse at a reference position among a plurality of positions and data in an energy table. .   The energy measurement method according to claim 1, wherein energy control is performed so that an energy value at the non-reference position becomes the predicted energy value.   The energy measurement method according to claim 2, wherein the energy control is performed by controlling an output of an energy source.   The apparatus including the energy source further includes an irradiation head that can irradiate an energy medium emitted from the energy source, and a propagation length adjustment mechanism that makes the propagation length of the energy medium from the energy source to the irradiation head variable. The energy measuring method according to any one of claims 1 to 3.   The energy measuring method according to any one of claims 1 to 4, wherein the energy medium emitted from the energy source is a laser beam.   The energy measurement method according to claim 5, wherein the propagation length of the energy medium is an optical path length of a laser beam.   The energy measuring method according to any one of claims 1 to 6, wherein the apparatus including the energy source is a processing apparatus configured to perform a predetermined processing operation on a workpiece. An energy measuring device applied to energy correction of a device having an energy source whose energy varies with time,
An energy monitor for measuring energy values at multiple locations by an energy source;
It has an energy table that has acquired energy values from energy sources measured in advance at multiple positions, and based on the energy values measured by the energy monitor after the passage of time at the reference position and the data in the energy table. A prediction means for predicting an energy value after time at a non-reference position among the positions of
An energy measuring device comprising:   The energy measuring device according to claim 8, further comprising energy control means for performing energy control so that an energy value at the non-reference position becomes the predicted energy value.   The energy measuring device according to claim 9, wherein the energy control is performed by an output control device that controls an output of an energy source.   The apparatus including the energy source further includes an irradiation head that can irradiate an energy medium emitted from the energy source, and a propagation length adjustment mechanism that makes the propagation length of the energy medium from the energy source to the irradiation head variable. The energy measuring device according to any one of claims 8 to 10.   The energy measuring device according to any one of claims 8 to 11, wherein the energy medium emitted from the energy source is a laser beam.   The energy measuring device according to claim 12, wherein the propagation length of the energy medium is an optical path length of a laser beam.   The energy measuring device according to any one of claims 8 to 13, wherein the device including the energy source is a processing device configured to perform a predetermined processing operation on a workpiece. An energy measurement method applied to energy correction of a processing apparatus having an energy source whose energy varies with time,
The machining apparatus includes an energy source that emits an energy medium, a machining head that can be selectively moved to a plurality of machining positions and can be irradiated with the energy medium emitted from the energy source, and the machining head that performs each machining. An energy monitor capable of measuring the energy value of the energy medium irradiated at the position, and a control computer for controlling the energy source, the machining head, and the energy monitor;
Acquiring in advance as energy table energy values emitted by a machining head at a plurality of machining positions before time;
A step of arranging a machining head at a reference position among a plurality of machining positions after time;
Measuring an energy value of an energy medium emitted from a machining head disposed at a reference position by an energy monitor;
Predicting an energy value irradiated from the machining head at a non-reference position among a plurality of machining positions based on the energy value measured at the reference position and the data in the energy table. Method. An energy measuring device applied to energy correction of a processing device having an energy source whose energy varies with time,
An energy source that emits an energy medium;
A machining head that can be selectively moved and arranged at a plurality of machining positions and that can be irradiated with an energy medium emitted from an energy source;
An energy monitor capable of measuring the energy value of the energy medium irradiated by the processing head at each processing position;
The energy value generated by the machining head at a plurality of machining positions before the passage of time is stored in advance as an energy table, and the energy value measured by the energy monitor from the machining head disposed at the reference position among the plurality of machining positions after the passage of time and the energy table And a control computer configured to predict an energy value irradiated from the machining head at a non-reference position among a plurality of machining positions based on the data.

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