JP2008244172A - Divided substrate and manufacturing method thereof, and infrared detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable high-density design, where a circuit component buried in a resin substrate is arranged near a three-dimensional shape section, and to prevent wrinkles from occurring in a metal layer. <P>SOLUTION: In a preforming process, a press mold 4 is used to form one portion of a metal sheet 69 becoming the foundation of the metal layer 68 in a shape corresponding to the three-dimensional shape section. In a lamination process, a resin substrate 67 and the metal sheet 69 preformed by a forming process are laminated onto a main substrate 66 to which the circuit component 8 is mounted to form a laminated substrate 60. In a press process, presswork is performed by allowing the press mold 4 to come into contact with a surface at the side of the metal sheet 69 of the laminated substrate 60, thus forming the three-dimensional shape section 6a at the forming section 4a, and burying the circuit component 8 in the resin substrate 67. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an individual substrate manufacturing method, an individual substrate, and an infrared detector.

  Conventionally, as an individual substrate 6 on which mounting components such as semiconductor elements are mounted, a resin substrate (for example, an epoxy resin substrate) 67 on one surface (upper surface of FIG. 8C) as shown in FIG. 8C. Is a three-dimensional structure in which a metal layer 68 (for example, constituting a circuit pattern 68a) is formed on one surface of the resin substrate 67 opposite to the main substrate 66, and a concave portion is formed on the one surface side. The thing in which the shape part 6a was formed is provided. In the individual substrate 6 of FIG. 8C, the circuit component 8 is mounted on one surface of the main substrate 66 on the resin substrate 67 side, and the circuit component 8 is three-dimensionally formed in the thickness direction of the main substrate 66 of the resin substrate 67. It is embedded in the portion that does not overlap the portion 6a.

  As a method for manufacturing this kind of individual substrate 6, a metal sheet (for example, a base substrate 66, a resin substrate 67, and a metal layer 68 on which a circuit component 8 is mounted on one surface side shown in FIG. , A copper foil) 69 and a lamination process for forming the laminated substrate 60, and as shown in FIG. 8B, the laminated substrate 60 (the main substrate 66, the resin substrate 67, and the metal sheet 69) is thermocompression-molded. There has been proposed a manufacturing method including a pressing step for molding the three-dimensionally shaped portion 6a. The circuit component 8 is embedded in the resin substrate 67 in the pressing process. Here, the press die 4 used in the pressing step has a molding portion 4a formed of a convex portion having a shape corresponding to the three-dimensional shape portion 6a of the individual substrate 6 at a contact portion with the laminated substrate 60. The three-dimensionally shaped portion 6a is formed on the laminated substrate 60 in the pressing process by the portion 4a. In this manufacturing method, the thermocompression molding of the laminated substrate 60, the molding of the three-dimensionally shaped portion 6a, and the embedding of the circuit component 8 in the resin substrate 67 can be simultaneously performed in the pressing process. The number of man-hours can be reduced as compared with the case where the molding of the three-dimensional shape portion 6a is performed in separate steps (see, for example, Patent Document 1). In the invention described in Patent Document 1, the circuit pattern 68a is formed by performing an etching process on the metal layer 68 (metal sheet 69) after the pressing step. However, the circuit pattern 68a is merely an example of the use of the metal layer 68 formed on the individual substrate 6, and for example, it has been proposed to use the metal layer 68 as an electromagnetic shield (see, for example, Patent Document 2).

  By the way, in the manufacturing method of the individual substrate 6 described above, it is general to form a plurality of individual substrates 6 at the same time in one press process (so-called multiple-cavity). For this reason, as shown in FIG. 9A, the laminated substrate 60 (the main substrate 66, the resin substrate 67, and the metal sheet 69) has a size that allows a plurality of individual substrates 6 to be taken, and is pressed. In the process, a press die 4 in which a plurality of molding parts 4 a are arranged is used, and a plurality of three-dimensionally shaped parts 6 a are molded simultaneously on one laminated substrate 60. And in the cutting process after a press process, the individual board | substrate 6 is cut out from the laminated substrate 60. FIG.

In addition, as an example of the individual substrate 6 manufactured by the above-described manufacturing method, a mounting region in which mounting components are mounted on one surface of the three-dimensional shape portion 6a is provided, and at least a part of the three-dimensional shape portion 6a is in the mounting region. In the formed structure, a gap is formed between the mounting component and the resin substrate 67 by the three-dimensionally shaped portion 6a, so that thermal insulation between the mounting component and the resin substrate 67 can be achieved. Therefore, when this single substrate 6 is used for, for example, an infrared detector that detects infrared rays, a pyroelectric element that converts a change in the amount of received infrared light into a voltage signal and outputs it as a mounting component mounted in the mounting region. It is conceivable to improve the sensitivity of the pyroelectric element by forming the three-dimensionally shaped portion 6a formed of a heat insulating recess at a position corresponding to the detection part of the pyroelectric element in the mounting region.
JP 2007-59844 (paragraph 0027-0031, FIG. 6) JP 2007-59846 A (paragraph 0012)

  By the way, in the manufacturing method of the individual substrate 6 described above, since the molding portion 4a of the press die 4 molds the three-dimensional shape portion 6a while stretching the metal sheet 69 in the pressing step, the front end surface of the molding portion 4a in the metal sheet 69 When the surrounding metal sheet 69 is pulled at the contact portion with the surface, a gap is created between a part of the metal sheet 69 and the surface of the molded part 4a as shown in FIG. However, it does not follow the shape of the molded part 4a, and the opening surface of the three-dimensionally shaped part 6a may become larger than the cross section of the base end part of the molded part 4a. As a result, when the circuit component 8 embedded in the resin substrate 67 and the three-dimensionally shaped portion 6a are arranged close to each other, the circuit component 8 and the metal layer 68 of the three-dimensionally shaped portion 6a contact each other as shown in FIG. There is a possibility that. Therefore, a high-density design in which the circuit component 8 embedded in the resin substrate 67 and the three-dimensionally shaped portion 6a are arranged close to each other is not possible. Further, a wrinkle is generated in a portion of the metal sheet 69 that creates a gap with the molding portion 4a, and may cause disconnection when the circuit pattern 68a is formed by patterning the metal layer 68 after the pressing process, for example. is there.

  The present invention has been made in view of the above-described reasons, and it is possible to design a high density such that circuit components embedded in a resin substrate and a three-dimensionally shaped portion are arranged close to each other, and the metal layer is wrinkled. It is an object of the present invention to provide a method for manufacturing an individual substrate, an individual substrate, and an infrared detector capable of improving sensitivity and improving reliability.

  The invention of claim 1 has a main substrate in which a resin substrate is laminated on one surface, a metal layer is formed on one surface opposite to the main substrate in the resin substrate, and a three-dimensionally shaped portion including a concave portion on the one surface side. A method of manufacturing an individual substrate in which a circuit component mounted on a main substrate is embedded in a portion of the resin substrate that does not overlap with the three-dimensionally shaped portion in the thickness direction of the main substrate. A lamination step of forming a laminated substrate by laminating a resin substrate and a metal sheet serving as a basis for the metal layer on the main substrate, and a molding portion including a convex portion having a shape corresponding to the three-dimensional shape portion of the individual substrate The pressing mold is brought into contact with the surface of the laminated substrate on the metal sheet side to perform press processing, thereby forming a three-dimensional shape portion at a molding portion and embedding a circuit component in a resin substrate, and laminating Before the process, It characterized by having a pre-forming step of molding a portion of the genera sheet in a shape corresponding to the three-dimensional shape portion.

  According to the present invention, since there is a pre-forming step for forming a part of the metal sheet into a shape corresponding to the three-dimensional shape portion before the laminating step, contact with the tip surface of the forming portion in the metal sheet in the pressing step The surrounding metal sheet is not pulled at the site, and a gap is created between a part of the metal sheet and the surface of the molded part, and the opening surface of the three-dimensionally shaped part is larger than the cross section of the base end part of the molded part It will never be. Therefore, it is possible to mold a three-dimensional shape portion that follows the shape of the molding portion, and it is possible to avoid contact between the circuit component adjacent to the three-dimensional shape portion and the metal layer of the three-dimensional shape portion. Thus, a high-density design is possible in which the circuit components and the three-dimensionally shaped portion are arranged close to each other. Further, since no gap is generated between the metal sheet and the molded part, the metal layer is not wrinkled.

  According to a second aspect of the present invention, in the first aspect of the invention, the pre-forming step uses the same press die as the press step, and the metal sheet is removed from the press die after the pre-forming step. And performing the pressing step.

  According to the present invention, since the metal sheet is not spring-backed by removing the metal sheet from the press mold from the pre-forming process to the pressing process, the pressing process while maintaining the shape of the metal sheet molded in the pre-forming process. As a result, the accuracy of the three-dimensional shape portion molded in the pressing process is improved, and it is possible to reliably avoid contact between the circuit component adjacent to the three-dimensional shape portion and the metal layer of the three-dimensional shape portion. it can.

  The invention of claim 3 is characterized in that, in the invention of claim 1 or 2, it has an annealing step of softening the metal sheet by annealing before the preforming step.

  According to the present invention, since the metal sheet is softened before the pre-forming step, the metal sheet is easily stretched in the pre-forming step, and when forming into a shape corresponding to the three-dimensional shape portion while stretching a part of the metal sheet. The metal sheet is difficult to tear.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the press die includes a front end surface that first contacts the laminated substrate in the pressing step in the molding portion and the front end surface. The corner between the side surfaces adjacent to each other is formed in a round shape.

  According to the present invention, compared to the case where the corner portion between the tip surface of the molded portion that first contacts the laminated substrate and the side surface adjacent to the tip surface is sharp, the corner portion in the multilayer substrate is abutted. Since stress concentration is less likely to occur at the contact area, the metal sheet is less likely to be broken during the pressing process.

  The invention of claim 5 is an individual substrate manufactured by the method for manufacturing an individual substrate according to any one of claims 1 to 4, wherein the component is mounted on one surface of the three-dimensionally shaped portion side. The three-dimensionally shaped portion is formed of a recess that forms a thermal insulation gap between the mounting component and the resin substrate by forming at least a part in the mounting region. Features.

  According to the present invention, contact between the circuit component adjacent to the three-dimensional shape portion and the metal layer of the three-dimensional shape portion can be avoided, so that heat insulation between the mounting component and the resin substrate is taken by the three-dimensional shape portion. In addition, a high-density design is possible in which the circuit component and the three-dimensionally shaped portion are arranged close to each other.

  A sixth aspect of the invention includes the individual substrate according to the fifth aspect of the invention and a pyroelectric element mounted on the mounting area as the mounting component, and the three-dimensional shape portion detects the pyroelectric element in the mounting area. It is formed in the position corresponding to a part.

  According to this invention, since the thermal insulation between the detection part of the pyroelectric element and the resin substrate can be taken, the sensitivity of the pyroelectric element is increased. In addition, since contact between the circuit component adjacent to the three-dimensional shape portion and the metal layer of the three-dimensional shape portion can be avoided, for example, when a circuit pattern is formed by patterning the metal layer, a short circuit between the circuit pattern and the circuit component is prevented. And improve the reliability.

  Since the invention of claim 1 has a preforming step of molding a part of the metal sheet into a shape corresponding to the three-dimensional shape portion before the laminating step, the circuit component embedded in the resin substrate and the three-dimensional shape portion are provided. A high density design is possible such that the metal layers are arranged close to each other, and there is an effect that the metal layer is not wrinkled.

  The invention of claim 6 has the effect of improving the sensitivity and reliability of the pyroelectric element.

  In each of the following embodiments, a method for manufacturing an individual substrate used for an infrared detector that detects infrared rays is illustrated, but the method for manufacturing an individual substrate of the present invention is not limited to an individual substrate used for an infrared detector, A main substrate having a resin substrate laminated on one surface, a metal layer is formed on one surface of the resin substrate opposite to the main substrate, and a three-dimensionally shaped portion including a recess is formed on the one surface side. Can be used as a method for manufacturing various individual substrates having a structure in which the circuit component mounted on the resin substrate is embedded in a portion of the resin substrate that does not overlap with the three-dimensionally shaped portion in the thickness direction of the main substrate.

(Embodiment 1)
Hereinafter, the configuration of the infrared detector exemplified in this embodiment will be described with reference to FIGS.

  The infrared detector according to the present embodiment includes a circuit block 10 on which a pyroelectric element 1 that outputs a change in the amount of received infrared light as a voltage signal is mounted on an individual substrate 6, and a package 2 that houses the circuit block 10. Yes. The circuit block 10 is formed with a signal processing circuit that processes at least the output of the pyroelectric element 1.

  The package 2 has a stem 21 made of a metal and formed in a disc shape, and a cap 22 made of a metal and formed in a bottomed cylindrical shape with an open rear surface. The rear surface of the cap 22 is a stem. 21 is assembled into a closed shape. The circuit block 10 is mounted on the stem 21 via a spacer 7 made of an insulating material, and the cap 22 is fixed to the stem 21 so as to form a space for housing the circuit block 10 between the stem 21. Here, a plurality (three in this case) of terminal pins 25 that are electrically connected to the circuit block 10 are inserted into the stem 21 so that electrical connection to the circuit block 10 can be made from the external space of the package 2. It is as. The spacer 7, the circuit block 10, and the stem 21 are fixed by an adhesive.

  A rectangular (here, square) window portion 2 a is formed on the front wall of the cap 22 located in front of the pyroelectric element 1, and infrared rays are collected on the light receiving surface (front surface) of the pyroelectric element 1. An infrared lens 3 that emits light is disposed inside the cap 22 so as to cover the window portion 2a. The stem 21 has a plurality of terminal holes 21b through which the terminal pins 25 are inserted in the thickness direction, and the sealing portion 24 in a state where the terminal pins 25 are inserted into the terminal holes 21b. Is sealed. In the present embodiment, the cap 22 and the stem 21 are made of steel plates, and the flange portion 22c that extends outward from the rear end edge of the cap 22 with respect to the flange portion 21c formed on the peripheral portion of the stem 21. Is sealed by welding.

  By the way, the individual substrate 6 of the circuit block 10 is made of glass epoxy or the like, and a circuit board 62 on which an IC 63 or a chip-like electronic component 64 which is a component such as a signal processing circuit is mounted, and a circuit board 62 made of glass epoxy or the like. In addition, a main substrate 66 that forms a circuit such as a signal processing circuit, a resin layer 65 laminated between the circuit substrate 62 and the main substrate 66, and one surface of the main substrate 66 opposite to the resin layer 65 are laminated. A resin substrate 67 and a metal layer 68 laminated on one surface of the resin substrate 67 opposite to the main substrate 66 are configured. The circuit board 62, the resin layer 65, the resin substrate 67, and the metal layer 68 are described later. The individual substrate 6 is formed so as to be integrally laminated on the main substrate 66 by using the manufacturing method of the individual substrate 6. Here, the circuit board 62 and the main board 66 are molded with the resin layer 65 sandwiched between the chip-like electronic components 64 mounted thereon, so that the resin layer 65 is embedded in the resin layer 65. A multilayer circuit board composed of a so-called component-embedded substrate is formed together with 65. That is, the individual substrate 6 of this embodiment is configured by laminating the resin substrate 67 and the metal layer 68 on the multilayer circuit board.

  In the circuit board 62, the IC 63 is flip-chip mounted on the lower surface side in FIG. 3 (or, although not shown, the IC 63 may be connected by wire bonding after die bonding and resin-sealed), and plural on the upper surface side. The chip-shaped electronic component 64 is mounted by solder reflow. The infrared detector of the present embodiment is used for detecting the movement of a person by detecting infrared rays radiated from the human body. The IC 63 is a predetermined frequency band (for example, 0) of the pyroelectric element 1. An amplifier circuit (bandpass amplifier) that amplifies the output of .about 1 to 10 Hz, a window comparator at the subsequent stage of the amplifier circuit, and the like are integrated.

  The pyroelectric element 1 is mounted on the mounting area 67 a on the one surface where the metal layer 68 is laminated on the resin substrate 67 of the individual substrate 6, and the pyroelectric element 1 is focused on the mounting area 67 a of the individual substrate 6. In a portion corresponding to the detection portion of the electric element 1, a three-dimensional shape portion 6 a is formed that includes a concave portion that forms a gap for thermal insulation between the detection portion of the pyroelectric element 1 and the resin substrate 67. . By providing the three-dimensionally shaped portion 6a, thermal insulation between the detecting portion of the pyroelectric element 1 and the resin substrate 67 can be taken, and the sensitivity of the pyroelectric element 1 is increased. Here, the three-dimensionally shaped portion 6 a (concave portion) is formed in an oval shape in plan view, and both sides of the three-dimensionally shaped portion 6 a on the one surface of the individual substrate 6 in the short diameter direction are both end portions of the pyroelectric element 1. It functions as a support part that supports Pads 68b for connecting electrodes (not shown) formed at both ends of the pyroelectric element 1 are formed on the support portion.

  Further, the circuit component 8 (see FIG. 1) is mounted on one surface of the main substrate 66 on the resin substrate 67 side, and the circuit component 8 is a three-dimensionally shaped portion 6a in the thickness direction of the main substrate 66 of the resin substrate 67. It is buried in the part that does not overlap. 2 and 3, the circuit component 8 is not shown.

  In the circuit block 10, through holes 62 b, 65 b, 66 b, 67 b through which the terminal pins 25 are inserted are provided through the circuit board 62, the resin layer 65, the main board 66, and the resin board 67 in the thickness direction. The pyroelectric element 1 and the signal processing circuit are electrically connected through the terminal pin 25. In this embodiment, the circuit board 62, the resin layer 65, the main board 66, and the resin board 67 are stacked, and through holes 62b and 65b are formed by a single drilling process that forms a through hole penetrating in the thickness direction. , 66b, 67b are formed so that the manufacturing process can be simplified and electrical connection within the circuit block 10 can be facilitated as compared with the case where the through holes 62b, 65b, 66b, 67b are individually formed. Yes.

  The metal layer 68 formed on the one surface of the resin substrate 67 constitutes the above-described pad 68b and the pattern portion 68c electrically connected to the pad 68b. Hereinafter, the pads 68b and the pattern portions 68c formed from the metal layer 68 on the one surface of the resin substrate 67 are referred to as circuit patterns 68a.

  Of the above-described three terminal pins 25, one is a power supply terminal pin 25 (25a), the other one is a signal output terminal pin 25 (25b), and the other one is a ground terminal pin 25. (25c). Here, the sealing portions 24 and 24 (24a and 24b) for sealing the terminal pins 25a and 25b are formed of insulating sealing glass, and the sealing portion 24 for sealing the terminal pins 25c. (24c) is formed of a metal material. In short, the terminal pins 25a and 25b are electrically insulated from the metal stem 21, whereas the ground terminal pin 25c is set to the same potential as the stem 21.

  When assembling the infrared detector having the above-described configuration, after mounting the circuit block 10 on the stem 21 via the spacer 7, the flange portion 22c of the cap 22 and the flange portion 21c of the stem 21 to which the infrared lens 3 is fixed. The circuit block 10 may be housed in the sealed metal package 2 by welding. The package 2 is a so-called CAN package, which can enhance the shielding effect against external noise and improve the weather resistance by improving the airtightness. Further, the mounting components mounted on the individual substrate 6 are not limited to the pyroelectric element 1 described above. For example, thermistor type infrared detection element, thermopile type infrared detection element, resistance bolometer type infrared detection element, etc. As long as the change in the amount of received infrared light can be converted into a change in the electrical signal, it is sufficient.

  Next, a method for manufacturing the individual substrate 6 used in the above-described infrared detector will be described with reference to FIG. Here, in order to improve productivity, a method of simultaneously forming a plurality of individual substrates 6 in a single pressing step (so-called multi-cavity) is adopted as in the conventional example. In FIG. 1, the circuit board 62 and the resin layer 65 are not shown.

  First, the chip-like electronic component 64 is mounted on the circuit board 62 and the circuit component 8 is mounted on the main board 66 to form a circuit such as a signal processing circuit. Further, as shown in FIG. 1 (a), by using a press die 4, a part of a metal sheet 69 (for example, a copper foil having a thickness of about 18 μm) as a basis of the above-described metal layer 68 is transferred to the three-dimensionally shaped portion 6a. (Hereinafter referred to as a pre-forming step). As shown in FIG. 1A, the press die 4 used in the pre-forming process has a three-dimensional shape portion 6a (here, for heat insulation) of the individual substrate 6 at a contact portion with the surface of the metal sheet 69. A molded portion 4a formed of a convex portion having a shape corresponding to the concave portion (here, the plan view is an oval shape), and the shape corresponding to the three-dimensional shape portion 6a is formed into a part of the metal sheet 69 by the molded portion 4a. Mold. Here, the press die 4 is used together with a female die 4 ′ having a female side molding portion 4a ′ composed of a recess corresponding to the molding portion 4a, and the surface of the press die 4 on which the molding portion 4a is formed (hereinafter referred to as “the molding die 4a”). (Referred to as molding surface 4b) and a surface (hereinafter referred to as female side molding surface 4b ') in which female side molding part 4a' is formed in female die 4 'as shown in FIG. The metal sheet 69 is molded by sandwiching the sheet 69. That is, in the preforming process, the metal sheet 69 is disposed between the female side molding surface 4b ′ of the female die 4 ′ and the molding surface 4b of the press die 4, and press working is performed in this state. As shown in FIG.1 (c), a part of metal sheet 69 is shape | molded by the shape corresponding to the solid-shaped part 6a. In the present embodiment, in order to simultaneously form a plurality of individual substrates 6 in a single pressing step, a metal sheet 69 having a size capable of taking a plurality of individual substrates 6 is used, and the molding surface A press die 4 in which a plurality of molding parts 4a having the same shape are arranged on 4b and a female mold 4 'in which a plurality of female side molding parts 4a' having the same shape are arranged on the female side molding surface 4b 'are used. Here, as an example, a press die 4 is used in which a plurality of molding portions 4a are formed in a lattice point shape so that the molding portions 4a are aligned at equal intervals on the molding surface 4b.

  Thereafter, the circuit board 62, the resin layer 65, and the main board 66 are laminated, the resin board 67 is further laminated on the surface of the main board 66, and the metal sheet 69 pre-formed in the above-described preforming process is attached to the resin board 67. By laminating on the surface, a laminated substrate 60 in which the circuit board 62, the resin layer 65, the main substrate 66, the resin substrate 67, and the metal sheet 69 are laminated so as to have the positional relationship shown in FIG. Hereinafter, it is referred to as a lamination process). Here, as the laminated substrate 60, a substrate having a size capable of obtaining a plurality of individual substrates 6 is used. In the present embodiment, a rectangular plate-shaped laminated substrate 60 is formed. Further, in the present embodiment, the resin layer 65 and the resin substrate 67 are formed by stacking B-stage resin sheets that have a relatively high elongation rate and tensile strength and are tough at room temperature and are not easily torn. The resin sheet is, for example, an organic green sheet such as an epoxy resin sheet having a thickness of about 10 to 1000 μm and a thermosetting resin such as an epoxy resin highly filled with an inorganic filler such as silica (for example, about 60 to 95 wt%). Can be used. In short, a plurality of resin sheets (for example, 13 sheets) are stacked between the circuit board 62 and the main board 66 to form a resin layer 65, and a plurality of resin sheets (for example, three sheets) are formed on the main board 66. A resin substrate 67 is formed by overlapping the layers.

  And in the state which has arrange | positioned the press metal mold | die 4 on the laminated substrate 60 formed at the lamination process, the resin sheet is softened and pressure is applied to the press metal mold | die 4 in a vacuum atmosphere, and the thermocompression molding of the laminated substrate 60 is carried out. Further, the resin sheet is cured to a C stage state at a predetermined temperature (hereinafter referred to as a pressing step). The press mold 4 used in the pressing process is the same as the press mold 4 (male mold) used in the pre-forming process. As shown in FIG. 6a is molded. That is, in the pressing process, the press mold 4 is arranged on the laminated substrate 60 so that the molding surface 4b on which the molding part 4a is formed is abutted against the surface of the laminated substrate 60 on the metal sheet 69 side. By performing the processing, the three-dimensional shape portion 6a is formed on the laminated substrate 60 by the forming portion 4a. Furthermore, in the pressing process, the laminated substrate 60 is thermocompression-bonded (that is, the circuit substrate 62, the resin layer 65, the main substrate 66, the resin substrate 67, and the metal layer 68 are integrated). The circuit component 8 mounted on the resin substrate 67 is embedded in the resin substrate 67. As a result, as shown in FIG. 1 (e), the thermocompression molding of the laminated substrate 60 and the molding of the three-dimensionally shaped portion 6 a and the embedding of the circuit component 8 in the resin substrate 67 can be performed simultaneously in the pressing process. Man-hours can be relatively reduced. Here, the circuit board 62, the main board 66, and the press mold 4 are formed by inserting pins (not shown) into through holes (not shown) formed at the four corners of the circuit board 62, the main board 66, and the press die 4. Pressing is performed in a state of being aligned in a plane orthogonal to the direction. The circuit component 8 is embedded in a portion of the resin substrate 67 that does not overlap the three-dimensional shape portion 6 a in the thickness direction of the main substrate 66. The conditions for the thermocompression molding described above can be set as appropriate. For example, the pressure may be 0.2 to 5 MPa, the temperature may be 100 to 150 ° C., and the time may be 60 to 600 seconds. Furthermore, in order to cure to the C stage state, the temperature is set to 150 to 200 ° C. and the time is set to 10 to 180 minutes.

  In the circuit forming process after the pressing process, through holes 62b, 65b, 66b, 67b and via holes are formed in the laminated substrate 60 integrated in the pressing process, and the through holes 62b, 65b, 66b, 67b are formed. In addition, a conductive path is formed in the via hole, and the metal layer 68 is patterned to form the circuit pattern 68a described above from the metal layer 68. Specifically, a portion of the metal layer 68 that becomes the circuit pattern 68a is covered with a resist (not shown), and the metal layer 68 is subjected to an etching process, whereby an unnecessary portion of the metal layer 68 other than the circuit pattern 68a ( The metal layer 68 of the three-dimensional shape portion 6a is removed by etching. Thereafter, if the resist is removed, a circuit pattern 68 a is formed on one surface of the resin substrate 67. Thereafter, the individual substrate 6 is cut out from the laminated substrate 60 in the cutting step.

  According to the manufacturing method of the individual substrate 6 described above, since there is a pre-forming step in which a part of the metal sheet 69 is pre-formed into a shape corresponding to the three-dimensional shape portion 6a before the laminating step, The surrounding metal sheet 69 is not pulled at the contact portion of the sheet 69 with the tip surface of the molded part 4a, and a gap is generated between a part of the metal sheet 69 and the surface of the molded part 4a, thereby forming a three-dimensionally shaped part. The opening surface of 6a does not become larger than the cross section of the base end portion of the molded portion 4a. Therefore, the three-dimensionally shaped part 6a can be molded following the shape of the molded part 4a, and contact between the circuit component 8 adjacent to the three-dimensionally shaped part 6a and the metal layer 68 of the three-dimensionally shaped part 6a can be avoided. In addition, a high-density design is possible in which the circuit component 8 embedded in the resin substrate 67 and the three-dimensionally shaped portion 6a are arranged close to each other. Further, since no gap is generated between the metal sheet 69 and the molded part 4a, the metal layer 68 is not wrinkled.

  By the way, in the present embodiment, a common press die 4 (male die) is used in the pre-forming step and the press step, but individual press dies 4 may be used in the pre-forming step and the press step. Good. However, when separate press dies 4 are used in the pre-forming process and the press process, as shown in FIGS. 4A and 4B, the press dies 4 for the pre-forming process after the pre-forming process. It is necessary to remove the metal sheet 69 from. Here, as shown in FIGS. 5A and 5B, when the metal sheet 69 is removed from the pre-forming press die 4, a spring back is generated in the metal sheet 69 and the metal sheet 69 is deformed. There is. When the pressing process is executed as shown in FIGS. 4C and 4D in a state where the spring back is generated in the metal sheet 69, the shape of the three-dimensional shape portion 6a is obtained as shown in FIG. 5C. The shape of the metal sheet 69 after being deformed by the spring back is reflected, and there is a possibility that the accuracy of molding the three-dimensionally shaped portion 6a is lowered.

  On the other hand, in the present embodiment, a common press die 4 is used in the pre-forming step and the press step, and the metal sheet 69 is moved to the press step without removing it from the press die 4 after the pre-forming step. ing. Therefore, since the spring back of the metal sheet 69 does not occur when the metal sheet 69 is removed from the press die 4, the pressing process can be performed while maintaining the shape of the metal sheet 69 formed in the pre-forming process. In particular, compared to the above manufacturing method using separate press dies 4 in the pre-forming process and the press process, the accuracy of molding of the three-dimensional shape portion 6a molded in the press process is improved.

(Embodiment 2)
The manufacturing method of the individual substrate 6 shown in the present embodiment is the same as the manufacturing method of the individual substrate 6 described in the first embodiment, and the metal sheet 69 is hardly broken in the pre-forming process or the pressing process. This is different from the first embodiment. In addition, the same code | symbol is attached | subjected to the component same as Embodiment 1, and description is abbreviate | omitted suitably.

  By the way, when the aspect ratio (here, depth / minor axis) of the three-dimensionally shaped portion 6a is relatively large, when the molding portion 4a of the press mold 4 molds while stretching the metal sheet 69 in the pre-forming process. The elongation amount of the metal sheet 69 is large, and there is a possibility that the metal sheet 69 is torn at a portion corresponding to the three-dimensionally shaped portion 6a as in the comparative example shown in FIG. If the metal sheet 69 is torn, there may be a problem that the resin of the resin substrate 67 oozes out and adheres to the surface of the metal layer 68 from where the metal sheet 69 is torn in the pressing process. On the other hand, in the present embodiment, the metal sheet 69 is hardly broken by the following method.

  That is, the manufacturing method of the individual substrate 6 shown in the present embodiment includes an annealing process in which the metal sheet 69 is softened by annealing before the preforming process. Specifically, the metal sheet 69 is softened by heating the metal sheet 69 to an appropriate temperature in the annealing step and then gradually cooling the metal sheet 69 to recrystallize. As an example, when a copper foil is used as the metal sheet 69, the metal sheet 69 is heated at a temperature near the recrystallization temperature of the copper foil (for example, 130 to 250 ° C.) for 1 hour or longer (for example, 1.5 hours). The metal sheet 69 can be softened. In this way, if the metal sheet 69 is softened before the pre-forming process, the metal sheet 69 is easily stretched in the pre-forming process, and the metal sheet 69 is hardly broken. For example, when using a metal sheet 69 having an elongation rate of about 5% within a range not torn before annealing, the metal sheet 69 may be torn in the pre-forming step unless the metal sheet 69 is annealed. However, in this embodiment, the elongation within a range where the metal sheet 69 is not broken can be improved to about 20% by annealing, so that the metal sheet 69 is broken as shown in FIG. Can be prevented.

  As another example of the present embodiment, as shown in FIG. 7A, a corner between one surface of the molded portion 4a that first contacts the laminated substrate 60 in the pressing step and another surface adjacent to the one surface. You may make it use the press die 4 in which the part 4d is chamfered by the round shape. In short, since the tip surface of the molding part 4a protruding from the molding surface 4b becomes one surface of the molding part 4a that first contacts the laminated substrate 60, the tip surface and the side surface of the molding part 4a adjacent to the tip surface are A pressing process is performed using a pressing die 4 formed in a curved shape in which the corners 4d between them are convex toward the laminated substrate 60 side. Here, as an example, a round shape having a curvature radius of 0.05 mm or more is used. In this method, as shown in FIG. 7B, compared to a case where the corner 4d between one surface of the molded portion 4a that first contacts the laminated substrate 60 and the other surface adjacent to the one surface is sharp. In addition, stress concentration is unlikely to occur in the portion of the laminated substrate 60 where the corner 4d abuts, so that the metal sheet 69 is not easily torn during the pressing process. Furthermore, in the pre-forming process, the metal sheet 69 is hardly broken by using the same press die 4.

  By the way, in each embodiment mentioned above, what laminated | stacked the circuit board 62, the resin layer 65, the main board | substrate 66, the resin board | substrate 67, and the metal sheet 69 (metal layer 68) was used as the laminated substrate 60, However The present invention is not limited to the substrate 60, and can be applied by applying the manufacturing method of the present invention as long as it is a laminated substrate 60 in which a resin substrate 67 and a metal sheet 69 are laminated on at least one surface (on the circuit component 8 side) of the main substrate 66. The single substrate 6 can be manufactured.

It is process sectional drawing of the principal part which shows the manufacturing method of the separate board | substrate of Embodiment 1 of this invention. The infrared detector same as the above is shown, (a) is a schematic plan view, and (b) is a schematic sectional view. It is a schematic exploded perspective view which shows an infrared detector same as the above. It is process sectional drawing of the principal part which shows the comparative example same as the above. 4A is an enlarged view of the main part A of FIG. 4A, FIG. 4B is an enlarged view of the main part B of FIG. 4B, and FIG. 4C is an enlarged view of the main part C of FIG. It is. (A) is a schematic sectional drawing of the principal part which shows the manufacturing method of the separate board | substrate of Embodiment 2 of this invention, (b) is a schematic sectional drawing of the principal part of a comparative example. (A) is a schematic sectional drawing of the principal part of the press metal mold | die used by the other example same as the above, (b) is a schematic sectional drawing of the solid-shaped part formed with the press metal mold | die of (a). It is process sectional drawing of the principal part which shows the manufacturing method of the separate substrate of a prior art example. It is process sectional drawing of the principal part which shows the manufacturing method of the separate substrate of another prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pyroelectric element 4 Press die 4a Molding part 4d Corner | gear part 6 Piece | segmentation board 6a Three-dimensional shape part 8 Circuit component 60 Laminated board 66 Main board 67 Resin board | substrate 67a Mounting area 68 Metal layer 69 Metal sheet

Claims (6)

  A main substrate having a resin substrate laminated on one surface, a metal layer is formed on one surface of the resin substrate opposite to the main substrate, and a three-dimensionally shaped portion including a recess is formed on the one surface side. A circuit board mounted on the main board on which the circuit component is mounted is embedded in a portion of the resin board that does not overlap with the three-dimensionally shaped portion in the thickness direction of the main board. A laminating process for forming a laminated substrate by laminating metal sheets that serve as a basis for the metal layer, and a press mold having a molding part composed of convex portions corresponding to the three-dimensional shape part of the individual substrate A pressing process for forming a three-dimensionally shaped part at a molding part and embedding a circuit component in a resin substrate by pressing the metal sheet in contact with the surface of the metal sheet. Part of Method for producing individual substrates characterized by having a pre-forming step of molding into a shape corresponding to the body-shaped portion.   2. The pre-forming step uses the same pressing die as the pressing step, and the pressing step is performed without removing the metal sheet from the pressing die after the pre-forming step. The manufacturing method of the separate board | substrate of description.   3. The method of manufacturing an individual substrate according to claim 1, further comprising an annealing step of softening the metal sheet by annealing before the preforming step.   The press mold is characterized in that a corner between a tip surface that first contacts the laminated substrate in the pressing step and a side surface adjacent to the tip surface in the pressing step is formed in a round shape. The method for manufacturing an individual substrate according to any one of claims 1 to 3.   5. An individual substrate manufactured by the method for manufacturing an individual substrate according to claim 1, wherein a mounting region in which a mounting component is mounted on one surface of the three-dimensionally shaped portion side. And the three-dimensionally shaped portion includes a concave portion that forms a gap for thermal insulation between the mounted component and the resin substrate by forming at least a part in the mounting region. 6. The individual board according to claim 5, and a pyroelectric element mounted on the mounting area as the mounting component, wherein the three-dimensionally shaped part is formed at a position corresponding to the detection part of the pyroelectric element in the mounting area. Infrared detector characterized by being made.

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