JP2008241917A - Liquid crystal display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display capable of easily inspecting a connection state of an LSI, even when the LSI is attached by an ACF on an array substrate. <P>SOLUTION: Two bumps 40 for inspection are projected from the lower surface of the LSI 20, inspection terminals 34 are formed on array substrates 14 corresponding to the bumps 40 for inspection, respectively and an the two bumps 42 for inspection are connected by inspection wiring 44. Then, the connection state of the LSI is inspected, by measuring the resistance value between the inspection terminals 34. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device in which an LSI is mounted on an array substrate by an ACF (anisotropic conductive film).

  In a liquid crystal display device, an LSI incorporating a drive driver is attached to an array substrate by ACF. By pressing and heating the ACF through the LSI, the LSI bumps and the wiring pattern terminals on the array substrate are physically and electrically connected.

  In order to confirm the connection state by the ACF, the number of conductive particles of ACF captured between the terminals using a microscope from the back surface of the array substrate (glass substrate) and the pressure-bonded state of the LSI are confirmed by human eyes. Moreover, it was performed by confirming the display image of the liquid crystal display device by a normal inspection.

On the other hand, as an inspection method when substrates are fixed to each other by ACF, as shown in Patent Document 1, an inspection pattern capable of evaluating electrical connection is provided on each substrate, and a prober is brought into contact with the measurement pattern. There has been proposed a method in which a resistance value is detected and an inspection is performed.
JP 2004-95872 A

  Since the inspection method for the liquid crystal display device as described above needs to be observed with a microscope, there are individual differences, and there is a problem that the work is complicated.

  Further, the inspection method of Patent Document 1 can form an inspection wiring pattern because substrates connected by ACF are substrates. However, in the liquid crystal display device, since the LSI is fixed on the array substrate by the ACF, it is difficult to provide a wiring pattern provided on the substrate.

  In view of the above problems, the present invention provides a liquid crystal display device that can easily inspect the connection state even when an LSI is mounted on an array substrate by an ACF.

  The present invention provides a liquid crystal display device in which an LSI is mounted on an array substrate by ACF, and two inspection bumps protrude from the lower surface of the LSI, and inspection terminals are respectively formed on the array substrate corresponding to the inspection bumps. In the liquid crystal display device, the two inspection bumps are connected by inspection wiring.

  According to the present invention, since the inspection bumps are connected by the inspection wiring in the LSI, when the resistance value between the inspection terminals on the array substrate is measured when fixed on the array substrate by the ACF, The connection state can be easily confirmed.

  Hereinafter, a liquid crystal display device 10 according to an embodiment of the present invention will be described with reference to FIGS.

(1) Configuration of Liquid Crystal Display Device 10 FIG. 1 is a perspective view of the liquid crystal display device 10 of the present embodiment.

  The liquid crystal display device 10 is mounted on a mobile phone and has a size of 2 to 3 inches. In the liquid crystal panel 12 of the liquid crystal display device 10, an array substrate 14 and a counter substrate 16 are arranged with a liquid crystal layer interposed therebetween, and the size of the array substrate 14 is larger than that of the counter substrate 16 and a shelf portion 18 is formed.

  An LSI 20 having a drive driver for the liquid crystal display device 10 is fixed to the shelf 18 of the array substrate 14 by an ACF 22.

  A plurality of lead lines 24 extending from each pixel of the array substrate 14 are wired on the shelf 18, and a first terminal 26 is provided at the tip thereof.

  In addition, a connection line 28 is provided from the end of the shelf 18 inward, and a second terminal 29 and a third terminal 30 are formed at both ends, respectively. A plurality of third terminals 30 outside the connection line 28 are connected to a flexible wiring board for connecting to a control IC of a main control unit in the main body of the mobile phone.

  The first terminal 26 of each lead line 24 and the second terminal 29 of the connection line 28 are arranged in parallel so as to face each other. Two first inspection terminals 34, 34 are provided on both sides of the first terminal 26 of the lead wire 24 and the second terminal 29 of the connection line 28, respectively, and an inspection wiring pattern 36 extends from each inspection terminal 34. A second inspection terminal 38 is formed at the end of the inspection wiring pattern 36.

  In the LSI 20, a plurality of signal bumps 40 are formed so as to correspond to the first terminals 26 and the second terminals 30. As shown in FIG. 4, two inspection bumps 42 and 42 are provided at both ends of the LSI 20. Positioning bumps 46 are respectively provided at the four corners of the lower surface of the LSI 20. An inspection wiring for electrically connecting the inspection bumps 42 and 42 is formed between the inspection bumps 42 and 42 and on the lower surface of the LSI 20.

(2) Fixing Method A case where the LSI 20 is fixed to the shelf 18 of the array substrate 14 in the liquid crystal display device 10 having the above configuration will be described.

  First, the sheet-like ACF 22 is arranged at a predetermined position of the shelf 18, the LSI 20 is arranged thereon, the LSI 20 is pressurized from above and heated at a predetermined temperature.

  Since the ACF 22 has conductive particles inside and is formed of a thermoplastic resin, the LSI 20 and the array substrate 14 are physically and electrically fixed by heating and pressing. In this case, if it is fixed securely, the bump 40 and the first terminal 26 and the second terminal 29 are electrically connected.

(3) Inspection Method An inspection method for confirming the electrical connection state of the LSI 20 fixed as described above will be described.

  As shown in FIG. 4, probers are connected to the pair of second inspection terminals 38, 38, respectively, and the resistance value between the second inspection terminals 38, 38 is measured. In this case, if the LSI 20 is securely connected, electricity flows through the second inspection terminal 38, the inspection wiring pattern 36, the first inspection terminal 34, the inspection bump 42, and the inspection wiring 44, and a predetermined resistance is obtained. Value. On the other hand, when the connection is not performed, the resistance value increases, indicating that the connection is insufficient.

(4) Effect As described above, in the liquid crystal display device 10 of the present embodiment, the LSI 20 is reliably connected to the array substrate 14 only by measuring the resistance value between the second inspection terminals 38 and 38. It can be determined whether or not.

  Further, since the first inspection terminals 34 and 34 are provided on the left side and the right side of the LSI 20, the mounting state can be easily inspected on both sides.

  Further, since the inspection wiring 44 for this inspection is only formed on the lower surface of the LSI 20, it can be easily formed.

(Example of change)
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

(1) Modification 1
In the above embodiment, the inspection wiring 44 is formed on the lower surface of the LSI 20, but it may be provided inside the LSI 20 instead.

(2) Modification example 2
In the above embodiment, a pair of inspection bumps 42 and 42 are provided at both ends of the LSI 20, but in addition to this, an inspection bump 42 may be provided at the center. The first inspection terminal 34 may also be provided at the corresponding central portion and pulled out outward by the inspection pattern 36.

  That is, the inspection bumps 42 may be provided at positions where the signal bumps 40 are vacant.

It is a perspective view of the liquid crystal display device which shows one Embodiment of this invention. It is a longitudinal cross-sectional view of the state which is going to attach LSI on an array board | substrate. It is a longitudinal cross-sectional view of a state where an LSI is mounted on an array substrate. It is a partial enlarged plan view of an array substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Liquid crystal display device 12 Liquid crystal panel 14 Array substrate 18 Shelf part 20 LSI
22 ACF
24 Lead wire 26 First terminal 28 Connection line 29 Second terminal 30 Third terminal 32 Flexible substrate 34 First inspection terminal 36 Inspection pattern 38 Second inspection terminal 40 Bump 42 Inspection bump 44 Inspection wiring

Claims (4)

In a liquid crystal display device in which an LSI is mounted on an array substrate by ACF,
Two inspection bumps protrude from the lower surface of the LSI,
Inspection terminals are respectively formed on the array substrate corresponding to the inspection bumps,
The two inspection bumps are connected by inspection wiring.
Liquid crystal display device. The inspection wiring is formed on the lower surface of the LSI,
The liquid crystal display device according to claim 1. The inspection wiring is formed inside the LSI;
The liquid crystal display device according to claim 1. The two inspection bumps are set as one set, and the one set of inspection bumps are respectively formed at both ends of the lower surface of the LSI.
The liquid crystal display device according to claim 1.

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