JP2008241444A - Machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a machining device capable of preventing a shift from being generated in an image picked up by an imaging means. <P>SOLUTION: This machining device is provided with a chuck table for holding a work, the imaging means provided with an optical system and an imaging element for imaging the work held by the chuck table, a machining means for machining the work held by the chuck table, a moving means for moving the chuck table along a machining feed direction including an imaging area of the imaging means, and a control means for controlling the imaging means, the machining means and the moving means, an opening and closing switch is arranged in an electric power source circuit for supplying electric power to the imaging element, and the control means closes the opening and closing switch, when executing an imaging process by the imaging means, and opens the opening and closing switch when finishing the imaging process by the imaging means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a processing apparatus such as a cutting apparatus that cuts a workpiece such as a semiconductor wafer, and more particularly to a processing apparatus including an imaging unit that images a processing region or the like of a workpiece.

For example, in a semiconductor device manufacturing process, devices such as IC and LSI are formed in a number of regions partitioned by dividing lines called streets formed in a lattice shape on the surface of a semiconductor wafer having a substantially disk shape, Individual devices are manufactured by dividing each region in which the devices are formed along a street. As a dividing device for dividing a semiconductor wafer, a cutting device as a dicing device is generally used. The cutting apparatus includes a chuck table for holding a workpiece, an imaging unit for detecting a region to be cut of the workpiece held on the chuck table, and a cutting unit for cutting the workpiece held on the chuck table. It is equipped with. (For example, refer to Patent Document 1).
JP 2002-11461 A

  The imaging means includes an optical system constituting a microscope and an imaging device (CCD) that converts an image captured by the optical system into an electrical signal. A reference line called a hairline is provided in the optical system of the image pickup means, and the reference line is adjusted in advance so that the position of the cutting blade matches. Therefore, the cutting blade can be accurately matched to the street by matching the captured street with the reference line.

In the above-described cutting apparatus, when the apparatus is turned on, a predetermined voltage is applied to the image pickup device constituting the image pickup means. Accordingly, since a voltage is applied to the image sensor for a long time, heat is accumulated. As a result, the case holding the image sensor slightly expands thermally, causing a shift in the captured image. For this reason, even if the captured street is matched with the reference line, the cutting blade does not match the street, and there is a problem that the wafer cannot be divided with high accuracy.
Such a problem occurs not only in the cutting apparatus but also in other processing apparatuses such as a laser processing apparatus including an image pickup unit including an optical system for picking up an image of a processing region and an image pickup element (CCD).

  The present invention has been made in view of the above-described facts, and a main technical problem thereof is to provide a processing apparatus that does not cause a deviation in an image picked up by an image pickup means.

In order to solve the above-mentioned main technical problem, according to the present invention, a chuck table for holding a workpiece, an optical system for imaging the workpiece held on the chuck table, and an imaging means including an imaging device Machining means for machining a workpiece held on the chuck table; movement means for moving the chuck table in a machining feed direction including an imaging region of the imaging means; the imaging means, the machining means, and the In a processing apparatus comprising a control means for controlling the moving means,
An open / close switch is disposed in a power supply circuit that supplies power to the image sensor,
The control means closes the open / close switch when performing the imaging process by the imaging means, and opens the open / close switch when the imaging process by the imaging means is completed.
The processing apparatus characterized by this is provided.

Further, according to the present invention, according to the present invention, a chuck table for holding a workpiece, an optical system for imaging the workpiece held on the chuck table, and an imaging means including an imaging device; , A shielding unit having a shielding position that shields the lower part of the optical system of the imaging unit, and a shielding member that operates to an open position that opens the lower part of the optical system, and a workpiece held on the chuck table A processing apparatus comprising:
An open / close switch disposed in a power supply circuit for supplying electric power to the image pickup device and opened and closed in conjunction with the operation of the shielding means;
The open / close switch is configured to open when the shielding plate of the shielding means is positioned at the shielding position, and to be closed when the shielding plate is positioned at the open position.
The processing apparatus characterized by this is provided.

In the processing apparatus according to the present invention, the open / close switch is disposed in the power supply circuit that supplies power to the image sensor that constitutes the imaging unit, and the control unit closes the open / close switch when the imaging unit performs the imaging process. Since the open / close switch is opened when the imaging process by the imaging means is completed, power is not supplied to the imaging device except for the imaging process. Accordingly, no heat is accumulated in the image sensor, and thus it is possible to prevent the image from being shifted due to thermal expansion of the case holding the image sensor.
Further, according to the present invention, the power supply circuit that supplies power to the imaging device constituting the imaging unit is provided with an open / close switch that opens and closes in conjunction with the operation of the shielding unit that shields the lower part of the optical system of the imaging unit, Since the opening / closing switch is opened when the shielding means is positioned at the shielding position, and the opening / closing switch is closed when the shielding means is positioned at the opening position, the shielding means is positioned at the open position so that imaging by the imaging means is possible. Power is not supplied to the image sensor except for the imaging process. Accordingly, no heat is accumulated in the image sensor, and thus it is possible to prevent the image from being shifted due to thermal expansion of the case holding the image sensor.

  Hereinafter, a preferred embodiment of a processing apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a cutting apparatus as a processing apparatus constructed according to the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. A chuck table 3 for holding a workpiece is disposed in the apparatus housing 2 so as to be movable in a direction indicated by an arrow X that is a cutting feed direction (machining feed direction). The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table support 31 is provided with a clamp 33 for fixing a support frame for supporting a semiconductor wafer, which will be described later, as a work piece via a protective tape. The chuck table 3 configured as described above can be moved in a cutting feed direction (machining feed direction) indicated by an arrow X by a cutting feed means (moving means) (not shown).

  The cutting apparatus in the illustrated embodiment includes a spindle unit 4 as cutting means (processing means). The spindle unit 4 is moved in an index feed direction indicated by an arrow Y in FIG. 1 by an index feed means (not shown), and is moved in a cut feed direction indicated by an arrow Z in FIG. 1 by a notch feed means (not shown). ing. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 41 is freely rotatable. And a cutting blade 43 attached to the front end of the rotating spindle 42.

  The cutting apparatus in the illustrated embodiment includes an image pickup means 5 for picking up an image of the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 43. The imaging means 5 is attached to the spindle housing 41 so that a reference line, which will be described later, is positioned on a straight line with the cutting blade 43 in the direction of the arrow X. Further, the cutting apparatus in the illustrated embodiment includes a display unit 6 that displays an image or the like captured by the imaging unit 5. The imaging unit 5 and the display unit 6 will be described with reference to FIG. 2 includes an optical system 52 including a microscope disposed in a housing 51, and an image sensor (CCD) 53 that converts an image captured by the optical system 52 into an electrical signal. . Note that the image sensor 53 is mounted on the housing 51 in a state of being disposed in the case 54. The imaging device 53 configured as described above is supplied with power by the power supply circuit 7 including the DC power supply 70. Further, the image sensor 53 converts an image captured by the optical system 52 into an electrical signal, and sends it to the control means 8 as image data. Then, the control means 8 performs image processing on the image data sent from the image sensor 53 and displays the image on the display means 6.

  In the illustrated embodiment, an open / close switch 71 is provided in the power supply circuit 7 that supplies power to the image sensor 53. The open / close switch 71 is opened and closed by a switch actuating means 9 (Act) controlled by the control means 8. Note that the control means 8 is configured to control each of the above-described means and each means described later.

  Returning to FIG. 1, the description will be continued. In the cassette mounting area 11 a of the apparatus housing 2, a cassette mounting table 11 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 11 is configured to be movable in the vertical direction by a lifting means (not shown). On the cassette mounting table 11, a cassette 12 that houses a semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 12 has a grid-like street formed on the surface thereof, and devices such as ICs and LSIs are formed in a plurality of rectangular regions partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 12 with the back surface adhered to the front surface of the protective tape T mounted on the annular frame F.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer 10 accommodated in a cassette 14 placed on a cassette placement table 13 (in a state where it is supported on an annular frame F via a protective tape T). Is carried out on the chuck table 3, the first conveying means 15 for conveying the semiconductor wafer 10 carried out on the temporary table 13 onto the chuck table 3, and the chuck table 3. A cleaning means 16 for cleaning the semiconductor wafer 10 and a second transport means 17 for transporting the semiconductor wafer 10 cut on the chuck table 3 to the cleaning means 16 are provided.

A cutting procedure for cutting the semiconductor wafer 10 along the street using the cutting apparatus configured as described above will be described with reference to the flowchart shown in FIG.
When a cutting work start switch (not shown) is turned on and a cutting work start signal is input, the control means 8 executes a wafer carry-out process in step S1. That is, the control means 8 operates a lifting / lowering means (not shown) of the cassette mounting table 11 so that the semiconductor wafer 10 (annular frame F) accommodated in a predetermined position of the cassette 12 placed on the cassette placing table 11 is operated. Is supported via the protective tape T) at the unloading position. Next, the unloading means 14 is advanced and retracted to unload the semiconductor wafer 10 positioned at the unloading position onto the temporary placement table 13.

  If the wafer unloading process is executed in step S1, the control means 8 proceeds to step S2 and executes the wafer holding process. That is, the control unit 8 operates the first transfer unit 15 to transfer the semiconductor wafer 10 carried out to the temporary table 13 onto the chuck table 3. Next, the control means 8 operates a suction means (not shown) to suck and hold the semiconductor wafer 10 on the chuck table 3. Further, the control means 8 operates a clamp operating means (not shown) to fix the annular frame F on which the protective tape T with the semiconductor wafer 10 attached is fixed by the clamp 33.

  If the wafer holding step is executed as described above, the control means 8 proceeds to step S3 and energizes (ON) the switch actuating means 9 (Act). As a result, the open / close switch 71 provided in the power supply circuit 7 is closed (ON), and a predetermined voltage is applied to the image pickup device 53 of the image pickup means 5. In this way, when a predetermined voltage is applied to the image pickup device 53 and preparation for image pickup by the image pickup means 5 is completed, the control means 8 proceeds to step S4, and the street formed on the semiconductor wafer 10 and the cutting blade 43 are connected. An imaging process for performing an alignment process for performing alignment is executed.

  In the imaging step, first, the control unit 8 operates a moving unit (not shown) to move the chuck table 3 holding the semiconductor wafer 10 to a position immediately below the imaging unit 5. Next, the control means 8 operates the image pickup means 5 to pick up an image of the street formed in a predetermined direction on the semiconductor wafer 10. And the control means 8 displays the street imaged by the imaging means 5 on the display means 6 as shown in FIG. If the imaged street is misaligned with the reference line as shown in FIG. 2, the control means 8 moves and adjusts the spindle unit 4 in the arrow Y direction as the indexing direction so that the reference line becomes the center of the street. Position. As a result, the cutting blade 43 is positioned at a position that matches the center of the street. As described above, when the street imaged by the imaging unit 5 is not parallel to the reference line, the control unit 8 operates a rotation mechanism (not shown) to rotate the chuck table 3 holding the semiconductor wafer 10. , And adjust so that the street and the reference line are parallel (alignment process). This imaging process is also performed on streets formed in a direction orthogonal to a predetermined direction.

  If the above-described imaging process is executed, the control means 8 proceeds to step S5 and deenergizes (OFF) the switch actuating means 9 (Act). As a result, the open / close switch 71 provided in the power supply circuit 7 is opened (OFF), and the supply of power to the image pickup device 53 of the image pickup means 5 is cut off.

Next, the control means 8 proceeds to step S6, moves the chuck table 3 holding the semiconductor wafer 10 to the cutting region, and executes a cutting step (processing step).
That is, the control means 8 operates a notch feeding means (not shown) to cut and feed the cutting blade 43 by a predetermined amount in the direction indicated by the arrow Z and rotate the chuck table 3 holding the semiconductor wafer 10 by suction. It moves at a predetermined cutting feed speed in a direction indicated by an arrow X that is a cutting feed direction (a direction orthogonal to the rotation axis of the cutting blade 43). In this cutting process, cutting water is supplied to the cutting blade 43 and the cutting part. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43. After the semiconductor wafer 10 is cut along a predetermined street in this way, the control means 8 operates an index feed means (not shown) to index and feed the chuck table 3 in the direction indicated by the arrow Y by the street interval. The cutting process is performed. When the cutting process is performed along all of the streets extending in a predetermined direction of the semiconductor wafer 10, the control means 8 operates a rotation mechanism (not shown) to rotate the chuck table 3 by 90 degrees, so that the semiconductor wafer is rotated. By executing the cutting process along the streets extending in the direction orthogonal to the predetermined direction, all the streets formed in a lattice shape on the semiconductor wafer 10 are cut and divided into individual chips. The divided chips do not fall apart due to the action of the protective tape T, and the state of the wafer supported by the annular frame F is maintained.

  As described above, when the cutting process is completed along the streets of the semiconductor wafer 10, the control means 8 proceeds to step S7 and executes a wafer holding release process. That is, the control means 8 operates a moving means (not shown) to return the chuck table 3 holding the semiconductor wafer 10 to the position where the semiconductor wafer 10 is first sucked and held. Then, the control means 8 stops the suction of the suction means (not shown) and releases the suction holding of the semiconductor wafer 10.

  Next, the control means 8 proceeds to step S8 and executes a cleaning process. That is, the control unit 8 operates the second transfer unit 17 to transfer the semiconductor wafer 10 on the chuck table 3 to the cleaning unit 16. Then, the control means 8 operates the cleaning means 16 to clean and dry the semiconductor wafer 10 cut in the cutting process.

  If the cleaning process described above is executed, the control means 8 proceeds to step S9 and executes the wafer storage process. That is, the control unit 8 operates the first transport unit 15 to transport the semiconductor wafer 10 cleaned and dried by the cleaning unit 16 to the temporary placement table 13. Then, the control means 8 operates the carry-out means 14 to store the semiconductor wafer 10 after cutting, which has been conveyed to the temporary table 13, in a predetermined position of the cassette 12. Accordingly, the carry-out means 14 also has a function as a carry-in means for carrying the processed semiconductor wafer 10 into the cassette 12.

  As described above, in the cutting apparatus according to the illustrated embodiment, the open / close switch 71 is disposed in the power supply circuit 7 that supplies power to the image pickup device 53 constituting the image pickup unit 5, and the open / close switch 71 is used for the above-described image pickup. Since it is energized (ON) only while the process is being performed, power is not supplied to the image sensor 53 constituting the imaging means 5 except for the imaging process. Accordingly, since heat is not accumulated in the image sensor 53, it is possible to prevent image displacement due to thermal expansion of the case 54 holding the image sensor 53.

  Note that the imaging step of imaging the semiconductor wafer 10 that is a workpiece by the imaging unit 5 may be performed in order to inspect the state of the cutting groove after the cutting step is performed. For example, if the above-described cutting process is performed on a predetermined number of semiconductor wafers 10 as workpieces, the control means 8 energizes (ON) the switch actuating means 9 (Act) to the power supply circuit 7. The provided opening / closing switch 71 is closed (ON), and the semiconductor wafer 10 is returned to the chuck table 3. And the control means 8 operates the imaging means 5, images the cutting groove formed in the semiconductor wafer 10, and performs the cutting groove inspection process which test | inspects the state of a cutting groove.

Next, another embodiment of the present invention will be described with reference to FIGS.
The embodiment shown in FIGS. 4 and 5 includes a shielding unit 20 that shields the lower side of the optical system 52 that constitutes the imaging unit 5 and is disposed in the power supply circuit 7 in conjunction with the operation of the shielding unit 20. The open / close switch 71 is configured to open and close. The shielding means 20 in the illustrated embodiment includes a guide member 21 mounted at a right angle to the optical axis of the optical system 52 at the lower end of the housing 51 in which the optical system 52 of the imaging device (CCD) 53 is disposed, A shielding member 22 movably disposed below the guide member 21 and an operating means 23 for moving the shielding member 22 along the lower surface of the guide member 21 are provided.

  The guide member 21 includes a guide portion 211 formed in a rectangular shape and a cylindrical mounting portion 212 that mounts the guide plate 211 on the lower end portion of the optical system 62. The guide portion 211 includes a first hole 211a corresponding to the optical system 52 at the center, and a pair of guide grooves 211b and 211c are formed on the lower surface thereof so as to face each other along the longitudinal direction. The cylindrical mounting portion 212 is formed upright from the periphery of the first hole 211a. The guide member 21 configured as described above has a cylindrical mounting portion 212 fitted to the lower end portion of the housing 51, and is mounted on the housing 51 by an adhering means such as an adhesive or a screw.

  The shielding member 22 is made of a flexible sheet material such as polyethylene terephthalate (PET) resin, and a second hole 22a corresponding to the first hole 211a is provided at a predetermined position. The shielding member 22 formed in this way is engaged with a pair of guide grooves 211b and 211c formed on the lower surface of the guide portion 211 that constitutes the guide member 21 on both sides, thereby forming a lower surface of the guide portion 211. It is arranged to be movable along. Accordingly, by positioning the second hole 22a provided in the shielding member 22 at an open position facing the first hole 211a, the imaging unit 5 can perform imaging through the optical system 52. Further, the first hole 211a is shielded by positioning the shielding member 22 at a shielding position that is moved at least by an amount corresponding to the diameter of the second hole 22a from the open position. Note that two holes 22 b and 22 b for connecting to the actuating means 23 are provided at one end of the shielding member 22.

  The actuating means 23 is constituted by an air piston mechanism in the illustrated embodiment. The actuating means 23 comprising an air piston mechanism includes a cylinder 231, a piston 232 slidably disposed in the cylinder 231, a piston rod 233 to which one end of the piston 232 is coupled, and the piston rod 233. And a connecting member 234 attached to the other end. In the operating means 23 configured as described above, the first chamber 231a and the second chamber 231b defined by the piston 232 in the cylinder 231 are communicated with an air control circuit (not shown). The connecting member 234 attached to the other end of the piston rod 233 has a length corresponding to the width of the shielding member 22, and includes a holding groove 234 a that holds one end of the shielding member 22. The connecting member 234 is formed with two holes 234b and 234b corresponding to the two holes 22b and 22b provided at one end of the shielding member 22 in a direction perpendicular to the holding groove 234a. One end of the shielding member 22 is inserted into the holding groove 234a of the connecting member 234 thus configured, and the bolt 235 is inserted into the holes 234b and 234b provided in the connecting member 234 and the holes 22b and 22b provided in the shielding member 22. , And the nut 236 is screwed into the bolt 235 to attach the shielding member 22 to the connecting member 234.

  The actuating means 23 configured as described above is appropriately fixed so that the cylinder 231 is in the housing 51 of the imaging means 5 and the sliding direction of the piston 232 is parallel to the optical axis of the optical system 52 as shown in FIG. Mounted by means. The connecting member 234 is positioned above one end in the longitudinal direction of the guide portion 211 that constitutes the guide member 21. For this reason, the shielding member 22 made of a flexible sheet is bent at a substantially right angle from one edge in the longitudinal direction of the guide portion 211. Therefore, the actuating means 23 can move the shielding member 22 along the lower surface of the guide portion 211 constituting the guide member 21 by actuating the piston rod 233 in the vertical direction in FIG. That is, when the piston rod 233 of the actuating means 23 is operated to the lower position indicated by the solid line, the shielding member 22 is positioned at the open position indicated by the solid line in FIG. 4, and when the piston rod 233 is operated to the upper position, the shielding member 22 is Is positioned at the shielding position indicated by a two-dot chain line. Thus, by forming the shielding member 22 with a flexible sheet, the operation means 23 can be easily arranged.

  In the embodiment shown in FIGS. 4 and 5, an open / close switch 71 disposed in the power supply circuit 7 shown in FIG. 2 is attached to the housing 51 adjacent to the operating means 23. In the open / close switch 71, the switch operating piece 711 is disposed to face the upper surface of the connecting member 234 constituting the operating means 23. In the open / close switch 71 configured as described above, the connecting member 234 and the switch operating piece 111 are separated from each other when the operating means 23 is positioned at the open position indicated by the solid line in FIG. ing. In addition, when the operating means 23 is positioned at the shielding position indicated by a two-dot chain line in FIG. 4, the switch operating piece 711 is operated by the connecting member 234 and the open / close switch 71 is opened (OFF).

  The embodiment shown in FIGS. 4 and 5 is configured as described above, and the open / close switch 71 provided in the power supply circuit 7 opens and closes in conjunction with the operating means 23 constituting the shielding means 20. Therefore, the switch actuating means 9 in the embodiment shown in FIG. 2 is not necessary. The actuating means 23 constituting the shielding means 20 is actuated based on the control signal of the control means 8. That is, the control unit 8 operates the operation unit 23 when performing the imaging step, and positions the operation unit 23 at the open position indicated by a solid line in FIG. At this time, the connecting member 234 of the actuating means 23 and the switch actuating piece 711 of the open / close switch 71 are separated as shown by the solid line in FIG. 4, and the open / close switch 71 is closed (ON). As a result, the second hole 22a provided in the shielding member 22 matches the first hole 211a provided in the guide plate 211, and imaging by the imaging means 5 becomes possible. Further, when the imaging step is completed, the control unit 8 operates the operation unit 23 to position it at the shielding position indicated by a two-dot chain line in FIG. At this time, the connecting member 234 of the operating means 23 operates the switch operating piece 711 of the open / close switch 71 as shown by a two-dot chain line in FIG. 4, and the open / close switch 71 is opened (OFF). Therefore, power is supplied to the image sensor 53 constituting the imaging unit 5 only while the above-described imaging process is performed. For this reason, since power is not supplied to the image pickup device 53 constituting the image pickup means 5 except for the image pickup step, heat is not accumulated in the image pickup device 53 and the case 54 holding the image pickup device 53 is thermally expanded. Therefore, it is possible to prevent the image from being shifted.

  On the other hand, since the shielding means 20 is positioned at the shielding position indicated by a two-dot chain line in FIG. 4 except for the imaging step, the optical system 52 constituting the imaging means 5 is shielded by the shielding member 22. Accordingly, in the above cutting process, the cutting operation is performed while supplying cutting water to the cutting blade 43 and the cutting portion. Therefore, the cutting water 43 and the contamination are scattered by the rotation of the cutting blade 43. The shielding member 22 shields the optical system 52 of the imaging means 5 from contamination.

  As mentioned above, although the example which applied this invention to the cutting device was shown, even if it applies this invention to other processing apparatuses, such as a laser processing apparatus, there exists the same effect.

The principal part perspective view of the cutting device as a processing means comprised according to this invention. The block block diagram which shows the imaging means and control means with which the cutting apparatus shown in FIG. 1 is equipped. The flowchart which shows the control procedure of the control means shown in FIG. The perspective view which shows the state which attached the shielding means to the imaging means with which the cutting apparatus shown in FIG. 1 is equipped. The perspective view which decomposes | disassembles and shows the shielding means shown in FIG.

Explanation of symbols

2: Device housing of cutting device 3: Chuck table 31: Chuck table support base 32: Suction chuck 33: Clamp 4: Spindle unit 41: Spindle housing 42: Rotating spindle 43: Cutting blade 5: Imaging means 51: Housing 52: Optical System 53: Image sensor 54: Case 6: Display means 7: Power supply circuit 70: Power supply 71: Open / close switch 711: Switch operating piece 8: Control means 9: Switch operating means (Act)
DESCRIPTION OF SYMBOLS 10: Semiconductor wafer 11: Cassette mounting table 12: Cassette 13: Temporary placement table 14: Unloading means 15: 1st conveyance means 16: Cleaning means 17: 2nd conveyance means 20: Shielding means 21: Guide member 22: Shielding member 23: Actuating member

Claims (2)

A chuck table for holding a workpiece, an image pickup unit having an optical system and an image sensor for imaging the workpiece held on the chuck table, and a workpiece held on the chuck table. In a processing apparatus comprising: a processing unit; a moving unit that moves the chuck table in a processing feed direction including an imaging region of the imaging unit; and a control unit that controls the imaging unit, the processing unit, and the moving unit. ,
An open / close switch is disposed in a power supply circuit that supplies power to the image sensor,
The control means closes the open / close switch when performing the imaging process by the imaging means, and opens the open / close switch when the imaging process by the imaging means is completed.
A processing apparatus characterized by that. A chuck table for holding a workpiece, an imaging system including an optical system and an imaging device for imaging the workpiece held on the chuck table, and a shield for shielding the imaging system from below the optical system In a processing apparatus comprising: a shielding means having a shielding member that operates to an open position that opens a position and a position below the optical system; and a processing means that processes a workpiece held on the chuck table.
An open / close switch disposed in a power supply circuit for supplying electric power to the image pickup device and opened and closed in conjunction with the operation of the shielding means;
The open / close switch is configured to open when the shielding plate of the shielding means is positioned at the shielding position, and to be closed when the shielding plate is positioned at the open position.
A processing apparatus characterized by that.

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