JP2008232502A - 電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器 - Google Patents

電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器 Download PDF

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Publication number
JP2008232502A
JP2008232502A JP2007070777A JP2007070777A JP2008232502A JP 2008232502 A JP2008232502 A JP 2008232502A JP 2007070777 A JP2007070777 A JP 2007070777A JP 2007070777 A JP2007070777 A JP 2007070777A JP 2008232502 A JP2008232502 A JP 2008232502A
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Japan
Prior art keywords
thermal
heat
conductor
water
circuit board
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Pending
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JP2007070777A
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English (en)
Japanese (ja)
Inventor
Yasumasa Nagao
保正 長尾
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Priority to JP2007070777A priority Critical patent/JP2008232502A/ja
Priority to KR1020070040594A priority patent/KR100890602B1/ko
Publication of JP2008232502A publication Critical patent/JP2008232502A/ja
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/001—Details of machines, plants or systems, using electric or magnetic effects by using electro-caloric effects

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Water Treatment By Sorption (AREA)
JP2007070777A 2007-03-19 2007-03-19 電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器 Pending JP2008232502A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007070777A JP2008232502A (ja) 2007-03-19 2007-03-19 電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器
KR1020070040594A KR100890602B1 (ko) 2007-03-19 2007-04-26 전자 열교환소자를 이용한 열교환 모듈 및 그 모듈을이용한 정수기

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007070777A JP2008232502A (ja) 2007-03-19 2007-03-19 電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器

Publications (1)

Publication Number Publication Date
JP2008232502A true JP2008232502A (ja) 2008-10-02

Family

ID=39905509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007070777A Pending JP2008232502A (ja) 2007-03-19 2007-03-19 電子熱交換素子を用いた熱交換モジュールおよび当該モジュールを用いた浄水器

Country Status (2)

Country Link
JP (1) JP2008232502A (ko)
KR (1) KR100890602B1 (ko)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012073018A (ja) * 2010-09-29 2012-04-12 Ind Technol Res Inst 熱電型飲用装置及び熱電ヒートポンプ
JP2013044520A (ja) * 2011-08-23 2013-03-04 Industrial Technology Research Inst 給水器
KR101272195B1 (ko) 2011-10-31 2013-06-07 (주) 엠티이엑스 열전소자를 이용한 정수기
JP2013245933A (ja) * 2012-05-28 2013-12-09 Industrial Technology Research Inst 給水機とそれに使用される熱電ヒートポンプ装置
KR101490341B1 (ko) * 2013-05-08 2015-02-11 최병규 냉온수 시스템
CN106007294A (zh) * 2016-07-21 2016-10-12 北京绿创生态科技有限公司 一种用于污泥的组合式管道加热装置
CN108662806A (zh) * 2018-05-24 2018-10-16 郑州大学 一种基于电热效应的两相流制冷装置
CN109962153A (zh) * 2019-03-24 2019-07-02 朱梁锋 一种稳定的热电器件
CN110108061A (zh) * 2019-05-23 2019-08-09 哈尔滨工业大学 一种小功率半导体多级低温制冷装置
FR3105821A1 (fr) * 2019-12-31 2021-07-02 Altran Prototypes Automobiles Dispositif thermique de chauffage et de refroidissement.

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170034302A (ko) 2015-09-18 2017-03-28 주식회사 대창 열교환 모듈
KR102436204B1 (ko) * 2021-02-18 2022-08-25 최병규 반도체 소자 테스트 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200168479Y1 (ko) * 1999-09-03 2000-02-15 주식회사케이제이엘 하이텍 금속기판의 열전냉온소자를 이용한 정수기
JP2007030419A (ja) * 2005-07-28 2007-02-08 Yasumasa Nagao 構造体およびその製造方法、並びに多層構造の構造体およびその製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9310110B2 (en) 2010-09-29 2016-04-12 Industrial Technology Research Institute Thermoelectric drinking apparatus and thermoelectric heat pump
JP2012073018A (ja) * 2010-09-29 2012-04-12 Ind Technol Res Inst 熱電型飲用装置及び熱電ヒートポンプ
JP2013044520A (ja) * 2011-08-23 2013-03-04 Industrial Technology Research Inst 給水器
KR101272195B1 (ko) 2011-10-31 2013-06-07 (주) 엠티이엑스 열전소자를 이용한 정수기
US9310113B2 (en) 2012-05-28 2016-04-12 Industrial Technology Research Institute Thermoelectric heat pump apparatus
JP2013245933A (ja) * 2012-05-28 2013-12-09 Industrial Technology Research Inst 給水機とそれに使用される熱電ヒートポンプ装置
KR101490341B1 (ko) * 2013-05-08 2015-02-11 최병규 냉온수 시스템
CN106007294A (zh) * 2016-07-21 2016-10-12 北京绿创生态科技有限公司 一种用于污泥的组合式管道加热装置
CN108662806A (zh) * 2018-05-24 2018-10-16 郑州大学 一种基于电热效应的两相流制冷装置
CN109962153A (zh) * 2019-03-24 2019-07-02 朱梁锋 一种稳定的热电器件
CN109962153B (zh) * 2019-03-24 2023-08-15 浙江东仑电气科技有限公司 一种稳定的热电器件
CN110108061A (zh) * 2019-05-23 2019-08-09 哈尔滨工业大学 一种小功率半导体多级低温制冷装置
FR3105821A1 (fr) * 2019-12-31 2021-07-02 Altran Prototypes Automobiles Dispositif thermique de chauffage et de refroidissement.

Also Published As

Publication number Publication date
KR20080085622A (ko) 2008-09-24
KR100890602B1 (ko) 2009-03-25

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