JP2008228945A - Production method of game board and game board for pinball game machine manufactured by this production method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production method of a game board and a game board which facilitate production control by easier formation of ground holes for fixing game nails. <P>SOLUTION: In the production method of the game board, mask members 61 in which light-transmitting holes 61a letting a laser light pass are formed in plurality to match an array pattern of the game nails are disposed on a base material 11a and a plurality of ground holes are formed simultaneously to fix the game nails by the laser light passing through the light-transmitting holes by irradiating an area including the plurality of light-transmitting holes 61a with the laser light from above the mask members to obtain a base material 11b in which the ground holes are formed at a prescribed pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  In the present invention, a plurality of game nails are fixed in a predetermined arrangement pattern on the front side of a base material, and a ball that plays a game by rolling and dropping the game balls launched into the game area on the plurality of game nails The present invention relates to a game board manufacturing method and a game board for gaming machines.

  Conventionally, laminated plywood (veneer board) using beech material or lauan material has been widely used as a base material for game boards used in ball game machines, and a decorative cell board is bonded to the upper surface of this base material. After that, holes for attaching various game parts such as center ornaments and winning devices, driving game nails, etc. are performed, and the game board is completed by mounting the game parts (for example, patent documents) 1). On the other hand, in recent years, the price of laminated plywood, which is the material of the base material, has soared, and problems with mass consumption of wood have been pointed out from the viewpoint of natural environment protection, and attempts to use synthetic resin as a substrate material to replace laminated plywood Is being implemented at each gaming machine manufacturer.

JP 2006-239193 A

  However, when a game nail is driven into a base material made of a resin material, there is a problem that the resin material corresponding to the volume is pushed away by the driven nail and a distortion is generated in the surrounding area. For example, when the base material is formed of a transparent resin material and a liquid crystal display panel or the like is disposed behind the base material, there is a problem that the image displayed on the liquid crystal display panel appears distorted around the game nail, Even when the base material is formed of an opaque resin material, the surroundings of the game nail appear to rise due to the reflected light on the board surface, which has been pointed out as an unfavorable appearance design.

  On the other hand, in order to reduce the above distortion, if a pilot hole for fixing a game nail is drilled by machining using a multi-axis drilling machine or the like, a large amount of time is required for machining a large number of pilot holes exceeding 200 per unit. There is a problem that productivity does not increase, and there is a problem that setup is not easy because it is necessary to change the setting of the tool arrangement according to the gauge setting when changing the production model. In addition, the tool is easily damaged by the large amount of heat generated during resin processing, and it is difficult to maintain a constant value due to fluctuations in the hole diameter when the tool continues to heat up. There is a problem that production management is complicated.

  The present invention has been made in view of the problems as described above, and can easily form a pilot nail fixing hole for solving a problem of distortion peculiar to a resin base material, thereby facilitating production management. An object is to provide a game board production method and a game board.

  In order to solve the above problems and achieve the object, the present invention has a plurality of game nails fixed in a predetermined arrangement pattern on the front side of the base material, and the game balls launched into the game area are ejected to the game nails. This is a method of manufacturing a game board used in a ball game machine that plays a game by rolling and falling. In this game board manufacturing method, a mask member (for example, the first mask member 61 in the embodiment) in which a plurality of light transmitting holes that transmit laser light are formed in accordance with the array pattern of game nails is formed on a resin base material. A plurality of pilot holes are formed simultaneously for fixing the game nail by irradiating a laser beam onto a region including a plurality of light transmitting holes from above the mask member and transmitting the laser light through each light transmitting hole. Thus, it is configured to obtain a base material in which a plurality of pilot holes are formed in a predetermined arrangement pattern.

  In the present invention, the processing region in the substrate is divided into a plurality of regions, and the divided region range is set as a laser light irradiation region (for example, the irradiation region 67 in the embodiment), and the laser light irradiation region in the processing region is defined as the laser light irradiation region. It is preferable that the plurality of pilot holes positioned in each divided region range are simultaneously formed by switching sequentially.

  In the present invention, a part of the processing region in the substrate is a laser light irradiation region (for example, the irradiation region 68 in the embodiment), and the laser light irradiation region is moved in the processing region while being positioned in the irradiation region. It is also preferable that the plurality of prepared holes be formed at the same time.

  The present invention according to claim 4 is a game board for a ball game machine manufactured by the manufacturing method according to claims 1 to 3.

  In the game board manufacturing method according to the present invention, a mask member in which a plurality of laser light transmitting holes are formed in accordance with an array pattern (gauge setting) of game nails is provided on a base material, and a plurality of mask members are provided from above. The region including the light transmitting holes is irradiated with laser light to simultaneously form a plurality of pilot holes in the irradiation region, and a substrate having a plurality of pilot holes formed in a predetermined arrangement pattern is obtained. . For this reason, it is possible to manufacture a game board in which a pilot hole is processed reasonably and quickly in a simple manufacturing process in which a mask member matching the arrangement pattern of game nails is covered and laser light is irradiated from above. it can. Further, since it is non-contact machining, tool management like a multi-axis drilling machine, hole diameter fluctuation due to overheating of the tool, and the like do not occur, and production management can be facilitated. Furthermore, when the production model is changed, only the mask member needs to be changed to match the gauge setting of the new model, and the setup can be completed in a short time.

  According to the configuration in which the processing region is divided into a plurality of regions, the divided region range is set as the laser light irradiation region, and the irradiation regions are sequentially switched to simultaneously process a plurality of pilot holes in each region range. Compared to batch processing by irradiating the entire processing area with laser light, the laser light irradiation area becomes narrower, so the power density of the laser beam in the irradiation area can be increased, and the processing time for each area is shortened. In addition, it is possible to construct a production system using a laser oscillator having a lower output than in the case of batch processing, thereby reducing the production cost. In addition, by narrowing the laser light irradiation area, it becomes easy to maintain high uniformity of the beam intensity in the irradiation area, and the variation in pilot hole dimensions (diameter and depth) depending on the processing position is suppressed. Processing uniformity can be improved.

  Also, in a configuration in which a part of the processing region is a laser light irradiation region and a plurality of pilot holes positioned in the irradiation region are simultaneously processed while moving the irradiation region, the laser beam in the irradiation region is also similar to the above. The power density can be increased, and the uniformity of the beam intensity can be easily kept high. Therefore, by constructing a production system using a relatively low-power laser oscillator, production costs can be reduced, and variations in pilot hole dimensions (diameter and depth) depending on the processing position can be suppressed. Uniformity can be improved.

  According to the game board for a ball game machine manufactured by the manufacturing method as described above, since the prepared holes of the game nail are uniformly formed at appropriate positions, the game board is not distorted by the placement of the game nail. Therefore, it is possible to obtain a game board in which game nails are securely fixed.

  Therefore, according to the present invention, it is possible to easily form a pilot nail fixing hole for solving a problem of distortion peculiar to a resin base material, and to provide a production method of a game board and a game board that facilitate production management. be able to.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. As an example of a ball game machine equipped with a game board to which the present invention is applied, a front view of a pachinko machine PM is shown in FIG. 1, and a front view of a game board 10 mounted on the pachinko machine PM is shown in FIG. First, the overall configuration of the pachinko machine PM will be outlined with reference to these drawings.

  In the pachinko machine PM, a front frame 2 for opening and closing mounted on a front surface of an outer frame 1 configured to have a predetermined frame size of an outer rectangular shape and forming a vertically fixed holding frame is formed on the front surface of the opening and closing of the rectangular frame size corresponding to this. The frame hinge mechanisms 3a and 3b arranged on the upper left and right sides of the front side are attached to the front so as to be able to be opened and closed laterally and attached to and detached from each other. When connected, they are kept closed.

  On the front side of the front frame 2, a rectangular glass door 5 and a bowl unit 6 adapted to the front side area are assembled so that they can be opened and closed sideways and attached / detached by hinge mechanisms 7 a, 7 b, 7 c provided on the left side of the front side. Attached and always kept closed using the locking device 4. A launch handle 8 for performing a launch operation of the game ball is provided at the lower right side of the ball tray unit 6. An upper part of the front frame 2 is provided with an accommodation frame that detachably accommodates and holds the game board 10, and the game board 10 configured with a predetermined gauge setting is detachably attached to the accommodation frame. The player is allowed to face the game area PA on the front through the glass window of the glass door 5 held closed.

  The game board 10 is based on a rectangular plate-like base material 11, and a substantially circular game area PA in which a game ball can roll is formed on the front side of the game board 10 and surrounded by guide rails 12. The game area PA has a large number of game nails 13 and windmills 14 as well as various prize-winning devices 15 such as a fixed prize 15a, movable prizes 15b and 15c, and a start gate 15d. And a liquid crystal display panel 25 that is attached to the back side of the central ornament 20 and displays an image corresponding to the game development. At the lower end of the game area PA, there is provided an out port 16 through which a game ball that has fallen without falling into the winning device 15 is discharged to the back surface of the game board 10. Each part of the pachinko machine is provided with an electrical decoration device 28 that is blinked in accordance with game development.

  Although not shown in detail on the back side of the front frame 2 located behind the game board 10, a mechanism set board called a back set board is attached to a ball storage tank or a ball payout device. And a ball processing mechanism such as a game ball discharge passage for guiding game balls such as safe balls and out balls discharged from the game board 10 to a collection device of the game facility. In addition, on each part of the rear surface of the back set board, there are a main control board that comprehensively controls the operation of the pachinko machine PM, and an operation of the liquid crystal display panel 25, the electric decoration device 28, a speaker, etc. In accordance with the operation signal from the launching handle 8 and the control board for controlling the operation of the ball dispensing device based on the command signal from the main control board. Various circuit boards such as a launch control board for controlling the operation of the game ball launcher are attached, and these are connected by a connector cable so that the pachinko machine PM can be operated.

  In the pachinko machine PM generally configured as described above, as shown in FIG. 3, the game board 10 includes a rectangular plate-like base material 11, a game nail 13 and a windmill. 14 is driven into and fixed to form a board 31, where the arc-shaped guide rail 12, the out port 16, a rail member 17 provided with a fixing hole of a clamp mechanism for fixing the game board, etc., a fixed prize 15 a And movable prizes 15b and 15c, a winning device 15 such as a start gate 15d, a central ornament 20 and the like are sequentially attached.

  The substrate 11 is made of a resin material such as polycarbonate (PC), acrylic resin (PMMA), or ABS resin having a plate thickness of 8 to 15 mm. For example, in the pachinko machine PM according to the present embodiment, a polycarbonate having a plate thickness of about 10 mm is used. Configured. Here, when the game nail 13 or the windmill 14 is directly driven and fixed to the base material 11, a large distortion is generated around the nail, causing various problems as described above. Further, the winning device 15, the central ornament 20, the rail member 17 and the like are attached to the substrate 11 with fixing screws such as wood screws and tapping screws. However, the resin material as described above has a higher density than wood and is directly attached to the fixing screws. It is difficult to screw in. Therefore, in the present invention, a hole machining is performed according to the gauge setting of the game board 10 using a laser machining system.

  FIG. 4 is a block diagram showing an outline of a laser processing system 50 that performs hole processing. The processing system 50 includes a laser oscillator 51 and a laser beam (output beam) LB output from the laser oscillator 51. A table having a folding mirror 52 that folds downward, a beam shaping optical system 53 that shapes the output beam LB into a beam mode suitable for processing, a condensing optical system 54 that condenses the output beam, and a table 55t on which the equipment 11 is placed. A processing stage 55 for moving the equipment 11 placed thereon in the XY directions (horizontal and vertical directions of the equipment 11), a control device 58 for controlling the operation of the entire system, and the like are included.

  The laser oscillator 51 is a laser oscillator that has a high absorption rate for a resin material to be processed and can obtain a relatively high-power laser beam. For example, a CO2 laser with a wavelength λ = 10.6 μm or a YAG with λ = 1.06 μm is used. A laser oscillator in the infrared region such as a laser or a laser oscillator in the ultraviolet region such as a KrF with a wavelength λ = 249 nm and an ArF excimer laser with a λ = 193 nm that does not cause carbonization by ablation processing although the absorption rate is not so high. can do.

  The beam shaping optical system 53 is an optical system that shapes the output beam LB output from the laser oscillator 51 into a parallel beam having a beam mode and a beam diameter suitable for pilot hole processing, and irradiates the substrate 11 with, for example, A beam homogenizer that shapes an output beam with a power density of Gaussian distribution into a flat-top mode with a uniform power density, a beam expander that expands the beam diameter of the output beam to the required irradiation diameter, and the expanded irradiation light on the substrate surface A collimating lens for making a parallel light beam perpendicular to the light beam, a beam splitter for removing the reflected light from the processing region, and the like, and is provided so as to be able to enter and leave the optical path of the output beam LB. A beam shaped and irradiated by the beam shaping optical system 53 is referred to as an irradiation beam.

  The condensing optical system 54 is an optical system that condenses the output beam LB output from the laser oscillator 51 and irradiates the base 11 with, for example, a condensing lens having a focal length f of about 5 to 10 inches. It is configured and provided so as to be able to enter and exit the optical path of the output beam LB. A beam focused and irradiated by the focusing optical system 54 is referred to as a focused beam.

  The processing stage 55 is an XY table including a table 55t on which the base material 11 is placed and a drive mechanism 55d that moves the table 55t in a plane (XY plane) orthogonal to the laser beam. The drive mechanism 55d is configured by, for example, a servo motor that moves the table 55t to the X axis and the Y axis, a ball screw, and the like.

  In the laser processing system 50, a base material 11 in an unprocessed state is loaded onto the table 55t, and a loading / unloading device for unloading the processed base material 11 is placed on the base material 11 as the processing steps progress. A masking device 57 for sequentially attaching and detaching the mask members 61, 62, 63 for drilling is provided. In addition, a machining area is formed in which a machining area near the machining stage is surrounded by a shielding wall that shields scattered light. The operation of each part of the laser processing system 50 is controlled by the NC controller 58.

  Next, the manufacturing method of the game board in the said processing system 50 is demonstrated, referring each figure of FIGS. Here, FIG. 5 is an explanatory diagram in which changes in the hole machining process (upper stage) by the laser machining system 50 and the base material 11 (lower stage) machined in each machining process are arranged in time series (1) to (5). FIGS. 6 to 8 are explanatory views showing each of (2), (3), and (4) in FIG. 5 in an enlarged manner, and FIG. 9 is a stage after the hole machining by the laser machining system 50 is completed (in FIG. 5). FIG. 5A is a front view of the base material 11 in a state (5), and FIG. 5B is a front view of the base material 11 in a state where the game nail 13 and the windmill 14 are driven on the surface of the base material by an automatic nailing machine. In the present embodiment, 3 using the first, second, and third mask members 61, 62, and 63 in which a plurality of types and a large number of holes formed in the base material 11 are formed for each type of the holes. An example of a configuration in which the process is divided into a pilot hole drilling step and a fourth drilling step without using a mask member is shown.

  As shown in FIG. 5 (1), the base material 11 has a common form part determined by the model of the front frame 2 regardless of the model of the pachinko machine PM. For example, the outer shape of the base material, the insertion hole 32 of the clamp mechanism for fixing the game board, the game-completed ball discharge passage 33 that is located behind the out port 16 and discharges the out-ball, and the position of the position in processing and assembly of the game board There are three positioning holes 35 serving as a reference. For this reason, such a common form part is delivered in the state formed in the base material 11 previously. For convenience of the following description, the base material 11 on which the common form portion has been formed in advance as described above is referred to as a base material 11a, and the base formed by the steps of FIGS. Subscripts b to e are attached to the material 11 and expressed as base materials 11 b to 11 e.

  The base material 11a carried into the processing stage 55 by a carrying-in / out device not shown in detail is positioned and fixed on the table 55t using the positioning holes 35. When the positioning and fixing of the base material 11 a is detected, in the laser processing system 50, the first mask member 61 is mounted on the base material 11 a by the masking device 57 and is positioned at the reference position using the positioning hole 35. Attach and hold.

  The first step drilling (FIG. 5 (2) and FIG. 6) using the first mask member 61 is a processing step for forming a pilot hole for driving and fixing the game nail 13 and the windmill 14, and the first mask. The member 61 is formed with a plurality of light transmitting holes 61 a, 61 a, 61 a... That allow the laser beam to pass therethrough at the driving positions of the game nail 13 and the windmill 14 determined based on the gauge setting of the game board 10. The first mask member 61 (and second and third mask members 62 and 63 to be described later) is configured to reflect or absorb laser light in a region other than the light transmitting hole 61a.

For example, when a CO ₂ laser is used as the laser oscillator 51, a plate material made of copper or aluminum having a high reflectance with respect to light having a wavelength λ = 10.6 μm is used, and the laser beam is placed on the plate surface at a position that matches the gauge setting. A transparent hole 61a is formed by drilling a transparent hole. Alternatively, a transparent hole 61a is formed in the same manner as described above using a plate material made of aluminum or copper having a high thermal conductivity, and an absorption layer having a high light absorptance at a wavelength λ = 10.6 μm is formed on the surface of the plate material with a black alumite treatment. Or by a means such as carburizing treatment or ceramic spraying. In this case, in order to release the absorbed heat, the entire first mask member 61 is cooled by cooling means such as forming a water channel inside the first mask member 61 and flowing cooling water.

The hole diameter of the light transmitting hole 61a is such that the game nail 13 and the windmill 14 that are driven in while suppressing the occurrence of distortion of the base material 11 are securely fixed and held without loosening. Is set smaller. For example, when the outer diameter φ _{1 of the} nail is φ ₁ = 1.8 mm, the hole diameter d ₁ of the light transmitting hole 61a is set to about d ₁ = 0.8 to 1.5 mm.

  Then, in the first to third hole processing, the condensing optical system 54 is retracted outside the optical path, the beam shaping optical system 53 is set and held in the optical path, and the CW (continuous wave) oscillation is performed. A laser beam is emitted from 51, and an irradiation beam with uniform beam intensity is irradiated from above the base material 11 a whose upper surface is covered with the first mask member 61. The irradiation beam irradiated on the mask member is removed only by irradiating the base material 11a through the light transmission hole 61a to the base material 11a only at the part where the light transmission hole 61a is formed. . At this time, an appropriate assist gas is injected into the processing region, and the exhausted and vaporized resin is removed by a suction device.

As a result, a round hole having a diameter corresponding to the hole diameter d ₁ of the light transmitting hole 61a is formed at the position where the light transmitting hole 61a is provided, and the game nail 13 and the windmill 14 are driven into positions that match the gauge setting. A pilot hole 71 is formed. The game hole 13 and the windmill nail pilot hole 71 may be in the form of a through-hole penetrating the front and back of the base material 11 or in the form of a blind hole that does not reach the back surface.

  When the first-stage drilling is completed, in the laser processing system 50, the first mask member 61 is removed by the masking device 57, and the second nail 13 and the windmill nail pilot hole 71 are formed on the base material 11b. A mask member 62 is mounted and positioned and held at the reference position using the positioning hole 35 as described above.

  The second-stage drilling using the second mask member 62 (FIG. 5 (3) and FIG. 7) is performed by the winning device 15 such as the fixed winning device 15a, the movable winning devices 15b and 15c, the start gate 15d, and the rail member 17. , A processing step of forming a pilot screw fixing hole for fixing a gaming component such as the central ornament 20, and the second mask member 62 has a gauge setting of the gaming board 10 and each gaming component 15 a, 15 b, 15 c, 15 d, A plurality of light transmitting holes 62a, 62a, 62a... For transmitting the laser beam are formed at predetermined positions determined based on the screw hole positions 17 and 20. Similarly to the first mask member 61, the second mask member 62 is configured to reflect or absorb laser light in a region other than the light transmitting hole 62a, and is provided with a cooling unit.

The hole diameter of the light transmitting hole 62a is smaller than the outer diameter of the fixing screw in order to securely hold the game nail 13 and the windmill 14 that are driven in without restraining the distortion of the base material 11 due to the fixing screw being screwed in. Is set. For example, when the nominal diameter φ _{2 of the} fixing screw is φ ₂ = 3, the hole diameter d ₂ of the light transmitting hole 62a is set to about d ₂ = 1.8 to 2.4 mm.

  Then, a laser beam is emitted from the CW-oscillated laser oscillator 51, and an irradiation beam whose beam intensity is made uniform by the beam shaping optical system 53 from above the base material 11 b whose upper surface is covered with the second mask member 62. Irradiate. As for the irradiation beam irradiated on the mask member, only the beam at the part where the light transmitting hole 62a is formed is irradiated to the base material 11b through the light transmitting hole 62a, and the base material at each part is melted and vaporized to be removed. . An appropriate assist gas is injected into the processing region, and the resin that has been exhausted and vaporized by a suction device is removed.

Thus, the position where light-transmitting hole 62a is provided, is formed a circular hole with a diameter corresponding to hole diameter d ₂ of the light-transmitting hole 62a, game parts 15a at a position that matches the gauge setting, 15b, 15c, 15d, A pilot hole 72 for fixing screws 17 and 20 is formed. The fixing screw pilot hole 72 may be in the form of a through-hole or a blind hole, but considering the processing time, it is preferably a blind hole having a depth of about 5 to 8 mm. In the case of using a through hole, the first mask member 61 is provided with a light transmitting hole 62a, so that a nail pilot hole 71 and a fixing screw pilot hole 72 are simultaneously formed, and the second step is omitted. can do.

  When the second stage hole machining is completed, in the laser machining system 50, the second mask member 61 is removed by the masking device 57, and the base 11c on which the pilot hole 71 of the game nail and the pilot hole 72 of the fixing screw are formed. The third mask member 63 is attached to the base plate, and is positioned and held at the reference position using the positioning hole 35.

  In the third stage hole drilling using the third mask member 63 (FIG. 5 (4) and FIG. 8), the various game parts 15a, 15b, 15c, 15d, 17, 20 is a processing step for forming a positioning hole for fitting and receiving a positioning projection protrudingly formed on the back surface side, and the third mask member 63 has a gauge setting of the game board 10 and each game component. A plurality of light transmitting holes 63a, 63a, 63a,... For transmitting the laser beam are formed at predetermined positions determined based on the positioning projection forming positions 15a, 15b, 15c, 15d, 17, 20. Similarly to the first mask member 61 and the second mask member 62 described above, the third mask member 63 is configured to reflect or absorb laser light in a region other than the light transmitting hole 63a, and is provided with a cooling unit. .

The hole diameter of the light transmitting hole 63a is set to be the same as or slightly larger than the outer diameter of the positioning protrusion in order to position each gaming component by fitting and receiving the positioning protrusion. For example, the outer diameter φ ₃ of the positioning protrusion is φ ₃ In the case of = 2 mm, the hole diameter d ₃ of the light transmitting hole 63a is set to about d ₃ = 2.0 to 2.2 mm.

  Then, the output mode of the laser oscillator 51 is switched to pulse oscillation to emit a laser beam, and the beam intensity is made uniform by the beam shaping optical system 53 from above the base material 11c whose upper surface is covered with the third mask member 63. Irradiate the irradiated beam. Of the irradiation beam irradiated on the mask member, only the beam at the part where the light transmitting hole 63a is formed is irradiated to the base material 11c through the light transmitting hole 63a, and the base material at each part is melted and vaporized to be removed. . An appropriate assist gas is injected into the processing region, and the resin that has been exhausted and vaporized by a suction device is removed. By processing with a pulse wave, excessive penetration can be prevented and the accuracy of the diameter and depth of the processed hole can be ensured.

Thus, the position where the light-transmitting hole 63a is provided, is formed a circular hole with a diameter corresponding to the hole diameter d ₃ of the light-transmitting hole 63a, the game component 15a at a position that matches the gauge setting, 15b, 15c, 15d , 17 and 20 are formed. The positioning hole 73 may be a through-hole, but is preferably a blind hole having a depth of about 3 mm in consideration of processing time. When the hole depth is set to the same depth as the hole 72, the second mask member 62 is provided with the light transmitting hole 63a (or the third mask member 63 is provided with the light transmitting hole 62a), and the lower hole is provided. 72 and the positioning hole 73 can be formed at the same time, and the third step (or the second step) can be omitted.

  The irradiation area of the irradiation beam in the first to third stages of hole processing using the first, second, and third mask members 61, 62, and 63 described above is a large number of game nails distributed on the plate surface. The entire processing area on the substrate is set by setting the area range including all of the pilot holes 71 (first stage), the pilot holes 72 (second stage) of many fixing screws, and the multiple positioning holes 73 (third stage). Can be configured to be collectively irradiated (the manufacturing method of the first embodiment). According to the manufacturing method of the first embodiment as described above, holes for each type can be collectively formed by a simple production process that does not involve table movement.

  On the other hand, the processing region of the substrate 11 is divided into a plurality of regions, and the divided region range is set as the irradiation region of the irradiation beam, and the irradiation regions are sequentially switched to simultaneously form a plurality of pilot holes positioned in each region range. It can be configured (manufacturing method of the second embodiment). For example, as shown in an area 67 surrounded by a two-dot chain line in FIG. 6, an irradiation area 67 is set by dividing the processing area for the base material 11 into four areas, and each irradiation area 67 is irradiated with a beam for a predetermined time. A plurality of pilot holes 71 (first stage) such as a plurality of game nails located inside are formed simultaneously. Then, the processing stage 55 moves the table 55t in the X direction and the Y direction to sequentially switch the irradiation position of the irradiation beam on the base material, and all the pilot holes 71 can be formed by four irradiations. The same applies to the second-stage prepared hole 72 and the third-stage positioning hole 73, and irradiation is performed for each divided region according to the hole depth to be formed, and the hole processing is completed.

  According to the manufacturing method of the second embodiment, the power density of the irradiation beam can be increased according to the number of divisions of the processing region (for example, when the number of divisions is 4, the power density is quadrupled). ). For this reason, the processing time per unit hole, which takes time in batch exposure, can be shortened in relation to the melting threshold energy of the resin material and the heat conduction inside the material, thereby reducing the overall processing time of all processed holes. It can be shortened. Moreover, since the required laser output of the laser oscillator 51 can be reduced according to the number of divisions, a production system can be constructed using a relatively small laser oscillator, and the production cost can be reduced. Further, by setting the irradiation area narrow, the beam magnification can be reduced to reduce the size and cost of the beam shaping optical system 53, and the uniformity of the beam intensity within the irradiation area can be easily kept high. Therefore, it is possible to improve the uniformity of the pilot hole machining by suppressing variations in the pilot hole dimensions (diameter and depth) depending on the machining position.

  Further, a part of the processing region of the base material 11 can be used as an irradiation region of the irradiation beam, and a plurality of pilot holes positioned in the irradiation region can be simultaneously processed while moving the irradiation region (third embodiment). Form manufacturing method) For example, a part of a processing region (for example, about 100 mm square) with respect to the base material 11 is set as an irradiation region 68 of the irradiation beam as shown by a region 68 surrounded by a two-dot chain line in FIG. The stage 55t is moved in the X direction and the Y direction by the stage 55, and a plurality of prepared holes 71 located in the irradiation area 68 are simultaneously processed while scanning the processed area where the prepared holes 71 to be processed exist at a predetermined speed. . By making the moving speed of the table constant, the processing time per unit hole can be made the same, and all holes can be formed by scanning the processing region where the pilot hole 71 to be processed exists. . The same applies to the second-stage prepared hole 72 and the third-stage positioning hole 73, and scanning is performed at a moving speed corresponding to the hole depth to be formed, and the hole processing is completed.

  According to the manufacturing method of the third embodiment, the power density of the irradiation beam can be increased according to the size of the irradiation region 68 (for example, when the irradiation region 68 is 100 mm square, the power density is About 20 times the total exposure). For this reason, since the machining time per unit hole can be shortened and the whole machining time of the hole machining can be shortened, and the required laser output of the laser oscillator 51 can be reduced according to the size of the irradiation region, a small laser A production system using an oscillator can be constructed to reduce production costs. In addition, the beam magnification can be reduced to reduce the size and cost of the beam shaping optical system 53, and it becomes easy to maintain high uniformity of the beam intensity in the irradiation region. Variation in (diameter and depth) can be suppressed, and the uniformity of the prepared hole processing can be improved. Furthermore, in the manufacturing method of the present embodiment, it is only necessary to scan a region where a hole to be processed exists. That is, in the gauge setting of the game board 10, the area where the game nail 13 is present only needs to be scanned in a U-shape (paradoxically, the area where the hole to be processed does not exist is not scanned), further reducing the processing time. While being possible, it is possible to suppress the irradiation of ineffective energy, improve the processing efficiency, and reduce the processing cost.

  Now, when the first through third stages of hole machining are completed in this way, in the laser machining system 50, the third mask member 61 is removed by the masking device 57 and has been disposed on the optical path so far. The beam shaping optical system 53 is retracted outside the optical path, and instead, the condensing optical system 54 is disposed on the optical path, and the fourth-stage drilling without using the mask member is started.

  In the fourth stage of drilling (FIGS. 5 (5) and 9 (a)), fixed parts 15a, movable prizes 15b and 15c, start gate 15d, rail member 17, central ornament 20 and other gaming parts are mounted. In the control process 58, the position and hole position of the component mounting holes based on the gauge setting of the game board 10 and the component shapes of the game components 15a, 15b, 15c, 15d, and 20 are provided in the control device 58. The shape and the position and hole diameter of the mounting guide hole for facilitating the mounting of the rail member 17 are preset and stored.

  The control device 58 switches the output mode of the laser oscillator 51 to CW oscillation again and moves the table 55t by the processing stage 55 so that the focused spot of the focused beam is positioned at the processing start point of the component mounting hole. The material 11d is moved, and thereafter the table 55t is moved in the XY direction in a state in which the laser beam is emitted, so that mounting holes are sequentially formed. For example, at the component mounting hole 78 of the central ornament 20, the table 55t is moved so that the focused spot of the focused beam is positioned at the machining start point 78a marked with x in FIG. A hole is drilled at a point 78a, and then the component mounting hole 78 of the central ornament 20 is cut by moving the irradiation position of the focused beam along the hole shape of the mounting hole 78 as shown by an arrow 78b in the figure. Process. An appropriate assist gas is injected into the processing region, and the resin that has been exhausted and vaporized by a suction device is removed. The mounting holes 75, 75... Of the other game parts 15a, 15b, 15c, 15d and the mounting guide holes 77, 77.

  Thereby, game part mounting holes and mounting guide holes 75, 77, 78 for mounting game parts are formed in each part of the base material 11, and the game nails 13 are formed in the base material 11 by the above-described first to fourth hole processing. And the hole processing for mounting and fixing the windmill 14 and the various game parts 15a, 15b, 15c, 15d, 17, 20 is completed. The control device 58 returns the table 55t to the origin position on the processing stage 55, and unloads the base material 11e after the hole processing by the loading / unloading device and moves it to the nail driving line.

  In the nail driving line, the game nail 13 and the windmill 14 are driven into a large number of pilot holes 71, 71... Formed by the first stage drilling, and the board body 31 shown in FIGS. A base for attaching game parts is formed and transferred to a game board assembly line for assembling game parts. In the game board assembly line, various games are made using the positioning holes 73 formed in the base material 11 by the third stage hole processing, the mounting guide holes 77 formed by the fourth stage hole processing, and the component mounting holes. The parts 15a, 15b, 15c, 15d, 17, and 20 are positioned and mounted at predetermined positions, and fixedly screwed into the prepared holes 72 formed in the base material 11 by the second stage hole processing. And the liquid crystal display panel 25 is attached to the back side of the central ornament 20, and the game board 10 is configured by wiring connection of each game component.

  As described above, in the game board manufacturing method according to the present invention, the mask members 61, 62, and 63 in which the laser light transmitting holes are formed in accordance with the gauge setting of the game board 10 are formed on the base material 11. A plurality of pilot holes 71 and 72 and positioning holes 73 that match the gauge setting are formed in a predetermined arrangement pattern by arranging and irradiating a laser beam from above to simultaneously form a plurality of holes in the irradiation region. It is comprised so that the obtained base material 11d may be obtained.

  For this reason, a game board in which holes are drilled reasonably and quickly in a simple manufacturing process in which mask members 61, 62 and 63 that match the gauge setting of the pachinko machine are covered and laser light is irradiated from above. Can be manufactured. Since the first to fourth stages of hole drilling by the laser machining system 50 are non-contact machining, problems such as tool damage and hole diameter fluctuation due to overheating of the tool do not occur, and processes resulting from these problems Production management can be facilitated by reducing management. In addition, when changing a production model with a different gauge setting, only the corresponding mask member needs to be replaced with a new model, and the setup associated with the model change can be completed in a short time.

  Therefore, according to the present invention, it is possible to easily form a pilot hole for solving the problem of distortion peculiar to a resin base material, and to provide a game board production method and a game board that facilitate production control. it can.

  In the embodiment described above, the case where the present invention is applied to a pachinko machine has been described. However, the present invention can be applied to other types of ball game machines such as an arrangement ball machine and a sparrow ball game machine, and the same effect is obtained. Can be obtained.

It is a front view of the pachinko machine shown as an example of the gaming machine to which the present invention is applied. It is a front view of the game board in the said pachinko machine. It is explanatory drawing which shows the general components structure of the said game board. It is a block diagram which shows the laser processing system outline | summary which performs a hole processing. It is explanatory drawing which arranged the process of the hole processing by the said laser processing system, and the change of the base material processed in each processing process to (1)-(5) in time series. It is explanatory drawing which expands and shows the state of (2) in FIG. It is explanatory drawing which expands and shows the state of (3) in FIG. It is explanatory drawing which expands and shows the state of (4) in FIG. FIG. 5A is a front view of the base material at the stage where the hole processing by the laser processing system has been completed, and FIG. 5B is a front view of the state where the game nail and the windmill are driven into the base material after the hole processing has been completed.

Explanation of symbols

PM Pachinko machine (ball game machine)
PA game area LB Laser beam 10 Game board 11 Base material (11a to 11e Processing base material)
13 game nail 50 laser processing system 57 masking device 61 first mask member (61a light transmitting hole)
67 Laser beam irradiation area 68 Laser light irradiation area 71 Pilot holes for fixing game nails

Claims (4)

A plurality of game nails are fixed in a predetermined arrangement pattern on the front side of the base material, and a ball ball game machine that performs a game by rolling and falling while letting the game balls launched into the game area be played by the plurality of game nails A method of manufacturing a game board used,
A mask member in which a plurality of light transmitting holes that transmit laser light are formed in accordance with the array pattern of the game nails is disposed on the resin base material,
From above the mask member, simultaneously form a plurality of pilot holes for fixing the game nail by irradiating the laser light to a region including a plurality of the light transmitting holes and transmitting each light transmitting hole,
A method for manufacturing a game board, comprising: a base material in which the plurality of prepared holes are formed in the predetermined arrangement pattern.   The processing region in the substrate is divided into a plurality of regions, and the divided region range is set as a laser light irradiation region, and the irradiation region is sequentially switched in the processing region, and a plurality of regions located in each divided region range 2. The game board manufacturing method according to claim 1, wherein the pilot holes are formed simultaneously.   A part of the processing area in the base material is a laser light irradiation area, and a plurality of pilot holes located in the irradiation area are formed simultaneously while moving the irradiation area in the processing area. A method for manufacturing a game board according to claim 1.   A game board for a ball game machine manufactured by the manufacturing method according to claim 1.

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