JP2008227249A - Electronic circuit component mounter - Google Patents

Electronic circuit component mounter Download PDF

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JP2008227249A
JP2008227249A JP2007064935A JP2007064935A JP2008227249A JP 2008227249 A JP2008227249 A JP 2008227249A JP 2007064935 A JP2007064935 A JP 2007064935A JP 2007064935 A JP2007064935 A JP 2007064935A JP 2008227249 A JP2008227249 A JP 2008227249A
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rotary head
nozzle
electronic circuit
rotation
head
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JP4939984B2 (en
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Toru Takahama
透 高浜
Takeshi Kato
剛 加藤
Takanori Suzuki
崇記 鈴木
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/52Improvements relating to the production of bulk chemicals using catalysts, e.g. selective catalysts

Abstract

<P>PROBLEM TO BE SOLVED: To improve the practical usefulness of an electronic circuit component mounter that moves forward and backward a suction nozzle in relation to a nozzle holding member by the relative displacement of a rotary head and a forward/backward driving member in an axial direction parallel to the axis of rotation. <P>SOLUTION: A lever driving member rotating around the axis of the rotation of a rotary head is engaged with a turnable lever as the rotary head comes down in a relative phase corresponding to a suction nozzle for receiving an electronic circuit component, thus turning the lever and moving downward the suction nozzle relative to a head body. After the rotary head moves down, the head goes up while rotating, and in synchronization with the rotation, the lever driving member is rotated, thus moving up the suction nozzle while turning it relative to the head body. After the rotary lever has left the lever driving member, the latter is rotated in an inverse direction, which is, then, rotated again in synchronization with the rotary head in a phase corresponding to the suction nozzle for receiving the electronic circuit component, and the suction nozzle comes down while rotating with the decline of the rotary head, thus sucking the electronic circuit component. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子回路部品装着装置に関するものであり、特に、実用性の向上に関するものである。   The present invention relates to an electronic circuit component mounting apparatus, and particularly relates to improvement of practicality.

電子回路部品装着装置には、下記の特許文献1に記載されているように、複数の吸着ノズルを備えたロータリヘッドにより電子回路部品を装着する装置がある。特許文献1に記載のロータリヘッドは、鉛直な回転軸線まわりに回転可能かつ昇降可能なノズル保持部材を備え、ノズル保持部材には、その回転軸線を中心とする一円周上に複数の吸着ノズルが等角度間隔に配設され、ノズル保持部材の回転により、複数の吸着ノズルが順次、部品受取位置へ回転させられる。複数の吸着ノズルはまた、ノズル保持部材に、それの回転軸線に平行な方向に移動可能に保持されており、それら複数の吸着ノズルの各々に対応してノズル保持部材にノズル選択装置の回動レバーが回動可能に保持されていて、それら回動レバーが各吸着ノズルと連携させられている。ノズル保持部材を回転させる回転装置の回転体には、駆動部材がノズル保持部材の回転軸線のまわりに、ノズル保持部材に対して回転可能に設けられており、ロータリヘッドの下降に伴って回動レバーが駆動部材に係合して回動し、複数の吸着ノズルのうち、電子回路部品の受取りあるいは装着を行う吸着ノズルがノズル保持部材に対して下降させられる。
特開2006−261325公報
An electronic circuit component mounting apparatus includes an apparatus for mounting an electronic circuit component by a rotary head including a plurality of suction nozzles as described in Patent Document 1 below. The rotary head described in Patent Document 1 includes a nozzle holding member that can rotate and move up and down around a vertical rotation axis, and the nozzle holding member includes a plurality of suction nozzles on a circumference around the rotation axis. Are arranged at equal angular intervals, and the plurality of suction nozzles are sequentially rotated to the component receiving position by the rotation of the nozzle holding member. The plurality of suction nozzles are also held by the nozzle holding member so as to be movable in a direction parallel to the rotation axis thereof, and the nozzle selection device rotates on the nozzle holding member corresponding to each of the plurality of suction nozzles. The levers are rotatably held, and the rotary levers are associated with the respective suction nozzles. The rotating body of the rotating device that rotates the nozzle holding member is provided with a drive member that can rotate relative to the nozzle holding member around the rotation axis of the nozzle holding member, and rotates as the rotary head descends. The lever engages with the driving member and rotates, and among the plurality of suction nozzles, the suction nozzle for receiving or mounting the electronic circuit component is lowered with respect to the nozzle holding member.
JP 2006-261325 A

特許文献1に記載の電子回路部品装着装置によれば、多数の電子回路部品をまとめて部品供給装置から受け取って搬送し、回路基板に装着することができ、また、ロータリヘッドの昇降を利用して吸着ノズルをノズル保持部材に対して昇降させることができ、実用性の高い装置であるが、例えば、吸着ノズルが電子回路部品を部品供給装置から受け取るのに要する時間の短縮等、更に実用性を高くする余地がある。
本発明は、以上の事情を背景として為されたものであり、ロータリヘッドと駆動部材とのロータリヘッドの回転軸線と平行な軸方向の相対移動により吸着ノズルをノズル保持部材に対して軸方向に進退させる形式の電子回路部品装着装置の実用性をさらに向上させることを課題とする。
According to the electronic circuit component mounting device described in Patent Document 1, a large number of electronic circuit components can be collectively received from the component supply device, transported, and mounted on the circuit board. The suction nozzle can be moved up and down with respect to the nozzle holding member, and it is a highly practical device. For example, it is more practical such as shortening the time required for the suction nozzle to receive the electronic circuit component from the component supply device. There is room to raise.
The present invention has been made against the background described above, and the suction nozzle is moved axially relative to the nozzle holding member by the relative movement of the rotary head and the drive member in the axial direction parallel to the rotational axis of the rotary head. It is an object of the present invention to further improve the practicality of an electronic circuit component mounting apparatus of a type that advances and retreats.

上記の課題は、(a)複数種類の電子回路部品を供給する部品供給装置と、(b)回転軸線まわりに回転可能なノズル保持部材に、前記回転軸線の周囲にそれぞれその回転軸線に平行な軸方向に進退可能に複数の吸着ノズルが配設されたロータリヘッドと、(c)前記回転軸線まわりに回転可能に設けられ、前記複数の吸着ノズルから選択される選択ノズルに対応する相対位相においてその選択ノズルを軸方向に進退させる進退駆動部材と、(d)前記ロータリヘッドを前記回転軸線まわりに回転させる第1回転駆動装置と、(e)前記進退駆動部材を前記回転軸線まわりに前記ロータリヘッドとは別に回転させる第2回転駆動装置と、(f)前記進退駆動部材と前記ロータリヘッドとを前記回転軸線と平行な軸方向に相対移動させることにより、前記進退駆動部材に前記選択ノズルを進退させる進退駆動装置と、(g)その進退駆動装置および前記第1,第2回転駆動装置を制御することにより、前記複数の吸着ノズルの各々に受取位置において前記部品供給装置から電子回路部品を受け取らせ、装着位置において回路基板に装着させる装着制御装置とを含む電子回路部品装着装置の装着制御装置を、ロータリヘッドを複数の吸着ノズルの1つが選択ノズルとなる回転位相へ回転させるとともに、そのロータリヘッドと進退駆動部材とを、その進退駆動部材が先に機能する選択ノズルである先行選択ノズルに対応する第1相対位相から次に機能する吸着ノズルである次選択ノズルに対応する第2相対位相へ相対回転させ、かつ、それら第1相対位相および第2相対位相における進退駆動部材およびロータリヘッドの回転と前記軸方向の相対移動との少なくとも一部を並行して生じさせる並行制御部を含むものとすることにより解決される。
ノズル保持部材の回転軸線は、鉛直な軸線でもよく、鉛直方向に対して傾斜した軸線でもよい。
The above-mentioned problems are: (a) a component supply device that supplies a plurality of types of electronic circuit components; and (b) a nozzle holding member that can rotate around the rotation axis, and the rotation axis is parallel to the rotation axis. A rotary head provided with a plurality of suction nozzles capable of moving back and forth in the axial direction, and (c) provided in a relative phase corresponding to a selected nozzle selected from the plurality of suction nozzles provided to be rotatable around the rotation axis. An advance / retreat drive member for moving the selected nozzle back and forth in the axial direction; (d) a first rotation drive device for rotating the rotary head about the rotation axis; and (e) an advance / retreat drive member about the rotation axis. A second rotation drive device that rotates separately from the head; and (f) the advance / retreat drive member and the rotary head are moved relative to each other in an axial direction parallel to the rotation axis, An advance / retreat drive device for advancing / retreating the selected nozzle; and (g) controlling the advance / retreat drive device and the first and second rotation drive devices so that each of the plurality of suction nozzles receives the component supply device A mounting control device for an electronic circuit component mounting device including a mounting control device for receiving an electronic circuit component and mounting the electronic circuit component on a circuit board at a mounting position, and rotating the rotary head to a rotation phase in which one of a plurality of suction nozzles is a selected nozzle. The rotary head and the advancing / retreating drive member correspond to the next selection nozzle that is the next functioning suction nozzle from the first relative phase corresponding to the preceding selection nozzle that is the selection nozzle that the advancing / retreating drive function first. Relative to the second relative phase, and the forward / backward drive member and the rotary head in the first relative phase and the second relative phase. It is solved by rotating the to include parallel control unit generating in parallel at least a portion of the relative movement of the axial direction.
The rotation axis of the nozzle holding member may be a vertical axis or an axis inclined with respect to the vertical direction.

上記選択ノズルは、進退駆動部材により軸方向に進退させられて、電子回路部品の部品供給装置からの受取り、あるいは回路基板への装着を行い得る状態にある吸着ノズルであり、進退駆動部材の「選択ノズルに対応する相対位相」は、進退駆動部材が選択ノズルを軸方向に進退させ得る相対位相である。したがって、進退駆動部材がある程度の広がりを有する相対角度範囲で選択ノズルを進退させる場合には、上記相対位相はその角度範囲を意味し、進退駆動部材が選択ノズルと一定不変の相対角度を保って選択ノズルを進退させる場合には、上記相対位相はその一定不変の相対角度を意味することとなる。
一般に、ロータリヘッドに保持された複数の吸着ノズルに、例えば部品供給装置から電子回路部品を受け取らせる際、複数の吸着ノズルを順次部品受取位置へ回転させるとともに、軸方向に進退させるのであるが、この吸着ノズルの回転と進退との少なくとも一部を同時期に生じさせること、すなわち回転と進退との少なくとも一部を並行させることが、部品受取りに要する時間を短縮する上で望ましい。
その点、本発明においては、先に選択されて前進位置にある先行選択ノズルの後退と、後退位置にある次選択ノズルの前進との両方において、吸着ノズルの回転と進退との少なくとも一部が並行させられるため、特に有効に時間短縮を行うことができ、電子回路部品装着装置の実用性が高められる。複数の吸着ノズルは順次機能位置(受取位置あるいは装着位置)へ回転させられて、電子回路部品の受取りあるいは装着の機能を果たす選択ノズルとなるのであるが、進退駆動部材は、先行選択ノズルを後退させた後、その先行選択ノズルに対応する第1相対位相から、次選択ノズルに対応する第2相対位相へ相対回転させられて、その次選択ノズルを前進させる。その際の吸着ノズル(ロータリヘッド)および進退駆動部材の回転と、進退駆動部材の軸方向の進退との少なくとも一部が、並行制御部により並行させられるのである。
なお、ロータリヘッドに保持されている複数の吸着ノズルの1つが選択されて選択ノズルとなるのであるが、この選択ノズルが電子回路部品の受取りと装着との少なくとも一方を行う回転位相が一定であり、かつ、吸着ノズルが並び順に選択ノズルとされる場合には、ロータリヘッドが吸着ノズルの配設ピッチ角ずつ回転させられることとなる。この場合には本発明を適用することが特に容易であるが、それに限定されるわけではない。極端な例を挙げれば、ロータリヘッドに保持されている複数の吸着ノズルのいずれかが任意の順序で選択ノズルとされ、任意の回転位相で受取りあるいは装着を行わされる場合に、本発明を適用することも可能なのである。回路基板上の各装着点とそれら装着点に順次装着されるべき電子回路部品を吸着している各吸着ノズルとの距離が可及的に短くなるように、電子回路部品の装着順序が決められる場合がその一例であり、その場合には、ロータリヘッドの回転角度も進退駆動部材の回転角度も一定ではなくなるが、吸着ノズルおよび進退駆動部材の回転と吸着ノズルの進退との少なくとも一部を並行させることは可能であり、そうすれば本発明の効果が得られるのである。
The selection nozzle is an adsorption nozzle that is advanced and retracted in the axial direction by the advance / retreat drive member and is ready to receive the electronic circuit component from the component supply device or to be mounted on the circuit board. The “relative phase corresponding to the selected nozzle” is a relative phase at which the advance / retreat driving member can advance and retract the selected nozzle in the axial direction. Therefore, when the advance / retreat drive member advances / retreats the selected nozzle within a relative angle range having a certain extent, the relative phase means the angle range, and the advance / retreat drive member keeps a constant angle unchanged from the selected nozzle. When the selected nozzle is advanced or retracted, the relative phase means a constant angle that does not change.
In general, when a plurality of suction nozzles held by a rotary head are to receive electronic circuit components from, for example, a component supply device, the plurality of suction nozzles are sequentially rotated to the component receiving position and moved back and forth in the axial direction. It is desirable to cause at least a part of the rotation and advance / retreat of the suction nozzle at the same time, that is, to make at least a part of the rotation and advance / retreat parallel to reduce the time required for receiving the parts.
In this regard, in the present invention, at least a part of the rotation and advancement / retraction of the suction nozzle is both in the backward movement of the preceding selection nozzle that is selected first and in the forward movement position, and in the forward movement of the next selection nozzle in the backward movement position. Since it is made parallel, time can be shortened especially effectively, and the practicality of the electronic circuit component mounting apparatus is enhanced. The plurality of suction nozzles are sequentially rotated to a functional position (receiving position or mounting position) to become a selection nozzle that performs a function of receiving or mounting an electronic circuit component, but the advance / retreat driving member moves the preceding selection nozzle backward. After that, the relative rotation is performed from the first relative phase corresponding to the preceding selection nozzle to the second relative phase corresponding to the next selection nozzle, and the next selection nozzle is advanced. At this time, at least a part of the rotation of the suction nozzle (rotary head) and the advance / retreat drive member and the advance / retreat of the advance / retreat drive member in the axial direction are made parallel by the parallel control unit.
One of the plurality of suction nozzles held by the rotary head is selected and becomes a selection nozzle, but the rotation phase at which this selection nozzle performs at least one of receiving and mounting of electronic circuit components is constant. When the suction nozzles are selected in the order of arrangement, the rotary head is rotated by the pitch pitch angle of the suction nozzles. In this case, it is particularly easy to apply the present invention, but it is not limited thereto. In an extreme example, the present invention is applied when any of a plurality of suction nozzles held by a rotary head is selected as an arbitrary order and is received or mounted at an arbitrary rotational phase. It is also possible to do. The mounting order of the electronic circuit components is determined so that the distance between each mounting point on the circuit board and each suction nozzle that sucks the electronic circuit components to be sequentially mounted at the mounting points is as short as possible. In this case, the rotation angle of the rotary head and the rotation angle of the advance / retreat drive member are not constant, but at least a part of the rotation of the suction nozzle and the advance / retreat drive member and the advance / retreat of the suction nozzle are performed in parallel. It is possible to obtain the effect of the present invention.

発明の態様Aspects of the Invention

以下に、本願において特許請求が可能と認識されている発明(以下、「請求可能発明」という場合がある。請求可能発明は、少なくとも、請求の範囲に記載された発明である「本発明」ないし「本願発明」を含むが、本願発明の下位概念発明や、本願発明の上位概念あるいは別概念の発明を含むこともある。)の態様をいくつか例示し、それらについて説明する。各態様は請求項と同様に、項に区分し、各項に番号を付し、必要に応じて他の項の番号を引用する形式で記載する。これは、あくまでも請求可能発明の理解を容易にするためであり、請求可能発明を構成する構成要素の組み合わせを、以下の各項に記載されたものに限定する趣旨ではない。つまり、請求可能発明は、各項に付随する記載,実施例の記載,従来の技術等を参酌して解釈されるべきであり、その解釈に従う限りにおいて、各項の態様にさらに他の構成要素を付加した態様も、また、各項の態様から構成要素を削除した態様も、請求可能発明の一態様となり得るのである。   In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, the prior art, and the like. An aspect in which is added, and an aspect in which constituent elements are deleted from the aspect of each item can also be an aspect of the claimable invention.

なお、以下の各項において、(1)項が請求項1に相当し、(2)項が請求項2に、(3)項が請求項3に、(5)項が請求項4に、(6)項が請求項5に、それぞれ相当する。   In each of the following terms, (1) corresponds to claim 1, (2) corresponds to claim 2, (3) corresponds to claim 3, (5) corresponds to claim 4, (6) corresponds to claim 5 respectively.

(1)複数種類の電子回路部品を供給する部品供給装置と、
回転軸線まわりに回転可能なノズル保持部材に、前記回転軸線の周囲にそれぞれその回転軸線に平行な軸方向に進退可能に複数の吸着ノズルが配設されたロータリヘッドと、
前記回転軸線まわりに回転可能に設けられ、前記複数の吸着ノズルから選択される選択ノズルに対応する相対位相においてその選択ノズルを軸方向に進退させる進退駆動部材と、
前記ロータリヘッドを前記回転軸線まわりに回転させる第1回転駆動装置と、
前記進退駆動部材を前記回転軸線まわりに前記ロータリヘッドとは別に回転させる第2回転駆動装置と、
前記進退駆動部材と前記ロータリヘッドとを前記回転軸線と平行な軸方向に相対移動させることにより、前記進退駆動部材に前記選択ノズルを進退させる進退駆動装置と、
その進退駆動装置および前記第1,第2回転駆動装置を制御することにより、前記複数の吸着ノズルの各々に受取位置において前記部品供給装置から電子回路部品を受け取らせ、装着位置において回路基板に装着させる装着制御装置と
を含み、かつ、前記装着制御装置が、前記ロータリヘッドを前記複数の吸着ノズルの1つが選択ノズルとなる回転位相へ回転させるとともに、そのロータリヘッドと前記進退駆動部材とを、その進退駆動部材が先に機能する(電子回路部品の受取りあるいは装着を行う)選択ノズルである先行選択ノズルに対応する第1相対位相から次に機能する吸着ノズルである次選択ノズルに対応する第2相対位相へ相対回転させ、かつ、それら第1相対位相および第2相対位相における進退駆動部材およびロータリヘッドの回転と前記軸方向の相対移動との少なくとも一部を並行して生じさせる並行制御部を含む電子回路部品装着装置。
(2)前記並行制御部が、前記ロータリヘッドの回転に基づく前記吸着ノズルの回転および進退駆動部材の回転と、前記吸着ノズルの進退とを並行させる間、進退駆動部材と前記ロータリヘッドとを同速度で回転させる同速回転制御部を含む(1)項に記載の電子回路部品装着装置。
同速回転制御部を設ければ、吸着ノズルおよび進退駆動部材の回転と、吸着ノズルの進退とが並行させられる間、進退駆動部材と、選択ノズルを進退させるための被駆動部材とが相対移動せず、両者の相対移動を許容するためのローラ等の転動部材を必要としないため、装置の構成を単純化し得る。
(3)前記進退駆動部材と係合して駆動される被駆動部材を備え、進退駆動部材と前記ロータリヘッドとの軸方向の相対移動を、前記吸着ノズルの前記ノズル保持部材に対する進退運動に変換する運動変換機構を含み、かつ、その運動変換機構が、前記軸方向の相対移動のストローク範囲のうち少なくとも前記吸着ノズルの後退端近傍に対応する範囲においては前記被駆動部材が前記進退駆動部材から離間して、運動変換機能を果たさなくなるものである(1)項または(2)項に記載の電子回路部品装着装置。
本項の運動変換機構を含む電子回路部品装着装置においては、被駆動部材が進退駆動部材から離間している間は、ロータリヘッドと進退駆動部材とが相対回転させられても、被駆動部材と進退駆動部材との間にすべりは生じない。したがって、被駆動部材が進退駆動部材から離間している期間を利用して、進退駆動部材が先行選択ノズルに対応する第1相対位相から、次選択ノズルに対応する第2相対位相へ、進退駆動部材とロータリヘッドとを相対回転させれば、進退駆動部材と被駆動部材との間にすべりが生じず、両者の相対移動を許容するためのローラ等転動部材を必要としなくなる。
(4)前記吸着ノズルを後退方向へ付勢する付勢装置を含み、前記進退駆動部材が、その付勢装置の付勢力に抗して被駆動部材を駆動し、吸着ノズルを前進させるものである(3)項に記載の電子回路部品装着装置。
付勢装置は、吸着ノズルを直接付勢するものでもよく、被駆動部材等、吸着ノズル以外の部材を付勢することにより吸着ノズルを間接的に付勢するものでもよい。
付勢装置の付勢により被駆動部材が進退駆動部材から離間し、吸着ノズルを、進退駆動部材の支持によることなく、後退位置に位置する状態に保つことができる。複数の吸着ノズルがノズル保持部材とは別の支持部材によって前進方向から支持されて後退位置に保たれるのであれば、吸着ノズルが後退位置において支持部材により支持される状態が得られるように、吸着ノズルの進退とロータリヘッドの回転とのタイミングを図ることが必要であるが、本項の電子回路部品装着装置においては、吸着ノズルがノズル保持部材によって支持されるため、ロータリヘッドと進退駆動部材との相対回転および前記並行制御が容易となる。
(5)前記並行制御部が、前記進退駆動部材が前記第1相対位相から脱する際に、前記ロータリヘッドの回転速度と一致した速度で回転する同期状態から回転速度を異にする状態に滑らかに移行させる軟同期離脱制御と、前記進退駆動部材が前記第2相対位相に達する際に、前記ロータリヘッドと回転速度を異にする状態から回転速度を同じくする同期状態に滑らかに移行させる軟同期移行制御との少なくとも一方を実行する徐変制御部を含む(1)項ないし(4)項のいずれかに記載の電子回路部品装着装置。
進退駆動部材は、第1相対位相で回転する状態と、第1相対位相から第2相対位相への移行の初期とにおいては、ロータリヘッドと同方向に回転し、第2相対位相への移行の中期においてはロータリヘッドと逆方向に回転し、第2相対位相への移行後期と第2相対位相で回転する状態とにおいては、再びロータリヘッドと同方向へ回転することとなる。回転方向の転換が2回行われるのであるが、この際、同期回転状態からの離脱と同期回転状態への移行との両方において徐変制御部が機能するようにすれば、進退駆動部材の回転速度の急変が良好に回避されて、電子回路部品装着装置の振動,騒音が低減させられ、電子回路部品の受取りや装着の位置精度が向上する効果が得られる。
しかし、徐変制御部が、同期回転状態からの離脱と同期回転状態への移行とのいずれか一方のみにおいて機能するものであっても、一応の効果が得られる。例えば、選択ノズルが電子回路部品の装着を行う場合に、電子回路部品装着装置の振動を低減させることができれば、装着位置精度の向上効果が得られ、実益が大きい。
なお、軟同期離脱制御や軟同期移行制御においては、与えられた時間内に進退駆動部材を必要な角度回転させることを条件として、できる限り小さな回転加速度で回転速度が変化させられることが望ましく、回転加速度の変化速度である躍動ができる限り小さくなるように回転速度が変化させられることがさらに望ましい。
第1相対位相から第2相対位相への移行は、移行開始時と終了時との各々における進退駆動部材の位置,速度および加速度をそれぞれ連続させることにより、滑らかに行なうことができるが、第2回転駆動装置の能力により許容されるのであれば、位置のみ、あるいは位置および速度のみを連続させることによっても、移行を滑らかに行なうことができる。第2回転駆動装置の能力は、例えば、駆動源がモータであれば、その容量により決められたり、第2回転駆動装置の対摩耗性によって決められる。
また、軟同期離脱制御と軟同期移行制御との少なくとも一方は、第2回転駆動装置の駆動源をサーボモータ等、回転角度の正確な制御が可能な電動モータとし、進退駆動部材の回転状態の移行が滑らかに行なわれるように電動モータを制御することにより実現することができ、あるいは、第2回転駆動装置をカムおよびカムフォロワを含むものとし、進退駆動部材の回転状態の移行が滑らかに行なわれるようにカム曲線を設定することによっても実現することができる。
(6)前記ロータリヘッドが前記回転軸線を中心とする一円周上に前記複数の吸着ノズルが等角度間隔で配設されたものであり、前記徐変制御部が、前記第1回転駆動装置の回転速度を滑らかに増大させ、滑らかに低減させて前記ロータリヘッドを前記複数の吸着ノズルの配設ピッチ角ずつ回転させるとともに、前記第2回転駆動装置の回転速度の制御により前記軟同期離脱制御と前記軟同期移行制御との少なくとも一方を実現するものである(5)項に記載の電子回路部品装着装置。
本態様は、ロータリヘッドの一定角度ずつの間欠的な回転により、そのロータリヘッドに保持されている複数の吸着ノズルのうち一定の回転位相に達したものに、電子回路部品の受取りあるいは装着を行わせる場合に好適である。
本態様においても、ロータリヘッドの回転速度が、与えられた時間で吸着ノズルの配設ピッチ角ずつ回転させることを条件として、できる限り小さな回転加速度、できる限り小さな躍動で変化させられることが望ましい。
(7)前記徐変制御部が、前記軟同期離脱制御と前記軟同期移行制御との両方を行う(5)項または(6)項に記載の電子回路部品装着装置。
同期回転状態からの離脱と同期回転状態への移行との両方において電子回路部品装着装置の振動,騒音が低減させられる。
(1) a component supply device that supplies a plurality of types of electronic circuit components;
A rotary head in which a plurality of suction nozzles are arranged around a rotation axis so as to be able to advance and retreat in an axial direction parallel to the rotation axis, around the rotation axis;
An advancing / retreating drive member that is rotatably provided around the rotation axis and moves the selected nozzle in the axial direction in a relative phase corresponding to the selected nozzle selected from the plurality of suction nozzles;
A first rotation drive device for rotating the rotary head around the rotation axis;
A second rotation drive device for rotating the advance / retreat drive member around the rotation axis separately from the rotary head;
An advancing / retreating drive device for advancing / retreating the selected nozzle by the advancing / retreating drive member by relatively moving the advancing / retreating drive member and the rotary head in an axial direction parallel to the rotation axis;
By controlling the forward / backward drive device and the first and second rotary drive devices, each of the plurality of suction nozzles receives electronic circuit components from the component supply device at the receiving position and is mounted on the circuit board at the mounting position. And the mounting control device rotates the rotary head to a rotational phase in which one of the plurality of suction nozzles becomes a selection nozzle, and the rotary head and the advancing / retreating drive member, The advancing / retreating drive member functions first (corresponding to the next selection nozzle corresponding to the suction nozzle functioning next from the first relative phase corresponding to the preceding selection nozzle corresponding to the selection nozzle that receives or mounts the electronic circuit component). Two relative phases, and the forward / backward drive member and the rotary head in the first relative phase and the second relative phase. An electronic circuit component mounting apparatus including a parallel control unit that generates at least a part of rotation of the door and relative movement in the axial direction in parallel.
(2) While the parallel control unit makes the rotation of the suction nozzle and the rotation of the advance / retreat driving member based on the rotation of the rotary head parallel with the advancement / retraction of the suction nozzle, the advance / retreat drive member and the rotary head are made the same. The electronic circuit component mounting device according to item (1), including a same-speed rotation control unit that rotates at a speed.
If the same speed rotation control unit is provided, the advancing / retreating drive member and the driven member for advancing / retreating the selected nozzle are relatively moved while the suction nozzle and the advance / retreat driving member are rotated in parallel with the advancement / retraction of the suction nozzle. Without the need for a rolling member such as a roller for allowing relative movement between the two, the configuration of the apparatus can be simplified.
(3) A driven member that is engaged with and driven by the advance / retreat drive member is provided, and the relative movement in the axial direction between the advance / retreat drive member and the rotary head is converted into an advance / retreat movement of the suction nozzle with respect to the nozzle holding member. And the driven member is moved away from the advanced / retracted drive member in a range corresponding to at least the vicinity of the retracted end of the suction nozzle in the axial relative movement stroke range. The electronic circuit component mounting device according to item (1) or (2), wherein the electronic circuit component mounting device is separated and no longer performs the motion conversion function.
In the electronic circuit component mounting apparatus including the motion conversion mechanism according to this section, while the driven member is separated from the advance / retreat drive member, even if the rotary head and the advance / retreat drive member are relatively rotated, No slip occurs between the advancing and retracting drive members. Therefore, using the period during which the driven member is separated from the advance / retreat drive member, the advance / retreat drive member is driven to advance / retreat from the first relative phase corresponding to the preceding selection nozzle to the second relative phase corresponding to the next selection nozzle. If the member and the rotary head are rotated relative to each other, no slip occurs between the advancing / retreating driving member and the driven member, and a rolling member such as a roller for allowing the relative movement of both of them is not necessary.
(4) A biasing device that biases the suction nozzle in the backward direction is included, and the advance / retreat driving member drives the driven member against the biasing force of the biasing device to advance the suction nozzle. The electronic circuit component mounting apparatus according to item (3).
The biasing device may directly bias the suction nozzle, or may indirectly bias the suction nozzle by biasing a member other than the suction nozzle, such as a driven member.
The driven member is separated from the advance / retreat drive member by the urging of the urging device, and the suction nozzle can be kept in the retracted position without being supported by the advance / retreat drive member. If the plurality of suction nozzles are supported from the forward direction by the support member different from the nozzle holding member and are maintained in the retracted position, the state where the suction nozzle is supported by the support member in the retracted position is obtained. Although it is necessary to aim at the timing of the advancement / retraction of the suction nozzle and the rotation of the rotary head, in the electronic circuit component mounting apparatus of this section, the suction nozzle is supported by the nozzle holding member. Relative rotation and the parallel control are facilitated.
(5) The parallel control unit smoothly changes from a synchronous state in which the reciprocating drive member rotates at a speed that matches the rotational speed of the rotary head to a state in which the rotational speed is different when the advance / retreat driving member deviates from the first relative phase. Soft-synchronization disengagement control that shifts to, and soft-synchronization that smoothly transitions from a state in which the rotational speed is different from that of the rotary head to a synchronized state that has the same rotational speed when the advance / retreat driving member reaches the second relative phase. The electronic circuit component mounting device according to any one of (1) to (4), further including a gradual change control unit that executes at least one of transition control.
The advancing / retreating drive member rotates in the same direction as the rotary head in the state of rotating in the first relative phase and in the initial stage of transition from the first relative phase to the second relative phase, and the transition to the second relative phase is performed. In the middle period, it rotates in the opposite direction to the rotary head, and in the latter period of transition to the second relative phase and in the state rotated in the second relative phase, it rotates again in the same direction as the rotary head. The rotation direction is changed twice. At this time, if the gradual change control unit functions in both the separation from the synchronous rotation state and the transition to the synchronous rotation state, the rotation of the advance / retreat driving member is performed. An abrupt change in speed can be satisfactorily avoided, vibration and noise of the electronic circuit component mounting apparatus can be reduced, and the positional accuracy of receiving and mounting the electronic circuit components can be improved.
However, even if the gradual change control unit functions only in one of the departure from the synchronous rotation state and the transition to the synchronous rotation state, a temporary effect can be obtained. For example, when the selection nozzle mounts an electronic circuit component, if the vibration of the electronic circuit component mounting apparatus can be reduced, an effect of improving the mounting position accuracy can be obtained, and the profit is large.
In the soft synchronization separation control and the soft synchronization transition control, it is desirable that the rotational speed is changed with the smallest possible rotational acceleration on condition that the advance / retreat driving member is rotated at a necessary angle within a given time period. It is further desirable that the rotational speed be changed so that the dynamic speed, which is the change speed of the rotational acceleration, is as small as possible.
The transition from the first relative phase to the second relative phase can be smoothly performed by making the position, speed, and acceleration of the advancing / retreating driving member continuous at the start and end of the transition, respectively. If permitted by the capability of the rotary drive, the transition can be made smoothly by only continuing the position or only the position and speed. For example, if the drive source is a motor, the capacity of the second rotary drive device is determined by its capacity, or is determined by the wear resistance of the second rotary drive device.
In addition, at least one of the soft-synchronization separation control and the soft-synchronization transition control is an electric motor that can accurately control the rotation angle, such as a servo motor, as the drive source of the second rotational drive device, and the rotational state of the advance / retreat drive member It can be realized by controlling the electric motor so that the transition is performed smoothly, or the second rotational drive device includes a cam and a cam follower so that the rotational state transition of the advancing / retreating drive member can be performed smoothly. This can also be realized by setting a cam curve.
(6) In the rotary head, the plurality of suction nozzles are arranged at equal angular intervals on a circumference with the rotation axis as a center, and the gradual change control unit includes the first rotation driving device. The rotational speed of the second rotational drive device is smoothly increased and decreased, and the rotary head is rotated by an arrangement pitch angle of the plurality of suction nozzles. The electronic circuit component mounting apparatus according to item (5), which realizes at least one of the soft-synchronization transition control.
In this aspect, electronic circuit components are received or mounted on a plurality of suction nozzles held by the rotary head that have reached a certain rotational phase by intermittent rotation of the rotary head at a constant angle. It is suitable when
Also in this aspect, it is desirable that the rotational speed of the rotary head be changed with as little rotational acceleration as possible and as small as possible as long as the suction nozzle is rotated by the arrangement pitch angle for a given time.
(7) The electronic circuit component mounting device according to (5) or (6), wherein the gradual change control unit performs both the soft synchronization disconnection control and the soft synchronization transition control.
The vibration and noise of the electronic circuit component mounting apparatus can be reduced both in the separation from the synchronous rotation state and in the transition to the synchronous rotation state.

以下、請求可能発明の実施例を、図を参照しつつ詳しく説明する。なお、請求可能発明は、下記実施例の他、上記〔発明の態様〕の項に記載された態様を始めとして、当業者の知識に基づいて種々の変更を施した態様で実施することができる。   Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

図1に、請求可能発明の一実施例としての電子回路部品装着装置を含む電子回路部品装着システムが図示されている。本電子回路部品装着システムは、図1に示すように、基板搬送装置10,基板保持装置12,電子回路部品装着装置14および制御装置16(図4参照)を含む。   FIG. 1 shows an electronic circuit component mounting system including an electronic circuit component mounting apparatus as an embodiment of the claimable invention. As shown in FIG. 1, the electronic circuit component mounting system includes a substrate transfer device 10, a substrate holding device 12, an electronic circuit component mounting device 14, and a control device 16 (see FIG. 4).

基板搬送装置10は、システム本体としてのベッド30上に設けられ、例えば、ベルトコンベヤを備え、回路基板32を水平な一方向に搬送して基板保持装置12に搬入し、基板保持装置12から搬出する。基板搬送方向をX軸方向とし、回路基板32の表面であって、作業面たる部品装着面に平行な面である水平面内においてX軸方向と直交する方向をY軸方向とする。基板保持装置12は位置を固定して設けられ、図示は省略するが、例えば、回路基板32を下方から支持する基板支持装置と、回路基板32をクランプするクランプ装置とを含み、基板搬送装置10により搬入された回路基板32を水平な姿勢で保持する。   The substrate transfer device 10 is provided on a bed 30 as a system main body, and includes, for example, a belt conveyor. The substrate transfer device 10 transfers the circuit board 32 in one horizontal direction and carries it into the substrate holding device 12. To do. The substrate transport direction is the X-axis direction, and the direction perpendicular to the X-axis direction in the horizontal plane that is the surface of the circuit board 32 and is parallel to the component mounting surface as the work surface is the Y-axis direction. The substrate holding device 12 is provided with a fixed position, and although not shown in the drawings, the substrate holding device 12 includes, for example, a substrate support device that supports the circuit substrate 32 from below and a clamp device that clamps the circuit substrate 32. The circuit board 32 carried in is held in a horizontal posture.

電子回路部品装着装置14は、図1および図2に示すように、フィーダ型部品供給装置38,トレイ型部品供給装置40,ロータリヘッド42,ヘッド保持装置44,ヘッド移動装置46,ヘッド昇降装置48,ヘッド回転装置50等を含む。部品供給装置38,40は、本実施例では、ベッド30上の、基板搬送装置10に対してY軸方向に隔たった両側にそれぞれ位置を固定して設けられている。フィーダ型部品供給装置38は、フィーダ支持台と、フィーダ支持台により支持される複数のフィーダとを含む。複数のフィーダはそれぞれ、例えば、部品保持テープに1列に設けられた多数の収容凹部の各々に電子回路部品が収容され、それら電子回路部品を送り装置により順次、部品供給部に位置決めし、供給するものとされる。各フィーダは、1種類の電子回路部品を多数保持し、複数のフィーダにより複数種類の電子回路部品が供給される。トレイ型部品供給装置40は、複数の収容凹部にそれぞれ電子回路部品が収容されたトレイにより電子回路部品を供給する。トレイは複数設けられ、複数種類の電子回路部品が供給される。   As shown in FIGS. 1 and 2, the electronic circuit component mounting device 14 includes a feeder-type component supply device 38, a tray-type component supply device 40, a rotary head 42, a head holding device 44, a head moving device 46, and a head lifting device 48. , The head rotating device 50 and the like. In the present embodiment, the component supply devices 38 and 40 are provided at fixed positions on both sides of the bed 30 separated from each other in the Y-axis direction with respect to the substrate transfer device 10. The feeder-type component supply device 38 includes a feeder support base and a plurality of feeders supported by the feeder support base. Each of the plurality of feeders, for example, stores electronic circuit components in each of a plurality of receiving recesses provided in a row on the component holding tape, and sequentially positions and supplies these electronic circuit components to the component supply unit by a feeder. It is supposed to be. Each feeder holds a large number of one type of electronic circuit components, and a plurality of types of electronic circuit components are supplied by a plurality of feeders. The tray-type component supply device 40 supplies electronic circuit components by trays in which electronic circuit components are respectively stored in a plurality of receiving recesses. A plurality of trays are provided, and a plurality of types of electronic circuit components are supplied.

ヘッド移動装置46は、本実施例では、ロータリヘッド42をX軸方向およびY軸方向に移動させる装置とされており、ロータリヘッド42と基板保持装置12および部品供給装置38,40とを、基板保持装置12により保持された回路基板32の部品装着面に平行な方向に相対移動させる相対移動装置を構成している。ヘッド移動装置46は、図1に概略的に示すように、X軸方向移動装置54およびY軸方向移動装置56を含む。X軸方向移動装置54は、可動部材としてのX軸スライド60とX軸スライド移動装置62(図4参照)とを含む。X軸スライド移動装置62は、駆動源たるX軸移動用モータ64(図4参照)と、ボールねじおよびナットを含む送りねじ機構66(図4参照)とを含む。Y軸方向移動装置56はX軸スライド60上に設けられ、可動部材としてのY軸スライド70とY軸スライド移動装置72(図4参照)とを含む。Y軸スライド移動装置72は、X軸スライド移動装置62と同様に、駆動源たるY軸移動用モータ74(図4参照)と送りねじ機構76(図4参照)とを含む。X軸移動用モータ64およびY軸移動用モータ74は、例えば、電動モータの一種であるエンコーダ付サーボモータにより構成される。サーボモータは、回転角度の正確な制御が可能な電動回転モータであり、サーボモータに代えてステップモータを用いてもよい。リニアモータを用いてもよい。   In this embodiment, the head moving device 46 is a device that moves the rotary head 42 in the X-axis direction and the Y-axis direction. The rotary head 42, the substrate holding device 12, and the component supply devices 38 and 40 are connected to the substrate. The relative movement device is configured to relatively move in the direction parallel to the component mounting surface of the circuit board 32 held by the holding device 12. The head moving device 46 includes an X-axis direction moving device 54 and a Y-axis direction moving device 56, as schematically shown in FIG. The X-axis direction moving device 54 includes an X-axis slide 60 and an X-axis slide moving device 62 (see FIG. 4) as movable members. The X-axis slide moving device 62 includes an X-axis moving motor 64 (see FIG. 4) as a driving source, and a feed screw mechanism 66 (see FIG. 4) including a ball screw and a nut. The Y-axis direction moving device 56 is provided on the X-axis slide 60, and includes a Y-axis slide 70 and a Y-axis slide moving device 72 (see FIG. 4) as movable members. Similar to the X-axis slide moving device 62, the Y-axis slide moving device 72 includes a Y-axis moving motor 74 (see FIG. 4) and a feed screw mechanism 76 (see FIG. 4) as drive sources. The X-axis moving motor 64 and the Y-axis moving motor 74 are constituted by, for example, a servo motor with an encoder which is a kind of electric motor. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle, and a step motor may be used instead of the servo motor. A linear motor may be used.

図2に示すように、Y軸スライド70に前記ヘッド保持装置44,ヘッド昇降装置48,ヘッド回転装置50が設けられ、ヘッド保持装置44により保持されたロータリヘッド42等がヘッド昇降装置48およびヘッド回転装置50と共に水平面上の任意の位置へ移動させられる。   As shown in FIG. 2, the Y-axis slide 70 is provided with the head holding device 44, the head elevating device 48, and the head rotating device 50. The rotary head 42 and the like held by the head holding device 44 include the head elevating device 48 and the head. It is moved together with the rotating device 50 to an arbitrary position on the horizontal plane.

ヘッド保持装置44は、図2に示すように、装置本体たる軸状部材80および軸状部材80の下端部に一体的に設けられたヘッド保持部82を含む。軸状部材80は、横断面形状が円形を成し、外周面にスプライン84が設けられたスプライン軸部材である。ヘッド保持部82は、横断面形状が円形を成し、軸状部材80より大きい直径を有する。   As shown in FIG. 2, the head holding device 44 includes a shaft-like member 80 that is a main body of the device and a head holding portion 82 that is integrally provided at the lower end of the shaft-like member 80. The shaft member 80 is a spline shaft member having a circular cross-sectional shape and a spline 84 provided on the outer peripheral surface. The head holding portion 82 has a circular cross-sectional shape and a larger diameter than the shaft-shaped member 80.

ヘッド回転装置50は、Y軸スライド70に、基板保持装置12により保持された回路基板32の部品装着面に直角であって、鉛直な軸線まわりに回転可能に保持された回転部材としての回転体86と、回転部材駆動装置としての回転体駆動装置88とを含む。回転体駆動装置88は回転用モータ90(図4参照)を駆動源とし、その回転が回転体86に固定のギヤ92等を含む回転伝達装置により回転体86に伝達され、回転体86が鉛直軸線まわりに回転させられる。回転用モータ90は、例えば、エンコーダ付サーボモータにより構成される。回転体86は円筒状を成し、その内周面に設けられたスプライン94に軸状部材80のスプライン84が軸方向に相対移動可能かつ相対回転不能に嵌合され、回転体86の回転により軸状部材80が自身の鉛直な軸線まわりに正逆両方向に任意の角度回転させられ、ヘッド保持部82が回転させられる。軸状部材80の軸線がヘッド保持装置44の回転軸線である。   The head rotating device 50 is a rotating body as a rotating member that is held by the Y-axis slide 70 at a right angle to the component mounting surface of the circuit board 32 held by the board holding device 12 and is rotatable about a vertical axis. 86 and a rotating body driving device 88 as a rotating member driving device. The rotating body driving device 88 uses a rotation motor 90 (see FIG. 4) as a driving source, and the rotation is transmitted to the rotating body 86 by a rotation transmitting device including a gear 92 fixed to the rotating body 86. Rotated around the axis. The motor 90 for rotation is comprised by the servomotor with an encoder, for example. The rotating body 86 has a cylindrical shape, and a spline 84 of the shaft-like member 80 is fitted to a spline 94 provided on the inner peripheral surface thereof so as to be relatively movable in the axial direction but not relatively rotatable. The shaft-like member 80 is rotated by an arbitrary angle in both the forward and reverse directions around its own vertical axis, and the head holding portion 82 is rotated. The axis of the shaft-shaped member 80 is the rotation axis of the head holding device 44.

前記ヘッド昇降装置48は、図2に示すように、Y軸スライド70に昇降可能に設けられた昇降部材100と、駆動源としての昇降用モータ102(図4参照)と、Y軸スライド70に軸方向に相対移動不能かつ鉛直軸線まわりに回転可能に設けられたねじ軸としてのボールねじ104および昇降部材100に固定のナット106を含む送りねじ機構108とを含む。昇降用モータ102は、例えば、エンコーダ付サーボモータにより構成される。軸状部材80の上部は、昇降部材100により相対回転可能かつ軸方向に相対移動不能に保持されており、ボールねじ104が昇降用モータ102により回転させられ、昇降部材100が昇降させられることによりヘッド保持装置44が昇降させられる。   As shown in FIG. 2, the head elevating device 48 includes an elevating member 100 that can be moved up and down on the Y-axis slide 70, an elevating motor 102 (see FIG. 4) as a drive source, and a Y-axis slide 70. A ball screw 104 as a screw shaft provided so as not to be relatively movable in the axial direction and rotatable around a vertical axis, and a feed screw mechanism 108 including a nut 106 fixed to the elevating member 100 are included. The raising / lowering motor 102 is comprised by the servomotor with an encoder, for example. The upper part of the shaft-like member 80 is held by the elevating member 100 so as to be relatively rotatable and incapable of relative movement in the axial direction. When the ball screw 104 is rotated by the elevating motor 102, the elevating member 100 is moved up and down. The head holding device 44 is moved up and down.

軸状部材80内には、図2に示すように、その軸線上に通路110が設けられるとともに、その外側に円環状通路112が設けられ、円環状通路112は負圧ポンプ等の負圧源120に接続されている。負圧源120から円環状通路112への負圧の供給は、開閉装置122により許容,遮断される。以後、円環状通路112を負圧供給通路112と称する。   As shown in FIG. 2, the shaft-shaped member 80 is provided with a passage 110 on its axis and an annular passage 112 on the outside thereof. The annular passage 112 is a negative pressure source such as a negative pressure pump. 120. Supply of negative pressure from the negative pressure source 120 to the annular passage 112 is permitted or blocked by the opening / closing device 122. Hereinafter, the annular passage 112 is referred to as a negative pressure supply passage 112.

通路110は、図2に示すように、コンプレッサ等の正圧源124および前記負圧源120に接続されている。通路110への正圧の供給と負圧の供給とは切換装置126により切り換えられ、正圧と負圧とが択一的に供給される。切換装置126により、通路110が大気に開放された状態も得られる。以後、通路110を正圧・負圧供給通路110と称する。   As shown in FIG. 2, the passage 110 is connected to a positive pressure source 124 such as a compressor and the negative pressure source 120. Supply of positive pressure and supply of negative pressure to the passage 110 are switched by the switching device 126, and positive pressure and negative pressure are alternatively supplied. A state in which the passage 110 is opened to the atmosphere by the switching device 126 is also obtained. Hereinafter, the passage 110 is referred to as a positive pressure / negative pressure supply passage 110.

前記ヘッド保持部82は、図3に示すように、その軸線に直角な一平面状を成し、水平で下向きの吸着面130を備えている。ヘッド保持部82には、吸着面130に開口し、その軸線を中心線とする円環状の負圧室用凹部132が形成され、通路134により負圧供給通路112に連通させられている。正圧・負圧供給通路110の下端部は、吸着面130に開口させられている。   As shown in FIG. 3, the head holding portion 82 has a flat surface perpendicular to the axis thereof, and includes a horizontal and downward suction surface 130. The head holding portion 82 is formed with an annular negative pressure chamber recess 132 that opens to the suction surface 130 and has an axis thereof as a center line, and communicates with the negative pressure supply passage 112 through a passage 134. A lower end portion of the positive pressure / negative pressure supply passage 110 is opened to the suction surface 130.

前記ロータリヘッド42は、図2および図3に示すように、ノズル保持部材としてのヘッド本体138,複数、例えば、12個のノズル保持部144,部品保持具たる複数、例えば、12個の吸着ノズル146,複数のノズル保持部144の各々に対応して設けられたバルブ装置150およびノズル選択装置152を備えている。ロータリヘッド42は、特開2006−261325公報に記載のロータリヘッドと同様に構成されており、簡単に説明する。   2 and 3, the rotary head 42 includes a plurality of head main bodies 138 as nozzle holding members, for example, twelve nozzle holding portions 144, and a plurality of, for example, twelve suction nozzles as component holders. 146, a valve device 150 and a nozzle selection device 152 are provided corresponding to each of the plurality of nozzle holding portions 144. The rotary head 42 is configured in the same manner as the rotary head described in JP-A-2006-261325, and will be briefly described.

ヘッド本体138は、被保持部140を備えている。被保持部140は、横断面形状が円形の円板状を成し、図3に示すように、その軸線に直角で一平面状の被吸着面156を備えている。ロータリヘッド42は、被吸着面156が吸着面130に密着させられ、負圧室用凹部132が塞がれてヘッド吸着用負圧室158が形成され、負圧供給通路112からヘッド吸着用負圧室158に供給される負圧によりロータリヘッド42がヘッド保持装置44により吸着され、同心状に保持される。ロータリヘッド42がヘッド保持装置44により保持された状態では、ヘッド本体138は、その中心軸線が鉛直となり、ヘッド回転装置50により、鉛直な回転軸線のまわりに回転させられる。ヘッド回転装置50が第1回転駆動装置を構成している。また、ヘッド保持装置44がヘッド昇降装置48によって下降させられることにより、ロータリヘッド42が昇降させられる。ヘッド保持装置44はロータリヘッド42を着脱可能に保持し、複数のロータリヘッド42や、吸着ノズルを1つ含むシングルノズルヘッドのうちの1つを選択的に保持することができる。   The head main body 138 includes a held portion 140. The held portion 140 has a disc shape with a circular cross-sectional shape, and includes an adsorbed surface 156 that is perpendicular to the axis thereof and has a flat surface, as shown in FIG. In the rotary head 42, the suction surface 156 is brought into close contact with the suction surface 130, the negative pressure chamber recess 132 is closed to form the head suction negative pressure chamber 158, and the head suction negative pressure is supplied from the negative pressure supply passage 112. The rotary head 42 is attracted by the head holding device 44 by the negative pressure supplied to the pressure chamber 158 and held concentrically. In a state where the rotary head 42 is held by the head holding device 44, the central axis of the head main body 138 is vertical, and the head rotating device 50 is rotated around the vertical rotation axis. The head rotating device 50 constitutes a first rotation driving device. Further, the head holding device 44 is lowered by the head lifting / lowering device 48, whereby the rotary head 42 is lifted / lowered. The head holding device 44 detachably holds the rotary head 42 and can selectively hold one of a plurality of rotary heads 42 and a single nozzle head including one suction nozzle.

複数の吸着ノズル146はそれぞれノズル保持部144により保持され、ヘッド本体138に、その回転軸線を中心とする一円周上に適宜の間隔を隔てて、本ロータリヘッド42においては等角度間隔で配設されている。複数のノズル保持部144は同様に構成され、図3に示すように、それぞれ、ヘッド本体138を、その回転軸線に平行な方向に貫通して形成されたホルダ孔170を含む。これらホルダ孔170は、ヘッド本体138の回転軸線を中心とする一円周上に等角度間隔に設けられ、それぞれ、有底円筒状のノズルホルダ172が軸方向に相対移動可能に嵌合されるとともに、各ノズルホルダ172に吸着ノズル146が軸方向に相対移動可能かつ相対回転不能に嵌合され、付勢手段の一種である弾性部材としての圧縮コイルスプリング173により下方へ、ノズルホルダ172から突出する向きに付勢されている。このスプリング173の付勢による吸着ノズル146の下降限度は、吸着ノズル146に設けられた係合部たる係合突部と、ノズルホルダ172に設けられた被係合部たる長穴の下側の端面との係合により規定される。ノズルホルダ172に保持された吸着ノズル146の軸線はロータリヘッド42の回転軸線に平行となり、複数の吸着ノズル146はそれぞれ、ヘッド本体138に対してロータリヘッド42の回転軸線に平行な方向に進退可能であって、昇降可能に配設されている。   Each of the plurality of suction nozzles 146 is held by a nozzle holding portion 144, and is arranged at an equiangular interval on the rotary head 42 with an appropriate interval on the circumference of the head body 138 centered on the rotation axis thereof. It is installed. The plurality of nozzle holding portions 144 are similarly configured, and each include a holder hole 170 formed through the head main body 138 in a direction parallel to the rotation axis thereof, as shown in FIG. These holder holes 170 are provided at equal angular intervals on a circumference centered on the rotation axis of the head main body 138, and are respectively fitted with a bottomed cylindrical nozzle holder 172 so as to be relatively movable in the axial direction. At the same time, the suction nozzle 146 is fitted to each nozzle holder 172 so as to be relatively movable in the axial direction and not relatively rotatable, and protrudes downward from the nozzle holder 172 by a compression coil spring 173 as an elastic member which is a kind of biasing means. It is energized in the direction to do. The lowering limit of the suction nozzle 146 by the urging of the spring 173 is such that the engagement protrusion provided as the engagement portion provided in the suction nozzle 146 and the lower side of the elongated hole provided as the engaged portion provided in the nozzle holder 172. It is defined by the engagement with the end face. The axis of the suction nozzle 146 held by the nozzle holder 172 is parallel to the rotation axis of the rotary head 42, and each of the plurality of suction nozzles 146 can advance and retreat in a direction parallel to the rotation axis of the rotary head 42 with respect to the head body 138. And it is arranged so that it can be raised and lowered.

前記ノズル選択装置152は、図3に示すように、回動レバー174および付勢装置の一種である弾性部材としての圧縮コイルスプリング176を含む。回動レバー174は長手形状の板状を成し、ヘッド本体138に軸178により、吸着ノズル146の軸線と直角に立体交差する回動軸線のまわりに回動可能に取り付けられている。回動レバー174の1対のアーム180,182のうち、アーム180は、その先端部において、ノズルホルダ172の上端部に相対回動可能に連携させられ、アーム182は、ヘッド本体138の外へ突出させられ、その突出端部に被係合部184が設けられている。回動レバー174の連携により、ノズルホルダ172の自身の軸線まわりの回転であって、ヘッド本体138に対する回転が阻止されている。   As shown in FIG. 3, the nozzle selection device 152 includes a rotation lever 174 and a compression coil spring 176 as an elastic member which is a kind of biasing device. The rotation lever 174 has a long plate shape, and is attached to the head body 138 by a shaft 178 so as to be rotatable about a rotation axis that intersects the axis of the suction nozzle 146 at a right angle. Of the pair of arms 180 and 182 of the rotation lever 174, the arm 180 is associated with the upper end portion of the nozzle holder 172 at the tip thereof so as to be relatively rotatable, and the arm 182 is moved out of the head main body 138. It is made to protrude and the to-be-engaged part 184 is provided in the protrusion edge part. By the cooperation of the rotation lever 174, the rotation of the nozzle holder 172 about its own axis, and the rotation with respect to the head main body 138 is prevented.

上記スプリング176は、図3に示すように、アーム180とヘッド本体138との間に配設され、回動レバー174をノズルホルダ172を上昇させる向きに付勢している。スプリング176の付勢による回動レバー174の回動限度であって、ノズルホルダ172ないし吸着ノズル146のヘッド本体138に対する上昇位置は、ノズルホルダ172が、ヘッド本体138のホルダ孔170の開口を塞ぐ部分に当接することにより規定される。スプリング176の付勢による回動限度が規定された状態での回動レバー174の位置を原位置とする。ノズルホルダ172の周壁には、外周面に開口し、軸方向に延びる円環溝や円環溝の上端部とノズルホルダ172内の空間とを連通させる半径方向通路が形成され、吸着ノズル146に負圧や正圧が供給されるようにされている。   As shown in FIG. 3, the spring 176 is disposed between the arm 180 and the head main body 138, and urges the rotating lever 174 to raise the nozzle holder 172. The upper limit of the rotation of the rotation lever 174 due to the bias of the spring 176 and the rise of the nozzle holder 172 or the suction nozzle 146 relative to the head main body 138 causes the nozzle holder 172 to block the opening of the holder hole 170 of the head main body 138. It is defined by contacting the part. The position of the rotation lever 174 in a state where the rotation limit by the bias of the spring 176 is defined is the original position. The peripheral wall of the nozzle holder 172 is formed with an annular groove that opens to the outer peripheral surface and extends in the axial direction, and a radial passage that connects the upper end of the annular groove and the space in the nozzle holder 172. Negative pressure and positive pressure are supplied.

前記バルブ装置150は、図3に示すように、第1バルブ200および第2バルブ202を含む。第1バルブ200は第1バルブスプール204を備え、前記負圧供給通路112,ヘッド本体138内に設けられた負圧供給系から吸着ノズル146への負圧の供給を許容し、前記正圧・負圧供給通路110,ヘッド本体138内に設けられた正圧供給系から吸着ノズル146への正圧の供給を許容,遮断する。第2バルブ202は第2バルブスプール206を備え、上記負圧供給系から吸着ノズル146への負圧の供給を許容,遮断する。これら第1,第2バルブスプール204,206はいずれも、ヘッド本体138に、ヘッド本体138の軸線に平行な方向に相対移動可能かつ相対回転不能に嵌合されるとともに、各々の上端部に設けられた被係合部208,210は、ヘッド本体138の外周面から外へ突出させられている。第1,第2バルブスプール204,206は、ロータリヘッド42の回転軸線を中心とする円周方向において、回動レバー174に対して互いに反対側に設けられるとともに、被係合部208,210は、前記ノズル選択装置152の回動レバー174の被係合部184と、ロータリヘッド42の回転軸線を中心とする同一円周上に位置させられている。被係合部208,210が、図3に示すように、ヘッド本体138に係合する位置が第1,第2バルブスプール204,206の原位置であり、第1,第2バルブスプール204,206は、原位置に位置する状態では、各下端部はヘッド本体138から下方へ突出させられる。第1バルブスプール204は、ヘッド本体138に対して相対的に上昇させられることにより、原位置から正圧供給位置へ移動させられ、第1バルブ200が正圧供給状態に切り換えられる。第2バルブスプール206は、ヘッド本体138に対して相対的に上昇させられることにより、原位置から負圧供給位置へ移動させられ、第2バルブ202が負圧供給状態に切り換えられる。   As shown in FIG. 3, the valve device 150 includes a first valve 200 and a second valve 202. The first valve 200 includes a first valve spool 204, which allows negative pressure to be supplied to the suction nozzle 146 from a negative pressure supply system provided in the negative pressure supply passage 112 and the head body 138. The negative pressure supply passage 110 and the positive pressure supply system provided in the head main body 138 allow or block the supply of positive pressure to the suction nozzle 146. The second valve 202 includes a second valve spool 206, and allows or blocks the supply of negative pressure from the negative pressure supply system to the suction nozzle 146. Each of the first and second valve spools 204 and 206 is fitted to the head body 138 so as to be relatively movable in a direction parallel to the axis of the head body 138 and not to be relatively rotatable, and is provided at each upper end portion. The engaged portions 208 and 210 thus formed are projected outward from the outer peripheral surface of the head main body 138. The first and second valve spools 204 and 206 are provided on the opposite sides with respect to the rotation lever 174 in the circumferential direction around the rotation axis of the rotary head 42, and the engaged portions 208 and 210 are The engaged portion 184 of the rotation lever 174 of the nozzle selecting device 152 and the rotation axis of the rotary head 42 are positioned on the same circumference. As shown in FIG. 3, the positions where the engaged portions 208 and 210 engage with the head main body 138 are the original positions of the first and second valve spools 204 and 206, and the first and second valve spools 204 and In a state where 206 is located at the original position, each lower end portion protrudes downward from the head main body 138. The first valve spool 204 is moved relative to the head main body 138 to be moved from the original position to the positive pressure supply position, and the first valve 200 is switched to the positive pressure supply state. The second valve spool 206 is moved relative to the head main body 138 to move from the original position to the negative pressure supply position, and the second valve 202 is switched to the negative pressure supply state.

前記ノズル選択装置152は、図2および図3に示すノズル選択駆動装置230により駆動され、吸着ノズル146がヘッド本体138に対して昇降させられる。ノズル選択駆動装置230は、進退駆動部材たる昇降駆動部材としてのレバー駆動部材232および第2回転駆動装置としてのレバー駆動部材回転駆動装置234を含む。レバー駆動部材回転駆動装置234は、図2に示すように、前記回転体86および後述するリセット部材により、軸方向に移動不能かつヘッド保持装置44の回転軸線のまわりに回転可能に設けられた回転体236および回転体回転装置238を含む。回転体回転装置238は、駆動源としてのレバー駆動部材回転用モータ240,レバー駆動部材回転用モータ240により回転させられる駆動ギヤ242,回転体236に設けられた被駆動ギヤ244を含む。レバー駆動部材232は長手形状を成し、回転体236の、半径方向においてロータリヘッド42から外れた部分から下方へ、レバー駆動部材232の回転軸線に平行に突出する状態で設けられており、回転体236が回転体回転装置238によって回転させられることにより、レバー駆動部材232が、ヘッド保持装置44の回転軸線のまわりであって、ヘッド本体138の回転軸線のまわりに、ロータリヘッド42とは別に回転させられる。レバー駆動部材回転用モータ240は、例えば、エンコーダ付サーボモータにより構成され、レバー駆動部材232は、正逆両方向に任意の角度回転させられる。   The nozzle selection device 152 is driven by a nozzle selection drive device 230 shown in FIGS. 2 and 3, and the suction nozzle 146 is moved up and down with respect to the head main body 138. The nozzle selection drive device 230 includes a lever drive member 232 as an elevating drive member as an advance / retreat drive member and a lever drive member rotation drive device 234 as a second rotation drive device. As shown in FIG. 2, the lever driving member rotation driving device 234 is a rotation provided by the rotating body 86 and a reset member, which will be described later, so that it cannot move in the axial direction and can rotate around the rotation axis of the head holding device 44. A body 236 and a rotating body rotating device 238. The rotating body rotating device 238 includes a lever driving member rotating motor 240 as a driving source, a driving gear 242 rotated by the lever driving member rotating motor 240, and a driven gear 244 provided on the rotating body 236. The lever driving member 232 has a longitudinal shape, and is provided in a state of projecting in parallel with the rotation axis of the lever driving member 232 downward from a portion of the rotating body 236 that is out of the rotary head 42 in the radial direction. When the body 236 is rotated by the rotating body rotating device 238, the lever driving member 232 is arranged around the rotation axis of the head holding device 44 and around the rotation axis of the head main body 138, separately from the rotary head 42. Rotated. The lever driving member rotating motor 240 is constituted by, for example, a servo motor with an encoder, and the lever driving member 232 is rotated at an arbitrary angle in both the forward and reverse directions.

レバー駆動部材232の回転体236からの突出端部であって、下端部がロータリヘッド42側へ直角に曲げられ、駆動部ないし係合部246が設けられている。係合部246は、吸着ノズル146の軸線に直角で上向きの駆動面ないし係合面248を備え、ヘッド本体138の半径方向においては、ヘッド本体138の昇降経路の外側であって、ノズル選択装置152の回動レバー174の被係合部184の昇降経路内に位置させられている。したがって、ヘッド昇降装置48によりヘッド保持装置44が下降させられるとき、ヘッド保持装置44に保持されたロータリヘッド42がレバー駆動部材232に対して下降させられ、係合部246は、レバー駆動部材232と対応する相対位相の吸着ノズル146に対応して設けられたノズル選択装置152の回動レバー174の被係合部184に係合してその下降を阻止する。それにより、ロータリヘッド42が、回動レバー174がレバー駆動部材232に係合する回動レバー係合高さから更に下降させられるのに伴って、回動レバー174の回動軸線が被係合部184に対して下降させられるとともに、回動レバー174がスプリング176の付勢力に抗して回動させられ、アーム180のノズルホルダ172に対する連携部が下降させられて吸着ノズル146がヘッド本体138に対して下降させられ、前進させられる。   The lever drive member 232 protrudes from the rotating body 236, and its lower end is bent at a right angle toward the rotary head 42, and a drive unit or engagement unit 246 is provided. The engaging portion 246 includes a driving surface or an engaging surface 248 that is perpendicular to the axis of the suction nozzle 146 and faces upward. In the radial direction of the head main body 138, the engaging portion 246 is outside the lifting path of the head main body 138, The rotating lever 174 of 152 is positioned in the ascending / descending path of the engaged portion 184. Therefore, when the head holding device 44 is lowered by the head lifting / lowering device 48, the rotary head 42 held by the head holding device 44 is lowered with respect to the lever driving member 232, and the engaging portion 246 has the lever driving member 232. Are engaged with the engaged portion 184 of the rotating lever 174 of the nozzle selecting device 152 provided corresponding to the suction nozzle 146 of the relative phase corresponding to the lowering and preventing its lowering. Thereby, as the rotary head 42 is further lowered from the rotation lever engagement height at which the rotation lever 174 engages the lever driving member 232, the rotation axis of the rotation lever 174 is engaged. The pivot lever 174 is pivoted against the urging force of the spring 176 while the pivot lever 174 is pivoted against the urging force of the spring 176, and the linkage section of the arm 180 with respect to the nozzle holder 172 is lowered. Is lowered and moved forward.

また、ヘッド保持装置44が上昇させられ、ロータリヘッド42が上昇させられるとき、回動レバー174がスプリング176の付勢により回動させられて吸着ノズル146がヘッド本体138に対して上昇させられ、後退させられる。回動レバー174は、原位置まで回動させられれば、その後、更にロータリヘッド42が上昇させられるのに伴ってロータリヘッド42と共に上昇させられ、被係合部184が係合部246から離間させられる。この回動レバー離間高さは、前記回動レバー係合高さと同じであり、両者を合わせて回動レバー係合・離間高さと称する。離間時には、回動レバー174が原位置へ回動させられ、吸着ノズル146はヘッド本体138に対して上昇位置へ移動させられる。   Further, when the head holding device 44 is raised and the rotary head 42 is raised, the rotation lever 174 is rotated by the bias of the spring 176 and the suction nozzle 146 is raised with respect to the head main body 138. It is made to retreat. When the rotary lever 174 is rotated to the original position, the rotary head 42 is further raised with the rotary head 42 as the rotary head 42 is further raised, and the engaged portion 184 is separated from the engaging portion 246. It is done. The turning lever separation height is the same as the turning lever engagement height, and both are referred to as turning lever engagement / separation height. At the time of separation, the turning lever 174 is turned to the original position, and the suction nozzle 146 is moved to the raised position with respect to the head main body 138.

ロータリヘッド42が回動レバー係合・離間高さと、その高さより小距離上方の部品受取・装着時上昇端高さとの間において昇降させられる間は、被係合部184の係合部246からの離間により回動レバー174は回動させられず、吸着ノズル146を昇降させない。ロータリヘッド42のレバー駆動部材232に対する昇降ストローク範囲のうち、吸着ノズル146の上昇端近傍に対応する範囲においては、回動レバー174が運動変換機能を果たさなくなるのである。   While the rotary head 42 is moved up and down between the engaging / separating height of the rotating lever and the rising height at the time of receiving and mounting the component a short distance above the height, the engaging portion 246 of the engaged portion 184 Accordingly, the rotation lever 174 is not rotated and the suction nozzle 146 is not moved up and down. In the range corresponding to the vicinity of the rising end of the suction nozzle 146 in the lift stroke range of the rotary head 42 relative to the lever driving member 232, the rotation lever 174 does not perform the motion conversion function.

このようにロータリヘッド42の昇降により、ロータリヘッド42と共に昇降させられるとともに、ヘッド本体138に対して昇降させられ、複数の吸着ノズル146の中から選択されて電子回路部品の受取りあるいは装着を行う吸着ノズル146が選択ノズル146であり、レバー駆動部材232は選択ノズルに対応する相対位相に位置させられ、選択ノズル146を昇降させる。   As described above, the rotary head 42 is lifted and lowered together with the rotary head 42 and is also lifted and lowered with respect to the head main body 138 and selected from the plurality of suction nozzles 146 to receive or mount electronic circuit components. The nozzle 146 is the selection nozzle 146, and the lever driving member 232 is positioned at a relative phase corresponding to the selection nozzle, and moves the selection nozzle 146 up and down.

回動レバー174は、そのアーム182がレバー駆動部材232に係合し、その一端部の下降を阻止されることにより、ロータリヘッド42の下降に伴って回動させられて吸着ノズル146をヘッド本体138に対して下降させ、ロータリヘッド42の上昇時には、スプリング176の付勢による回動レバー174の回動がレバー駆動部材232により規制され、ロータリヘッド42の上昇と対応して回動レバー174が回動させられ、吸着ノズル146がヘッド本体138に対して上昇させられるようにされる。したがって、選択ノズル146のヘッド本体138に対する下降時にも上昇時にも、レバー駆動部材232は選択ノズル146に対応する相対位相に位置することが必要である。また、ヘッド昇降装置48が、ロータリヘッド42が滑らかに昇降を開始し、停止するように制御されることにより、吸着ノズル146も滑らかに昇降を開始し、停止させられる。本電子回路部品装着装置においては、ヘッド昇降装置48が進退駆動装置を構成し、回動レバー174が被駆動部材を構成し、軸178,ヘッド本体138の回動レバー174を回動可能に支持する部分と共に、ロータリヘッド42のレバー駆動部材232に対する昇降を吸着ノズル146のヘッド本体138に対する昇降運動に変換する運動変換機構を構成している。   The rotating lever 174 is rotated with the lowering of the rotary head 42 by the arm 182 engaging with the lever driving member 232 and the lower end of the rotating lever 174 being prevented from lowering, so that the suction nozzle 146 is moved to the head main body. When the rotary head 42 is raised, the turning of the turning lever 174 due to the urging of the spring 176 is restricted by the lever driving member 232, and the turning lever 174 is moved in response to the raising of the rotary head 42. The suction nozzle 146 is raised with respect to the head main body 138 by being rotated. Accordingly, it is necessary that the lever driving member 232 be positioned at a relative phase corresponding to the selection nozzle 146 when the selection nozzle 146 is lowered or raised with respect to the head main body 138. Further, the head elevating device 48 is controlled so that the rotary head 42 starts and stops smoothly, and stops, so that the suction nozzle 146 also starts and stops smoothly. In this electronic circuit component mounting device, the head lifting device 48 constitutes an advance / retreat drive device, the turning lever 174 constitutes a driven member, and the shaft 178 and the turning lever 174 of the head body 138 are rotatably supported. In addition to this, it constitutes a motion conversion mechanism that converts the vertical movement of the rotary head 42 relative to the lever drive member 232 into the vertical movement of the suction nozzle 146 relative to the head body 138.

回動レバー174の被係合部184と、前記第1,第2バルブスプール204,206の被係合部208,210とは同一円周上に位置し、レバー駆動部材232の係合部246を被係合部208,210にも係合させることができる。係合部246の係合面248は、レバー駆動部材232の回転方向において、被係合部184と被係合部208との両方に係合し、あるいは被係合部184と被係合部210との両方に係合する幅を有する。レバー駆動部材232の回転位置の選択により、係合部246は、ロータリヘッド42の下降時に、被係合部184に係合するとともに被係合部210に係合し、第2バルブスプール206の下降を阻止してヘッド本体138に対して上昇させ、負圧供給位置へ移動させて第2バルブ202を負圧供給状態に切り換え、あるいは被係合部184に係合するとともに被係合部208に係合して第1バルブスプール204を正圧供給位置へ移動させ、第1バルブ200を正圧供給状態に切り換える。本実施例では、レバー駆動部材232がバルブ切換部材を兼ね、ノズル選択駆動装置230がバルブ切換装置を兼ねている。係合部248の幅は、被係合部208,210の一方と被係合部184との両方に同時には係合できるが、レバー駆動部材232と選択ノズル146との一定不変の相対角度においてのみ係合状態が得られる幅であり、選択ノズル146を昇降させる際には、レバー駆動部材232と選択ノズル146との相対位相を、その一定不変の相対角度が得られる位相に保つことが必要である。なお、それぞれ負圧供給位置および正圧供給位置へ移動させられたバルブスプール204,206は、前記回転体86に固定されたリセット部材250により、原位置へ復帰させられる。   The engaged portion 184 of the rotating lever 174 and the engaged portions 208 and 210 of the first and second valve spools 204 and 206 are located on the same circumference, and the engaging portion 246 of the lever driving member 232 is located. Can also be engaged with the engaged portions 208 and 210. The engaging surface 248 of the engaging portion 246 is engaged with both the engaged portion 184 and the engaged portion 208 in the rotation direction of the lever driving member 232, or the engaged portion 184 and the engaged portion. 210 and a width that engages both. By selecting the rotation position of the lever driving member 232, the engaging portion 246 engages with the engaged portion 184 and engages with the engaged portion 210 when the rotary head 42 is lowered, and the second valve spool 206 is engaged. The lowering is prevented and the head main body 138 is raised and moved to the negative pressure supply position to switch the second valve 202 to the negative pressure supply state, or engaged with the engaged portion 184 and the engaged portion 208. And the first valve spool 204 is moved to the positive pressure supply position to switch the first valve 200 to the positive pressure supply state. In the present embodiment, the lever driving member 232 also serves as a valve switching member, and the nozzle selection driving device 230 also serves as a valve switching device. The width of the engaging portion 248 can be simultaneously engaged with both one of the engaged portions 208 and 210 and the engaged portion 184, but at a constant and constant relative angle between the lever driving member 232 and the selection nozzle 146. Only when the selection nozzle 146 is moved up and down, it is necessary to keep the relative phase between the lever driving member 232 and the selection nozzle 146 at a phase where a constant and constant relative angle can be obtained. It is. The valve spools 204 and 206 moved to the negative pressure supply position and the positive pressure supply position, respectively, are returned to their original positions by the reset member 250 fixed to the rotating body 86.

さらに、前記Y軸スライド70には、図1に示すように、回路基板32に設けられた基準マーク(図示省略)を撮像する基準マーク撮像システム260が設けられ、ヘッド移動装置46により水平面内の任意の位置へ移動させられる。また、ベッド30上には、部品撮像システム262が設けられ、吸着ノズル146により保持された電子回路部品を撮像するようにされている。部品撮像システム262は、例えば、部品供給装置38,40の各々と基板搬送装置10との間の、部品供給装置38,40の基板搬送方向に平行な方向の中央部にそれぞれ、位置を固定して設けられ、ロータリヘッド42の全部の吸着ノズル146により保持された電子回路部品を一括して撮像し得るものとされている。   Further, as shown in FIG. 1, the Y-axis slide 70 is provided with a reference mark imaging system 260 that images a reference mark (not shown) provided on the circuit board 32. It can be moved to any position. Further, a component imaging system 262 is provided on the bed 30 so as to image the electronic circuit components held by the suction nozzle 146. For example, the component imaging system 262 fixes the position at the center between each of the component supply devices 38 and 40 and the substrate transfer device 10 in the direction parallel to the substrate transfer direction of the component supply devices 38 and 40. The electronic circuit components held by all the suction nozzles 146 of the rotary head 42 can be collectively imaged.

前記制御装置16は、図4に示すように、CPU300,ROM302,RAM304およびそれらを接続するバス306を含む制御コンピュータ310を主体とするものであり、入・出力部312には、基準マーク撮像システム260の基準マークカメラ314および部品撮像システムの部品カメラ316の撮像によりそれぞれ得られた画像データを処理する画像処理コンピュータ318,エンコーダ付サーボモータのエンコーダ319(複数であるが1つが代表的に示されている)等が接続されている。入・出力部312にはまた、駆動回路320を介してX軸移動用モータ64等、種々のアクチュエータ等が接続されている。ROM302には、装着プログラム,図示を省略するメインルーチン,図5にフローチャートで示す部品受取ルーチン,部品装着ルーチン等、種々のプログラムおよびデータ等が記憶させられている。   As shown in FIG. 4, the control device 16 mainly includes a control computer 310 including a CPU 300, a ROM 302, a RAM 304 and a bus 306 for connecting them, and an input / output unit 312 includes a reference mark imaging system. 260, an image processing computer 318 that processes image data obtained by imaging of the fiducial mark camera 314 and the component camera 316 of the component imaging system, and an encoder 319 of a servo motor with an encoder (one is representatively shown). Etc.) are connected. Various actuators such as an X-axis moving motor 64 are connected to the input / output unit 312 via the drive circuit 320. The ROM 302 stores various programs and data such as a mounting program, a main routine (not shown), a component receiving routine and a component mounting routine shown in the flowchart of FIG.

次に作動を説明する。
ロータリヘッド42は、ノズル保持部144により保持された吸着ノズル146の全部に電子回路部品を吸着させた後、基板保持装置12へ移動させられ、複数の電子回路部品を順次、回路基板32の部品装着点に装着する。本ロータリヘッド42においては、吸着ノズル146が電子回路部品の受取りを行なう際の、ロータリヘッド42の回転軸線まわりの位置は1個所に設定され、例えば、Y軸方向においてフィーダ型部品供給装置38に最も近い位置とされる。この回転位置を部品受取位置と称する。ロータリヘッド42には、複数のノズル保持部144の全部に吸着ノズル146を保持させることも、一部のみに吸着ノズル146を保持させることもあるが、一部の場合にも、複数の吸着ノズル146は、間を開けることなく、連続して並べて保持させる。そのため、ロータリヘッド42は、ノズル保持部144の配設ピッチ角ずつ回転させられ、複数の吸着ノズル146が並び順に部品受取位置へ移動させられる。この際、ヘッド回転装置50の回転速度は滑らかに増大させられるとともに滑らかに低減させられ、ロータリヘッド42が振動少なく回転を開始,停止させられる。また、ロータリヘッド42はヘッド移動装置46により、電子回路部品の受取りを行なう吸着ノズル146が、複数のフィーダのうち、受け取るべき電子回路部品を供給するフィーダの部品供給部の上方へ移動させられる。この移動は、吸着ノズル146が上昇させられ、電子回路部品をフィーダから取り出した状態で行われる。
Next, the operation will be described.
The rotary head 42 adsorbs the electronic circuit components to all of the suction nozzles 146 held by the nozzle holding unit 144 and then is moved to the substrate holding device 12 so that the plurality of electronic circuit components are sequentially transferred to the components of the circuit board 32. Attach to the attachment point. In this rotary head 42, the position around the rotation axis of the rotary head 42 when the suction nozzle 146 receives the electronic circuit components is set at one location, for example, in the feeder type component supply device 38 in the Y-axis direction. It is the closest position. This rotational position is referred to as a parts receiving position. The rotary head 42 may hold the suction nozzles 146 on all of the plurality of nozzle holding portions 144 or only a part of the suction nozzles 146. However, in some cases, a plurality of suction nozzles may be held. No. 146 is continuously held side by side without a gap. Therefore, the rotary head 42 is rotated by the arrangement pitch angle of the nozzle holding portion 144, and the plurality of suction nozzles 146 are moved to the component receiving position in order. At this time, the rotational speed of the head rotating device 50 is smoothly increased and decreased smoothly, and the rotary head 42 starts and stops rotating with little vibration. Further, in the rotary head 42, the suction nozzle 146 that receives the electronic circuit component is moved by the head moving device 46 above the component supply unit of the feeder that supplies the electronic circuit component to be received among the plurality of feeders. This movement is performed in a state where the suction nozzle 146 is raised and the electronic circuit component is taken out from the feeder.

図5に示す部品受取ルーチンに基づいて、吸着ノズル146による電子回路部品の受取動作を説明する。なお、ロータリヘッド42がフィーダ型部品供給装置38のフィーダから電子回路部品を取り出す場合を例に取って説明するが、トレイ型部品供給装置40のトレイから電子回路部品を取り出す場合も同様に制御が行われる。
部品受取ルーチンのステップ1(以後、S1と略記する。他のステップについても同じ。)においては、1番目に電子回路部品を受け取る吸着ノズル146が下降させられる。複数の吸着ノズル146のうち、最初に電子回路部品の受取りを行なう吸着ノズル146は予め部品受取位置に位置させられている。また、レバー駆動部材232は、ロータリヘッド42の回転軸線のまわりにおいて部品受取位置に対応する位置であって、係合面248が、部品受取位置に位置させられた吸着ノズル146に対応する回動レバー174の被係合部184およびバルブ装置150の第2バルブ202の第2バルブスプール206の被係合部210に係合可能な回転位置である部品受取時駆動位置に位置させられている。未だ電子回路部品の受取りを行なっておらず、ロータリヘッド42の回転方向において最も下流側に位置し、最も早くレバー駆動部材232と対応する回転位相へ回転させられ、レバー駆動部材232の駆動により昇降させられて先に電子回路部品の受取りを行なう吸着ノズル146が先行選択ノズル146であり、先行選択ノズルに対してロータリヘッド42の回転方向において上流側に隣接する吸着ノズル146が次に電子回路部品の受取りを行なう次選択ノズル146であり、レバー駆動部材232は先行選択ノズル146(ここでは1番目の吸着ノズル146)に対応する第1相対位相に位置させられている。
Based on the component receiving routine shown in FIG. 5, the electronic circuit component receiving operation by the suction nozzle 146 will be described. The case where the rotary head 42 takes out the electronic circuit component from the feeder of the feeder-type component supply device 38 will be described as an example. However, the control is similarly performed when the electronic circuit component is taken out from the tray of the tray-type component supply device 40. Done.
In step 1 of the component receiving routine (hereinafter abbreviated as S1. The same applies to other steps), the suction nozzle 146 that receives the electronic circuit component first is lowered. Among the plurality of suction nozzles 146, the suction nozzle 146 that first receives an electronic circuit component is previously positioned at the component receiving position. The lever driving member 232 is a position corresponding to the component receiving position around the rotation axis of the rotary head 42, and the engaging surface 248 is rotated corresponding to the suction nozzle 146 positioned at the component receiving position. The part 184 is positioned at a component receiving drive position, which is a rotational position engageable with the engaged part 184 of the lever 174 and the engaged part 210 of the second valve spool 206 of the second valve 202 of the valve device 150. The electronic circuit component has not been received yet, is positioned on the most downstream side in the rotation direction of the rotary head 42, and is first rotated to the rotation phase corresponding to the lever driving member 232, and is moved up and down by driving the lever driving member 232. The suction nozzle 146 that receives the electronic circuit component first is the preceding selection nozzle 146, and the suction nozzle 146 adjacent to the upstream side in the rotation direction of the rotary head 42 with respect to the preceding selection nozzle is the next electronic circuit component. The lever driving member 232 is positioned in the first relative phase corresponding to the preceding selection nozzle 146 (here, the first suction nozzle 146).

S1においては、部品受取位置に位置する1番目の吸着ノズル146を下降させるためにロータリヘッド42が下降させられる。ロータリヘッド42の下降の途中で、1番目の吸着ノズル146に対応する回動レバー174の被係合部184が、レバー駆動部材232の係合部246に係合し、ロータリヘッド42の下降に伴って回動レバー174が回動させられ、吸着ノズル146は、ヘッド本体138と共に下降させられつつ、さらにそのヘッド本体138に対して下降させられる。ロータリヘッド42の下降時にはまた、1番目の吸着ノズル146に対応するバルブ装置150の第2バルブスプール206の被係合部210が係合部246に係合し、ヘッド本体138に対して上昇させられて負圧供給位置へ移動させられ、吸着ノズル146への負圧の供給を許容する。   In S1, the rotary head 42 is lowered to lower the first suction nozzle 146 located at the component receiving position. During the lowering of the rotary head 42, the engaged portion 184 of the rotating lever 174 corresponding to the first suction nozzle 146 engages with the engaging portion 246 of the lever driving member 232, and the rotary head 42 is lowered. Accordingly, the rotation lever 174 is rotated, and the suction nozzle 146 is further lowered with respect to the head body 138 while being lowered together with the head body 138. When the rotary head 42 is lowered, the engaged portion 210 of the second valve spool 206 of the valve device 150 corresponding to the first suction nozzle 146 is engaged with the engaging portion 246 and is raised with respect to the head main body 138. And moved to the negative pressure supply position to allow the negative pressure to be supplied to the suction nozzle 146.

先行選択ノズル146は、その吸着管が部品保持テープの収容凹部内に進入し、電子回路部品に当接すれば下降を停止させられる。ロータリヘッド42は、その状態から更に小距離下降させられる。この下降は、スプリング173の圧縮により許容され、電子回路部品が吸着ノズル146により確実に吸着される。電子回路部品に当接することにより、吸着ノズル146の下降が停止させられるが、電子回路部品がないとすれば吸着ノズル146はさらに下降することができ、レバー駆動部材232の吸着ノズル146に対する相対位相は、まだ吸着ノズル146を昇降させ得る相対位相である。1番目の吸着ノズル146については、図6のタイムチャートに示すように、ロータリヘッド42の部品受取・装着時上昇端から下降端への下降の間、ロータリヘッド42は回転させられず、レバー駆動部材232も部品受取時駆動位置に停止させられている。   The preceding selection nozzle 146 is stopped when the suction tube enters the housing recess of the component holding tape and comes into contact with the electronic circuit component. The rotary head 42 is lowered further from the state. This lowering is allowed by the compression of the spring 173, and the electronic circuit component is reliably sucked by the suction nozzle 146. The lowering of the suction nozzle 146 is stopped by contacting the electronic circuit component. However, if there is no electronic circuit component, the suction nozzle 146 can be further lowered, and the relative phase of the lever driving member 232 with respect to the suction nozzle 146 is reduced. Is the relative phase at which the suction nozzle 146 can still be raised and lowered. For the first suction nozzle 146, as shown in the time chart of FIG. 6, the rotary head 42 is not rotated while the rotary head 42 is lowered from the rising end to the falling end when receiving and mounting the components, and the lever is driven. The member 232 is also stopped at the drive position when receiving the part.

ロータリヘッド42が下降端まで下降させられれば、S2が実行され、1番目の吸着ノズル146の上昇による電子回路部品のフィーダからの取出しおよび2番目の吸着ノズル146の下降による電子回路部品の吸着が行われる。先行選択ノズル146による電子回路部品の取出しおよび次選択ノズル146による電子回路部品の吸着が行われるのであり、図6のタイムチャートに示すように、ロータリヘッド42が、先行選択ノズル146により吸着された電子回路部品が部品保持テープの収容凹部から抜け出させられ、フィーダの上面より上方に位置する高さ(この高さを部品取出高さと称する)へ上昇させられれば、ロータリヘッド42が回転を開始させられ、先行選択ノズル146が部品受取位置から離れ始めるとともに、レバー駆動部材232がロータリヘッド42と同速度で回転を開始させられる。それにより、レバー駆動部材232は第1相対位相に位置する状態に保たれ、ロータリヘッド42が回転させられつつ上昇させられるのに伴って、回動レバー174がレバー駆動部材232に係合した状態を保って回動させられ、先行選択ノズル146が回転させられつつ、ヘッド本体138と共に上昇させられながら、さらにそのヘッド本体138に対して上昇させられる。   If the rotary head 42 is lowered to the descending end, S2 is executed, and the electronic circuit component is taken out from the feeder by the rising of the first suction nozzle 146 and the electronic circuit component is sucked by the lowering of the second suction nozzle 146. Done. The electronic circuit component is taken out by the preceding selection nozzle 146 and the electronic circuit component is sucked by the next selection nozzle 146, and the rotary head 42 is sucked by the preceding selection nozzle 146 as shown in the time chart of FIG. If the electronic circuit component is pulled out from the housing recess of the component holding tape and raised to a height above the upper surface of the feeder (this height is referred to as a component removal height), the rotary head 42 starts to rotate. As a result, the preceding selection nozzle 146 starts to move away from the component receiving position, and the lever driving member 232 starts to rotate at the same speed as the rotary head 42. As a result, the lever driving member 232 is maintained in the state of being in the first relative phase, and the rotary lever 174 is engaged with the lever driving member 232 as the rotary head 42 is raised while being rotated. The preceding selection nozzle 146 is rotated with the head main body 138 while being rotated together with the head main body 138 while being rotated.

図6のタイムチャートに示すように、ロータリヘッド42が、回動レバー係合・離間高さまで上昇させられれば、回動レバー174がレバー駆動部材232から離間し、運動変換機能を果たさなくなるため、レバー駆動部材232をロータリヘッド42と同期して回転させる必要がなくなる。そのため、レバー駆動部材回転駆動装置234の制御により、レバー駆動部材232が、ロータリヘッド42とは回転速度を異ならされ、第1相対位相から脱して、次選択ノズル146に対応する第2相対位相に向かって回転させられる。この第1相対位相から第2相対位相への移行の初期にはレバー駆動部材232はロータリヘッド42と同方向に回転させられるが、中期において逆方向に回転させられる。   As shown in the time chart of FIG. 6, if the rotary head 42 is raised to the turning lever engaging / separating height, the turning lever 174 is separated from the lever driving member 232 and does not perform the motion conversion function. There is no need to rotate the lever driving member 232 in synchronization with the rotary head 42. Therefore, under the control of the lever driving member rotation driving device 234, the lever driving member 232 has a rotational speed different from that of the rotary head 42, and moves away from the first relative phase to the second relative phase corresponding to the next selection nozzle 146. It is rotated toward. At the beginning of the transition from the first relative phase to the second relative phase, the lever driving member 232 is rotated in the same direction as the rotary head 42, but is rotated in the opposite direction in the middle period.

ロータリヘッド42は、部品受取・装着時上昇端高さまで上昇させられれば、直ちに下降を開始させられる。ロータリヘッド42は、回動レバー係合・離間高さへ上昇するまで待つことなく、部品取出高さへ上昇させられれば、回転を開始させられ、回転開始時期が早い。また、次に説明するように、ロータリヘッド42は、回転と並行して下降させられるため、次選択ノズル146が部品受取位置近くまで回転することを待たなくてよい分、早く下降を開始することができ、部品受取・装着時上昇端高さへの上昇後、直ちに下降を開始することができる。レバー駆動部材232は、ロータリヘッド42がちょうど回動レバー係合・離間高さへ下降させられた状態で次選択ノズル146に対応する第2相対位相に到達し、回動レバー174と係合するように回転させられる。レバー駆動部材232は、第2相対位相への移行の後期において、その回転方向がロータリヘッド42と同方向へ回転する方向に変えられ、ロータリヘッド42と回転速度を異にする状態から回転速度を同じくする同期状態とされる。そのため、レバー駆動部材232が回動レバー174に対応する相対位相に位置する状態に保たれ、ロータリヘッド42の下降により回動レバー174が回動させられ、次選択ノズル146が回転させられつつ、ヘッド本体138と共に下降させられながら、さらにそのヘッド本体138に対して下降させられる。   If the rotary head 42 is raised to the rising end height at the time of receiving and mounting the parts, the rotary head 42 is immediately started to descend. If the rotary head 42 is raised to the component take-out height without waiting until the rotary lever is raised to the engagement / separation height, the rotation is started and the rotation start timing is early. Further, as will be described below, the rotary head 42 is lowered in parallel with the rotation, so that it is not necessary to wait for the next selection nozzle 146 to rotate to near the parts receiving position, so that the rotary head 42 starts to descend earlier. It is possible to start the descent immediately after rising to the rising end height when receiving and mounting the parts. The lever driving member 232 reaches the second relative phase corresponding to the next selection nozzle 146 in a state where the rotary head 42 is lowered to the rotation lever engagement / separation height, and engages with the rotation lever 174. Is rotated as follows. At a later stage of the transition to the second relative phase, the rotation direction of the lever driving member 232 is changed to a direction rotating in the same direction as the rotary head 42, and the rotation speed is changed from a state where the rotation speed is different from that of the rotary head 42. The same synchronization state is set. Therefore, the lever driving member 232 is kept in a relative phase corresponding to the rotation lever 174, the rotation lever 174 is rotated by the lowering of the rotary head 42, and the next selection nozzle 146 is rotated. While being lowered together with the head body 138, the head body 138 is further lowered.

ロータリヘッド42の回転およびレバー駆動部材232の回転は、図6のタイムチャートに示すように、ロータリヘッド42が前記部品取出高さまで下降させられた状態でちょうど終了し、次選択ノズル146が部品受取位置へ到達する。そのため、ロータリヘッド42が更に下降させられるとき、吸着ノズル146の吸着管がフィーダや部品保持テープの収容凹部の側面にあたることがない。そして、ロータリヘッド42は下降端まで下降させられ、吸着ノズル146は電子回路部品に当接し、吸着する。レバー駆動部材232が次選択ノズル146と対応する相対位相へ回転させられ、ロータリヘッド42と同期して回転させられるとともに、次選択ノズル146をヘッド本体138に対して下降させる状態になれば、次選択ノズル146はその次に選択ノズルとなる吸着ノズル146に対して先行選択ノズル146となり、レバー駆動部材232の吸着ノズル146に対する相対位相は第1相対位相になったと考えることもでき、次選択ノズル146が電子回路部品を吸着した後、上昇させられる際に先行選択ノズル146になると考えることもできる。   As shown in the time chart of FIG. 6, the rotation of the rotary head 42 and the rotation of the lever driving member 232 are just finished in a state where the rotary head 42 is lowered to the component extraction height, and the next selection nozzle 146 receives the component. Reach the position. Therefore, when the rotary head 42 is further lowered, the suction pipe of the suction nozzle 146 does not hit the side surface of the feeder or the holding recess of the component holding tape. Then, the rotary head 42 is lowered to the lower end, and the suction nozzle 146 comes into contact with and sucks the electronic circuit component. When the lever driving member 232 is rotated to the relative phase corresponding to the next selection nozzle 146 and rotated in synchronization with the rotary head 42, the next selection nozzle 146 is lowered with respect to the head body 138. The selection nozzle 146 becomes the preceding selection nozzle 146 with respect to the suction nozzle 146 to be the next selection nozzle, and it can be considered that the relative phase of the lever driving member 232 to the suction nozzle 146 is the first relative phase. It can also be considered that the nozzle 146 becomes the pre-selection nozzle 146 when it is lifted after picking up the electronic circuit components.

図6のタイムチャートおよび上記の説明から明らかなように、吸着ノズル146の吸着管や、吸着ノズル146に吸着された電子回路部品がフィーダと干渉する恐れがなく、ロータリヘッド42の回転が可能である時期、およびレバー駆動部材232が吸着ノズル146を昇降させ得る時期は、ロータリヘッド42の昇降高さ(高さ方向位置)により制限され、第1,第2相対位相のそれぞれにおいて、レバー駆動部材232およびロータリヘッド42の回転とロータリヘッド42の昇降の一部とが同時期に行なわれ、吸着ノズル146の回転と昇降の一部とが並行して行なわれ、その分、電子回路部品の受取りに要する時間が短縮される。   As is clear from the time chart of FIG. 6 and the above description, the suction head of the suction nozzle 146 and the electronic circuit parts sucked by the suction nozzle 146 do not interfere with the feeder, and the rotary head 42 can be rotated. The timing at which the lever driving member 232 can raise and lower the suction nozzle 146 is limited by the elevation height (position in the height direction) of the rotary head 42, and the lever driving member at each of the first and second relative phases. 232 and the rotary head 42 and the rotary head 42 are partly lifted and lowered at the same time, and the suction nozzle 146 is rotated and partly lifted and lowered in parallel. Is shortened.

従来は、吸着ノズル146による電子回路部品の受取り時にレバー駆動部材232は部品受取時駆動位置に位置させられたままで回転させられなかったので、レバー駆動部材232の作用により吸着ノズル146を昇降させるために、ロータリヘッド42を昇降させつつ回転させることができず、図7のタイムチャートに示すように、ロータリヘッド42の昇降と回転とが互いに異なる時期に行なわれていた。そのため、ロータリヘッド42が回転を開始するには、回動レバー係合・離間高さへ上昇することを待たなければならず、下降を開始するには、ロータリヘッド42の回転により次選択ノズル146が部品受取位置へ到達する直前まで待たなければならなかったのであるが、本実施例の電子回路部品装着装置におけるように、レバー駆動部材232およびロータリヘッド42を、ロータリヘッド42の昇降と並行して回転させることにより、ロータリヘッド42が回動レバー係合・離間高さへ上昇するまで待つことなく、ロータリヘッド42の回転を開始することができ、また、次選択ノズル146が部品受取位置へ到達する直前まで待つことなく、ロータリヘッド42の下降を開始させることができ、電子回路部品の受取りに要する時間が短縮される。   Conventionally, when the electronic circuit component is received by the suction nozzle 146, the lever driving member 232 remains in the driving position when the component is received and cannot be rotated, so that the suction nozzle 146 is moved up and down by the action of the lever driving member 232. In addition, the rotary head 42 cannot be rotated while being raised and lowered, and as shown in the time chart of FIG. 7, the rotary head 42 is raised and lowered at different times. Therefore, in order to start the rotation of the rotary head 42, it is necessary to wait for the rotation lever to rise to the engagement / separation height, and to start the lowering, the next selection nozzle 146 is rotated by the rotation of the rotary head 42. However, the lever driving member 232 and the rotary head 42 are moved in parallel with the raising and lowering of the rotary head 42 as in the electronic circuit component mounting apparatus of this embodiment. By rotating the rotary head 42, the rotation of the rotary head 42 can be started without waiting for the rotary head 42 to rise to the turning lever engaging / separating height, and the next selection nozzle 146 moves to the component receiving position. The rotary head 42 can start to descend without waiting until just before it reaches, and the time required for receiving the electronic circuit components It is shrinking.

レバー駆動部材回転駆動装置234は、レバー駆動部材232が第1相対位相から脱する際のロータリヘッド42の回転速度と一致した状態で回転する同期状態から、回転速度を異にする状態への移行と、第2相対位相に達する際の回転速度を異にする状態から同期状態への移行とがいずれも、移行時に位置,速度および加速度が連続して変化し、滑らかにつながって行なわれるように制御される。これら軟同期離脱制御および軟同期移行制御のためのレバー駆動部材232の回転位置S,回転速度Vおよび回転加速度Aは、例えば次式(1)〜(3)に従って設定することができる。なお、これらの式において、第1相対位相離脱開始時の時間t=0,第2相対位相到達時の時間t=T,第1相対位相離脱開始時位置Sstart,第2相対位相到達時位置Send,第1相対位相離脱開始時速度Vstart,第2相対位相到達時速度Vend,第1相対位相離脱開始時加速度Astart,第2相対位相到達時加速度Aendとする。
S=at5+bt4+ct3+dt2+et+f・・・(1)
V=dS/dt=5at4+4bt3+3ct2+2dt+e・・・(2)
A=dV/dt=20at3+12bt2+6ct+2d・・・(3)
上記条件および(1)式〜(3)式から係数a〜fが下記のように得られる。
a={T2(Aend−Astart)/2−3T(Vend+Vstart)+6(Send−Sstart)}/T5
b={−T(Aend+Astart)/2+Vend−Vstart+5aT4}/(−2T3
c=(Aend−Astart−20aT3−12bT2)/6T
d=Astart/2
e=Vstart
f=Sstart
The lever drive member rotation drive device 234 shifts from a synchronized state in which the lever drive member 232 rotates in a state coincident with the rotation speed of the rotary head 42 when the lever drive member 232 leaves the first relative phase to a state in which the rotation speed is different. And the transition from the state in which the rotational speed at the time of reaching the second relative phase is different to the synchronization state are performed by continuously changing the position, speed and acceleration at the time of transition and smoothly connecting them. Be controlled. The rotational position S, the rotational speed V, and the rotational acceleration A of the lever driving member 232 for the soft synchronization release control and the soft synchronization transition control can be set according to the following equations (1) to (3), for example. In these equations, time t = 0 at the start of the first relative phase departure, time t = T at the arrival of the second relative phase, position Sstart at the first relative phase departure start, position Send at the second relative phase arrival , First relative phase departure start speed Vstart, second relative phase arrival speed Vend, first relative phase departure start acceleration Astart, and second relative phase arrival acceleration Aend.
S = at 5 + bt 4 + ct 3 + dt 2 + et + f (1)
V = dS / dt = 5 at 4 +4 bt 3 +3 ct 2 +2 dt + e (2)
A = dV / dt = 20 at 3 +12 bt 2 +6 ct + 2d (3)
From the above conditions and equations (1) to (3), coefficients a to f are obtained as follows.
a = {T 2 (Aend−Astart) / 2−3T (Vend + Vstart) +6 (Send−Start)} / T 5
b = {− T (Aend + Astart) / 2 + Vend−Vstart + 5aT 4 } / (− 2T 3 )
c = (Aend-Astart-20aT 3 -12bT 2 ) / 6T
d = Astart / 2
e = Vstart
f = Sstart

2番目の吸着ノズル146が下降させられて電子回路部品を吸着し、ロータリヘッド42が下降端へ下降させられれば、S3が実行され、ロータリヘッド42により現に保持されている吸着ノズル146の全部について電子回路部品の受取りが終了したか否かが判定される。まだ、終了していなければ、ルーチンの実行はS2に戻り、ロータリヘッド42の昇降,回転,レバー駆動部材232の回転が行なわれ、先行選択ノズル146が上昇させられつつ回転させられるとともに、次選択ノズル146が回転させられつつ下降させられて電子回路部品の取出し,吸着が行なわれる。最後の吸着ノズル146が下降させられて電子回路部品を吸着すれば、S3の判定結果がYESになってS4が実行され、ロータリヘッド42が上昇させられ、最後の吸着ノズル146が上昇させられて電子回路部品を取り出し、制御が終了する。この間、図6のタイムチャートに示すように、ロータリヘッド42およびレバー駆動部材232のいずれも回転させられず、部品受取位置において吸着ノズル146が上昇させられる。   If the second suction nozzle 146 is lowered to suck the electronic circuit component and the rotary head 42 is lowered to the lower end, S3 is executed, and all the suction nozzles 146 that are currently held by the rotary head 42 are performed. It is determined whether or not the electronic circuit component has been received. If not completed yet, execution of the routine returns to S2, the rotary head 42 is raised and lowered, the lever driving member 232 is rotated, the preceding selection nozzle 146 is rotated while being raised, and the next selection is performed. The nozzle 146 is lowered while being rotated, and the electronic circuit components are taken out and sucked. If the last suction nozzle 146 is lowered to suck the electronic circuit component, the determination result in S3 is YES, S4 is executed, the rotary head 42 is raised, and the last suction nozzle 146 is raised. The electronic circuit component is taken out and the control ends. During this time, as shown in the time chart of FIG. 6, neither the rotary head 42 nor the lever driving member 232 is rotated, and the suction nozzle 146 is raised at the component receiving position.

このようにロータリヘッド42はフィーダ型部品供給装置38から電子回路部品を取り出した後、基板保持装置12へ移動させられて電子回路部品を回路基板32に装着する。この移動の途中でロータリヘッド42が保持する全部の電子回路部品が部品カメラ316により一括して撮像され、その画像データに基づいて吸着ノズル146による電子回路部品の保持位置誤差が算出され、回路基板32の部品装着点の位置誤差と合わせて修正される。保持位置誤差には、吸着ノズル146により保持された電子回路部品の移動方向と平行な方向の位置誤差であるX軸方向およびY軸方向における各位置誤差と、電子回路部品の軸線まわりの位置誤差である回転位置誤差とが含まれる。また、部品装着点の位置誤差にも、部品装着面に平行な方向の位置誤差であるX軸,Y軸方向の各位置誤差と、部品装着面に直角な軸線まわりの位置誤差である回転位置誤差とが含まれる。ロータリヘッド42において吸着ノズル146は自身の軸線まわりに回転不能に設けられており、これら回転位置誤差は、ロータリヘッド42を回転させ、吸着ノズル146をロータリヘッド42の回転軸線まわりに旋回させて電子回路部品の向きを変えることにより修正される。ロータリヘッド42は、電子回路部品の装着姿勢(装着時における自身軸線まわりの位置)が設定された姿勢となるようにも回転させられる。X軸,Y軸方向の各位置誤差は、吸着ノズル146の移動位置の制御により修正される。この際、電子回路部品の回転位置誤差の修正,姿勢変更のためのロータリヘッド42の回転による吸着ノズル146の位置の変化も考慮して吸着ノズル146の移動位置が制御され、吸着ノズル146があたかも自身の中心線を回転軸線として回転させられ、電子回路部品を回転させつつ、部品装着点上へ移動させられたかのようにされる。   As described above, the rotary head 42 takes out the electronic circuit component from the feeder-type component supply device 38 and then moves to the substrate holding device 12 to mount the electronic circuit component on the circuit board 32. During the movement, all the electronic circuit components held by the rotary head 42 are collectively imaged by the component camera 316, and the holding position error of the electronic circuit components by the suction nozzle 146 is calculated based on the image data, and the circuit board is calculated. It is corrected together with the position error of 32 component mounting points. The holding position error includes the position error in the X-axis direction and the Y-axis direction, which is a position error in a direction parallel to the moving direction of the electronic circuit component held by the suction nozzle 146, and the position error about the axis of the electronic circuit component. And rotational position error. In addition, the positional error of the component mounting point includes the positional errors in the X-axis and Y-axis directions, which are positional errors in the direction parallel to the component mounting surface, and the rotational position, which is a positional error around the axis perpendicular to the component mounting surface. Error. In the rotary head 42, the suction nozzle 146 is provided so as not to rotate around its own axis, and these rotational position errors cause the rotary head 42 to rotate and the suction nozzle 146 to rotate around the rotation axis of the rotary head 42. It is corrected by changing the orientation of the circuit components. The rotary head 42 is also rotated so that the mounting posture of the electronic circuit component (position around its own axis at the time of mounting) becomes a set posture. Each position error in the X-axis and Y-axis directions is corrected by controlling the movement position of the suction nozzle 146. At this time, the movement position of the suction nozzle 146 is controlled in consideration of the correction of the rotational position error of the electronic circuit component and the change of the position of the suction nozzle 146 due to the rotation of the rotary head 42 for changing the posture. It is rotated with its own center line as the axis of rotation, and the electronic circuit component is rotated, as if it was moved onto the component mounting point.

電子回路部品の回路基板32への装着時には、レバー駆動部材232は、電子回路部品を装着する吸着ノズル146に対応するノズル選択装置152の回動レバー174およびバルブ装置150の第1バルブスプール204の被係合部208に対応する位相であって、部品装着時駆動位置へ回転させられ、ロータリヘッド42の下降に伴って回動レバー174の被係合部184および第1バルブスプール204の被係合部208に係合してそれらを駆動し、吸着ノズル146をヘッド本体138に対して下降させて電子回路部品を装着させるとともに、負圧供給の遮断および正圧の供給が行なわれて電子回路部品が積極的に開放されるようにされる。   When the electronic circuit component is mounted on the circuit board 32, the lever driving member 232 moves the rotation lever 174 of the nozzle selection device 152 corresponding to the suction nozzle 146 on which the electronic circuit component is mounted and the first valve spool 204 of the valve device 150. The phase corresponds to the engaged portion 208 and is rotated to the drive position at the time of mounting the component, and the engaged portion 184 of the rotating lever 174 and the engaged state of the first valve spool 204 as the rotary head 42 is lowered. Engage with the joint portion 208 and drive them, the suction nozzle 146 is lowered with respect to the head main body 138 to mount the electronic circuit components, and the negative pressure supply is cut off and the positive pressure is supplied to the electronic circuit. The parts are actively released.

電子回路部品の回路基板32への装着時にも、図示は省略するが、図5に示す部品受取ルーチンと同様に構成された部品装着ルーチンが実行され、電子回路部品の受取り時と同様に並行制御が行われる。電子回路部品を装着した吸着ノズル146の上昇時にレバー駆動部材232はロータリヘッド42と同期して回転させられ、吸着ノズル146が回転しつつ上昇させられ、レバー駆動部材232は回動レバー174の離間後、逆方向に回転させられ、第1相対位相から、次に電子回路部品を装着する吸着ノズル146に対応する第2相対位相へ回転させられて、その吸着ノズル146に対応して設けられたノズル選択装置152の回動レバー174に係合し、再びロータリヘッド42と同期して回転させられ、ロータリヘッド42の下降に伴って吸着ノズル146が回転しつつ下降するのであり、その分、電子回路部品の装着に要する時間が短縮される。   Even when the electronic circuit component is mounted on the circuit board 32, although not shown, a component mounting routine configured in the same manner as the component receiving routine shown in FIG. 5 is executed, and parallel control is performed as in the case of receiving the electronic circuit component. Is done. When the suction nozzle 146 mounted with the electronic circuit component is lifted, the lever driving member 232 is rotated in synchronization with the rotary head 42, the suction nozzle 146 is lifted while rotating, and the lever driving member 232 is separated from the rotating lever 174. After that, it was rotated in the opposite direction, and rotated from the first relative phase to the second relative phase corresponding to the suction nozzle 146 to which the electronic circuit component is mounted next, and provided corresponding to the suction nozzle 146. It is engaged with the rotation lever 174 of the nozzle selection device 152 and rotated again in synchronization with the rotary head 42, and the suction nozzle 146 is lowered while rotating as the rotary head 42 is lowered. Time required for mounting circuit components is reduced.

本ロータリヘッド42において電子回路部品の装着は、ヘッド本体138により保持された吸着ノズル146の並び順に行われるが、電子回路部品の姿勢は、ロータリヘッド42の回転により、吸着ノズル146がロータリヘッド42の回転軸線のまわりに回転させられることにより変えられるため、電子回路部品の装着姿勢,回転位置誤差および部品装着点の回転位置誤差に応じて、装着時における回転位置が吸着ノズル146毎に変わり、ロータリヘッド42およびレバー駆動部材232の回転角度が変わる。また、部品装着時には、ロータリヘッド42の回転は、回路基板32の部品装着面に対して一定距離上方へ離れた位置以上の高さ領域において許容される。回路基板32に先に装着されている電子回路部品と吸着ノズル146や吸着ノズル146に保持された電子回路部品との干渉を回避するためである。これらロータリヘッド42の回転許容高さ,先行選択ノズル146の装着位置および次選択ノズル146の装着位置に基づいて、電子回路部品を装着する吸着ノズル146が変わる毎に、軟同期離脱制御および軟同期移行制御のためのレバー駆動部材232の回転位置,速度および加速度が演算され、レバー駆動部材232の2度の方向転換が滑らかにつながって行われるようにされる。さらに、次に電子回路部品を装着する吸着ノズル146を部品装着点に位置させるためにロータリヘッド42はX軸,Y軸方向へ移動させられるが、その移動,ロータリヘッド42の回転および昇降は、ロータリヘッド42が回転許容高さより低い領域では回転せず、昇降のみ行う状態となるように行われる。   In the rotary head 42, the electronic circuit components are mounted in the order in which the suction nozzles 146 held by the head main body 138 are arranged. The posture of the electronic circuit components is determined by the rotation of the rotary head 42 so that the suction nozzle 146 moves to the rotary head 42. The rotation position at the time of mounting changes for each suction nozzle 146 according to the mounting posture of the electronic circuit component, the rotation position error, and the rotation position error of the component mounting point. The rotation angles of the rotary head 42 and the lever driving member 232 are changed. Further, at the time of component mounting, the rotation of the rotary head 42 is allowed in a height region equal to or higher than a position away from the component mounting surface of the circuit board 32 by a certain distance. This is to avoid interference between the electronic circuit component previously mounted on the circuit board 32 and the electronic circuit component held by the suction nozzle 146 or the suction nozzle 146. Based on the allowable rotation height of the rotary head 42, the mounting position of the preceding selection nozzle 146, and the mounting position of the next selection nozzle 146, each time the suction nozzle 146 to which the electronic circuit component is mounted is changed, the soft synchronization separation control and the soft synchronization are performed. The rotational position, speed, and acceleration of the lever driving member 232 for the transition control are calculated, and the two-direction change of the lever driving member 232 is smoothly connected. Further, the rotary head 42 is moved in the X-axis and Y-axis directions in order to position the suction nozzle 146 for mounting the electronic circuit component next at the component mounting point. The rotary head 42 does not rotate in a region lower than the allowable rotation height, and is only in a state where it is raised and lowered.

以上の説明から明らかなように、本電子回路部品装着装置においては、制御装置16のS2および部品装着時にS2に相当する制御を実行する部分が、軟同期離脱制御と軟同期移行制御との両方を行なう徐変制御部および同速回転制御部を構成し、並行制御部を構成している。   As is apparent from the above description, in the electronic circuit component mounting apparatus, the control unit 16 performs the control corresponding to S2 and the control corresponding to S2 at the time of component mounting, both the soft synchronization separation control and the soft synchronization transition control. The gradual change control unit and the same speed rotation control unit that perform the above are configured, and a parallel control unit is configured.

なお、本発明は、複数の吸着ノズルがそれぞれ、ノズル保持部材により、自身の軸線まわりに回転可能に保持され、ノズル保持部材の回転により、ノズル保持部材の回転軸線のまわりに旋回させられるとともに、自転させられるロータリヘッドを備えた電子回路部品装着装置にも適用することができる。   In the present invention, each of the plurality of suction nozzles is rotatably held around its own axis by the nozzle holding member, and is rotated around the rotation axis of the nozzle holding member by the rotation of the nozzle holding member. The present invention can also be applied to an electronic circuit component mounting apparatus having a rotary head that can be rotated.

請求可能発明の一実施例である電子回路部品装着装置を含む電子回路部品装着システムを概略的に示す平面図である。It is a top view which shows roughly the electronic circuit component mounting system containing the electronic circuit component mounting apparatus which is one Example of claimable invention. 上記電子回路部品装着装置のロータリヘッドをヘッド昇降装置等と共に示す側面断面図である。It is side surface sectional drawing which shows the rotary head of the said electronic circuit component mounting apparatus with a head raising / lowering apparatus etc. 上記ロータリヘッドを示す側面断面図である。It is side surface sectional drawing which shows the said rotary head. 上記電子回路部品装着システムを制御する制御装置を概念的に示すブロック図である。It is a block diagram which shows notionally the control apparatus which controls the said electronic circuit component mounting system. 上記制御装置の主体を成すコンピュータのROMに記憶させられた部品受取ルーチンを示すフローチャートである。It is a flowchart which shows the components reception routine memorize | stored in ROM of the computer which comprises the main body of the said control apparatus. 上記ロータリヘッドの回転,昇降およびレバー駆動部材の回転のタイミングを説明するタイムチャートである。It is a time chart explaining the timing of rotation of the said rotary head, raising / lowering, and rotation of a lever drive member. 従来のロータリヘッドの回転および昇降のタイミングを説明するタイムチャートである。It is a time chart explaining the timing of rotation and raising / lowering of the conventional rotary head.

符号の説明Explanation of symbols

14:電子回路部品装着装置 16:制御装置 32:回路基板 38:フィーダ型部品供給装置 40:トレイ型部品供給装置 42:ロータリヘッド 44:ヘッド保持装置 46:ヘッド移動装置 48:ヘッド昇降装置 50:ヘッド回転装置 138:ヘッド本体 146:吸着ノズル 152:ノズル選択装置 174:回動レバー 176:圧縮コイルスプリング 184:被係合部 232:レバー駆動部材 234:レバー駆動部材回転駆動装置   14: Electronic circuit component mounting device 16: Control device 32: Circuit board 38: Feeder type component supply device 40: Tray type component supply device 42: Rotary head 44: Head holding device 46: Head moving device 48: Head lifting device 50: Head rotation device 138: Head main body 146: Adsorption nozzle 152: Nozzle selection device 174: Rotating lever 176: Compression coil spring 184: Engagement portion 232: Lever drive member 234: Lever drive member rotation drive device

Claims (5)

複数種類の電子回路部品を供給する部品供給装置と、
回転軸線まわりに回転可能なノズル保持部材に、前記回転軸線の周囲にそれぞれその回転軸線に平行な軸方向に進退可能に複数の吸着ノズルが配設されたロータリヘッドと、
前記回転軸線まわりに回転可能に設けられ、前記複数の吸着ノズルから選択される選択ノズルに対応する相対位相においてその選択ノズルを軸方向に進退させる進退駆動部材と、
前記ロータリヘッドを前記回転軸線まわりに回転させる第1回転駆動装置と、
前記進退駆動部材を前記回転軸線まわりに前記ロータリヘッドとは別に回転させる第2回転駆動装置と、
前記進退駆動部材と前記ロータリヘッドとを前記回転軸線と平行な軸方向に相対移動させることにより、前記進退駆動部材に前記選択ノズルを進退させる進退駆動装置と、
その進退駆動装置および前記第1,第2回転駆動装置を制御することにより、前記複数の吸着ノズルの各々に受取位置において前記部品供給装置から電子回路部品を受け取らせ、装着位置において回路基板に装着させる装着制御装置と
を含み、かつ、前記装着制御装置が、前記ロータリヘッドを前記複数の吸着ノズルの1つが選択ノズルとなる回転位相へ回転させるとともに、そのロータリヘッドと前記進退駆動部材とを、その進退駆動部材が先に機能する選択ノズルである先行選択ノズルに対応する第1相対位相から次に機能する吸着ノズルである次選択ノズルに対応する第2相対位相へ相対回転させ、かつ、それら第1相対位相および第2相対位相における進退駆動部材およびロータリヘッドの回転と前記軸方向の相対移動との少なくとも一部を並行して生じさせる並行制御部を含む電子回路部品装着装置。
A component supply device for supplying multiple types of electronic circuit components;
A rotary head in which a plurality of suction nozzles are arranged around a rotation axis so as to be able to advance and retreat in an axial direction parallel to the rotation axis, around the rotation axis;
An advancing / retreating drive member that is rotatably provided around the rotation axis and moves the selected nozzle in the axial direction in a relative phase corresponding to the selected nozzle selected from the plurality of suction nozzles;
A first rotation drive device for rotating the rotary head around the rotation axis;
A second rotation drive device for rotating the advance / retreat drive member around the rotation axis separately from the rotary head;
An advancing / retreating drive device for advancing / retreating the selected nozzle by the advancing / retreating drive member by relatively moving the advance / retreat drive member and the rotary head in an axial direction parallel to the rotation axis;
By controlling the forward / backward drive device and the first and second rotary drive devices, each of the plurality of suction nozzles receives electronic circuit components from the component supply device at the receiving position and is mounted on the circuit board at the mounting position. And the mounting control device rotates the rotary head to a rotational phase in which one of the plurality of suction nozzles becomes a selection nozzle, and the rotary head and the advancing / retreating drive member, The advancing / retreating drive member rotates relative to the second relative phase corresponding to the next selected nozzle that is the next functioning suction nozzle from the first relative phase corresponding to the preceding selected nozzle that is the functioning selection nozzle, and these At least the rotation of the advance / retreat driving member and the rotary head and the relative movement in the axial direction in the first relative phase and the second relative phase An electronic circuit component mounting apparatus including a parallel control unit that also generates a part of them in parallel.
前記並行制御部が、前記ロータリヘッドの回転に基づく前記吸着ノズルの回転および進退駆動部材の回転と、前記吸着ノズルの進退とを並行させる間、進退駆動部材と前記ロータリヘッドとを同速度で回転させる同速回転制御部を含む請求項1に記載の電子回路部品装着装置。   While the parallel control unit rotates the suction nozzle based on the rotation of the rotary head and the advance / retreat drive member in parallel with the advance / retreat of the suction nozzle, the advance / retreat drive member and the rotary head rotate at the same speed. The electronic circuit component mounting apparatus according to claim 1, further comprising a same speed rotation control unit. 前記進退駆動部材と係合して駆動される被駆動部材を備え、進退駆動部材と前記ロータリヘッドとの軸方向の相対移動を、前記吸着ノズルの前記ノズル保持部材に対する進退運動に変換する運動変換機構を含み、かつ、その運動変換機構が、前記軸方向の相対移動のストローク範囲のうち少なくとも前記吸着ノズルの後退端近傍に対応する範囲においては前記被駆動部材が前記進退駆動部材から離間して、運動変換機能を果たさなくなるものである請求項1または2に記載の電子回路部品装着装置。   A motion conversion comprising a driven member that is driven by engaging with the advance / retreat drive member, and converts the relative movement in the axial direction between the advance / retreat drive member and the rotary head into an advance / retreat motion of the suction nozzle with respect to the nozzle holding member. The driven member is separated from the advance / retreat drive member in a range corresponding to at least the vicinity of the retracted end of the suction nozzle in the stroke range of the relative movement in the axial direction. The electronic circuit component mounting apparatus according to claim 1, wherein the electronic circuit component mounting device does not perform a motion conversion function. 前記並行制御部が、前記進退駆動部材が前記第1相対位相から脱する際に、前記ロータリヘッドの回転速度と一致した速度で回転する同期状態から回転速度を異にする状態に滑らかに移行させる軟同期離脱制御と、前記進退駆動部材が前記第2相対位相に達する際に、前記ロータリヘッドと回転速度を異にする状態から回転速度を同じくする同期状態に滑らかに移行させる軟同期移行制御との少なくとも一方を実行する徐変制御部を含む請求項1ないし3のいずれかに記載の電子回路部品装着装置。   When the advance / retreat drive member deviates from the first relative phase, the parallel control unit smoothly shifts from a synchronous state in which the rotational drive member rotates at a speed matching the rotational speed of the rotary head to a state in which the rotational speed is different. Soft-synchronization separation control, and soft-synchronization transition control that smoothly transitions from a state where the rotational speed is different from that of the rotary head to a synchronous state where the rotational speed is the same when the advance / retreat driving member reaches the second relative phase. The electronic circuit component mounting apparatus according to claim 1, further comprising a gradual change control unit that executes at least one of the above. 前記ロータリヘッドが前記回転軸線を中心とする一円周上に前記複数の吸着ノズルが等角度間隔で配設されたものであり、前記徐変制御部が、前記第1回転駆動装置の回転速度を滑らかに増大させ、滑らかに低減させて前記ロータリヘッドを前記複数の吸着ノズルの配設ピッチ角ずつ回転させるとともに、前記第2回転駆動装置の回転速度の制御により前記軟同期離脱制御と前記軟同期移行制御との少なくとも一方を実現するものである請求項4に記載の電子回路部品装着装置。   The rotary head is configured such that the plurality of suction nozzles are arranged at equal angular intervals on a circumference around the rotation axis, and the gradual change control unit is configured to rotate a rotation speed of the first rotation driving device. The rotary head is rotated in increments of pitch angles of the plurality of suction nozzles, and the soft synchronous separation control and the soft rotation are controlled by controlling the rotational speed of the second rotary drive device. The electronic circuit component mounting apparatus according to claim 4, wherein at least one of the synchronous shift control is realized.
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