JP2008227153A - Dielectric material for multilayer printed wiring board with built-in capacitor, multilayer printed wiring board with built-in capacitor member and capacitor, and method for manufacturing multilayer printed wiring board with built-in capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dielectric material for a multilayer printed wiring board with built-in capacitor which allows an on-board capacitors with difference of more than one figure in the capacity density to be efficiently fabricated on a board, to provide a multilayer printed wiring board with built-in capacitor member and capacitor, and to provide a method for manufacturing a multilayer printed wiring board with built-in capacitor. <P>SOLUTION: The dielectric material includes a first metalization layer with thickness of 5 to 15 μm, a first insulating layer with thickness of 0.1 to 1 μm, a second metalization layer with thickness of 10 to 35 μm, and a second insulating layer with thickness of 5 to 50 μm, wherein the specific inductive capacity of the first insulating layer is in the 10 to 2,000 range, while the specific inductive capacity after the second insulating layer is cured with a half-cured resin material is in the 20 to 100 range. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dielectric material for a capacitor-embedded multilayer printed wiring board, a capacitor member, a capacitor-embedded multilayer printed wiring board, and a method for manufacturing a capacitor-embedded multilayer printed wiring board.

  In recent years, along with the development of electronic devices, demands for miniaturization and weight reduction in addition to high performance of electronic components are increasing. In particular, in mobile electronic devices typified by mobile phones, the demand is remarkable from the pursuit of convenience. Against this background, various electronic component mounting methods have been studied and put into practical use, and in order to reduce the number of mounted components, it is required to incorporate passive components such as capacitors.

Applications of the capacitor include a bypass capacitor, a decoupling capacitor, an impedance matching capacitor, a DC cut capacitor, and the like, and the required capacitance varies greatly from several pF to several μF. On the other hand, as a dielectric of a capacitor, a resin film, a composite film of a resin and a high dielectric constant inorganic filler, a ceramic thin film, and the like are known (for example, Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document). 4). These can exhibit an effect as a material for producing a built-in capacitor on a substrate. These materials can be obtained with a desired capacity density by changing the relative permittivity and thickness which can be produced by devising the material design. For example, in Patent Document 1, a material having a relative dielectric constant of 4 to 41 is disclosed in Examples by a combination of an epoxy resin and barium titanate powder. When calculated based on the described thickness, the capacity density is 2.4 to 24 pF / mm ² . Further, in Patent Document 2, a material having a relative dielectric constant of 64 to 233 and a capacitance density of 115 to 200 pF / mm ² is disclosed in Examples by a combination of a high dielectric constant matrix resin and barium titanate powder. Moreover, in patent document 3, the material of 480-880 pF / mm < ² > (0.25-mm x 0.25-mm size 30-55 pF) is used for the Example by the thin film of barium strontium titanate or the barium titanate produced by the sol-gel method. It is disclosed. Furthermore, in patent document 4, the thickness and relative dielectric constant of the capacitor formed of various materials are summarized in Table 1 of the examples. When the capacity is calculated based on this value, it is 4.4 to 890000 pF / mm ² .

JP 2004-339260 A JP 2003-327821 A JP-A-2005-44833 JP 2002-9416 A

  However, in order to incorporate a plurality of capacitors having large capacitance differences, a plurality of materials must be used and a plurality of processing processes must be performed, and a simple method and material have been demanded. The present invention relates to a dielectric material for a multi-layer printed wiring board with a built-in capacitor, a capacitor member, a multi-layer printed wiring board with a built-in capacitor, and a multi-layer printed wiring board with a built-in capacitor. An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board with a built-in capacitor.

  The present invention provides a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a thickness of 5 to 50 μm. The first insulating layer has a relative dielectric constant of 10 to 2000, the second insulating layer is a semi-cured resin material, and the relative dielectric constant after curing is 20 to 100. The present invention relates to a dielectric material for a multilayer printed wiring board with a built-in capacitor.

  The present invention also relates to the dielectric material for a multilayer printed wiring board with a built-in capacitor, wherein the first insulating layer is made of a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles.

  The present invention also provides the multilayer printed wiring board with a built-in capacitor, wherein the second insulating layer contains an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000, and the surface roughness (Rz) is 1 to 5 μm. The present invention relates to a dielectric material.

  In the present invention, the surface of the first metal layer in contact with the first insulating layer and the surface of the second metal layer are metal films containing nickel or chromium as a main component, and the first metal layer and the second metal layer The metal layer relates to a dielectric material for a multilayer printed wiring board with a built-in capacitor, the main component of which is copper.

  The present invention also provides a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a thickness of 5 It consists of a second insulating layer having a thickness of ˜50 μm and a third metal layer having a thickness of 10 to 35 μm. The relative dielectric constant of the first insulating layer is 10 to 2000, and the relative dielectric constant of the second insulating layer is It is related with the dielectric material for multilayer printed wiring boards with a built-in capacitor which is 20-100.

  According to the present invention, the first insulating layer is made of a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles. Regarding materials.

  The present invention also relates to the dielectric material for a multilayer printed wiring board with a built-in capacitor, wherein the second insulating layer contains an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000.

  In the present invention, the surface of the first metal layer in contact with the first insulating layer and the surface of the second metal layer are metal films containing nickel or chromium as a main component, and the first metal layer and the second metal layer The metal layer and the third metal layer relate to a dielectric material for a multilayer printed wiring board with a built-in capacitor, the main component of which is copper.

  Further, the present invention uses the above-described dielectric material for a multilayer printed wiring board with a built-in capacitor, and the first metal layer, the second metal layer, the third metal layer, and the first insulating layer are patterned into arbitrary shapes. It is related with the made capacitor member.

  The present invention also relates to a capacitor built-in multilayer printed wiring board in which the capacitor member is incorporated.

The present invention also provides a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a thickness of 5 It consists of a second insulating layer having a thickness of ˜50 μm and a third metal layer having a thickness of 10 to 35 μm. The relative dielectric constant of the first insulating layer is 10 to 2000, and the relative dielectric constant of the second insulating layer is A method of manufacturing a multilayer printed wiring board with a built-in capacitor using a dielectric material for a multilayer printed wiring board with a built-in capacitor of 20 to 100, comprising:
1) etching a first metal layer of a dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
2) etching the first insulating layer to form an arbitrary dielectric pattern;
3) etching the second metal layer and the third metal layer to form an arbitrary circuit conductor pattern including the electrodes 2 and 3;
4) A step of aligning and fixing the dielectric material for the capacitor-embedded multilayer printed wiring board on the substrate via the sheet-like adhesive;
5) The present invention relates to a method for manufacturing a multilayer printed wiring board with a built-in capacitor, which includes the steps of forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern.

The present invention also provides a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a thickness of 5 It consists of a second insulating layer of ˜50 μm, the first dielectric layer has a relative dielectric constant of 10 to 2,000, the second dielectric layer is a semi-cured resin material, and the dielectric constant after curing is 20 to 100 A capacitor-embedded multilayer printed wiring board using a dielectric material for a capacitor-embedded multilayer printed wiring board,
1) forming a substrate having a planarized surface filled with resin between circuit conductor patterns including electrodes 3;
2) A step of placing the resin surface of the dielectric material for a multilayer printed wiring board with a built-in capacitor on the substrate surface and stacking and integrating them;
3) etching the first metal layer of the dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
4) etching the first insulating layer to form an arbitrary dielectric pattern;
5) etching the second metal layer to form an arbitrary circuit conductor pattern including the electrode 2;
6) A method of manufacturing a multilayer printed wiring board with a built-in capacitor, comprising the steps of forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern.

  According to the present invention, it is possible to efficiently produce a capacitor with a built-in substrate having a difference in capacitance density of one digit or more in the substrate, which is extremely suitable industrially.

The dielectric material for a multilayer printed wiring board with a built-in capacitor according to the present invention includes a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, and a first metal layer having a thickness of 10 to 35 μm. 2 and a second insulating layer having a thickness of 5 to 50 μm. The first insulating layer has a relative dielectric constant of 10 to 2000, and the second insulating layer is a semi-cured resin material and cured. The later relative dielectric constant is 20 to 100 (see FIG. 1).
The first metal layer becomes a capacitor electrode or a circuit wiring. A thickness of 5 μm or more is necessary in order to prevent damage in a printed board processing process typified by suppression of increase in conductor resistance and laser via drilling, and 15 μm or less for circuit processability and thinning. Preferably, it is 5-10 micrometers.

The first insulating layer is a dielectric material for producing a high-capacity capacitor. In order to ensure insulation, a thickness of 0.1 μm or more is necessary, and in order to obtain a high capacity, the thickness is 1 μm or less. Preferably, it is 0.3-0.7 micrometer. The relative dielectric constant needs to be 10 or more in order to obtain the effect of the capacitor, and is 2000 or less for industrial production. Preferably it is 20-2000. By forming such a thin film capacitor as a dielectric, usually 89~1800000pF / mm ^2, in the range of preferred specification can be obtained capacitance density of 250~59000pF / mm ^2.

  The second metal layer becomes a capacitor electrode or a circuit wiring. A thickness of 10 μm or more is necessary in order to prevent damage in a printed board processing process typified by suppression of increase in conductor resistance and laser via drilling, and 35 μm or less for circuit processability and thinning. Compared to the first metal layer, the thickness range is wide. This is because if the thickness is 20 μm or more, the rigidity of the material appears and the handleability is improved. Preferably, it is 20-35 micrometers.

The second insulating layer is a dielectric material for producing a low-capacitance capacitor. The resin material is semi-cured and used as an adhesive. In order to provide adhesiveness, a thickness of 5 μm or more is necessary, and in order to obtain a capacitor effect, the thickness is 50 μm or less. Preferably, it is 10-30 micrometers. The relative dielectric constant needs to be 20 or more in order to obtain the effect of the capacitor, and is set to 100 or less from the limit of industrial production of the resin material. Preferably it is 30-50. Such thin films 3.5~220pF / mm ² by forming a capacitor as a dielectric in the range of preferred specification can be obtained capacitance density of 8.9~44pF / mm ^2.

  As a semi-cured state, the melt viscosity at 120 ° C. is preferably 100 to 200 Pa · s. When the minimum melt viscosity is lower than 100 Pa · s, the flow is large, resulting in a large thickness variation, and when it is higher than 200 Pa · s, the adhesiveness is lowered. The first insulating layer is preferably a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles.

As a metal oxide thin film material, a composite metal oxide that essentially contains Ba and / or Sr and Ti as constituent elements exhibiting a high dielectric constant among ceramics (for example, about 1500 for BaTiO ₃ and about 200 for SrTiO _3). ) Can be suitably used. Of course, other elements and metal oxides, for example, composite metal oxides in which La is added to BaTiO ₃ to further increase the dielectric constant, and composite metal oxides in which characteristics are adjusted by adding CaTiO ₃ to BaTiO ₃ are also available. It can be used suitably. Furthermore, amorphous metal oxides added with crystalline nanoparticles are effective in achieving both high dielectric constant and high insulation. As a method for forming the metal oxide thin film, for example, a sol-gel method, a sputtering method, or a chemical vapor deposition method (CVD) is preferably used. The sol-gel method is more preferable because the composite metal oxide is easily adjusted to a desired composition. In order to suppress the oxidation of the copper foil during the formation of the thin film layer, the formation temperature is preferably 400 ° C. or lower, and more preferably 350 ° C. or lower.

  As the nanoparticles of the thin film resin material filled with the metal oxide nanoparticles, composite metal oxides that essentially contain Ba and / or Sr and Ti as the constituent elements described above can be suitably used. As the production method, for example, any of a solid phase method represented by a calcining pulverization method, a liquid phase method represented by a sol-gel method and an oxalate method, and a gas phase method represented by a flame spray method are suitable. Can be used. The liquid phase method is more preferable from the viewpoint that the secondary aggregation of the fine particles is difficult to occur. A phase method and a gas phase method can also be preferably applied. The average particle size of the crystalline fine particles is preferably in the range of 10 to 200 nm, more preferably in the range of 10 to 100 nm. When the average particle size is less than 10 nm, the dispersibility tends to decrease due to an increase in surface area. When the average particle size exceeds 200 nm, a thin film having a uniform thickness may not be obtained or defects may occur. is there. In addition, such metal oxide nanoparticles are commercially available from Toda Kogyo Co., Ltd. and CI Kasei Co., Ltd.

  As the resin material, polyimide resin, polyamide resin, polyamideimide resin, polyetherimide resin, epoxy resin, bismaleimide-triazine resin, modified polyphenylene ether resin, modified polyphenylene oxide resin, cyanate resin, etc. are preferably used. it can. Additives such as silane coupling agents and titanate coupling agents may be added for the purpose of improving the dispersibility of the metal oxide nanoparticles and improving the wettability. The second insulating layer preferably contains an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000 and has a surface roughness (Rz) of 1 to 5 μm.

  Any epoxy resin may be used as long as it cures and exhibits an adhesive action. Bifunctional epoxy resin is bisphenol A type or bisphenol F type resin, and polyfunctional epoxy resin is phenol novolac type epoxy resin or cresol novolac type epoxy resin. Etc. are exemplified. As the curing agent for the epoxy resin, those usually used can be used, and are not particularly limited. For example, amine, polyamide, acid anhydride, polysulfide, boron trifluoride, and phenolic hydroxyl group are contained in one molecule. Examples thereof include bisphenol A, bisphenol F, and bisphenol S, which are compounds having two or more compounds. In particular, it is preferable to use phenol novolak resin, bisphenol novolak resin, cresol novolak resin, or the like, which is a phenol resin, because of its excellent electric corrosion resistance during moisture absorption. Furthermore, a conventionally well-known hardening accelerator can be used with a hardening | curing agent, It is preferable to use various imidazoles as this hardening accelerator.

  Examples of the metal oxide particles having a relative dielectric constant of 50 to 2000 include barium titanate, strontium titanate, calcium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate, lead zirconate. These may be used alone or in combination of two or more. In particular, it is preferable to use a material having a relative dielectric constant of 50 or more. Moreover, as a filling amount, it is preferable to mix | blend 300-3000 with respect to the insulating resin 100 by weight ratio.

  In order to improve handling, a high molecular weight resin having a weight average molecular weight of 10,000 to 800,000 having at least one functional group such as an epoxy group, an amide group, a carboxyl group, a cyanate group, or a hydroxy group is blended It is preferable to do. Examples of such a high molecular weight resin include phenoxy resin, high molecular weight epoxy resin, ultrahigh molecular weight epoxy resin, polyamideimide resin, and functional group-containing reactive rubber. Further, a dispersant may be added. The dispersant that can be used may be any conventionally known one such as a commercially available non-silicone dispersant, and is not particularly limited. Moreover, what is necessary is just to determine the compounding quantity suitably by experiment.

  In the second insulating layer, the surface roughness (Rz) is preferably 1 to 5 μm. If the thickness is less than 1 μm, the production is difficult, and if it exceeds 5 μm, the thickness variation becomes large.

  Further, the first metal layer surface and the second metal layer surface in contact with the first insulating layer are metal films mainly composed of nickel or chromium, and the first metal layer and the second metal layer are made of copper. The main component is preferable (see FIG. 2). The first metal layer and the second metal layer are preferably copper or an alloy containing copper as a main component from the viewpoint of economy and applicability to a printed wiring board processing process. Further, since the first insulating layer is a thin film material, if the metal layer surface in contact with the first insulating layer is copper, reliability such as migration is lowered. Therefore, a metal mainly composed of a noble metal such as gold, platinum or palladium or a metal mainly composed of a base metal such as nickel or chromium is preferable. In view of economy, a metal film containing nickel or chromium as a main component is more preferable.

  The dielectric material for a multilayer printed wiring board with a built-in capacitor according to the present invention includes a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, and a thickness of 10 to 35 μm. The second metal layer, the second insulating layer having a thickness of 5 to 50 μm, and the third metal layer having a thickness of 10 to 35 μm, and the relative dielectric constant of the first insulating layer is 10 to 2000 The second dielectric layer has a relative dielectric constant of 20 to 100 (see FIG. 3).

  By providing the third metal layer, it is possible to obtain a metal / dielectric / metal / dielectric / metal material including two layers of capacitors having different capacitance levels. The range of capacitor characteristics obtained in each layer is the same as that of the dielectric material for a multilayer printed wiring board with a built-in capacitor described above. The third metal layer becomes a capacitor electrode or a circuit wiring. A thickness of 5 μm or more is necessary in order to prevent damage in a printed board processing process typified by suppression of increase in conductor resistance and laser via drilling, and 50 μm or less for circuit processability and thinning.

  Further, even in the metal / dielectric / metal / dielectric / metal structure, the first insulating layer is a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles, It is preferable from the viewpoint of obtaining a high capacity density. Similarly, the second insulating layer preferably contains an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000 from the viewpoint of obtaining a low capacity density. Regarding the surface of the metal layer, the first metal layer and the second metal layer in contact with the first insulating layer are metal films containing nickel or chromium as a main component, and the first metal layer and the second metal layer. It is preferable that the third metal layer is mainly composed of copper because a highly reliable dielectric can be obtained as the first insulating layer (see FIG. 4).

  The capacitor member of the present invention uses a dielectric material for a multilayer printed wiring board with a built-in capacitor of metal / dielectric / metal / dielectric / metal, and includes a first metal layer, a second metal layer, and a third metal. The layer and the first insulating layer are obtained by patterning into an arbitrary shape (see FIG. 5).

  A high-capacitance capacitor can be obtained with the electrode formed on the first metal layer and the electrode formed on the second electrode. Further, a low-capacitance capacitor can be obtained with the electrode formed on the second metal layer and the electrode formed on the third metal layer. In order to form the second electrode, it is necessary to pattern the first insulating layer.

  The multilayer printed wiring board with a built-in capacitor according to the present invention can be obtained by incorporating a capacitor member on which an electrode is formed. Even a capacitor member that has not been completely circuit-processed may be an intermediate processed product as long as it can be processed in the manufacturing process of the multilayer printed wiring board.

By incorporating a metal / dielectric / metal / dielectric / metal structure capacitor having two layers of different capacitance levels, it is possible to incorporate many capacitor functions in the substrate. Moreover, the manufacturing method of the multilayer printed wiring board with a built-in capacitor according to the present invention includes a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, and a thickness of 10 to 35 μm. It consists of a second metal layer, a second insulating layer having a thickness of 5 to 50 μm, and a third metal layer having a thickness of 10 to 35 μm, and the relative dielectric constant of the first insulating layer is 10 to 2000, A method for producing a capacitor-embedded multilayer printed wiring board using a dielectric material for a capacitor-embedded multilayer printed wiring board, wherein the relative dielectric constant of the second insulating layer is 20-100,
1) etching a first metal layer of a dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
2) etching the first insulating layer to form an arbitrary dielectric pattern;
3) etching the second metal layer and the third metal layer to form an arbitrary circuit conductor pattern including the electrodes 2 and 3;
4) A step of aligning and fixing the dielectric material for the capacitor built-in multilayer printed wiring board on the substrate through the adhesive,
5) It includes steps for forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern (see FIG. 6).

  Etching of iron chloride or copper chloride for copper, etchant such as sulfuric acid-hydrogen peroxide for nickel, and potassium ferricyanide for chromium for etching metal layers Can be used.

  For the etching of the first insulating layer, an etchant containing a chelating agent and hydrogen peroxide can be used. Examples of the chelating agent include ethylenediaminetetraacetic acid (EDTA), hydroxyethyliminodiacetic acid (HIDA), iminodiacetic acid (IDA), dihydroxyethylglycine (DHEG), and the like. Further, it can be physically removed by spraying a treatment liquid to which alumina particles are added at a high pressure. Such a method is commercially available from Macau Corporation under the name PFE treatment.

  The adhesive for fixing the dielectric material for a capacitor-embedded multilayer printed wiring board on which a pattern is formed is not particularly limited, but it is preferable to use a thermosetting adhesive film that can fix the dielectric material by thermocompression bonding. Of course, not only the adhesive film but also an adhesive paste using the same resin can be used. Furthermore, when the thin film capacitor is bonded onto the surface of the circuit conductor, a 5-20 μm thick solder foil or the like can be used. Moreover, the said thermocompression bonding can use the thermocompression bonding apparatus used for general sticking, The conditions are not specifically limited, It is about 5 to 60 second at 80-150 degreeC and 0.1-2 MPa. Is preferred. The thermosetting resin used as an adhesive is not particularly limited as long as it is a resin that can industrially control the semi-cured state. For example, it is generally used as an epoxy resin and has excellent heat resistance. Bismaleimide-triazine resin, modified polyphenylene ether resin excellent in dielectric properties, modified polyphenylene oxide resin, cyanate resin and the like can be used. Further, as a high molecular weight resin for forming a film, a rubber-based or imide-based resin having a functional group may be added as an adhesive layer component, if necessary.

  As the substrate, a substrate manufactured by a general substrate manufacturing process can be used, and a multilayer wiring substrate may be used. The resin material constituting the insulating layer of the substrate is not particularly limited. For example, glass cloth, glass nonwoven cloth, and aramid nonwoven cloth are impregnated with epoxy resin, bismaleimide resin, polyphenyl ether resin, fluorine resin resin, etc. A composite film, a polyimide resin, a polyamideimide resin, a plastic film such as a liquid crystal polymer, or the like can be used as appropriate.

Regarding the formation of an arbitrary insulating layer, the formation of a circuit conductor pattern, and the formation of an interlayer connection hole of a circuit conductor pattern, various methods have been applied to the production of printed wiring boards, and any of them can be used without limitation. I can do it. Moreover, the manufacturing method of the multilayer printed wiring board with a built-in capacitor according to the present invention includes a first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, and a thickness of 10 to 35 μm. It consists of a second metal layer and a second insulating layer having a thickness of 5 to 50 μm. The first insulating layer has a relative dielectric constant of 10 to 2000, and the second insulating layer is a semi-cured resin material. A method for producing a capacitor-embedded multilayer printed wiring board using a dielectric material for a capacitor-embedded multilayer printed wiring board having a relative dielectric constant of 20 to 100 after curing,
1) forming a substrate having a planarized surface filled with resin between circuit conductor patterns including electrodes 3;
2) A step of placing the resin surface of the dielectric material for a multilayer printed wiring board with a built-in capacitor on the substrate surface and stacking and integrating them;
3) etching the first metal layer of the dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
4) etching the first insulating layer to form an arbitrary dielectric pattern;
5) etching the second metal layer to form an arbitrary circuit conductor pattern including the electrode 2;
6) It includes steps for forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern (see FIG. 7).

  As a method of forming a flat substrate with resin filled between circuit conductor patterns, an unnecessary surface can be obtained by printing a resin paste or laminating a resin film and curing the resin by buffing, etc. A general method of removing the resin and flattening the surface is not limited thereto. A resin paste optimized for a resin substrate is commercially available from Yamaei Chemical Co., Ltd.

  The process conditions for stacking and integration are the same as those for a general printed wiring board and can be handled. That is, the temperature is 150 to 230 ° C., the pressure is 1 to 3 MPa, and the time is 0.5 to 3 hours. Other processes can be dealt with by the above-described contents and a general printed wiring board manufacturing process.

EXAMPLES Next, the present invention will be specifically described by way of examples, but the present invention is not limited to these.
(Example 1)
<Fabrication of dielectric material for multilayer printed wiring board with built-in capacitor>
A dielectric used for the first insulating layer was produced as follows. After completely dissolving 5.4 g of barium in a mixed solution of 157 g of 2-methoxyethanol and 25 g of acetic acid, 9 g of tetraethoxytitanium was further added and stirred to obtain 200 ml of 0.2 M BTO precursor solution.

  Further, 5.7 g of isopropoxy titanium was completely dissolved in a mixed solution of 140 g of 2-methoxyethanol and 51 g of acetic acid to obtain 100 ml of a 0.1 M titania precursor solution.

  On the other hand, a Ni thin film with a thickness of 0.8 μm is formed by sputtering on the glossy side of a 10 cm × 10 cm × 20 μm thick copper foil (manufactured by Mitsui Metal Mining Co., Ltd., 3EC-VLP). A copper foil (second metal layer) was obtained.

  Next, the above-described BTO precursor solution is spin-coated on the Ni thin film side of the copper foil with the Ni thin film layer obtained above and dried on a hot plate at 350 ° C. for 4 minutes, and the constituent elements are repeated six times. As a result, an amorphous composite metal oxide thin film layer 1A (thickness 300 nm) containing Ba and Ti was formed. Further, the operation of spin-coating the titania precursor solution on the composite metal oxide layer 1A and drying it on a hot plate at 350 ° C. for 4 minutes is repeated twice to form an amorphous metal oxide containing Ti as a constituent element. A thin film layer 1C (thickness: 100 nm) was formed. Finally, heat treatment was performed on a hot plate at 350 ° C. for 2 hours, and the thin film layer 1A and the thin film layer 1C were aged to form a first insulating layer. Next, after forming a Ni thin film having a thickness of 0.8 μm on the thin film layer 1C by sputtering, a first metal layer made of Cu having a thickness of 20 μm is formed on the Ni thin film by electrolytic copper plating. did. From the above steps, a thin film material 1 having a metal / thin film dielectric / metal structure was obtained.

Using this LCR meter YHP4275A (Yokogawa Hewlett-Packard Co., Ltd., trade name), the dielectric constant was calculated from the impedance characteristics at 25 ° C. and 1 MHz, and the thin film material 1 was 20 (converted value when a uniform material was used). there were. The capacity density was 450 pF / mm ² .

A dielectric used for the second insulating layer was manufactured as follows. 66 parts by weight of bisphenol A type epoxy resin (manufactured by Toto Kasei Co., Ltd., YD-8125) as an epoxy resin, 34 parts by weight of cresol novolac type epoxy resin (YDCN-703, manufactured by Toto Kasei Co., Ltd.), phenol as a curing agent for epoxy resin 63 parts by weight of novolak resin (Dainippon Ink Chemical Co., Ltd., Pliofen LF2882), 24 parts by weight of phenoxy resin (weight average molecular weight 50,000, manufactured by Toto Kasei Co., Ltd., phenototo YP-50) as a high molecular weight resin, cured 0.6 parts by weight of 1-cyanoethyl-2-phenylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., Curazole 2PZ-CN) as an accelerator, and a barium titanate filler (Fuji Titanium Industrial Co. 860 parts by weight, manufactured by BT-100PR, dispersant Then, to the composition consisting of 5.4 parts by weight of a non-silicone dispersant (BIC Chemie Japan Co., Ltd., BYK-W9010), methyl ethyl ketone was added and stirred and mixed for 1 hour at 1000 rpm using a bead mill. After filtering through a 200 mesh nylon cloth, vacuum deaeration was performed. This resin varnish 1 is applied onto an electrolytic copper foil having a thickness of 12 μm (GTS-12, manufactured by Furukawa Circuit Foil Co., Ltd.) and dried by heating at 140 ° C. for 5 minutes to form a B-stage coating having a thickness of 10 μm. A film was formed, and a high dielectric constant filler-added resin material sheet 1 provided with a copper foil was produced. The cured product obtained by curing the B-stage high dielectric constant filler-added resin material sheet 1 at 170 ° C. for 1 hour is measured using an LCR meter YHP4275A (Yokogawa Hewlett-Packard Co., Ltd., trade name) at 25 ° C. and 1 MHz impedance. As a result of calculating the dielectric constant from the characteristics, it was 20. The capacity density was 18 pF / mm ² .

  Next, the thin film material 1 and the high dielectric constant filler-added resin material sheet 1 are overlapped with the surface of the second metal layer facing the resin material surface, and the temperature is 170 ° C., the pressure is 1.5 MPa, and the heating is applied. Multi-layer with a built-in capacitor that has two layers of dielectric layers that have a metal / dielectric / metal / dielectric / metal structure and are different in capacitance density by an order of magnitude or more. The dielectric material 1 for printed wiring boards was obtained.

<Production of capacitor member>
Dry film type photoresist is laminated on both sides of dielectric material 1 for multilayer printed wiring board with built-in capacitor, pattern is printed on first metal layer surface, third metal layer surface is fully exposed, then development and etching By removing the resist, a circuit pattern including electrodes on the first metal layer was formed (FIG. 6A). Next, for the purpose of removing the first insulating layer (dielectric layer of the thin film material 1) that appears by etching, high pressure is applied at a water pressure of 0.3 MPa using an aqueous processing solution containing alumina particles having an average particle size of 30 μm. A water washing treatment was performed (FIG. 6B). After removing alumina particles and thin film residue by ultrasonic cleaning, dry film type photoresist is laminated on both sides, pattern is baked on the second metal layer surface and the third metal layer surface, and development, etching, resist By performing the removal, a circuit pattern electrode including a desired electrode was formed on the second metal layer and the third metal layer to obtain a capacitor member (FIG. 6C).

  Next, a 15 μm thick insulating adhesive film (manufactured by Hitachi Chemical Co., Ltd., HS-230) using a 25 μm thick PET film as a support film and the third metal layer surface of the capacitor member are laminated so as to be in contact with the adhesive, Lamination was performed at 100 ° C., 1 MPa, and 10 seconds.

<Fabrication of multilayer printed wiring board with built-in capacitor>
Glass epoxy laminate (manufactured by Hitachi Chemical Co., Ltd., MCL-E-679F), glass epoxy prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679F) and copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., F3-WS) A 4-layer resin substrate having a thickness of 0.4 mm and having an arbitrary circuit was produced. Next, the capacitor member from which the PET film is peeled is placed on the insulating layer surface of the four-layer resin substrate on which the surface circuit is not formed, with the adhesive film surface as the substrate surface, and heat at 100 ° C., 1 MPa, 60 seconds. Bonding was performed under pressure bonding conditions (FIG. 6D). Next, a glass epoxy prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679F) and copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., F3-WS) are laminated, and the surface connection circuit is formed after drilling and plating the interlayer connection holes. A pattern was formed by etching to obtain a multilayer printed wiring board with a built-in capacitor (FIG. 6E).

(Example 2)
<Fabrication of dielectric material for multilayer printed wiring board with built-in capacitor>
0.5 g of tetraethoxysilane and 2 g of hydrochloric acid were dissolved in 97.5 g of ethanol (99.5%) and allowed to stand at 20 ° C. for 60 hours to synthesize silica sol in the liquid, thereby obtaining 100 g of an ethanol dispersion of silica sol. . To this, 3 g of barium titanate (hereinafter referred to as BTO) nanoparticles (manufactured by Toda Kogyo Co., Ltd., average particle size of 30 nm) was added, dispersed using ultrasonic waves, and allowed to stand at 20 ° C. for 24 hours. Adsorbed on the surface. The BTO nanoparticles used were those obtained by centrifuging a slurry using water as a medium, collecting the precipitated particles, dispersing them in ethanol, centrifuging them again, and sedimenting and collecting them. After adsorption, the mixture was centrifuged to remove the supernatant liquid containing unadsorbed silica sol, and then the nanoparticles were washed by adding ethanol again and dispersing. After washing, the mixture was centrifuged to obtain silica sol-adsorbed BTO nanoparticles (crystalline fine particles having an average particle diameter of 30 nm).

  Further, after 5.4 g of barium was completely dissolved in a mixed solution of 157 g of 2-methoxyethanol and 25 g of acetic acid, 9 g of tetraethoxytitanium was further added and stirred to obtain 200 ml of 0.2 M BTO precursor solution.

  Next, 3 g of the silica sol-adsorbed BTO nanoparticles are added to a mixed solution of 43.5 g of the 0.2 M BTO precursor solution, 56.1 g of 2-methoxyethanol, and 5.4 g of N, N-dimethylformamide, and ultrasonic waves are added. To obtain a precursor solution A having a BTO concentration of 0.2 M and added with nanoparticles.

  Further, 5.7 g of isopropoxy titanium was completely dissolved in a mixed solution of 140 g of 2-methoxyethanol and 51 g of acetic acid to obtain 100 ml of a 0.1 M titania precursor solution.

  On the other hand, a Ni thin film with a thickness of 0.8 μm is formed by sputtering on the glossy side of a 10 cm × 10 cm × 20 μm thick copper foil (manufactured by Mitsui Metal Mining Co., Ltd., 3EC-VLP). A copper foil (second metal layer) was obtained.

  Next, the BTO precursor solution is spin-coated on the Ni thin film side of the copper foil with the Ni thin film layer obtained above, dried on a hot plate at 350 ° C. for 4 minutes, and then the BTO precursor solution is spun again. It was coated and dried in the same manner to form an amorphous composite metal oxide thin film layer 1A (thickness: 100 nm) containing Ba and Ti as constituent elements. Subsequently, the operation of spin-coating the precursor solution A on the thin film layer 1A and drying it on a hot plate at 350 ° C. for 4 minutes is repeated 6 times to obtain an amorphous composite metal oxide layer in which crystalline fine particles are dispersed. 1B (thickness 300 nm) was formed. Further, the operation of spin-coating the titania precursor solution on the composite metal oxide layer 1B and drying it on a hot plate at 350 ° C. for 4 minutes is repeated twice to form an amorphous metal oxide containing Ti as a constituent element. A thin film layer 1C (thickness: 100 nm) was formed. Finally, heat treatment was performed on a hot plate at 350 ° C. for 2 hours, and the thin film layer 1A, the composite metal oxide layer 1B, and the thin film layer 1C were aged to form a first insulating layer.

Next, after forming a Ni thin film having a thickness of 0.8 μm on the thin film layer 1C by sputtering, a first metal layer made of Cu having a thickness of 20 μm is formed on the Ni thin film by electrolytic copper plating. did. From the above steps, a thin film material 2 having a metal / thin film dielectric / metal structure was obtained. As a result of calculating the dielectric constant of this thin film material 2 from the impedance characteristics at 25 ° C. and 1 MHz using an LCR meter YHP4275A (Yokogawa Hewlett-Packard Co., Ltd., trade name), 57 (converted value when a uniform material is used) there were. The capacity density was 1000 pF / mm ² .

A dielectric used for the second insulating layer was manufactured as follows. 66 parts by weight of bisphenol A type epoxy resin (manufactured by Toto Kasei Co., Ltd., YD-8125) as an epoxy resin, 34 parts by weight of cresol novolac type epoxy resin (YDCN-703, manufactured by Toto Kasei Co., Ltd.), phenol as a curing agent for epoxy resin 63 parts by weight of novolak resin (Dainippon Ink Chemical Co., Ltd., Pliofen LF2882), 24 parts by weight of phenoxy resin (weight average molecular weight 50,000, manufactured by Toto Kasei Co., Ltd., phenototo YP-50) as a high molecular weight resin, cured 0.6 parts by weight of 1-cyanoethyl-2-phenylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., Curazole 2PZ-CN) as an accelerator, and a barium titanate filler (Fuji Titanium Industry Co., Ltd.) having an average particle size of 1.5 μm as a high dielectric constant filler 1300 parts by weight, manufactured by company, BT-100PR) 10. Barium titanate filler with a uniform particle size of 0.6 μm (manufactured by Fuji Titanium Industry Co., Ltd., HPBT-1), non-silicone dispersant as a dispersant (by BYK Japan Japan Co., Ltd., BYK-W9010) Methyl ethyl ketone was added to the composition consisting of 2 parts by weight, and the mixture was stirred and mixed at 1000 rpm for 1 hour using a bead mill, filtered through a 200 mesh nylon cloth, and then vacuum degassed. This resin varnish 2 is applied onto an electrolytic copper foil having a thickness of 12 μm (GTS-12, manufactured by Furukawa Circuit Foil Co., Ltd.), dried by heating at 140 ° C. for 5 minutes, and coated in a B stage state having a thickness of 20 μm. A film was formed, and a high dielectric constant filler-added resin material sheet 2 provided with a copper foil was produced. The cured product obtained by curing the B-stage high dielectric constant filler-added resin material sheet 1 at 170 ° C. for 1 hour is measured using an LCR meter YHP4275A (Yokogawa Hewlett-Packard Co., Ltd., trade name) at 25 ° C. and 1 MHz impedance. As a result of calculating the dielectric constant from the characteristics, it was 45. The capacity density was 20 pF / mm ² .

  Next, the thin film material 2 and the high dielectric constant filler-added resin material sheet 2 are overlapped with the surface of the second metal layer facing the resin material surface, and the temperature is 170 ° C., the pressure is 1.5 MPa, and the heating is applied. Multi-layer with a built-in capacitor that has two layers of dielectric layers that have a metal / dielectric / metal / dielectric / metal structure and are different in capacitance density by an order of magnitude or more. The dielectric material 2 for printed wiring boards was obtained.

<Manufacture of capacitor member> and <Manufacture of multilayer printed wiring board with built-in capacitor>
A capacitor member and a multilayer printed wiring board with a built-in capacitor were produced in the same manner as in Example 1 except that the dielectric material 2 for a multilayer printed wiring board with a built-in capacitor was used instead of the dielectric material 1 for a multilayer printed wiring board with a built-in capacitor. did.

(Example 3)
<Fabrication of dielectric material for multilayer printed wiring board with built-in capacitor>
The resin varnish 1 produced in Example 1 is applied to the surface of the second metal layer of the thin film material 1 produced in Example 1, and is heated and dried at 140 ° C. for 5 minutes to form a B stage having a thickness of 10 μm. Capacitor built-in multilayer printed wiring having a metal / dielectric / metal / dielectric (adhesive) structure and having two dielectric layers with different capacitance densities of one digit or more A dielectric material 3 for plates was obtained. It was 1.0 micrometer when the surface roughness (Rz) of this adhesive agent was measured with the laser microscope VF7510 (Keyence Corporation, brand name).

<Fabrication of multilayer printed wiring board with built-in capacitor>
Glass epoxy laminate (manufactured by Hitachi Chemical Co., Ltd., MCL-E-679F), glass epoxy prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679F) and copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., F3-WS) A 4-layer resin substrate having a thickness of 0.4 mm and having an arbitrary circuit was produced. Using a roll coater, paste type thermosetting insulating material HRP-700BA (Taiyo Ink Manufacturing Co., Ltd., trade name) is applied to the resin substrate surface about 40 μm from the substrate insulating layer surface and about 5 μm from the circuit pattern surface, 170 Curing was performed by heat treatment at 60 ° C. for 60 minutes. This substrate was polished with a buff brush until the surface of the circuit pattern appeared, and an excess insulating material was removed to obtain a substrate having a flat surface (FIG. 7A). At this time, the unevenness on the surface of the circuit board was 3 μm or less. The dielectric material 3 for a multilayer printed wiring board with a built-in capacitor is superposed on the surface of the substrate so that the adhesive surface faces the substrate, and laminated and integrated under press conditions of a temperature of 170 ° C., a pressure of 1.5 MPa, and a heating and pressing time of 60 minutes. (FIG. 7B). Next, by laminating a dry film type photoresist on both surfaces of the substrate, baking a pattern on the first metal layer surface, exposing the entire copper foil surface on the back surface, and then performing development, etching, and resist removal, A circuit pattern including an electrode was formed on the first metal layer (FIG. 7C). Next, for the purpose of removing the first insulating layer (dielectric layer of the thin film material 1) that appears by etching, high pressure is applied at a water pressure of 0.3 MPa using an aqueous processing solution containing alumina particles having an average particle size of 30 μm. A water washing treatment was performed (FIG. 7 (d)). After removing alumina particles and thin film residues by ultrasonic cleaning, laminating a dry film type photoresist on both sides, baking a pattern on the second metal layer surface, and exposing the entire copper foil surface on the back surface, By performing development, etching, and resist removal, a substrate on which a circuit pattern electrode including a desired electrode was formed on the second metal layer surface was obtained (FIG. 7E). Next, a glass epoxy prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679F) and copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., F3-WS) are laminated, and the surface connection circuit is formed after drilling and plating the interlayer connection holes. A pattern was formed by etching to obtain a multilayer printed wiring board with a built-in capacitor (FIG. 7 (f)).

Example 4
<Fabrication of dielectric material for multilayer printed wiring board with built-in capacitor>
The resin varnish 2 produced in Example 2 is applied to the surface of the second metal layer of the thin film material 2 produced in Example 2, and is heated and dried at 140 ° C. for 5 minutes to form a B stage state with a film thickness of 20 μm. Capacitor built-in multilayer printed wiring having a metal / dielectric / metal / dielectric (adhesive) structure and having two dielectric layers with different capacitance densities of one digit or more A dielectric material 4 for plates was obtained.

<Fabrication of multilayer printed wiring board with built-in capacitor>
A multilayer printed wiring board with a built-in capacitor was produced in the same manner as in Example 3, except that the dielectric material 4 for a multilayer printed wiring board with a built-in capacitor was used instead of the dielectric material 3 for a multilayer printed wiring board with a built-in capacitor.

(Comparative Example 1)
<Fabrication of dielectric material for multilayer printed wiring board with built-in capacitor>
The thin film material 1 produced in Example 1 and the high dielectric constant filler-added resin material sheet 1 were used as a dielectric material for a multilayer printed wiring board with a built-in capacitor.

<Fabrication of multilayer printed wiring board with built-in capacitor>
In the same manner as in Example 3, a 4-layer resin substrate having a flattened surface and a thickness of 0.4 mm was produced (FIG. 8A). The high dielectric constant filler-added resin material sheet 1 was superposed on the surface of the substrate so that the adhesive surface faces the substrate, and laminated and integrated under press conditions of a temperature of 170 ° C., a pressure of 1.5 MPa, and a heating and pressing time of 60 minutes. . Next, dry film type photoresist is laminated on both sides of the substrate, the pattern is baked onto the copper foil surface on which the resin material is laminated, the entire surface of the copper foil on the back surface is exposed, and then development, etching, and resist removal are performed. As a result, a circuit pattern including electrodes was formed on the resin material surface (FIG. 8B).

  Laminated on the third metal layer surface of the thin film material 1 so as to be in contact with the adhesive of a 15 μm thick insulating adhesive film (manufactured by Hitachi Chemical Co., Ltd., HS-230) using a 25 μm thick PET film as a supporting film, Lamination was performed under the conditions of 1 ° C. and 10 seconds at a temperature. Next, the support film was peeled off, and the thin film material 1 was laminated on the substrate surface on which the circuit pattern was formed under the conditions of 100 ° C., 1 MPa, and 60 seconds (FIG. 8C).

  Next, a dry film type photoresist is laminated on both surfaces of the substrate, a pattern is baked on the first metal layer surface, the entire back surface of the substrate is exposed, and then development, etching, and resist removal are performed. A circuit pattern including electrodes was formed on the metal layer. Next, for the purpose of removing the first insulating layer (dielectric layer of the thin film material 1) that appears by etching, high pressure is applied at a water pressure of 0.3 MPa using an aqueous processing solution containing alumina particles having an average particle size of 30 μm. Washing with water was performed. After removing alumina particles and thin film residue by ultrasonic cleaning, dry film type photoresist is laminated on both sides, pattern is baked on the second metal layer surface, and the entire back surface of the substrate is exposed, followed by development and etching By removing the resist, a circuit pattern including an electrode was formed on the second metal layer (FIG. 8D).

  Next, a glass epoxy prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679F) and copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., F3-WS) are laminated, and the surface connection circuit is formed after drilling and plating the interlayer connection holes. A pattern was formed by etching to obtain a multilayer printed wiring board with a built-in capacitor (FIG. 8E).

  According to the present invention, it has been found that a substrate built-in capacitor and a capacitor built-in multilayer printed wiring board having a difference in capacitance density of one digit or more in the substrate can be efficiently produced.

It is sectional drawing which shows one Embodiment of the dielectric material for multilayer printed wiring boards with a built-in capacitor of this invention. It is sectional drawing which shows one Embodiment of the dielectric material for multilayer printed wiring boards with a built-in capacitor of this invention. It is sectional drawing which shows one Embodiment of the dielectric material for multilayer printed wiring boards with a built-in capacitor of this invention. It is sectional drawing which shows one Embodiment of the dielectric material for multilayer printed wiring boards with a built-in capacitor of this invention. It is sectional drawing (a) which shows one Embodiment of the capacitor member of this invention, and the top view (b) seen from the 1st metal layer. It is sectional drawing which shows one Embodiment of the manufacturing method of the multilayer printed wiring board with a built-in capacitor of this invention. It is sectional drawing which shows one Embodiment of the manufacturing method of the multilayer printed wiring board with a built-in capacitor of this invention. It is sectional drawing which shows one Embodiment of the manufacturing method of the multilayer printed wiring board with a built-in capacitor of a comparative example.

Explanation of symbols

1. 1st metal layer First, the insulating layer (dielectric)
3. Second metal layer 4. Second insulating layer (dielectric)
5. 5. Metal film mainly composed of nickel or chromium 6. Metal layer mainly composed of copper Third metal layer 8. High-capacitance capacitor9. Low capacitance capacitor 10. Adhesive 11. Substrate 11 ′. Substrate 12. Interlayer connection hole 13. Circuit conductor pattern 14. Multilayer substrate insulating layer 15. Planarizing resin 16. 18. High dielectric constant filler-added resin material Thin film materials (metal / dielectric / metal)

Claims (12)

  A first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a second metal layer having a thickness of 5 to 50 μm A dielectric material for a multilayer printed wiring board with a built-in capacitor made of an insulating layer, wherein the first insulating layer has a relative dielectric constant of 10 to 2,000, and the second insulating layer is a semi-cured resin material after being cured. A dielectric material for a multilayer printed wiring board with a built-in capacitor, having a relative dielectric constant of 20 to 100.   The dielectric material for a multilayer printed wiring board with a built-in capacitor according to claim 1, wherein the first insulating layer is made of a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles. .   The second insulating layer includes an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000, and has a surface roughness (Rz) of 1 to 5 µm. Dielectric material for multilayer printed wiring boards with built-in capacitors.   The surface of the first metal layer in contact with the first insulating layer and the surface of the second metal layer are metal films mainly composed of nickel or chromium, and the first metal layer and the second metal layer are made of copper. The dielectric material for a multilayer printed wiring board with a built-in capacitor according to any one of claims 1 to 3, wherein the dielectric material is a metal layer having a main component.   A first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a second metal layer having a thickness of 5 to 50 μm A dielectric material for a multilayer printed wiring board with a built-in capacitor comprising an insulating layer and a third metal layer having a thickness of 10 to 35 μm, wherein the dielectric constant of the first insulating layer is 10 to 2000, A dielectric material for a multilayer printed wiring board with a built-in capacitor, wherein the dielectric constant of the insulating layer is 20 to 100.   6. The dielectric material for a multilayer printed wiring board with a built-in capacitor according to claim 5, wherein the first insulating layer is made of a metal oxide thin film material or a thin film resin material filled with metal oxide nanoparticles.   The dielectric material for a multilayer printed wiring board with a built-in capacitor according to claim 5 or 6, wherein the second insulating layer contains an epoxy resin and metal oxide particles having a relative dielectric constant of 50 to 2000.   The surface of the first metal layer in contact with the first insulating layer and the surface of the second metal layer are metal films mainly composed of nickel or chromium, and the first metal layer, the second metal layer, and the third metal layer The dielectric material for a multilayer printed wiring board with a built-in capacitor according to claim 5, wherein the metal layer is a metal layer mainly composed of copper.   A capacitor member using the dielectric material for a multilayer printed wiring board with a built-in capacitor according to claim 5, wherein the first metal layer, the second metal layer, and the third metal layer of the dielectric material A capacitor member, wherein the metal layer and the first insulating layer are patterned into an arbitrary shape.   A multilayer printed wiring board with a built-in capacitor comprising the capacitor member according to claim 9. A first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a second metal layer having a thickness of 5 to 50 μm A capacitor comprising an insulating layer and a third metal layer having a thickness of 10 to 35 μm, wherein the relative dielectric constant of the first insulating layer is 10 to 2000, and the relative dielectric constant of the second insulating layer is 20 to 100 A method for manufacturing a multilayer printed wiring board with a built-in capacitor using a dielectric material for a built-in multilayer printed wiring board,
(1) etching the first metal layer of the dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
(2) etching the first insulating layer to form an arbitrary dielectric pattern;
(3) etching the second metal layer and the third metal layer to form an arbitrary circuit conductor pattern including the electrodes 2 and 3;
(4) a step of aligning and fixing the dielectric material for the capacitor-embedded multilayer printed wiring board with the pattern formed thereon via an adhesive;
(5) A method of manufacturing a multilayer printed wiring board with a built-in capacitor, comprising the steps of forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern. A first metal layer having a thickness of 5 to 15 μm, a first insulating layer having a thickness of 0.1 to 1 μm, a second metal layer having a thickness of 10 to 35 μm, and a second metal layer having a thickness of 5 to 50 μm A multilayer print with a built-in capacitor comprising an insulating layer, wherein the first insulating layer has a relative dielectric constant of 10 to 2000, the second insulating layer is a semi-cured resin material, and the relative dielectric constant after curing is 20 to 100 A method of manufacturing a multilayer printed wiring board with a built-in capacitor using a dielectric material for wiring board,
(1) forming a substrate having a planarized surface filled with resin between circuit conductor patterns including electrodes 3;
(2) placing the resin surface of the dielectric material for a multilayer printed wiring board with a built-in capacitor on the substrate surface and stacking and integrating them;
(3) etching the first metal layer of the dielectric material for a multilayer printed wiring board with a built-in capacitor to form an arbitrary circuit conductor pattern including the electrode 1;
(4) etching the first insulating layer to form an arbitrary dielectric pattern;
(5) etching the second metal layer to form an arbitrary circuit conductor pattern including the electrode 2;
(6) A method of manufacturing a multilayer printed wiring board with a built-in capacitor, comprising the steps of forming an arbitrary insulating layer, forming a circuit conductor pattern, and forming an interlayer connection hole of the circuit conductor pattern.

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