JP2008227056A - Vertical heat treating boat and heat treating method for semiconductor wafer - Google Patents

Vertical heat treating boat and heat treating method for semiconductor wafer Download PDF

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JP2008227056A
JP2008227056A JP2007061632A JP2007061632A JP2008227056A JP 2008227056 A JP2008227056 A JP 2008227056A JP 2007061632 A JP2007061632 A JP 2007061632A JP 2007061632 A JP2007061632 A JP 2007061632A JP 2008227056 A JP2008227056 A JP 2008227056A
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support
heat treatment
auxiliary member
boat
flatness
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JP5061663B2 (en
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Takeshi Kobayashi
武史 小林
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Priority to JP2007061632A priority Critical patent/JP5061663B2/en
Priority to DE112008000667.9T priority patent/DE112008000667B4/en
Priority to US12/449,629 priority patent/US8003918B2/en
Priority to KR1020097018865A priority patent/KR101396850B1/en
Priority to PCT/JP2008/000384 priority patent/WO2008111286A1/en
Priority to TW097107714A priority patent/TW200903701A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vertical heat treating boat in which flatness in the supporting of a substrate to be treated can be easily improved when the substrate to be treated such as a semiconductor wafer is subjected to heat treatment by a vertical heat treating furnace and which can efficiently prevent the generation of slip dislocation, and a heat treating method for the semiconductor wafer. <P>SOLUTION: A vertical heat treating boat has at least four or more supports for horizontally supporting a substrate to be treated for each substrate to be treated to be supported. An auxiliary support member on which the substrate to be treated is laid is detachably attached to the four or more supports. Flatness obtained from each surface of each auxiliary support member on which the substrate to be treated is laid is adjusted by adjusting the thickness of the auxiliary support member according to each shape of the four or more supports or interposing a spacer between the support and the auxiliary support member. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、半導体ウエーハ等の被処理基板を熱処理する際に使用する縦型熱処理用ボートおよび半導体ウエーハの熱処理方法に関する。   The present invention relates to a vertical heat treatment boat used when heat treating a substrate to be treated such as a semiconductor wafer and a method for heat treating a semiconductor wafer.

半導体単結晶ウエーハ、例えばシリコンウエーハを用いてデバイスを作製する場合、ウエーハの加工プロセスから素子の形成プロセスまで多数の工程が介在し、その一つに熱処理工程がある。熱処理工程は、ウエーハの表層における無欠陥層の形成、ゲッタリング、結晶化、酸化膜形成、不純物拡散等を目的として行われる重要なプロセスである。   When a device is manufactured using a semiconductor single crystal wafer, for example, a silicon wafer, a number of steps are involved from a wafer processing process to an element formation process, and one of them is a heat treatment process. The heat treatment step is an important process performed for the purpose of forming a defect-free layer on the surface layer of the wafer, gettering, crystallization, oxide film formation, impurity diffusion, and the like.

このような熱処理工程、例えば、酸化や不純物拡散に用いられる拡散炉（酸化・拡散装置）としては、ウエーハの大口径化に伴い、多数のウエーハを所定の間隔をあけて水平に支持した状態で熱処理を行う縦型の熱処理炉が主に用いられている。そして、縦型熱処理炉を用いてウエーハを熱処理する際には、多数のウエーハをセットするための縦型熱処理用ボート（以下、「熱処理用ボート」又は単に「ボート」という場合がある。）が用いられる。   In such a heat treatment process, for example, a diffusion furnace (oxidation / diffusion apparatus) used for oxidation or impurity diffusion, a large number of wafers are supported horizontally at predetermined intervals as the wafer diameter increases. A vertical heat treatment furnace for performing heat treatment is mainly used. When a wafer is heat-treated using a vertical heat treatment furnace, there is a vertical heat treatment boat (hereinafter sometimes referred to as “heat treatment boat” or simply “boat”) for setting a large number of wafers. Used.

図８は、従来の一般的な縦型熱処理用ボート２１０の概略を示している。４本の支柱（ロッド）２１４の両端部に一対の板状部材（連結部材、あるいは天板と底板とも言う）２１６が連結されている。各支柱２１４には多数の溝２１１が形成され、各溝２１１間の凸部がウエーハの支持部２１２として作用する。ウエーハを熱処理する際には、図９（Ａ）の平面図、図９（Ｂ）の正面図に示したように、各支柱２１４の同じ高さに形成されている支持部２１２にウエーハＷの外周部を載置することでウエーハＷが水平に支持されることになる。   FIG. 8 shows an outline of a conventional general vertical heat treatment boat 210. A pair of plate-like members (also referred to as connecting members, or top and bottom plates) 216 are connected to both ends of the four support posts (rods) 214. A large number of grooves 211 are formed in each column 214, and the convex portion between the grooves 211 acts as a support portion 212 for the wafer. When the wafer is heat-treated, as shown in the plan view of FIG. 9A and the front view of FIG. 9B, the wafer W is placed on the support portion 212 formed at the same height of each column 214. By placing the outer peripheral portion, the wafer W is supported horizontally.

図１０は、縦型熱処理炉の一例を示す概略図である。縦型熱処理炉２２０の反応室２２２の内部に搬入された熱処理用ボート２１０には多数のウエーハＷが水平に支持されている。熱処理の際には、ウエーハＷは、反応室２２２の周囲に設けられたヒータ２２４によって加熱されることになる。熱処理中、反応室２２２にはガス導入管２２６を介してガスが導入され、上方から下方に向かって流れてガス排気管２２８から外部に排出される。使用するガスは熱処理の目的によって異なるが、主としてＨ２、Ｎ２、Ｏ２、Ａｒ等が用いられる。不純物拡散の場合には、これらのガスを不純物化合物ガスのキャリアガスとしても使用する。 FIG. 10 is a schematic view showing an example of a vertical heat treatment furnace. A number of wafers W are horizontally supported by the heat treatment boat 210 carried into the reaction chamber 222 of the vertical heat treatment furnace 220. During the heat treatment, the wafer W is heated by a heater 224 provided around the reaction chamber 222. During the heat treatment, gas is introduced into the reaction chamber 222 through the gas introduction pipe 226, flows downward from above, and is discharged from the gas exhaust pipe 228 to the outside. The gas to be used varies depending on the purpose of the heat treatment, but H 2 , N 2 , O 2 , Ar, etc. are mainly used. In the case of impurity diffusion, these gases are also used as a carrier gas for the impurity compound gas.

縦型熱処理用ボート２１０におけるウエーハ支持部２１２は種々の形状が採用されており、図１１（Ａ）（Ｂ）はそれぞれ一例を示している。（Ａ）の方は、半円柱形状の支柱２１４に凹み状の溝２１１を設けることで半円形の支持部２１２を形成したものである。一方、（Ｂ）の方は、（Ａ）のものよりもウエーハＷの中心に近い箇所を支持するために幅の広い角柱形状の支柱２１５に凹み状の溝２１１を設けて長方形の支持部２１３を形成したものである。他にも、溝形状を円弧状にしたものや、鉤型状にしたものなどもある。   Various shapes are adopted for the wafer support portion 212 in the vertical heat treatment boat 210, and FIGS. 11A and 11B show examples. In the case of (A), a semicircular support portion 212 is formed by providing a concave groove 211 in a semi-cylindrical column 214. On the other hand, in the case of (B), in order to support a portion closer to the center of the wafer W than that of (A), a rectangular support section 213 is provided by providing a concave column 211 on a prismatic column 215 having a wide width. Is formed. In addition, there are those in which the groove shape is an arc shape, and the groove shape is a hook shape.

また、支柱に比較的大きな板状の支持部（支持板）を設けることでウエーハを安定した状態で支持するもの（特許文献１参照）や、各支持部の上面に段差を設けることで直径の異なるウエーハを支持することができるようにしたもの（特許文献２参照）なども提案されている。   In addition, a relatively large plate-like support portion (support plate) is provided on the support column to support the wafer in a stable state (see Patent Document 1), and a step is provided on the upper surface of each support portion to increase the diameter. A device that can support different wafers (see Patent Document 2) has also been proposed.

ボートの材質に関しては、例えばシリコンウエーハ用としては、ウエーハの汚染を防ぐため、通常、石英（ＳｉＯ２）、炭化珪素（ＳｉＣ）、シリコン（Ｓｉ）等の材料が使用されている。例えば、１０００℃を超えるような高温熱処理工程では、石英（ＳｉＯ２）製のボートよりも耐熱性が高いＳｉＣやＳｉ製のボートが使用されている。特にＳｉＣ製のボートは、ＣＶＤ−ＳｉＣコートを施すことにより熱処理中に発生する金属汚染をより低減させることができることから多く使用されている。 Regarding the material of the boat, for example, for silicon wafers, materials such as quartz (SiO 2 ), silicon carbide (SiC), silicon (Si), etc. are usually used to prevent contamination of the wafer. For example, in a high-temperature heat treatment step exceeding 1000 ° C., a SiC or Si boat having higher heat resistance than a quartz (SiO 2 ) boat is used. In particular, SiC boats are often used because metal contamination generated during heat treatment can be further reduced by applying a CVD-SiC coating.

ところで、縦型熱処理用ボートを使用すると、特に酸化や不純物拡散等を目的とした高温の熱処理を行う場合、ウエーハの自重による内部応力やウエーハ内温度分布の不均一性による熱歪応力などが生じ、これらの応力がある一定の臨界値を超えると、ウエーハに結晶欠陥であるスリップ（スリップ転位）が発生してしまう。この転位発生の臨界値は高温になると急激に小さくなるため、高温になる程スリップ転位が発生し易くなることが知られている。スリップ転位発生箇所に素子を形成すると、接合リーク等の原因となり、デバイス作製の歩留まりを著しく低下させることがあった。   By the way, when a boat for vertical heat treatment is used, particularly when high-temperature heat treatment is performed for the purpose of oxidation or impurity diffusion, internal stress due to the weight of the wafer or thermal strain stress due to nonuniformity of the temperature distribution in the wafer occurs. When these stresses exceed a certain critical value, slip (slip dislocation) that is a crystal defect occurs in the wafer. It is known that the critical value for the occurrence of dislocation rapidly decreases as the temperature rises, so that slip dislocation is more likely to occur as the temperature increases. If an element is formed at a location where slip dislocations are generated, it may cause a junction leak or the like, and the yield of device fabrication may be significantly reduced.

このスリップ転位は、ウエーハが大口径化すると、より一層その発生の抑制が難しくなることが知られている。大口径化によりウエーハ荷重が増し、また、例えばウエーハを支持する支持部を３つとする３点支持の場合では、ウエーハ荷重が３つの支持部のうちの１つに集中しやすくなり、スリップ転位が発生しやすい。そこで、スリップ転位発生の抑制のためにウエーハ荷重を分散させる必要があることから、３点支持よりも、図８、９のように４つあるいはそれ以上の支持部を設け、４点以上で支持することが可能な縦型熱処理用ボートが用いられている。   This slip dislocation is known to become more difficult to suppress as the wafer diameter increases. The wafer load increases due to the increase in diameter, and, for example, in the case of a three-point support in which there are three support portions for supporting the wafer, the wafer load is likely to be concentrated on one of the three support portions, and slip dislocation occurs. Likely to happen. Therefore, since it is necessary to disperse the wafer load in order to suppress the occurrence of slip dislocation, four or more support parts are provided as shown in FIGS. A vertical heat treatment boat that can be used is used.

特開２０００−５３４９７号公報JP 2000-53497 A 特開２００５−１５９０２８号公報Japanese Patent Laid-Open No. 2005-159028

しかしながら、上記のようにウエーハ荷重を分散させるのを目的とし、４点以上の支持によるボートを用いてウエーハを支持して熱処理した場合でもスリップ転位が発生してしまっていた。
これは、支持部の数が増えた分、後述する上記４つ以上の支持部により得られる平面度が悪化し易く、これによって荷重のアンバランスが引き起こされ、その結果、スリップ転位が発生し易くなるためであることを本発明者は発見した。 However, for the purpose of dispersing the wafer load as described above, slip dislocation has occurred even when the wafer is supported and heat-treated using a boat with four or more supports.
This is because the flatness obtained by the above-described four or more support portions, which will be described later, is likely to deteriorate due to the increase in the number of support portions. The present inventor has discovered that this is the case.

また、例えばＳｉＣ製のボート等は加工が困難であり、ボート自体の加工によって、上記４つ以上の支持部全てによる平面度が改善されるように、支持部の高さが精密にそろうよう高精度に加工するのは非常に難しい。特に、図１１（Ｂ）に示すような支持部の長さが長いロングフィンガーボートの場合、極めて困難である。   For example, a boat made of SiC is difficult to process, and the height of the support portion is precisely aligned so that the flatness of all the four or more support portions is improved by processing the boat itself. It is very difficult to process with high accuracy. In particular, in the case of a long finger boat having a long support portion as shown in FIG.

ここで、上記平面度について詳述する。ここで言う平面度は、例えば以下のように、三次元測定器等によって測定された支持部等の形状の測定結果を用いて算出することができる。
まず、図４に三次元測定器を用いた支持部の形状の測定方法の概要を示す。
この三次元測定器２１は、それぞれＸ、Ｙ、Ｚ方向に移動可能なＡ、Ｂ、Ｃ部分を有するアーム２２、該アーム２２の先に取り付けられたプローブ２３、被測定物（縦型熱処理用ボート）を載上する石定盤２４を備えている。上記プローブ２３は回転可能となっており、該プローブ２３の先端にはルビーの玉が付いている。 Here, the flatness will be described in detail. The flatness mentioned here can be calculated by using the measurement result of the shape of the support portion or the like measured by a three-dimensional measuring instrument or the like, for example, as follows.
First, FIG. 4 shows an outline of a method for measuring the shape of the support using a three-dimensional measuring device.
The three-dimensional measuring instrument 21 includes an arm 22 having A, B, and C portions movable in the X, Y, and Z directions, a probe 23 attached to the tip of the arm 22, and an object to be measured (for vertical heat treatment). A stone surface plate 24 on which a boat is mounted is provided. The probe 23 is rotatable, and a ruby ball is attached to the tip of the probe 23.

そして、測定にあたっては、アーム２２やプローブ２３を用いて位置を調整し、プローブ２３のルビーの玉を縦型熱処理用ボートのそれぞれの支持部に押し付け、それによって各測定箇所におけるＺ座標を求めることができる。測定箇所は、支持部の長さや大きさ等に応じて適宜設定することができ特に限定されないが、例えば１枚の被処理基板を支持する支持部が４つの場合、１つの支持部ごとに２つの測定箇所とし、合計８つの測定箇所とすることができる（図１（Ｂ）参照）。なお、Ｚ座標の基準（基準面）は、例えば石定盤２４の上面（縦型熱処理用ボートの底板の裏面）とすることができる。   In the measurement, the position is adjusted using the arm 22 or the probe 23, and the ruby ball of the probe 23 is pressed against each support portion of the vertical heat treatment boat, thereby obtaining the Z coordinate at each measurement location. Can do. The measurement location can be appropriately set according to the length, size, etc. of the support part, and is not particularly limited. For example, when there are four support parts for supporting one substrate to be processed, 2 for each support part. There can be eight measurement points in total (see FIG. 1B). The Z coordinate reference (reference plane) can be, for example, the upper surface of the stone surface plate 24 (the rear surface of the bottom plate of the vertical heat treatment boat).

このようにして得られた各測定箇所のＺ座標のうち、最低点（すなわち、基準面に一番近い測定箇所におけるＺ座標）からそれぞれの点（それぞれの測定箇所におけるＺ座標）までの変位を求める。そして、得られた変位データより、上記８点の最小二乗平面を算出し、該最小二乗平面から８点のうち最も離れた点までの距離を平面度と規定する。   Of the Z coordinates of each measurement location obtained in this way, the displacement from the lowest point (that is, the Z coordinate at the measurement location closest to the reference plane) to each point (Z coordinate at each measurement location) is calculated. Ask. Then, from the obtained displacement data, the least square plane of the eight points is calculated, and the distance from the least square plane to the most distant point among the eight points is defined as flatness.

本発明は、上記のように、支持部が４つ以上の場合における荷重のアンバランスから生じる問題点を鑑みてなされたもので、縦型熱処理炉により半導体ウエーハ等の被処理基板を熱処理する際、被処理基板の支持における平面度を容易に改善することができ、スリップ転位の発生を効果的に防止することが可能な縦型熱処理用ボートおよび半導体ウエーハの熱処理方法を提供することを目的とする。   The present invention has been made in view of the problems arising from load imbalance when there are four or more support portions as described above. When a substrate to be processed such as a semiconductor wafer is heat-treated in a vertical heat treatment furnace. An object of the present invention is to provide a vertical heat treatment boat and a semiconductor wafer heat treatment method capable of easily improving the flatness in supporting a substrate to be processed and effectively preventing the occurrence of slip dislocation. To do.

上記目的を達成するために、本発明は、少なくとも、被処理基板を水平に支持するための支持部を、支持する被処理基板一枚あたりで４つ以上有しており、該４つ以上の支持部には、各々、前記被処理基板が載置される支持補助部材が着脱可能に装着されている縦型熱処理用ボートであって、前記４つ以上の支持部の各々の形状に合わせて、前記支持補助部材の厚さを調節するか、前記支持部と前記支持補助部材との間にスペーサを介在させることによって、前記被処理基板が載置される各々の支持補助部材の面全てから得られる平面度が調整されているものであることを特徴とする縦型熱処理用ボートを提供する（請求項１）。   In order to achieve the above object, the present invention has at least four support portions for supporting the substrate to be processed in a horizontal direction, and the four or more support portions for each substrate to be processed are supported. Each of the support portions is a vertical heat treatment boat in which a support auxiliary member on which the substrate to be processed is placed is detachably attached, and is adapted to the shape of each of the four or more support portions. By adjusting the thickness of the support auxiliary member or by interposing a spacer between the support portion and the support auxiliary member, the entire surface of each support auxiliary member on which the substrate to be processed is placed is placed. Provided is a vertical heat treatment boat characterized in that the obtained flatness is adjusted (Claim 1).

このような縦型熱処理用ボートであれば、被処理基板が載置される各々の支持補助部材の面全てから得られる平面度が調整されているものであるので、被処理基板が載置される各支持補助部材への荷重が均一となり、荷重がアンバランスになるのを防止することができ、ひいてはスリップ転位の発生を効果的に抑制することが可能である。   In such a vertical heat treatment boat, since the flatness obtained from all the surfaces of the respective supporting auxiliary members on which the substrate to be processed is placed is adjusted, the substrate to be processed is placed. The load on each supporting auxiliary member becomes uniform and the load can be prevented from becoming unbalanced. As a result, the occurrence of slip dislocation can be effectively suppressed.

そして、上記平面度の調整は、一枚あたりの被処理基板を支持する４つ以上の支持部の各々の形状に合わせて、支持補助部材の厚さを調節するか、支持部と支持補助部材との間にスペーサを介在させることによって行われたものであるので、極めて容易に調整されたものとなる。すなわちボート自体が高精度に加工されたものであるという実現が困難なものではなく、微調整がし易い支持補助部材の厚さやスペーサにより調整されたものであるため、簡単かつ正確に平面度が調整されたものとすることができる。   The flatness is adjusted by adjusting the thickness of the support auxiliary member or adjusting the thickness of the support auxiliary member according to the shape of each of the four or more support portions that support the substrate to be processed. Therefore, the adjustment is extremely easy. In other words, it is not difficult to realize that the boat itself is processed with high precision, and it is adjusted by the thickness of the support auxiliary member and the spacer that are easy to fine-tune. It can be adjusted.

このとき、前記縦型熱処理用ボートは、４本以上の支柱と、各支柱の両端部に連結した一対の板状部材とを有し、溝が水平方向に複数形成されていることにより、前記各支柱に前記支持部が垂直方向で複数形成されたものであり、前記各溝ごとに、１枚ずつ、前記被処理基板が挿入されて前記４つ以上の支持部により支持されるものであるのが望ましい（請求項２）。   At this time, the vertical heat treatment boat has four or more struts and a pair of plate-like members connected to both ends of each strut, and a plurality of grooves are formed in the horizontal direction. A plurality of support portions are formed in each column in the vertical direction, and the substrate to be processed is inserted and supported by the four or more support portions, one for each groove. (Claim 2).

このような構成の縦型熱処理用ボートであれば、各溝ごとに、１枚ずつ、被処理基板が挿入されて４つ以上の支持部により支持されるとともに、複数枚の被処理基板を一度に支持することができるものであるため、複数枚の被処理基板を同時に効率良く高品質に熱処理することができるものとなる。   In the case of the vertical heat treatment boat having such a configuration, a substrate to be processed is inserted into each groove and supported by four or more support portions, and a plurality of substrates to be processed are once attached. Therefore, a plurality of substrates to be processed can be efficiently and efficiently heat-treated at the same time.

また、本発明は、少なくとも、半導体ウエーハを一枚あたり４つ以上の支持部により水平に支持して熱処理を行うときに、前記４つ以上の支持部に、各々、支持補助部材を着脱可能に装着し、該支持補助部材上に前記半導体ウエーハを載置して熱処理する半導体ウエーハの熱処理方法であって、前記４つ以上の支持部の形状を各々測定し、該測定から４つ以上の支持部全てによる平面度を得て、該得られた平面度に基づいて、前記支持補助部材の厚さを調節して、前記測定した各々の支持部の形状に合わせて、前記厚さを調節した支持補助部材を選択し、該選択した支持補助部材を前記支持部に装着するか、前記測定した各々の支持部の形状に合わせてスペーサを選択し、該選択したスペーサを挟んで前記支持部に前記支持補助部材を装着して、前記各々の支持補助部材の載置面全てによる平面度を調整してから、該載置面上に前記半導体ウエーハを載置して熱処理を行うことを特徴とする半導体ウエーハの熱処理方法を提供する（請求項３）。   Further, according to the present invention, at least when a semiconductor wafer is horizontally supported by four or more support portions per one and subjected to heat treatment, a support auxiliary member can be attached to and detached from each of the four or more support portions. A semiconductor wafer heat treatment method for mounting and mounting the semiconductor wafer on the support auxiliary member, and measuring the shape of each of the four or more support portions, and measuring the four or more supports. The flatness by all the parts was obtained, the thickness of the support auxiliary member was adjusted based on the obtained flatness, and the thickness was adjusted according to the shape of each of the measured support parts A support auxiliary member is selected, and the selected support auxiliary member is attached to the support portion, or a spacer is selected according to the shape of each of the measured support portions, and the support portion is sandwiched between the selected support portions. Wearing the support auxiliary member A method for heat-treating a semiconductor wafer, comprising: adjusting the flatness of all the supporting surfaces of each of the supporting auxiliary members, and placing the semiconductor wafer on the placing surface to perform heat treatment. (Claim 3).

このように、本発明の半導体ウエーハの熱処理方法では、各々の支持補助部材の載置面全てによる平面度を調整してから、該載置面上に半導体ウエーハを載置して熱処理を行うので、半導体ウエーハの荷重が各支持補助部材へ均一になるように載置し、熱処理することが可能である。したがって、従来のようにウエーハ荷重のアンバランスが発生するのを防止し、それによって引き起こされるスリップ転位を効果的に抑制することができる。   As described above, in the semiconductor wafer heat treatment method according to the present invention, the flatness of all the supporting surfaces of each supporting auxiliary member is adjusted, and then the semiconductor wafer is mounted on the mounting surface to perform the heat treatment. It is possible to place the semiconductor wafer on each supporting auxiliary member and heat-treat them so that they are uniform. Therefore, it is possible to prevent the wafer load from being unbalanced as in the prior art, and to effectively suppress the slip dislocation caused thereby.

さらには、上記平面度の調整を、まず、一枚あたりの半導体ウエーハを支持する４つ以上の支持部の形状を各々測定し、該測定から４つ以上の支持部全てによる平面度を得て、該得られた平面度に基づいて、支持補助部材の厚さを調節して、測定した各々の支持部の形状に合わせて、厚さを調節した支持補助部材を選択し、選択した支持補助部材を支持部に装着するか、測定した各々の支持部の形状に合わせてスペーサを選択し、選択したスペーサを挟んで支持部に支持補助部材を装着することによって行うので、極めて容易に調整することができる。ボート自体を高精度に加工するという困難な方法ではなく、微調整がし易い支持補助部材の厚さやスペーサを選択して調整するので、簡単かつ正確に平面度の調整を行うことができる。   Further, in the adjustment of the flatness, first, the shape of each of the four or more support portions that support each semiconductor wafer is measured, and the flatness of all the four or more support portions is obtained from the measurement. Based on the obtained flatness, the thickness of the supporting auxiliary member is adjusted, and the supporting auxiliary member having the adjusted thickness is selected in accordance with the measured shape of each supporting portion, and the selected supporting auxiliary member is selected. It is very easy to adjust by attaching the member to the support part or selecting the spacer according to the measured shape of each support part and attaching the support auxiliary member to the support part across the selected spacer. be able to. It is not a difficult method of processing the boat itself with high accuracy, but the thickness of the support auxiliary member and the spacer that are easy to fine-tune are selected and adjusted, so that the flatness can be adjusted easily and accurately.

このとき、前記熱処理を、４本以上の支柱と、各支柱の両端部に連結した一対の板状部材とを有し、溝が水平方向に複数形成されていることにより、前記各支柱に前記支持部が垂直方向で複数形成されたものであり、前記各溝ごとに、１枚ずつ、前記半導体ウエーハが挿入されて前記４つ以上の支持部により支持される縦型熱処理用ボートを用いて行うのが望ましい（請求項４）。   At this time, the heat treatment includes four or more struts and a pair of plate-like members connected to both ends of each strut, and a plurality of grooves are formed in the horizontal direction. A plurality of support portions are formed in a vertical direction, and a vertical heat treatment boat is used in which the semiconductor wafer is inserted and supported by the four or more support portions, one for each groove. It is desirable to do this (claim 4).

このような構成の縦型熱処理用ボートを用いて熱処理を行う方法であれば、各溝ごとに、１枚ずつ、半導体ウエーハが挿入されて４つ以上の支持部により支持されるとともに、複数枚の半導体ウエーハを一度に支持することができるため、複数枚の半導体ウエーハを同時に効率良く高品質に熱処理することができる。   In the method of performing heat treatment using the vertical heat treatment boat having such a configuration, one wafer is inserted for each groove, and a semiconductor wafer is inserted and supported by four or more support portions. Therefore, a plurality of semiconductor wafers can be simultaneously and efficiently heat-treated with high quality.

以上のように、本発明の縦型熱処理用ボートおよび半導体ウエーハの熱処理方法によって、半導体ウエーハ等の被処理基板の支持（載置）において、これが載置される各々の支持補助部材の面全てから得られる平面度を調整することができ、バランスよく被処理基板を支持して熱処理を施すことが可能となり、大口径であっても基板荷重のアンバランスから生じるスリップ転位を抑制することができる。しかも、支持補助部材の厚さやスペーサの調整により上記平面度の調整を行うので、高精度かつ容易に調整することができる。   As described above, according to the vertical heat treatment boat and the semiconductor wafer heat treatment method of the present invention, in the support (placement) of the substrate to be processed such as a semiconductor wafer, the entire surface of each supporting auxiliary member on which the substrate is placed is placed. The flatness obtained can be adjusted, the substrate to be processed can be supported in a well-balanced manner and heat treatment can be performed, and slip dislocation resulting from substrate load imbalance can be suppressed even with a large diameter. In addition, since the flatness is adjusted by adjusting the thickness of the support auxiliary member and the spacer, it can be adjusted with high accuracy and ease.

以下では、本発明の実施の形態について説明するが、本発明はこれに限定されるものではない。
上述したように、縦型熱処理用ボートにおいて、３点支持のものの場合、１つの支持部に荷重が集中してスリップ転位が発生し易い。これを改善するべく４点以上の支持のものが用いられるが、平面度の悪化が引き起こす荷重のアンバランスにより、荷重分散の効果が発揮されずスリップ転位が生じてしまう。さらには、ボート自体を高精度に加工することは難しく、平面度の改善は容易ではなかった。 Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.
As described above, in the case of the three-point support boat in the vertical heat treatment boat, the load is concentrated on one support portion and slip dislocation is likely to occur. In order to improve this, a support having four or more points is used. However, due to load imbalance caused by deterioration of flatness, the effect of load distribution is not exhibited and slip dislocation occurs. Furthermore, it is difficult to process the boat itself with high precision, and it has been difficult to improve the flatness.

そこで、本発明者が、この荷重の均一化を目的として鋭意研究を行ったところ、以下のことを見出した。
すなわち、まず、被処理基板を支持する４つ以上の支持部の形状を測定する。その後、該測定した各々の支持部の形状に合わせ、実際に被処理基板が載置されることになる支持補助部材の厚さを調節するか、支持補助部材と支持部との間にスペーサを介在させる。これにより、各支持補助部材の載置面全てによる平面度を調整してから被処理基板を載置して熱処理すれば、平面度の調整を簡単かつ正確に行えるし、平面度を改善させて被処理基板の荷重のアンバランスをなくし、スリップ転位の発生を抑制することができる。本発明者はこれらのことを見出し本発明を完成させた。 Then, when this inventor earnestly researched for the purpose of equalization | homogenization of this load, the following things were found.
That is, first, the shape of four or more support portions that support the substrate to be processed is measured. Thereafter, in accordance with the shape of each of the measured support portions, the thickness of the support auxiliary member on which the substrate to be processed is actually placed is adjusted, or a spacer is provided between the support auxiliary member and the support portion. Intervene. This makes it possible to adjust the flatness easily and accurately and to improve the flatness by adjusting the flatness of all the supporting surfaces of each supporting auxiliary member and then placing the substrate to be processed and heat-treating it. The unbalance of the load on the substrate to be processed can be eliminated, and the occurrence of slip dislocation can be suppressed. The inventor found these things and completed the present invention.

以下、本発明の縦型熱処理用ボートについて、図面を参照しながら詳細に説明するが、本発明はこれに限定されるものではない。例えば、以下では、縦型熱処理ボートにおいて、支柱が４本、すなわち１枚あたりの被処理基板を支持する支持部が４つの場合について述べるが、当然支持部の数が５つ以上のものとすることもできる。
図１（Ａ）は本発明の縦型熱処理用ボート全体の一例の概略を示している。この熱処理用ボート１は、まず、４本の支柱４と、各支柱４の両端部に連結した一対の板状部材６（天板および底板）とを有している。各支柱４には、水平方向に複数の溝７が等間隔で形成されており、これにより、それぞれの溝７の間に被処理基板（ここでは、半導体ウエーハとする）の支持部２が凸形状に複数形成されている。そして、この本発明の縦型熱処理用ボート１では、各支柱４の支持部２に支持補助部材３が着脱可能に装着される。ウエーハを熱処理する際には、各支柱４の同程度の高さに形成された支持部２に溝７から挿入して装着した支持補助部材３上に各々１枚ずつウエーハが載置される。 Hereinafter, the vertical heat treatment boat of the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto. For example, in the following, in the vertical heat treatment boat, a case where there are four support columns, that is, four support portions for supporting each substrate to be processed will be described, but naturally the number of support portions is five or more. You can also
FIG. 1A shows an outline of an example of the entire boat for vertical heat treatment according to the present invention. The boat for heat treatment 1 has four struts 4 and a pair of plate members 6 (top and bottom plates) connected to both ends of each strut 4. A plurality of grooves 7 are formed at equal intervals in each column 4 so that the support portion 2 of the substrate to be processed (here, a semiconductor wafer) protrudes between the grooves 7. A plurality of shapes are formed. In the vertical heat treatment boat 1 of the present invention, the support auxiliary member 3 is detachably attached to the support portion 2 of each support column 4. When the wafer is heat-treated, one wafer is placed on each supporting auxiliary member 3 that is inserted into the support portion 2 formed at the same height of each support column 4 from the groove 7 and attached.

これにより、複数のウエーハを垂直方向で一度に支持して熱処理することができる構造になっており、効率良く多数枚のウエーハを熱処理することができる。溝７の数（支持部２の数）は特に限定されず、ボート１を入れる熱処理炉の大きさ等により、その都度決定することができる。   Thus, a structure in which a plurality of wafers can be supported and heat-treated at a time in the vertical direction can be efficiently heat-treated. The number of grooves 7 (the number of support portions 2) is not particularly limited, and can be determined each time depending on the size of the heat treatment furnace in which the boat 1 is placed.

ここで、まず、上記支柱４、板状部材６、支持部２からなるボート本体について述べる。このボート本体は、従来と同様のものとすることができる。すなわち、従来と同様にして、例えばＳｉＣからなる支柱と板状部材を接合してから、支柱を加工して水平方向に溝７を複数形成し、支持部２等の各部を形成したものとすることができる。もちろん、材質はＳｉＣに限定されず、Ｓｉ製や、ＳｉＯ２製のものとすることができる。 Here, first, a description will be given of a boat body including the support column 4, the plate-like member 6, and the support portion 2. The boat body can be the same as the conventional one. That is, in the same manner as in the prior art, for example, a post made of SiC and a plate-like member are joined, then the post is processed to form a plurality of grooves 7 in the horizontal direction, and each part such as the support portion 2 is formed. be able to. Of course, the material is not limited to SiC, and can be made of Si or SiO 2 .

しかしながら、上述したように、従来の加工技術では高精度に加工することは困難であるため、このボート本体では、図４のような三次元測定器を用いて支持部２の形状測定を行った場合、各測定箇所において様々なＺ座標（例えば、縦型熱処理ボート１の底板の裏面を基準とし、該基準からの高さ）を示すものとなる。すなわち、図１（Ｂ）は、図１（Ａ）のボート全体図において、支持補助部材３がはずされた状態（すなわち、ボート本体）の同じ一枚のウエーハを支持する支持部２の一組を示す平面図であるが、図中に示す４つの支持部２ａ（ＦＬ）、２ｂ（ＲＬ）、２ｃ（ＲＲ）、２ｄ（ＦＲ）の計８つの測定箇所でそれぞれ様々な高さを有している。そして、これらの高さのデータから得られる支持部２ａ〜２ｄの上面（支持面）全てによる平面度が比較的大きい値をとる場合、支持部２ａ〜２ｄの相対位置（高さ）に大きな差があるわけだから、このような従来のボート本体のみでは、ウエーハを支持した際、荷重がアンバランスとなり、ウエーハ荷重が各支持部２ａ〜２ｄに均一に分散されず、その結果、熱処理した際にスリップ転位が発生してしまう。   However, as described above, since it is difficult to process with high precision by the conventional processing technique, the shape of the support portion 2 was measured using a three-dimensional measuring device as shown in FIG. 4 in this boat body. In this case, various Z coordinates (for example, the height from the reference with respect to the back surface of the bottom plate of the vertical heat treatment boat 1) are indicated at each measurement location. That is, FIG. 1B shows a pair of support portions 2 that support the same wafer in a state where the support auxiliary member 3 is removed (that is, the boat body) in the overall boat view of FIG. However, each of the four support portions 2a (FL), 2b (RL), 2c (RR), and 2d (FR) shown in the figure has various heights. ing. When the flatness of all the upper surfaces (support surfaces) of the support portions 2a to 2d obtained from these height data takes a relatively large value, there is a large difference in the relative positions (heights) of the support portions 2a to 2d. Therefore, with such a conventional boat body alone, when the wafer is supported, the load becomes unbalanced, and the wafer load is not evenly distributed to each of the support portions 2a to 2d. Slip dislocation occurs.

一方、本発明の縦型熱処理用ボート１では、上記支持部２ａ〜２ｄの形状測定結果を基にして、ボート本体の支持部２ａ〜２ｄのそれぞれに対し、各々適切な厚さに調節された支持補助部材３ａ〜３ｄが装着されている。図２は支持部２ａ〜２ｄに支持補助部材３ａ〜３ｄを装着した場合の平面図であり、図３（Ａ）は支持部２ａ〜２ｄに支持補助部材３ａ〜３ｄが装着されている様子の一例を示す断面図である。
また、図３（Ｂ）の断面図に示すように、支持部２ａ〜２ｄと支持補助部材３ｅとの間に適切なスペーサ１２ａ〜１２ｄが介在されたものとすることもできる。 On the other hand, in the vertical heat treatment boat 1 of the present invention, the thicknesses of the support portions 2a to 2d of the boat body were adjusted to appropriate thicknesses based on the shape measurement results of the support portions 2a to 2d. Supporting auxiliary members 3a to 3d are mounted. FIG. 2 is a plan view when the supporting auxiliary members 3a to 3d are attached to the supporting portions 2a to 2d, and FIG. 3A is a state in which the supporting auxiliary members 3a to 3d are attached to the supporting portions 2a to 2d. It is sectional drawing which shows an example.
Further, as shown in the cross-sectional view of FIG. 3B, appropriate spacers 12a to 12d may be interposed between the support portions 2a to 2d and the support auxiliary member 3e.

そして、上記厚さの調節された支持補助部材３ａ〜３ｄ、スペーサ１２ａ〜１２ｄにより、実際にウエーハが載置される面（各支持補助部材３ａ〜３ｄ、３ｅの上面）のそれぞれの相対位置が調整され、これら載置面全てから得られる平面度が調整されたものとなっている。支持補助部材３ａ〜３ｄ、スペーサ１２ａ〜１２ｄの調節は、ボート自体の加工に比べれば極めて容易であり、高精度に行うことができる。したがって、支持補助部材を装着したボート１はウエーハの載置において、効率良く平面度が調整されたものとなり、また、これを用いて熱処理を実施する場合にスリップ転位を効果的に抑制でき、高品質の熱処理ウエーハを生産できるものである。
なお、図３では、上記全ての支持補助部材の載置面の高さが一致している場合を示しているが、これに限定されず、各種条件に応じて相対位置を適宜調整し、所望の平面度が得られるように調整されたものとすることができる。
また、所望の平面度に調整されていれば良く、厚さ調整やスペーサの介在は、全ての支持補助部材に対して行っても良いし、また、一部のものに対してのみ行うこともできる。 The relative positions of the surfaces on which the wafer is actually placed (the upper surfaces of the respective support auxiliary members 3a to 3d and 3e) are set by the support auxiliary members 3a to 3d and the spacers 12a to 12d having the adjusted thicknesses. It is adjusted, and the flatness obtained from all these mounting surfaces is adjusted. The adjustment of the supporting auxiliary members 3a to 3d and the spacers 12a to 12d is extremely easy as compared with the processing of the boat itself, and can be performed with high accuracy. Therefore, the boat 1 equipped with the supporting auxiliary member has a flatness adjusted efficiently when the wafer is placed, and when the heat treatment is performed using this, the slip dislocation can be effectively suppressed, A quality heat-treated wafer can be produced.
FIG. 3 shows a case where the heights of the mounting surfaces of all the supporting auxiliary members are the same. However, the present invention is not limited to this, and the relative position is appropriately adjusted according to various conditions, and desired. It can be adjusted so as to obtain a flatness of.
Moreover, it is sufficient that the flatness is adjusted to a desired level. Thickness adjustment and spacer interposition may be performed for all supporting auxiliary members, or only for a part of them. it can.

次に、本発明の半導体ウエーハの熱処理方法について述べる。この本発明の方法では、例えば上述した本発明の縦型熱処理用ボート（図１〜３）を用いて実施することができる。当然他のボートを用いることもでき、後述する本発明の方法を実施できるものであれば良い。なお、半導体ウエーハ１枚を支持する支持部２の数等は、上記と同様に４つ以上であれば良く特に限定されない。ここでは、支持部が４つの場合を例に挙げて述べる。
まず、上述したように、図４に示す三次元測定器２１を用い、支持部２ａ〜２ｄの形状測定を行う。すなわち、各支持部２ａ〜２ｄの例えば計８つの測定箇所のＺ座標を測定する。
ここで、得られた各Ｚ座標において、例えば８番目の測定箇所の値が最も低い値となった場合、その最低点を基準にし、それぞれの測定箇所における値までの変位を算出する。その後、この算出した変位データより最小二乗平面Ｓを算出し、この平面から最も離れた点までの距離である平面度Ｌを得る。 Next, a heat treatment method for the semiconductor wafer of the present invention will be described. In the method of the present invention, for example, the above-described vertical heat treatment boat (FIGS. 1 to 3) of the present invention can be used. Of course, other boats can be used as long as they can implement the method of the present invention described later. In addition, the number of the support parts 2 etc. which support one semiconductor wafer should just be four or more similarly to the above, and are not specifically limited. Here, a case where there are four support portions will be described as an example.
First, as described above, the shape of the support portions 2a to 2d is measured using the three-dimensional measuring device 21 shown in FIG. That is, for example, the Z coordinates of, for example, a total of eight measurement locations of each support portion 2a to 2d are measured.
Here, in each Z coordinate obtained, for example, when the value of the eighth measurement location is the lowest value, the displacement up to the value at each measurement location is calculated with the lowest point as a reference. Thereafter, a least square plane S is calculated from the calculated displacement data, and a flatness L which is a distance to a point farthest from the plane is obtained.

次に、上記測定によって得られた各支持部２ａ〜２ｄの形状に合わせて、厚さを調節した支持補助部材３ａ〜３ｄを選択し、それぞれ支持部２ａ〜２ｄに装着する。
より具体的には、平面度を上記のようにして得た値Ｌよりも小さな値に調整（すなわち、平面度を改善）したいのであれば、例えば、Ｚ座標の低い支持部２ｂや２ｄに対し、Ｚ座標の高い支持部２ａや２ｃに装着する支持補助部材３ａ、３ｃの厚さよりも厚いものを、支持補助部材３ｂ、３ｄとして選択して装着することができる（図３（Ａ）参照）。
これにより、各支持補助部材３ａ〜３ｄの載置面の相対位置（高さ）を狭めることができ、ひいては平面度をＬよりも小さくすることが可能である。 Next, according to the shape of each support part 2a-2d obtained by the said measurement, the support auxiliary member 3a-3d which adjusted thickness was selected, and it mounts | wears with support part 2a-2d, respectively.
More specifically, if it is desired to adjust the flatness to a value smaller than the value L obtained as described above (that is, improve the flatness), for example, for the support portions 2b and 2d having a low Z coordinate, The support auxiliary members 3a and 3c to be mounted on the support portions 2a and 2c having a high Z coordinate can be selected and mounted as the support auxiliary members 3b and 3d (see FIG. 3A). .
Thereby, the relative position (height) of the mounting surface of each support auxiliary member 3a-3d can be narrowed, and it is possible to make flatness smaller than L by extension.

なお、平面度の調整にあたっては、支持補助部材３ａ〜３ｄの選択の仕方は上記方法に限定されず、各測定箇所におけるデータ（支持部２ａ〜２ｄの形状）を基にして適宜決定することができる。調整後に所望の平面度が得られるように、その都度、支持補助部材の厚さを調節し、適切に支持補助部材３ａ〜３ｄを選択して装着すれば良い。   In adjusting the flatness, the method of selecting the support auxiliary members 3a to 3d is not limited to the above method, and can be determined as appropriate based on the data (shapes of the support portions 2a to 2d) at each measurement location. it can. In order to obtain a desired flatness after adjustment, the thickness of the support auxiliary member may be adjusted each time, and the support auxiliary members 3a to 3d may be appropriately selected and mounted.

また、平面度の調整は、支持補助部材３の厚さの調節による方法だけでなく、支持補助部材３と支持部２の間に適切なスペーサ１２を選択して挟むことによって行うこともできる。
支持部２ａ〜２ｄの形状に合わせ、例えば適切な厚さを有するスペーサ１２ａ〜１２ｄを支持補助部材３ｅと支持部２ａ〜２ｄの間に挟み、支持補助部材３ｅを装着すれば、たとえ、支持部２ａ〜２ｄの上面の相対位置等がずれていて、また、各支持部に装着する支持補助部材３ｅの厚さが同じであっても、それぞれの支持補助部材３ｅのウエーハ載置面を適切に調整することができ、ひいては所望の平面度に調整することができる（図３（Ｂ）参照）。 Further, the flatness can be adjusted not only by adjusting the thickness of the support auxiliary member 3 but also by selecting and inserting an appropriate spacer 12 between the support auxiliary member 3 and the support portion 2.
For example, if the support auxiliary member 3e is mounted by sandwiching the spacers 12a to 12d having an appropriate thickness between the support auxiliary member 3e and the support parts 2a to 2d in accordance with the shape of the support parts 2a to 2d, the support part Even if the relative positions and the like of the upper surfaces of 2a to 2d are shifted and the thickness of the supporting auxiliary member 3e attached to each supporting portion is the same, the wafer mounting surface of each supporting auxiliary member 3e is appropriately set. It can be adjusted, and by extension, it can be adjusted to a desired flatness (see FIG. 3B).

そして、本発明の熱処理方法では、以上のようにして支持補助部材３の載置面全てによる平面度を調整してから、該載置面上に半導体ウエーハを載置して熱処理を行う。したがって、ウエーハ荷重のアンバランスも発生せず、効果的にスリップ転位を抑制することができる。さらには、支持補助部材３の厚さの調節やスペーサを用いた調節により平面度の調整を行うので、ボート自体を高精度に加工するという実現が困難な方法とは異なり、微調整が極めて簡単で、低コストで高精度に調整を行うことができる。   And in the heat processing method of this invention, after adjusting the flatness by all the mounting surfaces of the supporting auxiliary member 3 as mentioned above, a semiconductor wafer is mounted on this mounting surface and it heat-processes. Therefore, unbalance of the wafer load does not occur, and slip dislocation can be effectively suppressed. Furthermore, since the flatness is adjusted by adjusting the thickness of the support auxiliary member 3 or using a spacer, the fine adjustment is very easy, unlike the difficult method of processing the boat itself with high accuracy. Thus, adjustment can be performed with high accuracy at low cost.

なお、上述したように本発明の縦型熱処理用ボート１を用いて熱処理を行うことができるので、複数の半導体ウエーハを一度に載置して熱処理することができ、効率良く、高品質の熱処理ウエーハを大量に生産することが可能である。   As described above, since the heat treatment can be performed using the vertical heat treatment boat 1 of the present invention, a plurality of semiconductor wafers can be mounted and heat treated at a time, and an efficient and high quality heat treatment can be performed. It is possible to produce a large amount of wafers.

以下、本発明を実施例、比較例によりさらに詳細に説明するが、本発明はこれに限定されない。
（実施例）
直径３００ｍｍのシリコンウエーハを熱処理するにあたり、まず、従来と同様の４点支持のロングフィンガーボート本体を用意した。
ここで、まず、図４に示すような三次元測定器（Ｍｉｔｕｔｏｙｏ製 Ｃｒｙｓｔａ−Ａｐｅｘ Ｃ）を用い、支持部２ａ〜２ｄの基準面（石定盤２４の上面）からの高さ（Ｚ座標）を測定した。測定箇所は、図１（Ｂ）に示すように合計８点とした。そして、測定の最低点からそれぞれの点までの変位を求めたところ、図５、表１（ロングフィンガーボート自体の項目）に示す変位データが得られた。なお、図５、表１は、７番目の測定箇所（支持部２ｄの先端側）における高さが最も低かったため、この箇所を基準にした。単位はそれぞれμｍである。
この変位データから８点の最小二乗平面を算出し、平面度を得たところ６０μｍであった。 EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited to this.
(Example)
In heat-treating a silicon wafer having a diameter of 300 mm, first, a long finger boat main body having the same four-point support as in the prior art was prepared.
Here, first, using a three-dimensional measuring device (Crysta-Apex C manufactured by Mitutoyo) as shown in FIG. 4, the height (Z coordinate) from the reference surface (the upper surface of the stone surface plate 24) of the support portions 2 a to 2 d. Was measured. As shown in FIG. 1 (B), a total of 8 measurement points were used. And when the displacement from the lowest point of measurement to each point was calculated | required, the displacement data shown in FIG. 5, Table 1 (item of long finger boat itself) were obtained. In FIG. 5 and Table 1, since the height at the seventh measurement location (the tip side of the support portion 2d) was the lowest, this location was used as a reference. Each unit is μm.
The least square plane of 8 points was calculated from this displacement data, and the flatness was obtained to be 60 μm.

ここで、この６０μｍという平面度を改善する（より小さな値にする）ため、図５、表１のデータを基に、支持部２ａ〜２ｄに厚さの異なる支持補助部材３ａ〜３ｄを選択して装着した。
具体的には、支持部２ａに対しては厚さ０．９８ｍｍの支持補助部材、
支持部２ｂに対しては厚さ１．００ｍｍの支持補助部材、
支持部２ｃに対しては厚さ０．９６ｍｍの支持補助部材、
支持部２ｄに対しては厚さ１．００ｍｍの支持補助部材を装着した。
このように、Ｚ座標が最も高い支持部２ｃに対して厚さが最も薄い支持補助部材を装着し、次にＺ座標が高い支持部２ａに対して、次に厚さが薄い支持補助部材３ａを装着した。
そして、これらに比べてＺ座標が低い支持部２ｂ、２ｄに対しては、比較的厚い支持補助部材を装着した。 Here, in order to improve the flatness of 60 μm (to a smaller value), based on the data in FIG. 5 and Table 1, support auxiliary members 3a to 3d having different thicknesses are selected as the support portions 2a to 2d. Attached.
Specifically, a support auxiliary member having a thickness of 0.98 mm for the support portion 2a,
A support auxiliary member having a thickness of 1.00 mm for the support portion 2b,
A support auxiliary member having a thickness of 0.96 mm for the support portion 2c,
A support auxiliary member having a thickness of 1.00 mm was attached to the support portion 2d.
In this way, the support auxiliary member having the thinnest thickness is attached to the support part 2c having the highest Z coordinate, and the support auxiliary member 3a having the next smallest thickness to the support part 2a having the next highest Z coordinate. Attached.
A relatively thick support auxiliary member was attached to the support portions 2b and 2d having a lower Z coordinate than these.

このようにして、各支持部の形状に合わせて適切な厚さを有する支持補助部材を選択して装着することにより、表１に示すように、平面度を６０μｍから４４μｍに低減することができた。すなわち、これらの支持補助部材の載置面のそれぞれに、よりバランス良くウエーハの荷重がかかるようにすることができた。また、他の溝（支持部）に関しても同様にして、荷重のアンバランスが生じないようにシリコンウエーハを載置し、１２００℃で１時間のアニールを施した。すなわち、図１に示すような本発明の縦型熱処理用ボート１を用い、本発明の熱処理方法を実施した。   In this way, by selecting and attaching a support auxiliary member having an appropriate thickness according to the shape of each support portion, the flatness can be reduced from 60 μm to 44 μm as shown in Table 1. It was. In other words, the load of the wafer can be applied to each of the mounting surfaces of these supporting auxiliary members in a more balanced manner. Similarly, with respect to the other grooves (supporting portions), a silicon wafer was placed so as not to cause load imbalance, and annealing was performed at 1200 ° C. for 1 hour. That is, the heat treatment method of the present invention was performed using the vertical heat treatment boat 1 of the present invention as shown in FIG.

この結果、図６に示す熱処理後のシリコンウエーハのスリップ転位の測定結果のように、いずれのシリコンウエーハにもスリップは発生せず、高品質の熱処理ウエーハを得ることができた。   As a result, no slip was generated in any silicon wafer as in the measurement result of the slip dislocation of the silicon wafer after the heat treatment shown in FIG. 6, and a high-quality heat-treated wafer could be obtained.

Figure 2008227056
Figure 2008227056

（比較例１）
実施例ではじめに用意したロングフィンガーボート本体、すなわち、従来と同様の４点支持のボートを用い、そのまま、直径３００ｍｍのシリコンウエーハを支持部上に載置し、実施例と同様に１２００℃で１時間のアニールを施した。 (Comparative Example 1)
The long finger boat main body prepared first in the example, that is, the same four-point support boat as the conventional one was used, and a silicon wafer having a diameter of 300 mm was placed on the support as it was, and the temperature was changed to 1200 ° C. as in the example. Time annealing was applied.

その結果、熱処理後のシリコンウエーハにスリップ転位が発生してしまった。熱処理後のシリコンウエーハのスリップ転位の測定結果の一例を図７に示す。
なお、実施例１と同様にして三次元測定器を用いてボートの支持部の形状を測定したところ、表１（ロングフィンガーボート自体の項目）と同様の測定結果および平面度（６０μｍ）が得られた（表１参照）。 As a result, slip dislocation occurred in the silicon wafer after the heat treatment. An example of the measurement result of the slip dislocation of the silicon wafer after the heat treatment is shown in FIG.
When the shape of the boat support was measured using a three-dimensional measuring instrument in the same manner as in Example 1, the same measurement results and flatness (60 μm) as in Table 1 (items for the long finger boat itself) were obtained. (See Table 1).

（比較例２）
実施例ではじめに用意したロングフィンガーボート本体、すなわち、従来と同様の４点支持のボートを用意し、いずれの支持部に対しても厚さ１．００ｍｍの同じ支持補助部材を装着し、直径３００ｍｍのシリコンウエーハを上記支持補助部材上に載置し、実施例と同様に１２００℃で１時間のアニールを施した。 (Comparative Example 2)
The long finger boat main body prepared first in the embodiment, that is, the same four-point support boat as the conventional one is prepared, and the same support auxiliary member having a thickness of 1.00 mm is attached to each support portion, and the diameter is 300 mm. The silicon wafer was placed on the support auxiliary member and annealed at 1200 ° C. for 1 hour as in the example.

その結果、熱処理後のシリコンウエーハには、図７と同様にスリップ転位が発生してしまった。
なお、実施例１と同様にして三次元測定器を用いてボートの支持部の形状を測定したところ、表１（ロングフィンガーボート自体の項目）と同様の測定結果および平面度（６０μｍ）が得られた。支持補助部材の厚さは全て１．００ｍｍであるため、各支持補助部材の載置面の相対位置は変わらず、したがって平面度も変化せず、６０μｍであった（表１参照）。 As a result, slip dislocation occurred in the silicon wafer after the heat treatment as in FIG.
In addition, when the shape of the support part of the boat was measured using a three-dimensional measuring device in the same manner as in Example 1, the same measurement results and flatness (60 μm) as in Table 1 (the item of the long finger boat itself) were obtained. It was. Since the thicknesses of the supporting auxiliary members were all 1.00 mm, the relative positions of the mounting surfaces of the supporting auxiliary members were not changed, and thus the flatness was not changed and was 60 μm (see Table 1).

（参考例）
平面度が悪化するように、支持部２ａに対しては厚さ１．００ｍｍの支持補助部材、支持部２ｂに対しては厚さ１．００ｍｍの支持補助部材、支持部２ｃに対しては厚さ１．０１ｍｍの支持補助部材、支持部２ｄに対しては厚さ１．００ｍｍの支持補助部材を選択して装着させる以外は、実施例１と同様にして本発明の縦型熱処理用ボートを準備し、本発明の熱処理方法を行った。
このとき、表１に示すように、平面度は６０μｍから６３μｍへと悪化し、熱処理後のシリコンウエーハには図７よりきついスリップ転位が確認された。 (Reference example)
A support auxiliary member having a thickness of 1.00 mm for the support portion 2a, a support auxiliary member having a thickness of 1.00mm for the support portion 2b, and a thickness for the support portion 2c so that the flatness is deteriorated. The vertical heat treatment boat of the present invention is the same as in Example 1 except that a support auxiliary member having a thickness of 1.01 mm and a support auxiliary member having a thickness of 1.00 mm are selected and mounted on the support portion 2d. Prepared and performed the heat treatment method of the present invention.
At this time, as shown in Table 1, the flatness deteriorated from 60 μm to 63 μm, and tight slip dislocation was confirmed in the silicon wafer after the heat treatment from FIG.

以上のように、本発明の縦型熱処理用ボートおよび半導体ウエーハの熱処理方法であれば、実施例と比較例１、２を比較してわかるように、被処理基板が載置される支持補助部材の載置面全てによる平面度を調整してから、被処理基板を載置して熱処理を行うので、平面度の改善を図ることができ、ひいてはスリップ転位の発生を効果的に防止することができる。しかも、この平面度の調整を簡単に安価で行うことができる。
また、実施例と参考例からも、平面度の調整がスリップ転位の発生に関して重要であることが判る。スリップ転位の防止にあたっては、所望の小さな平面度が得られるよう、適切な厚さを有する支持補助部材やスペーサを選択すれば良い。 As described above, in the case of the vertical heat treatment boat and the semiconductor wafer heat treatment method of the present invention, as can be seen by comparing the example and the comparative examples 1 and 2, the supporting auxiliary member on which the substrate to be processed is placed After adjusting the flatness of all of the mounting surfaces, the substrate to be processed is mounted and heat treatment is performed, so that the flatness can be improved and, in turn, the occurrence of slip dislocation can be effectively prevented. it can. Moreover, the flatness can be adjusted easily and inexpensively.
Also from the examples and reference examples, it can be seen that the adjustment of flatness is important with respect to the occurrence of slip dislocations. In order to prevent slip dislocation, a support auxiliary member or spacer having an appropriate thickness may be selected so that a desired small flatness can be obtained.

なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は、例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。   The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

（Ａ）本発明の縦型熱処理用ボート全体の一例を示す概略図である。（Ｂ）ボート本体の支持部の一例を示す平面図である。(A) It is the schematic which shows an example of the whole boat for vertical heat processing of this invention. (B) It is a top view which shows an example of the support part of a boat main body. 支持部に支持補助部材が装着された状態の一例を示す平面図である。It is a top view which shows an example of the state with which the support auxiliary member was mounted | worn with the support part. （Ａ）支持部に支持補助部材が装着された状態の一例を示す断面図である。（Ｂ）支持部と支持補助部材との間にスペーサが介在された状態の一例を示す断面図である。(A) It is sectional drawing which shows an example of the state with which the support auxiliary member was mounted | worn by the support part. (B) It is sectional drawing which shows an example of the state in which the spacer was interposed between the support part and the support auxiliary member. 三次元測定器を用いた支持部の形状の測定方法の一例を示す説明図である。It is explanatory drawing which shows an example of the measuring method of the shape of a support part using a three-dimensional measuring device. 実施例の支持部形状測定での支持部同士の相対高さを示す変位データである。It is a displacement data which shows the relative height of the support parts in the support part shape measurement of an Example. 実施例における熱処理後のシリコンウエーハのスリップ転位の測定結果の一例である。It is an example of the measurement result of the slip dislocation of the silicon wafer after heat processing in an Example. 比較例１における熱処理後のシリコンウエーハのスリップ転位の測定結果の一例である。4 is an example of measurement results of slip dislocations in a silicon wafer after heat treatment in Comparative Example 1. 従来の縦型熱処理用ボートの一例を示す概略図である。It is the schematic which shows an example of the conventional boat for vertical heat processing. 従来の縦型熱処理用ボートにウエーハをセットした状態を示す説明図である。It is explanatory drawing which shows the state which set the wafer to the conventional boat for vertical heat processing. 縦型熱処理炉の一例を示す概略図である。It is the schematic which shows an example of a vertical heat processing furnace. 従来の縦型熱処理用ボートにおけるウエーハ支持部を示す概略図である。It is the schematic which shows the wafer support part in the conventional boat for vertical heat processing.

符号の説明Explanation of symbols

１…本発明の縦型熱処理用ボート、 ２、２ａ、２ｂ、２ｃ、２ｄ…支持部、
３、３ａ、３ｂ、３ｃ、３ｄ、３ｅ…支持補助部材、 ４…支柱、 ６…板状部材、
７…溝、 １２、１２ａ、１２ｂ、１２ｃ、１２ｄ…スペーサ。
DESCRIPTION OF SYMBOLS 1 ... Vertical heat treatment boat of this invention, 2, 2a, 2b, 2c, 2d ... support part,
3, 3a, 3b, 3c, 3d, 3e ... supporting auxiliary members, 4 ... struts, 6 ... plate-like members,
7: Groove, 12, 12a, 12b, 12c, 12d ... Spacer.

Claims (4)

少なくとも、被処理基板を水平に支持するための支持部を、支持する被処理基板一枚あたりで４つ以上有しており、該４つ以上の支持部には、各々、前記被処理基板が載置される支持補助部材が着脱可能に装着されている縦型熱処理用ボートであって、
前記４つ以上の支持部の各々の形状に合わせて、
前記支持補助部材の厚さを調節するか、
前記支持部と前記支持補助部材との間にスペーサを介在させることによって、
前記被処理基板が載置される各々の支持補助部材の面全てから得られる平面度が調整されているものであることを特徴とする縦型熱処理用ボート。 At least four support portions for supporting the substrate to be processed horizontally are provided for each substrate to be processed, and each of the four or more support portions includes the substrate to be processed. A vertical heat treatment boat on which a supporting auxiliary member to be mounted is detachably mounted,
According to the shape of each of the four or more support parts,
Adjusting the thickness of the support auxiliary member,
By interposing a spacer between the support part and the support auxiliary member,
A vertical heat treatment boat, wherein the flatness obtained from all surfaces of each supporting auxiliary member on which the substrate to be processed is placed is adjusted. 前記縦型熱処理用ボートは、４本以上の支柱と、各支柱の両端部に連結した一対の板状部材とを有し、溝が水平方向に複数形成されていることにより、前記各支柱に前記支持部が垂直方向で複数形成されたものであり、前記各溝ごとに、１枚ずつ、前記被処理基板が挿入されて前記４つ以上の支持部により支持されるものであることを特徴とする請求項１に記載の縦型熱処理用ボート。   The vertical heat treatment boat has four or more struts and a pair of plate-like members connected to both ends of each strut, and a plurality of grooves are formed in the horizontal direction. A plurality of the support portions are formed in a vertical direction, and the substrate to be processed is inserted into each of the grooves, and is supported by the four or more support portions. The vertical heat treatment boat according to claim 1. 少なくとも、半導体ウエーハを一枚あたり４つ以上の支持部により水平に支持して熱処理を行うときに、前記４つ以上の支持部に、各々、支持補助部材を着脱可能に装着し、該支持補助部材上に前記半導体ウエーハを載置して熱処理する半導体ウエーハの熱処理方法であって、
前記４つ以上の支持部の形状を各々測定し、該測定から４つ以上の支持部全てによる平面度を得て、該得られた平面度に基づいて、
前記支持補助部材の厚さを調節して、前記測定した各々の支持部の形状に合わせて、前記厚さを調節した支持補助部材を選択し、該選択した支持補助部材を前記支持部に装着するか、
前記測定した各々の支持部の形状に合わせてスペーサを選択し、該選択したスペーサを挟んで前記支持部に前記支持補助部材を装着して、
前記各々の支持補助部材の載置面全てによる平面度を調整してから、該載置面上に前記半導体ウエーハを載置して熱処理を行うことを特徴とする半導体ウエーハの熱処理方法。 At least when a semiconductor wafer is horizontally supported by four or more support parts per one and subjected to heat treatment, a support auxiliary member is detachably attached to each of the four or more support parts, and the support auxiliary A method for heat-treating a semiconductor wafer, wherein the semiconductor wafer is placed on a member and heat-treated.
Measure the shape of each of the four or more support parts, obtain the flatness of all four or more support parts from the measurement, based on the obtained flatness,
The thickness of the support auxiliary member is adjusted, and the support auxiliary member with the adjusted thickness is selected according to the shape of each of the measured support portions, and the selected support auxiliary member is attached to the support portion. Or,
A spacer is selected according to the shape of each of the measured support parts, the support auxiliary member is attached to the support part with the selected spacer interposed therebetween,
A method for heat-treating a semiconductor wafer, comprising: adjusting the flatness of all of the supporting surfaces of each of the supporting auxiliary members, and placing the semiconductor wafer on the placing surface to perform heat treatment. 前記熱処理を、４本以上の支柱と、各支柱の両端部に連結した一対の板状部材とを有し、溝が水平方向に複数形成されていることにより、前記各支柱に前記支持部が垂直方向で複数形成されたものであり、前記各溝ごとに、１枚ずつ、前記半導体ウエーハが挿入されて前記４つ以上の支持部により支持される縦型熱処理用ボートを用いて行うことを特徴とする請求項３に記載の半導体ウエーハの熱処理方法。   The heat treatment includes four or more struts and a pair of plate-like members connected to both ends of each strut, and a plurality of grooves are formed in the horizontal direction, whereby the support portion is provided on each strut. A plurality of vertical heat treatment boats are formed, and each of the grooves is formed by using a vertical heat treatment boat in which the semiconductor wafer is inserted and supported by the four or more support portions. The method for heat-treating a semiconductor wafer according to claim 3, wherein the semiconductor wafer is heat-treated.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09129567A (en) * 1995-10-30 1997-05-16 N T T Electron Technol Kk Wafer support structure of vertical wafer boat
JPH1092757A (en) * 1996-09-10 1998-04-10 Tokyo Electron Ltd Workpiece supporting structure
JP2000150402A (en) * 1998-11-09 2000-05-30 Shin Etsu Handotai Co Ltd Substrate supporting jig
JP2001168175A (en) * 1999-12-07 2001-06-22 Semiconductor Leading Edge Technologies Inc Substrate holding fitting for heat treatment, substrate heat treatment apparatus, and method for thermally treating substrate
JP2004241545A (en) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd Boat for vertical heat treatment and heat treatment method of semiconductor wafer
JP2006128316A (en) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd Vertical boat for heat treatment and heat treating method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6077343A (en) 1998-06-04 2000-06-20 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it
JP3692812B2 (en) 1998-06-04 2005-09-07 信越半導体株式会社 Nitrogen-doped low-defect silicon single crystal wafer and manufacturing method thereof
JP2002324830A (en) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp Holding tool for substrate heat treatment, substrate heat treating equipment method for manufacturing semiconductor device, method for manufacturing the holding tool for substrate heat treatment and method for deciding structure of the holding tool for substrate heat treatment
JP4857517B2 (en) 2003-11-26 2012-01-18 信越半導体株式会社 Annealed wafer and method for manufacturing annealed wafer
JP2005203648A (en) 2004-01-19 2005-07-28 Shin Etsu Handotai Co Ltd Vertical type boat for heat treating silicon wafer and heat treating method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09129567A (en) * 1995-10-30 1997-05-16 N T T Electron Technol Kk Wafer support structure of vertical wafer boat
JPH1092757A (en) * 1996-09-10 1998-04-10 Tokyo Electron Ltd Workpiece supporting structure
JP2000150402A (en) * 1998-11-09 2000-05-30 Shin Etsu Handotai Co Ltd Substrate supporting jig
JP2001168175A (en) * 1999-12-07 2001-06-22 Semiconductor Leading Edge Technologies Inc Substrate holding fitting for heat treatment, substrate heat treatment apparatus, and method for thermally treating substrate
JP2004241545A (en) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd Boat for vertical heat treatment and heat treatment method of semiconductor wafer
JP2006128316A (en) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd Vertical boat for heat treatment and heat treating method

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