JP2008225511A - Manufacturing method of electrooptical device, and electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel manufacturing method of an electrooptical device that can make variance in substrate interval less than that of a conventional structure. <P>SOLUTION: The manufacturing method is a manufacturing method of an electrooptical device having a panel structure composed by disposing a spacer 17 defining spacings between an electrooptical substance, and first and second substrates, between the first and second substrates. When a front-stage panel structure is composed by forming a first front-stage substrate 11 as the first substrate which includes a first substrate region 11A and another first peripheral region 11B and a second front-stage substrate 12 as the second substrate which includes a second substrate region 12A and another second peripheral region 12B, and then sticking them on each other, a stack structure of a colored layer composing a color filter 15 or a protective film covering the color filter 15, and the spacer 17' is disposed between the first peripheral region 11B and second peripheral region 12B. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electro-optical device and an electro-optical device, and more particularly to a manufacturing technique of an electro-optical device including a color filter, an electro-optical material, and a spacer that defines a substrate interval between a pair of substrates.

  In general, some electro-optical devices such as liquid crystal display devices have a panel structure in which an electro-optical material is disposed between a pair of substrates. In many cases, a pair of electro-optical materials is used to define the thickness of the electro-optical material. Spacers are arranged between the substrates. The panel structure in which the spacers are arranged includes a method in which an independent granular spacer made of a synthetic resin or the like is dispersed on one of the substrates, and then the other substrate is bonded to the one substrate. There is known a method in which a protruding columnar spacer is formed on the inner surface of one of the substrates, and a pair of substrates are bonded through the columnar spacer.

  As a manufacturing method for forming a panel structure using the above-described granular spacers and columnar spacers, a front panel structure is formed by pasting together a pair of front substrates larger than a pair of substrates constituting the panel structure in advance. There is a method of forming the panel structure described above by dividing a pair of previous substrates in the structure and removing peripheral portions of the previous substrates. According to this method, particularly in the case of manufacturing a relatively small electro-optical device, the above-described front panel structure in which regions to be a plurality of electro-optical devices are arranged is formed. Since a plurality of panel structures can be obtained by dividing a pair of front-stage substrates constituting the plurality of panel structures, manufacturing costs can be reduced by manufacturing the plurality of panel structures in parallel.

  On the other hand, in the conventional electro-optical device, a strong pressure is easily applied to the outer peripheral portion of the substrate in the substrate bonding process, so that the distance between the substrates in the outer peripheral portion of the panel structure is likely to be reduced, thereby causing a display defect. There was a point. Therefore, by reducing the formation density of the columnar spacers or increasing the area of the columnar spacers in the non-display region configured around the display region, it is possible to suppress a decrease in the substrate interval in the outer peripheral portion of the panel structure, A method for preventing display defects is described in Patent Document 1 below. Further, in Patent Document 1, in order to further reduce the defect in the gap between the substrates at the time of bonding the substrates, a region that is arranged outside a portion that should be a panel region during the manufacturing process and is finally divided and removed. In addition, the point of forming columnar spacers is also disclosed (see the third page, fourth column, lines 12 to 16 and FIG. 4). In addition, the columnar spacer of this document is formed by laminating a plurality of colored layers constituting a color filter.

JP-A-9-73093

  However, in the method of forming each panel structure by dividing the front panel structure after forming the front panel structure as described above, there is a peripheral part around the part to be the panel structure in the front panel structure, and this peripheral part Since the above-mentioned granular spacers or columnar spacers do not exist, when a pair of previous-stage substrates are bonded together and bonded together, the substrate spacing in the peripheral portion is smaller than the portion that should be the panel structure, and the reaction results in the panel structure. There is a problem in that the substrate interval at the outer edge portion of the portion to be increased or decreased, and the variation in the substrate interval of the portion to be the panel structure increases.

  For example, in the case of an electro-optical device in which a pair of substrates are bonded via a sealing material, the granular spacers and columnar spacers are disposed inside the sealing material, and the granular spacers are also disposed inside the sealing material. However, since these spacers are not present in the outer portion of the sealing material, the distance between the substrates in the outer portion of the sealing material is reduced. As a result, the outer peripheral portion of the inner portion of the sealing material is used as a fulcrum. The substrate spacing increases, thereby increasing the variation in substrate spacing in the inner portion of the sealant.

  The above-mentioned problem can be solved to some extent by forming columnar spacers in the peripheral part finally removed from the panel structure as disclosed in the above-mentioned Patent Document 1. In the above method, the height of the columnar spacers is substantially constant, whereas in the display area and the outside display area, the interval to be defined by the columnar spacers is small due to various thin films formed on the inner surface of the substrate. In the peripheral portion to be finally removed, the interval to be defined by the columnar spacer is larger than that, so even if a dummy pattern formed simultaneously with the thin film transistor structure is provided, the substantial substrate interval in the peripheral portion is The problem is that the variation in the substrate spacing at the outer periphery of the panel structure is not reduced sufficiently because it is smaller than the display area and outside display area. There is. In particular, in the above document, columnar spacers are formed by laminating a plurality of colored layers constituting a color filter. However, since the columnar spacer has an area that is extremely smaller than the pixel area, a plurality of colored layers are laminated. In some cases, the entire laminated structure may not have a height that can define the substrate interval, and variations in the height of the columnar spacers also increase. That is, in a laminated body formed by laminating a plurality of layers, when the laminated area is reduced, the laminated height becomes smaller than the total thickness of each layer, and the variation in the laminated height becomes larger. With the columnar spacers in the literature, it is difficult to ensure sufficient uniformity of the substrate spacing.

  Accordingly, the present invention solves the above-described problems, and an object of the present invention is to provide a novel manufacturing method of an electro-optical device that can reduce the variation in the distance between the substrates as compared with the conventional structure.

  In view of such circumstances, an electro-optical device manufacturing method according to the present invention has an electro-optical device having a panel structure in which an electro-optical material and a spacer that defines a distance between the pair of substrates are disposed between a pair of substrates. In the device manufacturing method, the substrate forming step of forming the pair of substrates in a form including a substrate region to be the panel structure and a peripheral region in which the pair of substrates are separated from the substrate region, and the pair of substrates A front panel forming step of forming a front panel structure by bonding, and then a panel cutting step of forming the panel structure by dividing the front panel structure, and in the peripheral region of the front panel structure The color layer constituting the color filter or a protective film covering the color filter and an overlapping structure of the spacer are disposed. To.

  According to the present invention, the overlapping structure of the colored layer or the protective film and the spacer is arranged in the peripheral region of the front panel structure, so that the substrate interval in the peripheral region can be reliably defined by the above overlapping structure. . At this time, the colored layer constituting the color filter and the protective film covering the color filter have a relatively thick film thickness, and a spacer is formed separately from these to form a substrate in the peripheral region. It can prevent that a space | interval falls rather than the part which should become a panel structure. In addition, by configuring the spacer separately from the color filter, it is not necessary to configure the spacer with a laminated structure, so that the height of the spacer can be set with high accuracy and the colored layer superimposed on the spacer. Alternatively, since it is not necessary to form the protective film in a narrow area, the thickness accuracy of the colored layer or the protective film can be increased. Accordingly, since it is possible to accurately define the substrate interval in the peripheral region when bonding a pair of substrates, variation in the substrate interval of the electro-optical device can be reduced as compared with the conventional structure.

  In another electro-optical device manufacturing method according to the present invention, an electro-optical material and a spacer that defines a distance between the pair of substrates are disposed between a pair of substrates, and at least one of the substrates includes a color filter. In the method of manufacturing an electro-optical device having a panel structure, the pair of substrates is formed in a form including a substrate region serving as the panel structure and a peripheral region where the pair of substrates are separated from the substrate region. A front panel forming step of forming a front panel structure by bonding the pair of substrates together, and then a panel cutting step of forming the panel structure by cutting the front panel structure. In the substrate region in the panel structure, a colored layer constituting the color filter or a protective film covering the color filter and the spacer A joining structure is arranged, and an overlapping structure of a color layer constituting the color filter or a protective film covering the color filter and the spacer is arranged in the peripheral region of the front panel structure. .

  In the present invention, it is preferable that the superposed structure includes a laminated structure of a plurality of the colored layers. According to this, since the overlapping structure includes a laminated structure of a plurality of colored layers, the overlapping structure can be formed thick, so even if the thickness of the layer structure overlapping the spacer in the panel structure is large. Thus, it is possible to configure the substrate interval in the peripheral region in the same manner as the substrate interval of the portion to be the panel structure.

  In the present invention, it is preferable that the superposed structure includes a laminated structure of the colored layer and the protective film. Since the colored layer and the protective film are laminated, the overlapping structure can be formed thick. Therefore, even when the thickness of the layer structure that overlaps the spacer in the panel structure is large, the substrate spacing in the peripheral region is reduced. It becomes possible to constitute in the same manner as the substrate interval of the portion to be the panel structure.

  Here, in an active matrix type electro-optical device in which an active element is formed on the inner surface of one substrate, an active element such as a TFT (thin film transistor) or TFD (thin film diode) and a wiring conductively connected to the active element. By adopting an overlayer structure in which a thick insulating film is formed between the pixel electrode and the pixel electrode, and the active element and the pixel electrode are conductively connected through a contact hole formed in the insulating film, parasitic wiring caused by wiring Since the capacity can be reduced, display quality can be improved. However, when this overlayer structure is adopted, the insulating film overlaps with the spacer in the panel structure, so that the substrate interval is increased accordingly, so that the substrate interval is defined in the peripheral region. Therefore, it is necessary to increase the thickness of the overlapping structure. However, even in this case, in the present invention, by laminating a plurality of colored layers constituting the color filter and a protective film covering the color filter and overlapping the spacer, the thickness of the overlapping structure is increased, It is possible to configure the substrate interval in the peripheral region in the same manner as the substrate interval of the portion to be the panel region.

  In the present invention, the panel structure includes an electrode for applying an electric field to the electro-optical material, and an overhang portion including a wiring and a terminal that are extended from the other substrate on one of the substrates and electrically connected to the electrode. It is preferable that the overlapping structure is disposed in a portion where the wiring and the terminal are not formed in a region to be the projecting portion in the front panel structure. In the front panel structure, there is provided a portion where the region to be the projecting portion of one substrate and the peripheral region of the other substrate are opposed. According to the above configuration, the region to be the projecting portion and the other substrate Since the above overlapping structure is arranged in the part where the wiring and terminals are not formed between the peripheral area of the other substrate, the peripheral area of the other substrate is removed from the front panel structure, and the protruding portion of one substrate is exposed. In this case, it is possible to avoid an adverse effect on the wiring and terminals due to the removal of at least a part of the superposed structure together with the peripheral region of the other substrate.

  In the present invention, it is preferable that an electrode and a wiring are laminated in the substrate region via an interlayer insulating film, and the overlapping structure includes the interlayer insulating film. According to this, since the electrode and the wiring are laminated by the interlayer insulating film via the interlayer insulating film, it is possible to prevent the display quality from being deteriorated due to the parasitic capacitance between the electrode and the wiring. In addition, since the interlayer structure includes an interlayer insulating film, it is possible to cope with an increase in the distance between the substrates due to the interlayer insulating film without any problem. For example, a thick interlayer insulating film may be formed to sufficiently reduce the parasitic capacitance. Also, the function of the present invention can be surely ensured.

  Next, in the electro-optical device according to the invention, a color filter, an electro-optical material, and a spacer that defines a distance between the pair of substrates are disposed between a pair of substrates bonded via a sealing material. In the optical device, on the outer side of the seal material, a color layer constituting the color filter or a superposition structure of the protective film covering the color filter and the spacer is disposed between the pair of substrates. And

  According to this invention, the overlapping structure of the coloring layer or the protective film and the spacer is arranged outside the sealing material for bonding the pair of substrates of the electro-optical device, thereby defining the substrate interval outside the sealing material. Therefore, it is possible to reduce the variation in the distance between the substrates in the display area formed inside the sealant. In addition, in order to define the substrate interval outside the sealing material, not only the spacer but also the colored layer constituting the color filter and the protective film covering the color filter are overlaid. Even when the power interval is larger than the interval to be defined inside the sealant, the substrate interval outside the sealant can be configured to be equal to the substrate interval inside.

  In another electro-optical device according to the invention, a color filter, an electro-optical material, an electrode for applying an electric field to the electro-optical material, and a distance between the pair of substrates are defined between the pair of substrates. In the electro-optical device in which the spacer is disposed, one of the substrates is provided with an overhanging portion including a wiring and a terminal that are exposed without being covered with the other substrate and are conductively connected to the electrode, and the overhanging portion is provided. Is characterized in that the spacer is provided.

  According to the present invention, since the spacer is provided in the projecting portion, the substrate interval in the region to be the projecting portion is defined using the spacer before the peripheral region of the other substrate is removed in the manufacturing process. Therefore, it is possible to reduce the variation in the substrate interval in the outer peripheral portion on the protruding portion side in the display area. In this case, a structure in which a spacer is overlapped with a color layer constituting the color filter or a protective film covering the color filter may be provided in a region to be an overhanging portion. Alternatively, a spacer is provided in a region to be an overhang portion, a protective layer covering the color layer or the color filter constituting the color filter is provided in a peripheral region of the second substrate, and when the pair of substrates is bonded, The distance between the substrates may be defined such that the colored layer or protective film and the spacer overlap in the region to be the overhanging portion, and then the peripheral region of the other substrate may be removed together with the colored layer or protective film.

  In the present invention, the spacer is preferably a columnar spacer fixed on at least one substrate, but may be a granular spacer. In addition, the thickness of the overlapping structure is preferably a thickness that matches the substrate interval of the panel structure. However, it is not always necessary to completely match the substrate interval, so that the substrate interval can be supported. As long as it is configured, it may be formed slightly thinner than the substrate interval.

  Next, a method for manufacturing an electro-optical device and an embodiment of the electro-optical device according to the invention will be described in detail with reference to the accompanying drawings.

[Electro-optical device]
FIG. 1 is a schematic plan view schematically showing a front panel structure in the manufacturing method of the present embodiment, and FIG. 2A is a schematic longitudinal cross-sectional view schematically showing a cross-sectional structure along the line AA in FIG. FIG. 2 and FIG. 2B are schematic longitudinal sectional views schematically showing a sectional structure along the line BB in FIG. In the drawings attached to the present specification, for the sake of illustration and explanation, the thickness of each layer or thin film, the dimension of the spacer, etc. are usually greatly emphasized with respect to the thickness of the substrate. The actual dimensions are not shown as they are. 2A and 2B schematically show a cross-sectional structure of the front panel structure 10 before being bonded.

  In the front panel structure 10 of this embodiment, a first front substrate 11 and a second front substrate 12 are bonded together with a sealing material 13 interposed therebetween. A plurality of first substrate regions 11A are arranged on the first front substrate 11, a plurality of second substrate regions 12A are arranged on the second front substrate 12, and the first substrate region 11A and the second substrate region 12A are mutually connected. Are arranged opposite to each other. The first front substrate 11 is provided with a first peripheral region 11B, and the second front substrate 12 is provided with a second peripheral region 12B. The first peripheral region 11B and the second peripheral region 12B are disposed to face each other. Here, the first substrate region 11A is provided with a substrate overhanging region 11T projecting outward from the opposing second substrate region 12A, and the substrate overhanging region 11T is opposed to the second peripheral region 12B. is doing.

  The first substrate region 11A, the second substrate region 12A, and the sealing material 13 for bonding them together constitute a panel structure of the electro-optical device. In the present embodiment, a predetermined panel area to be a plurality of panel structures is arranged inside the front panel structure 10. In each planned panel region, the first electrode pattern 14 is formed on the inner surface of the first substrate region 11A, and the color filter 15 and the second electrode pattern 16 are formed on the inner surface of the second substrate region 12A. Although details of the actual panel structure will be described later, the detailed structure is largely omitted in FIGS. 1 and 2.

  The first peripheral region 11B and the second peripheral region 12B are provided on the outer edge portions of the first front substrate 11 and the second front substrate 12, but in the illustrated example, a plurality of arranged panel regions are arranged. It is also provided in some areas that exist between them. Thus, the first peripheral region 11B and the second peripheral region 12B may be provided between the planned panel regions, or alternatively, the first peripheral region 11B and the second peripheral region 12B are not provided between the planned panel regions. Alternatively, it may be provided only on the outer periphery of the first pre-stage substrate 11 and the second pre-stage substrate 12.

  A plurality of spacers 17 are arranged inside the sealing material 13. The spacer 17 defines a substrate interval between the first substrate region 11A and the second substrate region 12A. The spacer 17 is made of a material different from that of the color filter 15. In addition, on the outside of the sealing material 13, a plurality of spaces are provided between the first peripheral region 11B and the second peripheral region 12B and between the substrate overhanging region 11T and the second peripheral region 12B of the first substrate region 11A. A spacer 17 'is arranged. The spacer 17 and the spacer 17 ′ are formed on the inner surface of the first front substrate 11.

  A dummy pattern 18 is formed on the inner surface of the second peripheral region 12B. The dummy pattern 18 is formed of at least one of a plurality of colored layers constituting the color filter 15 or the same material as a protective film (not shown) that covers the color filter 15. In the manufacturing process, the dummy pattern 18 is formed simultaneously with the formation of the color filter 15 or its protective film. The dummy pattern 18 is formed over the entire periphery along the outer edge portion of the front panel 10. That is, it is configured so as to surround an array range of a plurality of scheduled panel areas over the entire circumference. In the illustrated example, it is also formed in a partial area between a plurality of scheduled panel areas. However, the dummy pattern 18 and the spacer 17 ′ need not be formed between the plurality of scheduled panel areas.

  In the front panel structure 10, the spacer 17 'formed on the inner surface of the first peripheral region 11B and the dummy pattern 18 formed on the inner surface of the second peripheral region 12B are overlapped with each other. The substrate spacing between the first peripheral region 11B and the second peripheral region 12B is defined by the overlapping structure of the spacer 17 'and the dummy pattern 18.

  Further, the first front substrate 11 is provided with a substrate overhanging region 11T facing the peripheral region 12B of the second front substrate 12 in a part of the first substrate region 11A. The substrate overhanging region 11T is a portion that becomes an overhanging portion (substrate overhanging portion 110T described later) that is not covered by the other substrate in the panel structure of the electro-optical device formed by dividing the front panel structure 10. is there. An overlapping structure of spacers 17 ′ and dummy patterns 18 similar to the above is also disposed between the substrate overhanging region 11 T and the peripheral region 12 B.

  Next, the internal structure of the electro-optical device 100 having individual panel structures formed by dividing the front panel structure 10 by a method described later will be described in detail. FIG. 6 is an enlarged partial cross-sectional view schematically showing an enlarged structure in the display area (formed inside the sealing material) of the electro-optical device 100, and FIG. 7 is a schematic diagram showing the overall structure of the electro-optical device 100. It is a schematic plan view shown in FIG.

  In the electro-optical device 100, a wiring 112 is formed on the inner surface of the first substrate 110, and the wiring 112 is connected to an active element 113 provided for each pixel region P. In the case of the illustrated example, the active element 113 is constituted by a TFD (thin film diode). The active element 113 is conductively connected to a pixel electrode 114 made of a transparent conductor such as ITO (indium tin oxide) or zinc oxide. The pixel electrode 114 is provided in a region corresponding to the pixel region P.

  In the present embodiment, the pixel regions P are arranged in a matrix in the vertical and horizontal directions. Further, a light shielding region K is formed between the pixel regions P. The pixel electrode 114 is configured in a matrix in alignment with the arrangement of the pixel regions P, thereby forming the electrode pattern 14 described above.

  A spacer (columnar spacer) 17 made of an insulating material such as a transparent resin is formed on the inner surface of the first substrate 110. The spacers 17 define the interval between the substrates and may be appropriately distributed and may not be formed for each pixel region P, but are provided for each pixel region P in the illustrated example. The spacer 17 is formed inside the light shielding region K, specifically, on the wiring 112 and the active element 113 formed in the light shielding region K. The spacer 17 is formed by a photolithography method in which a photosensitive material, for example, a photosensitive resin is applied to a predetermined thickness on a substrate, and then exposed by using a predetermined exposure mask and developed. The Since the spacer 17 formed by such a method has a single layer structure, it has high controllability with respect to its height, and it is possible to obtain sufficient height accuracy to define the substrate interval as described above.

  By the way, when the spacer 17 having a single-layer structure is formed as described above, it is difficult to form the spacer 17 with different heights depending on locations. In the present embodiment, the spacer 17 'is also formed of the same material as the spacer 17 at the same time, and the spacer 17 and the spacer 17' have basically the same height. Note that an alignment film 117 made of polyimide resin or the like is formed on the above structure.

  On the other hand, the color filter 15 is formed on the inner surface of the second substrate 120. In the color filter 15, any of the colored layers 15R, 15G, and 15B exhibiting a plurality of hues is formed for each of the pixel regions P, and the colored layers 15R, 15G, and 15B of the plurality of colors are formed in a predetermined manner. They are arranged to form an arrangement pattern. For example, in the example shown in FIG. 9, the colored layers 15R, 15G, and 15B are arranged in a so-called stripe arrangement pattern. Other examples of the arrangement pattern of the colored layers include various arrangement patterns such as a delta arrangement, a diagonal mosaic arrangement, and a pen tile arrangement.

  In the light shielding region K, a light shielding layer 15K is formed. In the case of this embodiment, the light shielding layer 15K is configured by stacking a plurality of colored layers among the colored layers 15R, 15G, and 15B. In the illustrated example, the light shielding layer 15K is configured by laminating all three colored layers. A protective film 15P made of a transparent material such as an acrylic resin is formed on the colored layers 15R, 15G, 15B and the light shielding layer 15K. The protective film 15P flattens the step generated by forming the color filter 15 and the light shielding layer 15K, and suppresses the entry of contaminants from the outside to the colored layers 15R, 15G, and 15B. It is provided in order to prevent the deterioration.

  A counter electrode 122 made of a transparent conductor such as ITO is formed on the protective film 15P. In the case of the present embodiment, as shown in FIG. 9, a plurality of strip-like counter electrodes 122 are arranged in stripes. The formation pattern of the plurality of counter electrodes 122 constitutes the electrode pattern 16 described above. Each counter electrode 122 is configured to extend in a direction orthogonal to the wiring 112 on the first substrate 110. In this embodiment, since a diode element (two-terminal nonlinear element) is formed for each pixel region P, a plurality of counter electrodes 122 are provided. For example, a transistor element (three terminals) is provided for each pixel region P. When forming a non-linear element, a single counter electrode structure or a counter electrode structure to which a common potential is supplied may be provided.

  An alignment film 123 made of polyimide resin or the like is formed on the counter electrode 122. This alignment film 123 is the same as the alignment film 117 described above, and is for imparting an initial alignment state to the liquid crystal that is the electro-optical material of the present embodiment.

  In the electro-optical device 100, the first substrate 110 is constituted by the first substrate region 11A separated by dividing the first front substrate 11 of the front panel structure 10, and the second substrate 120 is formed by the front panel structure described above. The second substrate region 12A is separated by dividing the ten second pre-stage substrates 12. A liquid crystal layer 130 that is an electro-optical material is disposed between the first substrate 110 and the second substrate 120. As the liquid crystal layer 130, for example, a TN (twisted nematic) mode or STN (super twisted nematic) mode liquid crystal layer can be used. 6 shows an example in which the polarizing plate 131 and the retardation plate 132 are disposed on the outer surface of the first substrate 110, and the polarizing plate 133 and the retardation plate 134 are disposed on the outer surface of the second substrate 120. .

  As shown in FIG. 7, the wiring 112 on the first substrate 110 extends from the display region G to the outside and is led out to the outside of the sealing material 13, and the substrate overhanging portion 110 </ b> T corresponding to the above-described substrate overhanging region 11 </ b> T. Pulled out on the surface. Further, the counter electrode 122 on the second substrate 120 extends outward from the display region G, is conductively connected to the wiring 118 on the first substrate 110 via the vertical conduction portion, and is led out onto the substrate extension portion 110T. . In the case of the illustrated example, the sealing material 13 is used as a vertical conduction portion that conductively connects the counter electrode 122 and the wiring 118. In this case, an anisotropic conductive material is configured by mixing a large number of fine conductive spacers inside the seal material 13 and dispersing them. Here, only part of the sealing material 13 may be configured to be an anisotropic conductive material, or all of the sealing material 13 may be formed as an anisotropic conductive material. In addition, the vertical conduction portion may be provided separately from the sealing material 13 without using the sealing material 13.

  Drive circuits (semiconductor integrated circuits) 141, 142, and 143 are mounted on the surface of the substrate extension portion 110 </ b> T in such a manner that they are conductively connected to the wirings 112 and 118. A plurality of input terminals 144 that are conductively connected to the drive circuits 141, 142, and 143 are arranged at the end of the substrate extension portion 110T.

FIG. 10 is a perspective view showing the detailed structure of the active element 113. As shown in FIG. 10, the active element (TFD element) 113 is formed by connecting a first TFD element 113a and a second TFD element 113b in series. The active element 113 is formed as follows, for example. First, an underlayer 110a for improving adhesion and preventing contamination is formed on the substrate 110, which is made of Ta ₂ O ₅ or the like. Next, the first metal layer 112A of the wiring 112 made of metal Ta (tartar), TaW, or the like and the first metal of the active element 113 are formed on the base layer 110a using a sputtering method, a photolithography technique, or the like. Layer 113A is formed. Next, the surfaces of the first metal layers 112A and 113A are oxidized by anodic oxidation or the like to form the insulating film 112B of the wiring 112 and the insulating film 113B of the active element 113 made of Ta ₂ O ₅ or the like. Next, the second metal layer 112C of the wiring 112 and the second metal layers 113C and 113D of the active element 113 are formed by laminating Cr (chromium) or the like on the insulating films 112B and 113B.

  Here, the wiring 112 is constituted by the first metal layer 112A, the insulating film 112B, and the second metal layer 112C. The first metal layer 113A, the insulating film 113B, and the second metal layer 113C constitute a first TFD element 113a, and the first metal layer 113A, the insulating film 113B, and the second metal layer 113D constitute a second TFD element 113b. . The second metal layer 113C of the first TFD element 113a extends from the second metal layer 112C of the wiring 112. Further, the second metal layer 113D of the second TFD element 113b is formed so that the tip thereof overlaps the pixel electrode 114, and is conductively connected.

  The current flowing from the wiring 112 to the pixel electrode 114 by the active element 113 proceeds in the order of the second metal layer 113C, the insulating film 113B, and the first metal layer 113A in the first TFD element 113a, and in the second TFD element 113b, the first metal. The process proceeds in the order of the layer 113A, the insulating film 113B, and the second metal layer 113D. In other words, in the active element 113, a pair of electrically opposite TFD elements are connected in series with each other. Such a structure is generally called a back-to-back structure, and the TFD element of this structure is compared with a case where the TFD element is configured by only one TFD element. It is known that stable characteristics can be obtained.

  Next, schematic steps of the method for manufacturing the electro-optical device according to the embodiment will be described with reference to FIG. FIG. 14 is a manufacturing process diagram of the above embodiment. In manufacturing the electro-optical device 100, the first pre-stage substrate forming process including the active element forming step P11 to the sealing material arranging step P16 shown in FIG. 14 and the color filter forming step P21 to the rubbing processing step P24 are included. The second pre-stage substrate forming step is performed separately. In the present embodiment, each of the above-described substrate forming steps is performed using a front substrate including a planned panel region corresponding to a plurality of electro-optical devices, and a pair of front substrates is bonded to form a front panel structure. A plurality of electro-optical devices having individual panel structures are divided. However, a single liquid crystal display device may be manufactured in such a manner that after the substrates provided with a single planned panel region are bonded to each other, the peripheral region disposed in at least a part of the periphery is removed.

  First, in the first pre-stage substrate formation process, in the active element formation step P11, the wirings 112 and 118 and the active element 113 are formed by a known method such as a film formation process, a photo etching process, and an anodization process. Thereafter, in the pixel electrode formation step P12, a thin film of ITO (indium tin oxide) is formed using a sputtering method or the like, and the pixel electrode 114 is formed by performing patterning.

  Next, in spacer formation step P13, a photosensitive resin such as an acrylic resin containing a photosensitive agent is applied, and exposure and development are sequentially performed to form spacers 17 and 17 '. After that, the alignment film 117 is formed in the alignment film forming step P14, and the alignment film 117 is rubbed in the rubbing process step P15. Then, in the sealing material arranging step P16, the seal material 13 is formed by a dispenser, screen printing, or the like. The sealing material 13 is arranged so as to surround an area to be the display area G in a mode in which an opening is provided in part. The first front substrate 11 is formed by the above steps.

  On the other hand, in the second pre-stage substrate forming step, first, in the color filter forming step P21, the color filter 15 is formed using a photolithography method or the like. The colored layers 15R, 15G, and 15B are formed using a coloring material in which a coloring material such as a dye or a pigment is dispersed in a transparent resin substrate such as an acrylic resin. Preferably, each coloring layer is formed by applying a coloring material to which a photosensitizer is added, and exposing and developing. This step is repeated for each of the plurality of types of colored layers. In step P21 for forming the plurality of colored layers, the light shielding layer 15K is simultaneously formed. When the dummy pattern 18 is composed of a colored layer, the dummy pattern 18 is formed at the same time in step P21.

  Next, the counter electrode 122 is formed in the counter electrode formation step P22. The counter electrode 122 is formed by forming a thin film of ITO (indium tin oxide) by sputtering and patterning it by etching or the like. Next, in the alignment film forming step P23, the alignment film 123 is formed by applying and baking polyimide resin. Next, a rubbing process is performed on the alignment film 123 in the rubbing process step P24. The second pre-stage substrate 12 is formed by the above process.

  Next, in the substrate bonding step P31, the first pre-stage substrate 11 and the second pre-stage substrate 12 are bonded together with the sealing material 13 in a state of alignment, and in the seal material curing step P32, the first pre-stage substrate 11 and the second pre-stage substrate 11 are bonded. The sealing material 13 is cured by applying a light irradiation process, a heating process, or the like according to the curing characteristics of the sealing material 13 in a state where the front substrate 12 is pressure-bonded. As a result, the front panel structure 10 is formed.

  Next, in the panel cutting step P33, the front panel structure 10 is divided into a substrate by a scribe break method, a laser break method, or the like as necessary, and an opening (liquid crystal injection port) of the sealing material 13 is opened at the end face. And Usually, by dividing the front panel structure into strips, a strip panel structure is formed in which openings of sealing materials in a plurality of planned panel areas are arranged in a line along the end surface. Then, liquid crystal is injected into the inside of the opening of the sealing material 13 in the liquid crystal injection step P34, and then the sealing material is applied and cured in the opening of the sealing material 13 in the liquid crystal sealing step P35. Enclose. The liquid crystal layer 130 is formed by sealing the liquid crystal in this way.

  Thereafter, in the panel cutting step P36, the panel is divided into individual panel structures as necessary. In mounting step P37, the drive circuits 141, 142, and 143 are mounted on the first substrate 110 having the divided panel structure. In this step, a flexible substrate or the like may be connected to the input terminal 144 of the electro-optical device 100 with an anisotropic conductive material. The electro-optical device 100 is completed through the above steps.

  In the above embodiment, the spacer is formed by using the photolithography technique, but the method for forming the spacer of the present invention is not limited to the above method. For example, the spacer arrangement as in each of the above embodiments can also be realized by a method of arranging the spacers one by one at a predetermined position on the substrate. As a more specific method for forming the spacer, there is a method in which a spacer dispersion solution in which the spacer is uniformly dispersed in a predetermined solvent is discharged onto the substrate by an inkjet method. In this method, the droplet of the spacer dispersion solution can be accurately landed on a predetermined position on the substrate, and the spacer is disposed at the predetermined position on the substrate by volatilizing the solvent from the droplet. . At this time, the concave portion is provided at a predetermined position on the substrate, and the liquid droplets are landed on the concave portion, thereby improving the positional accuracy of the spacer. Further, by coating the surface of the spacer with a thermoplastic resin, the spacer can be fixed on the substrate by providing a step of heating the spacer on the substrate to melt the thermoplastic resin.

  Next, the spacer 17 ′ and the dummy pattern 18 will be described in detail with reference to FIGS. 3, 4, and 5. In the front panel structure 10 of the present embodiment, the substrate interval is defined using the spacer 17 inside the sealing material 13. On the other hand, on the outside of the sealing material 13, the substrate interval is defined by an overlapping structure in which the spacer 17 'and the dummy pattern 18 are overlapped. However, the interval that the spacer 17 should define on the inner side of the sealing material 13 is formed so that the alignment films 117 and 123, the color filter 15, the light shielding layer 15K, the active element 113, and the like overlap. The distance between the spacer 17 'and the dummy pattern 18 is usually smaller than that to be defined. In the present embodiment, since the spacer 17 and the spacer 17 ′ have the same height dimension, the dummy pattern 18 is configured to compensate for the difference in the interval to be defined.

  In the present embodiment, the dummy pattern 18 is constituted by a colored layer constituting the color filter 15. Specifically, the dummy layer 18A is made of the same material as the colored layer 15R constituting the color filter 15, the dummy layer 18B is made of the same material as the colored layer 15G, and is made of the same material as the colored layer 15B. The dummy pattern 18 is configured by a laminated structure in which the dummy layers 18C are laminated. Here, the dummy pattern 18 is formed simultaneously with the color filter 15 by forming each dummy layer simultaneously with the corresponding colored layer.

  In the present embodiment, the dummy pattern 18 has a width larger than the width of the light shielding layer 15K, and as a result, is formed thicker than the light shielding layer 15K. This is because, when a laminated structure is formed by laminating a plurality of layers, the total thickness when each layer is formed in a sufficiently large area as compared with the thickness of each layer as the width of the laminated structure becomes smaller. This is because the thickness of the laminated structure tends to be smaller than that. In general, the light shielding layer 15K formed between the pixel regions P has a width of about 5 to 15 μm, whereas the dummy pattern 18 is configured to have a width of 10 times or more the width of the light shielding layer 15K. Can do. Therefore, the dummy pattern 18 can be formed thicker than the light shielding layer 15K. Further, since the dummy pattern 18 having a wider laminated structure has a thickness substantially equal to the total thickness of the respective layers, there is an advantage that the thickness can be set more accurately. Since the thickness of the dummy pattern 18 can be sufficiently ensured in this way, the spacer 17 ′ and the dummy pattern 18 are overlapped so that the substrate interval on the outside of the sealing material 13 is changed to the substrate on the inside of the sealing material 13. It can be defined in the same way as the interval.

  In this case, when it is necessary to adjust the thickness of the dummy pattern 18 in order to regulate the substrate interval equally between the inside and outside of the sealing material 13, the thickness of each dummy layer of the dummy pattern 18 is increased or decreased. Can be changed. In addition, a dummy layer formed simultaneously with the same material as the protective film 15P covering the color filter 15 can be used alone or in combination with the colored layer, so that the adjustment range of the thickness of the dummy pattern 18 can be increased. It can be further expanded. Of course, the colored layer or the protective film and other layers other than these can be laminated. In any case, since the colored layer and the protective film have a thickness of about 1 to 2 μm, the component for compensating for the shortage of the height of the spacer 17 ′ is a component of the electro-optical device 100. Most preferred.

  In the example shown in FIG. 3, the overlapping structure of the spacer 17 ′ and the dummy pattern 18 is arranged in a portion where the first peripheral region 11B and the second peripheral region 12B are opposed to each other. As shown by a two-dot chain line, the overlapping structure of the spacer 17 ′ and the dummy pattern 18 in the portion where the first substrate region 11A and the second substrate region 12A outside the sealing material 13 are arranged to face each other. May be arranged. However, in this case, as shown in II of FIG. 7, the above overlapping is performed on the outer edge portion (outside of the sealing material 13) of the electro-optical device 100 even after the first peripheral region 11 </ b> B and the second peripheral region 12 </ b> B are removed. The combined structure will remain.

  In FIG. 7, the spacer 17 inside the sealing material, and the spacer 17 ′ and the dummy pattern 18 shown in the above II are shown only in a part of the range, and the spacer 17 is actually made of the sealing material. The spacers 17 ′ and the dummy patterns 18 are uniformly distributed on the inside of the sealing material. In addition, the interval between the spacers 17 and 17 'shown in the figure is merely set for convenience of illustration, and does not represent the actual spacer formation pitch.

  In this embodiment, by arranging the overlapping structure of the spacer 17 ′ and the dummy pattern 18 between the substrates on the outside of the sealing material 13 as described above, the substrate interval on the outside of the sealing material 13 is defined, It is possible to prevent the substrate interval from becoming smaller than the substrate interval inside the sealing material 13. Therefore, when the substrates are bonded together, the substrate spacing on the outside of the sealing material 13 is reduced, so that the substrate is deformed with the sealing material 13 as a fulcrum. As a result, the substrate spacing on the inside of the sealing material 13 is increased. It is possible to prevent a variation in the distance between the substrates in the region G.

  As shown in FIG. 7, the electro-optical device 100 is provided with a substrate protruding portion 110 </ b> T in which the first substrate 110 extends outside the outer shape of the second substrate 120. The substrate projecting portion 110T constitutes the above-described projecting portion that is exposed without being covered by the second substrate 120. Then, in the process of forming the electro-optical device 100 from the front panel structure 10 in order to form the substrate projecting portion 110T, as shown in FIG. 4, the substrate projecting portion to become the substrate projecting portion 110T. It is necessary to separate the second peripheral region 12B that is opposed to the region 11T.

  In the present embodiment, an overlapping structure of the spacer 17 ′ and the dummy pattern 18 similar to the above is also formed between the substrate extension region 11T shown in FIG. 4 and the second peripheral region 12B facing the substrate extension region 11T. It is arranged. As shown in FIG. 7 III, this overlapping structure is formed in a range avoiding the wirings 112 and 118 on the substrate overhanging portion 110T. This is because when the second peripheral region 12B facing the substrate overhanging region 11T is removed, a situation in which the spacer 17 'peels off and affects these wirings 112 and 118 does not occur. Normally, when the second peripheral region 12B is removed, the spacer 17 'is separated from the dummy pattern 18 formed in the second peripheral region 12B and remains on the substrate extension 110T.

  FIG. 5 shows a configuration of the first peripheral region 11B and the second peripheral region 12B arranged between the planned panel regions in the front panel structure. In the peripheral region between the planned panel regions, an overlapping structure of the dummy pattern 18 and the spacer 17 'is basically provided in the same manner as described above.

  FIG. 8 shows the measurement of the substrate interval (cell thickness) at 19 points from the X point to the Y point shown in FIG. 7 for the electro-optical device 100 shown in FIG. 7 configured as described above by the manufacturing method of this embodiment. The results are shown. In this graph, three solid lines indicate measurement data of three configuration examples of the present embodiment, and two broken lines indicate measurement data of two conventional examples in which a spacer is formed only in the inner range of the sealing material 13. Show.

  As seen from the graph shown in FIG. 8, in this embodiment, the cell thickness in the display region G is highly uniform, and the cell thickness hardly changes outside the display region G. The cell thickness at the outer peripheral portion of the display region G is larger than that at the central portion, and there is a peak position where the cell thickness is the largest outside the display region G. It can be seen that the thickness is decreasing. This graph is considered to indicate that the substrate interval inside the sealing material is increased by using the sealing material as a fulcrum because the substrate interval outside the sealing material is small.

  FIG. 11 is an enlarged partial cross-sectional view showing an overlapping structure of the dummy pattern 18 and the spacer 17 ′ according to an embodiment different from the above embodiment. In this embodiment, the thickness of the overlapping structure disposed in the peripheral region, that is, the combined thickness of the dummy pattern 18 and the spacer 17 ′ is configured to be slightly smaller than the substrate interval of the front panel structure. . In the front panel structure, a gap is formed between the dummy pattern 18 having the overlapping structure and the spacer 17 '. As described above, even when the thickness of the overlapping structure is slightly smaller than the distance between the substrates, the dummy pattern 18 and the spacer 17 ′ support the substrates when the substrates are bonded together when the substrates are bonded together. Therefore, the same effect as described above can be obtained. Here, in the illustrated example, the dummy pattern 18 is disposed on the substrate 12, the spacer 17 'is disposed on the substrate 11, and a gap is formed between the dummy pattern 18 and the spacer 17'. However, the present invention is not limited to this, and the superposition structure is arranged only on one substrate by laminating the dummy pattern 18 and the spacer 17 ′ on one of the substrates 11 and 12. A gap may be formed between the first substrate and the other substrate.

  FIG. 12A is a partial plan view showing the structure of the first substrate 110 ′, which is a component of the electro-optical device 100 ′ of another configuration example obtained by modifying a part of the above-described embodiment, and FIG. It is a fragmentary sectional view of 1 board | substrate 110 '. Here, the parts not shown are the same as those in the above embodiment, and the same reference numerals are given to the same parts in the drawings, and the description thereof is omitted.

  In this configuration example, an insulating film 116 is formed of a transparent material such as acrylic resin on the wiring 112 and the active element 113 of the first substrate 110 ′, and the pixel electrode 114 is formed on the insulating film 116. . The pixel electrode 114 and the active element 113 are electrically connected through a contact hole 116 a formed in the insulating film 116. The spacer 17 is also formed on the insulating film 116. This insulating film 116 is usually formed to a thickness of about 1 to 3 μm, preferably about 2 μm.

  By forming the insulating film 116 described above, influence of parasitic capacitance generated between the wiring 112 and the pixel electrode 114 can be suppressed, so that display quality can be improved. In addition, since the insulating film 116 is made of a transparent material, the insulating film 116 can be used when the electro-optical device 100 ′ is configured as any one of a transmission type, a reflection type, and a transflective display device.

  FIG. 13 is an enlarged cross-sectional view showing a part of the front panel structure in the manufacturing process of the electro-optical device 100 ′. In this configuration example, since the insulating film 116 is present, a difference between an interval defined by the spacer 17 in the display region and an interval defined by the spacer 17 ′ and the dummy pattern 18 outside the sealing material 13. Is significantly larger than the above embodiment. Therefore, in this configuration example, as shown in FIG. 13, in the front panel structure, the dummy pattern 18 ′ has a plurality of dummy layers 18 </ b> A and 18 </ b> B formed of the same material at the same time as a plurality of colored layers constituting the color filter 15. , 18C, a dummy layer 18D formed of the same material as the protective film 15P covering the color filter 15 is further laminated. In this way, the thickness of the dummy pattern 18 ′ can be formed to be thicker than that of the above embodiment, and therefore, the substrate interval outside the sealing material 13 increased by forming the insulating film 116 can be set to the spacer 17 ′. It can be defined by the dummy pattern 18 '.

  In this configuration example, as shown by a two-dot chain line in FIG. 13, a dummy pattern 19 formed of the same material as the insulating layer 116 is formed on the first front substrate 11. By forming the spacer 17 ′ on the top, the thickness required for the dummy pattern 18 ′ can be reduced. In the illustrated example, it is not necessary to form a dummy layer 18D corresponding to the protective film 15P in the dummy pattern 18 '. In this way, when the layered structure is formed by stacking another layer in addition to the colored layer and the protective film overlapped with the spacer 17 ′, the substrate spacing in the outer side and the peripheral region of the sealing material is large. But it can be supported reliably.

  In the present embodiment described above, the substrate interval is defined by the overlapping structure of the spacers 17 ′ and the dummy patterns 18 in the manufacturing process, outside the sealing material 13, particularly in the peripheral region that is finally removed. At the time of alignment, it is possible to suppress a decrease in the substrate interval on the outer peripheral portion of the front panel structure 10, thereby preventing variations in the substrate interval in the display region G.

  In particular, the dummy pattern 18 overlapped with the spacer 17 ′ includes at least one of a plurality of colored layers 15 R, 15 G, and 15 B constituting the color filter 15, or a protective film 15 P that covers the color filter 15, or these. Since the laminated structure is used, the dummy pattern 18 having a sufficient thickness can be formed without changing the manufacturing process. Therefore, the board | substrate space | interval of a panel outer peripheral part can be prescribed | regulated to the board | substrate space | interval similar to the display area G easily and reliably.

[Electronics]
Finally, with reference to FIG. 15 and FIG. 16, the configuration of an electronic apparatus using the electro-optical device 100 of the above embodiment will be described.

  FIG. 15 is a schematic configuration diagram showing the configuration of the display system of the present embodiment. The electronic apparatus shown here includes the same electro-optical device 100 as described above, and a control unit 190 for controlling the electro-optical device 100. The electro-optical device 100 is provided with the panel structure 100P configured as described above and a drive unit 100D that electrically drives the panel structure 100P. The driving unit 100D is configured by driving circuits 141, 142, and 143 mounted on the substrate overhanging unit 110T. However, the drive unit 100D may be configured on a wiring substrate such as a flexible substrate mounted on the substrate extension unit 110T, or may be configured separately from the electro-optical device 100. The driving unit 100D includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit.

  The control unit 190 supplies a control signal and electric power to the driving unit 100D, and includes a display information output source 191, a display processing circuit 192, a power supply circuit 193, and a timing generator 194.

  The display information output source 191 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display information processing circuit 192 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 194.

  The display processing circuit 192 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / repetition circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, executes processing of input display information, and outputs the image information. The signal is supplied to the driving unit 100D together with the clock signal CLK. The power supply circuit 193 supplies a predetermined voltage to each of the above-described components.

  FIG. 16 shows a mobile phone 1000 which is an embodiment of an electronic apparatus according to the invention. In the cellular phone 1000, a circuit board 1100 is disposed inside a case body, and the above-described electro-optical device 100 is mounted on the circuit board 1100. Operation buttons are arranged on the front surface of the operation unit 1001 of the case body, and an antenna is attached to the display unit 1002 on which the screen 100A of the electro-optical device 100 is arranged so as to be able to appear and retract. A microphone is built in the end of the operation unit 1001, and a speaker is built in the end of the display unit 1002.

  Note that the electro-optical device of the present invention is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described embodiment, a columnar spacer fixed to at least one of a pair of previous-stage substrates is provided in the manufacturing process. As the spacer included in the overlapping structure, a granular spacer separated from the substrate is used. But you can. In addition, as an overlapping structure of the colored layer or the protective film and the columnar spacer, both the colored layer or the protective film and the columnar spacer may be disposed on one substrate.

  In the above embodiment, the TFD element is used as the active element, but other active elements such as TFT (Thin Film Transistor) can be used instead of the TFD element. Further, although the above embodiment is an active matrix type, a passive matrix type display device can also be used.

  In the above embodiment, an example of configuring a liquid crystal display device is described. However, an electroluminescence device, an organic electroluminescence device, a plasma display device, an electrophoretic display device, a device using an electron-emitting device (Field Emission Display and The present invention can be similarly applied to various electro-optical devices such as Surface-Conduction Electron-Emitter Display.

FIG. 3 is a schematic plan view schematically showing a front panel structure at the time of manufacturing the electro-optical device of the embodiment. The schematic sectional drawing (a) which shows the AA cross section shown in FIG. 1 of the front panel structure of embodiment, and the schematic sectional drawing (b) which shows a BB cross section. The expanded fragmentary sectional view which expands and shows a part of front panel structure of embodiment. The expanded fragmentary sectional view which expands and shows another part of the front | former stage panel structure of embodiment. The expanded fragmentary sectional view which expands and shows another part of the front | former panel structure of embodiment. FIG. 3 is an enlarged partial cross-sectional view of a display area of the electro-optical device according to the embodiment. 1 is a schematic plan view illustrating an overall configuration of an electro-optical device according to an embodiment. The graph which shows cell thickness distribution of embodiment. FIG. 3 is an enlarged partial plan view illustrating a part of a display area of the electro-optical device according to the embodiment. FIG. 3 is an enlarged partial perspective view schematically illustrating the structure of an active element of the electro-optical device according to the embodiment. The expanded fragmentary sectional view which expands and shows a part of front panel structure of other embodiment. The enlarged partial top view (a) and enlarged partial sectional view (b) of the 1st board | substrate of the structural example which deform | transformed embodiment. The expanded fragmentary sectional view of the said structural example. Process drawing which shows the manufacturing process of embodiment. FIG. 3 is a schematic configuration diagram illustrating a display control system of an electronic apparatus in which the electro-optical device according to the embodiment is mounted. The schematic perspective view which shows an example of an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Electro-optical device, 110 ... 1st board | substrate, 112 ... Wiring, 113 ... Active element, 114 ... Pixel electrode, 116 ... Insulating film, 120 ... 2nd board | substrate, 122 ... Counter electrode, 130 ... Liquid crystal layer, 10 ... Previous stage Panel structure, 11 ... first front substrate, 12 ... second front substrate, 13 ... sealing material, 14,16 ... electrode pattern, 15 ... color filter, 15R, 15G, 15B ... colored layer, 15K ... light shielding layer, 15P ... Protective film, 17, 17 '... spacer, 18, 19 ... dummy pattern, 18A, 18B, 18C, 18D ... dummy layer.

Claims (8)

In the method of manufacturing an electro-optical device, an electro-optical material and a spacer that defines a distance between the pair of substrates are disposed between the pair of substrates, and at least one of the substrates has a panel structure including a color filter.
A substrate forming step of forming the pair of substrates in a form including a substrate region to be the panel structure and a peripheral region in which the pair of substrates are separated from the substrate region;
A front panel forming step of forming the front panel structure by bonding the pair of substrates;
Thereafter, a panel cutting step of forming the panel structure by dividing the front panel structure,
A method for manufacturing an electro-optical device, wherein an overlapping structure of a colored layer constituting the color filter or a protective film covering the color filter and the spacer is disposed in the peripheral region of the front panel structure. In the method of manufacturing an electro-optical device, an electro-optical material and a spacer that defines a distance between the pair of substrates are disposed between the pair of substrates, and at least one of the substrates has a panel structure including a color filter.
A substrate forming step of forming the pair of substrates in a form including a substrate region to be the panel structure and a peripheral region in which the pair of substrates are separated from the substrate region;
A front panel forming step of forming the front panel structure by bonding the pair of substrates;
Thereafter, a panel cutting step of forming the panel structure by dividing the front panel structure,
In the substrate region in the front panel structure, a color layer constituting the color filter or a protective film covering the color filter and an overlapping structure of the spacer are disposed,
A method for manufacturing an electro-optical device, wherein an overlapping structure of a colored layer constituting the color filter or a protective film covering the color filter and the spacer is disposed in the peripheral region of the front panel structure.   3. The method of manufacturing an electro-optical device according to claim 1, wherein the superposed structure includes a laminated structure of a plurality of the colored layers.   4. The method of manufacturing an electro-optical device according to claim 1, wherein the superposed structure includes a laminated structure of the colored layer and the protective film. 5. The panel structure is provided with an electrode for applying an electric field to the electro-optic material, and an overhanging portion including a wiring and a terminal that are extended from the other substrate on one of the substrates and electrically connected to the electrode,
5. The superposed structure is arranged in a portion where the wiring and terminals are not formed in a region to be the overhanging portion in the front panel structure. A method for manufacturing the electro-optical device according to claim 1.   6. The electricity according to claim 1, wherein an electrode and a wiring are stacked in the substrate region via an interlayer insulating film, and the overlapping structure includes the interlayer insulating film. Manufacturing method of optical device. In an electro-optical device in which a color filter, an electro-optical material, and a spacer that defines a distance between the pair of substrates are disposed between a pair of substrates bonded via a sealing material.
An electro-optic, wherein a superposition structure of a colored layer constituting the color filter or a protective film covering the color filter and the spacer is disposed outside the sealing material between the pair of substrates. apparatus. In an electro-optical device in which a color filter, an electro-optical material, an electrode for applying an electric field to the electro-optical material, and a spacer that defines a distance between the pair of substrates are disposed between a pair of substrates,
One of the substrates is provided with an overhanging portion including a wiring and a terminal that are electrically connected to the electrode protruding from the other substrate,
The electro-optical device, wherein the protruding portion is provided with the spacer.

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