JP2008216966A - Manufacturing method of electrooptical device, electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of an electrooptical device in which sufficient thickness reduction of a substrate and formation of a conductive film on an electrooptical panel are both compatibly achieved. <P>SOLUTION: First and second conductive films 33 and 34 are formed by applying the coating solution of a conductive material by using an ink jet method, and then the sufficient thickness reduction of the substrate (for example, a second substrate 2) and the formation of the conductive films 33 and 34 on the liquid crystal panel 20 can be both compatibly achieved. Namely, using the ink jet method eliminates the need to process the liquid crystal panel 20 under reduced pressure, and even when the substrate (for example, second substrate 2) of the liquid crystal display panel 20 before the conductive film forming stage is made thin, the conductive films 33 and 34 can be formed on the liquid crystal display panel 20 without causing breakage of the substrate etc. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus suitable for use in displaying various types of information.

  In recent years, an electro-optical device such as a liquid crystal device called a so-called lateral electric field method has attracted attention. This method is a method in which the direction of the electric field applied to the liquid crystal is substantially parallel to the substrate, and has an advantage that visual characteristics can be improved as compared with a TN (Twisted Nematic) method or the like. As this horizontal electric field type liquid crystal device, a liquid crystal device such as an IPS (In-Plane Switching) method or a FFS (Fringe Field Switching) method is known. This horizontal electric field type liquid crystal device has a structure in which liquid crystal is sandwiched between two substrates, and has a comb-shaped pixel electrode and a common electrode that generates a horizontal electric field between the pixel electrode, They are provided on the same substrate.

  However, in such a horizontal electric field type liquid crystal device, when a charge is charged on a substrate on which no electrode is provided due to external static electricity or the like, a substrate on which an electrode is provided and a substrate on which no electrode is provided In some cases, an electric field is generated between them, and proper display cannot be performed.

  Thus, for example, Patent Document 1 discloses a transparent substrate on the side that is not provided with a pair of electrodes (display electrode and reference electrode) among a pair of transparent substrates that are arranged to face each other with a liquid crystal layer interposed therebetween. A technique is disclosed in which a transparent conductive film (ITO film) is formed over almost the entire area of the surface (outer surface) opposite to the liquid crystal layer by a CVD method, and the transparent conductive film is grounded via a conductive tape or the like. Yes. As described above, in an electro-optical device such as a liquid crystal device, a conductive film such as an ITO film may be formed on the outer surface side of the substrate.

  By the way, in an electro-optical device such as a liquid crystal device, in order to meet a demand for thinning and the like, a substrate is polished or polished in a process after an electro-optical panel is manufactured by sandwiching an electro-optical material such as liquid crystal between a pair of substrates. Generally, the thickness is reduced by etching or the like. For example, in a horizontal electric field type liquid crystal device, after a liquid crystal display panel is manufactured by sandwiching liquid crystal between a pair of substrates, a substrate on which the pair of electrodes is not provided has a thickness of 0.1 mm to 0 mm, for example. In some cases, it is thinned to a thickness of about 3 mm. Therefore, in the technique disclosed in Patent Document 1 described above, the formation of the conductive film on the outer surface side of the substrate is necessarily a step after the liquid crystal is sandwiched between the pair of substrates.

Japanese Patent No. 3645834

  However, since the film formation of the conductive film by the CVD method is usually performed under reduced pressure, when the substrate is thinned as described above, the substrate is damaged by the differential pressure generated inside and outside the electro-optical panel at the time of film formation. There is a fear. For this reason, in an electro-optical device that requires the formation of a conductive film on the electro-optical panel, there has been a limit to thinning the substrate.

  The present invention has been made in view of the above circumstances, and provides an electro-optical device, a manufacturing method thereof, and an electronic apparatus that can achieve both a sufficiently thin substrate and formation of a conductive film on an electro-optical panel. One of the purposes is to do.

  Application Example 1 A method of manufacturing an electro-optical device according to this application example includes a panel manufacturing process for manufacturing an electro-optical panel in which an electro-optical material is sandwiched between a pair of substrates, and a pair of substrates constituting the electro-optical panel. A conductive film forming step of forming a conductive film by applying a coating solution of a conductive material onto the outer surface of at least one of the substrates using a droplet discharge method.

  According to such a configuration, since it is not necessary to perform a process under reduced pressure on the produced electro-optical panel, even when the substrate constituting the electro-optical panel is thinned to a sufficient thickness, the substrate is damaged. Thus, the conductive film can be formed without generating the above.

  Application Example 2 In the method of manufacturing an electro-optical device according to the application example, the region where the coating solution is applied in the conductive film forming step is a conductive film set on the electro-optical panel so as to form the conductive film. The region is narrower than the formation region.

  According to such a configuration, a conductive film can be formed in a desired conductive film formation region in consideration of diffusion of the coating solution.

  Application Example 3 In the method of manufacturing the electro-optical device according to the application example, the conductive film forming step includes a first conductive film forming step of forming a first conductive film on the one substrate, and the first conductive film forming step. A second conductive film is formed across the region where the conductive film is formed, the side surface of the one substrate, and the other substrate to electrically connect the first conductive film and the other substrate. And a conductive film forming step.

  According to such a configuration, electrical connection to the substrate can be easily realized through the second conductive film to the other of the first conductive film formed on one substrate.

  Application Example 4 In the electro-optical device manufacturing method according to the application example, the conductive film formation step includes a step of forming an inclined portion from an end surface of the one substrate to the other substrate. .

  According to such a configuration, the first conductive film and the second conductive film are formed on the second substrate by forming the inclined portion having a gentle upper surface from the end surface of one substrate to the other substrate. It can be formed on the outer surface, on the inclined portion, and on the protruding portion. As a result, it is possible to eliminate a factor that hinders securing sufficient conduction between the first conductive film and the second conductive film.

  Application Example 5 In the method of manufacturing the electro-optical device according to the application example, the other substrate has a terminal electrically connected to the outside of the electro-optical device, and the second conductive film is connected to the terminal. It forms in the area | region which overlaps with, It is characterized by the above-mentioned.

  According to such a configuration, it is possible to accurately realize the electrical conduction of the second conductive film to the outside of the electro-optical device.

  Application Example 6 In the method of manufacturing the electro-optical device according to the application example described above, the viscosity of the coating solution used in the second conductive film forming step is higher than the viscosity of the coating solution used in the first conductive film forming step. It is characterized by being set relatively high.

  According to such a configuration, the conduction of the second conductive film formed from one substrate to the other substrate can be accurately ensured.

  Application Example 7 In the method of manufacturing the electro-optical device according to the application example, the coating amount per unit area of the coating solution applied in the second conductive film forming step is applied in the first conductive film forming step. The amount of coating solution to be applied is set to be relatively larger than the coating amount per unit area.

  According to such a configuration, the conduction of the second conductive film formed from one substrate to the other substrate can be accurately ensured.

  Application Example 8 An electro-optical device according to this application example is manufactured by using the above-described electro-optical device manufacturing method.

  According to such a configuration, since it is not necessary to perform a process under reduced pressure on the produced electro-optical panel, even when the substrate constituting the electro-optical panel is thinned to a sufficient thickness, the substrate is damaged. Thus, the conductive film can be formed without generating the above.

  Application Example 9 An electronic apparatus according to this application example includes the electro-optical device described above.

  According to such a configuration, the electronic device can be sufficiently thinned.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)

  The drawings relate to the first embodiment of the present invention, FIG. 1 is a cross-sectional view of a main part of the liquid crystal device, FIG. 2 is a plan view of the liquid crystal device, FIG. 3 is a cross-sectional view and a plan view of subpixels of the liquid crystal device, FIG. 5 is an explanatory diagram showing a conductive film formation region for a liquid crystal display panel, FIG. 6 is a bottom view of the conductive film material jet head, and FIG. 7 is an explanatory diagram showing a conductive film formation process. FIG. 8 is a cross-sectional view of the principal part showing a modification of FIG.

  A liquid crystal device 100 as an example of the electro-optical device illustrated in FIGS. 1 and 2 is, for example, an FFS (Fringe Field Switching) liquid crystal device, and the liquid crystal device 100 includes a liquid crystal display panel 20 as an electro-optical panel. Have.

  The liquid crystal display panel 20 has a pair of substrates (first and second substrates 1 and 2) made of glass, quartz, or the like. The first and second substrates 1 and 2 are interposed via a seal material 3. It is pasted together. The first and second substrates 1 and 2 sandwich the liquid crystal 4 that is an electro-optical material inside the cell defined by the sealing material 3.

  Here, the internal structure of the liquid crystal display panel 20 will be described with reference to FIG. FIG. 3 shows an enlarged view of one subpixel in the liquid crystal display panel 20.

  As shown in FIG. 3A, a pair of electrodes is formed on the first substrate 1 on the surface (inner surface) facing the liquid crystal 4 with an insulating film interposed therebetween. That is, a common electrode 5 is formed of a transparent conductive material such as ITO (Indium-tin-oxide) on the inner surface of the first substrate 1, and an insulating layer 7 made of acrylic resin or the like is formed on the common electrode 5. Is formed. Further, a pixel electrode 8 is formed on the insulating layer 7 from a transparent conductive material such as ITO. As shown in FIG. 3B, the pixel electrode 8 has a comb shape. Specifically, the pixel electrode 8 includes a plurality of linear conductive portions 8a to 8e arranged at predetermined intervals, and one end portions of the conductive portions 8a to 8e are connected to each other to form a main portion. It is configured. Each conductive portion 8 a to 8 e generates an electric field (so-called lateral electric field) E having a component in a direction substantially parallel to the substrates 1 and 2 between the common electrode 5.

  On the other hand, on the second substrate 2, a colored layer 6 constituting a color filter is formed on the surface (inner surface) facing the liquid crystal 4, and an alignment film 9 is formed on the colored layer 6. ing.

  As shown in FIGS. 1 and 2, in the first embodiment, the first substrate 1 has a protrusion 30 that protrudes relative to the second substrate 2. A plurality of wirings 23 are formed on the protruding portion 30, and each wiring 23 is electrically connected to an external connection terminal 26 arranged on the protruding portion 30 along the edge portion of the first substrate 1. Yes. In addition, a wiring 24 that is electrically connected to the common electrode 5 is formed on the protruding portion 30, and a wiring 25 that is electrically connected to the pixel electrode 8 is further formed. Here, in the first embodiment, among the plurality of wirings 23, the wiring 23 a located on the outermost side on one side is set as a ground wiring, and the ground wiring 23 a is an end of the second substrate 2. It is electrically connected to a ground terminal 27 formed on the protruding portion 30 in the vicinity of the portion. Note that the wirings 23, 24, 25, the external connection terminals 26, and the ground terminals 27 are formed by patterning a copper foil using, for example, a photoetching method.

  A driver IC 21, which is a liquid crystal driving IC (driver), is directly disposed on the protrusion 30 by a COG (Chip On Glass) technique, and further, a flexible substrate (FPC: electrically connected to each external connection terminal 26). (Flexible Printed Circuit) 22 is arranged.

  The FPC 22 is electrically connected to some terminals of the driver IC 21 through the wiring 23. The pixel electrode 8 is electrically connected to a common potential terminal (COM terminal) of the driver IC 21 through the wiring 24. Further, the pixel electrode 8 is electrically connected to some terminals of the driver IC 21 through the wiring 25. Thereby, the driver IC 21 controls the magnitude of the electric field E based on the control signal supplied from the outside via the FPC 22. In the horizontal electric field type liquid crystal display panel 20, by controlling the magnitude of the electric field E, the alignment state of the liquid crystal molecules in the liquid crystal 4 is changed, and the gradation on the display screen is changed. Note that the driver IC 21 is covered with an insulator 28 together with the wirings 23, 24, 25, and the like in order to prevent a short circuit or the like on the protruding portion 30.

  In the liquid crystal display panel 20 configured as described above, a polarizing plate 31 is provided on the surface (outer surface) of the first substrate 1 on the side not facing the liquid crystal 4.

  On the other hand, on the surface (outer surface) of the second substrate 2 that is not opposed to the liquid crystal 4, a polarizing plate 32 is provided via a conductive film (first conductive film) 33. Here, in the first embodiment, the first conductive film 33 is formed by applying a coating solution made of a transparent conductive material such as, for example, ITO by using an ink jet method (droplet discharge method). It is formed on the substantially front surface of the outer surface of the substrate 2.

  In addition, a second conductive film 34 is connected to the first conductive film 33, and the first conductive film 33 is electrically connected to the ground terminal 27 through the second conductive film 34. ing. That is, as shown in FIGS. 1 and 2, the second conductive film 34 extends from the edge of the first conductive film 33 formed on the outer surface of the second substrate 2 to the end surface of the second substrate 2. A belt-like film extending to the upper layer of the ground terminal 27 on the projecting portion 30 is formed. Here, in the first embodiment, similarly to the first conductive film 33, the second conductive film 34 is formed by applying a coating solution made of a transparent conductive material such as ITO by an inkjet method (droplet discharge method). It is formed by using and applying. At that time, the film thickness of the second conductive film 34 is preferably formed to be equal to the film thickness of the first conductive film 33. In this case, the second conductive film 34 is used in order to ensure accurate conduction even in the stepped portion caused by the thickness of the second substrate 2 or the cell gap between the first and second substrates 1 and 2. The viscosity of the coating solution when forming the film is desirably set to be relatively higher than that when forming the first conductive film 33.

However, in the case where it is difficult to ensure sufficient conduction of the second conductive film 34, a modification example for securing sufficient conduction of the second conductive film 34 of the above-described embodiment is shown below. There may be. FIGS. 8A and 8B show Modification 1 and Modification 2. FIG.
(Modification 1)

For example, as shown in FIG. 8A, the coating amount per unit area of the coating solution when forming the second conductive film 34 is set to be relatively larger than that for the first conductive film 33. For example, the second conductive film 34 can be formed relatively thicker than the first conductive film 33.
(Modification 2)

  For example, when the coating solution for forming the first conductive film 33 is different from the coating solution for forming the second conductive film 34, the second conductive film 34 is formed by the first conductive film. It can also be performed independently of the formation of the film 33. In this case, for example, as shown in FIG. 8B, the first conductive film 33 is provided with a terminal 33a partially protruding from the polarizing plate 32, and a part of the second conductive film 34 is overlapped with the terminal 33a. Thus, accurate conduction between the conductive films 33 and 34 can be realized.

  In the liquid crystal device 100 according to the first embodiment, the first conductive film 33 is formed on the outer surface of the second substrate 2, and the first conductive film 33 is connected to the ground via the second conductive film 34. As a result, it is possible to accurately prevent the second substrate 2 from being charged by static electricity or the like and to generate an electric field between the first and second substrates 1 and 2, and realize an appropriate display by the liquid crystal display panel 20. it can.

Next, a method for manufacturing the liquid crystal device 100 according to the first embodiment will be described.
As shown in FIG. 4, first, in step S1, a manufacturing process of the liquid crystal display panel 20 is performed. That is, after the first and second substrates 1 and 2 are bonded and the liquid crystal 4 is sandwiched between the bonded first and second substrates 1 and 2, the first and second substrates 1 and 2 are placed on the protruding portion 30 of the first substrate 1. The driver IC 21 and the FPC 22 are disposed on the substrate 1 by the COG technique so as to be electrically connected to the patterned wirings 23, 24, and 25. Further, for example, a liquid insulating material is applied to the protruding portion 30 of the first substrate 1 and then cured, so that the driver IC 21 and the wirings 23, 24, 25, and the like disposed on the protruding portion 30 are insulated 28. Covered with.

  Subsequently, in step S2, after the second substrate 2 constituting the liquid crystal display panel 20 is thinned to, for example, about 0.1 mm to 0.3 mm using polishing or etching (thinning process), in step S3. Then, the first and second conductive films 33 and 34 are formed (conductive film forming step).

  In the first embodiment, the first and second conductive films 33 and 34 are formed by, for example, applying a coating solution made of a transparent conductive material such as ITO using an inkjet method, and then baking the coating solution. It is formed by.

  For example, as a method of applying a coating solution using an inkjet method, as shown in FIG. 7, a coating apparatus 200 that coats the liquid crystal display panel 20 includes a stage 201 that positions and holds the liquid crystal display panel 20, The head 202 configured to be relatively movable with respect to the stage 201, the spray amount and spray timing of the coating solution sprayed (discharged) from the head 202, and the relative position between the stage 201 and the head 202 are controlled. And a control unit 203.

  In the first embodiment, the head 202 uses the first coating solution for forming the first conductive film 33 and the second coating solution for forming the second conductive film 34 based on a signal from the control unit 203. And can be selectively injected. That is, for example, as shown in FIG. 6, a first nozzle group 202 a in which a plurality of nozzles for spraying the first coating solution is arranged on the bottom surface of the head 202, and a second coating solution is sprayed. And a second nozzle group 202b in which a plurality of nozzles are arranged, and any one of the coating solutions can be selectively ejected from the nozzle groups 202a and 202b. The viscosity of the second coating solution is set to be relatively higher than the viscosity of the first coating solution. Also, if the opening diameter of each nozzle forming the second nozzle group 202b is set larger than the opening diameter of each nozzle forming the first nozzle group 202a, the application sprayed from the second nozzle group 202b It is also possible to set the spray amount (application amount) per unit area of the solution to be relatively larger than that from the first nozzle group 202a.

  Here, as shown in FIG. 5, the first application region B1 set in the liquid crystal display panel 20 to apply the first application solution is narrower than the formation region A1 of the first conductive film 33. Is set. Similarly, the second coating region B2 set in the liquid crystal display panel 20 to apply the second coating solution to the liquid crystal display panel 20 is a region narrower than the formation region A2 of the second conductive film 34. Is set. That is, each of the coating regions B1 and B2 takes into account the amount of diffusion of the coating solution around the coating solution that is assumed based on the viscosity and coating amount of each coating solution, and the like. , A2 is set to a relatively narrow area.

  Then, the first application solution is ejected (applied) from the first nozzle group 202a of the head 202 to the first application area B1 (see FIG. 7A), so that a desired area (formation area) is formed. A first conductive film 33 is formed in A1). Similarly, a desired region (formation region A2) is formed by spraying (applying) the coating solution from the second nozzle group 202b of the head 202 to the second coating region B2 (see FIG. 7B). A second conductive film 34 is formed.

  Thereafter, in step S4, the polarizing plate 31 is disposed on the first substrate 1, and the polarizing plate 32 is disposed on the second substrate 2 on which the first conductive film 33 is formed.

  According to such an embodiment, a substrate (for example, the second substrate 2) is formed by applying a coating solution of a conductive material by using an ink jet method to form the first and second conductive films 33 and 34. It is possible to achieve both a sufficient thickness reduction and formation of the respective conductive films 33 and 34 on the liquid crystal display panel 20. That is, by using the ink jet method, it is not necessary to perform a process under reduced pressure on the liquid crystal display panel 20, and the liquid crystal display panel 20 substrate (for example, the second substrate 2) before the conductive film forming step is used. Even when the thinning process is performed, the conductive films 33 and 34 can be formed on the liquid crystal display panel 20 without damaging the substrate. In this case, in particular, the formation of the second conductive film 34 formed three-dimensionally from the second substrate 2 side to the first substrate 1 side is more advantageous as the thickness of the second substrate 2 is reduced. It will be a thing.

  Further, by adopting a film forming method using the ink jet method, the coating solution can be applied only to the preset coating regions (first and second coating regions B1, B2), and the coating solution is wasted. It can be used without. In addition, since a process such as etching is not required when forming the desired conductive film (first and second conductive films 33 and 34), the conductive film can be formed by a simple process.

  In addition, the ground connection of the first conductive film 33 to the ground terminal 27 is performed via the second conductive film 34, thereby reducing the size of the second substrate 2 as compared with the case of performing via the conductive tape or the like. be able to. That is, when the ground connection of the first conductive film 33 is performed via a conductive tape or the like, a space for attaching a conductive tape or the like is required on the second substrate 2, but the second conductive film 34 is used. In such a case, since such a space is not required, the second substrate 2 can be reduced in size.

  In the above-described embodiment, an example in which the first conductive film 33 is connected to the ground on the protruding portion 30 has been described. However, for example, the ground line extends to the protruding portion 30 as in a liquid crystal device in which sub-displays are connected. In the other liquid crystal device wired, the first conductive film 33 can be connected to the ground at an arbitrary place where the ground line is wired.

  In the above-described embodiment, two types of nozzle groups 202a and 202b corresponding to the application areas B1 and B2 on the liquid crystal display panel 20 are set in the head 202, and the application solution is supplied from the nozzle groups 202a and 202b. Although an example in which the first and second conductive films 33 and 34 are formed by selectively spraying has been described, the present invention is not limited to this. For example, a single nozzle group is set. It is also possible to form the conductive films 33 and 34 using a head. In this case, for example, the film thickness of each of the conductive films 33 and 34 can be controlled by adjusting the number of times the coating solution is applied to each of the coating regions B1 and B2.

In the above-described embodiment, the example in which the first and second conductive films 33 and 34 are formed on the liquid crystal display panel 20 by using the ink jet method has been described. However, the present invention is limited to this. Instead, for example, only the first conductive film 33 may be formed by using an ink jet method, and the first conductive film 33 may be grounded via a conductive tape. Furthermore, it is needless to say that a conductive film for other uses may be formed on the liquid crystal display panel 20 by using an ink jet method.
(Second Embodiment)

  The second embodiment will be described below. FIG. 9 shows a schematic diagram of a liquid crystal device according to the second embodiment. About the structure and manufacturing process similar to 1st Embodiment, the same code | symbol and process name are provided, and description is abbreviate | omitted.

The liquid crystal device according to the second embodiment is different from the liquid crystal device according to the first embodiment in that an inclined portion 40 is provided.
As shown in FIG. 9, an inclined portion 40 is formed from the end surface of one substrate 2 to the other substrate 1. That is, UV mold resin having ultraviolet curing property from the above-described stepped portion to the protruding portion 30 due to the thickness of the second substrate 2, the cell gap between the first and second substrates 1 and 2, etc. An inclined portion 40 is formed. The inclined portion 40 covers and hides part of the above-described stepped portion. The inclined portion 40 is inclined from the outer surface of the second substrate 2 to the protruding portion 30. That is, the upper surface of the inclined portion 40 is gently formed as compared with the steep stepped portion described above.

  The manufacturing method of the liquid crystal device according to the second embodiment is different from the manufacturing method of the liquid crystal device according to the first embodiment in that the inclined portion 40 is formed after thinning in step S2, and then step S3 is performed. It is to be.

A method for forming the inclined portion 40 in step S2 will be described below.
An UV mold resin having ultraviolet curability is applied from the stepped portion to the protruding portion 30. Thereafter, the UV mold resin is cured by performing ultraviolet irradiation.

  Thereafter, in step S3, the first coating solution and the second coating solution made of a transparent conductive material such as ITO are applied to the first substrate 2 over the outer surface of the second substrate 2, the inclined portion 40, and the protruding portion 30. As in the embodiment, application is performed using an inkjet method. Thereafter, the first conductive film 33 and the second conductive film 34 are formed by baking the coating solution.

  Then, step 4 is performed. Thereby, the liquid crystal device 100 shown in FIG. 9 is obtained. Here, the viscosities of the first coating solution and the second coating solution are not limited to be set in the same manner as in the first embodiment, and may be equivalent.

  According to the second embodiment, the same effects as those of the first embodiment can be obtained, and the following effects can be obtained.

  Therefore, according to the second embodiment, the first conductive film 33 and the second conductive film 34 are formed on the second substrate 2 by forming the inclined portion 40 having a gentle upper surface in the above-described stepped portion. It can be formed on the outer surface, on the inclined portion 40 and on the protruding portion 30. As a result, it is possible to eliminate a factor that prevents the first conductive film 33 and the second conductive film 34 from ensuring sufficient conduction. In particular, it is possible to eliminate a factor that hinders securing sufficient conduction in a portion where the outer surface and the end surface of the second substrate 2 are in contact with each other and in the vicinity of this portion. Here, as a factor that prevents the securing of sufficient conduction, the thickness of the first conductive film 33 and the second conductive film 34 is not ensured. Further, it is exemplified that at least a part of the first conductive film 33 and the second conductive film 34 is broken at a portion where the outer surface and the end surface of the second substrate 2 are in contact with each other and in the vicinity of this portion.

Further, the viscosities of the first coating solution and the second coating solution are not limited to the same settings as in the first embodiment, and therefore the first conductive film 33 made of the first coating solution and the second The second conductive film 34 made of the coating solution can eliminate problems caused by differences in viscosity or material. Here, as this malfunction, the 1st electrically conductive film 33 and the 2nd electrically conductive film 34 are not formed continuously, interrupted, or fracture | ruptured. In addition, a defect in conduction between the first conductive film 33 and the second conductive film 34 due to this defect is also included as this defect.
(Third embodiment)

  The third embodiment will be described below. FIG. 10 shows a schematic diagram of a liquid crystal device according to the third embodiment. The liquid crystal device according to the third embodiment has the same configuration as that of the second embodiment shown in FIG. 9, but the manufacturing method is different. For this reason, the same code | symbol is provided and description of a structure is abbreviate | omitted.

The method for manufacturing the liquid crystal device 100 according to the third embodiment will be described below.
The liquid crystal device according to the third embodiment is different from the liquid crystal device according to the second embodiment in the material for forming the first conductive film. The material for forming the first conductive film is a coating solution made of a resin containing a transparent conductive material.
The difference between the method of manufacturing the liquid crystal device according to the third embodiment and the method of manufacturing the liquid crystal device according to the second embodiment is that the coating solution is applied to the polarizing plate 32 in step S3 to provide the first conductive material. The film 33b is formed.

  In step S3, a coating solution made of a resin containing a transparent conductive material is applied to the formation region A1 or the coating region B1 (see FIG. 5). And the application | coating solution consisting of resin containing a transparent conductive material is apply | coated to application | coating area | region B2 (refer FIG. 5) using the coating device 200. FIG. Here, the coating method is not limited to the ink jet method as described above, and may be a wet process such as screen printing.

  Thereafter, in step S4, the polarizing plate 32 on which the first conductive film 33b is formed with a coating solution made of a resin containing a transparent conductive material is disposed. Thereby, the 2nd board | substrate 2 and the polarizing plate 32 are bonded together by a coating solution. Thereafter, the first conductive film 33 and the second conductive film 34 are formed by firing. Here, the viscosities of the first coating solution and the second coating solution are not limited to be set in the same manner as in the first embodiment, and may be equivalent.

Thereby, the liquid crystal device 100 shown in FIG. 10 is obtained. Therefore, according to the third embodiment, the same effects as those of the above-described embodiments can be obtained.
(Fourth embodiment)

  The fourth embodiment will be described below. FIG. 11 is a schematic diagram of a liquid crystal device according to the fourth embodiment. About the structure and manufacturing process similar to 3rd Embodiment, the same code | symbol and process name are provided, and description is abbreviate | omitted.

A method for manufacturing the liquid crystal device 100 according to the fourth embodiment will be described below.
The fourth embodiment differs from the third embodiment in the material and method for forming the second conductive film. That is, in the fourth embodiment, in step S3, the second conductive film 34b is formed by a manufacturing method using a dry process typified by sputtering.

  In step S3, the second conductive film 34b is formed in the application region B2 (see FIG. 5) by sputtering a transparent conductive material such as ITO. That is, the second conductive film 34 b is formed by sputtering on the outer surface of the second substrate 2, on the inclined portion 40, and on the protruding portion 30.

  Thereafter, step S4 is performed in the same manner as in the third embodiment. Thereby, the liquid crystal device 100 shown in FIG. 11 is obtained. Therefore, according to the fourth embodiment, the same effects as those of the above-described embodiments can be obtained.

  Next, an example in which the liquid crystal device 100 according to the above-described embodiment is applied to a display unit of a mobile phone will be described. As shown in FIG. 12, the cellular phone 1200 includes the liquid crystal device 100 described above together with the earpiece 1202 and the mouthpiece 1203 in addition to the plurality of operation buttons 1201. In the figure, the display area of the liquid crystal display panel 20 appears as an external fit through a cover glass 1204.

  Note that the electro-optical device of the above-described embodiment can be applied not only to an FFS liquid crystal device but also to an IPS (In-Plane Switching) liquid crystal device. The present invention can also be applied to a twisted liquid crystal device. In addition to liquid crystal devices, electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission (such as Field Emission Display and Surface-Conduction Electron-Emitter Display), DLP (registration) The above-described embodiment can be similarly applied to various electro-optical devices such as a trademark (Digital Light Processing) (also known as DMD: Digital Micromirror Device).

  The above-described embodiments can also be applied to display devices that form elements on a semiconductor substrate, such as LCOS (Liquid Crystal On Silicon).

  In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed under the pixel electrode.

  In addition to mobile phones, electronic devices to which the electro-optical device of the above-described embodiments is applied include digital still cameras, notebook computers, liquid crystal televisions, viewfinder type (or monitor direct view type) video recorders, Examples include car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, and devices equipped with touch panels. Needless to say, the above-described electro-optical device can be applied as a display device of these various electronic devices.

1 is a cross-sectional view of a main part of a liquid crystal device according to a first embodiment. The top view of the liquid crystal device of a 1st embodiment. FIG. 4 is a cross-sectional view and a plan view of subpixels of the liquid crystal device according to the first embodiment. 3 is a flowchart showing a method for manufacturing the liquid crystal device of the first embodiment. Explanatory drawing which shows the formation area of the electrically conductive film with respect to the liquid crystal display panel of 1st Embodiment. The bottom view of the electrically conductive film material injection head of 1st Embodiment. Explanatory drawing which shows the formation process of the electrically conductive film of 1st Embodiment. The principal part sectional view showing the modification of a 1st embodiment. Schematic which shows the liquid crystal device of 2nd Embodiment. Schematic which shows the liquid crystal device of 3rd Embodiment. Schematic which shows the liquid crystal device of 4th Embodiment. 1 is a schematic diagram illustrating an electronic apparatus to which a liquid crystal device of the present invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 1st board | substrate (the other board | substrate), 2 ... 2nd board | substrate (one board | substrate), 4 ... Liquid crystal (electro-optical material), 20 ... Liquid crystal display panel (electro-optical panel), 27 ... Ground terminal, 33 DESCRIPTION OF SYMBOLS ... 1st electrically conductive film, 34 ... 2nd electrically conductive film, 100 ... Liquid crystal device (electro-optical device), 1200 ... Mobile phone, A1, A2 ... Formation area of electrically conductive film, B1, B2 ... Application | coating area | region.

Claims (9)

A panel fabrication process for fabricating an electro-optic panel having an electro-optic material sandwiched between a pair of substrates;
A conductive film forming step of forming a conductive film by applying a coating solution of a conductive material on the outer surface of at least one of the pair of substrates constituting the electro-optical panel using a droplet discharge method. A method for manufacturing an electro-optical device.   The region where the coating solution is applied in the conductive film formation step is a region narrower than a conductive film formation region set in the electro-optical panel to form the conductive film. Manufacturing method of the electro-optical device. The conductive film forming step includes a first conductive film forming step of forming a first conductive film on the one substrate,
A second conductive film is formed over the region where the first conductive film is formed, the side surface of the one substrate, and the other substrate to electrically connect the first conductive film and the other substrate. The method for manufacturing an electro-optical device according to claim 1, further comprising: forming a second conductive film to be connected.   4. The electro-optical device according to claim 1, wherein the conductive film forming step includes a step of forming an inclined portion from an end surface of the one substrate to the other substrate. 5. Manufacturing method.   5. The other substrate has a terminal that is electrically connected to the outside of the electro-optical device, and the second conductive film is formed in a region overlapping with the terminal to conduct. A method of manufacturing the electro-optical device according to claim.   6. The viscosity of the coating solution used in the second conductive film forming step is set to be relatively higher than the viscosity of the coating solution used in the first conductive film forming step. A method for manufacturing the electro-optical device according to claim 1.   The coating amount per unit area of the coating solution applied in the second conductive film formation step was set to be relatively larger than the coating amount per unit area of the coating solution applied in the first conductive film formation step. The method for manufacturing an electro-optical device according to claim 4, wherein the electro-optical device is manufactured as described above.   An electro-optical device manufactured using the method for manufacturing an electro-optical device according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 8.

Images