JP2008224413A - Printed board manufacturing device and printed board manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine pressure abnormality under pressurization of a printed board. <P>SOLUTION: A mounting plate is disposed between a resin film and one of heating plates of a pressing machine, and a polarization plane holding optical fiber 14 having a diffraction grating 14a is arranged on the surface of the mounting plate on the resin film side. Polarization light is made to come from a light emitting device 11a into the polarization plane holding optical fiber 14 during the pressurization of the resin film; wavelength interval of first and second reflected lights is specified based on an electric signal input from a light receiving device 11b, and the pressure of the part coming into contact with the diffraction grating of the printed board is detected based on the wavelength interval of the first and second reflected lights and is displayed on a display device 17. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a printed circuit board manufacturing apparatus and a printed circuit board manufacturing method for forming a printed circuit board by applying pressure while heating laminated resin films.

  Conventionally, such a printed circuit board manufacturing apparatus forms a printed circuit board by collectively pressing laminated resin films at a high temperature (for example, 300 degrees). In such a printed circuit board manufacturing apparatus, when the laminated resin film is pressed, if the hot plate is tilted or the mounting plate on which the resin film is mounted is distorted or deformed, it is applied to the resin film. The pressure becomes uneven, causing pattern flow due to resin flow, poor interlayer connection, insufficient interlayer adhesion, and the like, leading to manufacturing defects.

  Therefore, it is conceivable to reduce defective manufacturing of the printed circuit board by directly detecting the pressure applied to the printed circuit board during pressurization of the printed circuit board and distinguishing defective substrates in which the pressure abnormality has occurred.

  Some of the printed circuit board manufacturing apparatuses as described above are equipped with a pressure gauge for measuring the hydraulic pressure of the pressurizing cylinder when the printed circuit board is pressurized. It is not possible to directly detect the pressure applied to.

Therefore, an optical fiber pressure sensor that calibrates the output of a pressure sensitive diaphragm as a pressure sensitive element disposed at the end of the optical fiber in accordance with a temperature change detected by a dielectric filter disposed at the end of the optical fiber. It is conceivable to directly detect the pressure applied to the printed circuit board during pressurization using an apparatus (for example, see Patent Document 1).
Japanese Patent Laid-Open No. 5-196528

  However, the optical fiber pressure sensor device described in Patent Document 1 measures temperature using a dielectric filter with low heat resistance, and calibrates the output of the pressure sensitive diaphragm based on the measurement result. It is difficult to apply to a printed circuit board manufacturing apparatus that forms a printed circuit board by applying pressure while heating a resin film.

  It is also conceivable to directly detect the pressure applied to the printed circuit board during pressurization using a pressure sensor using a semiconductor type or thin film resistance type strain gauge.

  However, pressure sensors using such semiconductor and thin film resistance strain gauges do not have heat resistance that can withstand the heating temperature of the printed circuit board. It is difficult to apply to a printed circuit board manufacturing apparatus for forming a substrate. In addition, when using such a pressure sensor to directly detect the pressure applied to the printed circuit board during pressurization, the difference in thermal conductivity between the pressure sensor pressure detector and the surrounding mounting board It is conceivable that the heating becomes non-uniform and the quality of the printed circuit board deteriorates.

  As described above, the pressure applied to the printed circuit board during pressurization is directly detected by using a pressure sensor using a semiconductor type or thin film resistance type strain gauge or an optical fiber pressure sensor device described in Patent Document 1. Therefore, it is difficult to determine a pressure abnormality.

  The present invention has been made in view of the above points, and an object of the present invention is to make it possible to determine a pressure abnormality during pressurization of a printed circuit board.

  The first feature of the present invention is that a press machine (20) for forming a printed circuit board (30) by applying pressure while heating the resin film using hot plates (21) provided on both sides of the laminated resin film. A mounting plate (15) disposed between the resin film and one of the hot plates of the press, a polarization plane holding optical fiber (14) fixed to the surface of the mounting plate on the resin film side, and a polarization plane A light-emitting element (11a) that makes polarized light incident on the holding optical fiber, a spectroscope (12) that splits light incident on the light-emitting element from the polarization-maintaining optical fiber side, and light that has been dispersed by the spectroscope And a light receiving element (11b) for converting into an electrical signal, and the refractive index of the core (14b) of the polarization maintaining optical fiber is periodically changed at a predetermined pitch in the axial direction of the core. Diffraction grating (14a) is formed When polarized light from the light emitting element is incident on the polarization-maintaining optical fiber, the first and second reflected lights having different wavelengths are reflected and returned by the diffraction grating, and the first and second reflected lights are reflected according to the distortion amount of the diffraction grating due to pressurization. The wavelength interval of the first and second reflected light changes, and when the resin film is pressurized, polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, and the electric signal input from the light receiving element Based on the wavelength interval specifying means for specifying the wavelength interval between the first reflected light and the second reflected light based on the wavelength interval between the first reflected light and the second reflected light specified by the wavelength interval specifying means. Pressure detecting means for detecting the pressure of the portion in contact with the diffraction grating, and display control means for displaying the pressure detected by the pressure detecting means on the display device (17).

  In such a configuration, when the resin film is pressed, polarized light is incident on the polarization-maintaining optical fiber on which the diffraction grating is formed from the light emitting element, and the first reflected light is based on the electric signal input from the light receiving element. The wavelength interval between the second reflected light and the second reflected light is specified, the pressure of the portion of the printed circuit board in contact with the diffraction grating is detected, and the detected pressure is displayed on the display device. Can be determined.

  In addition, since the pressure detection part is comprised only by the polarization plane holding | maintenance optical fiber excellent in heat resistance, even when it heats at high temperature and forms a printed circuit board, the pressure of a printed circuit board can be detected without a problem. In addition, because it is configured to detect pressure using a thin-polarized polarization-maintaining optical fiber, it is possible to form a printed circuit board without affecting the in-plane temperature distribution during pressurization. It is.

  The second feature of the present invention is that a polarization maintaining optical fiber is formed with a plurality of diffraction gratings having different pitches, and a plurality of diffraction gratings of the polarization maintaining optical fiber are provided in the plane of the mounting plate. Each wavelength of the first and second reflected light changes according to the pitch of each diffraction grating, and the wavelength interval specifying means is provided from the light emitting element to the polarization plane holding optical fiber. Polarized light is incident, the wavelength interval of the first and second reflected light is specified for each diffraction grating based on the electrical signal input from the light receiving element, and the pressure detection means is provided for each diffraction grating by the wavelength interval specifying means. The pressure of the part that contacts the diffraction grating of the printed circuit board is detected for each diffraction grating from the identified wavelength interval of the first and second reflected light, and the display control means is a part that contacts the diffraction grating of the printed circuit board for each diffraction grating The pressure on the display device A.

  In such a configuration, the pressure is detected for each of the diffraction gratings arranged at a plurality of locations in the plane of the mounting plate, so that the pressure distribution in the plane of the printed board can be detected.

  A third feature of the present invention is that a groove (15a) for embedding the polarization-maintaining optical fiber is formed in the mounting plate, and the polarization-maintaining optical fiber is embedded in the polarization-maintaining optical fiber. It is buried in the groove.

  As described above, by burying the polarization-maintaining optical fiber in the groove for embedding the polarization-maintaining optical fiber, it is possible to reduce the damage caused by the pressurization of the polarization-maintaining optical fiber.

  A fourth feature of the present invention is that the polarization maintaining optical fiber includes a clad (14c) formed around the core, and the clad is formed with two stress applying portions (14d) so as to sandwich the core. The polarization-maintaining optical fiber is fixed to the mounting plate so that the stress applying portions are aligned in the stress direction that the mounting plate receives during pressurization.

  In this way, the polarization-maintaining optical fiber can be fixed to the mounting plate so that the stress applying portions are arranged in the stress direction received by the mounting plate during pressurization.

  The fifth feature of the present invention is that the polarization-maintaining optical fiber is bonded to the mounting plate using an adhesive (19) having a melting point higher than the heating temperature of the resin film.

  The sixth feature of the present invention is that the resin film is a thermoplastic resin film.

  The seventh feature of the present invention is that the press machine (30) is formed by pressing the resin film while heating the resin film using the hot plates (21) provided on both sides of the laminated resin film. 20), a mounting plate (15) disposed between the resin film and one of the hot plates of the press, and a polarization-maintaining optical fiber (14) fixed to the surface of the mounting plate on the resin film side, A light emitting element (11a) that makes polarized light incident on a polarization-maintaining optical fiber, a spectroscope (12) that splits light that enters the light-emitting element from the polarization-maintaining optical fiber side, and light that has been dispersed by the spectroscope A light receiving element (11b) that receives light and converts it into an electrical signal, and the refractive index of the core (14b) of the polarization-maintaining optical fiber is periodically changed at a predetermined pitch in the axial direction of the core. The formed diffraction grating (14a) is formed When polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, the first and second reflected lights having different wavelengths are reflected and returned by the diffraction grating, depending on the distortion amount of the diffraction grating due to pressurization. The wavelength interval between the first and second reflected light changes, and when the resin film is pressed, polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, and the electric light input from the light receiving element is input. The wavelength interval between the first reflected light and the second reflected light is specified based on the signal, and the pressure at the portion in contact with the diffraction grating of the printed circuit board is determined from the specified wavelength interval between the first reflected light and the second reflected light. , And the detected pressure is displayed on the display device (17). Based on whether or not the pressure displayed on the display device is out of a predetermined standard range, a pressure abnormality during pressurization of the printed circuit board is detected. It is to judge.

  In such a configuration, when the resin film is pressed, polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, and the first reflected light and the second reflected light are based on the electrical signal input from the light receiving element. , The pressure of the portion in contact with the diffraction grating of the printed circuit board is detected from the identified wavelength interval of the first reflected light and the second reflected light, and the detected pressure is displayed on the display device. A pressure abnormality during pressurization of the printed circuit board can be determined based on whether or not the pressure displayed on the display device is out of a predetermined standard range.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  FIG. 1 shows the overall configuration of a printed circuit board manufacturing apparatus according to an embodiment of the present invention. The printed circuit board manufacturing apparatus 1 includes a light measuring element 11a, a light receiving element 11b, a spectroscope 12, a polarization maintaining optical fiber 14, a signal processing unit 16, a display device 17, and a pressure measuring device 10 having a storage device 18, and a laminated resin. It is comprised by the press 20 which forms a printed circuit board by pressurizing a film, heating at high temperature (for example, 300 degree | times).

  The light emitting element 11 a is for entering polarized light into the polarization-maintaining optical fiber 14, and is configured by a laser diode that emits light according to a signal from the signal processing unit 16. The light emitting element 11a has a polarization maintaining optical fiber to which the FC connector 13 is assembled, and the polarized light is incident on the spectroscope 12 through the polarization maintaining optical fiber.

  The spectroscope 12 is for making the polarized light output from the light emitting element 11a enter the polarization plane holding optical fiber 14 and for splitting the reflected light reflected from the polarization plane holding optical fiber 14 to the light receiving element 11b. is there. The spectroscope 12 is configured using a polarization-maintaining optical fiber so as to perform spectroscopy while maintaining the polarization plane of the polarized light. The spectroscope 12 is connected to the polarization-maintaining optical fiber 14 via the FC connector 13.

  The light receiving element 11b is an element for receiving the reflected light reflected and returned from the polarization-maintaining optical fiber 14 and converting it into an electric signal, and is constituted by a photodiode. The light receiving element 11b has a polarization-maintaining optical fiber to which the FC connector 13 is assembled. The light receiving element 11b receives light dispersed by the spectrometer 12 through the polarization-maintaining optical fiber.

  The polarization maintaining optical fiber 14 is formed with a plurality of diffraction gratings 14a whose refractive index is periodically changed at a predetermined pitch in the axial direction of the core using a method such as a UV irradiation method. The polarization maintaining optical fiber 14 will be described later in detail.

  The signal processing unit 16 is configured as a computer including a CPU, a memory, an I / O, and the like, and the CPU performs various processes according to a program stored in the memory.

  The display device 17 has a display such as a liquid crystal and displays an image corresponding to the image signal input from the signal processing unit 16 on the display.

  The storage device 18 includes a nonvolatile storage medium such as a hard disk or a flash memory, and stores data input from the signal processing unit 16 in the nonvolatile storage medium.

  The press machine 20 is an apparatus that forms a printed circuit board by collectively pressing a resin film while heating the resin film at a high temperature using hot plates provided on both sides of the laminated resin film. In this embodiment, a thermoplastic resin film is laminated to form a multilayer PLAAP substrate (PALAP substrate: Patterned Prep Lay Up Process substrate) as described in JP-A No. 15-086949.

  The press machine 20 is provided with a start button 20a for instructing the start of pressing. When the start button 20a is operated by the operator, the press machine 20 sends a signal instructing the start of pressing to the pressure measuring device 10 and starts a process of batch pressing while heating the hot plate 21 at a high temperature. .

  The pressure measuring device 10 in this embodiment forms a biaxial FBG (Fiber Bragg Grating) sensor using the polarization-maintaining optical fiber 14 on which the diffraction grating 14a is formed as a pressure detection unit, and a printed circuit board is formed by the FBG sensor. The pressure applied to is directly measured.

  Here, the FBG sensor will be described. A diffraction grating whose refractive index is periodically changed at a predetermined pitch in the axial direction of the core of the optical fiber is formed, and the incident light having a wavelength λ1 as shown in FIG. When light is incident, reflected light of wavelength λ2 as shown by a solid line in FIG. 2B is reflected and returned by the diffraction grating, and other components are transmitted. Note that the wavelength λ2 of the reflected light has a property of shifting according to the distortion generated in the diffraction grating, as indicated by a dotted line in FIG. The FBG sensor detects the pressure applied to the diffraction grating using such properties.

  The pressure measuring device 10 in this embodiment forms a biaxial FBG sensor using a polarization-maintaining optical fiber. The polarization-maintaining optical fiber 14 has different refractive index structures in two orthogonal polarization planes. Therefore, when a diffraction grating 14a is formed in the axial direction of the core of the polarization-maintaining optical fiber 14, and light is incident on the polarization-maintaining optical fiber 14 from the light emitting element, the diffraction grating 14a has a wavelength as shown in FIG. Different first and second reflected lights are reflected back. In addition, the wavelength interval d of the first and second reflected light has a property of changing according to the amount of distortion of the diffraction grating 14a.

  FIG. 4 shows the relationship between the pressure applied to the diffraction grating 14a and the wavelength interval shift amount of the first and second reflected light. As shown in the figure, the wavelength interval shift amount of the first and second reflected light increases as the pressure to the diffraction grating 14a increases.

  In this embodiment, a biaxial FBG sensor is configured using the polarization-maintaining optical fiber 14 in which such a diffraction grating 14a is formed, and the pressure applied to the diffraction grating 14a is detected from the wavelength interval shift amount.

  Further, an optical fiber in which such a diffraction grating is formed has a property that the wavelength of reflected light changes according to the pitch of the diffraction grating. Using such properties, it is possible to form a plurality of diffraction gratings having different pitches in one optical fiber and individually measure the pressure applied to each diffraction grating according to the wavelength of the reflected light. ing.

  As shown in FIG. 5, the polarization-maintaining optical fiber 14 is wired on the upper surface of a mounting plate 15 for mounting a printed board. A plurality of diffraction gratings 14 a having different pitches are formed in the polarization plane holding optical fiber 14, and the diffraction gratings 14 a are scattered around the center and the center of the mounting plate 15.

  When polarized light is incident on the polarization-maintaining optical fiber 14 from the light emitting element 11a, the first and second reflected lights having different wavelengths for each diffraction grating are reflected and returned.

  The signal processing unit 16 specifies the wavelength interval of the first and second reflected lights having different wavelengths for each diffraction grating based on the electrical signal input from the light receiving element 11b, and specifies the specified first and second reflected lights. The pressure on the mounting plate 15 is detected for each diffraction grating from the wavelength interval. Thus, by detecting the pressure for each of the diffraction gratings 14a scattered around the central portion of the mounting plate 15, the in-plane distribution of the pressure of the printed circuit board 30 can be detected.

  FIG. 6 shows a schematic cross-sectional configuration of the polarization-maintaining optical fiber 14 wired on the upper surface of the mounting plate 15. As shown in the figure, the polarization-maintaining optical fiber 14 is bonded to the upper surface of the mounting plate 15 using an adhesive 19.

  The mounting plate 15 is made of a material having excellent thermal conductivity such as Al, SUS, Fe, Cu, glass, and alumina.

  Moreover, the polarization-maintaining optical fiber 14 has heat resistance enough to withstand the heating temperature of the resin film. Also, the adhesive 19 has a melting point higher than the heating temperature of the resin film, and has heat resistance enough to withstand the heating of the resin film. The linear expansion coefficient when the adhesive is cured is preferably a value between the thermal expansion coefficients of the polarization-maintaining optical fiber 14 and the mounting plate 15. Moreover, since the pressure detection accuracy decreases when the polarization-maintaining optical fiber 14 extends in the axial direction, the adhesive 19 has a relatively elastic modulus so as to suppress the elongation in the axial direction of the polarization-maintaining optical fiber 14. Higher ones are used.

  Moreover, two stress applying portions 14d are formed on the clad 14c of the polarization maintaining optical fiber 14 so as to sandwich the core 14b. The core 14b of the polarization-maintaining optical fiber 14 receives tensile stress in the vertical direction in FIG. 6 and compressive stress in the horizontal direction in FIG. 6 by these stress applying portions 14d.

  The polarization-maintaining optical fiber 14 is placed on the mounting plate 15 such that the core 14b and the two stress applying portions 14d are arranged in a line in the direction of stress applied to the mounting plate 15 during pressurization, that is, in the direction perpendicular to the mounting surface of the mounting plate 15. It is glued.

  Further, as shown in the figure, the mounting plate 15 is disposed on the upper surface of the heat plate 21 on the lower side of the press machine 20, and the polarization plane holding optical fiber 14 on the upper side of the mounting plate 15 is bonded to the printed board 30. Installed on the surface.

  Next, a method for manufacturing a printed circuit board will be described. First, as shown in FIG. 6, the operator installs a resin film laminated on the surface to which the polarization plane holding optical fiber 14 on the upper side of the mounting plate 15 is bonded.

  When the start button 20a of the press machine 20 is operated, the press machine 20 starts a process of batch pressing while heating the hot plate 21 at a high temperature in accordance with a program stored in advance in the memory, and instructs the start of pressing. The signal is sent to the signal processing unit 16.

  When the signal instructing the start of pressing is input, the signal processing unit 16 starts the processing shown in FIG. First, the light emitting element 11a emits light (S100). When the light emitting element 11a emits light in this way, the polarized light is incident on the polarization maintaining optical fiber 14 from the light emitting element 11a, and the first and second reflected lights are respectively emitted from the diffraction gratings 14a of the polarization maintaining optical fiber 14. The light is reflected and returned by the light receiving element 11b.

  Next, each wavelength of the first and second reflected light reflected and returned from each diffraction grating 14a is measured based on the signal input from the light receiving element 11b, and the wavelength of the first and second reflected light is measured. A process of specifying the position of the diffraction grating 14a reflecting the first and second reflected lights and specifying the wavelength interval of the first and second reflected lights for each diffraction grating is performed (S102). In the present embodiment, the wavelength interval of the first and second reflected lights is specified at the timing when the greatest load is applied to the printed circuit board 30 by the hot plate 21 of the press machine 20. Further, each wavelength of the first and second reflected light can be measured by using a known optical spectrum analysis technique by high-speed sweep.

  Next, the pressure of the part of the printed circuit board 30 in contact with the diffraction grating 14a is detected for each diffraction grating from the wavelength interval of the first and second reflected light. Specifically, the relationship between the pressure applied to the diffraction grating 14a as shown in FIG. 4 and the wavelength interval shift amount of the first and second reflected light is stored in the memory for each diffraction grating. Based on the above, the pressure of the portion of the printed circuit board 30 in contact with the diffraction grating 14a is detected from the wavelength interval shift amount of the first and second reflected light (S104).

  Next, the detected pressure is displayed on the display device 17. Specifically, the detected pressure is displayed on the display device 17 for each portion of the printed circuit board 30 that contacts the diffraction grating 14a, and the contents of the display screen are stored in the storage device 18 (S106). finish.

  FIG. 8 shows a display example of the display device 17. As shown in the figure, the detected pressures X1 to X11 are displayed for each of the portions A to K in contact with the diffraction grating 14a of the printed circuit board 30.

  The operator determines a pressure abnormality during pressurization of the printed circuit board based on whether or not the pressure displayed on the display of the display device 17 is out of a predetermined standard range, and the pressure during pressurization is abnormal. In some cases, it is distinguished from non-defective products. In this way, it is possible to prevent the printed circuit board 30 manufactured with an abnormal pressure during pressurization from flowing to a subsequent process.

  According to the configuration described above, the mounting plate is provided between the resin film and one of the hot plates of the press machine, and the polarization plane holding optical fiber in which the diffraction grating is formed on the surface of the mounting plate on the resin film side is disposed, When the resin film is pressed, polarized light is incident on the polarization-maintaining optical fiber on which the diffraction grating is formed from the light emitting element, and the first reflected light and the second reflected light are based on the electrical signal input from the light receiving element. The pressure at the part of the printed circuit board in contact with the diffraction grating is detected, and the detected pressure is displayed on the display device. From the pressure displayed on the display device, the pressure during pressurization of the printed circuit board is detected. Abnormality can be determined.

  In addition, since the pressure detection part is comprised only with the polarization plane holding | maintenance optical fiber and adhesive agent 19 which are excellent in heat resistance, even when it heats at high temperature and forms a printed circuit board, the pressure of a printed circuit board is detected without a problem. be able to. In addition, since the pressure is detected using a thin polarization-maintaining optical fiber having a diameter of about 100 to 200 microns, printing can be performed without affecting the temperature distribution in the plane of the printed circuit board during pressurization. It is possible to form a substrate.

  Further, since the pressure is detected for each of the diffraction gratings arranged at a plurality of locations in the surface of the mounting plate, the pressure distribution in the surface of the printed board can be detected.

  In addition, this invention is not limited to the said embodiment, Based on the meaning of this invention, it can implement with a various form.

  For example, in the above-described embodiment, the example in which the polarization-maintaining optical fiber 14 is disposed on the upper surface of the flat mounting plate 15 has been described. However, as illustrated in FIGS. Alternatively, a groove 15 a for embedding the polarization-maintaining optical fiber 14 may be formed, and the polarization-maintaining optical fiber 14 may be embedded in the groove 15 a and bonded using an adhesive 19. By burying the polarization-maintaining optical fiber 14 in the groove 15 a of the mounting plate 15, damage to the polarization-maintaining optical fiber 14 due to pressurization can be reduced.

  Moreover, although the example which detects the pressure of several places using the polarization-maintaining optical fiber 14 in which the several diffraction grating 14a was formed was shown in the said embodiment, even if the number of the diffraction gratings 14a is one place. Good.

  Moreover, although the example which comprised the FBG sensor by the polarization plane holding | maintenance optical fiber in which the diffraction grating was formed was shown in the said embodiment, you may comprise an FBG sensor by the optical waveguide in which the diffraction grating was formed.

  Moreover, in the said embodiment, although the mounting board 15 was arrange | positioned on the upper surface of the thermal plate 21 of the lower side of the press machine 20, and the polarization plane holding | maintenance optical fiber 14 was arrange | positioned on the upper surface of the mounting board 15, the example of a structure was shown, for example The mounting plate 15 may be disposed on the lower surface of the hot plate 21 on the upper side of the press machine 20, and the polarization-maintaining optical fiber 14 may be disposed on the lower surface of the mounting plate 15.

  In the above-described embodiment, the example in which the wavelength interval between the first and second reflected lights is specified and the pressure is detected at the timing when the largest load is applied to the printed board 30 has been described. The inside pressure may be detected periodically, and the state of the pressure change may be displayed in time series. Furthermore, a pressure abnormality during pressurization of the printed circuit board may be determined based on whether or not the detected pressure is outside a predetermined standard range, and the determination result may be displayed.

  Moreover, in the said embodiment, although the example which presses the laminated thermoplastic resin film and forms a printed circuit board was shown, it is not limited to a thermoplastic resin film, For example, the laminated thermosetting resin film May be pressed to form a printed circuit board.

  The correspondence between the configuration in the above embodiment and the configuration in the claims will be described. S102 corresponds to the wavelength interval specifying unit, S104 corresponds to the pressure detection unit, and S106 corresponds to the display control unit.

It is a figure showing the whole printed circuit board manufacturing device composition concerning one embodiment of the present invention. It is a figure for demonstrating a FBG sensor. It is a figure for demonstrating a FBG sensor. It is a figure which shows the relationship between the pressure applied to a diffraction grating, and the wavelength interval shift amount of 1st, 2nd reflected light. It is a figure which shows a mode that the polarization plane holding | maintenance optical fiber was wired on the upper surface of the mounting board. It is a figure which shows the schematic cross-sectional structure of the polarization-maintaining optical fiber wired on the upper surface of the mounting board. It is a flowchart which shows the process of a signal processing part. It is a figure which shows the example of a display of a display apparatus. It is a figure for demonstrating a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board manufacturing apparatus, 10 ... Pressure measuring apparatus, 11a ... Light emitting element,
11b ... light receiving element, 12 ... spectrometer, 13 ... FC connector,
14 ... polarization-maintaining optical fiber, 14a ... diffraction grating, 15 ... mounting plate,
16 ... Signal processing unit, 17 ... Display device, 18 ... Storage device, 19 ... Adhesive,
20 ... Press machine, 21 ... Hot plate.

Claims (7)

A press machine (20) for forming a printed circuit board (30) by applying pressure while heating the resin film using hot plates (21) provided on both sides of the laminated resin film;
A mounting plate (15) disposed between the resin film and one of the hot plates of the press;
A polarization-maintaining optical fiber (14) fixed to the surface of the mounting plate on the resin film side;
A light emitting element (11a) that makes polarized light incident on the polarization maintaining optical fiber;
A spectroscope (12) that splits light incident on the light emitting element side from the polarization-maintaining optical fiber side;
A light receiving element (11b) that receives the light dispersed by the spectroscope and converts it into an electrical signal,
A diffraction grating (14a) whose refractive index is periodically changed at a predetermined pitch in the axial direction of the core is formed on the core (14b) of the polarization-maintaining optical fiber. When polarized light is incident on the optical fiber from the light emitting element, the first and second reflected lights having different wavelengths are reflected and returned by the diffraction grating, and the first and second reflected lights are returned according to the amount of distortion of the diffraction grating due to pressurization. 1, the wavelength interval of the second reflected light is changed,
When the resin film is pressed, the polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, and the first reflected light and the second reflected light are based on an electric signal input from the light receiving element. Wavelength interval specifying means for specifying the wavelength interval of light;
Pressure detecting means for detecting a pressure of a portion of the printed circuit board in contact with the diffraction grating from a wavelength interval of the first reflected light and the second reflected light specified by the wavelength interval specifying means;
A printed circuit board manufacturing apparatus comprising: display control means for displaying the pressure detected by the pressure detection means on a display device (17). A plurality of diffraction gratings having different pitches are formed in the polarization-maintaining optical fiber, and a plurality of diffraction gratings of the polarization-maintaining optical fiber are disposed at a plurality of locations in the plane of the mounting plate, Each wavelength of the first and second reflected light changes according to the pitch of each diffraction grating,
The wavelength interval specifying means makes polarized light incident on the polarization plane holding optical fiber from the light emitting element, and reflects the first and second reflected light for each diffraction grating based on an electric signal input from the light receiving element. Identify the wavelength interval,
The pressure detecting means is a pressure at a portion in contact with the diffraction grating of the printed circuit board for each diffraction grating from the wavelength interval of the first and second reflected light specified for each diffraction grating by the wavelength interval specifying means. Detect
2. The printed circuit board manufacturing apparatus according to claim 1, wherein the display control unit causes the display device to display a pressure of a portion of the printed circuit board in contact with the diffraction grating for each of the diffraction gratings. A groove (15a) for embedding the polarization maintaining optical fiber is formed in the mounting plate, and the polarization maintaining optical fiber is embedded in a groove for embedding the polarization maintaining optical fiber. The printed circuit board manufacturing apparatus according to claim 1 or 2. In the polarization maintaining optical fiber, a clad (14c) is formed around the core, and two stress applying portions (14d) are formed in the clad so as to sandwich the core.
4. The polarization-maintaining optical fiber is fixed to the mounting plate so that the stress applying portions are arranged in a stress direction that the mounting plate receives when pressed. Printed circuit board manufacturing apparatus. The polarization-maintaining optical fiber is bonded to the mounting plate using an adhesive (19) having a melting point higher than the heating temperature of the resin film. Printed circuit board manufacturing apparatus. The printed circuit board manufacturing apparatus according to claim 1, wherein the resin film is a thermoplastic resin film. A press machine (20) for forming a printed circuit board (30) by applying pressure while heating the resin film using hot plates (21) provided on both sides of the laminated resin film;
A mounting plate (15) disposed between the resin film and one of the hot plates of the press;
A polarization-maintaining optical fiber (14) fixed to the surface of the mounting plate on the resin film side;
A light emitting element (11a) that makes polarized light incident on the polarization maintaining optical fiber;
A spectroscope (12) that splits light incident on the light emitting element side from the polarization-maintaining optical fiber side;
A light receiving element (11b) that receives the light dispersed by the spectroscope and converts it into an electrical signal,
A diffraction grating (14a) whose refractive index is periodically changed at a predetermined pitch in the axial direction of the core is formed on the core (14b) of the polarization-maintaining optical fiber. When polarized light is incident on the optical fiber from the light emitting element, the first and second reflected lights having different wavelengths are reflected and returned by the diffraction grating, and the first and second reflected light are returned according to the strain amount of the diffraction grating due to pressurization. 1, the wavelength interval of the second reflected light is changed,
When the resin film is pressed, the polarized light is incident on the polarization-maintaining optical fiber from the light emitting element, and the first reflected light and the second reflected light are based on an electric signal input from the light receiving element. Identify the wavelength interval of light,
Detecting the pressure of the portion of the printed circuit board in contact with the diffraction grating from the identified wavelength interval between the first reflected light and the second reflected light;
The detected pressure is displayed on the display device (17), and a pressure abnormality during pressurization of the printed circuit board is determined based on whether or not the pressure displayed on the display device is out of a predetermined standard range. And a printed circuit board manufacturing method.

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