JP2008216521A - Method of manufacturing electrooptical device and electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrooptical device by which the possibility of damaging a substrate of the electrooptical device is reduced and also the possibility of remaining a residue of an adhesive or the like is reduced. <P>SOLUTION: This method comprises: a first sticking step for sticking a surface of a substrate 11 to a surface of a supporting body 12; a first adhesion step for providing an adhesive 13 in respective end surfaces of the substrate 11 and the supporting body 12 which are stuck to each other along the stuck surfaces; a second sticking step for sticking a surface of a substrate 21 to a surface of a supporting body 22; a second adhesion step for providing an adhesive 23 in respective end surfaces of the substrate 21 and the supporting body 22 which are stuck to each other along the stuck surfaces; a third sticking step for sticking an opposite side surface of the substrate 11 to an opposite side surface of the substrate 21; and a removing step for removing the adhesives 13 and 23 provided on the end surfaces. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an electro-optical device manufacturing method and an electro-optical device, and more particularly, to an electro-optical device manufacturing method and an electro-optical device including two substrates.

Conventionally, a display device such as a liquid crystal display device is known as an electro-optical device. For example,
The liquid crystal display device is configured by bonding two substrates. Display devices such as liquid crystal display devices are widely used by being mounted on electronic devices such as mobile phones.

In particular, in recent years, with the miniaturization or thinning of electronic devices, there has been a demand for thin display devices. As the thickness is reduced, a thin substrate must be flowed so as not to break in the manufacturing process. A thin substrate is easily cracked and bends, so that sufficient care is required for handling in the manufacturing process, and its fluidity is low. Therefore, in the case of a liquid crystal display device, there is a proposal for improving the fluidity in the manufacturing process by using a jig for holding a thin substrate and attaching the substrate to the flat portion of the jig with an adhesive material. (For example, refer to Patent Document 1).
JP-A-9-105896

However, in the manufacturing method according to the proposal, an adhesive material is attached to the entire flat portion of the jig, a thin substrate is attached to the adhesive material-attached portion, and the thin substrate is formed after the predetermined process is completed. Since there is a step for peeling the substrate from the entire plane portion of the jig, there is a problem that there is a high possibility that the substrate surface is scratched during the process. In addition, since the adhesive material is applied to the entire surface of the flat portion, there is a high possibility that a residue of the adhesive material remains on the surface of the thin substrate.

The present invention has been made in view of the above problems, and reduces the possibility of scratching the substrate in the manufacturing process of the electro-optical device, and suppresses the possibility of residual residues such as adhesives remaining low. An object of the present invention is to provide a method of manufacturing an electro-optical device capable of performing

The electro-optical device manufacturing method of the present invention includes a first bonding step of bonding the surface of the first substrate for the electro-optical device and the surface of the first support, and the first bonding to the first substrate. A first bonding step in which a first adhesive is provided at an end of the bonding surface on each of the end surfaces of the substrate and the first support; and a surface of the second substrate for the electro-optical device; In the second bonding step of bonding the surface of the second support to the end surface of the bonding surface, each of the second substrate and the second support bonded to the end surface of the bonding surface A second bonding step of providing an adhesive, a surface of the first substrate opposite to the surface, and a surface of the second substrate opposite to the surface are bonded together. A bonding step and the first and second contacts provided on the respective end faces; Having a removal step of removing the agent.

According to such a configuration, there is provided a method for manufacturing an electro-optical device that can reduce the possibility of scratching the substrate in the manufacturing process of the electro-optical device, and can suppress the possibility that a residue such as an adhesive remains. can do.

In the method of manufacturing the electro-optical device according to the aspect of the invention, before the third bonding step, the surface on the opposite side of the first substrate and the surface on the opposite side of the second substrate It is desirable to have a patterning process for performing predetermined patterning.
According to such a configuration, desired patterning can be performed.

In the method of manufacturing an electro-optical device according to the aspect of the invention, the first and second substrates may be removed by removing the first and second adhesives by the third bonding step. It is desirable to cut the end surface portions of the first support and the second support.
According to such a configuration, it is easy to remove the adhesive and the productivity is good.

In the method of manufacturing the electro-optical device according to the aspect of the invention, it is preferable that the first and second adhesives be removed by adhesive breakage of the adhesive.
According to such a configuration, the adhesive can be easily peeled off.

In the method of manufacturing the electro-optical device according to the aspect of the invention, it is preferable that the first and second adhesives are removed by chemical etching.
According to such a configuration, the adhesive can be easily removed.

The electro-optical device of the present invention is an electro-optical device manufacturing method manufactured by the method of the present invention.
According to such a configuration, since the adhesion area of the adhesive applied to fix the substrate to the support is small, the possibility of scratches on the substrate surface is reduced, and the amount of adhesive residue is also reduced. Therefore, a high quality electro-optical device can be manufactured.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a liquid crystal display device which is one of electro-optical devices as an example.
First, the manufacturing method of the electro-optical device according to the present embodiment will be described with reference to FIGS. 1 to 3 are schematic cross-sectional views for explaining a process of bonding a substrate and a support. FIG. 4 is a schematic cross-sectional view for explaining the configuration of a laminate described later. FIG. 5 is a diagram for explaining a method of creating a laminated body to be described later. FIG. 6 is a diagram for explaining a method of dividing an individual liquid crystal display device from a large liquid crystal display device including a plurality of liquid crystal display devices.

The liquid crystal display device is configured by bonding two substrates and enclosing liquid crystal between the two substrates. In the present embodiment, in manufacturing one liquid crystal display device, a method of manufacturing individual liquid crystal display devices by creating a plurality of liquid crystal display devices in a state of a large substrate and finally dividing them is used. ing.

In FIG. 1, a substrate 11 is one of two substrates for a liquid crystal display device, and the substrate 11 is a large substrate (a so-called one substrate) of each of a plurality of liquid crystal display devices. It may also be called a mother board). The substrate 11 is, for example, a glass substrate that is an element substrate such as a so-called TFT substrate of a liquid crystal display device.

The substrate 11 has a rectangular or circular shape when viewed from above, that is, when viewed from a direction orthogonal to the surface of the substrate. Hereinafter, the case where the substrate 11 is rectangular will be described.

In FIG. 1, the support 12 is a glass substrate here, and is a member having the same shape as that of the substrate 11 when viewed in plan. First, a bonding process is performed in which the substrate 11 and the support 12 are bonded together so that the surface of the support 12 and the surface of the substrate 11 opposite to the surface on which the element is formed are in close contact. Here, the substrate 11 and the support 12 are both transparent members having the same coefficient of thermal expansion. This is to prevent peeling of the substrate 11 and the support 12 due to a difference in thermal expansion coefficient and facilitate positioning of the bonding of the substrate 11 and the support 12 in the manufacturing process.

For example, the substrate 11 and the support 12 are plate members each having a side of 70 cm when viewed in plan. Further, for example, the substrate 11 has a thickness of 0.2 mm, and the support 12 is 0 mm.
. It has a thickness of 5 mm to 0.6 mm.

Next, the bonding step is performed by applying the adhesive 13 by application or the like along the bonded surfaces on the respective end surfaces of the bonded substrate 11 and the support 12. FIG.
As shown in FIG. 4, the adhesive 13 is bonded so that the surface of the substrate 11 and the surface of the support 12 are in close contact with each other, and the adhesive 13 is bonded to the end surfaces of the two bonded plate members. An adhesive 13 is applied along a line intersecting the mating surface. The adhesive 13 is, for example, an epoxy resin adhesive.
Note that the adhesive 13 does not have to be applied all along the line, and if the two plate-like members are fixed to each other so as not to be separated, the adhesive 13 is partially applied to the end of the bonding surface, etc. May be.

The substrates 1 bonded together and adhered to each other by an adhesive 13 at the end surfaces.
1 and the support 12 have a thickness of 0.7 mm to 0.8 mm. Since the two plate-like members of the substrate 11 and the support 12 that are bonded together have a thickness of 0.7 mm to 0.8 mm or more, there is no large deflection that reduces fluidity in the manufacturing process.

Next, a patterning process for performing a necessary patterning process is performed on the surface of the substrate 11, that is, the surface opposite to the surface in close contact with the support 12. As a result, as shown in FIG. 3, a large plate 15 on the element substrate side on which a patterning layer 14 including various circuits is formed is created. The patterning process is a film forming process, a photoresist process, or the like. A circuit or the like for realizing various functions as the TFT substrate is formed on the substrate 11 by the patterning process.

Similarly, in the liquid crystal display device, the same bonding process, bonding process, and patterning process in FIGS. 1 to 3 are also performed on the counter substrate side, which is the other of the two substrates. Thus, a large plate 25 on the so-called counter substrate side having a color filter or the like is produced.

The two large substrates formed as described above are bonded so that the surface of the patterning layer 14 of the element substrate and the surface of the patterning layer 24 of the counter substrate face each other in a large plate state. The laminated body 31 is created by laminating. FIG. 4 is a schematic cross-sectional view of a laminate in which two large boards are bonded together.

As shown in FIG. 4, on the opposite substrate side of the laminate 31, the substrate 21 is bonded to the support 22, and the adhesive 23 is applied to each end surface of the substrate 21 and the support 22 along the bonding surface. It is provided by. The adhesive 23 may be the same as or different from the adhesive 13 for fixing the substrate 11 and the support 12.
The surface of the substrate 21 is patterned and a patterning layer 24 is formed, whereby a large plate 25 on the counter substrate side is created. Then, the two large plates 15 and 25 as shown in FIG. 3 are bonded to each other so that the patterning layers 14 and 24 face each other, and as shown in FIG. 22 is a laminate 31 that sandwiches the substrate 11 and the substrate 21 therebetween.

FIG. 5 is a diagram for explaining a bonding process in which the large plate 15 on the element substrate side and the large plate 25 on the counter substrate side are bonded together. As shown in FIG. 5, the two large plates 15 and 25 are bonded together so that the patterning layer 14 of the large plate 15 on the element substrate side and the patterning layer 24 of the large plate 25 on the counter substrate side face each other. Then, a bonding step is performed. In this bonding step, a frame-shaped sealing material (not shown) surrounding a liquid crystal layer provided corresponding to the formation area of each liquid crystal display device on the opposing surface of one large plate, and a plurality of liquid crystal display devices The two large plates 15 are surrounded by a sealing material (not shown) provided on the outer periphery of the large plate in order to prevent the etching solution such as hydrofluoric acid from entering between the large plates in the subsequent chemical etching. And 2
5 is bonded.

Next, as shown by a dotted line L1 in FIG. 4, the periphery of the laminate 31 is cut, that is, scribe-broken using a scribing device or the like in a direction parallel to the end surface of the laminate 31 provided with the adhesive 14. Thereby, the removal process which removes the adhesive agents 13 and 23 from the laminated body 31 is implemented.

Here, since the stacked body 31 has a rectangular shape in plan view, the peripheral portion of the stacked body 31 is cut off along the four end surfaces. Since only the end surface provided with the adhesive 14 of the laminate 31 is cut, the removal of the adhesive is easy and the productivity is good.

By cutting the periphery of the laminate 31, the substrate 11, the support 12, and the substrate 21 are cut.
Since the adhesives 13 and 23 which fixed the support 22 are removed, the supports 12 and 22 can be peeled from the respective substrates.

Then, after the supports 12 and 22 are peeled off from the substrates 11 and 21, respectively, a large-sized liquid crystal display device including a plurality of liquid crystal display devices is cut into individual liquid crystal display device sizes. A step of taking out the liquid crystal display measure is performed.

FIG. 6 is a diagram for explaining a method of taking out individual liquid crystal display devices from a large liquid crystal display device. As shown in FIG. 6, a large plate on which substrates 11 and 21 and supports 12 and 22 are laminated so as to be a liquid crystal display device is formed in a so-called matrix shape along lines L2 and L3 in a predetermined direction. Then, cut with a scribing device or the like. Lines L2 and L3 are virtual lines indicating positions for taking out individual liquid crystal display devices from a large liquid crystal display device including a plurality of liquid crystal display devices. As a result, individual liquid crystal display devices are obtained.

Note that the liquid crystal that is an electro-optical material is in a state of a plurality of liquid crystal display devices as shown in FIG. 6 or in a state where a plurality of liquid crystal display devices are arranged along a line L2 or L3. The liquid crystal display device is sealed in the liquid crystal display device by sealing from the liquid crystal sealing port and sealing the sealing port with a sealing material. Alternatively, after the liquid crystal is divided into individual liquid crystal display devices, the liquid crystal is sealed in the liquid crystal display device by sealing from the liquid crystal sealing port of each liquid crystal display device and sealing the sealing port with a sealing material. It may be.

Furthermore, in the case of the drop bonding method in which the liquid crystal is provided with a frame-shaped sealing material on the surface on the counter substrate side, the liquid crystal is dropped inside the sealing material and the counter substrate side and the element substrate side are bonded, FIG. By dropping the liquid crystal in such a large plate state, the liquid crystal is sealed in each liquid crystal display device.

If the liquid crystal display device is manufactured as described above, a thin liquid crystal display device can be manufactured without reducing fluidity in the manufacturing process. And since the adhesive which fixes a support body and a board | substrate is provided only in the end surface of a large board, the adhesion process of an adhesive agent can be simplified, As a result, possibility that a substrate surface will be damaged will become low. In addition, when removing the adhesive, only the end face of the laminate of large plates is cut, so that the possibility that an adhesive residue remains on the substrate surface can be kept low. Therefore, the yield and productivity in the manufacturing process of the liquid crystal display device can be improved.

Note that the method of removing the adhesive may be a method other than the method of cutting the end surface portion of the laminate 31 of the large plate. FIG. 7 shows a method of removing an adhesive by ultraviolet irradiation when such an adhesive is used because there is an adhesive that can cause an adhesive breakage by ultraviolet light depending on the types of the adhesives 13 and 23. It is a figure for demonstrating.

As shown in FIG. 7, for example, in order to irradiate ultraviolet rays (hereinafter referred to as UV), it is placed on a predetermined table so that the end face of the rectangle is on top. The entire end face is irradiated with UV from the top as shown by arrow LL. The other three surfaces can be similarly irradiated with UV to cause adhesive breakage of the adhesive on the end surface of the laminate 31. As a result, when UV is applied to the end face of the laminated body 31, adhesive failure occurs at the interface between the adhesive and the adherend, so that the adhesive can be easily peeled off.

Furthermore, as another method, the adhesive may be removed by chemical etching. FIG. 8 is a diagram for explaining a method of removing the adhesive by melting the substrate and the support by chemical etching.

As shown in FIG. 8, by immersing the laminate 31 in a tank 52 filled with a hydrofluoric acid solution 51, the substrate and the support, which are glass materials, are dissolved. At that time, when the glass material is melted, hydrofluoric acid enters between the adhesive and the substrate and between the adhesive and the support, and the adhesive can be easily peeled off. Since hydrofluoric acid also affects the substrate, the laminate 31 is immersed in the solution 51 only for the time necessary for the adhesive to peel off.

In the above description, the example of performing the removal of the adhesive by scribe breaking, adhesion breaking, and chemical etching has been described. However, other methods such as heating may be used.
As described above, according to the present embodiment, a thin liquid crystal display device can be manufactured without reducing fluidity in the manufacturing process of the liquid crystal display device. And since the adhesive which fixes a support body and a board | substrate is provided only in the end surface of a large board, the adhesion process of an adhesive agent can be simplified.

As a result, since the adhesive area of the adhesive applied to fix the substrate to the support is small, the possibility of scratches on the substrate surface is reduced, and the amount of adhesive residue is also reduced. A high quality electro-optical device can be manufactured.
In particular, when the adhesive is removed by UV irradiation, heating, etc., less energy is required for UV irradiation, heating, etc.
Note that the manufacturing method described above is applicable not only when a large substrate is divided to obtain a plurality of liquid crystal display devices, but also when a single liquid crystal display device is manufactured.

Further, the electro-optical device of the present invention is an active matrix type liquid crystal display device (for example, T
The present invention can be similarly applied not only to a liquid crystal display panel provided with FT (thin film transistor) and TFD (thin film diode) as a switching element) but also to a passive matrix liquid crystal display device. In addition to liquid crystal display panels, electroluminescence devices,
Organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electroluminescent elements (Field Emission Display and Surface-Conduction El
The present invention can be similarly applied to various electro-optical devices such as an ectron-emission display.
The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

Sectional drawing for demonstrating the process of bonding the board | substrate and support body which concern on embodiment. Sectional drawing for demonstrating the structure of the laminated body concerning embodiment. Sectional drawing for demonstrating the process of bonding the board | substrate and support body which concern on embodiment. Sectional drawing for demonstrating the structure of the laminated body concerning embodiment. The figure for demonstrating the method to produce the laminated body concerning embodiment. The figure for demonstrating the method of parting the liquid crystal display device of a large board. The figure for demonstrating the method of removing an adhesive agent by ultraviolet irradiation. The figure for demonstrating the method of removing an adhesive agent by chemical etching.

Explanation of symbols

11, 21 Substrate, 12, 22 Support, 13, 23 Adhesive, 14, 24 Patterning layer, 31 Laminate

Claims (6)

A first bonding step of bonding the surface of the first substrate for the electro-optic device and the surface of the first support;
A first bonding step in which a first adhesive is provided at an end of the bonding surface at each end surface of the bonded first substrate and the first support;
Secondly, the surface of the second substrate for the electro-optical device is bonded to the surface of the second support.
Bonding process of
A second bonding step in which a second adhesive is provided at an end of the bonded surface at each end surface of the bonded second substrate and the second support;
A third bonding step of bonding the surface of the first substrate opposite to the surface and the surface of the second substrate opposite to the surface;
A removing step of removing the first and second adhesives provided on the respective end faces;
A method for manufacturing an electro-optical device. Before the third bonding step, a patterning step of performing predetermined patterning on the opposite surface of the first substrate and the opposite surface of the second substrate is provided. The method of manufacturing an electro-optical device according to claim 1. The removal of the first and second adhesives includes the first substrate, the second substrate, the first support, and the second support that are bonded together by the third bonding step. The method of manufacturing an electro-optical device according to claim 1, wherein the method is performed by cutting an end surface portion of the body. 3. The method of manufacturing an electro-optical device according to claim 1, wherein the first and second adhesives are removed by adhesive breakage of the adhesive. 3. The method of manufacturing an electro-optical device according to claim 1, wherein the first and second adhesives are removed by chemical etching of the adhesives. An electro-optical device manufactured by the method according to claim 1.

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