JP2008211513A - Imaging apparatus and method of manufacturing imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which is made small in size in an optical axis direction by preventing a sealant from leaking out outside a light receiving area of an imaging element and an area where a holder is mounted. <P>SOLUTION: The imaging apparatus is provided with: a flexible board 10 on which the imaging element 20 is mounted by a boding wire 22; and a cylindrical bolder 30 which holds a second lens 72 or the like, and is mounted on the flexible board 10 so as to cover the imaging element 20. The holder 30 has: an injection hole 35 for injecting the sealant 60 for sealing the imaging element 20 into a holder 30; and a bank part 36 for preventing the injected sealant 60 from leaking out to the light receiving area 21 of the imaging element 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an imaging device and a method for manufacturing the imaging device.

2. Description of the Related Art A small-sized imaging device mounted on a mobile phone or the like includes a substrate on which an imaging element is mounted and a cylindrical holder that is mounted on the substrate so as to hold a lens and cover the imaging element.
In order to reduce the size of such an imaging apparatus, an apparatus that employs a flexible printed board having flexibility has been proposed (see Patent Document 1).
By adopting a flexible printed board thinner than the rigid board, the image pickup apparatus can be reduced in size in the optical axis direction.

JP 2004-48810 A

Since such an imaging apparatus mounts an imaging element on a flexible printed circuit board, the flexible printed circuit board bends to cause deterioration of a captured image, peeling of the imaging element from the flexible printed circuit board, damage to a bonding wire, and the like. May occur. Even when the imaging element is mounted on a rigid rigid substrate, the same problem may occur when the rigid substrate is thin or when the rigid substrate is deformed due to a temperature change.
In order to prevent the occurrence of such a problem, it can be solved by sealing the image sensor with a sealant. Thereby, an imaging device with excellent durability can be provided.
However, when the sealant is self-flowing or when the holder is mounted on a flexible printed circuit board, the sealant may flow out to the outside of the light receiving area of the image sensor or the area where the holder is mounted. there were.

  Accordingly, the present invention provides an imaging device that is prevented from flowing out of the light receiving area of the imaging element and the area where the holder is mounted, and an imaging apparatus that is miniaturized in the optical axis direction and a method for manufacturing the imaging apparatus. For the purpose.

The object includes a substrate on which an image sensor is mounted, and a cylindrical holder that is mounted on the substrate so as to hold the lens and cover the image sensor, and the holder seals the image sensor. An imaging apparatus comprising: an injection port for injecting a sealing agent into the holder; and an embankment for preventing the injected sealing agent from flowing out to the light receiving region of the imaging element. Can be achieved.
With this configuration, it is possible to improve the durability of the imaging device and to prevent the sealant from flowing out to the light receiving region. Moreover, since the holder has an inlet for injecting the sealant into the holder, the sealant can be prevented from flowing out of the holder.

In the above configuration, the imaging element may be electrically connected to the substrate by a bonding wire.
With this configuration, the connection to the substrate by the bonding wire can be reinforced with the sealant, and the sealant can be prevented from flowing out to the light receiving area of the image sensor, and the sealant can be prevented from flowing out of the holder. it can.

In the above configuration, the bank portion is formed in a frame shape so as to surround the light receiving region facing the imaging element, and the injection port is formed at a position outside the space surrounded by the bank portion. The configuration can be adopted.
With this configuration, the sealant can be prevented from flowing out to the light receiving region.

The said structure WHEREIN: The said injection port can employ | adopt the structure currently formed in the position retracted | saved from the said bonding wire.
With this configuration, a jig such as a dispenser for injecting the sealant can be prevented from coming into contact with the bonding wire.

The said structure WHEREIN: The said injection port can employ | adopt the structure currently formed so that the said sealing agent may be inject | poured into the position close | similar to the corner | angular part of the said image pick-up element formed in the rectangular shape.
With this configuration, it is possible to efficiently seal the image sensor while suppressing the size of the injection port.

In the above configuration, the substrate may be a flexible substrate.
With this configuration, since the flexible substrate does not require a space in the optical axis direction, it is possible to reduce the size in the optical axis direction.

Further, the object is to mount the imaging device on the substrate, to fix the cylindrical holder to the substrate so as to cover the imaging device, and from the injection port formed in the holder, And a step of injecting a sealant into a space defined by the bank portion formed in the holder, the imaging element, the substrate, and the inner peripheral portion of the holder while preventing outflow to the light receiving region. This can also be achieved by a method for manufacturing an imaging device.
Also with this configuration, the durability of the imaging device is improved by sealing the area other than the light receiving area of the imaging element. When a flexible substrate is used as the substrate, the imaging device is reduced in size in the optical axis direction. Can be manufactured.

Further, the object is to mount the imaging device on the substrate, hold the cylindrical holder on the substrate so as to cover the imaging device, and from the inlet formed in the holder, A sealant is injected into a space that is prevented from flowing out to the light receiving region and is defined by the bank portion formed in the holder, the imaging element, the substrate, and the inner peripheral portion of the holder, and is cylindrical on the substrate. And a step of fixing the holder of the imaging device.
With this configuration, the process can be simplified and the cost can be reduced. Further, the durability is improved by sealing the imaging element, and when a flexible substrate is employed as the substrate, a downsized imaging device in the optical axis direction can be manufactured.

  ADVANTAGE OF THE INVENTION According to this invention, it is excellent in durability, and the imaging device reduced in the optical axis direction and its manufacturing method can be provided.

  Embodiments according to the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view illustrating the configuration of the imaging apparatus according to the present embodiment.
The image pickup apparatus according to the present embodiment includes a substrate 10 that is a flexible FPC substrate (flexible print substrate) as a substrate on which an image pickup element is mounted, an image pickup element 20, a holder 30, a first lens holder 40, and a second lens holder 50. The first lens 71, the second lens 72, the third lens 73, and the like.
The image pickup device 20 is mounted on the substrate 10, and each terminal of the image pickup device 20 is connected to a wiring pattern of the substrate 10 through bonding wires 22.
The holder 30 holds the first lens holder 40 and the second lens holder 50 and is fixed to the substrate 10 so as to cover the periphery of the imaging device 20. Further, the holder 30 has a rectangular tube portion 31 formed on the substrate 10 side and a cylindrical portion 34 formed on the subject side. A threaded portion 32 is formed on the inner peripheral surface of the cylindrical portion 34. The screwing portion 32 is screwed with a screwing portion 52 formed on the outer peripheral surface of the second lens holder 50 formed in a cylindrical shape.

The second lens holder 50 is formed in a cylindrical shape, has an opening 51, and holds the second lens 72 and the third lens 73 therein.
The first lens holder 40 is formed in a disc shape, is fixed to the upper surface of the second lens holder 50, has an opening 41, and holds the first lens 71.
The optical path is defined by the openings 41 and 51. The first lens 71 is fixed to the first lens holder 40 on the optical axis so as to cover the opening 41, and the second lens 72 and the third lens 73 are second on the optical axis so as to cover the opening 51. Fixed to the lens holder 50. The subject light that has passed through the opening 41 and the opening 51 forms an image on the image sensor 20.

The holder 30 has a bank portion 36. The bank portion 36 extends from the screwing portion 32 toward the substrate 10 in the optical axis direction and is formed in a circular frame shape. The bank portion 36 is slightly spaced from the image sensor 20, for example, 0. They are formed to face each other with a distance of about 05 to 0.1 mm. This is to avoid the risk that pressure is applied to the surface of the image pickup device 20 and the image pickup device 20 malfunctions.
An injection port 35 is formed in the rectangular tube portion 31. The injection port 35 is for injecting a sealant 60 for sealing the imaging element 20 into the holder 30. The injection port 35 is formed so as to penetrate the rectangular tube portion 31 in the optical axis direction.

  A space defined by the inner surface of the rectangular tube portion 31 (the inner surface of the holder), the substrate 10, the image sensor 20, and the bank portion 36 is filled with a sealant 60. The electrical connection between the substrate 10 and the bonding wire 22 is ensured at the edge of the substrate 10 by the bonding wire 22. The bonding wire 22 is sealed with a sealant 60.

Next, the injection port 35 and the bank portion 36 will be described in detail.
FIG. 2 is a front view of the substrate 10 on which the imaging element 20 is mounted, and the positions of the inner periphery of the injection port 35, the bank portion 36, and the rectangular tube portion 31 are indicated by broken lines.
The bank portion 36 is formed so as to surround the light receiving region 21. A bonding wire 22 is formed on the outside of the bank portion 36.
The injection port 35 is formed in two diagonal lines of the image sensor 20 and is located near the corner of the image sensor 20. The injection port 35 is formed at a position where the bonding wire 22 is not formed in the optical axis direction from the injection port 35, that is, at a position retracted from the bonding wire 22.

Next, an assembly process of the imaging device will be described.
First, each terminal of the image sensor 20 and the wiring pattern of the substrate 10 are connected by wire bonding.
Next, as illustrated in FIG. 3, the holder 30 is temporarily fixed to the substrate 10 so as to surround the imaging element 20. Temporary fixing is performed with, for example, an ultraviolet curable adhesive or a cyanoacrylic adhesive.

  Next, as shown in FIG. 4, the sealing agent 60 is injected from the injection port 35 by a dispenser. As the sealant 60, for example, a thermosetting epoxy system or a room temperature curable silicon system is used. When the sealant 60 is injected from the injection port 35, the sealant 60 passes through the space defined by the dike portion 36, the inner surface of the rectangular tube portion 31, the substrate 10, and the imaging element 20, and the edge of the substrate 10. It flows out to cover. Further, since the injection port 35 is provided outside the bank portion 36, the sealant 60 does not flow out to the light receiving region 21.

  Next, when the edge of the image sensor 20 is covered with the sealant 60, when the adhesive for fixing the holder 30 to the substrate 10 is an ultraviolet curing adhesive, the fixing portion between the holder 30 and the substrate 10 is used. Irradiate ultraviolet rays from the side. As a result, the holder 30 is fixed to the substrate 10.

  Next, when the sealant 60 is thermosetting, a curing process is performed in a thermosetting furnace. In the case where the sealant 60 is curable at room temperature, the sealant 60 is left as it is for a while to be cured.

  Next, after the sealant 60 is cured, the second lens holder 50 is assembled to the holder 30 by screwing the screwing portions 32 and 52 as shown in FIG. Next, as shown in FIG. 6, the 1st lens holder 40 is assembled | attached to the upper surface of the 2nd lens holder 50, and it fixes with an adhesive agent. Next, the amount of screwing of the screwing portions 32 and 52 is adjusted to adjust the focus, and then an adhesive is applied and fixed to the positions of the screwing portions 32 and 52.

Thus, by providing the bank portion 36, it is possible to prevent the sealant 60 from flowing out to the light receiving region 21. Moreover, since the holder 30 has the injection port 35 for injecting the sealing agent 60 into the holder 30, the sealing agent 60 can be prevented from flowing out of the holder 30.
Therefore, since the image pickup apparatus according to the present embodiment is provided with the bank portion 36, the sealant 60 that seals the image pickup device 20 is provided from the light receiving region 21 of the image pickup device 20 and the region where the holder 30 is mounted. Is prevented from flowing to the outside, and the substrate 10 is employed to reduce the size in the optical axis direction.

  The injection port 35 is formed at a position retracted from the bonding wire 22. With this configuration, a jig such as a dispenser for injecting the sealing agent 60 can be prevented from coming into contact with the bonding wire 22 and being disconnected.

  The injection port 35 is formed such that the sealing agent 60 is injected into a position close to the corner of the imaging element 20 formed in a rectangular shape. With this configuration, the imaging device 20 can be efficiently sealed while suppressing the size of the injection port 35.

  As shown in FIG. 1, there is a slight gap between the bank portion 36 and the image sensor 20. This gap is set such that the sealant 60 does not pass through this gap in consideration of the viscosity of the sealant 60 before curing.

Next, a modified example of the imaging apparatus according to the present embodiment will be described.
FIG. 7 is a front view of the substrate 10 on which the imaging element 20 is mounted in the imaging apparatus according to the modification. FIG. 7 corresponds to FIG.
As shown in FIG. 7, the injection port 35 </ b> A is formed along one side of the image sensor 20. Thus, by forming the injection port 35A in this way, the dispenser can be easily inserted into the injection port 35A.

  Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and modifications and changes can be made within the scope of the gist of the present invention described in the claims. Is possible.

  In this embodiment, the example in which the image sensor is mounted on the flexible substrate has been described. However, the image sensor may be mounted on a rigid rigid substrate.

  In this embodiment, the example in which the imaging element is made conductive with the substrate by the bonding wire has been described. However, the output terminal formed on the back side of the imaging element and the electrode on the substrate are joined by a bump or the like to make the imaging element flexible. You may mount on a board | substrate or a rigid rigid board | substrate.

  In the present embodiment, the example in which the sealing agent has two injection ports has been described. However, the present invention is not limited to this, and a suitable number may be provided so that the sealing agent can be easily injected.

  In the present embodiment, an example in which the bank portion is circular has been described, but the embodiment is not limited thereto, and may be a polygonal shape surrounding the light receiving region of the image sensor. In addition, the embankment part was opposed to the image sensor with a slight gap. However, in the case of an image sensor that does not malfunction, such as there is no circuit in the part facing the embankment part, the embankment part is applied to the image sensor. You may contact.

  In the present embodiment, the process of the imaging device for improving the durability by injecting the sealant from the injection port formed in the holder after the holder is bonded and fixed to the substrate has been described. However, the present invention is not limited to this. The sealant serves as an adhesive for fixing the holder, and after positioning and holding the holder on the substrate, the sealant is injected from the injection port formed in the holder, and at the same time the durability is improved. May be a step of bonding and fixing.

It is sectional drawing which showed the structure of the imaging device which concerns on a present Example. It is a front view of the board | substrate which mounted the image pick-up element. It is explanatory drawing of the process of fixing a holder to a flexible substrate. It is explanatory drawing of the process which inject | pours sealing agent. It is explanatory drawing of the process of attaching a 2nd lens holder to a holder. It is explanatory drawing of the process of attaching a 1st lens holder to a 2nd lens holder. It is a front view of the board | substrate which mounted the image pick-up element of the imaging device which concerns on a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Image pick-up element 21 Light-receiving area 22 Bonding wire 30 Holder 31 Square cylinder part 32, 52 Screw part 34 Cylindrical part 35, 35A Inlet 36 Embankment part 40 1st lens holder 41 Opening part 50 2nd lens holder 51 Opening part 60 Sealant 71 First lens 72 Second lens 73 Third lens

Claims (8)

A substrate on which an image sensor is mounted, and a cylindrical holder mounted on the substrate to hold the lens and cover the image sensor,
The holder includes an injection port for injecting a sealing agent for sealing the imaging element into the holder, and a dike for preventing the injected sealing agent from flowing out to the light receiving region of the imaging element. And an imaging device.   The imaging apparatus according to claim 1, wherein the imaging element is electrically connected to the substrate by a bonding wire. The levee portion is formed in a frame shape so as to surround the light receiving region facing the imaging element,
The imaging apparatus according to claim 1, wherein the injection port is formed at a position outside a space surrounded by the bank portion.   The imaging apparatus according to claim 2, wherein the injection port is formed at a position retracted from the bonding wire.   The said injection port is formed so that the said sealing agent may be inject | poured into the position close | similar to the corner | angular part of the said image pick-up element formed in the rectangular shape. The imaging device described in 1.   The imaging apparatus according to claim 1, wherein the substrate is a flexible substrate. Mounting the image sensor on the substrate;
Fixing a cylindrical holder to the substrate so as to cover the imaging element;
It prevents the outflow of the image sensor from the injection port formed in the holder to the light receiving region and is defined by the bank portion formed in the holder, the image sensor, the substrate, and the inner peripheral portion of the holder. And a step of injecting a sealing agent into the space. Mounting the image sensor on the substrate;
Holding a cylindrical holder on the substrate so as to cover the imaging element;
It prevents the outflow of the image sensor from the injection port formed in the holder to the light receiving region and is defined by the bank portion formed in the holder, the image sensor, the substrate, and the inner peripheral portion of the holder. And a step of injecting a sealant into the space and fixing a cylindrical holder to the substrate.

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