JP2008207322A5 - - Google Patents
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- Publication number
- JP2008207322A5 JP2008207322A5 JP2008020162A JP2008020162A JP2008207322A5 JP 2008207322 A5 JP2008207322 A5 JP 2008207322A5 JP 2008020162 A JP2008020162 A JP 2008020162A JP 2008020162 A JP2008020162 A JP 2008020162A JP 2008207322 A5 JP2008207322 A5 JP 2008207322A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/700,346 US7311590B1 (en) | 2007-01-31 | 2007-01-31 | Polishing pad with grooves to retain slurry on the pad texture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008207322A JP2008207322A (ja) | 2008-09-11 |
| JP2008207322A5 true JP2008207322A5 (ja) | 2011-02-10 |
Family
ID=38863240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008020162A Pending JP2008207322A (ja) | 2007-01-31 | 2008-01-31 | パッドテクスチャー上にスラリーを保持するための溝を有する研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7311590B1 (ja) |
| JP (1) | JP2008207322A (ja) |
| KR (1) | KR20080071933A (ja) |
| CN (1) | CN101234481B (ja) |
| DE (1) | DE102008004874B4 (ja) |
| FR (1) | FR2912075A1 (ja) |
| TW (1) | TWI426979B (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| US8062103B2 (en) * | 2008-12-23 | 2011-11-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate groove pattern |
| US8057282B2 (en) * | 2008-12-23 | 2011-11-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate polishing method |
| KR101232787B1 (ko) * | 2010-08-18 | 2013-02-13 | 주식회사 엘지화학 | 연마 시스템용 연마 패드 |
| CN102744676A (zh) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | 用于化学机械研磨的研磨垫以及化学机械研磨设备 |
| TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| SG10202002601QA (en) | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7299970B2 (ja) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | 改良型研磨パッドのための配合物 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN114473857B (zh) * | 2021-12-29 | 2023-03-14 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫及半导体器件的制造方法 |
| CN114918824A (zh) * | 2022-06-29 | 2022-08-19 | 万华化学集团电子材料有限公司 | 一种具有径向微沟槽的抛光垫 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2345255B (en) * | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
| US6241596B1 (en) * | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
| US6749485B1 (en) * | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
| JP4855571B2 (ja) * | 2000-08-31 | 2012-01-18 | ニッタ・ハース株式会社 | 研磨パッド及びその研磨パッドを用いた被加工物の研磨方法 |
| US6679769B2 (en) * | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
| US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
| US7125318B2 (en) | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
| US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
| US6843709B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for reducing slurry reflux |
| US6955587B2 (en) | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
| US6974372B1 (en) | 2004-06-16 | 2005-12-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having grooves configured to promote mixing wakes during polishing |
| US7059949B1 (en) | 2004-12-14 | 2006-06-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having an overlapping stepped groove arrangement |
| US7059950B1 (en) | 2004-12-14 | 2006-06-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad having grooves arranged to improve polishing medium utilization |
| US7131895B2 (en) | 2005-01-13 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a radially alternating groove segment configuration |
| TW200720017A (en) * | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | Water-based polishing pads having improved adhesion properties and methods of manufacture |
| US7234224B1 (en) * | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
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2007
- 2007-01-31 US US11/700,346 patent/US7311590B1/en active Active
-
2008
- 2008-01-17 DE DE102008004874.7A patent/DE102008004874B4/de active Active
- 2008-01-17 TW TW097101746A patent/TWI426979B/zh active
- 2008-01-30 KR KR1020080009800A patent/KR20080071933A/ko not_active Application Discontinuation
- 2008-01-30 CN CN2008100054148A patent/CN101234481B/zh active Active
- 2008-01-31 FR FR0850600A patent/FR2912075A1/fr not_active Withdrawn
- 2008-01-31 JP JP2008020162A patent/JP2008207322A/ja active Pending