JP2008205287A - Apparatus and method for placing conductive ball - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for placing a conductive ball, which improves the productivity in a step of placing a conductive ball in a plurality of pads while preventing contact of a conductive ball storing member and a mask, and also preventing capture of the conductive ball between the conductive ball storing member and the mask. <P>SOLUTION: The apparatus comprises: a vibrating device 15 for vibrating a conductive ball storing member 13; and a plate member 14 provided with a plurality of through parts 43 having a size allowing passage of a conductive ball 38 so as to cover an opening part 13A of the conductive ball storing member 13 for dropping a plurality of conductive balls 38 so that the conductive ball storing member 13 and the plate member 14 are disposed away from a mask 12 so as to prevent capture of the conductive ball 38 between the conductive ball storing member 13 and the plate member 14, and the mask 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a conductive ball mounting device and a conductive ball mounting method, and more particularly to a conductive ball mounting on a substrate such as a wiring board or a semiconductor wafer having a plurality of pads on which an adhesive material is formed. The present invention relates to a conductive ball mounting device and a conductive ball mounting method.

  FIG. 1 is a cross-sectional view of a conventional conductive ball mounting apparatus.

  Referring to FIG. 1, a conventional conductive ball mounting apparatus 100 includes a stage 102, a mask 103, a conductive ball container 104, and an air supply unit 105.

  The stage 102 is for holding the wiring substrate 108 including a plurality of pads 109 on which the flux 111 is formed. The mask 103 is disposed above the wiring substrate 108. The mask 103 has a plurality of through portions 103A that expose the pads 109 on which the flux 111 is formed.

  The conductive ball container 104 is disposed above the mask 103 and is configured to be movable in the J direction. The conductive ball container 104 has an opening 104A through which a plurality of conductive balls 106 can pass at the lower end. The conductive ball container 104 is for receiving a plurality of conductive balls 106 and dropping the plurality of conductive balls 106 onto the mask 103 via the opening 104A. The gap K between the conductive ball container 104 and the mask 103 is set to be slightly smaller than the value of the diameter of the conductive ball 106. The diameter of the conductive ball 106 can be, for example, 100 μm to 200 μm.

  A part of the air supply means 105 is accommodated in the conductive ball container 104. The air supply means 105 is for making it easy to drop the plurality of conductive balls 106 accommodated in the conductive ball container 104 onto the mask 103 by supplying air into the conductive ball container 104. is there.

The conductive ball mounting apparatus 100 configured as described above drops a plurality of conductive balls 106 from the opening 104A of the conductive ball container 104 onto the mask 103, thereby passing through the opening 103A of the mask 103. Then, one conductive ball 106 is placed on each of the plurality of pads 109 on which the flux 111 is formed (see, for example, Patent Document 1).
JP 2006-318994 A

  However, in the conventional conductive ball mounting apparatus 100, since the gap K between the conductive ball container 104 and the mask 103 is small, the wiring board 108 warps (this warp becomes more conspicuous as the area of the wiring board 108 is larger). ), The lower end of the moving conductive ball container 104 is in contact with the mask 103, or the conductive ball 106 is sandwiched between the conductive ball container 104 and the mask 103. There is a problem that productivity in the process of placing the conductive balls 106 on the plurality of pads 109 is lowered.

  Therefore, the present invention has been made in view of the above-described problems, and prevents contact between the conductive ball container and the mask, and the conductive ball is sandwiched between the conductive ball container and the mask. It is an object of the present invention to provide a conductive ball mounting apparatus and a conductive ball mounting method capable of improving productivity in a process of mounting conductive balls on a plurality of pads.

  According to one aspect of the present invention, a mask having a plurality of penetrating portions that are disposed on a substrate having a plurality of pads on which an adhesive material is formed and exposes the plurality of pads, and a plurality of conductive balls are accommodated. And a conductive ball mounting device having a conductive ball container having openings for dropping the plurality of conductive balls on the mask, wherein the conductive ball container is vibrated. A vibration device is provided, and a plate body having a plurality of penetrating portions that are sized to allow one conductive ball to pass therethrough is provided so as to cover the opening of the conductive ball container, and the conductive ball The conductive ball container and the plate are arranged apart from the mask so that the conductive balls dropped on the mask are not sandwiched between the container and the plate and the mask. That Conductive ball mounting apparatus is provided for the symptoms.

  According to the present invention, a vibration device that vibrates a conductive ball container is provided, and a plate having a plurality of through portions that are sized to allow one conductive ball to pass through is provided as an opening of the conductive ball container. The conductive ball container and the plate are separated from the mask so that the conductive ball dropped on the mask is not sandwiched between the conductive ball container and the plate and the mask. For example, even when the wiring board is warped, the conductive ball container and the plate body and the mask are in contact with each other, or the conductive ball container and the plate body and the mask are electrically conductive. Therefore, the productivity in the process of placing the conductive balls on the plurality of pads can be improved.

  The conductive ball container or the plate may be provided with a drop direction restricting means for restricting the drop direction of the plurality of conductive balls falling from the plurality of through portions of the plate. As a result, the conductive ball can be accurately dropped on the mask corresponding to the region where the pad of the wiring board is formed, so that productivity can be improved.

  Furthermore, a conductive ball collecting means is provided for collecting the conductive balls that have not been placed on the plurality of pads on which the adhesive material is formed among the plurality of conductive balls dropped on the mask. Also good. Thereby, excess conductive balls present on the mask can be removed.

  Moreover, you may provide the brush part which contacts the said some conductive ball dropped on the said mask in the said drop direction control means. Thus, when the vibrating device vibrates the conductive ball container, if the vibrating brush portion and the conductive ball are in contact, the conductive ball in contact with the brush portion can be moved on the mask. Therefore, it is possible to increase the probability that the conductive ball enters the through portion of the mask.

  Further, a moving means for moving the conductive ball container so that the brush portion comes into contact with the conductive ball separated from the brush portion among the plurality of conductive balls dropped on the mask. It may be provided. This makes it possible to move many conductive balls on the mask, so that the probability that the conductive balls enter the penetrating portion of the mask can be further increased.

  According to another aspect of the present invention, on a substrate having a plurality of pads on which an adhesive material is formed, a mask having a plurality of penetrating portions exposing the plurality of pads is disposed, and a plurality of conductive balls are arranged. Placement of one conductive ball on each of the plurality of pads by dropping the plurality of conductive balls onto the mask from openings of the contained conductive ball container. A mask having a plurality of through portions sized to allow one of the conductive balls to pass therethrough is provided so as to cover the opening of the conductive ball container, and the mask The conductive ball container and the plate are separated from the mask so that the plurality of conductive balls dropped on the conductive ball container and the plate are not sandwiched between the mask and the mask. Place After the conductive ball container and plate body arranging step, and after the conductive ball container and plate body arranging step, the conductive ball container is vibrated, so that the plurality of conductive materials from the plurality of through portions of the plate body. And a conductive ball dropping step of dropping the conductive ball. A method of placing the conductive ball is provided.

  According to the present invention, the conductive ball container and the plate are arranged so that the plurality of conductive balls dropped on the mask arranged on the wiring pattern are not sandwiched between the conductive ball container and the plate body and the mask. The body is disposed away from the mask, and then the conductive ball container is vibrated to drop the plurality of conductive balls from the plurality of through-holes of the plate body. Since there is no contact with the mask or the conductive balls are sandwiched between the conductive ball container and the plate and the mask, productivity in the process of placing the conductive balls on a plurality of pads is improved. Can be improved.

  In addition, a conductive ball collecting step is provided for collecting the conductive balls that have not been placed on the plurality of pads on which the adhesive material is formed among the plurality of conductive balls dropped on the mask. Also good. Thereby, excess conductive balls present on the mask can be removed.

  According to the present invention, the contact between the conductive ball container and the mask is prevented, and the conductive ball is prevented from being sandwiched between the conductive ball container and the mask. The productivity in the step of placing the functional ball can be improved.

  Next, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 2 is a sectional view of the conductive ball mounting device according to the first embodiment of the present invention. FIG. 2 schematically shows a state in which a plurality of conductive balls 38 are dropped on the mask 12 from the conductive ball container 13 disposed above the mask 12. In FIG. 2, the Z and Z directions indicate the vertical direction, and the X and X directions indicate the directions orthogonal to the Z and Z directions, respectively.

  Referring to FIG. 2, the conductive ball mounting apparatus 10 according to the first embodiment includes a stage 11 that holds a wiring board 18, a mask 12, a conductive ball container 13, a plate body 14, The vibration device 15 and the conductive ball recovery means 16 are included.

  First, for convenience of explanation, the configuration of the wiring board 18 held by the stage 11 will be described. The wiring board 18 has a configuration in which a plurality of wiring boards 21 are formed on a plate-like board body 23. That is, the wiring board 18 is an aggregate of a plurality of wiring boards 21. As a material of the substrate body 23, for example, a glass epoxy resin can be used.

  The wiring substrate 21 includes a substrate body 23, a through via 25, an upper wiring 26, pads 27 and 32, solder resists 29 and 33, a lower wiring 31, and an adhesive material 35. The through via 25 is provided so as to penetrate the substrate body 23. The upper end portion of the through via 25 is connected to the pad 27, and the lower end portion of the through via 25 is connected to the pad 32.

  The upper wiring 26 is provided on the upper surface 23 </ b> A of the substrate body 23. The upper wiring 26 is connected to the pad 27. The pad 27 is provided on the upper surface 23 </ b> A of the substrate body 23 corresponding to the position where the through via 25 is formed. The pad 27 is connected to the through via 25. A single conductive ball 38 serving as an external connection terminal of the wiring board 21 is disposed on the pad 27 via an adhesive material 35.

  The solder resist 29 is provided on the upper surface 23 </ b> A of the substrate body 23 so as to cover the upper wiring 26. The solder resist 29 has an opening 29 </ b> A that exposes the pad 27.

  The lower wiring 31 is provided on the lower surface 23 </ b> B of the substrate body 23. The lower wiring 31 is connected to the pad 32. The pad 32 is provided on the lower surface 23 </ b> B of the substrate body 23 corresponding to the position where the through via 25 is formed. The pad 32 is connected to the through via 25. The pad 32 is electrically connected to the pad 27 through the through via 25. For example, an electronic component (specifically, a semiconductor chip or a passive component) is mounted on the pad 32.

  The solder resist 33 is provided on the lower surface 23 </ b> B of the substrate body 23 so as to cover the lower wiring 31. The solder resist 33 has an opening 33 </ b> A that exposes the pad 32. The adhesive material 35 is provided on the pad 27 exposed to the opening 29A. The adhesive 35 is for temporarily fixing on the pad 27 the conductive ball 38 that falls when the vibration device 15 vibrates the conductive ball container 13. As the adhesive material 35, for example, flux, solder paste, or the like can be used.

  The wiring board 18 configured as described above is held on the stage 11 so that the plurality of pads 27 on which the adhesive material 35 is formed face the conductive ball container 13.

  The stage 11 is for holding the wiring board 18. The mask 12 is fixed on the wiring substrate 18 through a resist film 41 formed on the solder resist 29. The mask 12 has a plurality of through portions 12A. The through portion 12 </ b> A is formed so as to penetrate the portion of the mask 12 corresponding to the formation position of the pad 27. The penetrating part 12A exposes the adhesive material 35 formed on the pad 27. The diameter R1 of the through portion 12A is set to a size that allows only one conductive ball 38 to pass through (a size slightly larger than the diameter of the conductive ball 38). Specifically, when the diameter of the conductive ball 38 is 100 μm, the diameter R1 of the through portion 12A of the mask 12 can be set to 120 μm, for example. Moreover, as a material of the mask 12, for example, a metal can be used.

  The conductive ball container 13 contains a plurality of conductive balls 38 and is disposed above the mask 12. The conductive ball container 13 has an opening 13A at its lower end. The opening 13A has a size that allows a plurality of conductive balls 38 to pass therethrough. As the conductive ball 38, for example, a solder ball can be used. Moreover, the diameter of the conductive ball 38 can be set to, for example, 10 μm to 100 μm.

  The plate body 14 is provided in the conductive ball container 13 so as to cover the lower end portion of the conductive ball container 13 and the opening 13A. The plate body 14 is disposed at a position spaced above the mask 12 so that the conductive balls 38 dropped on the mask 12 are not sandwiched between the plate body 14 and the mask 12. When the diameter of the conductive ball 38 is 100 μm, the distance D1 between the plate body 14 and the mask 12 can be set to 1 mm to 10 mm, for example. The plate body 14 has a plurality of through portions 43 sized to allow one conductive ball 38 to pass therethrough. When the diameter of the conductive ball 38 is 100 μm, the diameter R2 of the through portion 43 can be set to, for example, 105 μm to 110 μm.

  The plate 14 is for adjusting the number of conductive balls 38 that are dropped on the mask 12 so that many conductive balls 38 are not dropped on the mask 12 at a time. The thickness M1 of the plate body 14 can be set to 80 μm, for example. Moreover, as a material of a plate body, a metal can be used, for example.

  In this way, the conductive ball container 13 and the plate body 14 are arranged at a position away from the mask 12 so that the conductive balls 38 dropped on the mask 12 are not sandwiched between the plate body 14 and the mask 12. Thus, for example, even when the wiring substrate 18 is warped, the conductive ball container 13 and the plate body 14 and the mask 12 come into contact with each other, or the conductive ball container 13 and the plate body 14 and the mask 12 are in contact with each other. Since the conductive ball 38 is not sandwiched between the two, the productivity in the process of placing the conductive ball 38 on the plurality of pads 27 can be improved.

  The vibration device 15 is provided in the conductive ball container 13. The vibration device 15 is for vibrating the conductive ball housing body 13 provided with the plate body 14. The vibration device 15 is a conductive ball in a state where the opening 13A of the conductive ball container 13 and the mask 12 corresponding to the pad formation region A (region where the pad 27 is formed) of each wiring board 25 face each other. By vibrating the container 13, the plurality of conductive balls 38 accommodated in the conductive ball container 13 are dropped onto the mask 12 from the through portion 43 of the plate body 14. Of the plurality of conductive balls 38 that have fallen on the mask 12, only the conductive balls 38 that have entered the penetrating portion 12 </ b> A of the mask 12 are placed on the pads 27 on which the adhesive material 35 is formed.

  The conductive ball collecting means 16 is disposed above the mask 12 so that the conductive balls 38 dropped on the mask 12 are not sandwiched between the lower end of the conductive ball collecting means 16 and the mask 12. . The conductive ball collecting means 16 is for collecting the conductive balls 38 that have not been placed on the pad 27 on which the adhesive material 35 is formed, among the plurality of conductive balls 38 that have fallen on the mask 12. is there.

  By providing such a conductive ball collecting means 16, among the plurality of conductive balls 38 that have dropped onto the mask 12, the conductive balls 38 that are not placed on the pad 27 on which the adhesive material 35 is formed can be obtained. The excess conductive balls 38 can be removed from the mask 12 by recovery. Further, by collecting the conductive ball 38 by the conductive ball collecting means 16, the collected conductive ball 38 can be reused.

  According to the conductive ball mounting device of the present embodiment, the vibration device 15 that vibrates the conductive ball container 13 is provided, and the lower end of the conductive ball container 13 and the opening 13A are covered with 1 A plate body 14 having a plurality of penetrating portions 43 sized to allow the two conductive balls 38 to pass therethrough is provided, and the conductive balls 38 dropped on the mask 12 are connected to the conductive ball container 13 and the plate body 14 By disposing the conductive ball container 13 and the plate body 14 above the mask 12 so as not to be sandwiched between the mask 12 and the mask 12, for example, even when the wiring board 18 is warped, the conductive ball container 13 and the plate body 14 and the mask 12 are not in contact with each other, and the conductive ball 38 is not sandwiched between the conductive ball container 13 and the plate body 14 and the mask 12. 27 can improve the productivity of the step of mounting the conductive balls 38.

  In the present embodiment, the case where the plate body 14 is provided so as to cover the lower end portion of the conductive ball container 13 and the opening 13A has been described as an example. However, the plate body 14 is provided with the conductive ball container. You may provide so that only the opening part 13A of the body 13 may be covered (the side surface of the plate body 14 contacts the inner wall of the conductive ball container 13). In this case, the same effect as that of the conductive ball mounting apparatus 10 according to the first embodiment can be obtained.

  3 to 9 are process diagrams for explaining a conductive ball placing method using the conductive ball placing apparatus according to the first embodiment of the present invention, and FIG. 10 is a wiring board. It is a figure which shows the state by which the conductive ball was mounted on all the pads provided in this. 3-10, the same code | symbol is attached | subjected to the same structure part as the structure shown in FIG. 2 demonstrated previously. 3, 8, and 9, C indicates a position at which the wiring substrate 18 is cut (hereinafter referred to as “cutting position C”).

  With reference to FIGS. 3-10, the mounting method of the conductive ball 38 using the conductive ball mounting apparatus 10 based on the 1st Embodiment of this invention is demonstrated.

  First, in the process shown in FIG. 3, the wiring substrate 18 in which the adhesive material 35 is provided on the plurality of pads 27 is formed by a known method. The wiring board 18 is an aggregate of a plurality of wiring boards 21.

  Next, in the process shown in FIG. 4, a resist film 41 is formed on a portion of the solder resist 29 that does not correspond to the pad formation region A, and then a plurality of through-holes 12 </ b> A are formed on the wiring substrate 18 via the resist film 41. The mask 12 having the above is fixed. At this time, the mask 12 is disposed so that the penetrating portion 12 </ b> A exposes the adhesive material 35 formed on the pad 27.

  Next, in the step shown in FIG. 5, the structure shown in FIG. 4 is fixed on the stage 11 of the conductive ball mounting apparatus 10 so that the mask 12 and the plate 14 are opposed to each other. In the illustrated process, the conductive ball container 13 and the plate 14 are separated from the mask 12 so that the plurality of conductive balls 38 dropped on the mask 12 are not sandwiched between the mask 12 and the plate 14. (Conductive ball container and plate arrangement step). When the diameter of the conductive ball 38 is 100 μm, the distance D1 between the plate body 14 and the mask 12 can be set to 1 mm to 10 mm, for example.

  In this way, the conductive ball container 13 and the plate body 14 are separated from the mask 12 so that the plurality of conductive balls 38 dropped on the mask 12 are not sandwiched between the plate body 14 and the mask 12. Thus, even when the wiring board 18 is warped, the conductive ball container 13 and the plate body 14 and the mask 12 are in contact with each other, or the conductive ball container 13 and the plate body 14 and the mask 12 are contacted. Since the conductive ball 38 is not sandwiched between the two, the productivity in the process of placing the conductive ball 38 on the plurality of pads 27 can be improved.

  Next, in the step shown in FIG. 6, the conductive ball container 13 containing the plurality of conductive balls 38 is moved by a driving device (not shown) so that the plate body 14 and the pad forming region A face each other. After that, the conductive ball container 13 is vibrated by the vibration device 15, and the plurality of conductive balls 38 are dropped from the plurality of through portions 43 of the plate body 14 onto the mask 12, thereby forming the adhesive material 35. One conductive ball 38 is placed on each of the plurality of pads 27 (conductive ball dropping step). At this time, excess conductive balls 38 remaining on the mask 12 in a portion not facing the plate body 14 are collected by the conductive ball collection means 16 (conductive ball collection step). The conductive ball collecting step may be performed in parallel with the conductive ball dropping step.

  Thus, by performing the conductive ball recovery step and the conductive ball drop step in parallel, the time required for the conductive ball drop step and the conductive ball recovery step can be shortened. Can be improved.

  As shown in FIG. 10, the above-described movement of the conductive ball container 13 (movement for making the plate body 14 and the pad forming area A face each other) and the vibration of the conductive ball container 13 are repeatedly performed. Then, one conductive ball 38 is placed on each pad 27 of the wiring board 18. Then, after one conductive ball 38 is placed on each of the pads 27, the vibration of the conductive ball container 13 is stopped, and finally the pad formation region A where the conductive ball 38 is dropped is supported. The excess conductive ball 38 remaining on the mask 12 in the portion to be recovered is recovered by the conductive ball recovery means 16 (see FIG. 10).

  Next, in the step shown in FIG. 7, the wiring board 18 to which the mask 12 is fixed is removed from the stage 11 of the conductive ball mounting apparatus 10. Next, in the step shown in FIG. 8, the resist film 41 and the mask 12 are removed from the wiring substrate 18 on which the plurality of conductive balls 38 are placed. Thereafter, the conductive ball 38 is melted to bond the conductive ball 38 to the pad 27, and then the adhesive material 35 is removed by washing.

  Next, in the step shown in FIG. 9, the wiring board 18 on which the plurality of conductive balls 38 are placed is cut along the cutting position C by a dicer. Thereby, a plurality of wiring boards 21 provided with the conductive balls 38 are manufactured.

  According to the conductive ball mounting method of the present embodiment, the conductive ball container is provided so that the plurality of conductive balls 38 dropped on the mask 12 are not sandwiched between the plate body 14 and the mask 12. The conductive ball container 13 is vibrated with the 13 and the plate body 14 spaced apart from the mask 12, and a plurality of conductive balls 38 are dropped onto the mask 12 from the plurality of through portions 43 of the plate body 14. As a result, even when the wiring substrate 18 is warped, the conductive ball container 13 and the plate body 14 and the mask 12 are in contact with each other, or between the conductive ball container 13 and the plate body 41 and the mask 12. Therefore, the productivity in the process of placing the conductive balls 38 on the plurality of pads 27 can be improved.

  FIG. 11 is a cross-sectional view of a conductive ball placing device according to a modification of the first embodiment of the present invention. In FIG. 11, the same components as those of the conductive ball mounting apparatus 10 according to the first embodiment are denoted by the same reference numerals.

  In this embodiment, the case where the resist film 41 is formed on the wiring substrate 18 and the mask 12 is placed on the resist film 41 has been described as an example. However, the conductive ball placement shown in FIG. Instead of using the resist film 41 as in the apparatus 45, a mask 46 in which a portion corresponding to the resist film 41 and the mask 12 are integrally formed may be placed on the wiring substrate 18. When such a conductive ball mounting device 45 is used, one conductive ball 38 is provided for each of the plurality of pads 27 by the same method as the method for mounting the conductive ball 38 described in the first embodiment. Can be placed.

(Second Embodiment)
FIG. 12 is a cross-sectional view of a conductive ball placing apparatus according to the second embodiment of the present invention. FIG. 12 schematically shows a state in which a plurality of conductive balls 38 are dropped on the mask 12 from the conductive ball container 13 disposed above the mask 12. In FIG. 12, the same components as those of the conductive ball mounting apparatus 10 according to the first embodiment are denoted by the same reference numerals.

  Referring to FIG. 12, the conductive ball mounting apparatus 50 according to the second embodiment is different from the configuration of the conductive ball mounting apparatus 10 according to the first embodiment except that a drop direction regulating means 51 is provided. Is configured in the same manner as the conductive ball mounting apparatus 10.

  The drop direction regulating means 51 has a cylindrical shape, and is provided on the lower surface 14 </ b> A of the plate body 14 so as to surround the plurality of through portions 43 formed in the plate body 14. The drop direction restricting means 51 is for restricting the drop direction of the plurality of conductive balls 38 falling from the plurality of through portions 43 of the plate body 14. The drop direction restricting means 51 is disposed at a position away from the mask 12 so that the conductive ball 38 dropped on the mask 12 is not sandwiched between the drop direction restricting means 51 and the mask 12. The distance D2 between the lower end portion of the drop direction regulating means 51 and the mask 12 can be set to 1 mm to 2 mm, for example. As a material of the drop direction regulating means 51, for example, metal can be used.

  As described above, by providing the drop direction restricting means 51 for restricting the drop direction of the plurality of conductive balls 38 falling from the plurality of through portions 43 of the plate body 14, a portion corresponding to the pad formation region A of the wiring board 18. Since the conductive ball 38 can be accurately dropped on the mask 12, the productivity in the process of placing the conductive ball 38 on the plurality of pads 27 can be improved.

  Further, the drop direction regulating means 51 is arranged at a position away from the mask 12 so that the plurality of conductive balls 38 dropped on the mask 12 are not sandwiched between the drop direction regulating means 51 and the mask 12. Even when the wiring substrate 18 is warped, the drop direction restricting means 51 and the mask 12 do not come into contact with each other, and the conductive ball 38 is not sandwiched between the drop direction restricting means 51 and the mask 12. Therefore, productivity can be improved.

  According to the conductive ball mounting device of the present embodiment, the drop direction regulating means 51 for regulating the drop direction of the plurality of conductive balls 38 falling from the plurality of through portions 43 of the plate body 14 is provided on the lower surface of the plate body 14. 14A, and the drop direction restricting means 51 is arranged at a position away from the mask 12 so that the plurality of conductive balls 38 dropped on the mask 12 are not sandwiched between the drop direction restricting means 51 and the mask 12. As a result, the conductive ball 38 can be accurately dropped on the mask 12 corresponding to the pad formation region A of the wiring board 18, and even if the wiring board 18 is warped, the direction of dropping is reduced. Since the restricting means 51 and the mask 12 do not come into contact with each other, and the conductive ball 38 is not sandwiched between the drop direction restricting means 51 and the mask 12, a plurality of pads can be used. It is possible to improve the productivity in the step of mounting the conductive balls 38 to 7.

  When the conductive ball mounting apparatus 50 according to the present embodiment is used, one conductive property is applied to each of the plurality of pads 27 by the same method as the conductive ball mounting method described in the first embodiment. A ball 38 can be placed.

  According to the conductive ball mounting method of the present embodiment, the plurality of conductive balls 38 dropped on the mask 12 are transferred to the conductive ball container 13, the plate body 14, the drop direction regulating means 51, the mask 12, and the like. The conductive ball container 13 is vibrated in a state where the conductive ball container 13, the plate body 14, and the drop direction regulating means 51 are arranged apart from the mask 12 so as not to be sandwiched between them. By dropping a plurality of conductive balls 38 onto the mask 12 from the plurality of through portions 43 of the body 14, even when the wiring board 18 is warped, the conductive ball container 13, the plate body 14, and the dropping direction Since the restricting means 51 and the mask 12 do not come into contact with each other, and the conductive ball 38 is not sandwiched between the plate member 14 and the drop direction restricting means 51 and the mask 12, it is possible to conduct electricity to the plurality of pads 27. It is possible to improve the productivity in the step of placing the ball 38.

(Third embodiment)
FIG. 13 is a cross-sectional view of a conductive ball mounting apparatus according to the third embodiment of the present invention. FIG. 13 schematically shows a state in which a plurality of conductive balls 38 are dropped onto the mask 12 from the conductive ball container 13 disposed above the mask 12. Moreover, in FIG. 13, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 50 of 2nd Embodiment.

  Referring to FIG. 13, the conductive ball mounting device 60 according to the third embodiment is conductive except that a brush portion 61 is provided in the configuration of the conductive ball mounting device 50 according to the second embodiment. It is comprised similarly to the property ball | bowl mounting apparatus 50. FIG.

  The brush portion 61 is provided so as to cover the lower end portion of the drop direction regulating means 51. The length of the brush portion 61 can be set to, for example, a length that is in contact with the mask 12 (specifically, a length approximately equal to the value of the distance D2). When the vibration device 15 vibrates the conductive ball container 13, the brush portion 61 is in contact with the brush portion 61 that vibrates and the conductive ball 38 dropped on the mask 12. This is for moving the contacting conductive ball on the mask corresponding to the pad formation region A.

  Thus, the conductive ball container 13 was vibrated by the vibration device 15 by providing the brush portion 61 in contact with the conductive ball 38 dropped on the mask 12 at the lower end of the drop direction regulating means 51. At this time, since the conductive ball 38 in contact with the brush portion 61 moves on the mask 12 corresponding to the pad forming area A, the probability that the conductive ball 38 enters the through portion 12A of the mask 12 is increased. it can. As a result, the time required for the process of placing the conductive balls 38 on the plurality of pads 27 can be shortened, so that productivity can be improved.

  As a material for the brush portion 61, for example, a conductive resin may be used. Thus, by using a resin having conductivity as the material of the brush portion 61, the static electricity generated when the brush portion 61 comes into contact with the mask 12 and the conductive ball 38 is released, so that the mask 12 and the conductive ball are discharged. 38 can be prevented from being charged.

  According to the conductive ball mounting device of the present embodiment, the vibration device 15 is provided with the brush portion 61 that contacts the conductive ball 38 dropped on the mask 12 at the lower end of the drop direction restricting means 51. When the conductive ball container 13 is vibrated, the conductive ball 38 that is in contact with the brush portion 61 moves on the mask 12 corresponding to the pad forming region A. Therefore, it is possible to improve the productivity in the process of placing the conductive balls 38 on the plurality of pads 27.

  In addition, when the conductive ball mounting device 60 of the present embodiment is used, one pad is arranged on each of the plurality of pads 27 by the same method as the conductive ball mounting method described in the first embodiment. A conductive ball 38 can be placed.

(Fourth embodiment)
FIG. 14 is a cross-sectional view of a conductive ball mounting apparatus according to the fourth embodiment of the present invention. FIG. 14 schematically shows a state in which a plurality of conductive balls 38 are dropped onto the mask 12 from the conductive ball container 13 disposed above the mask 12. Moreover, in FIG. 14, the same code | symbol is attached | subjected to the same component as the conductive ball mounting apparatus 60 of 3rd Embodiment.

  Referring to FIG. 14, the conductive ball mounting apparatus 70 according to the fourth embodiment is different from the configuration of the conductive ball mounting apparatus 60 according to the third embodiment except that a container moving means 71 is provided. Is configured in the same manner as the conductive ball mounting device 60.

  The container moving means 71 is provided in the conductive ball container 13. The container moving means 71 is a conductive ball such that the conductive ball 38 and the brush portion 61 that are located apart from the brush portion 61 out of the plurality of conductive balls 38 dropped on the mask 12 are in contact with each other. This is for moving the container 13. Specifically, the container moving means 71, for example, causes the conductive ball container 13 to move circularly or reciprocate.

  Thus, by providing the container moving means 71 for moving the conductive ball container 13 so that the conductive ball 38 present at a position separated from the brush part 61 and the brush part 61 are in contact with each other, the container body is provided. When the moving means 71 moves the conductive ball container 13, the conductive balls 38 present at a position separated from the brush portion 61 come into contact with the brush portion 61 and on the portion of the mask 12 corresponding to the pad formation region A. Therefore, it is possible to increase the probability that the conductive ball 38 enters the through portion 12A of the mask 12, so that the productivity in the process of placing the conductive ball 38 on the plurality of pads 27 can be improved. it can.

  According to the conductive ball mounting device of the present embodiment, the storage that moves the conductive ball container 13 so that the conductive ball 38 and the brush 61 are in contact with each other at a position separated from the brush 61. By providing the body moving means 71, when the container moving means 71 moves the conductive ball container 13, the conductive balls 38 present at a position separated from the brush section 61 come into contact with the brush section 61 and are padded. Since the conductive ball 38 moves on the mask 12 corresponding to the formation area A, the probability that the conductive ball 38 enters the through portion 12A of the mask 12 is increased. Productivity can be improved.

  When the conductive ball mounting apparatus 70 of the present embodiment is used, in the step shown in FIG. 6 described in the first embodiment, the conductive ball container 13 is vibrated and the container moving means 71 is used. The conductive ball 38 of the first embodiment is mounted except that the conductive ball container 13 is moved so that the conductive ball 38 present at a position away from the brush portion 61 and the brush portion 61 are in contact with each other. One conductive ball 38 can be placed on each of the plurality of pads 32 by a method similar to the placement method.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible.

  The present invention can be applied to a conductive ball mounting device and a conductive ball mounting method for mounting a conductive ball on a wiring board having a plurality of pads on which an adhesive material is formed.

It is sectional drawing of the conventional conductive ball mounting apparatus. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 1) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 2) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 3) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 4) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 5) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 6) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is process drawing (the 7) for demonstrating the mounting method of the conductive ball using the conductive ball mounting apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the state by which the conductive ball was mounted on all the pads provided in the wiring board. It is sectional drawing of the conductive ball mounting apparatus which concerns on the modification of the 1st Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the conductive ball mounting apparatus which concerns on the 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 45, 50, 60, 70 Conductive ball mounting apparatus 11 Stage 12, 46 Mask 12A Penetrating part 13 Conductive ball container 14 Plate body 14A, 23B Lower surface 15 Vibrating device 16 Conductive ball collection means 18, 21 Wiring Substrate 23 Substrate body 23A Upper surface 25 Through via 26 Upper wiring 27, 32 Pad 29, 33 Solder resist 13A, 29A, 33A Opening 31 Lower wiring 35 Adhesive material 38 Conductive ball 41 Resist film 43 Through portion 51 Drop direction regulating means 61 Brush part 71 Container moving means A Pad forming area C Cutting position D1, D2 Distance M1 Thickness R1, R2 Diameter

Claims (7)

A mask having a plurality of penetrating portions that are disposed on a substrate having a plurality of pads on which an adhesive material is formed and expose the plurality of pads;
A conductive ball mounting device comprising: a plurality of conductive balls; and a conductive ball container having an opening for dropping the plurality of conductive balls on the mask,
While providing a vibration device for vibrating the conductive ball container,
A plate body having a plurality of penetrating portions that are sized to allow one of the conductive balls to pass is provided so as to cover the opening of the conductive ball container, and the conductive ball container and the plate body The conductive ball container and the plate are arranged apart from the mask so that the conductive balls dropped on the mask are not sandwiched between the mask and the mask. Ball mounting device.   The drop direction restricting means for restricting a drop direction of the plurality of conductive balls falling from the plurality of through portions of the plate body is provided on the conductive ball container or the plate body. The conductive ball mounting apparatus according to 1.   Among the plurality of conductive balls dropped on the mask, there is provided conductive ball collecting means for collecting the conductive balls that have not been placed on the plurality of pads on which the adhesive material is formed. The conductive ball mounting apparatus according to claim 1 or 2, characterized in that:   4. The conductive ball mounting apparatus according to claim 2, wherein a brush portion that contacts the plurality of conductive balls dropped on the mask is provided in the drop direction regulating means.   Among the plurality of conductive balls dropped on the mask, there is provided moving means for moving the conductive ball container so that the brush portion comes into contact with the conductive ball spaced from the brush portion. The conductive ball mounting apparatus according to claim 4. An opening of a conductive ball container in which a mask having a plurality of through portions exposing the plurality of pads is arranged on a substrate having a plurality of pads on which an adhesive material is formed, and a plurality of conductive balls are accommodated. A plurality of conductive balls are dropped on the mask to place one conductive ball on each of the plurality of pads;
A plate body having a plurality of through portions that are sized to allow one of the conductive balls to pass therethrough is provided so as to cover the opening of the conductive ball container,
The conductive ball container and the plate body are removed from the mask so that the plurality of conductive balls dropped on the mask are not sandwiched between the conductive ball container and the plate body and the mask. A conductive ball container and a plate body arranging step to be arranged apart from each other;
A conductive ball dropping step of vibrating the conductive ball container and dropping the plurality of conductive balls from the plurality of through portions of the plate after the conductive ball container and the plate body arranging step; The mounting method of the conductive ball | bowl characterized by including these.   Among the plurality of conductive balls dropped on the mask, there is provided a conductive ball collecting step for collecting the conductive balls that have not been placed on the plurality of pads on which the adhesive material is formed. The method for placing a conductive ball according to claim 6, wherein:

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