JP2008199158A - Heat-dissipating structure of solid-state imaging element, and solid-state imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating structure for cooling a solid-state imaging element, while reducing the external force loads applied to the solid-state imaging element, in a relatively simple structure, in a heat-dissipating structure of the solid-state imaging element used in an imaging device which is provided with the solid-state imaging element. <P>SOLUTION: The solid-state imaging element is equipped with a heat-dissipating member, provided with a contact part to be brought into contact with the solid-state imaging element fixed to a prism member and a fin-like heat-dissipating part for radiating heat transmitted through the contact part into a gas around it, and the contact part and the heat-dissipating part are formed of a foil-like member comprising a high thermal conductivity material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure for a solid-state image pickup device and a solid-state image pickup device used in an image pickup apparatus such as a television camera or a video camera including the solid-state image pickup device.

  In recent years, a three-plate color camera (hereinafter referred to as a three-plate camera) has been developed and widely used as an imaging apparatus using three solid-state imaging devices. The structure of such a conventional three-panel camera will be described with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view of an imaging block 10 in a conventional three-plate camera. As shown in FIG. 1, the imaging block 10 includes a color separation prism that separates light incident through an imaging lens (not shown) in a three-plate camera into predetermined color components, a plurality of solid-state imaging devices, And an image sensor substrate on which a solid-state image sensor is mounted.

  As shown in FIG. 1, the color separation prism is composed of three prism members 1r, 1g, and 1b that are in close contact with each other, and is a three-color separation prism 1 that separates incident light into three color components. is there. The joining interfaces of the prism members 1r, 1g, and 1b are dichroic mirrors 4 and 5, respectively. In addition, solid imaging elements 2r, 2g, and 2b are individually fixed to the light emission surfaces of the three prism members 1r, 1g, and 1b via an adhesive.

  In FIG. 1, a light beam 7 incident on a three-color separation prism 1 is color-separated into three color components, that is, light beams 6a, 6b, and 6c of three primary colors of light by dichroic mirrors 4 and 5, respectively. Light is received by 2r, 2g, and 2b. Of the light beams separated and reflected by the dichroic mirrors 4 and 5 into the three primary colors, the light beams 6a and 6b are totally reflected again in the respective prism members 1g and 1b, so that they are not inverted images (mirror images). It is received by the solid-state imaging devices 2g and 2b as a light beam that forms an image. The respective light fluxes received by the respective solid-state image pickup devices 2g, 2b, and 2r are processed as image pickup signals by the respective image pickup device substrates 3r, 3g, and 3b, and are color television signals obtained by combining the image pickup signals. Is obtained.

  In a conventional three-plate camera having such a configuration, it is necessary to accurately superimpose three color subject images. If the overlay accuracy, that is, the registration accuracy is poor, color misregistration and moire false signals are generated, and the image quality is slightly degraded. Therefore, it is necessary to reduce the external force load applied to each solid-state imaging device 2r, 2g, 2b so that the registration accuracy does not deteriorate.

  In addition, when the solid-state imaging device is used in a high temperature environment, problems such as image quality deterioration due to white scratches and shortening of the lifetime occur. Therefore, it is necessary to use the solid-state imaging device at a predetermined temperature or lower. In recent years, in particular, in an imaging apparatus typified by a three-plate camera on which a solid-state imaging device is mounted, the ambient temperature of the solid-state imaging device (apparatus housing) increases with the increase in power consumption due to lightness, shortness, multifunctionality, and high functionality. (Internal temperature) tends to increase more and more, and means for cooling the solid-state imaging device is indispensable.

  Therefore, in the conventional imaging device, various heat dissipation structures for efficiently cooling the solid-state image sensor while reducing the external force load applied to the solid-state image sensor have been proposed (for example, Patent Documents 1 and 2). 3).

  First, Patent Document 1 proposes a heat dissipation structure in which a thermoelectric cooling element installed on a heat transfer member with screws is arranged so as to come into contact with the back surface of each solid-state imaging element. In such a heat dissipation structure, the amount of deformation accompanying thermal expansion and contraction of each member can be absorbed by screw backlash, so that a force accompanying thermal deformation is applied from the cooling element to the solid-state imaging element. Can not be.

  Further, in Patent Document 2, a heat dissipation structure in which a thermoelectric cooling element fixed to a heat conducting plate is disposed so as to be in close contact with the back surface of the solid-state imaging device by using the elasticity of the heat conducting plate. Has been proposed. In such a heat dissipation structure, by utilizing the elasticity of the heat conducting plate, the cooling element can be brought into close contact with the back surface of the solid-state imaging element, and efficient heat dissipation can be realized.

  In Patent Document 3, as a heat dissipation structure that does not use a thermoelectric cooling element, one end of a metal part is inserted and disposed between the back surface of the solid-state image sensor and the image sensor substrate, and the other end of the metal member is fixed to the metal frame. Thus, there has been proposed a heat dissipation structure that releases heat transferred from the solid-state imaging device to the metal part to the metal frame.

JP-A-1-295575 JP 2002-247594 A JP 2001-30569 A

  In recent years, positioning of each solid-state imaging device in such a three-plate camera is demanding accuracy of the order of μm. For example, positioning of each solid-state imaging device 2r, 2g, 2b has a depth of focus in the optical axis direction. Therefore, an accuracy of the order of μm is required in the direction of several tens μm and in the subject image plane.

  However, in the heat dissipation structure of Patent Document 1, since external force is absorbed by screw backlash, the external force generated by minute thermal deformation cannot be sufficiently absorbed, and depending on the magnitude of the applied external force. In some cases, the positioning accuracy of the image sensor may be affected, and a decrease in registration accuracy due to this misalignment becomes a problem. Further, in the heat dissipation structure of Patent Document 2, an external force is applied to the solid-state imaging device due to the elastic force of the heat conduction plate, and the external force changes due to thermal expansion or the like, which may affect the positioning accuracy. Further, in the heat dissipation structures of Patent Documents 1 and 2, there is a problem that the cost of the imaging apparatus increases because a relatively expensive thermoelectric cooling element is used.

  Further, in the heat dissipation structure of Patent Document 3 that does not use a cooling element, the metal part having one end fixed to the metal frame is disposed so as to contact the back surface of the solid-state imaging element, so that the heat of the metal member Load caused by springback due to expansion / contraction is applied to the solid-state image sensor through the contact end on the solid-state image sensor side, and a displacement occurs on the bonding surface between the solid-state image sensor and the prism member. Decrease is a problem. In addition, any of the heat dissipation structures of Patent Documents 1 to 3 has a complicated structure, and it cannot be said that attachment work and handling work are easy.

  Further, a UV adhesive (ultraviolet curable adhesive) is used for bonding the front surfaces of the solid-state imaging devices 2r, 2g, and 2b and the prisms 1r, 1g, and 1b, and each adhesive is applied between the bonding surfaces. A method is widely used in which the position adjustment (six axes) of the solid-state imaging devices 2r, 2g, and 2b is performed, and then the adhesive is cured by irradiating ultraviolet rays to fix the adhesive surface.

  However, such a UV adhesive has a high temperature creep characteristic (characteristic of creeping when a load is continuously applied in a high temperature environment), and therefore the ambient temperature of the solid-state imaging devices 2r, 2g, and 2b (internal temperature of the apparatus housing) is particularly high. When it becomes high, the load resulting from the springback of the metal parts or the like becomes a serious problem.

  Accordingly, an object of the present invention is to solve the above-described problem, and in a heat dissipation structure for a solid-state image sensor used in an image pickup apparatus including the solid-state image sensor, an external force applied to the solid-state image sensor with a relatively simple structure. An object of the present invention is to provide a solid-state imaging element heat dissipation structure for cooling a solid-state imaging element while reducing a load, and a solid-state imaging device having such a heat dissipation structure.

  In order to achieve the above object, the present invention is configured as follows.

  According to the first aspect of the present invention, the contact portion that is in contact with the solid-state imaging device fixed to the prism member, and the fin-like heat dissipation portion that dissipates the heat transmitted through the contact portion into the surrounding gas. There is provided a heat dissipation structure for a solid-state imaging device, characterized in that the contact portion and the heat dissipation portion include a heat dissipation member formed of a foil-like member made of a highly thermally conductive material.

  According to a second aspect of the present invention, there is provided the solid-state image sensor heat dissipation structure according to the first aspect, wherein the contact portion of the heat dissipation member is in contact with the solid-state image sensor via a contact auxiliary material. .

  According to the third aspect of the present invention, in the heat radiating member, the fin-like heat radiating portion has a shape in which the foil-like member is curved or bent in the thickness direction. The solid-state image sensor heat dissipation structure described in 1. is provided.

  According to the fourth aspect of the present invention, the plurality of heat radiating members are individually attached to the plurality of fixed imaging elements fixed to the plurality of prism members constituting the color separation prism that separates light into a plurality of color components. The solid-state imaging device heat dissipation structure according to any one of the first to third aspects is provided.

  According to the fifth aspect of the present invention, in the solid-state imaging device according to the fourth aspect, the gas flow direction in the fin-shaped heat radiation portion is arranged in the same direction in all the heat radiation members. Provide a heat dissipation structure.

  According to the sixth aspect of the present invention, the contact portion is disposed so as to be in contact with substantially the entire one surface of the solid-state imaging device, and the foil extends from respective end portions of the contact portion facing each other. A solid-state imaging element heat dissipation structure according to any one of the first to fifth aspects, in which the fin-shaped heat dissipation part is formed by a member.

According to a seventh aspect of the present invention, a prism member;
A solid-state imaging device fixed to the prism member;
A contact portion that is in contact with the solid-state imaging device; and a fin-like heat dissipation portion that dissipates heat transmitted through the contact portion into a surrounding gas. The contact portion and the heat dissipation portion have high thermal conductivity. There is provided a solid-state imaging device comprising a heat radiating member formed of a foil-like member made of a material.

According to an eighth aspect of the present invention, a color separation prism configured by a plurality of prism members and separating light into a plurality of color components;
A plurality of fixed imaging elements individually fixed to the plurality of prism members;
Each of the fixed imaging elements has a contact portion that is individually contacted, and a fin-like heat dissipation portion that dissipates heat transmitted through the contact portion into a surrounding gas. The contact portion and the heat dissipation portion And a plurality of heat dissipating members formed of a foil-like member made of a high thermal conductivity material.

  According to a ninth aspect of the present invention, there is provided the solid-state imaging device according to the seventh aspect or the eighth aspect, wherein the contact portion of the heat dissipation member is in contact with the solid-state imaging element via a contact auxiliary material. To do.

  According to a tenth aspect of the present invention, in the heat radiating member, the fin-shaped heat radiating portion has a shape in which the foil-like member is curved or bent in the thickness direction thereof. A solid-state imaging device according to any one of the above.

  According to an eleventh aspect of the present invention, the solid-state imaging device according to the eighth aspect, in which the width direction of the heat radiating member in the fin-shaped heat radiating portion is arranged in the same direction in all the heat radiating members. I will provide a.

  According to a twelfth aspect of the present invention, the contact portion is disposed so as to be in contact with substantially the entire surface of one surface of the solid-state imaging device, and the foil extends from respective end portions facing each other in the contact portion. The solid-state imaging device according to any one of the seventh aspect to the eleventh aspect, in which the fin-shaped heat radiation portion is formed by a member.

  According to the present invention, a heat radiating member having a contact portion that is in contact with a solid-state imaging device and a fin-like heat radiating portion is fixed to another member such as a housing as in a conventional heat radiating structure, and then to the housing. Instead of adopting a structure that allows heat to escape, a structure that dissipates heat into the surrounding gas through a fin-shaped heat dissipation part without being fixed to other members such as a housing. As a result, the stress load such as springback applied to the solid-state imaging device through the heat radiating member can be remarkably reduced. Moreover, although such a heat radiating member is disposed in contact with the surface of the solid-state imaging device, both the contact portion and the fin-shaped heat radiating portion are formed of a foil-like member. The dead weight can be reduced to the limit that can maintain the member form. Therefore, it is possible to suppress the stress load applied to the fixed imaging element due to the weight of the heat radiating member. Therefore, with a relatively simple structure, a solid-state image sensor that can reduce the stress load applied to the solid-state image sensor through the heat radiating member while ensuring the necessary heat dissipation performance, and can suppress a decrease in registration accuracy. And a solid-state imaging device having such a heat dissipation structure can be provided.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 2 shows a schematic perspective view of an imaging block 20 (a state in which no heat dissipation structure is provided) in the three-plate camera in which the solid-state image sensor heat dissipation structure according to the first embodiment of the present invention is adopted. FIG. 3 shows a schematic perspective view of the imaging block 20 in a state in which the heat dissipation structure of the embodiment is equipped. In addition, since the structure itself of the imaging block 20 is the same structure as the imaging block 10 shown in FIG. 1, the same referential mark is attached | subjected to the same structural member and the description is abbreviate | omitted.

  As shown in FIGS. 2 and 3, the heat dissipation structure of the solid-state imaging device according to the first embodiment is a fin-shaped heat dissipation member (radiation fin member) 11 formed of a foil-like member formed of a high thermal conductivity material. , 12 and 13 are individually arranged so as to be in contact with the back surfaces of the respective solid-state imaging devices 2r, 2g and 2b. The heat generated in each solid-state imaging device 2r, 2g, 2b is released into the surrounding gas, that is, the atmosphere without interposing other members through the respective heat radiating members 11, 12, 13, and as a result. The temperature of each solid-state imaging device 2r, 2g, 2b can be reduced.

  Here, the typical perspective view which shows the external appearance structure of the heat radiating member 11 on behalf of the heat radiating members 11, 12, and 13 which have the respectively same shape is shown in FIG.

  As shown in FIG. 4, the heat radiating member 11 is in contact with the back surface of the solid-state imaging device 2r (the surface opposite to the light receiving surface of the light beam), thereby radiating heat generated in the solid-state imaging device 2r by this contact. A contact portion 11a for transferring heat to the member 11 is provided at the bottom, and a foil-like member extending upward from the respective ends facing each other at the bottom is bent or bent a plurality of times in the thickness direction. A heat dissipating part 11b in which a plurality of fins are formed in an accordion shape so as to increase the contact area with the surrounding atmosphere, that is, the heat dissipating area, is provided at the upper part.

  In this heat radiating member 11, the contact part 11a and the heat radiating part 11b are formed using the foil-shaped member which has a predetermined width dimension. Such a foil-shaped member is made of, for example, copper or a graphite sheet as a high thermal conductivity material (a material having a high thermal conductivity), and is formed in a thickness of, for example, 0.1 mm or less.

  As shown in FIG. 3, the heat dissipating member 11 having such a structure has a contact portion 11a formed of a foil-like member disposed between the solid-state image pickup device 2r and the image pickup device substrate 3r. In this arrangement state, the bottom surface of the contact portion 11a is in contact with the back surface of the solid-state imaging device 2r. In order to secure a contact area that can effectively release the heat generated in the solid-state imaging device 2r, the contact portion 11a comes into contact with substantially the entire flat portion of the back surface of the solid-state imaging device 2r. The shape (length and width dimensions) of the contact portion 11a is determined. Further, in order to enhance the substantial contact between the contact portion 11a of the heat radiating member 11 and the back surface of the solid-state imaging device 2r, for example, grease is applied as a contact auxiliary material between the two and disposed. There may be. In other words, in the present invention, the contact between the solid-state imaging device and the heat dissipation member refers to the case where both are in direct contact without interposing other members, and the contact between the solid-state image sensor and the heat dissipation member. For the purpose of improving the contactability, it includes any case where the both are indirectly brought into contact with each other through a contact auxiliary material typified by grease.

  Moreover, the contact part 11a of the heat radiating member 11 is disposed between the solid-state image sensor 2r and the image sensor substrate 3r, and is lightly sandwiched between the two to hold the position where the heat radiating member 11 is disposed. In addition, instead of such a case, it is also possible to adopt a configuration in which the heat radiation member 11 can be slid freely to some extent in a state where the contact with the solid-state imaging device 2r is maintained without being sandwiched between the two. it can. That is, as long as the contact between the solid-state imaging device and the heat radiating member is maintained, the relative movement of the heat radiating member with respect to the solid-state imaging device does not matter.

  Further, as shown in FIG. 3, the other heat radiating members 12 and 13 are also arranged in the same configuration as the heat radiating member 11 so as to be in contact with the solid-state imaging devices 2 g and 2 b individually. Furthermore, in a state where the respective heat radiation members 11, 12, and 13 are mounted on the imaging block 20, each of the heat radiation members 11, 12, and 13 includes other heat radiation members, a casing, a lens barrel case, and the like. It arrange | positions so that it may not contact another member.

  According to the heat radiation structure of the solid-state imaging device of the first embodiment, the solid-state imaging devices 2r, 2g, and 2b that are individually fixed to the prism members 1r, 1g, and 1b constituting the imaging block 20 The heat dissipating members 11, 12, and 13 are arranged in contact with each other, and a configuration is adopted in which the heat is dissipated into the surrounding atmosphere by the bellows-shaped heat dissipating part provided in each heat dissipating member 11, 12, 13 Compared to the case where the heat radiating member is fixed to other members at the heat radiating side end as in the conventional heat radiating structure, the heat radiating member is moved from the heat radiating member to the solid-state imaging device by the spring back due to thermal expansion / contraction. The applied stress load can be significantly reduced.

  Furthermore, the entire structure including the contact portion and the heat radiating portion in such fin-shaped heat radiating members 11, 12, and 13 is configured by a foil-like member made of a highly thermally conductive material having a thickness of 0.1 mm or less (for example, By configuring them integrally, the weight of the heat dissipating members 11, 12, 13 can be greatly reduced. In particular, the fin-shaped heat dissipation member of the first embodiment is different from a general heat dissipation fin member adopting a configuration in which the distance between the contact portion and the heat dissipation portion is the shortest distance. It is formed of a foil-like member, with an emphasis on weight reduction rather than the formation. More specifically, as shown in FIG. 4, a general radiating fin in that a plurality of fins are formed in a bellows shape by bending or bending a foil-like member having a predetermined width dimension a plurality of times. It is very different from the member. Thus, by using the heat radiating member whose weight is significantly reduced, the stress load applied to the solid-state imaging device by the weight can be greatly reduced.

  Therefore, with a relatively simple structure, a solid-state image sensor that can reduce the stress load applied to the solid-state image sensor through the heat radiating member while ensuring the necessary heat dissipation performance, and can suppress a decrease in registration accuracy. The heat dissipation structure can be provided.

  Further, the contact portion 11a in the heat radiation member 11 is in contact with the back surface of the solid-state imaging device 2r, and the heat radiation portion 11b is formed so as to extend from the respective opposite ends of the contact portion 11a. The heat generated in the image sensor can be transferred from each end to the heat radiating member to dissipate the heat, and the heat dissipating part has higher heat dissipation efficiency than the case where the heat radiating part extends from one end. The effect that the temperature can be made uniform can be obtained.

  Here, FIG. 5 shows a schematic perspective view of the imaging block 30 equipped with the heat dissipation structure according to the modification of the first embodiment. In the imaging block 30 shown in FIG. 5, each imaging element substrate 3r, 3g, 3b is arranged at an arrangement position rotated 90 degrees with respect to each prism member 1r, 1g, 1b in the direction along the surface of the substrate. Is fixed. Further, the heat dissipating members 11, 12, and 13 are also provided at the arrangement positions rotated by 90 degrees in accordance with the arrangement positions of the imaging element substrates 3r, 3g, and 3b. As a result, as shown in FIG. 5, the fin direction of the heat radiating portion of each heat radiating member 11, 12, 13 can be set to the same direction D. In other words, the width direction of the heat dissipation member can be the same direction D. Thereby, the flow direction D of the gas in the fin of the thermal radiation part of each thermal radiation member 11, 12, 13 can be made into the same direction.

  In this way, by setting the gas flow direction D of the heat radiating portion to the same direction in all the heat radiating members 11, 12, and 13, for example, the imaging block 30 is arranged so that the direction D becomes the vertical direction, It is possible to improve the heat dissipation efficiency by actively utilizing the convection of air. Further, the heat radiation effect can be obtained evenly in all the heat radiation members 11, 12, and 13. Further, even if the direction D is not the vertical direction, the heat radiation efficiency can be improved by mechanically forming an air flow along the direction D using a blower or the like, and all the heat radiating members 11. , 12 and 13 can obtain a heat radiation effect evenly.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, FIG. 6 shows a schematic perspective view of an imaging block 40 equipped with a solid-state imaging device heat dissipation structure according to the second embodiment of the present invention. FIG. 7 shows a schematic perspective view of the heat radiating member 41 as a representative of the heat radiating members 41, 42, and 43 provided in the imaging block 40 of FIG. Since the configuration of the imaging block 40 itself is the same as that of the imaging block 20 of the first embodiment, the same reference numerals are assigned to the same structural members and the description thereof is omitted.

  As shown in FIGS. 6 and 7, the heat dissipating members 41, 42, and 43 of the second embodiment are arranged so as to be in contact with the back surfaces of the respective solid-state imaging devices 2 r, 2 g, and 2 b individually. Although the configuration is the same as that of the heat dissipation structure of the first embodiment, the shape of the heat dissipation portion in each of the heat dissipation members 41, 42, and 43 is different from that of the heat dissipation portion of the first embodiment.

  Specifically, the heat radiating portion 11b of the heat radiating member 11 of the first embodiment has a plurality of fin-like shapes formed in a generally bellows shape, whereas the second shape shown in FIG. The heat dissipating part 41b of the heat dissipating member 41 of the embodiment has a fin-like form in which a foil-like member having a predetermined width dimension is curved in a spiral shape in the thickness direction. Each foil-like member extending toward the upper side in the drawing from the mutually opposing end portions of the contact portion 41a of the heat radiating member 41 is curved in different directions to form a spiral heat radiating portion 41b.

  In addition to having the same heat dissipation characteristics as the heat dissipation members 11, 12, and 13 of the first embodiment, the heat dissipation members 41, 42, and 43 having such a spiral shape are provided at both ends of the foil-shaped member. Since it can manufacture by making it curve, it has the advantage that the manufacture can be made comparatively easy.

  Further, like the heat dissipation structure according to the modified example of the first embodiment, as shown in FIG. 8, such spiral heat dissipation members 41, 42, and 43 have the same gas flow direction D. The imaging block 50 can also be equipped so as to be in the direction.

  In each of the above embodiments, as an example of the form of the heat dissipation member, the substantially bellows-like form and the spiral form have been described. However, the present invention is not limited to such a form, and a foil-like member is used. Various other forms can be adopted as long as the necessary heat radiation efficiency can be obtained without contacting a member other than the solid-state imaging device (other heat radiating member, housing, etc.).

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as long as they do not depart from the scope of the present invention.

Schematic configuration diagram of imaging block in a conventional three-plate color camera 1 is a schematic perspective view of an imaging block in a state where a heat dissipation structure for a solid-state imaging device according to the first embodiment of the present invention is not installed. Schematic perspective view of the imaging block of FIG. 2 equipped with the heat dissipation structure of the first embodiment Schematic perspective view of the heat dissipation member of the first embodiment The model perspective view of the imaging block of the state equipped with the thermal radiation structure concerning the modification of this 1st Embodiment The schematic perspective view of the imaging block of the state equipped with the thermal radiation structure of the solid-state image sensor of 2nd Embodiment of this invention Schematic perspective view of the heat dissipation member of the second embodiment The model perspective view of the imaging block of the state equipped with the thermal radiation structure concerning the modification of this 2nd Embodiment

Explanation of symbols

1 Three-color separation prism 1r Prism member (red)
1g Prism member (green)
1b Prism member (blue)
2r solid-state image sensor (for red)
2g solid-state image sensor (for green)
2b Solid-state image sensor (for blue)
3r Image sensor substrate (for red)
3g Image sensor substrate (for green)
3b Image sensor substrate (for blue)
4 Dichroic mirror 5 Dichroic mirror 6a Primary light flux (for red)
6b Primary color luminous flux (for green)
6c Primary color luminous flux (for blue)
7 Light fluxes 10, 20, 30, 40, 50 Imaging blocks 11, 12, 13 Heat radiation member 11a Contact portion 11b Heat radiation portions 41, 42, 43 Heat radiation member 41a Contact portion 41b Heat radiation portion

Claims (12)

  A contact portion that is in contact with the solid-state imaging device fixed to the prism member; and a fin-like heat dissipation portion that dissipates heat transmitted through the contact portion into the surrounding gas. A heat dissipating structure for a solid-state imaging device, wherein the heat dissipating member is formed of a foil-shaped member made of a highly heat conductive material.   The heat radiation structure for a solid-state imaging device according to claim 1, wherein the contact portion of the heat radiating member is in contact with the solid-state imaging device via a contact auxiliary material.   3. The heat dissipation structure for a solid-state imaging device according to claim 1, wherein the fin-shaped heat dissipation portion has a shape in which the foil-shaped member is curved or bent in the thickness direction thereof.   The plurality of heat radiation members are individually brought into contact with the plurality of fixed imaging elements fixed to the plurality of prism members constituting a color separation prism that separates light into a plurality of color components. The heat dissipation structure of the solid-state image sensor as described in any one of these.   The solid-state imaging element heat dissipation structure according to claim 4, wherein a width direction of the heat dissipation member in the fin-shaped heat dissipation portion is arranged in the same direction in all the heat dissipation members.   The contact portion is disposed so as to be in contact with substantially the entire surface of one surface of the solid-state imaging device, and the fin-like heat radiating portion is formed by the foil-like member extending from each of the contact portions facing each other. The heat dissipation structure for a solid-state imaging device according to claim 1, which is formed. A prism member;
A solid-state imaging device fixed to the prism member;
A contact portion that is in contact with the solid-state imaging device; and a fin-like heat dissipation portion that dissipates heat transmitted through the contact portion into a surrounding gas. The contact portion and the heat dissipation portion have high thermal conductivity. A solid-state imaging device comprising: a heat radiating member formed of a foil-like member made of a material. A color separation prism composed of a plurality of prism members, which separates light into a plurality of color components;
A plurality of fixed imaging elements individually fixed to the plurality of prism members;
Each of the fixed imaging elements has a contact portion that is individually contacted, and a fin-like heat dissipation portion that dissipates heat transmitted through the contact portion into a surrounding gas. The contact portion and the heat dissipation portion And a plurality of heat dissipating members formed of a foil-like member made of a highly heat conductive material.   The solid-state imaging device according to claim 7 or 8, wherein the contact portion of the heat radiating member is in contact with the solid-state imaging element via a contact auxiliary material.   10. The solid-state imaging device according to claim 7, wherein in the heat dissipation member, the fin-shaped heat dissipation portion has a shape in which the foil-shaped member is curved or bent in the thickness direction.   The solid-state imaging device according to claim 8, wherein a width direction of the heat radiating member in the fin-shaped heat radiating portion is arranged in the same direction in all the heat radiating members.   The contact portion is disposed so as to be in contact with substantially the entire surface of one surface of the solid-state imaging device, and the fin-like heat radiating portion is formed by the foil-like member extending from each of the contact portions facing each other. The solid-state imaging device according to claim 7, wherein the solid-state imaging device is formed.

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