JP2006245961A - Fitting structure of imaging element, and imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fitting structure of an imaging element where heat dissipation environment of the imaging element is satisfactory. <P>SOLUTION: The bottom surface side of a solid-state imaging element 2 is fixed to an element seat 3, and the element seat 3 is fixed to the outgoing end face 1a of a 3-color separation prism 1 via a wedge glass 4. The element seat 3 has a through-hole 6 bored at a site which the bottom surface of the imaging element 2 faces. The bottom surface of the imaging element 2 is exposed directly to the surrounding air via the through-hole 6, so that heat dissipation from the bottom surface side is easy. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an image pickup device mounting structure used for a TV camera and the like, and more particularly to an image pickup device mounting structure for improving heat dissipation of a solid-state image pickup device and an image pickup apparatus using the same.

  Conventionally, in an imaging apparatus typified by a TV camera, in particular, a color television camera, subject light from an imaging lens is made up of an R (red) component, a G (green) component, and a B (blue) component by a three-color separation prism. Each of these color components is converted into an electric signal by a solid-state image pickup device such as a CCD or an image pickup tube, and the electric signal is received by an image signal processing circuit provided outside. The signal is processed, and an image of the subject captured by the color television camera is displayed on the screen of the monitor television.

By the way, the solid-state imaging device used in such a TV camera needs to be positioned and fixed with respect to the three-color separation prism so as not to cause a shift in the image for each color. It is desirable that the fixing state is fixed so that the fixing state does not easily change depending on environmental conditions such as temperature fluctuation and vibration after fixing.
Based on this viewpoint, various methods for fixing the solid-state imaging device to the color separation prism have been proposed (for example, see Patent Document 1).

  For example, FIG. 7 shows a typical example of a technique for fixing a solid-state imaging device to a three-color separation prism. Hereinafter, this conventional fixing technique will be described with reference to FIG.

  The three-color separation prism 1 has an emission end face 1a corresponding to each of the R component, G component, and B component. FIG. 7 shows an emission end face that emits one of the components for convenience of explanation. The attachment structure of the solid-state image sensor 2 in 1a is shown.

  In this mounting structure, there is provided a member called an element seat (hereinafter referred to as an element seat) 20 in which a recess 5 is formed so that the solid-state imaging device 2 is just fitted therein. The fixed imaging device 2 is fixed to the recess 5 by an adhesive so as to be joined on the bottom surface side. The end faces of both end portions in the longitudinal axis direction (the vertical direction in FIG. 7) of the element seat 20 are formed with slopes inclined outward, and are arranged between the element seat 20 and the three-color separation prism 1. The slope of the wedge glass 4 is joined.

  The element seat 20, the wedge glass 4, and the three-color separation prism 1 appropriately adjust the position of the wedge glass 4 so that the distance between the solid-state imaging device 2 and the emission end face 1 a of the three-color separation prism 1 is an appropriate distance. Then, after the position is determined, they are fixed to each other by an adhesive.

JP-A-9-163389

  By the way, the element seat used for holding the solid-state imaging element as described above is usually formed of a member whose thermal expansion coefficient approximates that of the glass material constituting the three-color separation prism, for example, ceramic or titanium. Is done.

  However, these members such as ceramic and titanium have a relatively low thermal conductivity, and in the case of a solid-state imaging device, particularly an element that requires heat radiation from its bottom side, such as a CCD, as described above, its bottom surface. The solid-state image sensor is more difficult to dissipate heat in combination with the fact that is fixed to the element seat with an adhesive, and the conventional element seat is never good in terms of the heat radiation environment of the solid-state image sensor. There was a problem that it was not a structure.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a mounting structure for an image sensor that can easily dissipate heat from the image sensor with a relatively simple configuration.
Another object of the present invention is to provide an image pickup apparatus in which the heat radiation environment of the image pickup element is good.

The mounting structure of the imaging device of the present invention is a mounting structure of an imaging device that is attached to the light emission end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. A portion of the element seat that is attached to the light emitting end face and faces the bottom surface of the imaging element is provided with a through hole or a slit that exposes a part of the bottom surface to the outside. It is.

  Furthermore, it is more preferable that a metal plate to which a heat radiating member can be joined via the through hole or the slit is attached to the bottom surface of the imaging element exposed from the through hole or the slit.

Further, the mounting structure of the image sensor attached to the light emission end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. A gap that is attached to the light emitting end face, and at least part of the gap between the bottom surface of the image sensor and the inner wall of the element seat facing the bottom surface is formed to allow the passage of air from the outside. Is also suitable.

Still further, an imaging device mounting structure that is mounted on the light emitting end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. While the element seat is attached to the light emitting end face, it is also preferable that at least a part of the part facing the bottom surface of the imaging element is formed thinner than the other part.

The image pickup apparatus of the present invention is an image pickup apparatus in which an image pickup element is attached to the light emission end face of the color separation prism using an element seat.
The image pickup device is attached by any one of the image pickup device attachment structures described above.

  Note that “... the element seat receives the bottom surface of the image sensor” means that the element seat holds the image sensor in a state where the inner wall surface of the element seat faces the bottom surface of the image sensor. However, it is not limited to a state in which the inner wall surface of the element seat is in contact with the bottom surface of the image sensor.

  According to the image pickup device mounting structure of the present invention, the image pickup device is attached to the color separation prism by an element seat configured such that the bottom surface side thereof is exposed to the surrounding air or air flow. Better heat dissipation of the element can be secured, the temperature rise of the image sensor itself is suppressed, and not only the deterioration of the image sensor due to the temperature can be prevented, but also the occurrence of color shift due to the temperature rise of the image sensor is suppressed. In addition, a highly reliable imaging device can be provided.

  In particular, by reducing the thickness of the portion of the element seat that faces the bottom surface of the image sensor, it is possible to improve heat dissipation through that portion as compared with the conventional case, and the temperature of the image sensor itself increases. In addition to preventing deterioration of the image sensor due to temperature, it is possible to provide a highly reliable image pickup apparatus that suppresses the occurrence of color misregistration caused by the temperature rise of the image sensor.

Hereinafter, an image sensor mounting structure according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a schematic configuration example of a TV camera as an imaging apparatus to which an imaging element mounting structure according to the first embodiment of the present invention is applied. First, with reference to FIG. explain. The same components as those used in the conventional configuration shown in FIG.

  The TV camera according to the embodiment of the present invention includes a main body 101 in which a three-color separation prism 1 and the like to be described later are housed, and a photographing lens 102 that is attached to the main body 101 and includes an appropriate number of lenses. It is divided roughly.

  The main body 101 is provided with a three-color separation prism 1 for separating the subject light obtained by the photographing lens 102 into three components of an R (red) component, a G (green) component, and a B (blue) component. A solid-state image sensor 2 such as a CCD is attached to the three-color separation prism 1 as will be described later. The three-color separation prism 1 has three emission end faces 1a corresponding to the three components. However, in FIG. 1, for convenience of explanation, the solid-state imaging device 2 on one emission end face 1a is viewed from the side. It has been shown.

  The light of the three color components obtained by the solid-state imaging device 2 is input to an external image processing device via a signal cable (not shown), is signal-processed, and is captured by a TV camera on a monitor TV screen (not shown). The image of the subject can be projected.

  In the embodiment of the present invention, the solid-state imaging device 2 is fixed to the element seat 3 with an adhesive on the bottom side thereof, and the element seat 3 is fixed to the wedge glass 4 with an adhesive. The point of being fixed to the color separation prism 1 with an adhesive is basically the same as in the prior art, but the structure of the element seat 3 is different from the prior art as described below.

  That is, the element seat 3 is a member having a thermal expansion coefficient close to the thermal expansion coefficient of the constituent glass material of the three-color separation prism 1, for example, a flat plate member made of ceramic, titanium, or the like, and the solid-state image pickup element 2 on the bottom side. The recess 5 to be fitted is formed. The element seat 3 has a lateral width, that is, a length in a direction orthogonal to the arrangement direction of the connection terminals 2a of the solid-state image pickup device 2 (vertical direction in the drawing in FIG. 2B). While the length is set smaller than the length, in this embodiment, the length in the longitudinal axis direction, that is, the direction along the arrangement direction of the connection terminals 2a of the solid-state imaging device 2 (the vertical direction in FIG. 2B) is These are set longer than the length of the solid-state imaging device 2 in the same direction (see FIG. 2).

  On one surface side of the element seat 3, a recess 5 is formed in which the length in the longitudinal axis direction is set equal to the length along the arrangement direction of the connection terminals 2 a of the solid-state imaging device 2. . The recess 5 only needs to have a depth that allows the solid-state image pickup device 2 to be secured to the bottom surface side thereof with an adhesive and can hold the solid-state image pickup device 2 sufficiently, and need not be limited to a specific depth. (See FIG. 2).

  In addition, the end surfaces of both end portions in the longitudinal axis direction of the recess 5 are formed on inclined surfaces that are inclined outward as in the conventional case, and the wedge glass 4 disposed between the element seat 3 and the three-color separation prism 1 is formed. The slopes are joined.

  Furthermore, in the element seat 3 in this embodiment, a through-hole 6 of an appropriate size is formed in a portion facing the bottom surface of the solid-state image sensor 2, that is, a substantially central portion of the recess 5, so that the solid-state image sensor The bottom surface of 2 is directly exposed to the surrounding air (see FIG. 2). As a result, unlike the conventional case, the bottom surface of the solid-state image sensor 2 is directly exposed to the surrounding air through the through-hole 6, so heat dissipation from the bottom surface side is facilitated, and the temperature rise of the solid-state image sensor 2 is reliably suppressed. The Rukoto.

  In addition, although the cross-sectional shape of the through-hole 6 in this 1st Embodiment is a circle (refer FIG.2 (b)), the shape of this through-hole 6 does not need to be limited to a specific shape. , Should be set arbitrarily.

  Since the mounting procedure of the element seat 3 having such a configuration is basically the same as the conventional one, a detailed description thereof will be omitted. However, in brief, first, the solid-state imaging element 2 is first attached to the element seat 3 with an adhesive. Stick. Thereafter, the position of the wedge glass 4 between the emission end face 1a and the element seat 3 is adjusted so that the distance between the emission end face 1a of the three-color separation prism 1 and the imaging face of the solid-state imaging device 2 becomes a desired distance. After the position is determined, the three-color separation prism 1, the wedge glass 4 and the element seat 3 are bonded and fixed to each other with an adhesive.

Next, an image sensor mounting structure and a TV camera as an image capturing apparatus having the mounting structure in the second embodiment will be described with reference to FIG.
The TV camera in the second embodiment is different from the element seat 3 in the first embodiment in the configuration of the element seat 3A as described below, and other configurations are basically shown in FIG. The configuration is the same as that shown in FIG. The same constituent elements as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be mainly described below.

  In the element seat 3A in the second embodiment, the recess 5A is formed slightly deeper than the conventional one. As a result, the solid-state imaging device 2 is conventionally fixed to the recess 5A on the bottom surface side with an adhesive, whereas in the second embodiment, the bottom surface of the solid-state imaging device 2 and the element seat The solid-state imaging device 2 is bonded with an adhesive at the end in the arrangement direction of the connection terminals 2a so that an air passage gap 7 is formed between the inner wall of 3A, that is, the surface of the recess 5A. The element seat 3A is fixed to the end inner wall surfaces 8a, 8b.

  Since the side surface of the element seat 3A along the arrangement direction of the connection terminals 2a of the solid-state image sensor 2 is open to the outside, the gap 7 communicates with the outside of the element seat 3A and the bottom surface of the solid-state image sensor 2 In addition to being directly exposed to the surrounding air, the air is directly exposed to the flow of air as it passes through the gap 7. Since the bottom surface of the solid-state image sensor 2 is directly exposed to the air passing through the gap 7, heat dissipation from the bottom surface side is promoted, and the temperature rise of the solid-state image sensor 2 is surely suppressed.

Next, an imaging element mounting structure and a TV camera as an imaging apparatus having the mounting structure in the third embodiment will be described with reference to FIG.
The TV camera in the third embodiment is different from the element seat 3 in the first embodiment in the configuration of the element seat 3B as described below, and other configurations are basically shown in FIG. The configuration is the same as that shown in FIG. The same constituent elements as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be mainly described below.

In the element seat 3B in the third embodiment, the element seats 3 and 3A in the first and second embodiments are integrally formed using one member. Thus, it is composed of two divided members 9a and 9b.
That is, the divided members 9a and 9b have a shape in the vicinity of the end in the arrangement direction of the connection terminals 2a of the solid-state imaging device 2, for example, similar to the element seat 3 shown in FIG. It is fixed to the step portion 10 by an adhesive.

  Thus, an appropriate portion of the bottom surface of the solid-state imaging device 2 is exposed to the outside from between the two divided members 9a and 9b and directly exposed to the air outside the element seat 3B. As a result, heat radiation from the bottom surface side of the solid-state imaging device 2 is promoted, and the temperature rise of the solid-state imaging device 2 is surely suppressed.

  In such a configuration, in particular, the solid-state image pickup device 2 can be radiated more heat by fixing a flat plate member using, for example, copper or the like having good heat dissipation efficiency, that is, a metal plate 11 to the bottom surface of the solid-state image pickup device 2. Even if it is promoted, it is preferable (see FIG. 5). Further, a heat radiator (not shown) having a large number of fins that have been conventionally used for heat radiation of semiconductor elements or the like is joined and fixed to the metal plate 11 to further promote heat radiation. Is preferred.

  Next, an image sensor mounting structure and a TV camera as an image capturing apparatus having the mounting structure in the fourth embodiment will be described with reference to FIG.

In the TV camera according to the fourth embodiment, a camera in which the thickness of the bottom surface of the recess 5 of the element seat 3C is set thin is used.
That is, the element seat 3 </ b> C in the fourth embodiment has a structure in which the second recess 12 is formed in a portion corresponding to the recess 5 on the outer wall side which is the surface opposite to the recess 5. As a result, the bottom surface of the recess 5 is thinner than in the prior art.

  Thus, the thickness of the element seat 3C interposed between the bottom surface of the solid-state image sensor 2 and the air around the element seat 3C is reduced, in other words, the bottom surface of the solid-state image sensor 2 via the element seat 3C and the surrounding area. It can be expected that heat radiation from the bottom surface side through the element seat 3C becomes easier as the distance from the air becomes smaller than in the conventional case.

  In any of the embodiments described above, the element seats 3, 3A, 3B, 3C are joined to the emission end face 1a of the three-color separation prism 1 via the wedge glass 4, but the element seats 3, 3A are used. , 3B, 3C may be directly joined to the emission end face 1a of the three-color separation prism 1.

1 is a configuration diagram showing a schematic configuration of a TV camera to which an imaging element mounting structure according to a first embodiment of the present invention is applied. The side view (a) of the element seat in the attachment structure of the image pick-up element which concerns on the 1st Embodiment of this invention, and a top view (b) The side view (a) of the element seat used for the attachment structure of the image pick-up element which concerns on the 2nd Embodiment of this invention, and a top view (b) The side view (a) of the element seat used for the attachment structure of the image pick-up element which concerns on the 3rd Embodiment of this invention, and a top view (b) The side view (a) of an element seat in the state where the metal plate was fixed to the bottom of a solid-state image sensor, and the top view (b) in the mounting structure of the image sensor concerning a 3rd embodiment of the present invention. The side view (a) and top view (b) of the element seat used for the attachment structure of the image pick-up element which concerns on the 4th Embodiment of this invention. Side view (a) and plan view (b) of a conventional element seat

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 3 color separation prism 1a Outgoing end surface 2 Solid-state image sensor 3 Element seat (1st Embodiment)
3A element seat (second embodiment)
3B element seat (third embodiment)
3C element seat (fourth embodiment)
4 Wedge glass 5 Recess (first, third and fourth embodiments)
5A recess (second embodiment)
6 Through-hole 7 Gap 9a, 9b Dividing member 11 Metal plate 101 Body 102 Photo lens

Claims (5)

An image sensor mounting structure that is mounted on the light emission end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. An image pickup characterized in that a part of the element seat that is attached to the light emitting end face and faces the bottom surface of the image pickup element is formed with a through hole or a slit that exposes a part of the bottom surface to the outside. Element mounting structure.   2. The imaging according to claim 1, wherein a metal plate to which a heat radiating member can be joined via the through hole or the slit is attached to a bottom surface of the imaging element exposed from the through hole or the slit. Element mounting structure. An image sensor mounting structure that is mounted on the light emission end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. A gap that allows air from the outside to pass is formed at least partly between the bottom surface of the imaging element and the inner wall of the element seat facing the bottom surface while being attached to the light emitting end face. An image pickup device mounting structure characterized by the above. An image sensor mounting structure that is mounted on the light emission end face of the color separation prism,
The image sensor is attached to a light emitting end surface of the color separation prism using an element seat, the element seat receives a bottom surface of the image sensor, and a peripheral portion of the element seat is directly or via the other member. A mounting structure for an image pickup device, wherein the device seat is attached to a light emitting end surface, and at least a part of a portion facing the bottom surface of the image pickup device is formed thinner than the remaining portion. An image pickup apparatus in which an image pickup element is attached to a light emission end face of a color separation prism using an element seat,
The image pickup device is attached by the image pickup device mounting structure according to any one of claims 1 to 4.

Images